CN115023060A - Liquid phase repairing method for golden finger - Google Patents
Liquid phase repairing method for golden finger Download PDFInfo
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- CN115023060A CN115023060A CN202210654420.6A CN202210654420A CN115023060A CN 115023060 A CN115023060 A CN 115023060A CN 202210654420 A CN202210654420 A CN 202210654420A CN 115023060 A CN115023060 A CN 115023060A
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- golden finger
- finger
- copper
- gold
- golden
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- 238000000034 method Methods 0.000 title claims abstract description 53
- 239000007791 liquid phase Substances 0.000 title claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 61
- 229910052802 copper Inorganic materials 0.000 claims abstract description 61
- 239000010949 copper Substances 0.000 claims abstract description 61
- 239000002105 nanoparticle Substances 0.000 claims abstract description 35
- 239000000725 suspension Substances 0.000 claims abstract description 28
- 230000008439 repair process Effects 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 230000000694 effects Effects 0.000 claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 239000013078 crystal Substances 0.000 claims abstract description 14
- 230000004927 fusion Effects 0.000 claims abstract description 13
- 238000000151 deposition Methods 0.000 claims abstract description 10
- 238000005566 electron beam evaporation Methods 0.000 claims abstract description 8
- 238000001755 magnetron sputter deposition Methods 0.000 claims abstract description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 51
- 229910052737 gold Inorganic materials 0.000 claims description 51
- 239000010931 gold Substances 0.000 claims description 51
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 42
- 238000004140 cleaning Methods 0.000 claims description 21
- 229910052759 nickel Inorganic materials 0.000 claims description 21
- 239000010410 layer Substances 0.000 claims description 17
- 239000011241 protective layer Substances 0.000 claims description 13
- 239000003945 anionic surfactant Substances 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 9
- 239000007864 aqueous solution Substances 0.000 claims description 8
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- BTBJBAZGXNKLQC-UHFFFAOYSA-N ammonium lauryl sulfate Chemical compound [NH4+].CCCCCCCCCCCCOS([O-])(=O)=O BTBJBAZGXNKLQC-UHFFFAOYSA-N 0.000 claims description 3
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 3
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 3
- 238000009210 therapy by ultrasound Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 239000000243 solution Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003760 magnetic stirring Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The application discloses a liquid phase repairing method for a golden finger, which comprises the steps of firstly manufacturing a mask in the surface area of a printed board substrate except the golden finger; placing the golden finger in a magnetron sputtering instrument or an electron beam evaporation table, and depositing a copper seed crystal layer on the surface of the printing plate substrate and the area of the golden finger which are lost by the golden finger by using a copper target; preparing a copper nanoparticle suspension; placing the golden finger in the copper nanoparticle suspension, and setting laser parameters and a laser light path; and starting a laser to perform fusion repair on the surface of the golden finger. Through the method and the device, the repairing effect and the repairing efficiency of the damaged golden finger can be effectively improved.
Description
Technical Field
The application relates to the technical field of server accessories, in particular to a liquid phase gold finger repairing method.
Background
The golden finger is a common connecting part between hardware of a computer and server, and is an important component between a memory bank and various board cards. With the continuous increase of the service time and the service frequency of the golden finger, the surface coating of the golden finger and even the whole golden finger can be abraded to generate loss, thereby reducing the service life of the golden finger and even leading the golden finger to be scrapped. Therefore, it is an important technical problem if gold finger repair is performed.
The existing gold finger repairing method generally comprises surface cleaning and oxide layer removal.
However, the existing gold finger repairing method is only limited to surface cleaning, so that the damaged area of the gold finger is not repaired thoroughly, and the repairing efficiency is not high enough.
Disclosure of Invention
The application provides a liquid phase gold finger repairing method, which aims to solve the problem that the gold finger repairing efficiency in the prior art is not high enough.
In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:
a liquid-phase gold finger repair method, the gold finger being disposed on a surface of a printed board substrate, the method comprising:
manufacturing a mask in the surface area of the printed board substrate except the golden fingers, wherein the mask is used for protecting the golden fingers and does not corrode the golden fingers;
placing the golden finger in a magnetron sputtering instrument or an electron beam evaporation table, and depositing a copper seed crystal layer on the surface of the printing plate substrate missing the golden finger and the area of the golden finger by using a copper target, wherein the thickness of the copper seed crystal layer is 40-100 mu m, and the purity of the copper target is more than or equal to 99.99%;
preparing a copper nano-particle suspension, wherein the purity of the adopted copper nano-particles is more than or equal to 99.99 percent, and the particle size is 5-30 nm;
placing a golden finger in the copper nanoparticle suspension, and setting laser parameters and a laser light path, wherein the copper nanoparticle suspension is in a flowing or rotating state, the laser energy density is adjusted to be 0.1-1.0J/pulse/square centimeter, the pulse frequency is 10-50Hz, the laser wavelength is 248-;
and starting a laser to perform fusion repair on the surface of the golden finger, wherein the repair time is 5-20 minutes.
Optionally, the method for preparing a suspension of copper nanoparticles includes the following steps:
preparing an active aqueous solution with the weight ratio of anionic surfactant of 0.5-1.5%, wherein the purity of the anionic surfactant is more than or equal to 99.9%;
dispersing 0.5-5 wt% of copper nanoparticles in the active aqueous solution to prepare a suspension;
and (3) placing the suspension in ultrasonic equipment for ultrasonic treatment for 5-15 minutes, and completely dispersing the copper nanoparticles to form the copper nanoparticle suspension, wherein the frequency of the ultrasonic equipment is 20-50 Hz.
Optionally, the anionic surfactant comprises: one of sodium dodecyl benzene sulfonate, sodium dodecyl sulfate, ammonium dodecyl sulfate and triethanolamine.
Optionally, before the mask is made on the surface area of the printed board substrate except the gold finger, the method further comprises:
and cleaning the surface of the golden finger by adopting an acid washing or plasma cleaning process.
Optionally, after the laser is turned on and the surface of the gold finger is subjected to fusion repair, the method further includes:
checking whether the golden finger meets a set repairing effect;
if so, judging that the repairing is finished, and cleaning the surface of the golden finger;
and if not, starting the laser again, performing fusion repair on the surface of the golden finger again until a set repair effect is met, and cleaning the surface of the golden finger.
Optionally, after the set repairing effect is satisfied and the surface of the golden finger is cleaned, the method further includes:
and manufacturing a nickel protective layer on the surface of the gold finger, wherein the thickness of the nickel protective layer is 30-100 nm.
Optionally, the method for manufacturing a nickel protection layer on the surface of a gold finger includes:
manufacturing a mask again according to the method for manufacturing the mask in the surface area of the printed board substrate except the golden finger;
and placing the golden finger in a magnetron sputtering instrument or an electron beam evaporation table, and depositing a nickel protective layer on the surface of the golden finger by using a nickel target, wherein the purity of the nickel target is more than or equal to 99.99%.
Optionally, after the nickel protection layer is formed on the surface of the gold finger, the method further comprises:
and removing the mask by cleaning the surface of the golden finger.
The technical scheme provided by the embodiment of the application can have the following beneficial effects:
the application provides a liquid phase repairing method for a golden finger, which comprises the steps of firstly manufacturing a mask on the surface area of a printed board substrate except the golden finger, so that the golden finger is protected in the subsequent process and is not polluted by the subsequent process or damaged by laser, then depositing a copper seed crystal layer on the golden finger area by using a copper target, specifically depositing a copper seed crystal layer on the surface of the printed board substrate missing the golden finger and the golden finger area, and enabling the copper seed crystal layer to be in good contact with the surface of the damaged golden finger or the surface of the exposed printed board substrate. And then preparing a copper nanoparticle turbid liquid, placing the gold finger into the copper nanoparticle turbid liquid, and performing fusion repair on the gold finger by using a pulse laser beam, wherein the copper seed crystal layer has higher surface activity and positive charges, and forms an adsorption effect with the copper nanoparticles with negative charges on the surface in the solution, and the copper seed crystal layer and the copper nanoparticles are continuously fused by using a laser fusion technology after adsorption, copper nano ions in the solution are continuously deposited on the surface of the gold finger, and meanwhile, rapid annealing is performed in a liquid phase environment, so that the method is favorable for improving the densification degree of the gold finger, avoiding the generation of internal defects and improving the gold finger repair efficiency. And removing the mask and the residual turbid liquid on the surface after the repair is finished, then manufacturing the mask again, depositing a nickel protective layer on the surface of the golden finger by means of a magnetron sputtering or electron beam evaporation process, so that the improvement of the oxidation resistance of the surface of the golden finger is facilitated, and removing the mask again after the manufacture is finished, thereby completing the repair. By adopting the method in the embodiment, the damaged area of the golden finger can be effectively repaired, the service life of the part is prolonged, and the repaired golden finger can be more reliably connected with the slot due to the fact that the densification degree of the repaired golden finger is improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic flow chart of a liquid-phase gold finger repairing method provided in an embodiment of the present application.
Detailed Description
In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
For a better understanding of the present application, embodiments of the present application are explained in detail below with reference to the accompanying drawings.
Referring to fig. 1, fig. 1 is a schematic flow chart of a liquid phase gold finger repairing method according to an embodiment of the present disclosure. As can be seen from fig. 1, the liquid phase repairing method for a gold finger in this embodiment mainly includes the following steps:
s2: and manufacturing a mask in the surface area of the printed board substrate except the gold finger.
The mask in the embodiment is used for protecting the gold fingers, and the gold fingers can be prevented from being polluted by subsequent copper seed crystals and difficult to remove. The specific material and form of the mask are not required, the mask is easy to clean, the gold finger part is not corroded, and the part under the mask can be prevented from being damaged by laser.
Further, before the step S2, the gold finger liquid phase repairing method further includes the step S1: and cleaning the surface of the golden finger.
The gold finger and the surface of the exposed printing plate substrate are usually cleaned by adopting an acid washing or plasma cleaning process, so that organic matters or oxide layers and the like on the surface are removed, and the efficiency and the effect of repairing the gold finger are improved.
As can be seen from fig. 1, after the mask is formed on the surface area of the printed circuit board substrate other than the gold finger, step S3 is executed: and placing the golden finger in a magnetron sputtering instrument or an electron beam evaporation table, and depositing a copper seed crystal layer on the surface of the printing plate substrate and the golden finger area where the golden finger is lost by using a copper target.
Wherein the thickness of the copper seed crystal layer is 40-100 μm, and the purity of the copper target is more than or equal to 99.99%.
In practical application, a copper seed layer with a thickness of 50nm can be deposited on the gold finger area by using a copper target with a purity of 99.99%.
S4: and preparing a copper nanoparticle suspension. Wherein the purity of the adopted copper nanoparticles is more than or equal to 99.99 percent, and the particle size is 5-30 nm.
Specifically, step S4 includes the following processes:
s41: firstly, preparing an active aqueous solution with the weight ratio of anionic surfactant of 0.5-1.5%, wherein the purity of the anionic surfactant is more than or equal to 99.9%.
As the anionic surfactant, there can be used: one of sodium dodecyl benzene sulfonate, sodium dodecyl sulfate, ammonium dodecyl sulfate and triethanolamine.
S42: then, 0.5 to 5% by weight of copper nanoparticles are dispersed in an active aqueous solution to prepare a suspension.
S43: and then, putting the suspension into an ultrasonic device for ultrasonic treatment for 5-15 minutes to completely disperse the copper nanoparticles to form copper nanoparticle suspension, wherein the frequency of the ultrasonic device is 20-50 Hz.
From the above steps S41-S43, in practical application, an active aqueous solution with a weight ratio of sodium dodecyl sulfate of 1% is prepared, then copper nanoparticles with a purity of 99.99% and a particle size of 20nm are dispersed in the active aqueous solution to prepare a suspension with a weight ratio of 1.5%, and finally the suspension is placed in an ultrasonic cleaning machine with a frequency of 35KHz for 10 minutes to completely disperse the copper nanoparticles.
After the copper nanoparticle suspension is prepared, step S5 is performed: and placing the golden finger in the copper nanoparticle suspension, and setting laser parameters and a laser light path.
In this embodiment, the suspension of copper nanoparticles is in a flowing or rotating state, the laser energy density is adjusted to 0.1-1.0J/pulse/square centimeter, the pulse frequency is 10-50Hz, the laser wavelength is 248-.
In this embodiment, the implementation manner of making the suspension of copper nanoparticles in a flowing or rotating state includes but is not limited to: and placing the copper nanoparticle suspension in a magnetic stirring device.
S6: and starting a laser, and performing fusion repair on the surface of the golden finger, wherein the repair time is 5-20 minutes.
In practical application, the repair is preferably carried out for 15 minutes, so that a good repair effect can be realized, and the repair efficiency can be improved. The surface of the golden finger is deposited with a copper seed crystal layer and is not annealed at high temperature, so that the surface activity of the golden finger is high, the surface of the golden finger and copper nano-ions generate adsorption action under the action of an anionic surfactant in a solution, rapid fusion is facilitated by means of a laser pulse melting technology, rapid annealing is performed between two pulse intervals, the compactness and stability of the golden finger are improved, the defects are reduced, and the compactness of the golden finger can be improved, so that the good combination of a repair material and a base material can be realized.
Further, after the fusion repairing is performed on the surface of the gold finger, the method further includes step S7: and (5) carrying out repair result inspection and cleaning on the golden finger.
Specifically, step S7 includes the following processes:
s71: checking whether the golden finger meets the set repairing effect;
if the set restoration effect is satisfied, execute step S72: after the repair is judged to be finished, cleaning the surface of the golden finger;
if the set repairing effect is not satisfied, returning to execute step S6, turning on the laser again, performing fusion repairing on the surface of the golden finger again until the set repairing effect is satisfied, and executing step S72: and cleaning the surface of the golden finger.
The surface of the gold finger is usually dried or blown dry after being cleaned.
The repairing effect and the repairing efficiency of the golden finger can be further improved through the step S7, and the mask and the residual copper nanoparticle suspension can be removed through surface cleaning of the golden finger.
Further, after the surface cleaning is performed on the gold finger, the method further includes step S8: and manufacturing a nickel protective layer on the surface of the gold finger, wherein the thickness of the nickel protective layer is 30-100 nm.
Specifically, step S8 includes the following processes:
s81: and manufacturing the mask again according to the method for manufacturing the mask on the surface area of the printed board substrate except the golden finger.
S82: and placing the golden finger in a magnetron sputtering instrument or an electron beam evaporation table, and depositing a nickel protective layer on the surface of the golden finger by using a nickel target, wherein the purity of the nickel target is more than or equal to 99.99%.
The nickel protective layer is beneficial to improving the oxidation resistance of the golden finger, so that the connection performance and the contact firmness between hardware are improved, and the service life of the part is prolonged.
Further, after the step S8, the gold finger liquid phase repairing method further includes the step S9: and removing the mask by cleaning the surface of the golden finger.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. A liquid phase gold finger repairing method is characterized in that a gold finger is arranged on the surface of a printed board substrate, and the method comprises the following steps:
manufacturing a mask in the surface area of the printed board substrate except the golden fingers, wherein the mask is used for protecting the golden fingers and does not corrode the golden fingers;
placing the golden finger in a magnetron sputtering instrument or an electron beam evaporation table, and depositing a copper seed crystal layer on the surface of the printing plate substrate and the area of the golden finger which are lost by the golden finger by using a copper target, wherein the thickness of the copper seed crystal layer is 40-100 mu m, and the purity of the copper target is more than or equal to 99.99%;
preparing a copper nano-particle suspension, wherein the purity of the adopted copper nano-particles is more than or equal to 99.99%, and the particle size is 5-30 nm;
placing a golden finger in the copper nanoparticle suspension, and setting laser parameters and a laser light path, wherein the copper nanoparticle suspension is in a flowing or rotating state, the laser energy density is adjusted to be 0.1-1.0J/pulse/square centimeter, the pulse frequency is 10-50Hz, the laser wavelength is 248-;
and starting a laser to perform fusion repair on the surface of the golden finger, wherein the repair time is 5-20 minutes.
2. The liquid phase repairing method for the gold finger as claimed in claim 1, wherein the method for preparing the copper nanoparticle suspension comprises the following steps:
preparing an active aqueous solution with the weight ratio of anionic surfactant of 0.5-1.5%, wherein the purity of the anionic surfactant is more than or equal to 99.9%;
dispersing 0.5-5 wt% of copper nanoparticles in the active aqueous solution to prepare a suspension;
and (3) placing the suspension in ultrasonic equipment for ultrasonic treatment for 5-15 minutes, and completely dispersing the copper nanoparticles to form the copper nanoparticle suspension, wherein the frequency of the ultrasonic equipment is 20-50 Hz.
3. The liquid phase repairing method for gold fingers according to claim 2, wherein the anionic surfactant comprises: one of sodium dodecyl benzene sulfonate, sodium dodecyl sulfate, ammonium dodecyl sulfate and triethanolamine.
4. The liquid phase repairing method for gold fingers according to claim 1, wherein before the mask is made on the printed board substrate surface area outside the gold fingers, the method further comprises:
and cleaning the surface of the golden finger by adopting an acid washing or plasma cleaning process.
5. The liquid phase gold finger repairing method according to claim 1, wherein after the laser is turned on to perform fusion repairing on the surface of the gold finger, the method further comprises:
checking whether the golden finger meets a set repairing effect or not;
if so, judging that the repairing is finished, and cleaning the surface of the golden finger;
and if not, starting the laser again, performing fusion repair on the surface of the golden finger again until a set repair effect is met, and cleaning the surface of the golden finger.
6. The liquid phase gold finger repairing method according to claim 5, wherein after the gold finger is subjected to surface cleaning while satisfying a set repairing effect, the method further comprises:
and manufacturing a nickel protective layer on the surface of the gold finger, wherein the thickness of the nickel protective layer is 30-100 nm.
7. The liquid phase repairing method for gold finger of claim 6, wherein the method for forming a nickel protective layer on the surface of the gold finger comprises:
manufacturing a mask again according to the method for manufacturing the mask in the surface area of the printed board substrate except the golden finger;
and placing the golden finger in a magnetron sputtering instrument or an electron beam evaporation table, and depositing a nickel protective layer on the surface of the golden finger by using a nickel target, wherein the purity of the nickel target is more than or equal to 99.99%.
8. The liquid phase repairing method for gold fingers according to claim 6, wherein after the nickel protective layer is formed on the surface of the gold finger, the method further comprises:
and removing the mask by cleaning the surface of the golden finger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210654420.6A CN115023060B (en) | 2022-06-10 | 2022-06-10 | Liquid phase golden finger repairing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210654420.6A CN115023060B (en) | 2022-06-10 | 2022-06-10 | Liquid phase golden finger repairing method |
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| CN115023060A true CN115023060A (en) | 2022-09-06 |
| CN115023060B CN115023060B (en) | 2023-07-14 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112004338A (en) * | 2020-07-25 | 2020-11-27 | 苏州浪潮智能科技有限公司 | Gold finger repairing method |
| CN112296024A (en) * | 2020-09-21 | 2021-02-02 | 苏州浪潮智能科技有限公司 | Method for removing oxide layer on surface of golden finger |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112004338A (en) * | 2020-07-25 | 2020-11-27 | 苏州浪潮智能科技有限公司 | Gold finger repairing method |
| CN112296024A (en) * | 2020-09-21 | 2021-02-02 | 苏州浪潮智能科技有限公司 | Method for removing oxide layer on surface of golden finger |
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| CN115023060B (en) | 2023-07-14 |
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