JPH0382187A - Manufacture of high corrosion-resistant printed wiring board - Google Patents
Manufacture of high corrosion-resistant printed wiring boardInfo
- Publication number
- JPH0382187A JPH0382187A JP21948389A JP21948389A JPH0382187A JP H0382187 A JPH0382187 A JP H0382187A JP 21948389 A JP21948389 A JP 21948389A JP 21948389 A JP21948389 A JP 21948389A JP H0382187 A JPH0382187 A JP H0382187A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- circuit
- solder resist
- wiring board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005260 corrosion Methods 0.000 title claims description 9
- 230000007797 corrosion Effects 0.000 title claims description 9
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 19
- 239000010949 copper Substances 0.000 claims abstract description 19
- 229910000679 solder Inorganic materials 0.000 claims abstract description 14
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 7
- 238000007639 printing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 9
- 238000009413 insulation Methods 0.000 abstract description 8
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract description 7
- 239000005751 Copper oxide Substances 0.000 abstract description 7
- 229910000431 copper oxide Inorganic materials 0.000 abstract description 7
- 239000004593 Epoxy Substances 0.000 abstract description 3
- 230000001603 reducing effect Effects 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 2
- 230000003628 erosive effect Effects 0.000 abstract 2
- 229910000085 borane Inorganic materials 0.000 abstract 1
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 238000005498 polishing Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- 238000002203 pretreatment Methods 0.000 description 3
- 238000010019 resist printing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 210000001787 dendrite Anatomy 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、耐電食性に優れるプリント配線板の製造方法
に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for manufacturing a printed wiring board having excellent electrolytic corrosion resistance.
（従来の技術）
従来、ソルダーレジスト印刷の前処理法としては、ソル
ダーレジストと銅回路との密着力を高めるために、化学
処理または研磨により銅回路表面に適度の微細凹凸を形
成する方法がある。(Prior art) Conventionally, as a pretreatment method for solder resist printing, there is a method of forming appropriate fine irregularities on the surface of the copper circuit by chemical treatment or polishing in order to increase the adhesion between the solder resist and the copper circuit. .
（発明が解決しようとする課題）
しかしながら、ソルダーレジストと銅回路の密着力を高
めるための前処理法では、使用中に銅マイグレーション
が発生し、回路間にデンドライト等の電食析出物が発生
し、回路間距離を減少させる。このため回路間の絶縁抵
抗が低下するという問題点があった。(Problem to be solved by the invention) However, in the pretreatment method for increasing the adhesion between the solder resist and the copper circuit, copper migration occurs during use, and electrolytic corrosion deposits such as dendrites occur between the circuits. , reducing the distance between circuits. Therefore, there was a problem in that the insulation resistance between the circuits decreased.
本発明はこの点に鑑みなされたもので、電食析出物の発
生を抑制し、回路間における所要の絶縁抵抗値を確保す
るようにした、高耐電食性のプリント配線板の製造方法
を提供するものである。The present invention has been made in view of this point, and provides a method for manufacturing a printed wiring board with high electrolytic corrosion resistance, which suppresses the generation of electrolytic corrosion deposits and ensures a required insulation resistance value between circuits. It is something.
（課題を解決するための手段）
このため本発明は、ソルダーレジスト印刷的、すなわち
ソルダーレジスト印刷前処理としての銅回路表面化学処
理または研磨処理の後に、該銅回路表面に還元剤を接触
させることを特徴とするものである。(Means for Solving the Problems) For this reason, the present invention provides a method for contacting a reducing agent with a surface of a copper circuit after chemical treatment or polishing of the surface of the copper circuit as a solder resist printing process, that is, as a pre-treatment for printing a solder resist. It is characterized by:
（作用）
このようにプリント配線板の銅回路表面に還元剤を接触
させると、接触した還元剤の還元作用により銅マイグレ
ーションが抑制される。このため、回路間においてデン
ドライト等の電食析出物の発生が抑えられる。(Function) When the reducing agent is brought into contact with the copper circuit surface of the printed wiring board in this way, copper migration is suppressed by the reducing action of the contacted reducing agent. Therefore, generation of electrolytic deposits such as dendrites between circuits is suppressed.
（実施例〉
以下に本発明を実施例および比較例により詳しく説明す
る。(Examples) The present invention will be explained in detail below using Examples and Comparative Examples.
ガラスエポキシ基材の銅張積層板に、ライン幅０．１〜
０．１２ｎ＋ｍ、沿面距離０．１〜０．１２開の回路を
サブトラクティブ法で形成し、ソルダーレジストとの密
着性確保のために酸化銅処理（Ｋ処理）を行い、ＤＭＡ
Ｂ （ジメチルアミンボラン）の６ｇ／ｆ水溶液に１〜
３分浸漬し、酸化銅を還元するとともに、銅回路表面に
ＤＭＡＢを接触させた。Copper-clad laminate with glass epoxy base material, line width 0.1~
A circuit of 0.12n+m and a creepage distance of 0.1 to 0.12 is formed by a subtractive method, and copper oxide treatment (K treatment) is performed to ensure adhesion with the solder resist.
1 to 6 g/f aqueous solution of B (dimethylamine borane)
It was immersed for 3 minutes to reduce the copper oxide and bring DMAB into contact with the surface of the copper circuit.
続いて水洗、乾燥後にソルダーレジスト（ＣＲ−５０６
Ｇ （二液性エポキシ系ソルダーレジスト。Next, after washing with water and drying, solder resist (CR-506
G (Two-component epoxy solder resist.
株式会社アサヒ化学研究所製、商品名）を印刷した。こ
のプリント配線板を８５℃、８５％ＲＨの環境下に置き
、隣接するラインが正補と負極になるように１００Ｖの
直流電圧を印加し、銅マイグレーションによる電食析出
物の発生状況と、ライン間の絶縁抵抗を観測した。上記
のＤＭＡＢ処理を行ったプリント配線板の上面図を第１
図に示す。Manufactured by Asahi Chemical Research Institute Co., Ltd., product name) was printed. This printed wiring board was placed in an environment of 85°C and 85% RH, and a 100V DC voltage was applied so that the adjacent lines became positive and negative electrodes. The insulation resistance between the two was observed. The top view of the printed wiring board that has been subjected to the above DMAB processing is shown in Figure 1.
As shown in the figure.
比較例として、研磨処理のみを行ったもの、および酸化
銅処理のみを行ったものについても同様に評価した。な
お、第２図、第３図はそれぞれ研磨処理のみを行ったも
の、酸化銅処理のみを行ったものを示す図であって、よ
り詳しくは８５℃。As comparative examples, those subjected to only polishing treatment and those subjected to only copper oxide treatment were similarly evaluated. In addition, FIG. 2 and FIG. 3 are diagrams showing those subjected to only polishing treatment and those subjected to only copper oxide treatment, respectively, and more specifically at 85°C.
８５９６ＲＨ，ＤＣ１００Ｖ印加１００時間経過時の上
面図である。8596RH, a top view after 100 hours of DC 100V application.
−に記実施例によるＤＭＡＢ処理を行った場合には、８
５℃、８５％ＲＨ，ＤＣ１００Ｖ印加の高温高湿バイア
ス試験２５００時間でも銅回路１間に電食析出物は発生
せず、ライン間絶縁抵抗は初期値１０１３Ωに対し１・
０１２Ωを維持している。- When the DMAB processing according to the embodiment described in 8.
Even in a 2,500-hour high-temperature, high-humidity bias test at 5°C, 85% RH, and DC 100V applied, no galvanic deposits were generated between the copper circuits 1, and the line-to-line insulation resistance was 1.
012Ω is maintained.
一方、比較例による研磨処理のみを行った場合、および
酸化処理のみを行った場合には、試験時間１００時間ま
でに電食析出物２が発生し、試験時間３００時間ではラ
イン間絶縁抵抗が１０９Ω以下となり、短絡状態となっ
た。On the other hand, when only the polishing treatment according to the comparative example was performed and when only the oxidation treatment was performed, electrolytic corrosion deposits 2 were generated by the test time of 100 hours, and the line-to-line insulation resistance was 109Ω by the test time of 300 hours. As a result, a short circuit occurred.
（発四の効果）
以−１−のように本発明によれば、銅回路表面に還元剤
を接触させたうえでソルダーレジスト印刷を行うので、
還元作用により銅マイグレーションを良奸に抑制して電
食析出物の発生を防止できる。(Four Effects) As described in -1- above, according to the present invention, since solder resist printing is performed after bringing the reducing agent into contact with the surface of the copper circuit,
The reduction action effectively suppresses copper migration and prevents the generation of electrolytic corrosion deposits.
従って、ライン間の絶縁抵抗の低下を防止できる効果が
ある。Therefore, there is an effect of preventing a decrease in insulation resistance between lines.
第１図は、本発明の製造方法によるＤＭＡＢ処理を行っ
たプリント配線板の８５℃、８５％ＲＨ。
ＤＣ１００Ｖ印加１００時間経過時の上面図。
第２図は、従来の製造方法による研磨処理のみを行った
プリント配線板の８５℃、８５％ＲＨ。
ＤＣ１００Ｖ印加１００時間経過時の１・６面図。
第３図は、従来の製造方法による酸化銅処理のみを行っ
たプリント配線板の８５℃、８５％ＲＨ。
ＤＣ１００Ｖ印加１００時間経過時の−に面図。
１・・・銅回路
２・・・電食析出物FIG. 1 shows a printed wiring board at 85° C. and 85% RH that has been subjected to DMAB treatment according to the manufacturing method of the present invention. A top view after 100 hours of DC 100V application. Figure 2 shows a printed wiring board at 85°C and 85% RH that has been subjected to only polishing using the conventional manufacturing method. 1 and 6 views after 100 hours of DC 100V application. Figure 3 shows a printed wiring board at 85°C and 85% RH that has been subjected to only copper oxide treatment using the conventional manufacturing method. - side view after 100 hours of DC 100V application. 1...Copper circuit 2...Electrolytic corrosion deposits
Claims (1)
路表面に還元剤を接触させることを特徴とする高耐電食
性プリント配線板の製造方法。1. A method for producing a highly electrolytic corrosion resistant printed wiring board, which comprises bringing a reducing agent into contact with the surface of a copper circuit before printing a solder resist on the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21948389A JPH0382187A (en) | 1989-08-25 | 1989-08-25 | Manufacture of high corrosion-resistant printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21948389A JPH0382187A (en) | 1989-08-25 | 1989-08-25 | Manufacture of high corrosion-resistant printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0382187A true JPH0382187A (en) | 1991-04-08 |
Family
ID=16736147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21948389A Pending JPH0382187A (en) | 1989-08-25 | 1989-08-25 | Manufacture of high corrosion-resistant printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0382187A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07249856A (en) * | 1991-07-02 | 1995-09-26 | Rockwell Internatl Corp | Method for restoration of solderability of electronic component |
| US6086956A (en) * | 1995-12-19 | 2000-07-11 | Morton International Inc. | Composition and method for reducing copper oxide to metallic copper |
| JP2007037657A (en) * | 2005-08-01 | 2007-02-15 | Nkk:Kk | Facial treatment mask |
| JP2007037658A (en) * | 2005-08-01 | 2007-02-15 | Nkk:Kk | Facial treatment apparatus |
-
1989
- 1989-08-25 JP JP21948389A patent/JPH0382187A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07249856A (en) * | 1991-07-02 | 1995-09-26 | Rockwell Internatl Corp | Method for restoration of solderability of electronic component |
| US6086956A (en) * | 1995-12-19 | 2000-07-11 | Morton International Inc. | Composition and method for reducing copper oxide to metallic copper |
| JP2007037657A (en) * | 2005-08-01 | 2007-02-15 | Nkk:Kk | Facial treatment mask |
| JP2007037658A (en) * | 2005-08-01 | 2007-02-15 | Nkk:Kk | Facial treatment apparatus |
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