CN112296024A - Method for removing oxide layer on surface of golden finger - Google Patents
Method for removing oxide layer on surface of golden finger Download PDFInfo
- Publication number
- CN112296024A CN112296024A CN202010992095.5A CN202010992095A CN112296024A CN 112296024 A CN112296024 A CN 112296024A CN 202010992095 A CN202010992095 A CN 202010992095A CN 112296024 A CN112296024 A CN 112296024A
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- golden finger
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- laser
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- 238000000034 method Methods 0.000 title claims abstract description 43
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000010931 gold Substances 0.000 claims abstract description 17
- 229910052737 gold Inorganic materials 0.000 claims abstract description 17
- 238000004140 cleaning Methods 0.000 claims description 22
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 20
- 238000009826 distribution Methods 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000003860 storage Methods 0.000 claims description 7
- 238000007781 pre-processing Methods 0.000 claims description 6
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- 238000010301 surface-oxidation reaction Methods 0.000 abstract description 4
- 230000003647 oxidation Effects 0.000 description 10
- 238000007254 oxidation reaction Methods 0.000 description 10
- 230000006870 function Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 244000137852 Petrea volubilis Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Cleaning In General (AREA)
Abstract
The invention provides a method for removing a gold finger surface oxidation layer, which belongs to the technical field of gold finger treatment and comprises the main steps of gold finger pretreatment, scanning parameter setting, laser beam scanning and the like.
Description
Technical Field
The invention relates to the technical field of golden finger treatment, in particular to a method for removing an oxide layer on the surface of a golden finger.
Background
The golden finger is a bridge for connecting and communicating with a computer and a server mainboard, such as a conventional memory bank, a network card, a hard disk, a RAID card, a RISER card, a switching card and the like. Because computers and servers are generally used in daily indoor environments, under the environment of humidity, dust and electromagnetism, dust on the surfaces of golden fingers is easy to accumulate and oxidize, so that the electrical performance is influenced, parts cannot be effectively identified, and even the computers and the servers cannot normally operate. In order to restore the normal use of the part, the surface of the golden finger needs to be cleaned, the conventional cleaning method mainly comprises the steps of erasing with rubber, smearing with a pencil, polishing with sand paper and the like, accumulated materials and an oxide layer on the surface cannot be fundamentally removed, the part needs to be cleaned at intervals, the cleaning frequency is higher and higher, the part finally loses the use value and is scrapped, and meanwhile, the hardware is wasted.
In conclusion, the conventional wiping method cannot fundamentally remove the surface oxide layer, only can remove the surface dust, and has limited effect. The disclosed laser cleaning mode is suitable for removing surface oxidation layers of common metal parts and equipment, is not suitable for golden finger part products, and can cause the products to be directly damaged.
Disclosure of Invention
The invention aims to provide a method for removing a surface oxidation layer of a golden finger, which solves the technical problems that the conventional golden finger wiping method cannot fundamentally remove the surface oxidation layer and only can remove surface dust, and the effect is limited.
In a first aspect, the present invention provides a method for removing an oxide layer on a gold finger surface, including:
preprocessing the golden finger to be removed;
setting scanning parameters according to the length, width and position distribution of the golden finger;
setting laser parameters according to the distribution of the oxide layer;
and scanning the laser beam of the golden finger according to the scanning parameters and the laser parameters.
Further, the step of preprocessing the golden finger to be removed comprises the following steps:
wiping the golden finger to be removed by using ethanol;
immersing the golden finger in a cleaning solution for a preset time;
and cleaning the golden finger by using pure water, and drying the golden finger.
Further, the preset time is 10 to 60 seconds.
Further, before the step of immersing the gold finger in the cleaning solution for a preset time, the method further comprises:
hydrofluoric acid, ammonium fluoride and water in the weight ratio of 0.5-3 to 2-5 to 20-40 are used to prepare the cleaning solution.
Further, the laser parameters include: laser wavelength of 1064nm and laser energy density range of 50-200mJ/cm2The scanning speed is 0.1-2mm/s, and the scanning frequency is 1-6 times.
Further, the step of scanning the laser beam to the golden finger according to the scanning parameters and the laser parameters comprises:
fixing the golden finger in a vacuum environment;
and starting the laser beam according to the scanning parameters and the laser parameters, and carrying out surface scanning on the golden finger.
Further, the vacuum pressure of the vacuum environment is less than or equal to 300 mba.
Further, after the step of scanning the laser beam on the golden finger according to the scanning parameters and the laser parameters, the method further comprises the following steps:
breaking vacuum by using nitrogen, and taking out the golden finger;
and wiping the golden finger to be removed by using ethanol.
In a second aspect, the present invention also provides a computer readable storage medium having stored thereon machine executable instructions, which when invoked and executed by a processor, cause the processor to execute the method for removing the oxide layer on the surface of the golden finger.
The method for removing the oxidation layer on the surface of the golden finger provided by the invention realizes the complete removal of the oxidation layer on the surface of the golden finger through surface corrosion and laser scanning, and has the following beneficial effects:
1. the defects that the oxide layer cannot be effectively removed, the oxide layer and the PCB are damaged and frequent cleaning is needed in the conventional method are overcome.
2. The active surface is formed by the corrosion of the pickling solution, and the oxide layer is effectively removed and the oxidation resistance is improved by the laser planarization treatment.
3. Scanning parameters can be set according to the distribution density, the length and the width of different golden fingers, the whole golden finger can be scanned, and the removal efficiency is high.
4. The vacuum scanning environment avoids the secondary oxidation of the gold fingers in the treatment process, and effectively prolongs the service life of the parts.
5. The PCB is not damaged, and the quality and the performance of the components are ensured.
Accordingly, the computer-readable storage medium provided by the embodiment of the invention also has the technical effects.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a flow chart provided by an embodiment of the present invention.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "comprising" and "having," and any variations thereof, as referred to in embodiments of the present invention, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Example 1
The embodiment of the invention provides a method for removing an oxide layer on the surface of a golden finger, which comprises the following steps:
s1, preprocessing the golden finger to be removed, comprising the following substeps:
s1a, wiping the golden finger to be removed by using ethanol;
s1b, preparing a cleaning solution by using hydrofluoric acid, ammonium fluoride and water according to the weight ratio of 0.5:2:20 respectively;
s1c, immersing the golden finger in the cleaning solution for a preset time, wherein the preset time is 10 seconds;
s1d, cleaning the golden finger by using pure water, and drying the golden finger;
s2, setting scanning parameters according to the length, width and position distribution of the golden finger;
s3, setting laser parameters according to the distribution of the oxide layer, wherein the laser parameters comprise: the laser wavelength is 1064nm, and the laser energy density is 50mJ/cm2The scanning speed is 0.1mm/s, and the scanning frequency is 1 time;
s4, scanning the laser beam of the golden finger according to the scanning parameters and the laser parameters, comprising the following substeps:
s4a, fixing the golden finger in a vacuum environment, wherein the vacuum pressure of the vacuum environment is 180 mba;
s4b, starting laser beams according to the scanning parameters and the laser parameters, and carrying out surface scanning on the golden finger;
s4c, breaking vacuum by using nitrogen, and taking out the golden finger;
and S4d, wiping the golden finger to be removed by using ethanol.
Example 2
The embodiment of the invention provides a method for removing an oxide layer on the surface of a golden finger, which comprises the following steps:
s1, preprocessing the golden finger to be removed, comprising the following substeps:
s1a, wiping the golden finger to be removed by using ethanol;
s1b, preparing a cleaning solution by using hydrofluoric acid, ammonium fluoride and water according to the weight ratio of 3:5:40 respectively;
s1c, immersing the golden finger in the cleaning solution for a preset time, wherein the preset time is 60 seconds;
s1d, cleaning the golden finger by using pure water, and drying the golden finger;
s2, setting scanning parameters according to the length, width and position distribution of the golden finger;
s3, setting laser parameters according to the distribution of the oxide layer, wherein the laser parameters comprise: the laser wavelength is 1064nm, and the laser energy density is 200mJ/cm2The scanning speed is 2mm/s, and the scanning frequency is 6 times;
s4, scanning the laser beam of the golden finger according to the scanning parameters and the laser parameters, comprising the following substeps:
s4a, fixing the golden finger in a vacuum environment, wherein the vacuum pressure of the vacuum environment is 300 mba;
s4b, starting laser beams according to the scanning parameters and the laser parameters, and carrying out surface scanning on the golden finger;
s4c, breaking vacuum by using nitrogen, and taking out the golden finger;
and S4d, wiping the golden finger to be removed by using ethanol.
Example 3
The embodiment of the invention provides a method for removing an oxide layer on the surface of a golden finger, which comprises the following steps:
s1, preprocessing the golden finger to be removed, comprising the following substeps:
s1a, wiping the golden finger to be removed by using ethanol;
s1b, preparing a cleaning solution by using hydrofluoric acid (with the purity of 40 percent), ammonium fluoride (with the purity of 96 percent) and water according to the weight ratio of 1:3:25 respectively, uniformly stirring in the preparation process, and then standing for 20 minutes;
s1c, immersing the golden finger in the cleaning solution for a preset time, wherein the preset time is 30 seconds;
s1d, cleaning the golden finger by using pure water, and drying the golden finger;
s2, setting scanning parameters according to the length, width and position distribution of the golden finger;
s3, setting laser parameters according to the distribution of the oxide layer, wherein the laser parameters comprise: laser wavelength of 1064nm and laser energy density range of 100mJ/cm2The scanning speed is 0.7mm/s, and the scanning frequency is 2 times;
s4, scanning the laser beam of the golden finger according to the scanning parameters and the laser parameters, comprising the following substeps:
s4a, fixing the golden finger in a vacuum environment, wherein the vacuum pressure of the vacuum environment is 200 mba;
s4b, starting laser beams according to the scanning parameters and the laser parameters, and carrying out surface scanning on the golden finger;
s4c, breaking vacuum by using nitrogen, and taking out the golden finger;
and S4d, wiping the golden finger to be removed by using ethanol.
The method for removing the oxidation layer on the surface of the golden finger in the three embodiments completely removes the oxidation layer on the surface of the golden finger through surface corrosion and laser scanning, and firstly, the defects that the oxidation layer cannot be effectively removed, the oxidation layer and a PCB (printed circuit board) are damaged, and frequent cleaning is needed are overcome; secondly, the active surface is presented through the corrosion of pickling solution, and then the oxide layer is effectively removed through laser planarization treatment, and meanwhile, the oxidation resistance is improved; third, can set up scanning parameter according to the distribution density and length, the width of different golden fingers, realize scanning whole golden finger, get rid of efficiently, and fourth, the secondary oxidation of golden finger in the processing procedure has been avoided to the vacuum scanning environment, has effectively improved the life of part, and fifth, to the PCB board not damaged, guaranteed part quality and performance.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Corresponding to the methods for removing the oxidized layer on the surface of the gold finger in the three embodiments, an embodiment of the present invention further provides a computer-readable storage medium, where machine executable instructions are stored, and when the computer executable instructions are called and executed by a processor, the computer executable instructions cause the processor to execute the steps of the method.
The apparatus provided by the embodiment of the present invention may be specific hardware on the device, or software or firmware installed on the device, etc. The device provided by the embodiment of the present invention has the same implementation principle and technical effect as the method embodiments, and for the sake of brief description, reference may be made to the corresponding contents in the method embodiments without reference to the device embodiments. It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the foregoing systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the embodiments provided in the present invention, it should be understood that the disclosed apparatus and method can be implemented in other ways. The apparatus embodiments described above are merely illustrative, and for example, the flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
For another example, the division of the unit is only one division of logical functions, and there may be other divisions in actual implementation, and for another example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments provided by the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus once an item is defined in one figure, it need not be further defined and explained in subsequent figures, and moreover, the terms "first", "second", "third", etc. are used merely to distinguish one description from another and are not to be construed as indicating or implying relative importance.
Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present invention, which are used for illustrating the technical solutions of the present invention and not for limiting the same, and the protection scope of the present invention is not limited thereto, although the present invention is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: any person skilled in the art can modify or easily conceive the technical solutions described in the foregoing embodiments or equivalent substitutes for some technical features within the technical scope of the present disclosure; and the modifications, changes or substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention. Are intended to be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. A method for removing an oxide layer on the surface of a gold finger is characterized by comprising the following steps:
preprocessing the golden finger to be removed;
setting scanning parameters according to the length, width and position distribution of the golden finger;
setting laser parameters according to the distribution of the oxide layer;
and scanning the laser beam of the golden finger according to the scanning parameters and the laser parameters.
2. The method for removing the oxide layer on the surface of the gold finger according to claim 1, wherein the step of pretreating the gold finger to be removed comprises:
wiping the golden finger to be removed by using ethanol;
immersing the golden finger in a cleaning solution for a preset time;
and cleaning the golden finger by using pure water, and drying the golden finger.
3. The method as claimed in claim 2, wherein the predetermined time is 10 to 60 seconds.
4. The method for removing the oxidized layer on the surface of the gold finger according to claim 2, wherein before the step of immersing the gold finger in the cleaning solution for a predetermined time, the method further comprises:
hydrofluoric acid, ammonium fluoride and water in the weight ratio of 0.5-3 to 2-5 to 20-40 are used to prepare the cleaning solution.
5. The method for removing the oxide layer on the surface of the gold finger according to claim 1, wherein the laser parameters comprise: laser wavelength of 1064nm and laser energy density range of 50-200mJ/cm2The scanning speed is 0.1-2mm/s, and the scanning frequency is 1-6 times.
6. The method for removing the oxide layer on the surface of the gold finger according to claim 1, wherein the step of scanning the gold finger with the laser beam according to the scanning parameters and the laser parameters comprises:
fixing the golden finger in a vacuum environment;
and starting the laser beam according to the scanning parameters and the laser parameters, and carrying out surface scanning on the golden finger.
7. The method as claimed in claim 6, wherein the vacuum pressure of the vacuum environment is less than or equal to 300 mba.
8. The method for removing the oxide layer on the surface of the gold finger according to claim 1, wherein the step of scanning the gold finger with the laser beam according to the scanning parameters and the laser parameters further comprises:
breaking vacuum by using nitrogen, and taking out the golden finger;
and wiping the golden finger to be removed by using ethanol.
9. A computer readable storage medium having stored thereon machine executable instructions which, when invoked and executed by a processor, cause the processor to execute the method of any of claims 1 to 7.
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CN202010992095.5A CN112296024A (en) | 2020-09-21 | 2020-09-21 | Method for removing oxide layer on surface of golden finger |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115023060A (en) * | 2022-06-10 | 2022-09-06 | 苏州浪潮智能科技有限公司 | Liquid phase repairing method for golden finger |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1475602A (en) * | 2002-08-16 | 2004-02-18 | 中国科学院金属研究所 | Preparation method of magnesium alloy chromeless chemical conversion film and its used film forming solution |
US6830627B1 (en) * | 1999-03-23 | 2004-12-14 | International Business Machines Corporation | Copper cleaning compositions, processes and products derived therefrom |
US20080004197A1 (en) * | 2006-06-30 | 2008-01-03 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
CN103264227A (en) * | 2013-04-11 | 2013-08-28 | 温州大学 | Method of removing metal film covering surface of polymer substrate by direct laser etching |
CN103831506A (en) * | 2014-03-11 | 2014-06-04 | 中国化学工程第六建设有限公司 | Nitinol welding method |
CN104971927A (en) * | 2015-06-19 | 2015-10-14 | 湖州志英光电有限公司 | Laser cleaning equipment based on fiber laser unit |
CN104999080A (en) * | 2015-08-03 | 2015-10-28 | 北京理工大学 | Composite material increase manufacturing method for precise fine complex structural component |
CN107199251A (en) * | 2017-07-06 | 2017-09-26 | 武汉翔明激光科技有限公司 | A kind of laser cleaner |
CN110340541A (en) * | 2019-06-05 | 2019-10-18 | 武汉铱科赛科技有限公司 | A kind of wave pushing-type laser processing, device and system |
-
2020
- 2020-09-21 CN CN202010992095.5A patent/CN112296024A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6830627B1 (en) * | 1999-03-23 | 2004-12-14 | International Business Machines Corporation | Copper cleaning compositions, processes and products derived therefrom |
CN1475602A (en) * | 2002-08-16 | 2004-02-18 | 中国科学院金属研究所 | Preparation method of magnesium alloy chromeless chemical conversion film and its used film forming solution |
US20080004197A1 (en) * | 2006-06-30 | 2008-01-03 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
CN103264227A (en) * | 2013-04-11 | 2013-08-28 | 温州大学 | Method of removing metal film covering surface of polymer substrate by direct laser etching |
CN103831506A (en) * | 2014-03-11 | 2014-06-04 | 中国化学工程第六建设有限公司 | Nitinol welding method |
CN104971927A (en) * | 2015-06-19 | 2015-10-14 | 湖州志英光电有限公司 | Laser cleaning equipment based on fiber laser unit |
CN104999080A (en) * | 2015-08-03 | 2015-10-28 | 北京理工大学 | Composite material increase manufacturing method for precise fine complex structural component |
CN107199251A (en) * | 2017-07-06 | 2017-09-26 | 武汉翔明激光科技有限公司 | A kind of laser cleaner |
CN110340541A (en) * | 2019-06-05 | 2019-10-18 | 武汉铱科赛科技有限公司 | A kind of wave pushing-type laser processing, device and system |
Non-Patent Citations (1)
Title |
---|
巩水利: "《先进激光加工技术》", 30 November 2016 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115023060A (en) * | 2022-06-10 | 2022-09-06 | 苏州浪潮智能科技有限公司 | Liquid phase repairing method for golden finger |
CN115023060B (en) * | 2022-06-10 | 2023-07-14 | 苏州浪潮智能科技有限公司 | Liquid phase golden finger repairing method |
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