CN115023027A - High-voltage pulse energy full-absorption circuit board and manufacturing method thereof - Google Patents

Abstract

The invention relates to the technical field of circuit boards, in particular to a high-voltage pulse energy full-absorption circuit board and a manufacturing method thereof. The upper surface and the lower surface of the common circuit board are both attached with an energy full-absorption functional layer, the energy full-absorption functional layer comprises a copper wire attaching layer, a functional material layer and a conductive grounding layer which are sequentially arranged, and the conductive grounding layer is tightly connected with the surface of the common circuit board; the functional material layer has an insulator state when a voltage at any point of any one of the copper-attached wires on the copper-attached wire layer is not higher than a threshold value, and a conductor state for causing a high voltage on the copper-attached wire layer to release high voltage energy to the conductive ground layer through the functional material layer when the voltage at a point on the copper-attached wire layer exceeds the threshold value. On the premise of realizing the full absorption of high-voltage pulse energy, the method has low precision requirement on the process, low manufacturing difficulty and easy popularization.

Description

High-voltage pulse energy full absorption circuit board and manufacturing method thereof

technical field

The invention relates to the technical field of circuit boards, in particular to a high-voltage pulse energy full absorption circuit board and a manufacturing method thereof.

Background technique

Anti-instantaneous high-voltage pulse is an eternal subject in electronic manufacturing design. As the main means of attacking the communication command system, the directional electromagnetic pulse gun and the electromagnetic pulse projectile are mainly aimed at attacking and paralyzing electronic circuits of electronic equipment. At present, the protection of this electromagnetic pulse is mainly only a shielding scheme. This method inevitably leaves a large number of pores for the electromagnetic pulse to enter the shielding cavity, making it difficult for the electronic components of the device to be completely protected under the attack of the electric potential field of the electromagnetic pulse. Therefore, for the attack method of electromagnetic pulse, a higher security protection measure is required.

In order to solve the above technical problems, the Chinese Patent Publication No. CN113438796A discloses a circuit board capable of absorbing instantaneous high-voltage pulse energy and a manufacturing method. By arranging an energy absorbing plate conductively connected to the ground wire on the copper-attached layer, the transient state can be realized. The release of high voltage pulse energy. However, this method needs to set up more energy absorbing disks, and needs to achieve precise alignment between the energy absorbing disk and the copper wire attached to the surface circuit, which requires high process precision and is difficult to manufacture.

SUMMARY OF THE INVENTION

The purpose of the present invention is to aim at the defects of the prior art, to provide a high-voltage pulse energy full absorption circuit board and a manufacturing method thereof. Easy to popularize.

A high-voltage pulse energy full absorption circuit board of the present invention has the following technical solutions:

Including an ordinary circuit board, the upper and lower surfaces of the ordinary circuit board are attached with an energy full absorption functional layer, and the energy full absorption functional layer includes a copper wire layer, a functional material layer and a conductive ground layer arranged in sequence. The conductive ground layer is closely connected with the surface of the common circuit board;

the functional material layer has an insulator state when the voltage at any point of any one of the copper-attached wires on the copper-attached layer is not higher than a threshold value, and

At the moment when the voltage at a certain point on the copper-attached layer exceeds the threshold, it is a conductor state used to release high-voltage energy from the high-voltage on the copper-attached layer to the conductive ground layer through the functional material layer;

Among them, after the high-voltage energy is released, the functional material layer immediately returns to the insulator state.

Through the above technical solution, when the voltage difference between the voltages on all the copper-attached wires in the copper-attached layer and the polymer resistance material layer is less than 300V, the functional material layer is an insulator. When there is an abnormal voltage higher than 300V at any point of the wire, the point of the functional material layer corresponding to this point of the copper wire will locally change from an insulator to a conductor, so that this point of the copper wire is attached. The sensed abnormal high voltage releases high voltage energy to the conductive ground layer through the voltage-induced resistance film layer, so that the electronic components installed on the copper wire are protected from the shock of abnormal voltage.

More preferably, the conductive ground layer includes a polymer resistance material layer connected with the functional material layer and a grid ground wire layer connected with the surface of the common circuit board;

The polymer resistance material layer is formed by thermal curing of a thermal curing material;

The grid ground wire layer is a grid-shaped copper metal wire formed by etching a layer of copper foil layer attached to the surface of the high molecular resistance material layer.

More preferably, the copper wire-attached layer is a copper metal foil layer with a thickness of 10 um-20 um used for etching the surface of the circuit board with a copper wire attached.

More preferably, the functional material layer is a polymer composite nanometer voltage mutagenic soft film layer.

More preferably, the thickness of the polymer resistance material layer is 50um-200um, the volume resistivity is 0.5Ω-180Ω/cm ³ , and the thermosetting material is formed by mixing a polymer with a shapeable resistance value and conductive particles.

More preferably, the line width of the grid ground line layer at the connection with the ground line is greater than 2 mm, and the line width at other places is less than 1 mm.

Preferably, the fully energy absorbing functional layer is closely connected with the upper and lower surfaces of the common circuit board by the PP prepreg on one side of the conductive ground layer under the condition of thermocompression to form the circuit board as a whole.

A manufacturing method of a high-voltage pulse energy full absorption circuit board of the present invention, the technical scheme of which includes the following steps:

A layer of functional material is printed on the surface of the first copper foil and cured to form a functional foil;

A layer of polymer resistance material is printed on the functional material surface of the functional foil, a second copper foil is laid on the polymer resistance material and cured with the polymer resistance material, and the surface of the cured second copper foil is etched A grid structure is formed to form a full energy absorption functional board;

Remove the common circuit board, and drill the remaining two pieces of energy absorption function boards at the preset coordinate positions of the non-ground connection holes that require through-holes in the multi-layer circuit board, and make the hole diameter of the drilled holes larger than the planned finished board. Twice the diameter of the through hole;

A piece of energy absorption function board, a PP prepreg sheet, a common circuit board, a PP prepreg sheet and an energy absorption function board are placed in sequence in a stacked manner, and positioned and fastened by positioning bolts to form a circuit board to be cured;

curing the to-be-cured circuit board to form a high-voltage pulse energy fully absorbing embryo board;

The high-voltage pulse energy fully absorbs the blank plate at the coordinate position of the through hole according to the planned diameter of the through hole. hole coordinate position;

Washing, countersinking copper and copper-plating the through holes processed by the high-voltage pulse energy fully absorbed blank plate;

According to the design requirements, copper wires are etched on both sides of the high-voltage pulse energy full absorption embryonic plate to obtain a high-voltage pulse energy full absorption circuit board.

More preferably, the printing and curing of a layer of functional material on the surface of the first copper foil includes:

Take a piece of the first copper foil whose size and thickness meet the design requirements, and put it on the flat plate of the vacuum adsorption machine after degreasing the surface;

Printing a layer of functional material on the surface of the first copper foil;

The copper foil printed with functional materials is placed in a high temperature box for curing.

More preferably, after processing the full energy absorption function board, it also includes:

Take two pieces of energy absorption function board, make their conductive grounding layers coincide with the two surfaces of the ordinary circuit board, mark the coordinates of the two pieces of energy absorption function board and the ordinary circuit board, and determine the positioning holes and positioning bolts s position.

The beneficial effects of the present invention are:

1. Under the premise of realizing full absorption of high-voltage pulse energy, this circuit board does not need to set up an energy absorption disk, nor does it need precise alignment between the energy absorption disk and the copper wire attached to the surface circuit and through-hole copper plating connection, which requires the accuracy of the process. Low, low production difficulty, easy to popularize. At the same time, because there is no need to set up an energy absorbing disk, there will be no more problems in the process of processing due to the need to make through holes between the circuit and the energy absorbing disk, and the copper-plated connection may cause quality problems such as virtual connection, short circuit, and serial connection of a certain hole. The problems and dilemmas that cause the entire circuit board to be scrapped is a subversion of the original technology.

2. All parts of each copper wire in the circuit are arranged on the surface of the functional material, that is, any point of the circuit board is included in the protection range of the functional material, and there are infinitely many energy discharges between the circuit and the resistance material. The channel does not need to be specially designed and constructed for the energy channel, the manufacturing difficulty is greatly reduced, and the reliability is greatly improved. In addition, for the ultra-high energies of longer line segments, there is no need to consider the energy distribution problem in advance, and infinitely many energy release points naturally differentiate the energy.

Description of drawings

Fig. 1 is the structural representation of the present invention;

Fig. 2 is the schematic diagram of the first copper foil of the present invention;

Fig. 3 is the functional foil schematic diagram of the present invention;

4 is a schematic diagram of a polymer resistance material on the functional material surface of the present invention;

5 is a schematic diagram of laying a second copper foil on the polymer resistance material of the present invention;

6 is a schematic diagram of a grid structure etched on the second copper foil of the present invention;

7 is a schematic diagram of an ordinary circuit board in the middle of the high-voltage pulse energy full absorption circuit board of the present invention;

FIG. 8 is a schematic diagram of the high-voltage pulse energy fully absorbing embryonic plate M ₀ according to the present invention;

In Figure 1: 1-Ordinary circuit board, 2-Energy full absorption functional layer, 2.1-Copper wire layer, 2.2-Functional material layer, 2.3-Polymer resistance material layer, 2.4-Grid ground wire layer, 3-PP Prepreg.

Detailed ways

In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.

It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

It is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inside", "outside", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, which are only for the convenience of describing the application and simplifying the description, rather than indicating or implying the indicated device. Or elements must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as a limitation of the present application.

In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of the present application, "plurality" means two or more, unless otherwise expressly and specifically defined.

In the following description, for the purpose of illustration rather than limitation, specific details such as a specific system structure and technology are set forth in order to provide a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.

In addition, in the description of the specification of the present application and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the description, and should not be construed as indicating or implying relative importance.

References in this specification to "one embodiment" or "some embodiments" and the like mean that a particular feature, structure or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in other embodiments," etc. in various places in this specification are not necessarily All refer to the same embodiment, but mean "one or more but not all embodiments" unless specifically emphasized otherwise. The terms "including", "including", "having" and their variants mean "including but not limited to" unless specifically emphasized otherwise. "Plural" means "two or more"

Example 1

Fig. 1 shows a schematic structural diagram of a high-voltage pulse energy full absorption circuit board provided by a preferred embodiment of the present application (Fig. 1 shows the first embodiment of the present application). The relevant parts of the example are detailed as follows:

Including an ordinary circuit board 1, the two sides of the ordinary circuit board 1 are attached with an energy full absorption functional layer 2, one of the two energy full absorption functional layers 2 is denoted as N1, and the other is denoted as N2. The surface layers of the N1 and N2 energy absorption functional layers are the copper foil layers. The copper foil layers are used to etch electronic circuits to form the copper wire layer A. When the voltage and polymer resistance of all the copper wires in the copper wire layer A are attached When the voltage difference between the material layers C is less than 300V, the functional material layer B is an insulator. When an abnormal voltage higher than 300V appears on any point of any copper-attached wire on the copper-attached layer A, the copper-attached wire This point of the functional material layer B corresponding to this point of the wire will locally change from an insulator to a conductor, so that the abnormal high voltage induced by this point with the copper wire releases high-voltage energy to the conductive ground layer through the functional material layer. , so that the electronic components installed on the copper wire are protected from the shock of abnormal voltage.

The energy absorption functional layers N1 and N2 have the same structure, and both are composed of a functional foil layer composed of a copper wire layer 2.1, a functional material layer 2.2, a conductive ground layer composed of a polymer resistance material layer 2.3 and a grid ground wire layer 2.4. .

In one embodiment, the common circuit board 1 is a common multi-layer circuit constituting the middle layer of the multi-layer circuit board (double-sided or single-sided without the common layer). The energy full absorption functional layers N1 and N2 are respectively connected with the upper and lower surfaces of the common circuit layer by the PP prepreg on one side of the conductive ground layer under the condition of thermocompression to form the whole circuit board.

In one embodiment, the surface-attached copper layer A is a copper metal foil with a thickness of 10um to 20um for etching the surface of the circuit board with copper wires, and the functional material layer B is a Chinese invention patent (Patent No.: ZL201210314982. 2) The "polymer composite nano-voltage mutagenic resistance soft film" or the second manufacturing method in the patent is a functional thermosetting material with a thickness of 15um to 200um, and the functional material layer B is directly attached to the surface with copper attached. The surface of layer A. Among them, in addition to the two materials provided in this embodiment, the functional material layer B can be used as the functional material layer B in this solution, and the material layers formed by curing other materials that can realize the same function can be used as the functional material layer B in this solution.

In one embodiment, the polymer resistance material C is attached to the surface of the functional material layer B, the grid grounding wire D is attached to the surface of the polymer resistance material C, and the polymer resistance material C and the grid grounding wire D together form a conductive ground Floor. The polymer resistance material C is a thermosetting material with a shapeable resistance value of polymer and conductive particles blended, the thickness is 50um～200um, and the volume resistivity is 0.5Ω～180Ω/cm ³ .

In one embodiment, the grid grounding wire D is a grid-shaped copper metal wire formed by etching a copper foil layer attached to the surface of the polymer resistance material C, and the grid grounding wire D is connected to the The line width at the connection point of the ground wire is greater than 2mm, and the line width at other places is less than 1mm. The length and width of each grid are (20mm～20mm)×(20mm～40mm). The surface-attached copper layer A is etched according to a pre-designed circuit to form the surface-attached copper wire of the high-voltage pulse energy full absorption circuit board.

Embodiment 2

This embodiment provides a preparation method for preparing the above circuit board, and the steps are as follows:

Step 1: Take a copper foil with a thickness of 10um to 20um in an appropriate size, and put it on the flat plate of the vacuum adsorption machine after degreasing the surface, and print functional materials with a thickness of 15um to 200um on its surface. , Put the copper foil printed with functional materials into a high temperature box, adjust the temperature to 160 ° C, and naturally cool after 90 minutes to obtain functional foil.

Step 2, put the functional foil on the flat surface of the vacuum adsorption machine, print the polymer resistance material on the surface of the functional material, the printing thickness is 50um-200um, and then lay the copper foil with the thickness of 10um-15um on the surface of the polymer resistance material , after evenly compacting on the roller rolling machine, put it in the oven, adjust the temperature to 40 ℃ to cure for 20 minutes, then 60 ℃ for 20 minutes, and then 160 ℃ for 20 minutes, then naturally cool and take out, and then adhere to the surface of the resistance material layer The copper foil of 30mm×30mm and the line width of 1mm are etched into the grid to obtain the energy-absorbing functional board 2.

Step 3, take a piece of energy absorption function board as N2, the conductive ground layer facing up and overlap with the other side of a common circuit layer, and another piece of energy absorption function board as N1, with the conductive ground layer facing down and the common circuit board 1. The other side is overlapped, and the coordinate positioning marks are carried out on N1, ordinary circuit boards 1, and N2, and the positions of the positioning holes and the positioning bolts are determined.

Step 4. After the three boards are positioned, remove the bolts and remove the common circuit boards 1 and N1, and then re-install N1. Drill the coordinates of the non-ground connection holes that need through-holes for N2 and N1 in the pre-designed multi-layer circuit board. The hole diameter should be greater than twice the diameter of the planned through hole of the finished board.

Step 5: Loosen the positioning bolt, remove N1, place a piece of PP prepreg with the same size as N1 and a thickness of 30um on the conductive ground plane of N2, then reset the common circuit board 1, and then place the common circuit board 1 on the The circuit board 1 is the same size as the PP prepreg with a thickness of 30um, and finally N1 is installed to fasten the positioning bolt.

Step 6, put N1, ordinary circuit board 1, N2 that have been placed in the PP prepreg and have been positioned on a flat heat press machine, the temperature is adjusted to 300 ° C, the pressure is adjusted to 30KG, and after 30h of natural cooling, N1, ordinary The circuit board 1 and N2 will become a whole. The through holes of N1 and N2 will be filled with PP resin glue and some of them will overflow from the through holes. At this time, the high-voltage pulse energy fully absorbed embryo plate will be obtained.

Step 7: Clean up the overflowing PP resin, and then place the high-voltage pulse energy full-absorption blank plate on a flat grinder for grinding, so that both sides of the high-voltage pulse energy full-absorption blank plate are flat and consistent.

Step 8: For the high-voltage pulse energy full absorption embryonic plate, the through-hole coordinate positions of the forward, reverse and intermediate layers that need to be connected to each other are planned according to the planed through-hole diameter of the through-hole.

Step 9: Washing, sinking copper, and plating copper on the embryo plate with full absorption of high-voltage pulse energy.

Step 10, attach blue films on both sides of the high-voltage pulse energy fully absorbed embryonic plate.

Step 11: Expose and rinse the blue film to expose the pattern of the attached copper lines.

Step 12, after etching the attached copper wire and performing necessary post-processing, a high-voltage pulse energy full absorption circuit board is obtained.

It should be understood that the size of the sequence numbers of the steps in the above embodiments does not mean the sequence of execution, and the execution sequence of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

The above-mentioned embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the above-mentioned embodiments, those of ordinary skill in the art should understand that: it can still be used for the above-mentioned implementations. The technical solutions described in the examples are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions in the embodiments of the application, and should be included in the within the scope of protection of this application.

Claims (10)

1. The utility model provides a high-voltage pulse energy absorbs circuit board entirely, includes ordinary circuit board (1), its characterized in that: the upper surface and the lower surface of the common circuit board (1) are both attached with an energy full-absorption functional layer (2), the energy full-absorption functional layer (2) comprises a copper-attached wire layer (2.1), a functional material layer (2.2) and a conductive grounding layer which are sequentially arranged, and the conductive grounding layer is tightly connected with the surface of the common circuit board (1);

the functional material layer (2.2) has an insulator state when a voltage at any point of any one of the copper-attached wires on the copper-attached wire layer (2.1) is not higher than a threshold value, and

at the moment when the voltage of a certain point on the copper-attached wire layer (2.1) exceeds a threshold value, the high voltage on the copper-attached wire layer (2.1) is used for releasing the high-voltage energy to the conductive ground layer through the functional material layer (2.2);

wherein, after the high-voltage energy is released, the functional material layer (2.2) is immediately restored to an insulator state.

2. The high voltage pulse energy total absorption circuit board of claim 1, wherein: the conductive grounding layer comprises a high-molecular resistance material layer (2.3) connected with the functional material layer (2.2) and a grid grounding layer (2.4) connected with the surface of the common circuit board (1);

the high-molecular resistance material layer (2.3) is formed by thermosetting a thermosetting material;

the grid grounding layer (2.4) is a latticed copper metal wire formed by etching a copper foil layer attached to the surface of the high polymer resistance material layer.

3. The high voltage pulse energy total absorption circuit board of claim 1, wherein: the copper wire attaching layer (2.1) is a copper metal foil layer with the thickness of 10 um-20 um and used for etching a copper wire attached to the surface of the circuit board.

4. The high voltage pulse energy total absorption circuit board of claim 1, wherein: the functional material layer (2.2) is a polymer composite nanometer voltage induced resistance soft film layer.

5. The high-voltage pulse energy total absorption circuit board according to claim 2, characterized in that: the thickness of the high polymer resistance material layer (2.3) is 50-200 um, and the volume resistivity is 0.5-180 omega/cm ³ The thermosetting material is formed by blending and melting a polymer with a moldable resistance value and conductive particles.

6. The high voltage pulse energy total absorption circuit board of claim 2, wherein: the line width of the grid ground wire layer (2.4) at the connection part with the ground wire is more than 2mm, and the line widths of other parts are less than 1 mm.

7. The high voltage pulse energy total absorption circuit board of claim 2, wherein: the energy full-absorption functional layer (2) is tightly connected with the upper surface and the lower surface of the common circuit board (1) through a PP prepreg on one surface of the conductive grounding layer under the hot-pressing condition to form a circuit board whole.

8. A manufacturing method of a high-voltage pulse energy full-absorption circuit board is characterized by comprising the following steps:

printing a layer of functional material on the surface of the first copper foil and solidifying to form a functional foil;

printing a layer of polymer resistance material on the functional material surface of the functional foil, paving a second copper foil on the polymer resistance material and carrying out curing treatment on the second copper foil and the polymer resistance material, and etching a grid structure on the surface of the cured second copper foil to form the energy full-absorption functional plate;

taking down the common circuit board (1), drilling the two remaining energy full-absorption function boards at the coordinate position of the non-grounding connecting hole of the through hole required by the preset multilayer circuit board, and enabling the aperture of the drilled hole to be one time larger than the diameter of the through hole of the planned finished product board;

sequentially placing a piece of energy full-absorption functional board, a piece of PP prepreg, a piece of common circuit board (1), a piece of PP prepreg and a piece of energy full-absorption functional board in a laminating manner, and positioning and fastening the energy full-absorption functional board into a circuit board to be cured through a positioning bolt;

curing the circuit board to be cured to form a high-voltage pulse energy full-absorption embryonic plate;

carrying out through hole on the high-voltage pulse energy full-absorption embryonic plate at a through hole coordinate position according to the planned through hole diameter, wherein the through hole coordinate position is the through hole coordinate position of the planned positive and negative lines in the finished plate and the lines needing to be communicated with each other in the middle layer;

carrying out hole washing, counter bore copper and copper plating treatment on the through hole processed by the high-voltage pulse energy full-absorption blank plate;

and etching the attached copper wires on the two sides of the high-voltage pulse energy total absorption embryonic plate according to design requirements to obtain the high-voltage pulse energy total absorption circuit board.

9. The method of claim 8, wherein the printing a layer of functional material on the surface of the first copper foil and curing the functional material comprises:

taking a first copper foil with the size and thickness meeting the design requirements, performing degreasing treatment on the surface of the first copper foil, and placing the first copper foil on a flat plate of a vacuum adsorption machine;

printing a layer of functional material on the surface of the first copper foil;

and placing the copper foil printed with the functional material into a high-temperature box for curing.

10. The method for manufacturing a high voltage pulse energy total absorption circuit board according to claim 8, wherein after the energy total absorption function board is processed, the method further comprises:

taking two energy full-absorption function boards, enabling the conductive grounding layers of the two energy full-absorption function boards to be respectively superposed with two surfaces of the common circuit board (1), carrying out coordinate positioning marking on the two energy full-absorption function boards and the common circuit board (1), and determining the positions of the positioning holes and the positioning bolts.

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