CN115014518A - Focal plane assembly of space imaging spectrometer and detector assembly adjusting method - Google Patents
Focal plane assembly of space imaging spectrometer and detector assembly adjusting method Download PDFInfo
- Publication number
- CN115014518A CN115014518A CN202210549872.8A CN202210549872A CN115014518A CN 115014518 A CN115014518 A CN 115014518A CN 202210549872 A CN202210549872 A CN 202210549872A CN 115014518 A CN115014518 A CN 115014518A
- Authority
- CN
- China
- Prior art keywords
- detector
- assembly
- plate frame
- focal plane
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 238000009413 insulation Methods 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000000523 sample Substances 0.000 claims description 12
- 229910000838 Al alloy Inorganic materials 0.000 claims description 10
- 238000005202 decontamination Methods 0.000 claims description 10
- 230000003588 decontaminative effect Effects 0.000 claims description 10
- 239000004642 Polyimide Substances 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 230000007774 longterm Effects 0.000 abstract description 7
- 230000003287 optical effect Effects 0.000 abstract description 5
- 238000012360 testing method Methods 0.000 abstract description 5
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 4
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 238000005201 scrubbing Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
- G01J3/2823—Imaging spectrometer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/0202—Mechanical elements; Supports for optical elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
- G01J3/2803—Investigating the spectrum using photoelectric array detector
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
A focal plane component of a space imaging spectrometer and an assembling and adjusting method thereof belong to the technical field of space optical remote sensing, and aim to solve the problems of slow focusing of the focal plane component in the assembling and adjusting process, instability under test and examination facing complex space environment, poor heat dissipation of the focal plane component in long-term continuous working and substandard electromagnetic compatibility of the focal plane component in the prior art. The invention comprises the following steps: a plate frame assembly; the PCB is arranged in the plate frame assembly; the detector assembly is arranged at one end of the opening of the plate frame assembly through the fixed substrate and at least comprises a detector arranged in an inner space formed by the fixed substrate and the plate frame assembly, the detector and the PCB are welded and sealed, the light-sensitive surface of the detector faces to a light inlet hole in the fixed substrate, and the pin surface faces to the front surface of the PCB; and the heat conduction block assembly is connected with the detector assembly, and transmits the heat of the detector assembly to the outside of the plate frame assembly through the heat conduction block assembly and removes the dirt.
Description
Technical Field
The invention belongs to the technical field of space optical remote sensing, and particularly relates to a focal plane assembly of a space imaging spectrometer and a detector assembly adjusting method.
Background
With the rapid development of the space remote sensing technology, the imaging spectrometer as an important branch of the development of the space remote sensing instrument becomes the focus of research in recent years. The focal plane component is used as the last ring of the optical design, can realize the important function of converting optical signals into image signals, and is generally used as an important criterion for the success of a model transmitting task according to the definition of images. In the face of a complex space environment, many problems need to be considered in the design and adjustment of the focal plane assembly, such as the fit degree of the detector photosensitive surface and the actual focal plane in the adjustment process of the focal plane assembly, particularly the stability under the test and examination of the space environment, the problems of heat dissipation and electromagnetic compatibility involved in the long-term work of the focal plane assembly, and the like.
Disclosure of Invention
The invention aims to provide a focal plane assembly of a spatial imaging spectrometer and a detector assembly assembling and adjusting method, and solves the problems that in the prior art, the focal plane assembly is slow in focusing in the assembling and adjusting process and unstable under test examination facing a complex space environment, and the focal plane assembly is poor in heat dissipation and unqualified in electromagnetic compatibility in long-term continuous working.
To achieve the above object, the present invention provides a focal plane assembly of a spatial imaging spectrometer, comprising:
the plate frame assembly is provided with an opening at one end;
the PCB is arranged inside the plate frame assembly;
the detector assembly is arranged at one end of the opening of the plate frame assembly through a fixed substrate and at least comprises a detector arranged in an inner space formed by the fixed substrate and the plate frame assembly, the detector and the PCB are welded and sealed, the light-sensitive surface of the detector faces to a light inlet hole in the fixed substrate, and the pin surface faces to the front surface of the PCB;
and the heat conduction block assembly is connected with the detector assembly, and transmits the heat of the detector assembly to the outside of the plate frame assembly through the heat conduction block assembly and removes the dirt.
The probe assembly further includes:
the detector is connected with a mounting hole in the Y direction along the length direction of the cross section of the detector support through a bolt, and the detector support is connected with a mounting strip-shaped hole in the X direction along the length direction of the cross section of the fixed substrate through a bolt;
the adjusting gasket is arranged between the detector support and the fixed substrate, and the displacement of the detector relative to the fixed substrate along the Z direction is adjusted through the adjusting gasket;
a third insulation pad disposed between the probe and the probe support connection;
and an insulating thermal pad; the insulating heat conducting pad is arranged on one end face of the detector facing the inside of the plate frame assembly.
And the end part of the bolt connected between the detector support and the detector and the end part of the bolt connected between the detector support and the fixed substrate are respectively provided with an insulating sleeve.
The detector is a back-illuminated CMOS area array detector; the third heat insulation pad material is polyimide; the detector support is made of low expansion alloy 4J 32; the fixed substrate is made of aluminum alloy 7A 09.
The heat-conducting block assembly includes:
the third heat conduction block is used as a fixing support to be fixed with the fixing substrate of the detector assembly and tightly attached to the detector;
a second heat conduction block having one end connected to the third heat conduction block;
the other end of the second heat conduction block penetrates through the plate frame assembly and is fixedly connected with the first heat conduction block;
a first insulation pad located where the second heat conduction block passes through the plate frame assembly;
the second heat-insulation pad is positioned at the connecting position of the first heat-conducting block and the plate frame assembly and is positioned between the first heat-conducting block and the plate frame assembly;
and the heating decontamination resistor is arranged on the third heat conduction block.
The second heat conduction block is a multilayer graphene sheet body, and the first heat conduction block and the third heat conduction block are aluminum alloys; two ends of the second heat conduction block are respectively connected with the first heat conduction block and the third heat conduction block in a brazing mode; the first heat insulation pad and the second heat insulation pad are made of polyimide.
The sheet frame assembly includes:
one end of the detector plate frame is matched with the spigot of the fixed substrate;
one end of the FPGA plate frame is matched with a spigot at the other end of the detector plate frame;
and the top cover is matched with the spigot at the other end of the FPGA, and a fixing bolt sequentially penetrates through the top cover, the FPGA plate frame, the detector plate frame and the fixing substrate to be connected.
The FPGA plate frame and the detector plate frame are made of aluminum alloy 7A 09.
The PCB is an imaging control circuit.
The detector assembly adjusting method based on the focal plane assembly of the space imaging spectrometer comprises the following steps of:
the method comprises the following steps: replacing an adjusting gasket of the detector assembly with memory rubber, and roughly installing the detector assembly;
step two: the position of the detector in the X direction is adjusted through a mounting strip-shaped hole in the fixed substrate, and the position of the detector in the Y direction is adjusted through a mounting hole in the detector support, so that the image is centered;
step three: the memory rubber is pressed by a triangle of the detector bracket, a bolt between the detector bracket and the fixed base plate is screwed, and the focal plane distance of the detector in the Z direction is adjusted until the optimal focal plane position is found;
step four: taking down the memory rubber, grinding and repairing an adjusting gasket through the height of the memory rubber, and fastening a bolt between the detector bracket and the fixed substrate to find the actual focal plane position after the adjusting gasket is installed;
step five: mounting a detector plate frame on the fixed substrate;
step six: performing final drop welding and sealing on the detector relative to the PCB;
step seven: and (4) sequentially assembling the FPGA plate frame and the top cover, and fastening by fixing screws to finish assembly and adjustment.
The invention has the beneficial effects that: the invention relates to a focal plane component of a space imaging spectrometer and an assembly and adjustment method thereof, which comprises a PCB (printed Circuit Board), a plate frame component, a detector component and a heat dissipation component, wherein the PCB is fixed on the plate frame component, the detector component is butted with a target light source, after the optimal focal plane position is determined according to the assembly and adjustment method, the detector component and the PCB are subjected to falling welding, and finally, a thermal control component is implemented, so that the assembly and adjustment process of the whole focal plane component is completed. By adopting the design and adjustment method, the overall structure is simple, the actual focal plane position can be quickly found, the stability of the focal plane assembly in a complex space environment test examination can be effectively improved while the light weight of a space product is ensured, the temperature stability of the focal plane assembly can be ensured when the focal plane assembly works for a long time under the holding of the heat dissipation assembly, the overall temperature difference is controlled to be +/-3 ℃ through actual tests, and the electromagnetic compatibility reaches the standard.
Drawings
FIG. 1 is a schematic view of a focal plane assembly of a spatial imaging spectrometer of the present invention;
FIG. 2 is a cross-sectional view of a focal plane assembly of a spatial imaging spectrometer of the present invention;
FIG. 3 is a schematic view of a bezel assembly in the focal plane assembly of a spatial imaging spectrometer according to the present invention;
FIG. 4 is a schematic view of a thermal mass assembly in a focal plane assembly of a spatial imaging spectrometer according to the present invention;
FIG. 5 is a schematic view of a detector assembly in the focal plane assembly of a spatial imaging spectrometer of the present invention;
FIG. 6 is a schematic diagram of a method of adjusting a focal plane assembly of a spatial imaging spectrometer according to the present invention;
wherein: 1. PCB board, 2, the sheet frame subassembly, 201, the top cap, 202, the FPAG sheet frame, 203, the detector sheet frame, 204, set screw, 3, the heat conduction block subassembly, 301, the third heat conduction piece, 302, the heating scrubbing resistance, 303, the second heat conduction piece, 304, first heat insulating mattress, 305, the second heat insulating mattress, 306, the first heat conduction piece, 4, the detector subassembly, 401, the detector, 402, the detector support, 403, adjusting shim, 404, the third heat insulating mattress, 405, insulating cover, 406, fixed baseplate, 407, insulating heat conducting mattress.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings.
Referring to fig. 1-5, a focal plane assembly of a spatial imaging spectrometer of the present invention comprises:
the plate frame component 2 is provided with an opening at one end;
the PCB board 1 is arranged inside the plate frame assembly 2;
the detector assembly 4 is arranged at one open end of the plate frame assembly 2 through a fixed substrate 406, the detector assembly 4 at least comprises a detector 401 arranged in an inner space formed by the fixed substrate 406 and the plate frame assembly 2, the detector 401 and the PCB 1 are welded and sealed, a light-sensitive surface of the detector 401 faces to a light inlet hole in the fixed substrate 406, and a pin surface faces to the front surface of the PCB 1;
the heat conduction block assembly 3 is connected with the detector assembly 4, heat of the detector assembly 4 is transmitted to the outside of the plate frame assembly 2 through the heat conduction block assembly 3, and the detector 401 can complete a refrigeration function; heating decontamination resistance 302 installs on the third heat conduction piece, can guarantee its pollutant that probably exists in image plane department, toasts the back through heating decontamination resistance heating, and transmission heat energy makes the pollutant decompose the diffusion under the high temperature effect on the detector body, accomplishes the scrubbing function, plays the effect that does not influence entire system imaging function. .
The detector assembly 4 further comprises:
the detector 401 is connected with a mounting hole in the Y direction in the length direction of the cross section of the detector support 402 through a bolt, and the detector support 402 is connected with a mounting strip-shaped hole in the X direction in the length direction of the cross section of the fixed substrate 406 through a bolt;
a spacer 403 arranged between the probe holder 402 and the fixed substrate 406, wherein the displacement of the probe 401 relative to the fixed substrate 406 along the Z direction is adjusted by the spacer 403;
a third insulation pad 404 disposed between the probe 401 and the probe holder 402 junction;
and an insulating thermal pad 407; the insulating and heat conducting pad 407 is disposed on an end face of the detector 401 facing the inside of the plate frame assembly 2.
The end of the bolt connected between the probe holder 402 and the probe 401 and the end of the bolt connected between the probe holder 402 and the fixed substrate 406 are provided with insulating sleeves 405.
The detector 401 is a back-illuminated CMOS area array detector 401; the third heat insulation pad 404 is made of polyimide; the detector support 401 is made of low expansion alloy 4J 32; the material of the fixed substrate 406 is aluminum alloy 7a 09.
The insulating heat conducting pad 407 is mounted on the back surface of the detector 401 and located between the detector and the third heat conducting block 301, so that the heat conducting block assembly 3 can conduct heat generated by long-term operation of the detector 401 out, and the heat conducting block assembly and the third heat conducting block are insulated; the detector 401 is installed with the detector support 402 in a heat insulation mode through the third heat insulation pad 404, and the detector support 402 is manufactured by processing and preparing 4J32 with an ultralow expansion coefficient, so that the deviation between the light-sensitive surface of the detector 401 and the actual light path under the influence of temperature is reduced. Four threaded holes are formed in four corners of the fixing substrate 406 and are matched with the fixing screws 204 to tightly press the whole focal plane assembly; the detector bracket 402 is rigidly fixed to the inside of the fixing base plate 406 by screws passing through the adjusting spacers 403.
The heat conduction block assembly 3 includes:
a third heat conduction block 301, wherein the third heat conduction block 301 is fixed with a fixing substrate 406 of the detector assembly 4 as a fixing bracket and is tightly attached to the detector 401;
a second heat conduction block 303 having one end connected to the third heat conduction block 301;
the first heat conduction block 306 is arranged outside the plate frame assembly 2, and the other end of the second heat conduction block 303 penetrates through the plate frame assembly 2 and is fixedly connected with the first heat conduction block 306;
a first insulation pad 304 located where the second thermal conduction block 303 passes through the plate frame assembly 2;
a second insulation mat 305 located at the connection position of the first heat conduction block 306 and the plate frame assembly 2, wherein the second insulation mat 305 is located between the first heat conduction block 306 and the plate frame assembly 2;
and a heating decontamination resistor 302 disposed on the third heat conduction block 301. The heating decontamination resistor 302 is fixed on the third heat conducting block 301 by screws, and heat conducting silicone grease is filled between the third heat conducting block and the third heat conducting block to increase the heat conducting capacity; and heating the external flying wire of the decontamination resistor 302 to the PCB 1 for control.
The second heat conduction block 303 is a multilayer graphene sheet, and the first heat conduction block 306 and the third heat conduction block 301 are aluminum alloys; two ends of the second heat conduction block 303 are respectively connected with the first heat conduction block 306 and the third heat conduction block 301 in a soldering manner; the materials of the first thermal insulation pad 304 and the second thermal insulation pad 305 are polyimide.
The heat conducting block 303 is made of a composite material, aluminum alloy 1060 is arranged at two ends of the heat conducting block, and a plurality of layers of graphene sheets are used in the middle of the heat conducting block and are respectively connected with the aluminum blocks at the two ends in a brazing mode, so that the heat conducting block has the advantages of being high in heat transfer coefficient, high in light weight and the like. One end of the heat-conducting block 303 is connected with the heat-conducting block fixing support 301 and is tightly attached to the detector 401 of the detector assembly 4, so that the heat dissipation of the detector 401 is ensured; and the other end of the detector is arranged outside the FPGA plate frame 202 and the detector plate frame 203 through an outlet reserved in the detector plate frame 203. The heat conducting block 303 is externally connected with a heat radiating plate 306, and the conduction of heat generated by long-term operation of the detector assembly 4 is completed by utilizing high heat conductivity coefficient, so that the long-term operation of the detector assembly is guaranteed to be free of faults. The heating decontamination resistor 302 is arranged above the heat conducting block 303 and is used for decontaminating the detector 401 in a space environment; the first heat insulation pad 304 and the second heat insulation pad 305 are made of polyimide materials, so that the heat conduction block 303 and the plate frame assembly 2 are ensured to be installed in a heat insulation manner.
The panel frame assembly 2 includes:
the detector plate frame 203, one end of the detector plate frame 203 is matched with the spigot of the fixed substrate 406;
the FPGA plate frame 202 is matched with a spigot at one end of the detector plate frame 203 at the other end;
and the top cover 201 is matched with a spigot at the other end of the FPGA, and a fixing bolt sequentially penetrates through the top cover 201, the FPGA plate frame 202, the detector plate frame 203 and the fixing substrate 406 to be connected. The header 201 is used to secure the connector assembly.
The FPGA plate frame 202 and the detector plate frame 203 are both made of aluminum alloy 7A 09. And the front surface of the PCB (printed circuit board) 1 is fixed by screws, so that the rectangular connector and the data transmission connector can be conveniently welded.
The PCB board 1 is an imaging control circuit, and imaging control, refrigeration control, heating decontamination, receiving processing and packaging downloading of output image data, remote measurement of the detector 401 and serial communication with an electric cabinet are realized through the PCB board 1. The system specifically comprises a linear power supply conversion circuit, an FPGA and peripheral circuit, a detector 401 and peripheral circuit, an RS-422 interface circuit, an internal telemetering circuit, an external telemetering interface circuit, a heating decontamination and temperature measurement circuit and the like.
Referring to fig. 6, the method for adjusting the detector assembly based on the focal plane assembly of the spatial imaging spectrometer comprises the following steps:
the method comprises the following steps: replacing an adjusting gasket 403 of the detector assembly 4 with memory rubber, roughly installing the detector assembly 4, aligning an optical system, and utilizing one end of a switching circuit board to be inserted into a pin of the detector 401 and the other end to be connected with external grounding detection equipment;
step two: the position of the detector 401 in the X direction is adjusted through a mounting strip-shaped hole in the fixed substrate 406, and the position of the detector 401 in the Y direction is adjusted through a mounting hole in the detector support 402, so that the image is centered;
step three: the memory rubber is pressed tightly through the triangle of the detector support 402, a bolt between the detector support 402 and the fixed substrate 406 is screwed, and the focal plane distance of the detector 401 in the Z direction is adjusted until the optimal focal plane position is found;
step four: taking off the memory rubber, grinding an adjusting gasket 403 through the height of the memory rubber, mounting the adjusting gasket 403, and fastening a bolt between the detector bracket 402 and the fixed substrate 406 to find the actual focal plane position;
step five: the detector plate frame 203 is arranged on the fixed substrate 406 in a pair;
step six: performing falling welding connection on the detector 401 relative to the PCB 1, and ensuring that the detector 401 is free from any stress after falling welding;
step seven: the FPGA plate frame 202 and the top cover 201 are assembled in sequence and fastened through the fixing screws 204, and assembly and adjustment are completed.
The invention relates to a focal plane component of a space imaging spectrometer and an assembling and adjusting method thereof, which are a design method and a focal plane method aiming at a space effective load focal plane unit, wherein the detector component 4 and a PCB (printed Circuit Board) 1 are utilized to complete the key step of photoelectric signal conversion, and the plate frame component 2 is used for ensuring the reliability of the space environment and the heat conducting block component 3 is used for ensuring the reliability of the long-term working heat dissipation.
Claims (10)
1. A focal plane assembly for a spatial imaging spectrometer, comprising:
the plate frame assembly (2), one end of the plate frame assembly (2) is open;
the PCB (1) is arranged inside the plate frame assembly (2);
the detector assembly (4) is arranged at one opening end of the plate frame assembly (2) through a fixed substrate (406), the detector assembly (4) at least comprises a detector (401) arranged in an inner space formed by the fixed substrate (406) and the plate frame assembly (2), the detector (401) and the PCB (1) are welded and sealed, a light-sensitive surface of the detector (401) faces to a light inlet hole in the fixed substrate (406), and a pin surface faces to the front surface of the PCB (1);
and the heat conduction block assembly (3) is connected with the detector assembly (4), and the heat conduction block assembly (3) transmits the heat of the detector assembly (4) to the outside of the plate frame assembly (2) and removes the dirt.
2. The focal plane assembly of a spatial imaging spectrometer according to claim 1, wherein the detector assembly (4) further comprises:
the detector support (402), the mounting holes of the detector (401) and the detector support (402) along the Y direction in the length direction of the cross section are connected through bolts, and the mounting bar-shaped holes of the detector support (402) and the fixed substrate (406) along the X direction in the length direction of the cross section are connected through bolts;
the adjusting shim (403) is arranged between the joint of the detector support (402) and the fixed substrate (406), and the displacement of the detector (401) relative to the fixed substrate (406) along the Z direction is adjusted through the adjusting shim (403);
a third insulation pad (404) disposed between the probe (401) and probe holder (402) connection;
and an insulating thermal pad (407); the insulating heat conducting pad (407) is arranged on one end face of the fixed base plate (406) facing the interior of the plate frame assembly (2).
3. The focal plane assembly of a spatial imaging spectrometer according to claim 2, wherein the ends of the bolts connecting between the detector support (402) and the detector (401) and the bolts connecting between the detector support (402) and the stationary substrate (406) are provided with an insulating sleeve (405).
4. The focal plane assembly of a spatial imaging spectrometer according to claim 2, wherein the detector (401) is a back-illuminated CMOS area-array detector; the third heat insulation pad (404) is made of polyimide; the detector support (402) is made of low expansion alloy 4J 32; the material of the fixed substrate (406) is aluminum alloy 7A 09.
5. The focal plane assembly of a spatial imaging spectrometer according to claim 1 or 2, wherein the heat conducting block assembly (3) comprises:
a third heat-conducting block (301), wherein the third heat-conducting block (301) is used as a fixing bracket to be fixed with a fixing substrate (406) of the detector assembly (4) and is tightly attached to the detector (401);
a second heat conduction block (303) having one end connected to the third heat conduction block (301);
the first heat conduction block (306) is arranged outside the plate frame assembly (2), and the other end of the second heat conduction block (303) penetrates through the plate frame assembly (2) and is fixedly connected with the first heat conduction block (306);
a first thermal insulation pad (304) located where the second heat conduction block (303) passes through the plate frame assembly (2);
a second insulation mat (305) located at the connection location of the first heat conduction block (306) and the plate frame assembly (2), the second insulation mat (305) being located between the first heat conduction block (306) and the plate frame assembly (2);
and a heating decontamination resistor (302) arranged on the third heat conduction block (301).
6. The focal plane assembly of a spatial imaging spectrometer according to claim 5, wherein the second thermally conductive block (303) is a multi-layer graphene sheet, and the first and third thermally conductive blocks (306, 301) are aluminum alloys; two ends of the second heat-conducting block (303) are respectively connected with the first heat-conducting block (306) and the third heat-conducting block (301) in a soldering manner; the materials of the first heat insulation pad (304) and the second heat insulation pad (305) are polyimide.
7. The focal plane assembly of a spatial imaging spectrometer according to claim 1, wherein the plate frame assembly (2) comprises:
the detector plate frame (203), one end of the detector plate frame (203) is matched with the spigot of the fixed substrate (406);
one end of the FPGA plate frame (202) is matched with a spigot at the other end of the detector plate frame (203);
and the top cover (201) is matched with a spigot at the other end of the FPGA, and a fixing bolt sequentially penetrates through the top cover (201), the FPGA plate frame (202), the detector plate frame (203) and the fixing substrate (406) to be connected.
8. The focal plane assembly of a spatial imaging spectrometer according to claim 7, wherein the FPGA plate frame (202) and the detector plate frame (203) are both made of aluminum alloy 7a 09.
9. A focal plane assembly of a spatial imaging spectrometer according to claim 1, characterised in that the PCB board (1) is an imaging control circuit.
10. The method for adjusting the focal plane assembly of a spatial imaging spectrometer as claimed in claim 1, comprising the steps of:
the method comprises the following steps: replacing an adjusting gasket (403) of the detector assembly (4) with memory rubber, and roughly installing the detector assembly (4);
step two: the position of the detector (401) in the X direction is adjusted through a mounting strip-shaped hole in a fixed substrate (406), and the position of the detector (401) in the Y direction is adjusted through a mounting hole in a detector support (402), so that an image is centered;
step three: the memory rubber is pressed through a triangle of the detector support (402), a bolt between the detector support (402) and the fixed substrate (406) is screwed, and the focal plane distance of the detector (401) in the Z direction is adjusted until the optimal focal plane position is found;
step four: taking off the memory rubber, grinding and repairing the adjusting gasket (403) through the height of the memory rubber, mounting the adjusting gasket (403), and fastening a bolt between the detector bracket (402) and the fixed substrate (406) to find the actual focal plane position;
step five: -aligning a detector plate frame (203) to one another on the stationary substrate (406);
step six: performing falling welding connection on the detector (401) relative to the PCB (1);
step seven: the FPGA plate frame (202) and the top cover (201) are assembled in sequence and fastened through fixing screws (204) to finish assembly and adjustment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210549872.8A CN115014518A (en) | 2022-05-20 | 2022-05-20 | Focal plane assembly of space imaging spectrometer and detector assembly adjusting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210549872.8A CN115014518A (en) | 2022-05-20 | 2022-05-20 | Focal plane assembly of space imaging spectrometer and detector assembly adjusting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115014518A true CN115014518A (en) | 2022-09-06 |
Family
ID=83069849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210549872.8A Pending CN115014518A (en) | 2022-05-20 | 2022-05-20 | Focal plane assembly of space imaging spectrometer and detector assembly adjusting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115014518A (en) |
-
2022
- 2022-05-20 CN CN202210549872.8A patent/CN115014518A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103500749B (en) | A kind of super long alignment InGaAs detector encapsulating structure of thermoelectric cooling | |
| EP3700029A1 (en) | Light source module | |
| CN109361845B (en) | CCD camera structure capable of continuously shooting high-definition pictures | |
| KR102236109B1 (en) | black body system for calibration of infrared detector installed on satellite | |
| CN115014518A (en) | Focal plane assembly of space imaging spectrometer and detector assembly adjusting method | |
| CN210093797U (en) | Thermal imaging device structure | |
| JP2001165525A (en) | Thermoelectric heating/cooling device | |
| JPH0821767A (en) | Infrared detector and preparation thereof | |
| CN111623959B (en) | MTF test equipment for integrated optical lens group | |
| KR20210076092A (en) | radiation imaging device | |
| JP3400114B2 (en) | Cooling system | |
| CN115844430A (en) | CT detector module temperature control structure and CT scanning equipment | |
| Trollier et al. | Flexible thermal link assembly solutions for space applications | |
| US4719353A (en) | Integrated infrared detector and cryoengine assembly | |
| CN108801454B (en) | Low temperature radiometer thermal structure | |
| KR101413869B1 (en) | Imaging apparatus and imaging apparatus production method | |
| JP7181049B2 (en) | Radiation imaging device, method for manufacturing radiation imaging device, and method for repairing radiation imaging device | |
| CN112763095A (en) | CCD temperature control system of satellite-borne hyperspectral detector | |
| CN203631552U (en) | Thermoelectric refrigeration super long alignment InGaAs detector packaging structure | |
| CN114518680B (en) | FXT (x-ray fluorescence) focusing camera refrigeration link structure for Einstein probe satellite | |
| CN221282943U (en) | Motor heat balance assembly | |
| CN118011581B (en) | Deep low temperature multiband cold optical system | |
| CN217878032U (en) | Anti-electromagnetic interference infrared thermal imaging engine core assembly of photoelectric measuring instrument | |
| US20240175719A1 (en) | Multipurpose Spacer | |
| JP6932277B1 (en) | Infrared sensor and manufacturing method of infrared sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |