CN115008777A - Manufacturing method of temperature sensing wide-field probe - Google Patents
Manufacturing method of temperature sensing wide-field probe Download PDFInfo
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- CN115008777A CN115008777A CN202210657566.6A CN202210657566A CN115008777A CN 115008777 A CN115008777 A CN 115008777A CN 202210657566 A CN202210657566 A CN 202210657566A CN 115008777 A CN115008777 A CN 115008777A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
- B29C67/242—Moulding mineral aggregates bonded with resin, e.g. resin concrete
- B29C67/243—Moulding mineral aggregates bonded with resin, e.g. resin concrete for making articles of definite length
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Abstract
The invention relates to the technical field of laser wide-field imaging sensing, and discloses a technical scheme for achieving the purpose, wherein the technical scheme comprises the following steps: a method for manufacturing a temperature sensing wide-field probe comprises the following steps: manufacturing a forming die; paving diamond particles containing NV color centers in a forming die; adding a substrate raw material which is initially in a fluid state into a forming die to cover diamond particles; the raw material of the substrate becomes a solid substrate after being solidified, and the diamond particles are embedded into the lower side surface of the substrate; the substrate and the diamond particles are taken out from the forming die after being demoulded; the manufacturing method provided by the invention can quickly connect batches of NV-containing diamond particles on the substrate and can effectively ensure that the detection ends of the diamond particles are in the same detection plane.
Description
Technical Field
The invention relates to the technical field of laser wide-field imaging sensing, in particular to a method for manufacturing a temperature sensing wide-field probe.
Background
In recent years, electronic circuit integration has been increasing and many circuits are assembled in one chip, and the corresponding power consumption has increased in proportion to the scale of the circuit, in which case the chip temperature rises and, in the worst case, the chip can burn out. In order to avoid this, it is required to detect the chip temperature of the semiconductor device and control the semiconductor device system so as to protect the chip. And the local temperature of the semiconductor chip is also a very heavy index, and the loss of the module function can be caused by the local over-high temperature. Therefore, how to realize the calculation of the chip temperature and the scanning of the chip temperature gradient in the local area is an urgent problem to be solved.
At present, in order to obtain a sensor with higher sensitivity and measurement accuracy, researchers have shifted the center of gravity to the concept and technology of quantum physics, and studies on magnetic field measurement and temperature information detection using electron spin have been advanced. The super-high sensitivity magnetic field measurement can be realized under the action of external laser and microwave by utilizing the electron spin paramagnetic property and optical property of a diamond nitrogen vacancy center (NV color center). Meanwhile, the NV color center diamond is used as a sensitive element of the temperature sensor, and temperature measurement can be realized by measuring the optical detection magnetic resonance spectrum (ODMR spectrum) of the NV color center under the action of external laser, microwave and a multi-physical field of a given magnetic field. There are two main types of NV color center electron spins studied at present: single NV colour center electron spin and ensemble NV colour center. The NV color center diamond with high concentration and high uniformity is used as a sensitive element, so that the signal to noise ratio is high, and the sensitivity and the measurement accuracy are high.
However, at present, the technology of using NV color centers to measure temperature is a point-to-point measurement mode, that is, the surface of a chip is measured point by using small-grained NV color center diamonds, but the speed of the measurement mode is extremely slow, which is not favorable for obtaining temperature data of the chip quickly, and in order to improve the detection efficiency, research on a large-size NV diamond probe (wide-field probe) is being started, however, the existing wide-field probe based on NV color centers is single in manufacturing method (can manufacture large-size diamond films), and is difficult to satisfy the requirement for manufacturing diverse probes.
Based on the method, the invention designs a manufacturing method of a novel temperature sensing wide-field probe.
Disclosure of Invention
The invention provides a method for manufacturing a temperature sensing wide-field probe, which aims to solve the problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme:
a method for manufacturing a temperature sensing wide-field probe comprises the following steps:
s1, manufacturing a forming die;
s2, paving diamond particles containing NV color centers in a forming die;
s3, adding the substrate raw material in the initial fluid state into a forming die to cover the diamond particles;
s4, solidifying the raw material of the substrate to form a solid substrate, and embedding the diamond particles into the lower side surface of the substrate;
and S5, removing the substrate and the diamond particles from the forming die after demoulding.
Preferably, after the substrate is taken out after demolding, an antireflection film is arranged on the upper side surface of the substrate, and a reflective heat-insulating coating layer is arranged on the lower side surface of the substrate.
Preferably, after the reflective heat-insulating coating is arranged on the lower side surface of the substrate, the lower side surface of the substrate is wiped by using a grinding platform, so that the reflective heat-insulating coating on the diamond particle detection end is erased.
Preferably, the bottom surface of the inner cavity of the forming die is uniformly distributed with diamond particle positioning grooves, the bottom surfaces of all the diamond particle positioning grooves approach to the same horizontal plane, and the error is not more than 0.1 mm.
Preferably, the diamond particle positioning groove is in a circular table shape, an included angle between a generatrix of the circular table and the bottom surface is 30-70 degrees, the groove bottom of the diamond particle positioning groove is a narrow surface, and the groove opening is a wide surface.
Preferably, the flatness of the bottom surface of the inner cavity of the forming die is not more than 0.1 mm.
Preferably, before the substrate material is cured, impurities or bubbles inside the substrate material are removed, and then the top surface of the substrate material is pressed by a flat plate to be flat.
Preferably, the substrate is a poor conductor of heat and is transparent to light.
Preferably, the substrate is glass, organic glass or epoxy resin.
Preferably, the specific process of step S2 is as follows:
firstly, pouring a certain amount of diamond particles containing NV color centers into an ethanol solution, and uniformly distributing the diamond particles in the ethanol by stirring or shaking or combination of the stirring and the shaking;
then, pouring a certain amount of the solution into a forming mold to cover the bottom surface of the mold cavity;
finally, after the ethanol is naturally volatilized, the diamond particles are uniformly distributed in the forming die.
Preferably, the specific process of step S3 is as follows:
firstly, a mesh screen cylinder with the size matched with the inner cavity of a forming die is manufactured, and a piston plate is manufactured in a matched mode;
then, moving the mesh screen cylinder to a position close to the upper part of the diamond particles in the forming die;
finally, a certain amount of fluid base plate raw material is poured on the mesh screen cylinder, and the base plate raw material is pressed by moving the piston plate, so that the base plate raw material slowly penetrates through meshes on the mesh screen cylinder and covers diamond particles in the forming die.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a manufacturing method of a temperature sensing wide-field probe, which can quickly connect batches of NV-containing diamond particles to a substrate and can effectively ensure that the detection ends of the diamond particles are positioned in the same detection plane.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a flow chart of the method of the present invention;
FIG. 2 is a schematic diagram of a wide-field temperature sensing probe according to an embodiment I;
FIG. 3 is a schematic view illustrating a molding die according to one embodiment;
FIG. 4 is a schematic view illustrating a state where a substrate raw material is added to a mold according to a first embodiment;
FIG. 5 is a diagram illustrating a pressing operation performed by a flat plate according to an embodiment;
FIG. 6 is a schematic view showing a state in demolding in the first embodiment;
FIG. 7 is a schematic view of a temperature-sensing wide-field probe according to a second embodiment;
FIG. 8 is a schematic view showing a state in which diamond particles are wiped by a polishing platen according to the second embodiment;
FIG. 9 is a schematic view of a temperature-sensing wide-field probe according to a third embodiment;
FIG. 10 is a partial schematic view of a substrate according to a third embodiment;
FIG. 11 is a schematic view of a temperature-sensing wide-field probe according to a fourth embodiment;
FIG. 12 is a schematic diagram of the fabrication of a wide-field temperature sensing probe according to the fourth embodiment.
Reference numerals: 1-temperature sensing wide field probe, 2-mould, 3-punching equipment, 4-flat plate, 5-grinding platform, 6-mesh screen cylinder, 7-piston plate, 11-base plate, 12-diamond particles and 21-diamond particle positioning groove.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of protection of the disclosure.
Example one
Referring to fig. 2, a wide field probe 1 for temperature sensing to be manufactured in an embodiment includes a substrate 11, where the substrate 11 is a square planar thin plate structure made of a transparent material with low thermal conductivity, and may be glass, organic glass, epoxy resin, and the like, in this example, the substrate 11 is made of a transparent epoxy resin, one side of the substrate 11 is a microparticle surface, and the other side of the substrate is a light irradiation surface, diamond particles 12 (including NV color centers) are distributed on the microparticle surface at intervals, the diamond particles 12 are cubic particles with 1mm, a distance between adjacent diamond particles 12 is 0.5mm to 0.7mm, and one end of each diamond particle 12 far from the transparent planar substrate 11 approaches to the same virtual plane.
Referring to fig. 1, for the above wide-field temperature sensing probe, the present embodiment discloses a manufacturing method, which includes the following specific steps:
s1, manufacturing a forming die:
specifically, referring to fig. 3, a mold 2 is manufactured according to the requirement of the overall dimension of the temperature sensing wide-field probe, and diamond particle positioning grooves 21 arranged in an array manner are punched on the bottom surface of an inner cavity of the mold 2 through a punching device 3;
s2, paving diamond particles containing NV color centers in a forming die: specifically, one diamond particle 12 is placed in each diamond particle positioning groove 21;
s3, adding the substrate raw material in the initial fluid state into a molding die so that the substrate raw material covers the diamond particles:
specifically, referring to fig. 4, the liquid epoxy resin and the curing agent are mixed uniformly, then a certain amount of the mixed solution is poured into the mold 2 to cover the diamond particles 12 (care is taken to clean air bubbles in the mixture), when pouring, the mixed solution is poured into the mold 2 at a position close to one side of the mold, and the flow rate is controlled to slowly pour the mixed solution, so that the diamond particles 12 are prevented from being displaced due to impact of the mixture;
pressing the top surface of the mixed solution by a flat plate 4 (as shown in fig. 5), on one hand, leveling the top surface of the substrate 11, on the other hand, enabling the mixed solution to be in closer contact with the diamond particles 12, and preventing the mixed solution from falling off in the later period;
s4, solidifying the raw material of the substrate to form a solid substrate, and embedding the diamond particles into the lower side surface of the substrate: the epoxy will cure over time (complete curing at room temperature for 1-2 days), with the diamond particles 12 embedded in one side of the solid epoxy;
and S5, removing the substrate and the diamond particles from the forming die after demolding, and referring to the attached figure 6.
Further, after the finished product is manufactured, the double-sided flatness check is needed, and when the flatness does not meet the standard, the finished product needs to be leveled, such as polished.
Example two
Referring to fig. 7, an overall structure of the temperature sensing wide-field probe to be manufactured in this embodiment is similar to that of the temperature sensing wide-field probe in the first embodiment, except that an antireflection film is disposed on an illumination surface of the substrate 11, which can effectively improve light transmittance of the substrate 11 and reduce reflected light; the reflective heat insulation coating layer is arranged on the particle surface, and can reflect the trigger light which does not act on the diamond particles 12, namely, the trigger light is reduced to irradiate the chip, the temperature rise effect of the trigger light on the chip is reduced, and the temperature on the surface of the chip can be accurately measured;
based on the design of the antireflection film and the reflective heat-insulating coating layer, the manufacturing method in the embodiment further comprises the following steps:
a. after the substrate 11 is taken out after demoulding, arranging an antireflection film on the upper side surface of the substrate 11 by a sputtering method, and spraying a reflective heat-insulating coating on the lower side surface;
b. after the reflective thermal insulation coating layer is disposed on the lower side of the substrate 11, the polishing platform 5 (which may also be a hard paper board wiper) is used to wipe off the lower side of the substrate 11, so that the reflective thermal insulation coating on the probing end of the diamond particles 12 is wiped off (as shown in fig. 8).
EXAMPLE III
Referring to fig. 9, a temperature sensing wide-field probe to be manufactured in the third embodiment is similar to the temperature sensing wide-field probe in the second embodiment in the overall structure, except that a protrusion is formed around each diamond particle 12 to wrap the diamond particle 12 (trigger light enters the substrate 11, part of the trigger light directly irradiates the diamond particle 12, and part of the trigger light irradiates an inclined plane of the protrusion around the diamond particle 12, and after being reflected, the trigger light can irradiate the diamond particle 12, so that the utilization rate of the trigger light is improved);
based on the design of the convex structure, when the temperature sensing wide-field probe is manufactured, the diamond particle positioning groove 21 is manufactured into a circular table shape, the included angle alpha between the generatrix of the circular table and the bottom surface is about 45 degrees (see the attached figure 10), the groove bottom of the diamond particle positioning groove 21 is a narrow surface, and the groove opening is a wide surface; in the manufacturing process, the size of the selected diamond particles 12 is slightly smaller than the size of the narrow surface of the circular truncated cone, the diamond particles 12 are placed in the middle of the diamond particle positioning groove 21, and the raw material of the substrate can be automatically filled around the diamond particles to form a bulge.
Example four
Referring to fig. 11, a temperature sensing wide-field probe to be manufactured in the fourth embodiment has a similar overall structure to that of the temperature sensing wide-field probe in the first embodiment, except that the diamond particles 12 are micron-sized powder particles, and since the diamond particles 12 are extremely small, a large number of diamond particles 12 may be on the particle surface of the substrate 11, which improves the sensitivity of temperature sensing.
Referring to fig. 12, for the above differences, this example provides a method for fabricating a wide-field probe for temperature sensing as described above:
s1, manufacturing a forming die:
specifically, a mold 2 is manufactured according to the requirement of the overall dimension of the temperature sensing wide-field probe (in this example, because the diamond particles are extremely small and numerous, the diamond particle positioning grooves 21 are not arranged any more);
s2, paving diamond particles containing NV color centers in a forming die:
specifically, a certain amount of diamond particles 12 with the size of 50-100 microns are taken and poured into ethanol, the diamond particles 12 in the ethanol are uniformly distributed through stirring, vibration and other technologies, and then a certain amount of the solution is poured into the mold 2 (a thin layer is formed and covers the bottom surface of the mold 2); after the ethanol naturally volatilizes, the diamond particles 12 are uniformly distributed in the die 2;
s3, adding the substrate raw material in the initial fluid state into a molding die so that the substrate raw material covers the diamond particles:
firstly, a mesh screen cylinder 6 with the size corresponding to the inner cavity of a forming die is manufactured, and a piston plate 7 is manufactured in a matching way;
the mesh screen cylinder 6 is then moved into the mould 2 to a position close above the diamond particles 12;
finally, a certain amount of a fluid base material (a mixture of liquid epoxy resin and a curing agent) is poured onto the mesh screen cylinder 6, and the base material is pressed by moving the piston plate 7 so as to slowly penetrate through the mesh holes of the mesh screen cylinder 6 and cover the diamond particles 12 in the molding die.
The mesh screen cylinder 6 can reduce the speed of the mixed liquid, and can ensure that the mixed liquid has uniform impact on the diamond particles 12, thereby effectively ensuring the uniformity of the distribution of the diamond particles 62;
a flat plate 4 is used for pressing the top surface of the mixed liquid, so that the top surface of the substrate 11 is leveled on one hand, and the mixture is in closer contact with the diamond particles 12 on the other hand, and the mixture is not easy to fall off in the later period;
s4, solidifying the raw material of the substrate to form a solid substrate, and embedding the diamond particles into the lower side surface of the substrate: the epoxy will cure over time (complete curing at room temperature for 1-2 days), with the diamond particles 12 embedded in one side of the solid epoxy;
and S5, removing the substrate and the diamond particles from the forming die after demolding.
The processing methods of the flatness, antireflection coating and reflective insulation coating in this embodiment are the same as those described above, and are not described herein again.
In this embodiment, no protrusion is provided around the diamond particles.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise forms disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (10)
1. A method for manufacturing a temperature sensing wide-field probe is characterized by comprising the following steps:
s1, manufacturing a forming die;
s2, paving diamond particles containing NV color centers in a forming die;
s3, adding the substrate raw material in the initial fluid state into a forming die to cover the diamond particles;
s4, solidifying the raw material of the substrate to form a solid substrate, and embedding the diamond particles into the lower side surface of the substrate;
and S5, removing the substrate and the diamond particles from the forming die after demoulding.
2. The method of manufacturing according to claim 1, wherein: and after the substrate is taken out after demoulding, arranging an antireflection film on the upper side surface of the substrate, and arranging a reflective heat-insulating coating layer on the lower side surface of the substrate.
3. The method of manufacturing according to claim 2, wherein: after the reflective heat-insulating coating layer is arranged on the lower side surface of the substrate, the lower side surface of the substrate is wiped by using a grinding platform, so that the reflective heat-insulating coating on the diamond particle detection end is erased.
4. The method of manufacturing according to claim 1, wherein: the bottom surface of the inner cavity of the forming die is uniformly distributed with diamond particle positioning grooves, the bottom surfaces of all the diamond particle positioning grooves approach to the same horizontal plane, and the error is not more than 0.1 mm.
5. The method of manufacturing according to claim 4, wherein: the diamond particle positioning groove is in a circular table shape, an included angle between a generatrix of the circular table and the bottom surface is 30-70 degrees, the bottom of the diamond particle positioning groove is a narrow surface, and a notch is a wide surface.
6. The method of manufacturing according to claim 1, wherein: the flatness of the bottom surface of the inner cavity of the forming die is not more than 0.1 mm.
7. The production method according to any one of claims 1 or 2, characterized in that: before the substrate raw material is solidified, impurities or bubbles in the substrate raw material are removed, and then the top surface of the substrate raw material is pressed by a flat plate to be flat.
8. The manufacturing method according to any one of claims 1 or 2, characterized in that: the substrate is glass, organic glass or epoxy resin.
9. The production method according to any one of claims 1 or 2, characterized in that: the specific process of step S2 is as follows:
firstly, pouring a certain amount of diamond particles containing NV color centers into an ethanol solution, and uniformly distributing the diamond particles in the ethanol by stirring or shaking or combination of the stirring and the shaking;
then, pouring a certain amount of the solution into a forming mold to cover the bottom surface of the mold cavity;
finally, after the ethanol is naturally volatilized, the diamond particles are uniformly distributed in the forming die.
10. The manufacturing method according to any one of claims 1 or 2, characterized in that: the specific process of step S3 is as follows:
firstly, a mesh screen cylinder with the size corresponding to the inner cavity of a forming die is manufactured, and a piston plate is manufactured in a matching way;
then, moving the mesh screen cylinder to a position close to the upper part of the diamond particles in the forming die;
finally, a certain amount of fluid base plate raw material is poured on the mesh screen cylinder, and the base plate raw material is pressed by moving the piston plate, so that the base plate raw material slowly penetrates through meshes on the mesh screen cylinder and covers diamond particles in the forming die.
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