CN203365205U - Slice mold for PCB (printed circuit board) - Google Patents
Slice mold for PCB (printed circuit board) Download PDFInfo
- Publication number
- CN203365205U CN203365205U CN 201320503673 CN201320503673U CN203365205U CN 203365205 U CN203365205 U CN 203365205U CN 201320503673 CN201320503673 CN 201320503673 CN 201320503673 U CN201320503673 U CN 201320503673U CN 203365205 U CN203365205 U CN 203365205U
- Authority
- CN
- China
- Prior art keywords
- foil layer
- pvc plastic
- plastic pipe
- pcb
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model discloses a slice mold for a PCB, and belongs to the technical field of PCB slice molds. The slice mold is technically characterized by comprising a base plate, wherein a plurality of rubber mats are distributed at the bottom of the base plate, the upper surface of the base plate is covered with an adhesive copper foil layer or an aluminum foil layer, and PVC (polyvinyl chloride) plastic pipes are arranged on the upper surface of the adhesive copper foil layer or the aluminum foil layer; and the bottom end surfaces of the PVC plastic pipes are tightly contacted with the adhesive copper foil layer or the aluminum foil layer. The provided slice mold for the PCB is simple in structure, convenient to use, low in manufacturing cost and easy to demold, and is used for manufacturing PCB slices in the PCB industry.
Description
Technical field
The utility model relates to a kind of wafer cutting die, more particularly, relates in particular to a kind of used for printed circuit board wafer cutting die that customizes section.
Background technology
At the printed circuit board industry, PCB producer can provide various section samples to the client according to client's demand, for observing wiring board coating situation and assessment product quality etc.This type of section sample is that the section of fetching from circuit board is wrapped up with polyester resin, polyester resin first adds appropriate catalyzer and hardening agent to stir, after after a while, polyester resin will solidify, form transparent right cylinder after the demoulding, section is sealed in right cylinder inside, has formed the section sample.In actual manufacturing process, need customization, buy special-purpose mould, in prior art, be to adopt common silica gel mould to make mostly.This kind of silica gel mould cost is higher, complicated operation, be difficult for the demoulding, when running into the microsection manufacture of different size requirement, needs customization, buys a plurality of moulds, sometimes can not meet immediately the needs of making; Because the pliability of silica gel is larger, the model of working it out easily is out of shape, and out-of-flatness causes section to grind difficulty.
The utility model content
The purpose of this utility model is for above-mentioned the deficiencies in the prior art, and a kind of simple in structure, easy to use, low cost of manufacture and the easy used for printed circuit board wafer cutting die of the demoulding are provided.
The technical solution of the utility model is achieved in that a kind of used for printed circuit board wafer cutting die, comprise backing plate, wherein said backing plate bottom is distributed with some rubber cushions, at the backing plate upper surface, is coated with gum copper foil layer or aluminium foil layer, at gum copper foil layer or aluminium foil layer upper surface, is provided with the PVC plastic pipe; The bottom end face of described PVC plastic pipe and gum copper foil layer or aluminium foil layer close contact.
In above-mentioned used for printed circuit board wafer cutting die, the inwall of described PVC plastic pipe is provided with separation layer; Further, described separation layer is that oil substances spreads upon the oil layer that PVC plastic pipe inwall forms.
In above-mentioned used for printed circuit board wafer cutting die, the height of described PVC plastic pipe is 2.5～5.0 centimetres, and external diameter is 2.8～4.0 centimetres, and internal diameter is 2.5～3.7 centimetres.
After the utility model adopts said structure, by the PVC plastic pipe, in conjunction with the backing plate that is coated with gum copper foil layer or aluminium foil layer, in the PVC plastic pipe, separation layer is set, very effectively completed the making of section, and the demoulding is very convenient simultaneously.The utility model compared with prior art, has advantages of following:
(1) can, according to specific requirement select the to adapt PVC plastic pipe of specification, produce simply, rapidly mould, low cost of manufacture;
(2) the section model of making, shapeliness, not yielding;
(3) making and the demoulding are all very easy, quick, high efficiency.
The accompanying drawing explanation
Below in conjunction with the embodiment in accompanying drawing, the utility model is described in further detail, but do not form any restriction of the present utility model.
Fig. 1 is structural representation of the present utility model;
In figure: backing plate 1, rubber cushion 2, gum copper foil layer or aluminium foil layer 3, PVC plastic pipe 4, separation layer 5.
Embodiment
Consult shown in Fig. 1, a kind of used for printed circuit board wafer cutting die of the present utility model, comprise backing plate 1, and backing plate 1 can adopt the substrate material of scrapping to be made; 30 centimetres of backing plate 1 length, wide 20 centimetres, thick 1.6 millimeters; Be distributed with some rubber cushions 2 in backing plate 1 bottom, the rubber cushion 2 in the present embodiment is arranged on four angles of backing plate 1 bottom.Be coated with gum copper foil layer or aluminium foil layer 3 at backing plate 1 upper surface, gum copper foil layer or aluminium foil layer 3 belong to inhomogeneous material with polyester resin, and therefore the expansion coefficient difference easily separates; Be provided with PVC plastic pipe 4 at gum copper foil layer or aluminium foil layer 3 upper surfaces, the height of PVC plastic pipe 4 is 2.5～5.0 centimetres, and external diameter is 2.8～4.0 centimetres, and internal diameter is 2.5～3.7 centimetres.Can according to actual needs, arrange some PVC plastic pipes 4 diversified in specifications on backing plate 1 simultaneously; PVC plastic pipe 4 use sanders polish flat the mouth of pipe at two ends, make bottom end face and gum copper foil layer or aluminium foil layer 3 close contacts of PVC plastic pipe 4, guarantee that polyester resin is difficult for producing distortion when adding, and can not overflow from bottom.
Further, more convenient for making the demoulding, be provided with separation layer 5 at the inwall of PVC plastic pipe 4; Separation layer described in the present embodiment is that oil substances spreads upon the oil layer that PVC plastic pipe 4 inwalls form.
During the section sample making, at first on smooth table top, put backing plate 1 well, guarantee that the flatness of backing plate 1 is less than 0.5 millimeter; Secondly, for convenience of the demoulding, evenly smear appropriate oil substances at PVC plastic pipe 4 inwalls, and PVC plastic pipe 4 is placed on to corresponding position, then the section of required grinding is fixed in to the inner bottom part middle position of PVC plastic pipe 4; Then by the polyester resin (containing catalyzer and hardening agent) modulated, be poured into successively in the PVC plastic pipe 4 placed, at room temperature standing 10～20 minutes, pick up PVC sebific duct 4, firmly touch out the crystal colloid by bottom, ground by certain requirement after the section demoulding, can be obtained the section sample of moulding.
Above-described embodiment is preferably embodiment of the utility model; but embodiment of the present utility model is not restricted to the described embodiments; and other any do not deviate from change, the modification done under Spirit Essence of the present utility model and principle, substitutes, combination, simplify; all should be equivalent substitute mode, within being included in protection domain of the present utility model.
Claims (4)
1. a used for printed circuit board wafer cutting die, comprise backing plate (1), it is characterized in that, described backing plate (1) bottom is distributed with some rubber cushions (2), be coated with gum copper foil layer or aluminium foil layer (3) at backing plate (1) upper surface, at gum copper foil layer or aluminium foil layer (3) upper surface, be provided with PVC plastic pipe (4); The bottom end face of described PVC plastic pipe (4) and gum copper foil layer or aluminium foil layer (3) close contact.
2. used for printed circuit board wafer cutting die according to claim 1, is characterized in that, the inwall of described PVC plastic pipe (4) is provided with separation layer (5).
3. used for printed circuit board wafer cutting die according to claim 2, is characterized in that, described separation layer is that oil substances spreads upon the oil layer that PVC plastic pipe (4) inwall forms.
4. used for printed circuit board wafer cutting die according to claim 1, is characterized in that, the height of described PVC plastic pipe (4) is 2.5～5.0 centimetres, and external diameter is 2.8～4.0 centimetres, and internal diameter is 2.5～3.7 centimetres.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320503673 CN203365205U (en) | 2013-08-16 | 2013-08-16 | Slice mold for PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320503673 CN203365205U (en) | 2013-08-16 | 2013-08-16 | Slice mold for PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203365205U true CN203365205U (en) | 2013-12-25 |
Family
ID=49812951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320503673 Expired - Fee Related CN203365205U (en) | 2013-08-16 | 2013-08-16 | Slice mold for PCB (printed circuit board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203365205U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105321734A (en) * | 2014-07-28 | 2016-02-10 | 黄武 | Production method of micro part slice |
| CN105437423A (en) * | 2014-09-25 | 2016-03-30 | 黄武 | Slicing mold and slicing method adopting same |
-
2013
- 2013-08-16 CN CN 201320503673 patent/CN203365205U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105321734A (en) * | 2014-07-28 | 2016-02-10 | 黄武 | Production method of micro part slice |
| CN105437423A (en) * | 2014-09-25 | 2016-03-30 | 黄武 | Slicing mold and slicing method adopting same |
| CN105437423B (en) * | 2014-09-25 | 2017-12-12 | 黄武 | A kind of wafer cutting die and the dicing method using the wafer cutting die |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104955278B (en) | A kind of method that three-dimensional circuit is manufactured on moulding surface | |
| CN102203927B (en) | Method for device plastic packaging and packaging structure | |
| JP2014110333A5 (en) | Manufacturing method of LED device | |
| CN206109195U (en) | Curved graphite three -plate mold utensil of 3D heat | |
| CN203365205U (en) | Slice mold for PCB (printed circuit board) | |
| CN108140623A (en) | A kind of fingerprint recognition module and preparation method thereof | |
| CN203679185U (en) | Vibrating workbench | |
| CN103737762B (en) | A kind of manufacture method of decorative pattern copy mold electroforming core | |
| CN103252957A (en) | Carbon fiber housing with three-dimensional surface textures and producing method thereof | |
| CN104241144A (en) | Chip plastic package structure manufacturing method | |
| CN202462712U (en) | Die attached with die cushion | |
| CN105128372B (en) | Preparation method for composite polymer film with high thermal conductivity | |
| CN106611655A (en) | Special forming mold for circular tantalum core of tantalum capacitor and using method thereof | |
| CN211942188U (en) | Simple flexible pressure equalizing pad for hot press molding of composite material and molding device | |
| CN107167020A (en) | Integrated radiating piece, manufacture mould and its manufacture method | |
| CN202572717U (en) | Forming mould used for light guide plate of mobile phone | |
| CN107978567B (en) | Three-dimensional ceramic substrate and preparation method thereof | |
| CN207930880U (en) | A kind of silicon nitride ceramics molding machine being easy to demoulding | |
| CN202842301U (en) | Plane shaping mould for food | |
| CN106378385A (en) | Tantalum capacitor square tantalum core specific molding die and use method of same | |
| CN203254562U (en) | Anticorrosion compression mold | |
| CN205185441U (en) | Stone module | |
| CN214936993U (en) | Large-size curved glass forming device | |
| CN202137276U (en) | An evaporator pipeline forming die | |
| CN216187664U (en) | A high-efficient protection turnover device for having enough to meet need in-process electronic product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131225 Termination date: 20210816 |