CN114988858A - 一种密缝连纹低膨胀系数地暖瓷砖坯体及其制备方法 - Google Patents
一种密缝连纹低膨胀系数地暖瓷砖坯体及其制备方法 Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 52
- 238000010438 heat treatment Methods 0.000 title claims abstract description 34
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 239000000843 powder Substances 0.000 claims abstract description 59
- 229910052744 lithium Inorganic materials 0.000 claims abstract description 32
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims abstract description 30
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000004927 clay Substances 0.000 claims abstract description 14
- 239000010453 quartz Substances 0.000 claims abstract description 12
- 239000010433 feldspar Substances 0.000 claims abstract description 11
- 229910052500 inorganic mineral Inorganic materials 0.000 claims abstract description 10
- 239000011707 mineral Substances 0.000 claims abstract description 10
- 150000003839 salts Chemical class 0.000 claims abstract description 10
- 238000005245 sintering Methods 0.000 claims description 24
- 239000002002 slurry Substances 0.000 claims description 19
- 238000003825 pressing Methods 0.000 claims description 14
- 239000002994 raw material Substances 0.000 claims description 12
- 238000000498 ball milling Methods 0.000 claims description 11
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 claims description 10
- 229910052642 spodumene Inorganic materials 0.000 claims description 10
- 229910001570 bauxite Inorganic materials 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 8
- 238000005469 granulation Methods 0.000 claims description 8
- 230000003179 granulation Effects 0.000 claims description 8
- 238000007641 inkjet printing Methods 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 8
- 238000005498 polishing Methods 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 8
- 239000007921 spray Substances 0.000 claims description 8
- FUJCRWPEOMXPAD-UHFFFAOYSA-N Li2O Inorganic materials [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 claims description 7
- NWXHSRDXUJENGJ-UHFFFAOYSA-N calcium;magnesium;dioxido(oxo)silane Chemical compound [Mg+2].[Ca+2].[O-][Si]([O-])=O.[O-][Si]([O-])=O NWXHSRDXUJENGJ-UHFFFAOYSA-N 0.000 claims description 7
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 claims description 7
- 229910052637 diopside Inorganic materials 0.000 claims description 7
- 239000010456 wollastonite Substances 0.000 claims description 7
- 229910052882 wollastonite Inorganic materials 0.000 claims description 7
- HEHRHMRHPUNLIR-UHFFFAOYSA-N aluminum;hydroxy-[hydroxy(oxo)silyl]oxy-oxosilane;lithium Chemical compound [Li].[Al].O[Si](=O)O[Si](O)=O.O[Si](=O)O[Si](O)=O HEHRHMRHPUNLIR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052670 petalite Inorganic materials 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 3
- 229940094522 laponite Drugs 0.000 claims description 2
- XCOBTUNSZUJCDH-UHFFFAOYSA-B lithium magnesium sodium silicate Chemical compound [Li+].[Li+].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Na+].[Na+].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3 XCOBTUNSZUJCDH-UHFFFAOYSA-B 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 2
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims 1
- 229910052681 coesite Inorganic materials 0.000 claims 1
- 229910052593 corundum Inorganic materials 0.000 claims 1
- 229910052906 cristobalite Inorganic materials 0.000 claims 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 229910052682 stishovite Inorganic materials 0.000 claims 1
- 229910052905 tridymite Inorganic materials 0.000 claims 1
- 229910001845 yogo sapphire Inorganic materials 0.000 claims 1
- 229910004298 SiO 2 Inorganic materials 0.000 abstract description 8
- 229910010413 TiO 2 Inorganic materials 0.000 abstract description 8
- 229910052708 sodium Inorganic materials 0.000 abstract description 8
- BYFGZMCJNACEKR-UHFFFAOYSA-N aluminium(i) oxide Chemical compound [Al]O[Al] BYFGZMCJNACEKR-UHFFFAOYSA-N 0.000 abstract 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 7
- 239000002585 base Substances 0.000 description 7
- 239000011449 brick Substances 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010304 firing Methods 0.000 description 6
- 235000010755 mineral Nutrition 0.000 description 6
- 238000009740 moulding (composite fabrication) Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229940072033 potash Drugs 0.000 description 3
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 3
- 235000015320 potassium carbonate Nutrition 0.000 description 3
- 238000009827 uniform distribution Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052656 albite Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052863 mullite Inorganic materials 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 description 1
- 229910000271 hectorite Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明涉及陶瓷砖领域,具体而言,涉及一种密缝连纹低膨胀系数地暖瓷砖坯体及其制备方法。本发明所述坯体包括如下质量份数的组分:长石18~26份,石英11~18份,粘土10~17份,矿物盐11~17份,高铝土4~9份,含锂陶瓷粉料17~43份;所述含锂陶瓷粉料包括如下质量百分比的组成:SiO2:73~79%,Al2O3:10~14%,Fe2O3:0.05~0.20%,TiO2:0~0.03%,CaO:0.4~0.8%,MgO:0.01~0.03%,K2O:3~6%,Na2O:2~5%,Li2O:0~4%。本发明用于降低地暖瓷砖的膨胀系数,提高地暖瓷砖的性能。
Description
技术领域
本发明涉及陶瓷砖领域,特别涉及一种密缝连纹低膨胀系数地暖瓷砖坯体及其制备方法。
背景技术
地暖瓷砖是一种专门为铺设地暖的家庭设计的,区别于普通的瓷砖,地暖瓷砖能够更好的承受地暖长时间加热而膨胀现象,但是,目前地暖瓷砖的生产工艺存在较多差异,在一些北方地区,由于温差较大,普通的地暖瓷砖不能够承受地暖加热造成的温差变化,仍会出现瓷砖之间相互“拥挤”,造成崩边、崩角、翘起等问题,大大影响了人们的日常生活。
发明内容
本发明的主要目的在于提供一种密缝连纹低膨胀系数地暖瓷砖坯体及其制备方法,用于降低地暖瓷砖的膨胀系数,提高地暖瓷砖的性能。
为实现上述目的,本发明采取的技术方案为:
一种密缝连纹低膨胀系数地暖瓷砖坯体,所述坯体包括如下质量份数的组分:
长石18~26份,石英11~18份,粘土10~17份,矿物盐11~17份,高铝土4~9份,含锂陶瓷粉料17~43份;
所述含锂陶瓷粉料包括如下质量百分比的组成:
SiO2:73~79%,Al2O3:10~14%,Fe2O3:0.05~0.20%,TiO2:0~0.03%,CaO:0.4~0.8%,MgO :0.01~0.03%,K2O:3~6%,Na2O:2~5%,Li2O:0~4%。优选地,所述坯体包括如下质量份数的组分:
长石20~25份,石英12~16份,粘土12~16份,矿物盐12~16份,高铝土6~8份,含锂陶瓷粉料20~40份。
优选地,所述高铝土为铝矾土或煅烧铝矾土其中至少一种。
优选地,所述矿物盐为硅灰石或透辉石其中至少一种。
优选地,所述陶瓷粉料至少包含锂辉石、透锂长石、锂瓷石其中一种。
优选地,包括以下步骤:
1)对坯体原料进行球磨15-18小时,获得坯浆,坯浆细度为0.5~0.6%。
2)对坯浆进行喷雾造粒,获得坯体粉料;
3)对坯体粉料进行压制成型,获得坯体。成型坯体平整度误差在±0.3mm,厚度误差在±0.1mm。
在压机阶段严格控制压机冲压次数和压力,确保砖坯平整度误差在±0.3mm(传统误差±0.75mm),厚度误差±0.1mm(传统误差±0.3mm),确保粉料分布均匀一致,坯体致密度一致,减少烧成后大小头、变形等缺陷。
4)干燥;
5)布施底釉、喷墨打印图案、布施保护釉和抛釉;
6)入窑烧成。烧成温度为1150~1220度,烧成周期为80~90分钟;
通过上述步骤,所得坯体热膨胀系数为44~52×10-7/K。
优选地,所述坯浆细度为0.5~0.6%。
优选地,在压制成型的步骤中,所述坯体平整度误差在±0.3mm,厚度误差在±0.1mm。
优选地,所述坯体层热膨胀系数为44~52×10-7/K。
与现有技术相比,本发明具有如下有益效果:
本发明通过在地暖瓷砖的坯体原料配方中引进含锂陶瓷粉料,并通过对配方配比调整,适度提高粘土、铝矾土等配比,确保配方中的铝含量提高,使得坯体热膨胀系数急速降低,坯体更加致密,强度提高,吸水率控制在0.03%以下,解决产品后期物理反应,大大降低了后期吸湿膨胀,防止二次变形。
具体实施方式
下面将结合实施例对本发明的实施方案进行详细描述,但是本领域技术人员将会理解,下列实施例仅用于说明本发明,而不应视为限制本发明的范围。实施例中未注明具体条件者,按照常规条件或制造商建议的条件进行。所用试剂或仪器未注明生产厂商者,均为可以通过市购获得的常规产品。
本发明的密缝连纹低膨胀系数地暖瓷砖坯体,所述坯体包括如下质量份数的组分:
长石18~26份,石英11~18份,粘土10~17份,矿物盐11~17份,高铝土4~9份,含锂陶瓷粉料17~43份;
所述含锂陶瓷粉料包括如下质量百分比的组成:
SiO2:73~79%,Al2O3:10~14%,Fe2O3:0.05~0.20%,TiO2:0~0.03%,CaO:0.4~0.8%,MgO :0.01~0.03%,K2O:3~6%,Na2O:2~5%,Li2O:0~4%。
所述坯体包括如下质量份数的组分:
长石20~25份,石英12~16份,粘土12~16份,矿物盐12~16份,高铝土6~8份,含锂陶瓷粉料20~40份。
对坯体配方引进一种含锂陶瓷粉料,并对坯料配方进行适当调整;确保配方铝含量同时,可降低坯体热膨胀系数30%,强度提高3倍。
所述高铝土为铝矾土或煅烧铝矾土其中至少一种。
所述矿物盐为硅灰石或透辉石其中至少一种。
所述陶瓷粉料至少包含锂辉石、锂长石、锂瓷石其中一种。
通过引进20~40%含锂陶瓷粉料,并通过对配方配比调整,适度提高粘土、铝矾土等配比,确保配方中的铝含量提高。本发明配方调整后,通过氧化硅在高温下与氧化铝结合产生更多的莫来石晶体,部分的氧化硅与碱性金属氧化物在高温下产生玻璃相,一部分的锂辉石与游离硅结合形成锂辉石固溶体,最终得到烧结物主要成分为低膨胀系数的莫来石、玻璃晶相和锂辉石固溶体;坯体热膨胀系数急速降低,坯体更加致密,强度提高。
本发明制造过程包括以下步骤:
1)对坯体原料进行球磨,获得坯浆,所述原料球磨时间为15~18小时。
所述坯体粉料细度为0.5~0.6%。
2)对坯浆进行喷雾造粒,获得坯体粉料;
3)对坯体粉料进行压制成型,获得坯体。
对原料球磨15~18小时(传统10~13小时),通过延长球磨时间让粉料细度达到0.5~0.6%(传统0.8~1.2%)。粉料细度越细,有利于粉料堆积,增加坯体致密度,有利于提高烧结度,减少二次变形。
在压制成型的步骤中,所述坯体平整度误差在±0.3mm,厚度误差在±0.1mm。
在压机阶段严格控制压机冲压次数和压力,确保砖坯平整度误差在±0.3mm(传统误差±0.75mm),厚度误差±0.1mm(传统误差±0.3mm),确保粉料分布均匀一致,坯体致密度一致,减少烧成后大小头、变形等缺陷。
4)干燥压制成型后坯体;
5)布施底釉、喷墨打印图案、布施保护釉和抛釉;
6)入窑烧成。烧成温度为1150~1220度,烧成周期为80~90分钟;
所述坯体层热膨胀系数为44~52×10-7。
下面将结合具体的实施例和对比例对本发明作进一步的解释说明。
实施例1
密缝连纹低膨胀系数地暖瓷砖坯体,所述坯体包括如下质量份数的组分:
钾钠长石18份,石英12份,粘土16份,硅灰石11份,高铝土8份,含锂陶瓷粉料35份;
所述含锂陶瓷粉料包括如下质量百分比的组成:
SiO2:73%,Al2O3:13%,Fe2O3:0.20%,TiO2:0.03%,CaO:3.8%,MgO :0.03%,K2O:5%,Na2O:3.44%,Li2O:1.5%。
其中采用透锂长石引入锂。
生产过程步骤为:
1)对坯体原料进行球磨16小时,获得坯浆,坯体粉料细度为0.56%。
2)对坯浆进行喷雾造粒,获得坯体粉料;
3)对坯体粉料进行压制成型,获得坯体。成型坯体平整度误差在±0.3mm,厚度误差在±0.1mm。
在压机阶段严格控制压机冲压次数和压力,确保砖坯平整度误差在±0.3mm(传统误差±0.75mm),厚度误差±0.1mm(传统误差±0.3mm),确保粉料分布均匀一致,坯体致密度一致,减少烧成后大小头、变形等缺陷。
4)干燥压制成型后坯体;
5)布施底釉、喷墨打印图案、布施保护釉和抛釉;
6)入窑烧成。烧成温度为1195度,烧成周期为82分钟;
通过上述步骤,所得坯体热膨胀系数为48×10-7。
实施例2:
密缝连纹低膨胀系数地暖瓷砖坯体,所述坯体包括如下质量份数的组分:
钾钠长石22份,石英12份,粘土16份,透辉石11份,高铝土9份,含锂陶瓷粉料30份;
所述含锂陶瓷粉料包括如下质量百分比的组成:
SiO2:73.34%,Al2O3:13%,Fe2O3:0.20%,TiO2:0.03%,CaO:0.8%,MgO :2.03%,K2O:5.5%,Na2O:3.8%,Li2O:1.3%。
其中采用锂辉石引入锂。
生产过程步骤为:
1)对坯体原料进行球磨16小时,获得坯浆,坯体粉料细度为0.53%。
2)对坯浆进行喷雾造粒,获得坯体粉料;
3)对坯体粉料进行压制成型,获得坯体。成型坯体平整度误差在±0.3mm,厚度误差在±0.1mm。
在压机阶段严格控制压机冲压次数和压力,确保砖坯平整度误差在±0.3mm(传统误差±0.75mm),厚度误差±0.1mm(传统误差±0.3mm),确保粉料分布均匀一致,坯体致密度一致,减少烧成后大小头、变形等缺陷。
4)干燥压制成型后坯体;
5)布施底釉、喷墨打印图案、布施保护釉和抛釉;
6)入窑烧成。烧成温度为1200度,烧成周期为83分钟;
通过上述步骤,所得坯体热膨胀系数为51×10-7。
实施例3:
密缝连纹低膨胀系数地暖瓷砖坯体,所述坯体包括如下质量份数的组分:
钾钠长石18份,石英12份,粘土16份,硅灰石5份,透辉石6,高铝土4份,含锂陶瓷粉料39份;
所述含锂陶瓷粉料包括如下质量百分比的组成:
SiO2:73%,Al2O3:12%,Fe2O3:0.20%,TiO2:0.03%,CaO:1.8%,MgO :1.03%,K2O:5.8%,Na2O:3.44%,Li2O:1.7%。
其中采用锂辉石和透锂长石引入锂。
生产过程步骤为:
1)对坯体原料进行球磨17小时,获得坯浆,坯体粉料细度为0.58%。
2)对坯浆进行喷雾造粒,获得坯体粉料;
3)对坯体粉料进行压制成型,获得坯体。成型坯体平整度误差在±0.3mm,厚度误差在±0.1mm。
在压机阶段严格控制压机冲压次数和压力,确保砖坯平整度误差在±0.3mm(传统误差±0.75mm),厚度误差±0.1mm(传统误差±0.3mm),确保粉料分布均匀一致,坯体致密度一致,减少烧成后大小头、变形等缺陷。
4)干燥压制成型后坯体;
5)布施底釉、喷墨打印图案、布施保护釉和抛釉;
6)入窑烧成。烧成温度为1180度,烧成周期为85分钟;
通过上述步骤,所得坯体热膨胀系数为45×10-7。
实施例4:
密缝连纹低膨胀系数地暖瓷砖坯体,所述坯体包括如下质量份数的组分:
钾钠长石26份,石英12份,粘土16份,硅灰石5份,透辉石6,高铝土4份,含锂陶瓷粉料31份;
所述含锂陶瓷粉料包括如下质量百分比的组成:
SiO2:73%,Al2O3:12%,Fe2O3:0.20%,TiO2:0.03%,CaO:2.2%,MgO :1.03%,K2O:5.8%,Na2O:3.24%,Li2O:1.5%。
其中采用锂辉石和透锂长石引入锂。
生产过程步骤为:
1)对坯体原料进行球磨18小时,获得坯浆,坯体粉料细度为0.5%。
2)对坯浆进行喷雾造粒,获得坯体粉料;
3)对坯体粉料进行压制成型,获得坯体。成型坯体平整度误差在±0.3mm,厚度误差在±0.1mm。
在压机阶段严格控制压机冲压次数和压力,确保砖坯平整度误差在±0.3mm(传统误差±0.75mm),厚度误差±0.1mm(传统误差±0.3mm),确保粉料分布均匀一致,坯体致密度一致,减少烧成后大小头、变形等缺陷。
4)干燥压制成型后坯体;
5)布施底釉、喷墨打印图案、布施保护釉和抛釉;
6)入窑烧成。烧成温度为1150度,烧成周期为80分钟;
通过上述步骤,所得坯体热膨胀系数为52×10-7。
实施例5:
密缝连纹低膨胀系数地暖瓷砖坯体,所述坯体包括如下质量份数的组分:
钾钠长石18份,石英12份,粘土16份,硅灰石5份,透辉石6,高铝土8份,含锂陶瓷粉料35份;
所述含锂陶瓷粉料包括如下质量百分比的组成:
SiO2:73%,Al2O3:13.5%,Fe2O3:0.20%,TiO2:0.03%,CaO:1.8%,MgO :1.03%,K2O:4.3%,Na2O:3.44%,Li2O:1.7%。
其中采用锂辉石和透锂长石引入锂。
生产过程步骤为:
1)对坯体原料进行球磨15小时,获得坯浆,坯体粉料细度为0.6%。
2)对坯浆进行喷雾造粒,获得坯体粉料;
3)对坯体粉料进行压制成型,获得坯体。成型坯体平整度误差在±0.3mm,厚度误差在±0.1mm。
在压机阶段严格控制压机冲压次数和压力,确保砖坯平整度误差在±0.3mm(传统误差±0.75mm),厚度误差±0.1mm(传统误差±0.3mm),确保粉料分布均匀一致,坯体致密度一致,减少烧成后大小头、变形等缺陷。
4)干燥压制成型后坯体;
5)布施底釉、喷墨打印图案、布施保护釉和抛釉;
6)入窑烧成。烧成温度为1170度,烧成周期为86分钟;
通过上述步骤,所得坯体热膨胀系数为49×10-7。
最后应说明的是:以上各实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述各实施例对本发明进行了详细的说明,但本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。
以上显示和描述了本发明的基本原理和主要特征和本发明的优点。本行业的技术人员应该了解,本发明不受上述实施例的限制,上述实施例和说明书中描述的只是说明本发明的原理,在不脱离本发明精神和范围的前提下,本发明还会有各种变化和改进,这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。
Claims (10)
1.一种密缝连纹低膨胀系数地暖瓷砖坯体,其特征在于,所述坯体包括如下质量份数的组分:
长石18~26份,石英11~18份,粘土10~17份,矿物盐11~17份,高铝土4~9份,含锂陶瓷粉料17~43份;
所述含锂陶瓷粉料包括如下质量百分比的组成:
SiO2:73~79%,Al2O3:10~14%,Fe2O3:0.05~0.20%,TiO2:0~0.03%,CaO:0.4~0.8%,MgO :0.01~0.03%,K2O:3~6%,Na2O:2~5%,Li2O:0~4%。
2.根据权利要求1所述的密缝连纹低膨胀系数地暖瓷砖坯体,其特征在于,所述坯体包括如下质量份数的组分:
长石20~25份,石英12~16份,粘土12~16份,矿物盐12~16份,高铝土6~8份,含锂陶瓷粉料20~40份。
3.根据权利要求2所述的密缝连纹低膨胀系数地暖瓷砖坯体,其特征在于,所述高铝土为铝矾土或煅烧铝矾土其中至少一种。
4.根据权利要求2所述的密缝连纹低膨胀系数地暖瓷砖坯体,其特征在于,所述矿物盐为硅灰石或透辉石其中至少一种。
5.根据权利要求2所述的密缝连纹低膨胀系数地暖瓷砖坯体,其特征在于,所述含锂陶瓷粉料至少包含锂辉石、透锂长石、锂瓷石其中一种。
6.根据权利要求1-5任一项所述的密缝连纹低膨胀系数地暖瓷砖坯体的制备方法,其特征在于,包括以下步骤:
1)对坯体原料进行球磨,获得坯浆;
2)对坯浆进行喷雾造粒,获得坯体粉料;
3)对坯体粉料进行压制成型,获得坯体;
4)干燥;
5)布施底釉、喷墨打印图案、布施保护釉和抛釉;
6)入窑烧成,烧成温度为1150-1220度,烧成周期为80~90分钟。
7.根据权利要求6所述的密缝连纹低膨胀系数地暖瓷砖坯体的制备方法,其特征在于,所述原料球磨时间为15-18小时。
8.根据权利要求6所述的密缝连纹低膨胀系数地暖瓷砖坯体的制备方法,其特征在于,所述坯浆细度为0.5-0.6%。
9.根据权利要求6所述的密缝连纹低膨胀系数地暖瓷砖坯体的制备方法,其特征在于,在压制成型的步骤中,所述坯体平整度误差在±0.3mm,厚度误差在±0.1mm。
10.根据权利要求6所述的密缝连纹低膨胀系数地暖瓷砖坯体的制备方法,其特征在于,所述坯体热膨胀系数为44-52×10-7/K。
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