CN114986409B - Clamping device for optical module, crimping box and error code testing equipment - Google Patents

Abstract

The invention provides a clamping device for an optical module, a crimping box and bit error testing equipment, belonging to the technical field of bit error meters. The clamping device includes a cylinder; a cylinder fixing plate, used to fix the cylinder body; a cylinder push plate, fixedly connected with the plunger; a pressing block assembly, including an optical module pressing block, and the pressing block assembly is connected to the cylinder pushing plate through a first fastener connection, the first fastener is threaded with the pressure block assembly after passing through the cylinder push plate, and the first fastener is sleeved with a first compression spring abutted between the cylinder push plate and the pressure block assembly; the limit block, Fixedly installed under the pressing block assembly; the temperature control module is located under the limit block; the lever bracket, the two ends of which are in contact with the pressing block assembly and the temperature control module respectively; the limit block is installed along the length direction of the optical module The limiting through holes are provided with convex strips on the bottoms of both sides of the limiting through holes, and the top surfaces of the convex strips are used to place optical modules. The clamping device of the present invention can ensure the surface quality of the optical module while ensuring the heating efficiency and cost saving.

Description

Clamping device, crimp box and bit error testing equipment for optical modules

technical field

The invention relates to the technical field of bit error meters, in particular to a clamping device for an optical module, a crimping box and bit error testing equipment.

Background technique

In the current optical module testing, the crimping of the optical module usually relies on manual screwing or elbow clamping. This crimping method has low production efficiency and unstable pressure. When the module is plugged and pulled out in this crimping mode, there is a certain probability that the module under test will be scratched, resulting in poor appearance. At present, in order to reduce the defects of module scratches, some optical module manufacturers put high-temperature tape on the heat sink/module during the production test process. Although this method can avoid the external surface scratches of the module during the test process, it will lead to higher The cooling efficiency drops (according to the actual test data, the test time with high temperature tape is more than 50% longer than that without high temperature tape), which greatly wastes time and cost.

Therefore, the compression method of the optical module in the prior art cannot ensure the cooling efficiency and lower cost while ensuring the surface quality of the optical module.

Contents of the invention

An object of the first aspect of the present invention is to provide a clamping device for an optical module, which can ensure the surface quality of the optical module while ensuring heating efficiency and saving costs.

A further object of the present invention is to prevent the optical module from being scratched during the insertion and removal process.

A further object of the present invention is to ensure that the optical module pressing block and the temperature control module are pressed to the surface of the optical module evenly.

An object of the second aspect of the present invention is to provide a crimp box comprising the above-mentioned clamping device for an optical module.

An object of the third aspect of the present invention is to provide a bit error testing device comprising the above crimp box.

In particular, the present invention provides a clamping device for an optical module, comprising:

Cylinder, including cylinder block and plunger;

The cylinder fixing plate is fixedly arranged and used for fixing the cylinder body;

The cylinder push plate is fixedly connected with the plunger;

A pressing block assembly, including an optical module pressing block, the pressing block assembly is connected to the cylinder push plate through a first fastener, and the first fastener is connected to the pressing block assembly after passing through the cylinder pushing plate Threaded connection, the first fastener is sleeved with a first compression spring abutted between the cylinder push plate and the pressure block assembly;

The limit block is fixedly arranged under the pressing block assembly, and is used to place the optical module and limit the position of the optical module;

a temperature control module, located below the limiting block, for controlling the temperature of the optical module;

A lever bracket, the two ends of which are in contact with the pressing block assembly and the temperature control module respectively, and the cylinder is used to control the extension of the plunger when the optical module needs to be compressed, thereby driving the pressing block The component is moved down and the temperature control module is moved up, so that the optical module pressing block is in contact with the top surface of the optical module, and the temperature control module is in contact with the heat dissipation surface at the bottom surface of the optical module;

The limiting block is provided with a limiting through hole penetrating along the length direction of the optical module, and the bottoms of both sides of the limiting through hole are provided with raised strips, and the top surface of the raised strip is used to place the In the optical module, the limiting through hole also partially penetrates the upper surface and the lower surface of the limiting block, so as to be in contact with the pressing block assembly and the temperature control module.

Optionally, a plurality of first guide posts are fixed on the upper surface of the optical module pressing block, and pass through guide holes provided correspondingly on the cylinder fixing plate and the cylinder push plate.

Optionally, a first guide sleeve is provided between the first guide post and the guide hole.

Optionally, the pressing block assembly further includes a rocker, the rocker is provided with a first through hole for passing through the optical module pressing block, and a push rod protrudes from the bottom of the rocker, so The end of the push rod is in contact with the lever bracket.

Optionally, the temperature control module includes a heat sink, a semiconductor cooling chip, and a water cooling module stacked in sequence, and the heat sink, the semiconductor cooling chip, and the water cooling module are provided with a shell for wrapping them, The heat sink has a heat conduction surface aligned with the heat dissipation surface of the optical module, and the housing is provided with a second through hole for exposing the heat conduction surface.

Optionally, the housing is pierced with a second fastener, one end of the second fastener is a cap, and the other end is fixed, and the second fastener is sleeved to abut against the A second compression spring between the cap and the top surface of the housing.

Optionally, the housing is located below the limiting block, and the limiting block is provided with a third through hole for passing through the second fastener of the part.

In particular, the present invention also provides a crimping box, comprising a box body and any one of the clamping devices described above, the clamping device being arranged in the box body.

Optionally, the crimping box is detachably connected to the BER tester, and the box body is also provided with a first opening for passing through the circuit board of the device under test, and a second opening for passing in dry air.

In particular, the present invention also provides a bit error testing device, including a bit error tester, a circuit board of the device under test and the above-mentioned crimping box, the crimping box is detachably connected to the bit error tester, the The circuit board of the device under test is provided with an interface for plugging in the optical module and is connected to the test chip of the bit error meter through a radio frequency connector.

According to an embodiment of the present invention, the optical module pressing block and the temperature control module are controlled to be clamped synchronously on the upper and lower surfaces of the optical module through the air cylinder. Since the force provided by the air cylinder can be controlled, an appropriate pressure can be applied to the optical module after debugging. The crimping of the optical module is simple and efficient through programmed control, without the need to use professional techniques to tighten screws or use elbow clamps, so the optical module will not be crushed and the surface quality of the optical module can be guaranteed. This way that the temperature control module is directly in contact with the heat dissipation surface of the optical module also ensures the heating and cooling efficiency, and the whole crimping process is simple and efficient, saving time and cost.

Further, due to the setting of the first compression spring, when the downward thrust acts on the optical module, there will not be a sudden increase in pressure, but a pressure buffered by a spring, which is beneficial to protect the surface of the optical module from being lost. Guaranteed surface quality.

According to an embodiment of the present invention, the upper surface of the temperature control module is lower than the lower surface of the optical module by setting the raised bar for placing the optical module, so the two will not touch, thereby preventing the optical module from being damaged during the plugging process. scratched.

Furthermore, the position of the optical module is effectively limited by the setting of the limiting structure of the convex strip. Only by aligning the limiting structure with the position of the interface of the circuit board of the device under test, the optical module can be easily inserted into the In the interface of the circuit board of the device under test.

According to an embodiment of the present invention, a first guide post is provided on the optical module pressing block, and the first guide post penetrates into the guide holes corresponding to the cylinder fixing plate and the cylinder push plate so that the optical module pressing block, the cylinder fixing plate and the The cylinder push plate is on the same straight line, ensuring that the optical module pressing block and the cylinder pushing plate move in the same direction without skewing, and ensuring that the optical module pressing block is pressed flatly on the upper surface of the optical module. By providing the first guide sleeve, the durability of the components can be increased and wear can be prevented when the first guide post moves.

According to an embodiment of the present invention, the seesaw and the optical module pressing block are two separate parts, so the strokes of the two can be different. When the seesaw hits the lever bracket and compresses the first compression spring, the optical module pressing block can Continue to move down until it touches the optical module, which can reduce the design difficulty. It is not necessary to meet the pressure requirements on the upper surface and the lower surface of the optical module at the same time through a part, but the force transmission process of the optical module pressing block and the rocker can be designed separately, so that The two meet the pressure requirements on the upper surface and the lower surface of the optical module respectively.

According to an embodiment of the present invention, the housing is pierced with a second fastener. One end of the second fastener is a cap and the other end is fixed. A second compression spring between the top surfaces of the body. When the lever bracket lifts the temperature control module, the setting of the second fastener can ensure that the temperature control module is lifted upwards in the vertical direction, and when the temperature control module is lifted to a certain displacement, the compression of the second compression spring can buffer the temperature control module against the light The upward pressure of the module can protect the lower surface of the optical module from damage, that is, ensure the surface quality of the optical module.

Those skilled in the art will be more aware of the above and other objects, advantages and features of the present invention according to the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings.

Description of drawings

Hereinafter, some specific embodiments of the present invention will be described in detail by way of illustration and not limitation with reference to the accompanying drawings. The same reference numerals in the drawings designate the same or similar parts or parts. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the attached picture:

1 is a structural sectional view of a clamping device for an optical module in an unpressed state according to an embodiment of the present invention;

Fig. 2 is a partial enlarged view of place A in Fig. 1;

3 is a structural cross-sectional view of a clamping device for an optical module in a compressed state according to an embodiment of the present invention;

4 is a partial cross-sectional view of a clamping device for an optical module at a first fastener according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a limit block of a clamping device for an optical module according to an embodiment of the present invention;

6 is a partial cross-sectional view of a clamping device for an optical module at a first guide post according to an embodiment of the present invention;

7 is an exploded schematic diagram of a temperature control module for an optical module according to an embodiment of the present invention;

8 is a partial cross-sectional view of a clamping device for an optical module at a second fastener according to an embodiment of the present invention;

9 is a cross-sectional view of a crimp box according to an embodiment of the present invention;

Fig. 10 is a schematic structural diagram of a bit error testing device according to an embodiment of the present invention.

Reference signs:

100-clamping device, 101-first fastener, 102-first compression spring, 103-second fastener, 104-second compression spring, 10-cylinder, 11-cylinder, 12-plunger, 20-Cylinder fixing plate, 30-Cylinder push plate, 40-Block assembly, 41-Optical module press block, 411-First guide column, 412-First guide sleeve, 42-Wawker, 421-First through hole , 422-Ejector rod, 50-Limiting block, 51-Limiting through hole, 52-Protruding strip, 53-Insertion port, 54-Third through hole, 60-Temperature control module, 61-Heat sink, 611-Heat conduction Surface, 62-semiconductor cooling sheet, 63-water cooling module, 64-housing, 641-upper cover, 642-lower cover, 601-second through hole, 70-lever bracket, 71-rotating shaft, 80-box body, 91 -Connecting column, 92-fixing screw, 93-second guide sleeve, 94-connecting seat, 95-air connector, 96-hap, 200-optical module, 300-coder.

Detailed ways

FIG. 1 is a structural cross-sectional view of a clamping device 100 for an optical module 200 in an unpressed state according to an embodiment of the present invention. Fig. 2 is a partial enlarged view of A in Fig. 1 . FIG. 3 is a cross-sectional view of the structure of the clamping device 100 used for the optical module 200 in a compressed state according to an embodiment of the present invention.

FIG. 4 is a partial cross-sectional view of the clamping device 100 for the optical module 200 at the first fastener 101 according to an embodiment of the present invention. FIG. 5 is a schematic structural diagram of a limit block 50 of a clamping device 100 used for an optical module 200 according to an embodiment of the present invention. The present invention provides a clamping device 100 for an optical module 200. As shown in FIG. , a limit block 50, a temperature control module 60 and a lever bracket 70. The air cylinder 10 includes a cylinder body 11 and a plunger 12 , and air pressure is used to control the expansion and contraction of the plunger 12 relative to the cylinder body 11 . The cylinder fixing plate 20 is fixedly arranged and used to fix the cylinder body 11 . When the clamping device 100 is used, there are usually fixed parts, and the cylinder fixing plate 20 can be fixedly connected to the parts. The cylinder push plate 30 is fixedly connected with the plunger 12, for example, fixedly connected by screws. The pressing block assembly 40 includes an optical module pressing block 41 , and the optical module pressing block 41 is used for crimping the optical module 200 . As shown in Figure 4, the briquetting block assembly 40 is connected with the cylinder push plate 30 through the first fastener 101, and the first fastener 101 is threaded with the briquetting block assembly 40 after passing through the cylinder push plate 30, and the first fastener 101 is covered with a first compression spring 102 abutted between the cylinder push plate 30 and the pressure block assembly 40 . The limiting block 50 is fixedly disposed under the pressing block assembly 40 for placing the optical module 200 and limiting the position of the optical module 200 . As before, the stop block 50 can be fixed at a fixed part. The temperature control module 60 is located below the limiting block 50 and is used to control the temperature of the optical module 200 . The two ends of the lever bracket 70 abut against the briquetting block assembly 40 and the temperature control module 60 respectively, that is, the lever bracket 70 forms a rotational connection with the fixed parts through the rotating shaft 71, and the upper surfaces of the two ends of the lever bracket 70 respectively contact the briquetting block assembly. 40 abuts against the temperature control module 60 . The cylinder 10 is used to control the extension of the plunger 12 when the optical module 200 needs to be pressed, and then drive the pressing block assembly 40 to move down and the temperature control module 60 to move up, so that the optical module pressing block 41 abuts against the top surface of the optical module 200 . The temperature control module 60 is in contact with the heat dissipation surface at the bottom surface of the optical module 200 (see FIG. 3 ). Of course, when the optical module 200 does not need to be pressed, the plunger 12 is retracted, and neither the optical module pressing block 41 nor the temperature control module 60 is in contact with the optical module 200 , see the state in FIG. 2 . As shown in Figure 5, the limiting block 50 is provided with a limiting through hole 51 penetrating along the length direction of the optical module 200, and the bottoms of both sides of the limiting through hole 51 are provided with raised lines 52, as shown in Figure 2, the convex The top surface of the bar 52 is used to place the optical module 200 , and the limiting through hole 51 also partially penetrates the upper surface and the lower surface of the limiting block 50 so as to be in contact with the pressing block assembly 40 and the temperature control module 60 . Generally, as shown in FIG. 2 , the part where the temperature control module 60 is in contact with the optical module 200 has a separate boss, at this time, the distance between the two convex strips 52 can be set slightly larger than the width of the boss, so that The boss protrudes between the two convex strips 52 and contacts the heat dissipation surface of the optical module 200 .

During specific operation, by controlling the extension of the plunger 12 of the cylinder 10, the push plate 30 of the cylinder is pushed down, and the press block assembly 40 is suspended by the push plate 30 of the air cylinder, so the press block assembly 40 will follow the push plate 30 of the cylinder under the action of gravity. move down. When the pressure block assembly 40 moves down to touch one end of the lever bracket 70, the cylinder push plate 30 starts to compress the first compression spring 102 and continues to push the pressure block assembly 40 to move down so as to press down one end of the lever bracket 70, so that the lever bracket 70 The other end is tilted up, and then the temperature control module 60 is lifted, so that the temperature control module 60 is in contact with the heat dissipation surface of the optical module 200 . When the cylinder push plate 30 moves down, the optical module pressing block 41 also moves down until the optical module pressing block 41 contacts the upper surface of the optical module 200, and then compresses the first compression spring 102 at the optical module pressing block 41 to further push the optical module The pressing block 41 is pressed against the optical module 200 . The process of decompressing is opposite to the above process, and will not be repeated here.

In this embodiment, the air cylinder 10 is used to control the optical module pressing block 41 and the temperature control module 60 to be clamped synchronously on the upper and lower surfaces of the optical module 200. Since the force provided by the air cylinder 10 can be controlled, an appropriate pressure can be applied to the optical module 200 after debugging. , the crimping of the optical module 200 is simple and efficient through programmed control, without the need to use professional methods to tighten screws or use elbow clamps, so the optical module 200 will not be crushed, and the surface quality of the optical module 200 can be guaranteed. The manner in which the temperature control module 60 is directly in contact with the heat dissipation surface of the optical module 200 also ensures the heating and cooling efficiency, and the whole crimping process is simple and efficient, saving time and cost.

Further, due to the setting of the first compression spring 102, when the downward thrust acts on the optical module 200, there will not be a sudden increase in pressure, but a pressure buffered by a spring, which is beneficial to protect the surface of the optical module 200 from is lost, surface quality is guaranteed.

In this embodiment, by setting the raised bar 52 for placing the optical module 200, the upper surface of the temperature control module 60 is lower than the lower surface of the optical module 200, so that the two will not touch, thereby preventing the optical module 200 from being damaged during the plugging process. scratched.

Further, the position of the optical module 200 is effectively limited by the setting of the limiting structure such as the convex strip 52. Only by aligning the limiting structure with the position of the interface of the circuit board of the device under test, the optical module 200 can be easily Insert the ground into the interface of the circuit board of the device under test.

As shown in FIG. 5 , the front portion of the limiting block 50 is further provided with an insertion opening 53 expanding from the rear to the front, for guiding the insertion of the optical module 200 .

FIG. 6 is a partial cross-sectional view of the clamping device 100 for the optical module 200 at the first guide post 411 according to an embodiment of the present invention. In one embodiment, as shown in FIG. 6 , a plurality of first guide posts 411 are fixed on the upper surface of the optical module pressing block 41 , and penetrate through the corresponding guide holes of the cylinder fixing plate 20 and the cylinder push plate 30 . Furthermore, a first guide sleeve 412 is provided between the first guide post 411 and the guide hole, that is, a straight rod type universal first guide sleeve 412, which can be made of high-quality high-strength brass, graphite and other materials.

In this embodiment, a first guide column 411 is provided on the optical module pressing block 41, and the first guiding column 411 is penetrated into the guide holes corresponding to the cylinder fixing plate 20 and the cylinder pushing plate 30 so that the optical module pressing block 41 and the cylinder fixing plate 20 and the cylinder push plate 30 are on the same straight line, ensuring that the optical module pressing block 41 and the cylinder pushing plate 30 move in the same direction without skewing, and ensuring that the optical module pressing block 41 is pressed to the upper surface of the optical module 200 smoothly.

By providing the first guide sleeve 412, the durability of the components can be increased and wear can be prevented when the first guide post 411 moves.

As shown in FIG. 1 , the pressing block assembly 40 further includes a seesaw 42 , a first through hole 421 is provided at the seesaw 42 for passing through the optical module pressing block 41 , and a push rod 422 protrudes from the bottom of the seesaw 42 . The end of the push rod 422 is in contact with the lever bracket 70 .

In this embodiment, the seesaw 42 and the optical module pressing block 41 are two separate parts, so the strokes of the two can be different. When the seesaw 42 hits the lever bracket 70 to compress the first compression spring 102, the optical module presses The block 41 can continue to move down until it touches the optical module 200, which can reduce the design difficulty. It is not necessary to meet the pressure requirements on the upper surface and the lower surface of the optical module 200 through a part at the same time, but the optical module pressing block 41 and the seesaw can be designed separately 42, so that the two meet the pressure requirements on the upper surface and the lower surface of the optical module 200 respectively.

FIG. 7 is an exploded schematic view of the temperature control module 60 used in the optical module 200 according to an embodiment of the present invention. As shown in FIG. 7 , in one embodiment, the temperature control module 60 includes a heat sink 61 , a semiconductor cooling chip 62 and a water cooling module 63 which are stacked in sequence. The heat sink 61, the semiconductor cooling plate 62 and the water-cooling module 63 are provided with a housing 64 for wrapping them. The heat sink 61 has a heat conduction surface aligned with the heat dissipation surface of the optical module 200, and the housing 64 is provided with an exposed heat conduction surface. The second through hole 601 on the surface. In the embodiment shown in FIG. 7 , the casing 64 includes an upper cover 641 and a lower cover 642 , which form a closed casing 64 by fitting together.

FIG. 8 is a partial cross-sectional view of the clamping device 100 for the optical module 200 at the second fastener 103 according to an embodiment of the present invention. In one embodiment, as shown in FIG. 8 , the housing 64 is pierced with a second fastener 103 , one end of the second fastener 103 is a cap and the other end is fixed, and the second fastener 103 is sleeved with a The second compression spring 104 abuts between the cap and the top surface of the housing 64 .

When the lever bracket 70 lifts the temperature control module 60, the setting of the second fastener 103 can ensure that the temperature control module 60 is lifted upwards in the vertical direction, and when the temperature control module 60 is lifted to a certain displacement, the second compression spring 104 can be compressed. Buffering the upward pressure of the temperature control module 60 on the optical module 200 can protect the lower surface of the optical module 200 from damage, that is, ensure the surface quality of the optical module 200 .

Further, as shown in FIG. 8 , the housing 64 is located below the limiting block 50 , and the limiting block 50 is provided with a third through hole 54 for passing through the second fastener 103 of the part.

The alignment of the temperature control module 60 and the limit block 50 can be ensured through the cooperation of the second fastener 103 and the third through hole 54 , thereby indirectly ensuring the smooth contact between the temperature control module 60 and the optical module 200 .

9 is a cross-sectional view of a crimp box according to one embodiment of the present invention. The present invention also provides a crimping box, as shown in FIG. 9 , in one embodiment, the crimping box includes a box body 80 and a clamping device 100 in any of the above-mentioned embodiments or combinations of embodiments, the clamping device 100 is disposed in the box body 80 .

This embodiment provides a crimping box with a temperature control function and a pressing function. The crimping box is a separate structure, so it can be assembled on the BER tester 300 according to requirements, and cooperate with the BER tester 300 to complete different types of optical modules. 200 detections.

As shown in Figure 9, the bottom plate of the box body 80 is fixed with a connecting column 91, the top of the connecting column 91 abuts against the bottom of the cylinder fixing plate 20, and is screwed with the connecting column 91 after passing through the cylinder fixing plate 20 through the fixing screw 92 The cylinder fixing plate 20 can be fixed. Of course, the connecting column 91 also passes through the cylinder push plate 30, and the outside of the part where the connecting column 91 passes through the cylinder push plate 30 and the seesaw 42 is provided with a second guide sleeve 93, so that the cylinder push plate 30 is relatively opposite to the connecting column. 91 will not wear out when moving. The connection column 91 is further provided with a connection seat 94 fixed to the bottom plate in the box body 80 , and the connection seat 94 is fixedly connected with the limit block 50 through fasteners, so as to realize the fixed setting of the limit block 50 .

Fig. 10 is a schematic structural diagram of a bit error testing device according to an embodiment of the present invention. As shown in Figure 10, the present invention also provides a kind of bit error testing equipment, comprises bit error meter 300, circuit board of the device under test (not shown) and above-mentioned crimp box, and crimp box and bit error meter 300 form The detachable connection can be locked with the hasp shown in Figure 10. The circuit board of the device under test is provided with an interface for plugging in an optical module and is connected to the test chip of the bit error detector through a radio frequency connector. The box body 80 is also provided with a first opening for passing through the circuit board of the device under test, and a second opening for feeding dry air. As shown in FIG. Air is used to solve the problem of low-temperature condensation in the box body 80 , and the air joint 95 at the other second opening is used to connect the cylinder 10 to provide gas for the cylinder 10 .

In this embodiment, both the circuit board of the device under test and the crimp box are set to be detachably connected to the bit error meter 300, so when it is necessary to test different optical modules, only the circuit board of the device under test and the circuit board of the device under test need to be replaced accordingly. The crimp box will do. This method is simple to operate, saves time and effort, and improves the efficiency of production line change.

Further, in order to realize the detachability of different optical modules 200, in this embodiment, the circuit board of the device under test used to insert the optical module 200 and the chip of the bit error detector 300 are connected through a radio frequency connector, that is, through a non-cable The unique connection method realizes the convenient replacement of circuit boards of different devices under test and the bit error detector 300, and the cost of radio frequency connectors is lower than that of multiple sets of high-speed radio frequency cables.

So far, those skilled in the art should appreciate that, although a number of exemplary embodiments of the present invention have been shown and described in detail herein, without departing from the spirit and scope of the present invention, the disclosed embodiments of the present invention can still be used. Many other variations or modifications consistent with the principles of the invention are directly identified or derived from the content. Accordingly, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

Claims (9)

1. A clamping device for an optical module, comprising: Cylinder, including cylinder block and plunger; The cylinder fixing plate is fixedly arranged and used for fixing the cylinder body; The cylinder push plate is fixedly connected with the plunger; A pressing block assembly, including an optical module pressing block, the pressing block assembly is connected to the cylinder push plate through a first fastener, and the first fastener is connected to the pressing block assembly after passing through the cylinder pushing plate Threaded connection, the first fastener is sleeved with a first compression spring abutted between the cylinder push plate and the pressure block assembly; The limit block is fixedly arranged under the pressing block assembly, and is used to place the optical module and limit the position of the optical module; a temperature control module, located below the limiting block, for controlling the temperature of the optical module; A lever bracket, the two ends of which are in contact with the pressing block assembly and the temperature control module respectively, and the cylinder is used to control the extension of the plunger when the optical module needs to be compressed, thereby driving the pressing block The component is moved down and the temperature control module is moved up, so that the optical module pressing block is in contact with the top surface of the optical module, and the temperature control module is in contact with the heat dissipation surface at the bottom surface of the optical module; The limiting block is provided with a limiting through hole penetrating along the length direction of the optical module, and the bottoms of both sides of the limiting through hole are provided with raised strips, and the top surface of the raised strip is used to place the In the optical module, the limiting through hole also partially penetrates the upper surface and the lower surface of the limiting block, so as to be in contact with the pressing block assembly and the temperature control module; The temperature control module includes a heat sink, a semiconductor cooling chip and a water-cooling module that are stacked in sequence. The heat sink, the semiconductor cooling chip and the water-cooling module are provided with a shell for wrapping them. The heat sink It has a heat conduction surface aligned with the heat dissipation surface of the optical module, and the housing is provided with a second through hole for exposing the heat conduction surface. 2. The clamping device for an optical module according to claim 1, wherein: A plurality of first guide posts are fixed on the upper surface of the optical module pressing block, and are penetrated into guide holes correspondingly provided on the cylinder fixing plate and the cylinder push plate. 3. The clamping device for an optical module according to claim 2, characterized in that, A first guide sleeve is provided between the first guide post and the guide hole. 4. The clamping device for optical modules according to claim 1, characterized in that, The pressing block assembly also includes a seesaw, and a first through hole is provided at the seesaw for passing through the optical module pressing block. A push rod protrudes from the bottom of the seesaw, and the push rod The end is in contact with the lever bracket. 5. The clamping device for an optical module according to any one of claims 1-4, characterized in that, The shell is pierced with a second fastener, one end of the second fastener is a cap and the other end is fixed, and the second fastener is sleeved with a butt joint between the cap and the cap. the second compression spring between the top surfaces of the housing. 6. The clamping device for an optical module according to claim 5, characterized in that, The housing is located below the limiting block, and the limiting block is provided with a third through hole for passing through the second fastener. 7. A crimping box, characterized by comprising a box body and the clamping device according to any one of claims 1-6, the clamping device being arranged in the box body. 8. The crimp box according to claim 7, characterized in that, The crimping box is detachably connected to the BER tester, and the box body is also provided with a first opening for passing through the circuit board of the device under test, and a second opening for passing in dry air. 9. A bit error testing device, characterized in that it comprises a bit error tester, a circuit board of the device under test and the crimping box according to claim 8, the crimping box is detachably connected to the bit error tester, The circuit board of the device under test is provided with an interface for plugging in the optical module and is connected to the test chip of the bit error detector through a radio frequency connector.

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