CN107063635B - Optical module high-low temperature testing device - Google Patents
Optical module high-low temperature testing device Download PDFInfo
- Publication number
- CN107063635B CN107063635B CN201710291198.7A CN201710291198A CN107063635B CN 107063635 B CN107063635 B CN 107063635B CN 201710291198 A CN201710291198 A CN 201710291198A CN 107063635 B CN107063635 B CN 107063635B
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- optical module
- sliding block
- thermocouple probe
- low temperature
- fixed
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- 238000012360 testing method Methods 0.000 title claims abstract description 87
- 230000003287 optical effect Effects 0.000 title claims abstract description 81
- 239000000523 sample Substances 0.000 claims abstract description 53
- 238000003825 pressing Methods 0.000 claims description 24
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 230000002441 reversible effect Effects 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract description 3
- 239000011521 glass Substances 0.000 description 4
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to an optical module high-low temperature testing device which is used for testing an optical module, wherein the optical module high-low temperature testing device comprises a base and a testing frame arranged on the base, and the optical module is placed on the testing frame; the thermocouple probe is arranged above the test frame and is in contact with the optical module placed on the test frame, the thermocouple probe is fixed through the support, the thermocouple probe of the optical module high-low temperature test device is fixed through the support, so that when the optical module is fixed on the test frame, the thermocouple probe is directly in contact with the optical module, the installation test process is convenient, and the thermocouple probe cannot generate displacement phenomenon, so that the problem of inaccurate test data caused by displacement change of the thermocouple probe can be avoided.
Description
Technical Field
The invention relates to a high-low temperature testing device for an optical module.
Background
At present, in the production of a high-speed optical transceiver module for long-distance transmission, parameters of the optical module need to be calibrated at high and low temperatures so as to ensure the stability of wavelength and optical power. At present, an incubator or a jet flow box with a glass cover interface is generally adopted as a temperature control source for high-low temperature test, but the former has low efficiency and low temperature rising speed, errors are easy to occur, the latter has high price, the size of the glass cover can limit the design size of an optical module test tooling plate, particularly the high-speed wire of a high-speed optical module has wiring requirements, and the size limitation of the glass cover can influence wiring. And both are inconvenient in connecting the temperature probes of the module under test. If manual pasting or placement is used, the change of the probe position can introduce more measurement data errors. And the gas outlet of the glass cover is generally fixed, so that the flow of the gas flow is relatively fixed, and the uniformity of the temperature distribution on the surface of the optical module can be poor for the optical module with larger test volume.
Disclosure of Invention
The invention aims to provide the optical module high-low temperature testing device which is convenient in mounting and testing process and can improve testing accuracy.
In order to achieve the above purpose, the present invention provides the following technical solutions: the high-low temperature testing device for the optical module is used for testing the optical module and comprises a base and a testing frame arranged on the base, wherein the optical module is placed on the testing frame; the upper side of test frame is provided with the thermocouple probe, the thermocouple probe with place the optical module contact on the test frame, the thermocouple probe passes through the support to be fixed.
Further: the bracket comprises a fixed plate positioned above the test frame and a sliding block arranged on the fixed plate; the thermocouple probe is arranged on the fixed plate and can move towards the direction of the optical module placed on the test frame relative to the fixed plate; the sliding block can move relative to the fixed plate, and the thermocouple probe is driven to move towards the direction of the optical module placed on the test frame when the sliding block moves.
Further: the thermocouple probe comprises a fixing plate, and is characterized in that a supporting plate is fixed on the fixing plate, a through hole is formed in the supporting plate, a cavity for accommodating the thermocouple probe is formed between the fixing plate and the supporting plate, one end of the thermocouple probe penetrates through the through hole, a movable piece is fixed on the thermocouple probe and is positioned in the cavity, a first elastic piece is arranged between the movable piece and the supporting plate, the sliding block is propped against one side of the movable piece, and when the sliding block drives the movable piece to move towards the direction of the optical module placed on the test frame, the thermocouple probe moves along with the movable piece.
Further: the sliding block is arranged between the sliding block and the fixed plate, and the sliding block is driven to move towards the opposite direction of the movable part when the second elastic part is deformed and reset.
Further: the optical module high-low temperature testing device further comprises a shell arranged on the base and a reversible bin gate movably arranged on the shell, a testing cavity is formed by surrounding the shell, the testing frame is arranged in the testing cavity, the fixed plate is fixed on the shell, a pressing piece is arranged on one side of the sliding block, the pressing piece and the movable piece are oppositely arranged on two sides of the sliding block along the longitudinal direction of the optical module arranged on the fixed plate, and the pressing piece is fixed on the bin gate; when the bin gate is turned down, the pressing piece presses against the sliding block and pushes the sliding block to move towards the direction of the movable piece.
Further: and magnetic pieces are respectively arranged on the bin gate and the base.
Further: the shell is provided with an air inlet which can be connected with a temperature control source.
Further: the shell is provided with a plurality of exhaust ports.
Further: and a protection pad is arranged below the thermocouple.
Further: the optical module high-low temperature testing device further comprises a heat dissipation assembly arranged on one side of the testing frame.
The invention has the beneficial effects that: the thermocouple probe of the optical module high-low temperature testing device is fixed through the support, so that the thermocouple probe is directly contacted with the optical module after the optical module is fixed on the testing frame, the installation and testing process is convenient, and the problem of inaccurate testing data caused by displacement change of the thermocouple probe can be avoided because the thermocouple probe cannot generate displacement phenomenon.
The foregoing description is only an overview of the present invention, and is intended to provide a better understanding of the present invention, as it is embodied in the following description, with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
Fig. 1 is a schematic structural diagram of an optical module high-low temperature testing device according to an embodiment of the present invention;
FIG. 2 is a partially exploded view of the optical module high and low temperature test apparatus shown in FIG. 1;
FIG. 3 is an exploded view of a portion of the structure of FIG. 1;
FIG. 4 is a schematic view of the structure of the bracket in FIG. 1;
FIG. 5 is a schematic view of a portion of the structure of the bracket of FIG. 4;
FIG. 6 is a schematic view of a portion of the structure of the bracket in FIG. 5 in another direction;
fig. 7 is a schematic structural view of the fixing plate in fig. 4.
Detailed Description
The following describes in further detail the embodiments of the present invention with reference to the drawings and examples. The following examples are illustrative of the invention and are not intended to limit the scope of the invention.
Referring to fig. 1, 2 and 4, an optical module high-low temperature testing device according to a preferred embodiment of the present invention is used for testing an optical module 10, and the optical module high-low temperature testing device includes a base, a housing 2 disposed on the base 1, a reversible bin door 3 movably mounted on the housing 2, a testing stand 4 disposed on the base 1, and a heat dissipation assembly 5 disposed on one side of the housing 2. The housing 2 encloses a test chamber (not numbered), and the test rack 4 is disposed in the test chamber. In order to prevent the case 2 from being excessively large in temperature difference between the inside and the outside to cause vapor condensation, the case 2 and the bin gate 3 are made of heat insulation materials. The bin door 3 is fixed on the housing 2 through a hinge 6, and the structure of the hinge 6 is of conventional design, so that details are not repeated here. In order to ensure that the bin gate 3 can be well closed, magnetic pieces (not shown) are respectively arranged on the bin gate 3 and the base 1, and a handle 31 is arranged on the bin gate 3. In this embodiment, the reference viewing angle is shown in fig. 1, and the direction a-a in fig. 1 is the longitudinal direction of the optical module 10. The base 1 is provided with a circuit board 7, the circuit board 7 is electrically connected with the test rack 4, and the shell 2 and the bin gate 3 are arranged along the longitudinal direction of the optical module 10. The heat dissipation assembly 5 is a fan, and when the housing 2 and the bin gate 3 are removed and the optical module 10 is tested at normal temperature, the fan cools the optical module 10.
Referring to fig. 2 and 4, a thermocouple probe 8 is disposed above the test frame 4, the thermocouple probe 8 contacts with the upper surface of an optical module 10 placed on the test frame 4, and the thermocouple probe 8 is fixed by a bracket 9. The protection pad (not shown) is arranged below the thermocouple probe 8, the protection pad is fixed at the bottom of the thermocouple probe 8 in a pasting mode, the size of the protection pad can be 0.5mm, and the protection pad can prevent the thermocouple from damaging the upper surface of the optical module 10. Referring to fig. 3 and 4 in combination with fig. 2, the stand 9 includes a fixing plate 91 above the test rack 4 and a sliding block 92 provided on the fixing plate 91. In the present embodiment, the fixing plate 91 is fixed to the housing 2, and the fixing plate 91 may be fixed to the test rack 4. The thermocouple probe 8 is arranged on the fixed plate 91 and can move relative to the fixed plate 91 towards the direction of the optical module 10 placed on the test rack 4; the sliding block 92 can move relative to the fixed plate 91, and the sliding block 92 drives the thermocouple probe 8 to move towards the optical module 10 placed on the test frame 4 when moving. In the present embodiment, the connection relationship among the sliding block 92, the thermocouple probe 8 and the fixing plate 91 is specifically as follows: the fixing plate 91 is fixed with a supporting plate 93, the supporting plate 93 is provided with a through hole 931, a cavity 94 for accommodating the thermocouple probe 8 is formed between the fixing plate 91 and the supporting plate 93, one end of the thermocouple probe 8 passes through the through hole 931, a movable piece 95 is fixed on the thermocouple probe 8, the movable piece 95 is located in the cavity 94, a first elastic piece 901 is arranged between the movable piece 95 and the supporting plate 93, the sliding block 92 abuts against one side of the movable piece 95, and when the sliding block 92 drives the movable piece 95 to move towards the direction of the optical module 10 placed on the test frame 4, the thermocouple probe 8 moves along with the movable piece 95. In this embodiment, the first elastic member 901 is a first spring 901. In order to make the thermocouple probe 8 move more stably, two optical holes 951 are formed in the movable member 95, optical axes 952 are disposed in the two optical holes 951, one end of the optical axis 952 is fixed on the supporting plate 93, the two optical axes 952 are sleeved with the first springs 901, and the two optical axes 952 are disposed on two sides of the thermocouple probe 8 relatively. Referring to fig. 5 and 6, in the present embodiment, the sliding block 92 and the movable member 95 are arranged along the longitudinal direction of the optical module 10, the sliding block 92 has an abutment surface 921 disposed with an inclined surface, the movable member 95 has a slope surface 953 matching with the abutment surface 921, and the abutment surface 921 abuts against the slope surface 953. The sliding block 92 is an elongated plate body extending along the longitudinal direction of the optical module 10 placed on the test rack 4, the sliding block 92 further has a vertical surface 922, the vertical surface 922 is located at the rear end of the pressing surface 921, and the vertical surface 922 is formed by extending vertically downward from the rear end of the pressing surface 921. The movable member 95 further has a stop surface 954 facing the vertical surface 922, and when the pressing surface 921 moves to a certain distance toward the slope surface 953 of the movable member 92, the vertical surface 922 abuts against the stop surface 954 to prevent the sliding block 92 from being excessively dislocated from the movable member 95.
Referring to fig. 5 to 7, a second elastic member 902 is disposed between the sliding block 92 and the fixed plate 91, and the second elastic member 902 drives the sliding block 92 to move in a direction opposite to the movable member 95 when the second elastic member 902 is deformed and restored. The two sides of the sliding block 92 are convexly provided with a bump 921, the bump 921 is provided with a fixed column 922, the second elastic element 902 is a second spring, the second spring 902 is sleeved on the fixed column 922, and the fixed plate 91 is provided with a mounting hole 911 for the fixed column 922 to insert. The fixed plate 91 is provided with a sliding slot 912, the moving plate is provided with a sliding block 923, and the sliding block 923 is inserted into the sliding slot 912 and can move along the longitudinal direction of the optical module 10 relative to the sliding slot 912.
Referring to fig. 1 to 3, a pressing member 96 is disposed on one side of the sliding block 92, the pressing member 96 and the movable member 95 are disposed on two sides of the sliding block 92 along the longitudinal direction of the optical module 10 disposed on the fixed plate 91, and the pressing member 96 is fixed on the bin gate 3; when the bin door 3 is turned down, the pressing member 96 presses against the sliding block 92 and pushes the sliding block 92 to move in the direction of the movable member 95. In order to prevent the rigid impact, a third elastic member (not shown) is provided between the pressing member 96 and the sliding block 92. The housing 2 is provided with an air inlet 21 connectable to a temperature control source (not shown), the air inlet 21 is connected through an air outlet hose (not shown), and when the housing 2 is in a positive pressure state, the door 3 can blow off water vapor in a mode of normal temperature air inlet at normal temperature, so as to reduce the risk of condensation of the water vapor. The shell 2 is provided with a plurality of exhaust ports 22 to ensure that the gas entering from the temperature control source can uniformly diffuse out to take away heat or heat, in this embodiment, the number of the exhaust ports 22 is four, the exhaust ports 22 are respectively and oppositely arranged on the four end corners of the shell, and in other embodiments, the exhaust ports 22 can be arranged in other numbers and the layout thereof according to the actual requirements.
The method for using the optical module high-low temperature testing device when the detection optical module 10 is installed is as follows: the bin gate 3 is turned up through the handle 31, the test rack 4 fixed with the optical module 10 is placed in the test cavity, the bin gate 3 is turned down, when the bin gate 3 is arranged below, the pressing piece 96 on the bin gate 3 moves along with the bin gate 3, at the moment, the pressing piece 96 turns towards the sliding block 92, and after the pressing piece 96 turns to a certain position, the pressing piece 96 presses against the sliding block 92; when the pressing member 96 continues to move with the bin gate 3 being turned upside down, the second spring 902 is compressed, and at the same time, the pressing member 96 pushes the sliding block 92 to move toward the movable member 95; simultaneously, as the sliding block 92 moves, the pressing surface 921 of the sliding block 92 presses down against the slope surface 953 of the movable member 95, so that the movable member 95 moves downward; when the movable member 95 moves downward, the first spring 901 is compressed, and the thermocouple probe 8 on the movable member 95 moves downward until the thermocouple probe 8 contacts the upper surface of the optical module 10, and the door 3 is closed while the thermocouple probe 8 contacts the optical module 10. When the optical module 10 is detected, the bin door 3 is opened, at this time, after the sliding block 92 loses the pressure applied to it by the pressing piece 96, the sliding block 92 moves rightward and resets under the action of the second spring 902, and when the sliding block 92 is reset, the pressure on the movable piece 95 is gradually withdrawn, the movable piece 95 moves upward and resets under the action of the first spring 901, and the thermocouple probe 8 moves upward with the movable piece 95 to be away from the upper surface of the optical module 10. In this embodiment, by providing the first spring 901 and the second spring 902, it is possible to realize control of the clamping force in addition to the automatic return function.
To sum up: the thermocouple probe 8 of the optical module high-low temperature testing device is fixed through the bracket 9, so that when the optical module 10 is fixed on the testing frame 4, the thermocouple probe 8 is directly contacted with the optical module 10, and therefore the installation testing process is convenient, and the problem of inaccurate testing data caused by displacement change of the thermocouple probe 8 can be avoided because the thermocouple probe 8 cannot generate displacement phenomenon, and in addition, compared with the prior art, the optical module high-low temperature testing device has a simple structure.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (8)
1. The high-low temperature testing device for the optical module is characterized by comprising a base and a testing frame arranged on the base, wherein the optical module is placed on the testing frame; a thermocouple probe is arranged above the test frame and is in contact with an optical module placed on the test frame, and the thermocouple probe is fixed through a bracket;
the bracket comprises a fixed plate positioned above the test frame and a sliding block arranged on the fixed plate; the thermocouple probe is arranged on the fixed plate and can move towards the direction of the optical module placed on the test frame relative to the fixed plate; the sliding block can move relative to the fixed plate, and the thermocouple probe is driven to move towards the direction of the optical module placed on the test frame when the sliding block moves;
the thermocouple probe comprises a fixing plate, and is characterized in that a supporting plate is fixed on the fixing plate, a through hole is formed in the supporting plate, a cavity for accommodating the thermocouple probe is formed between the fixing plate and the supporting plate, one end of the thermocouple probe penetrates through the through hole, a movable piece is fixed on the thermocouple probe and is positioned in the cavity, a first elastic piece is arranged between the movable piece and the supporting plate, the sliding block is propped against one side of the movable piece, and when the sliding block drives the movable piece to move towards the direction of the optical module placed on the test frame, the thermocouple probe moves along with the movable piece.
2. The optical module high-low temperature testing device according to claim 1, wherein a second elastic piece is arranged between the sliding block and the fixed plate, and the sliding block is driven to move towards the opposite direction of the movable piece when the second elastic piece is deformed and reset.
3. The optical module high-low temperature testing device according to claim 2, further comprising a housing arranged on the base and a reversible bin gate movably arranged on the housing, wherein the housing encloses a testing cavity, the testing frame is arranged in the testing cavity, the fixed plate is fixed on the housing, one side of the sliding block is provided with a pressing piece, the pressing piece and the movable piece are oppositely arranged on two sides of the sliding block along the longitudinal direction of the optical module arranged on the fixed plate, and the pressing piece is fixed on the bin gate; when the bin gate is turned down, the pressing piece presses against the sliding block and pushes the sliding block to move towards the direction of the movable piece.
4. The optical module high-low temperature testing device according to claim 3, wherein the bin gate and the base are respectively provided with a magnetic piece.
5. The optical module high-low temperature testing device according to claim 4, wherein the housing is provided with an air inlet connectable to a temperature control source.
6. The optical module high-low temperature testing device according to claim 4, wherein the housing is provided with a plurality of exhaust ports.
7. The optical module high-low temperature testing device according to claim 1, wherein a protection pad is arranged below the thermocouple.
8. The optical module high and low temperature testing device according to claim 1, further comprising a heat dissipation assembly disposed at one side of the test frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710291198.7A CN107063635B (en) | 2017-04-28 | 2017-04-28 | Optical module high-low temperature testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710291198.7A CN107063635B (en) | 2017-04-28 | 2017-04-28 | Optical module high-low temperature testing device |
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| Publication Number | Publication Date |
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| CN107063635A CN107063635A (en) | 2017-08-18 |
| CN107063635B true CN107063635B (en) | 2023-10-27 |
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| CN201710291198.7A Active CN107063635B (en) | 2017-04-28 | 2017-04-28 | Optical module high-low temperature testing device |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108709654B (en) * | 2018-07-26 | 2024-01-16 | 深圳市亚派光电器件有限公司 | Temperature testing device |
| CN110806272B (en) * | 2018-08-06 | 2022-03-18 | 宁波方太厨具有限公司 | Power strip temperature rise testing arrangement |
| CN111721440A (en) * | 2020-05-28 | 2020-09-29 | 武汉华工正源光子技术有限公司 | High-low temperature test system of optical module |
| CN113432835B (en) * | 2021-06-03 | 2023-06-13 | 厦门特仪科技有限公司 | Multi-cavity high-low temperature testing device and system with same |
| CN114986409B (en) * | 2022-05-18 | 2023-04-21 | 苏州联讯仪器股份有限公司 | Clamping device for optical module, crimping box and error code testing equipment |
| CN115855295B (en) * | 2023-02-28 | 2023-05-16 | 瑞熙恩电气（珠海）有限公司 | Integrated industrial temperature measurement system and method based on front-end operation |
| CN116818119A (en) * | 2023-06-28 | 2023-09-29 | 苏州联讯仪器股份有限公司 | Testing device for testing optical module and water cooling system |
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| JPH06235678A (en) * | 1992-05-22 | 1994-08-23 | Froilabo | Sample holding module for testing optical structural part |
| JPH11148961A (en) * | 1997-09-11 | 1999-06-02 | Fuji Electric Co Ltd | Device for measuring temperature for testing power semiconductor module |
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| CN107063635A (en) | 2017-08-18 |
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