CN114982387A - 柔性电路板及显示装置 - Google Patents
柔性电路板及显示装置 Download PDFInfo
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- CN114982387A CN114982387A CN202080003665.1A CN202080003665A CN114982387A CN 114982387 A CN114982387 A CN 114982387A CN 202080003665 A CN202080003665 A CN 202080003665A CN 114982387 A CN114982387 A CN 114982387A
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- Prior art keywords
- circuit board
- film
- sub circuit
- flexible circuit
- region
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/08—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of piezoelectric devices, i.e. electric circuits therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
本公开提供了一种柔性电路板和显示装置。所述柔性电路板包括：堆叠设置的多个子电路板，所述多个子电路板至少包括第一子电路板和第二子电路板；以及设置于所述第一子电路板上的压力传感器，其中，所述第一子电路板包括：基材薄膜；设置在所述基材薄膜远离所述第二子电路板一侧的导电薄膜；设置在所述导电薄膜远离所述基材薄膜一侧的粘结层；设置在所述粘结层远离所述基材薄膜一侧的覆盖层；以及设置在所述覆盖层远离所述基材薄膜一侧的电磁屏蔽层，其中，所述导电薄膜的至少一部分形成所述压力传感器的电极。
Description
PCT国内申请，说明书已公开。
Claims (21)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/139511 WO2022134026A1 (zh) | 2020-12-25 | 2020-12-25 | 柔性电路板及显示装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114982387A true CN114982387A (zh) | 2022-08-30 |
Family
ID=82118166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080003665.1A Pending CN114982387A (zh) | 2020-12-25 | 2020-12-25 | 柔性电路板及显示装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US11765830B2 (zh) |
| CN (1) | CN114982387A (zh) |
| WO (1) | WO2022134026A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113840443A (zh) * | 2020-06-05 | 2021-12-24 | 京东方科技集团股份有限公司 | 柔性电路板、其制作方法及相关装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101149398B1 (ko) | 2010-08-16 | 2012-06-01 | 디케이 유아이엘 주식회사 | 휴대 단말기 |
| KR102061072B1 (ko) | 2013-03-12 | 2019-12-31 | 삼성전자주식회사 | 하우징 실링 상태 확인 방법 및 장치 |
| KR102233188B1 (ko) | 2014-10-29 | 2021-03-30 | 삼성디스플레이 주식회사 | 표시 장치 |
| CN106325626B (zh) | 2015-07-01 | 2024-03-15 | 安徽精卓光显技术有限责任公司 | 触控显示装置及压力触控单元 |
| KR101841583B1 (ko) * | 2016-12-05 | 2018-03-26 | 삼성전자주식회사 | 전자 장치의 모듈 배치 구조 |
| KR102323014B1 (ko) | 2017-08-16 | 2021-11-09 | 주식회사 아모텍 | 안테나 모듈 및 이를 포함하는 휴대 단말 |
| KR102414477B1 (ko) | 2017-11-23 | 2022-06-30 | 삼성전자 주식회사 | 압력 센서의 성능 저하를 방지하기 위한 탄성 부재를 포함하는 전자 장치 및 방법 |
| CN109032416B (zh) | 2018-03-28 | 2021-08-10 | 上海和辉光电股份有限公司 | 触控显示面板、显示装置及触控显示面板的制备方法 |
| KR102665381B1 (ko) | 2018-11-23 | 2024-05-14 | 삼성디스플레이 주식회사 | 표시장치 |
| KR102632916B1 (ko) * | 2019-02-19 | 2024-02-02 | 삼성전자주식회사 | 디스플레이를 통해 배치되는 전자 부품을 포함하는 전자 장치 |
| KR20220012028A (ko) * | 2020-07-22 | 2022-02-03 | 삼성전자주식회사 | 연성회로기판 및 이를 포함하는 전자 장치 |
-
2020
- 2020-12-25 CN CN202080003665.1A patent/CN114982387A/zh active Pending
- 2020-12-25 US US17/435,158 patent/US11765830B2/en active Active
- 2020-12-25 WO PCT/CN2020/139511 patent/WO2022134026A1/zh active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| US11765830B2 (en) | 2023-09-19 |
| WO2022134026A1 (zh) | 2022-06-30 |
| US20220210917A1 (en) | 2022-06-30 |
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