CN114982385A - 连接焊盘及基板 - Google Patents

连接焊盘及基板 Download PDF

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Publication number
CN114982385A
CN114982385A CN202080002520.XA CN202080002520A CN114982385A CN 114982385 A CN114982385 A CN 114982385A CN 202080002520 A CN202080002520 A CN 202080002520A CN 114982385 A CN114982385 A CN 114982385A
Authority
CN
China
Prior art keywords
sub
connection
pad
pads
connection pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080002520.XA
Other languages
English (en)
Inventor
刘宗民
张东东
曲峰
黄继景
侯孟军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of CN114982385A publication Critical patent/CN114982385A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

提供一种连接焊盘及基板，属于显示技术领域。所述连接焊盘，其包括多个子焊盘(11)和第一连接部(12)；其中，所述多个子焊盘(11)间隔设置，并通过所述第一连接部(12)电连接。由于所述连接焊盘由间隔设置子焊盘(11)通过第一连接部(12)连接形成，也即在子焊盘(11)之间存在一定的间隙，对于连接焊盘自身而言，其上具有镂空区域，这样一来，在将该连接焊盘应用至基板中，并与其它信号线路板上的连接焊盘通过ACF胶绑定时，子焊盘(11)之间的缝隙给ACF胶提供溢胶空间，从而有效的避免了焊盘过宽而导致ACF胶中金球挤压连接焊盘，导致连接焊盘拱起而导致连接焊盘的绑定不良问题。

Description

PCT国内申请，说明书已公开。

Claims (14)

  1. PCT国内申请，权利要求书已公开。
CN202080002520.XA 2020-10-28 2020-10-28 连接焊盘及基板 Pending CN114982385A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/124395 WO2022087891A1 (zh) 2020-10-28 2020-10-28 连接焊盘及基板

Publications (1)

Publication Number Publication Date
CN114982385A true CN114982385A (zh) 2022-08-30

Family

ID=81381676

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080002520.XA Pending CN114982385A (zh) 2020-10-28 2020-10-28 连接焊盘及基板

Country Status (3)

Country Link
US (1) US20220312592A1 (zh)
CN (1) CN114982385A (zh)
WO (1) WO2022087891A1 (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000040715A (ja) * 1998-07-24 2000-02-08 Oki Electric Ind Co Ltd フリップチップ実装型半導体装置およびフリップチップ実装型半導体装置の製造方法
US6069323A (en) * 1997-01-21 2000-05-30 Dell Usa, L.P. Pad with indentations surface mount
US20170094789A1 (en) * 2015-09-25 2017-03-30 Samsung Electronics Co., Ltd. Printed circuit board
CN207783287U (zh) * 2018-01-29 2018-08-28 广东欧珀移动通信有限公司 电路板、成像装置及电子装置
CN110213880A (zh) * 2018-02-28 2019-09-06 苏州旭创科技有限公司 柔性电路板、电路板组件、光收发组件及光模块
CN110933836A (zh) * 2019-11-20 2020-03-27 武汉光谷信息光电子创新中心有限公司 柔性电路板、印刷电路板、软硬结合板及其制作方法
CN111564455A (zh) * 2020-05-20 2020-08-21 京东方科技集团股份有限公司 一种阵列基板、显示面板及显示装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8816512B2 (en) * 2011-07-28 2014-08-26 Lg Innotek Co., Ltd. Light emitting device module
TWI492456B (zh) * 2012-01-20 2015-07-11 Univ Nat Chiao Tung 具頻帶截止功能之超寬頻天線
WO2013179288A1 (en) * 2012-05-29 2013-12-05 Essence Solar Solutions Ltd. Self aligning soldering
JP6272173B2 (ja) * 2014-07-31 2018-01-31 京セラ株式会社 配線基板
KR102382004B1 (ko) * 2015-06-18 2022-03-31 삼성에스디아이 주식회사 연성인쇄회로기판
ES2894505T3 (es) * 2018-10-17 2022-02-14 3M Innovative Properties Co Ensamblaje de placa de circuito impreso encapsulada para detectar el voltaje de un cable de alimentación en una red de distribución de energía

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6069323A (en) * 1997-01-21 2000-05-30 Dell Usa, L.P. Pad with indentations surface mount
JP2000040715A (ja) * 1998-07-24 2000-02-08 Oki Electric Ind Co Ltd フリップチップ実装型半導体装置およびフリップチップ実装型半導体装置の製造方法
US20170094789A1 (en) * 2015-09-25 2017-03-30 Samsung Electronics Co., Ltd. Printed circuit board
CN207783287U (zh) * 2018-01-29 2018-08-28 广东欧珀移动通信有限公司 电路板、成像装置及电子装置
CN110213880A (zh) * 2018-02-28 2019-09-06 苏州旭创科技有限公司 柔性电路板、电路板组件、光收发组件及光模块
CN110933836A (zh) * 2019-11-20 2020-03-27 武汉光谷信息光电子创新中心有限公司 柔性电路板、印刷电路板、软硬结合板及其制作方法
CN111564455A (zh) * 2020-05-20 2020-08-21 京东方科技集团股份有限公司 一种阵列基板、显示面板及显示装置

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Publication number Publication date
US20220312592A1 (en) 2022-09-29
WO2022087891A1 (zh) 2022-05-05

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