CN114980557A

CN114980557A - Preparation process capable of optimizing welding of pins of USB device

Info

Publication number: CN114980557A
Application number: CN202210422905.2A
Authority: CN
Inventors: 莫其森
Original assignee: Carven Technology Wuxi Ltd
Current assignee: Carven Technology Wuxi Ltd
Priority date: 2022-04-21
Filing date: 2022-04-21
Publication date: 2022-08-30
Anticipated expiration: 2042-04-21
Also published as: CN114980557B

Abstract

The invention discloses a preparation process capable of optimizing the pin welding of a USB device, which is applied to the pin welding of the USB device with the length of the pin being less than the plate thickness, the diameter of the pin is expanded on the basis of the original aperture to form a compensation aperture, the compensation aperture is 12.5-25% of the original aperture, the corresponding pin hole is arranged at the position close to the center of a PCB, the pin is sent to a welding position through a conveyor belt, and the pin welding is carried out by adopting a wave soldering mode. By adopting the design scheme of the invention, the problem that when the length of the pin of the USB device is smaller than the plate thickness, only two welding pins on one side can be formed on the PCB, and the connection with the PCB is not stable enough can be solved, more solder paste can be pressed into the hole by designing the aperture expansion, a welding surface is formed on the surface of the USB pin which does not extend out, the connection stability is improved, and meanwhile, the solder paste which is in contact with the pin in the hole is increased, so that the structure of the connection of the welding surface is larger, and the shape is more stable.

Description

Preparation process capable of optimizing welding of pins of USB device

Technical Field

The invention relates to an improvement of a welding process, in particular to a preparation process capable of optimizing the welding of a pin of a USB device.

Background

In the actual PCB production and device assembly process, the following problems are encountered:

after the device is inserted into the PCB, the USB pin cannot extend out of the PCB due to too short length, the solder leg and the hole wall are tightly attached, so that the gap is very small, when the subsequent wave soldering is passed, the upward jet force of the wave crest sprayed by the nozzle cannot jet solder paste into the hole due to the undersize of the hole diameter, the solder leg cannot be sprayed by the solder paste, the tin climbing process cannot be realized, and the solder leg cannot be provided with the solder paste, so that the soldering cannot be realized.

For a typical pin bond, the conventional bond points should be four points, while if the bond feet are too short, the bond points can only have the top two.

Disclosure of Invention

The invention aims to: the invention aims to solve the problem that the stability of the whole device is influenced because the conventional pin is too short to be normally welded.

The technical scheme is as follows: in order to achieve the purpose, the invention provides the following technical scheme:

when the length of a pin of the USB device is smaller than the thickness of the plate, the pin is expanded on the basis of the corresponding original aperture of the USB pin to form a compensation aperture, the compensation aperture is 12.5-25% of the original aperture, the corresponding pin hole is arranged at a position close to the center of a PCB, the pin is conveyed to a welding position through a conveyor belt, and the pin is welded in a wave soldering mode.

Through increasing the aperture, can carry out the spouting inlet as much as possible with tin when crossing wave-soldering, optimize the welding, the aperture increases the back, there is bigger space surplus between pin and the pore wall, the spout spun wave crest upward jet power is with the better spout aperture of tin cream, tin cream can be according to climbing tin to each corner of pore wall behind the pin, make soldering tin more full as far as possible, furthermore, unnecessary tin cream can get into the PCB face that does not stretch out the pin in the route that forms, PCB face forming area at the pin of not stretching out is greater than the face of welding of pore face, make the USB device not only can be under a large amount of soldering tin extrudees, increase the stability of horizontal direction, it is spacing to carry out vertical direction to the pin through the overall structure that constitutes by the face of welding in and the pin hole simultaneously, increase vertical direction's stability.

The wave soldering mode is adopted because the wave soldering has higher spraying force, and simultaneously, because the spraying point of the wave soldering is at the center of a wave soldering device, the spraying force in the middle is larger than the spraying force at the periphery, the pin holes are correspondingly arranged at the positions close to the center of the PCB, and the solder paste can more easily enter the pin holes by matching with the hole diameter expansion of the pin holes to form the welding structure which is stable in the horizontal and vertical directions,

furthermore, before wave soldering, the PCB needs flux spraying and preheating processes.

Further, the solder feet formed after the USB device is placed on the PCB are parallel to the board feeding direction.

The arrangement direction of the holes is consistent with the flowing direction of tin, the flowing direction of the tin is consistent with that of the air knife, so that tin can be better climbed, the tin is fuller, and the insufficient soldering is reduced.

And further, the PCB subjected to wave soldering is sent out after an air cooling process.

Further, the compensating aperture diameter does not exceed 12.5% of the spacing between adjacent apertures.

Further, when the hole spacing is less than or equal to 0.8mm, the hole spacing is less than or equal to 0.0625 and the compensating hole diameter is less than or equal to 0.125; when 0.8mm < hole spacing ≤ 1.2mm, hole spacing ≤ 0.083 is not less than compensating hole diameter ≤ 0.125; when the hole spacing is >1.2mm, the compensation hole diameter is 0.125 hole spacing.

Has the advantages that: compared with the prior art, the invention has the advantages that:

by adopting the design scheme of the invention, the problem that when the length of the pin of the USB device is smaller than the plate thickness, only two welding pins on one side can be formed on the PCB, and the connection with the PCB is not stable enough can be solved, more solder paste can be pressed into the hole by designing the aperture expansion, a welding surface is formed on the surface of the USB pin which does not extend out, the connection stability is improved, and meanwhile, the solder paste which is in contact with the pin in the hole is increased, so that the structure of the connection of the welding surface is larger, and the shape is more stable.

Drawings

FIG. 1 is a schematic view of a soldering process according to the present invention;

FIG. 2 is a schematic view of a USB device according to the present invention.

Detailed Description

The present invention is further illustrated by the following figures and specific examples, which are to be understood as illustrative only and not as limiting the scope of the invention, which is to be given the full breadth of the appended claims and any and all equivalent modifications thereof which may occur to those skilled in the art upon reading the present specification.

Example 1

As shown in attached drawings 1-2, when the length of a pin of a USB device 1 is smaller than the thickness of the plate, the pin is expanded on the basis of the corresponding original aperture of the USB pin to form a compensation aperture, the compensation aperture is 12.5-25% of the original aperture, the corresponding pin hole is arranged at a position close to the center of a PCB, the pin is conveyed to a welding position through a conveyor belt, and the pin welding is carried out in a wave soldering mode. Reference numeral 4 in fig. 1 denotes a wave soldering process.

For example, on the basis of the conventional requirement of 0.4mm aperture, the aperture is enlarged to 0.45mm, and if the space is enough, the aperture is increased to 0.5 mm. In other words, for the situation, the large aperture of 0.05 mm-0.1 mm can be added on the basis of the original aperture compensation, and after the large aperture is increased, tin can be sprayed into the aperture as much as possible during wave soldering, so that the soldering is optimized.

before wave soldering, the PCB is subjected to flux spraying, which is denoted by reference numeral 2 in fig. 1, and preheating, which is denoted by reference numeral 3 in fig. 1.

The welding feet formed after the USB device is placed on the PCB are parallel to the board feeding direction.

The PCB after the wave soldering is sent out after passing through an air cooling process denoted by reference numeral 5 in fig. 1.

Reference numeral 6 in the figure is a central controller, and the connection among the steps can better complete the matching of adjacent equipment through the central controller, so that the energy is saved.

The compensating aperture diameter is no more than 12.5% of the adjacent aperture spacing.

When the hole spacing is less than or equal to 0.8mm, the hole spacing is less than or equal to 0.0625 and the compensation hole diameter is less than or equal to 0.125; when 0.8mm < hole spacing ≤ 1.2mm, hole spacing ≤ 0.083 is not less than compensating hole diameter ≤ 0.125; when the hole spacing is >1.2mm, the compensation hole diameter is 0.125 hole spacing.

Claims

1. A preparation process capable of optimizing welding of a pin of a USB device is characterized in that when the length of the pin of the USB device is smaller than the thickness of the plate: expanding the diameter of the USB pin on the basis of corresponding to the original aperture to form a compensation aperture, wherein the compensation aperture is 12.5-25% of the original aperture, arranging the corresponding pin hole at a position close to the center of the PCB, conveying the pin hole to a welding position through a conveying belt, and welding the pin by adopting a wave soldering mode.

2. The manufacturing process capable of optimizing the pin soldering of the USB device according to claim 1, wherein: before wave soldering, the PCB also needs flux spraying and preheating processes.

3. The manufacturing process capable of optimizing the pin soldering of the USB device according to claim 1, wherein: the welding feet formed after the USB device is placed on the PCB are parallel to the board feeding direction.

4. The manufacturing process capable of optimizing the pin soldering of the USB device according to claim 1, wherein: and sending out the PCB subjected to wave soldering after an air cooling process.

5. The manufacturing process capable of optimizing the pin soldering of the USB device according to claim 1, wherein: the compensating aperture diameter is no more than 12.5% of the adjacent aperture spacing.

6. The manufacturing process capable of optimizing the pin soldering of the USB device according to claim 5, wherein: when the hole spacing is less than or equal to 0.8mm, the hole spacing is less than or equal to 0.0625 and the compensation hole diameter is less than or equal to 0.125; when 0.8mm < hole spacing ≤ 1.2mm, hole spacing ≤ 0.083 is not less than compensating hole diameter ≤ 0.125; when the hole spacing is >1.2mm, the compensation hole diameter is 0.125 hole spacing.