CN114974645A - 银基多元合金粉末材料及其制备方法和应用 - Google Patents
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- 239000004332 silver Substances 0.000 title claims abstract description 73
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Abstract
本发明公开了银基多元合金粉末材料及其制备方法和应用。粉末材料包括如下以重量百分含量计的元素：Cu：5‑10％，Ni：1‑5％，V：0.1‑0.5％，余量为Ag。本发明采用真空感应熔炼法+气雾化工艺吹制并经球形造粒处理得到，通过控制增减Cu强化合金抗腐蚀和抗氧化性能；通过Ni细化合金晶粒，降低合金偏析；通过V提高合金硬度和强度等机械性能，以及改善抗硫化性能，尤其是可提高对硫化氢、二氧化硫及湿热气氛的抗腐蚀性能；通过球形造粒处理优化粉末材料流动性；粉末材料在经激光熔覆成型或激光增材制造处理后，所制熔覆层或沉积层组织均匀致密无偏析，且相较于纯银或银合金，抗氧化、抗硫化及机械性能有着大幅度提高。
Description
技术领域
本发明涉及合金技术领域，尤其涉及银基多元合金粉末材料及其制备方法和应用。
背景技术
纯银的低接触电阻和高导电性、高导热性、抗菌性等性能已经被广泛应用与光学材料、导电材料等领域；现阶段银粉末材料或银浆常作为导电材料广泛的用在电子产品、电接触器材中，如构建柔性电子线路，制备导电触面等。
目前使用纯银制备导电触面时，由于纯银粉末材料易氧化、易团聚等特性使得在通导大电流或外部硫化环境等苛刻条件下所导致的氧化、凹陷或粘结会影响导电能力，造成电量损失，威胁电气设备安全稳定运行。
因此，如何在保证银粉末材料制品具备高导电性能的情况下，提高其抗氧化、抗硫化和机械性能是本应用领域亟需解决的痛点。
发明内容
本发明的目的在于，针对现有技术的上述不足，提出一种提高抗氧化、抗硫化及机械性能的银基多元合金粉末材料及其制备方法和应用。
本发明的一种银基多元合金粉末材料，包括如下以重量百分含量计的元素：Cu：5-10％，Ni：1-5％，V：0.1-0.5％，余量为Ag和不可避免的杂质。
进一步的，所述银基多元合金粉末材料粒径范围在30-150μm。
一种银基多元合金粉末材料的制备方法，通过真空感应熔炼法加气雾化工艺吹制并经球形造粒处理得到银基多元合金粉末材料。
进一步的，所述银基多元合金粉末材料的霍尔流速检测优于30s/50g。
一种银基多元合金粉末材料的应用，所述的银基多元合金粉末材料经激光熔覆或激光增材制造的方法加工成型，得到的银基多元合金制品。
本发明与现有技术方案相比的有益效果在于，采用真空感应熔炼法+气雾化工艺吹制并经球形造粒处理得到的银基多元合金粉末材料，通过控制增减合金成分中的合金元素种类和含量，最大程度保留了银基合金中Ag元素的相关性能，可以在粉末材料制备阶段通过工艺方法控制增减合金元素Cu强化合金抗腐蚀和抗氧化性能；通过合金元素Ni细化合金晶粒，降低合金偏析；通过合金元素V提高合金硬度和强度等机械性能，以及改善抗硫化性能，尤其是可提高对硫化氢、二氧化硫及湿热气氛的抗腐蚀性能；通过球形造粒处理优化粉末材料流动性；上述银基多元合金粉末材料可以经激光熔覆或激光增材制造的方法加工成型，得到制品，本发明的银基多元合金粉末材料在经激光熔覆成型或激光增材制造处理后，所制熔覆层或沉积层组织均匀致密无偏析，且相较于纯银或银合金，抗氧化、抗硫化及机械性能有着大幅度提高。
附图说明
图1a和图1b均是银基多元合金粉末材料的扫描电镜照片；
图2是银基多元合金粉末材料的能谱图像；
图3a-3d是图2的谱图照片；
图4是银基多元合金粉末材料经激光加工制备银层制品及打磨处理的照片；
图5是银基多元合金制品的维氏硬度检测表；
图6是银基多元合金制品和纯银制品在硫化环境长时间大电流工作后的对比照片。
具体实施方式
以下是本发明的具体实施例并结合附图，对本发明的技术方案作进一步的描述，但本发明并不限于这些实施例。
实施例1
以重量百分含量计(wt％)，配比银基多元合金：Cu：5％，Ni：1％，V：0.1％，余量为Ag和不可避免的杂质；将所述银基多元合金采用真空感应熔炼炉炼得母合金锭，然后经过真空气雾化工艺吹制银基多元合金粉末，并对合金粉末进行造粒处理成球形粉末后，配合霍尔流速计对上述粉末进行分筛出粒径范围在30-150μm且流动性优的银基多元合金粉末。
实施例2
以重量百分含量计(wt％)，配比银基多元合金：Cu：10％，Ni：5％，V：0.5％，余量为Ag和不可避免的杂质；将所述银基多元合金采用真空感应熔炼炉炼得母合金锭，然后经过真空气雾化工艺吹制银基多元合金粉末，并对合金粉末进行造粒处理成球形粉末后，配合霍尔流速计对上述粉末进行分筛出粒径范围在30-150μm且流动性优的银基多元合金粉末。
实施例3
以重量百分含量计(wt％)，配比银基多元合金：Cu：7％，Ni：3％，V：0.3％，余量为Ag和不可避免的杂质；将所述银基多元合金采用真空感应熔炼炉炼得母合金锭，然后经过真空气雾化工艺吹制银基多元合金粉末，并对合金粉末进行造粒处理成球形粉末后，配合霍尔流速计对上述粉末进行分筛出粒径范围在30-150μm且流动性优的银基多元合金粉末。
对比例1
实施例1中V的含量为零，Cu和Ni的含量不变，其他操作与实施例1相同，制备得到球形粉末。
图1a和图1b均是银基多元合金粉末材料的扫描电镜照片，从上述图可以看出，本申请制备的粉末材料球形度好，图2是银基多元合金粉末材料的能谱图像；图3a-3d是图2的谱图照片；可以看出本申请的主要元素的合金元素，及其本申请的限定的合金元素范围是有效真实的。
如图4和图5将实施例1中所述银基多元合金粉末材料通过激光加工的方式在T2铜板上制备出银层制品，检测银层内部的硬度分布，得到银层内部的平均维氏硬度为166.8HV0.2，较纯银材质的硬度高。
将对比例1中所述银基多元合金粉末材料通过激光加工的方式在T2铜板上制备出银层制品，检测银层内部的硬度分布，得到银层内部的平均维氏硬度比实施例1得到的硬度低，较纯银材质的硬度高。
结合图6可知，在已知硫化环境下以银基多元合金制品(图中左侧)和纯银制品(图中右侧)为电接触面，进行长时间的大电流通流工作后，可以发现银基多元合金制品(图中左侧)相比于纯银制品(图中右侧)的表面未发现明显氧化和蚀损。
所述的银基多元合金粉末材料可以经激光熔覆或激光增材制造的方法加工成型，得到的银基多元合金制品在硬度等机械性能方面较纯银制品高，且在硫化环境中长时间大电流通流工作时抗硫化、抗氧化性能相比纯银制品有提高。
以上未涉及之处，适用于现有技术。
虽然已经通过示例对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上示例仅是为了进行说明，而不是为了限制本发明的范围，本发明所属技术领域的技术人员可以对所描述的具体实施例来做出各种各样的修改或补充或采用类似的方式替代，但并不会偏离本发明的方向或者超越所附权利要求书所定义的范围。本领域的技术人员应该理解，凡是依据本发明的技术实质对以上实施方式所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围。
Claims (5)
1.一种银基多元合金粉末材料，其特征在于，包括如下以重量百分含量计的元素：Cu：5-10％，Ni：1-5％，V：0.1-0.5％，余量为Ag和不可避免的杂质。
2.如权利要求1所述的一种银基多元合金粉末材料，其特征在于，所述银基多元合金粉末材料粒径范围在30-150μm。
3.如权利要求1所述的一种银基多元合金粉末材料，其特征在于，所述银基多元合金粉末材料的霍尔流速检测优于30s/50g。
4.如权利要求1-3任一项所述的一种银基多元合金粉末材料的制备方法，其特征在于：通过真空感应熔炼法加气雾化工艺吹制并经球形造粒处理得到银基多元合金粉末材料。
5.如权利要求1-3任一项所述的一种银基多元合金粉末材料的应用，其特征在于：所述的银基多元合金粉末材料经激光熔覆或激光增材制造的方法加工成型，得到的银基多元合金制品。
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| CN113564410A (zh) * | 2021-08-18 | 2021-10-29 | 沈阳大陆激光先进制造技术创新有限公司 | 一种激光制造应用于导电横臂的高强高导铜合金材料及其制备工艺 |
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| CN116575022A (zh) * | 2023-03-31 | 2023-08-11 | 中国长江电力股份有限公司 | 铜基材上激光熔覆银层的方法及其在水电机组大电流铜母线修复中的应用 |
| CN116575022B (zh) * | 2023-03-31 | 2023-11-28 | 中国长江电力股份有限公司 | 铜基材上激光熔覆银层的方法及其在水电机组大电流铜母线修复中的应用 |
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