CN114973979A - Display module and display device - Google Patents
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- CN114973979A CN114973979A CN202210557578.1A CN202210557578A CN114973979A CN 114973979 A CN114973979 A CN 114973979A CN 202210557578 A CN202210557578 A CN 202210557578A CN 114973979 A CN114973979 A CN 114973979A
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Abstract
The application provides a display module and a display device, wherein the display module comprises a display area, a splicing area and a binding area, wherein the splicing area and the binding area are respectively positioned on different sides of the display area; the display module comprises at least two display panels arranged along a first direction, each display panel comprises a substrate, a display part arranged on the substrate and positioned in the display area, and a binding part arranged on the substrate and positioned in the binding area, and the binding part and the display part are arranged in parallel along the first direction; this application still includes the first encapsulation layer adjacent with the display part through setting up display panel, and first encapsulation layer is including being located the first encapsulation subtotal of splice area, in arbitrary two adjacent display panel, all be equipped with first encapsulation subtotal between two display parts, and the first encapsulation subtotal of another adjacent display panel of one of them display panel encapsulates the subtotal and sets up side by side to the seamless concatenation of display module assembly has been realized, and then realize that display device has that the frame is narrow, seamless demonstration's characteristics.
Description
Technical Field
The application relates to the technical field of display, in particular to a display module and a display device.
Background
With the development of display technologies, the demand of various super-large-sized display devices is increasing day by day, and the application of the super-large-sized display devices in various scenes is becoming more and more extensive, and therefore, the tiled display devices are gaining more and more importance, wherein compared with Liquid Crystal Displays (LCDs) and organic light-emitting diodes (OLEDs), Micro light-emitting diodes (Mini/Micro light-emitting diodes, Mini/-LEDs/Micro-LEDs, collectively called MLEDs), the tiled display devices have advantages of lower power consumption, lower response time, higher PPI, higher color gamut, and the like, and become the mainstream of the display technologies.
In the prior art, a splicing technology is usually adopted to realize large-size display of an MLED, but at present, a frame with a certain width needs to be reserved on the periphery of a display area of an MLED display screen to accommodate components such as a driving circuit, and therefore when the MLED display screen is spliced, a splicing seam is formed on the frame between adjacent MLED display screens, continuity and integrity of an image are damaged, and splicing effect is seriously affected.
Disclosure of Invention
The embodiment of the application provides a display module and a display device, which are used for relieving the defects in the related technology.
In order to realize the above functions, the technical solutions provided in the embodiments of the present application are as follows:
the embodiment of the application provides a display module, which comprises a display area, a splicing area and a binding area, wherein the splicing area and the binding area are respectively positioned on different sides of the display area;
the display module comprises at least two display panels arranged along a first direction, each display panel comprises a substrate, a display part arranged on the substrate and positioned in the display area, and a binding part arranged on the substrate and positioned in the binding area, and the binding part and the display part are arranged in parallel along the first direction;
the display panel further comprises a first packaging layer adjacent to the display parts, the first packaging layer comprises first packaging sub-parts located in the splicing area, the first packaging sub-parts are arranged between any two adjacent display panels and between the two display parts, and the first packaging sub-part of one display panel is arranged in parallel with the first packaging sub-part of the other adjacent display panel.
In the display module provided in the embodiment of the present application, the display module includes at least two display panel groups arranged along a second direction, each display panel group includes two display panels arranged along a first direction, and the first direction is set to form a preset included angle with the second direction;
in any two adjacent display panels in the two adjacent display panel groups, the first packaging sub-portion is arranged between the two display portions, and the first packaging sub-portion of one display panel is arranged in parallel with the first packaging sub-portion of the other display panel.
In the display module provided by the embodiment of the application, the display panel further includes a second encapsulation layer located on one side of the display portion, which is far away from the substrate, the second encapsulation layer is located in the display area, and an orthographic projection of the second encapsulation layer in a direction perpendicular to the display module covers the display portion;
the first packaging layer further comprises a second packaging sub-part located on one side, far away from the display part, of the second packaging layer, the second packaging sub-part is located in the display area and the binding area, and the orthographic projection of the second packaging sub-part in the direction perpendicular to the display module group covers the second packaging layer and the binding part.
In the display module provided in the embodiment of the present application, the first encapsulation layer is an inorganic encapsulation layer, and the second encapsulation layer is an organic encapsulation layer.
In the display module provided in the embodiment of the present application, the transmittance of the first encapsulation layer is greater than 99%, and the transmittance of the second encapsulation layer is greater than 95%.
In the display module provided by the embodiment of the application, in the splicing region, along a direction perpendicular to the display module, the width range of the first packaging layer is 100-200 micrometers.
In the display module provided in the embodiment of the present application, the display panel further includes a third encapsulation layer located on a side of the first encapsulation sub-portion away from the second encapsulation layer, and the third encapsulation layer is located in the splicing region;
in any two adjacent display panels, the third packaging layer is arranged between the two first packaging subsections, and the third packaging layer of one display panel is arranged in parallel with the third packaging layer of the other adjacent display panel.
In the display module provided in the embodiment of the present application, the third encapsulation layer is an organic encapsulation layer.
In the display module provided in the embodiment of the application, in the splicing region, along a direction perpendicular to the display module, a sum of widths of the third encapsulation layer and the first encapsulation sub-portion ranges from 100 micrometers to 200 micrometers.
The embodiment of the application provides a display device, including any one of the above-mentioned display module assembly.
The beneficial effects of the embodiment of the application are as follows: the embodiment of the application is through setting up the display module assembly includes the display area, splice area and binds the district, the splice area with it is located respectively to bind the district the difference side of display area, the display module assembly includes at least two display panel that set up along first direction, display panel includes the basement, is located display part in the display area and is located bind the portion of distinguishing, bind the portion with the display part is followed first direction sets up side by side, display panel still include with the first encapsulation layer that the display part is adjacent, first encapsulation layer is including being located first encapsulation subterminal in the splice area, arbitrary adjacent two among the display panel, two all be equipped with between the display part first encapsulation subterminal, and wherein one display panel first encapsulation subterminal and adjacent another display panel first encapsulation subterminal sets up side by side, therefore, seamless splicing of the display module is realized, and the display device has the characteristics of narrow frame and seamless display.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic view of a first structure of a display module according to an embodiment of the present disclosure;
fig. 2 is a first top cross-sectional view of a display module according to an embodiment of the present disclosure;
fig. 3 is a schematic view of a second structure of a display module according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;
fig. 5 is a second top cross-sectional view of a display module according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.
The embodiment of the application provides a display module and a display device. The following are detailed below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.
Referring to fig. 1 to 5, an embodiment of the present application provides a display module and a display device, where the display module 1 includes a display area a, a splicing area B, and a binding area C, and the splicing area B and the binding area C are respectively located at different sides of the display area a;
the display module 1 comprises at least two display panels 100 arranged along a first direction X, each display panel 100 comprises a substrate 10, a display part 20 arranged on the substrate 10 and located in the display area a, and a binding part 30 arranged on the substrate 10 and located in the binding area C, and the binding part 30 and the display part 20 are arranged in parallel along the first direction X;
the display panel 100 further includes a first packaging layer 41 adjacent to the display portions 20, the first packaging layer 41 includes a first packaging sub-portion 41A located in the splicing region B, the first packaging sub-portion 41A is disposed between two display portions 20 in any two adjacent display panels 100, and the first packaging sub-portion 41A of one display panel 100 is disposed in parallel with the first packaging sub-portion 41A of another adjacent display panel 100.
It can be understood that, in the prior art, a splicing technology is usually adopted to implement large-size display of a Micro light emitting diode (Mini/Micro lighting emitting diode, Mini/-LED/Micro-LED, collectively called MLED), but at present, a frame with a certain width needs to be reserved on the periphery of a display area of an MLED display screen to accommodate components such as a driving circuit, and therefore, when the MLED display screens are spliced, a seam is formed between frames between adjacent MLED display screens, which destroys continuity and integrity of an image and seriously affects a splicing effect.
This application embodiment is through setting up display module assembly 1 includes display area A, splice area B and binds district C, splice area B with it is located respectively to bind district C the different sides of display area A, display module assembly 1 includes at least two display panel 100 that set up along first direction X, display panel 100 includes base 10, is located display part 20 in the display area A and is located bind the portion 30 that binds in district C, bind portion 30 with display part 20 is followed first direction X sets up side by side, display panel 100 still include with the first encapsulation layer 41 that display part 20 is adjacent, first encapsulation layer 41 is including being located first encapsulation sub-part 41A in splice area B, arbitrary adjacent two in display panel 100, two all be equipped with between display part 20 first encapsulation sub-part 41A, and wherein one of display panel 100 first encapsulation sub-part 41A and adjacent another display panel 100's institute The first packaging sub-parts 41A are arranged in parallel, so that seamless splicing of the display module 1 is realized, and the display device has the characteristics of narrow frame and seamless display.
The technical solution of the present application will now be described with reference to specific embodiments.
In one embodiment, please combine fig. 1 and fig. 2; fig. 1 is a first schematic structural diagram of a display module provided in an embodiment of the present application; fig. 2 is a first top cross-sectional view of a display module according to an embodiment of the present disclosure.
This embodiment provides a display module assembly 1, display module assembly 1 includes display area a, splice area B and binding area C, splice area B with binding area C is located respectively the different sides of display area a.
The display module 1 comprises at least two display panels 100 arranged along a first direction X, each display panel 100 comprises a substrate 10, a display part 20 arranged on the substrate 10 and located in the display area a, and a binding part 30 arranged on the substrate 10 and located in the binding area C, and the binding part 30 and the display part 20 are arranged in parallel along the first direction X; it can be understood that, in the display module 1, the splicing region B and the binding region C are respectively located at different sides of the display region a, so that the binding portion 30 is located outside the splicing region B, thereby implementing seamless display of two adjacent display panels 100 at the splicing position.
In this embodiment, the substrate 10 may include a rigid material or a flexible material, when the material of the substrate 10 is a rigid material, the material of the substrate 10 may be metal or glass, and when the material of the substrate 10 is a flexible material, the material of the substrate 10 may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane-based resin, cellulose resin, silicone resin, polyimide-based resin, and polyamide-based resin; it is to be understood that the present embodiment does not specifically limit the material of the substrate 10.
The display part 20 includes a thin film transistor layer 21 and a display functional layer 22 stacked on the substrate 10, the display functional layer 22 includes a plurality of light emitting devices 221, and the bonding part 30 and the thin film transistor layer 21 are disposed in parallel along the first direction X, where, as will be described below, the light emitting devices 221 are Mini light emitting diodes (Mini/-LEDs) in this embodiment, where the light emitting devices 221 may be transferred onto the thin film transistor layer 21 through a bulk transfer process or a wave Soldering (SMT) process, which is not particularly limited in this embodiment.
Further, in the present embodiment, the binding part 30 includes a wiring layer 31 extending from the display area a into the binding area C, and the display panel 100 further includes a circuit board 60 electrically connected to the wiring layer 31; it can be understood that the display area a has the light emitting device 221 therein, the wiring layer 31 includes a plurality of metal wirings therein, and the plurality of metal wirings extend into the display area a and are in signal connection with the light emitting device 221 to implement transmission of display signals.
It should be noted that the thin film transistor layer 21 includes, but is not limited to, an active layer, a gate insulating layer, a gate electrode, an interlayer insulating layer, a source drain electrode layer, a passivation layer, and other common film layers, which are not described in this embodiment again, it can be understood that the type or structure of the thin film transistor is not specifically limited in this embodiment, preferably, the thin film transistor layer 21 includes a plurality of top gate thin film transistors, and the light transmittance of the thin film transistor layer 21 is greater than 80%; in specific implementation, the thin-film transistor layer 21 may be configured to implement a driving or switching function of the light emitting device 221.
Further, in this embodiment, the display module 1 includes at least two display panel sets 1000 arranged along a second direction Y, each of the display panel sets 1000 includes two display panels 100 arranged along the first direction X, and the first direction X is set to form a preset included angle with the second direction Y; it should be noted that, in this embodiment, the range of the preset included angle and the directions of the first direction X and the second direction Y are not limited, but for convenience of description, the preset included angle is 90 °, the first direction is an X direction, and the second direction is a Y direction, which are taken as examples for illustration in this embodiment.
It should be noted that, in this embodiment, the technical solution of the present application is exemplified by the case that the display module 1 includes two display panel sets 1000 arranged along the second direction Y, and each display panel set 1000 includes two display panels 100 arranged along the first direction X.
In this embodiment, the display panel 100 further includes a first packaging layer 41 adjacent to the display portions 20, the first packaging layer 41 includes a first packaging sub-portion 41A located in the splicing region B, in any two adjacent display panels 100 arranged along the first direction X, the first packaging sub-portion 41A is arranged between the two display portions 20, and the first packaging sub-portion 41A of one display panel 100 is arranged in parallel with the first packaging sub-portion 41A of the other adjacent display panel 100.
Specifically, in this embodiment, in any two adjacent display panels 100 in the two adjacent display panel groups 1000 arranged along the second direction Y, the first packaging sub-portion 41A is disposed between the two display portions 20, and the first packaging sub-portion 41A of one display panel 100 and the first packaging sub-portion 41A of the other adjacent display panel 100 are disposed in parallel, preferably, in the splicing region B, along a direction perpendicular to the display module 1, a width range of the first packaging layer 41 is 100 micrometers to 200 micrometers.
It can be understood that, in the present embodiment, by disposing the first encapsulation layer 41 including the first encapsulation sub-portions 41A in the splicing region B, in any two adjacent display panels 100 disposed along the first direction X, the first encapsulation sub-portion 41A is disposed between two display portions 20, and in any two adjacent display panels 100 disposed along the second direction Y, the first encapsulation sub-portion 41A is disposed between two display portions 20, and the first encapsulation sub-portion 41A of one display panel 100 is disposed in parallel with the first encapsulation sub-portion 41A of another display panel 100, that is, in the present embodiment, along the first direction X and along the second direction Y, any two adjacent display panels 100 are attached and spliced by the first encapsulation sub-portions 41A, so as to implement seamless packaging of two adjacent display panels 100, and further, the display module 1 has the characteristics of narrow frame and seamless display, wherein compared with the existing LCD display device in which the width of the minimum joint is 1700 microns and the existing OLED display device in which the width of the minimum joint is 3500 microns, the display module 1 provided by the embodiment has a joint gap of only about 400 microns, the width of the joint gap is greatly reduced, and the display module has a wide application prospect.
In this embodiment, the display panel 100 further includes a second encapsulation layer 42 located on a side of the display portion 20 away from the substrate 10, the second encapsulation layer 42 is located in the display area a, and an orthogonal projection of the second encapsulation layer 42 in a direction perpendicular to the display module 1 covers the display portion 20; specifically, the second encapsulation layer 42 is an organic encapsulation layer, the material of the second encapsulation layer 42 includes, but is not limited to, materials such as silica gel, epoxy resin, and the like, the transmittance of the material of the second encapsulation layer 42 is greater than 95%, and the shrinkage rate is lower than 4%, the second encapsulation layer 42 is disposed on one side of the display function layer 22 away from the thin film transistor layer 21 and covers the plurality of light emitting devices 221, so as to implement encapsulation protection for the plurality of light emitting devices 221, and prevent failure problems of the light emitting devices 221 caused by external environment interference, such as: water vapor, oxygen, and the like.
Wherein the curing manner of the second encapsulation layer 42 includes Ultraviolet (UV) curing or heating curing, or ultraviolet and heating mixed curing, and the curing temperature of the second encapsulation layer 42 is lower than 150 ℃, preferably, the curing temperature of the second encapsulation layer 42 is lower than 100 ℃.
Further, the first packaging layer 41 further includes a second packaging sub-portion 41B located on a side of the second packaging layer 42 away from the display portion 20, the second packaging sub-portion 41B is located in the display area a and the binding area C, and an orthogonal projection of the second packaging sub-portion 41B in a direction perpendicular to the display module 1 covers the second packaging layer 42 and the binding portion 30.
Specifically, as shown in fig. 1, the second packaging sub-section 41B packages a side of the display section 20 away from the substrate 10, the second packaging sub-section 41B packages a side of the display section 20 close to the binding section 30, the second packaging sub-section 41B packages a side of the binding section 30 away from the substrate 10, and the second packaging sub-section 41B packages a side of the substrate 10 close to the binding section 30; preferably, the first encapsulation layer 41 is an inorganic encapsulation layer, the material of the first encapsulation layer 41 includes but is not limited to at least one of silicon nitride SiNx, titanium dioxide TiO2, and silicon oxide SiOx, and the transmittance of the first encapsulation layer 41 is greater than 99%, it can be understood that, in this embodiment, by setting the transmittance of the first encapsulation layer 41 to be greater than 99% and the transmittance of the second encapsulation layer 42 to be greater than 95%, on the premise that the light extraction effect of the display panel 100 is not affected, encapsulation protection is implemented on the display panel 100, so as to improve the service life of the display panel 100; moreover, the second packaging sub-part 41B can effectively improve the binding strength by packaging the side of the binding part 30 away from the substrate 10, and prevent the metal of the binding part 30 from being oxidized; it should be noted that the first encapsulation layer 41 may be prepared by using a method such as chemical vapor deposition or atomic layer deposition, which is not limited in this embodiment.
In this embodiment, the display module 1 further includes a glass cover 50(CoverGlass, CG) located on a side of the second packaging sub-portion 41B away from the substrate 10, wherein an orthographic projection of the glass cover 50 in a direction perpendicular to the display module 1 covers the second packaging sub-portion 41B, a surface of the glass cover 50 close to the second packaging sub-portion 41B is parallel to a surface of the second packaging sub-portion 41B close to the glass cover 50, and the second packaging sub-portion 41B can provide a flat supporting surface for the glass cover 50.
Specifically, the display module 1 includes a plurality of glass cover plates 50, one glass cover plate 50 corresponds to one display panel 100, and two adjacent glass cover plates 50 are attached and encapsulated in the splicing region B, so that the glass cover plates 50 are integrated; the thickness of the glass cover plate 50 may be selected according to actual process conditions, which is not limited in this embodiment.
Please refer to fig. 3, a second structural schematic diagram of the display module 1 provided in the embodiment of the present application, in another embodiment, the first encapsulation layer 41 further includes a third encapsulation sub-layer 41C located on a side of the substrate 10 away from the display portion 20, and the third encapsulation sub-layer 41C encapsulates the side of the substrate 10 away from the display portion 20, so as to further improve the lifetime of the display module 1, and the first encapsulation layer 41 is utilized to form an effective protection for the display panel 100.
Please refer to fig. 4 and 5; fig. 4 is a schematic structural diagram of a third display module provided in the embodiment of the present application; fig. 5 is a second top cross-sectional view of a display module according to an embodiment of the present disclosure.
In another embodiment, the structure of the display module is similar to/the same as the first structure of the display module provided in the above embodiment, and please refer to the description of the display module in the above embodiment, which is not repeated herein, and the difference between the two is only:
in this embodiment, the display panel 100 further includes a third packaging layer 43 located on a side of the first packaging sub-portion 41A away from the second packaging layer 42, and the third packaging layer 43 is located in the splicing region B; in any two adjacent display panels 100, the third encapsulation layer 43 is disposed between the two first encapsulation subsections 41A, and the third encapsulation layer 43 of one of the display panels 100 is disposed in parallel with the third encapsulation layer 43 of the other adjacent display panel 100; preferably, in the splicing region B, along a direction perpendicular to the display module 1, a sum of widths of the third encapsulation layer 43 and the first encapsulation sub-portion 41A ranges from 100 micrometers to 200 micrometers, wherein the width of the third encapsulation layer 43 is less than 300 micrometers, the width of the first encapsulation sub-portion 41A is less than 15 micrometers, preferably, the width of the third encapsulation layer 43 is less than 200 micrometers, and the width of the first encapsulation sub-portion 41A ranges from 5 micrometers to 10 micrometers.
It can be understood that, in the present embodiment, the display panel 100 includes the third encapsulating layer 43 located in the splicing region B, wherein, in any two adjacent display panels 100, the third encapsulating layer 43 is disposed between two first encapsulating sub-portions 41A, and the third encapsulating layer 43 of one of the display panels 100 and the third encapsulating layer 43 of another adjacent display panel 100 are disposed in parallel, that is, in the present embodiment, along the first direction X and along the second direction Y, any two adjacent display panels 100 are bonded and spliced by the third encapsulating layer 43, so as to implement seamless encapsulation of two adjacent display panels 100, and further implement that the display module 1 has the characteristics of narrow frame and seamless display, wherein, compared with the existing LCD display device, the width of the smallest splicing seam is 1700 micrometers, Compared with the existing OLED display device that the width of the minimum splicing seam is 3500 micrometers, the splicing seam of the display module 1 provided by the embodiment is only about 400 micrometers, the width of the splicing seam is greatly reduced, and the OLED display device has a wide application prospect.
It should be noted that, compared to the above embodiment, two adjacent display panels 100 are bonded and spliced through the first packaging sub-portion 41A, because the first packaging sub-portion 41A is an inorganic packaging layer, when two adjacent first packaging sub-portions 41A are bonded, the inorganic packaging layer is easily subjected to external force impact to generate cracks, thereby causing packaging failure, in this embodiment, two adjacent display panels 100 are bonded and spliced through the third packaging layer 43, the third packaging layer 43 is an organic packaging layer, and by adopting a composite packaging layer composed of an inorganic layer and an organic layer in the splicing region B, the composite packaging layer has a better packaging effect, thereby improving the splicing effect of two adjacent display panels 100.
Specifically, the third encapsulating layer 43 is disposed around the display panel 100, the third encapsulating layer 43 encapsulates a side of the first encapsulating sub-portion 41A away from the second encapsulating layer 42, the third encapsulating layer 43 encapsulates a side of the second encapsulating sub-portion 41B away from the bonding portion 30, and the third encapsulating layer 43 encapsulates a side of the second encapsulating sub-portion 41B away from the substrate 10; preferably, the third encapsulation layer 43 is an organic encapsulation layer, and the third encapsulation layer43 include, but are not limited to, epoxy, acrylic, and polyurethane, and the third encapsulant layer 43 has a permeability of greater than 90% and a water vapor permeability (WVTR) of less than 4g/m 2 24h, so as to further protect the plurality of light emitting devices 221 from failure caused by external environment interference, such as: water vapor, oxygen, and the like.
The present embodiment provides a display device, including the display module described in any of the above embodiments.
It is understood that the light emitting module has been described in detail in the above embodiments, and the description is not repeated here.
In specific application, the display device can be a display screen of a smart phone, a tablet computer, a notebook computer, an intelligent bracelet, an intelligent watch, intelligent glasses, an intelligent helmet, a desktop computer, an intelligent television or a digital camera, and even can be applied to an electronic device with a flexible display screen.
To sum up, the application provides a display module assembly and display device, through setting up the display module assembly includes the display area, splice area and binds the district, splice area with bind the district and be located respectively the different sides of display area, the display module assembly includes at least two display panel that set up along the first direction, display panel includes the basement, is located display part in the display area and is located bind the portion in the district, bind the portion with the display part is followed the first direction sets up side by side, display panel still include with the first encapsulation layer that the display part is adjacent, first encapsulation layer is including being located first encapsulation subtotal arbitrary adjacent two in the splice area in the display panel, two all be equipped with between the display part first encapsulation subtotal adjacent another display panel first encapsulation subtotal set up side by side, therefore, seamless splicing of the display module is realized, and the display device has the characteristics of narrow frame and seamless display.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The display module and the display device provided by the embodiment of the present application are described in detail above, and a specific example is applied to explain the principle and the implementation manner of the present application, and the description of the above embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A display module is characterized by comprising a display area, a splicing area and a binding area, wherein the splicing area and the binding area are respectively positioned on different sides of the display area;
the display module comprises at least two display panels arranged along a first direction, each display panel comprises a substrate, a display part arranged on the substrate and positioned in the display area, and a binding part arranged on the substrate and positioned in the binding area, and the binding part and the display part are arranged in parallel along the first direction;
the display panel further comprises a first packaging layer adjacent to the display parts, the first packaging layer comprises first packaging sub-parts located in the splicing area, the first packaging sub-parts are arranged between any two adjacent display panels and between the two display parts, and the first packaging sub-part of one display panel is arranged in parallel with the first packaging sub-part of the other adjacent display panel.
2. The display module according to claim 1, wherein the display module comprises at least two display panel groups arranged along a second direction, each display panel group comprises two display panels arranged along the first direction, and the first direction is arranged to form a predetermined included angle with the second direction;
in any two adjacent display panels in the two adjacent display panel groups, the first packaging sub-portion is arranged between the two display portions, and the first packaging sub-portion of one display panel is arranged in parallel with the first packaging sub-portion of the other display panel.
3. The display module according to claim 2, wherein the display panel further comprises a second encapsulation layer located on a side of the display portion away from the substrate, the second encapsulation layer being located in the display area, and an orthographic projection of the second encapsulation layer in a direction perpendicular to the display module covers the display portion;
the first packaging layer further comprises a second packaging sub-part located on one side, far away from the display part, of the second packaging layer, the second packaging sub-part is located in the display area and the binding area, and the orthographic projection of the second packaging sub-part in the direction perpendicular to the display module group covers the second packaging layer and the binding part.
4. The display module of claim 3, wherein the first encapsulation layer is an inorganic encapsulation layer and the second encapsulation layer is an organic encapsulation layer.
5. The display module of claim 4, wherein the transmittance of the first encapsulant layer is greater than 99% and the transmittance of the second encapsulant layer is greater than 95%.
6. The display module according to claim 5, wherein the width of the first encapsulation layer in the stitching region along a direction perpendicular to the display module is in a range of 100-200 μm.
7. A display module according to claim 3, wherein the display panel further comprises a third encapsulation layer on a side of the first encapsulation subsection remote from the second encapsulation layer, the third encapsulation layer being located within the stitching region;
in any two adjacent display panels, the third packaging layer is arranged between the two first packaging subsections, and the third packaging layer of one display panel is arranged in parallel with the third packaging layer of the other adjacent display panel.
8. The display module of claim 7, wherein the third encapsulation layer is an organic encapsulation layer.
9. The display module according to claim 8, wherein a sum of the widths of the third encapsulation layer and the first encapsulation subsection in a direction perpendicular to the display module within the stitching region is in a range of 100-200 microns.
10. A display device comprising a display module according to any one of claims 1 to 9.
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| CN114973979B (en) | 2024-02-20 |
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