CN113054131A - Display panel, display device and manufacturing method of display panel - Google Patents
Display panel, display device and manufacturing method of display panel Download PDFInfo
- Publication number
- CN113054131A CN113054131A CN202110253390.3A CN202110253390A CN113054131A CN 113054131 A CN113054131 A CN 113054131A CN 202110253390 A CN202110253390 A CN 202110253390A CN 113054131 A CN113054131 A CN 113054131A
- Authority
- CN
- China
- Prior art keywords
- layer
- display panel
- sub
- color film
- film layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 239000010410 layer Substances 0.000 claims abstract description 346
- 239000012790 adhesive layer Substances 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims abstract description 29
- 238000004806 packaging method and process Methods 0.000 claims abstract description 16
- 238000005538 encapsulation Methods 0.000 claims description 73
- 239000012044 organic layer Substances 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 19
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 239000010408 film Substances 0.000 description 85
- 230000000694 effects Effects 0.000 description 22
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 11
- 239000003086 colorant Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000005525 hole transport Effects 0.000 description 4
- 150000002632 lipids Chemical class 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 2
- 238000005234 chemical deposition Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- DOTMOQHOJINYBL-UHFFFAOYSA-N molecular nitrogen;molecular oxygen Chemical compound N#N.O=O DOTMOQHOJINYBL-UHFFFAOYSA-N 0.000 description 1
- 239000001272 nitrous oxide Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the application discloses a display panel, a display device and a manufacturing method of the display panel. The display panel comprises an array substrate, a light emitting layer and an encapsulating layer, wherein the light emitting layer is arranged on the array substrate, the encapsulating layer is arranged on the light emitting layer, the encapsulating layer comprises a first sub-encapsulating layer, a color film layer and a second sub-encapsulating layer which are sequentially arranged on the light emitting layer, and at least one side surface of the color film layer is provided with an adhesive layer. The embodiment of the application can increase the interface adhesion between the color film layer and the packaging layer by arranging the color film layer in the packaging layer and arranging the bonding layer on at least one side surface of the color film layer, thereby avoiding the failure of the display panel caused by the falling off of the color film layer in the manufacturing or using process of the display panel.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel, a display device and a manufacturing method of the display panel.
Background
With the development of display panels towards light, thin, low power consumption and high reliability, currently, the display panels adopt a top emission device structure design in the field of mobile display to obtain a display effect with high aperture ratio and high color purity. Several companies and research institutes have proposed techniques for making color filters on thin film packages instead of circular polarizers to achieve higher transmittance and lower thickness of display panels.
At present, in order to further improve the viewing angle of the display panel, the color film layer is often disposed in the encapsulation layer to shorten the distance between the color film layer and the light emitting layer, but the adhesion between the color film layer and the encapsulation layer is poor, and the color film layer is easy to fall off during the manufacturing or using process of the display panel, thereby causing the failure of the display panel.
Disclosure of Invention
The embodiment of the application provides a display panel, a display device and a manufacturing method of the display panel, and can solve the problems that in the prior art, the adhesion between a color film layer and a packaging layer is poor, and the color film layer is easy to fall off.
An embodiment of the present application provides a display panel, including:
an array substrate;
the light emitting layer is arranged on the array substrate;
the packaging layer is arranged on the luminous layer and comprises a first sub-packaging layer, a color film layer and a second sub-packaging layer which are sequentially arranged on the luminous layer, and at least one side surface of the color film layer is provided with an adhesive layer.
Optionally, in some embodiments of the present application, the adhesive layer is disposed on both sides of the color film layer.
Optionally, in some embodiments of the present application, the thickness of the adhesion layer is greater than or equal to 50nm and less than or equal to 100 nm.
Optionally, in some embodiments of the present application, the adhesion layer is made of one or more of silicon oxynitride and silicon nitride.
Optionally, in some embodiments of the present application, the first sub-encapsulation layer includes a first inorganic layer and a first organic layer that are sequentially disposed along the direction away from the array substrate, and the second sub-encapsulation layer includes a second organic layer and a second inorganic layer that are sequentially disposed along the direction away from the array substrate.
Optionally, in some embodiments of the present application, the first organic layer has a thickness greater than or equal to 2 microns.
Optionally, in some embodiments of the present application, a thickness of the first sub-encapsulation layer is less than or equal to a thickness of the second sub-encapsulation layer.
Correspondingly, an embodiment of the present application further provides a display device, including the display panel described in any one of the above.
Correspondingly, an embodiment of the present application further provides a method for manufacturing a display panel, where the method includes:
providing an array substrate;
forming a light emitting layer on the array substrate;
and forming an encapsulation layer on the luminous layer, wherein the encapsulation layer comprises a first sub-encapsulation layer, a color film layer and a second sub-encapsulation layer, and at least one side surface of the color film layer is provided with an adhesive layer.
Optionally, in some embodiments of the present application, the forming an encapsulation layer on the light emitting layer includes:
forming a first sub-encapsulation layer on the light emitting layer;
sequentially forming a first adhesive layer and a color film layer on the first sub-packaging layer;
and forming a second sub-packaging layer on the color film layer.
Optionally, in some embodiments of the present application, before forming the second sub-encapsulation layer on the color film layer, the method further includes: and forming a second bonding layer on the color film layer.
The embodiment of the application adopts the color film layer to be arranged in the packaging layer, and the bonding layer is arranged on the surface of at least one side of the color film layer, so that the interface adhesion force between the color film layer and the packaging layer can be increased, and the display panel is prevented from being out of work due to the fact that the color film layer falls off in the manufacturing or using process of the display panel.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a display device according to an embodiment of the present disclosure;
fig. 3 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;
fig. 4 is a flowchart of step S30 in the method for manufacturing a display panel according to the embodiment of the present application;
description of reference numerals:
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.
The embodiment of the application provides a display panel, a display device and a manufacturing method of the display panel. The following are detailed below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.
First, an embodiment of the present application provides a display panel, which includes an array substrate, a light emitting layer, and an encapsulation layer. The array substrate comprises a light emitting layer, an encapsulation layer, a first sub-encapsulation layer, a color film layer and a second sub-encapsulation layer, wherein the light emitting layer is arranged on the array substrate, the encapsulation layer is arranged on the light emitting layer, the encapsulation layer comprises a first sub-encapsulation layer, a color film layer and a second sub-encapsulation layer which are sequentially arranged on the light emitting layer, and at least one side surface of the color film.
Fig. 1 is a schematic structural view of a display panel 100 according to an embodiment of the present disclosure, as shown in fig. 1, a plurality of pixel openings 111 are formed on a surface of an array substrate 110 for defining light-emitting pixel positions, and a light-emitting layer 120 is disposed on the array substrate 110 and located in the pixel openings 111.
The light-emitting layer 120 may include a plurality of sub-light-emitting pixels, adjacent sub-light-emitting pixels may be one or more of red sub-light-emitting pixels, green sub-light-emitting pixels, and blue sub-light-emitting pixels, and different sub-light-emitting pixels may cooperate with each other to exhibit different display effects, so as to meet different display requirements of the display panel 100.
The encapsulation layer 130 is disposed on the light emitting layer 120 and is used to isolate the corrosion of moisture or oxygen to the light emitting material of the light emitting layer 120, so as to avoid the failure of the entire display panel 100 caused by the damage of the light emitting layer 120. In the embodiment of the present application, the encapsulation layer 130 at least includes the first sub-encapsulation layer 131 and the second sub-encapsulation layer 132 sequentially disposed on the light-emitting layer 120 along the direction away from the array substrate 110, and the structure and composition of the multi-layer sub-encapsulation layer are designed, so that the overall encapsulation effect of the encapsulation layer 130 can be further improved, the corrosion of moisture or oxygen to the light-emitting layer 120 is avoided, the stability of the light-emitting layer 120 in the display panel 100 is improved, and the overall performance of the display panel 100 is ensured.
The first sub-package layer 131 and the second sub-package layer 132 may be respectively made of only one layer of package material, or may be respectively made of multiple layers of package materials, and may be designed according to actual manufacturing requirements of the display panel 100.
The thicknesses of the first sub-package layer 131 and the second sub-package layer 132 can be adjusted according to actual requirements, and only the package layer 130 is required to effectively isolate the corrosion of moisture or oxygen to the light-emitting layer 120 of the display panel 100, so as to ensure the display effect of the display panel 100.
Optionally, the encapsulation layer 130 further includes a color film layer 140, and the color film layer 140 is located between the first sub-encapsulation layer 131 and the second sub-encapsulation layer 132. Because the adhesion between the color film layer 140 and the first sub-package layer 131 or the second sub-package layer 132 may be poor, and the peeling phenomenon is easily generated during the manufacturing or using process, thereby affecting the light emitting effect of the display panel 100, an adhesive layer 150 needs to be disposed on the surface of at least one side of the color film layer 140 during the manufacturing process of the display panel 100, so as to adhere the color film layer 140 and the package layer 130, improve the adhesion between the color film layer 140 and the package layer 130, ensure the stability of the color film layer 140 in the package layer 130, and ensure the overall display effect of the display panel 100.
Optionally, when the adhesion effect between the color film layer 140 and the first sub-package layer 131 and the second sub-package layer 132 is poor, the two side surfaces of the color film layer 140 may be respectively provided with a bonding layer 150 for bonding the color film layer 140 and the first sub-package layer 131, and the color film layer 140 and the second sub-package layer 132, so as to further reduce the risk of the color film layer 140 falling off during the manufacturing process, improve the stability of the color film layer 140 in the package layer 130, and ensure the display effect of the display panel 100.
The thickness of the adhesive layer 150 in the embodiment of the present application is greater than or equal to 50nm and less than or equal to 100 nm. If the thickness of the adhesive layer 150 is too small, the adhesive ability of the adhesive layer 150 may be poor, and the effect of adhering the color film layer 140 and the encapsulation layer 130 cannot be achieved, or the risk that the color film layer 140 falls off may still occur during the use of the display panel 100; meanwhile, if the thickness of the adhesive layer 150 is too small, the requirement for the accuracy of vapor deposition or deposition for manufacturing the adhesive layer 150 is higher, thereby increasing the difficulty of the manufacturing process of the adhesive layer 150. If the thickness of the adhesive layer 150 is too large, the overall thickness of the encapsulation layer 130 is increased, which affects the light-emitting effect of the display panel 100, and also reduces the foldability of the display panel 100, thereby affecting the application of the display panel 100.
According to the embodiment of the application, the thickness of the bonding layer 150 is greater than or equal to 50nm and less than or equal to 100nm, so that the bonding layer can have a good bonding effect, and the overall performance of the display panel cannot be adversely affected. In the actual production process, the thickness of the adhesive layer 150 can be adjusted according to the requirement, the thickness of the adhesive layer 150 can be 60nm, 80nm or 90nm, and the like, and the thickness of the adhesive layer 150 can be reduced as much as possible while the adhesive effect of the adhesive layer 150 is ensured.
It should be noted that the material of the adhesion layer 150 in the embodiment of the present application may include one or more of silicon oxynitride and silicon nitride. When the adhesive layer 150 is formed, the adhesion effect of the adhesive layer 150 can be adjusted by adjusting the nitrogen and oxygen content and the ratio in the adhesive layer 150. Meanwhile, the thickness of the adhesive layer 150 can be adjusted in a matching manner, so that the thickness of the adhesive layer 150 can be reduced as much as possible while the adhesive effect is satisfied, and the influence on the overall performance of the display panel 100 due to the increase of the overall thickness of the packaging layer 130 is avoided.
Optionally, the first sub-encapsulation layer 131 in the embodiment of the present application may include a first inorganic layer 1311 and a first organic layer 1312 sequentially disposed along the direction away from the array substrate 110, and the second sub-encapsulation layer 132 may include a second organic layer 1321 and a second inorganic layer 1322 sequentially disposed along the direction away from the array substrate 110, that is, the color film layer 140 may be located between the first organic layer 1312 and the second organic layer 1321.
Because the adhesion effect between the color film layer 140 and the organic layer is poor, the adhesive layers 150 are required to be disposed on the two side surfaces of the color film layer 140, and are respectively used for improving the adhesion between the color film layer 140 and the first organic layer 1312 and the second organic layer 1321, so as to prevent the color film layer 140 from falling off during the manufacturing or using process of the display panel 100, thereby improving the stability of the color film layer 140 in the encapsulation layer 130.
Optionally, the first sub-encapsulation layer 131 may include a first inorganic layer 1311 and a first organic layer 1312 disposed along the direction away from the array substrate 110, and the second sub-encapsulation layer 132 may include only a second inorganic layer 1322, i.e., the color film layer 140 is located between the first organic layer 1312 and the second inorganic layer 1322.
Because the adhesion effect between the inorganic layer and the color film layer 140 is better than that between the organic layer and the color film layer 140, the adhesive layer 150 can be disposed on the surface of the color film layer 140 near the first organic layer 1312, so as to prevent the color film layer 140 from falling off during the manufacturing or using process of the display panel 100, and improve the stability of the color film layer 140 in the encapsulation layer 130.
Alternatively, the first sub-encapsulation layer 131 may include only the first inorganic layer 1311, and the second sub-encapsulation layer 132 may include the second organic layer 1321 and the second inorganic layer 1322 that are sequentially disposed away from the array substrate 110, i.e., the color film layer 140 is located between the first inorganic layer 1311 and the second organic layer 1321.
Similarly, the adhesive layer 150 may be disposed only on the surface of the color film layer 140 close to the second organic layer 1321, so as to prevent the color film layer 140 from falling off during the manufacturing or using process of the display panel 100, and improve the stability of the color film layer 140 in the encapsulation layer 130.
It should be noted that, in the embodiment of the application, the first organic layer 1312 is disposed on the first inorganic layer 1311 and is used for covering particles on the surface of the first inorganic layer 1311, and at the same time, can relieve stress generated on the surface of the first inorganic layer 1311, so as to prevent the package layer 130 from cracking during the manufacturing or using process, which may cause failure of the display panel 100.
If the thickness of the first organic layer 1312 is too small, particles on the surface of the first inorganic layer 1311 may not be effectively covered, such that moisture or oxygen may penetrate through the first inorganic layer 1311 to attack the light-emitting layer 120, thereby causing the failure of the display panel 100.
The thickness of the first organic layer 1312 in the embodiment of the present application is greater than or equal to 2 μm. In an actual manufacturing process, the thickness of the first inorganic layer 1311 may be adjusted as needed, for example, the thickness of the first inorganic layer 1311 may be 2 microns, 3 microns, 4 microns, or 5 microns, and only by ensuring that the first organic layer 1312 can effectively cover particles on the surface of the first inorganic layer 1311, and moisture or oxygen cannot penetrate through the first inorganic layer 1311 to erode the light emitting layer 120.
Optionally, in the embodiment of the present disclosure, the materials of the first inorganic layer 1311 and the second inorganic layer 1322 may include one or more of silicon oxynitride and silicon nitride, and the materials of the first organic layer 1312 and the second organic layer 1321 may include acrylic glue (PMMA) and the like.
The first inorganic layer 1311 and the second inorganic layer 1322 are made of materials having different nitrogen and oxygen contents and ratios from those of the material used for the adhesion layer 150. By adjusting the nitrogen and oxygen content and the ratio, the first inorganic layer 1311 and the second inorganic layer 1322 mainly function to isolate the moisture or oxygen from corroding the light emitting layer 120, and the adhesive layer 150 mainly functions to improve the adhesion between the color film layer 140 and the encapsulation layer 130, so as to prevent the color film layer 140 from falling off during the manufacturing or using process of the display panel 100, and ensure the stability of the color film layer 140 in the encapsulation layer 130.
Optionally, in the embodiment of the present application, the thickness of the first sub-encapsulation layer 131 may be less than or equal to the thickness of the second sub-encapsulation layer 132. Since the color film layer 140 is located between the first sub-package layer 131 and the second sub-package layer 132, the position of the color film layer 140 directly affects the distance between the color film layer 140 and the light-emitting layer 120, thereby affecting the light-emitting effect and the viewing angle of the display panel 100.
By adjusting the thickness relationship between the first sub-package layer 131 and the second sub-package layer 132, the thickness of the first sub-package layer 131 is smaller than the thickness of the second sub-package layer 132, that is, the color film layer 140 is as close to the array substrate 110 as possible, so that the distance between the color film layer 140 and the light-emitting layer 120 can be shortened, the propagation path of light is reduced, the display effect of the display panel 100 is improved, and the viewing angle of the display panel 100 is increased.
The color film layer 140 in the embodiment of the present application includes a color resistance module 141 and a light shielding module 142. The color resistance modules 141 correspond to the sub-emitting pixels of the light-emitting layer 120 in the pixel openings 111 on the surface of the array substrate 110 one to one. The color resistance module 141 is used to replace a conventional polarizer and filter the light emitted from the light emitting layer 120. The color resistance module 141 is made of lipid material with color pigment, and the thickness of the lipid material is greater than or equal to 1 micron and less than or equal to 1.5 microns.
The light shielding module 142 is located between the color resistance modules 141 and used for defining the positions of the color resistance modules 141. Meanwhile, the light-shielding module can also absorb light emitted by adjacent sub-emitting pixels, so as to avoid the optical crosstalk phenomenon between the adjacent sub-emitting pixels, thereby ensuring the overall light-emitting effect of the display panel 100.
Alternatively, the color resist module 141 may include color resist blocks of a plurality of colors, for example, one or more of a red color resist block, a green color resist block, and a blue color resist block, and the color resist blocks of different colors correspond to the sub-emitting pixels of the corresponding light emitting layer 120. In the operation process of the display panel 100, under the driving of a preset voltage, electrons and holes are respectively injected into the electron and hole transport layers, the electrons and the holes respectively migrate to the light emitting layer 120 through the electron and hole transport layers and meet in the light emitting layer 120 to form excitons and excite the light emitting molecules, and the light emitting molecules emit visible light of corresponding colors through radiative relaxation.
Optionally, the material used for the light shielding module 142 in the embodiment of the present application may be a lipid substance with black pigment, and the thickness of the lipid substance is greater than or equal to 1 micron and less than or equal to 1.5 microns. The black material can effectively absorb light of other colors, so that optical crosstalk between adjacent sub-emitting pixels is avoided.
The material used for the light-shielding module 142 may be the same as the material used for the color resistance module 141. The light-shielding module 142 may include a plurality of color resist blocks of different colors stacked, for example, the light-shielding module 142 may include a green color resist block, a red color resist block, and a blue color resist block sequentially stacked in a direction away from the array substrate 110.
The green color block, the red color block and the blue color block which are stacked can have the shading effect equivalent to that of a black shading material through the matching arrangement of green, red and blue colors. The light emitted from the light emitting layer 120 is substantially absorbed by the color resist blocks after passing through the green color resist block, the red color resist block and the blue color resist block layer by layer, so that the optical crosstalk between adjacent sub-pixels can be avoided while the Black Matrix (BM) process is reduced.
Alternatively, the material of the light-shielding module 142 may be only composed of red color resist blocks and blue color resist blocks stacked in sequence in a direction away from the array substrate 110. Because the difference of the penetrating frequency spectrums of the red light and the blue light is large, the light intensity after the two layers of color resistors are crossed and overlapped is greatly reduced, and therefore the red color resistor block and the blue color resistor block which are stacked can have the shading effect similar to that of a Black Matrix (BM).
In addition, the stacked red color resist blocks and blue color resist blocks can be simultaneously manufactured with the corresponding color resist blocks in the color resist module 141, thereby simplifying the manufacturing process and reducing the production cost.
Next, an embodiment of the present application further provides a display device, which includes a display panel, and the specific structure of the display panel refers to the foregoing embodiments, and since the display device adopts all the technical solutions of all the foregoing embodiments, the display device at least has all the beneficial effects brought by the technical solutions of the foregoing embodiments. And will not be described in detail herein.
Fig. 2 is a schematic structural diagram of a display device according to an embodiment of the present disclosure, and as shown in fig. 2, the display device 10 includes a display panel 100, a control circuit 200, and a housing 300. The housing 300 is connected to the display panel 100 to support and fix the display panel 100, the control circuit 200 is disposed in the housing 300, and the control circuit 200 is electrically connected to the display panel 100 to control the display panel 100 to display images.
The display panel 100 may be fixed to the housing 300 to be integrated with the housing 300, and the display panel 100 and the housing 300 form a closed space to accommodate the control circuit 200. The control circuit 200 may be a main board of the display device 10, and one or more functional components of a battery, an antenna structure, a microphone, a speaker, an earphone interface, a universal serial bus interface, a camera, a distance sensor, an ambient light sensor, a receiver, a processor, and the like may be integrated on the control circuit 200, so that the display device 10 can be adapted to various application fields.
It should be noted that the display device 10 is not limited to the above, and may further include other devices, such as a camera, an antenna structure, a fingerprint unlocking module, etc., to expand the application range thereof, and is not limited herein.
It should be noted that the display device 10 in the embodiment of the present application has a wide application range, and includes flexible OLED displays and illuminations such as televisions, computers, mobile phones, foldable and rollable OLEDs, and wearable devices such as smart bracelets, smart watches, Virtual Reality (VR), etc., which are all within the application range of the display device in the embodiment of the present application.
Finally, an embodiment of the present application further provides a manufacturing method of a display panel, as shown in fig. 1 and fig. 3, the manufacturing method of the display panel includes:
s10, providing an array substrate 110. The array substrate 110 may include a plurality of thin film layers stacked on a substrate, and the substrate may be a glass substrate for supporting each film structure in the array substrate 110.
S20, forming a light emitting layer 120 on the array substrate 110. The array substrate 110 has a pixel opening 111 formed on a surface thereof for defining a light-emitting pixel position, and the light-emitting layer 120 is disposed in the pixel opening 111.
In the embodiment of the present invention, the light emitting layer 120 may be formed on the array substrate 110 by evaporation or inkjet printing as needed.
Here, the light emitting layer 120 may include a plurality of sub light emitting pixels, and the adjacent sub light emitting pixels may be one or more of red, green, and blue sub light emitting pixels. In the operation process of the display panel 100, under the driving of a preset voltage, electrons and holes are respectively injected into the electron and hole transport layers, the electrons and the holes respectively migrate to the light emitting layer 120 through the electron and hole transport layers and meet in the light emitting layer 120 to form excitons and excite the light emitting molecules, and the light emitting molecules emit visible light of corresponding colors through radiative relaxation.
S30, forming an encapsulation layer 130 on the light emitting layer 120, where the encapsulation layer 130 includes a first sub-encapsulation layer 131, a color film layer 140, and a second sub-encapsulation layer 132, and at least one side surface of the color film layer 140 is provided with an adhesive layer 150.
It should be noted that, because the color film layer 140 is located between the first sub-package layer 131 and the second sub-package layer 132, and there may be a problem of small adhesion between the color film layer 140 and the first sub-package layer 131 and/or the second sub-package layer 132, and a phenomenon that the color film layer 140 falls off may occur during a manufacturing or using process, the adhesive layer 150 needs to be disposed on at least one side surface of the color film layer 140 for adhering the color film layer 140, the first sub-package layer 131, and the second sub-package layer 132, so as to ensure stability of the color film layer 140 in the package layer 130.
Alternatively, as shown in fig. 1 and 4, in step S30 of this embodiment, the forming the encapsulation layer 130 on the light-emitting layer 120 may include:
s301, the first sub-encapsulation layer 131 is formed on the light emitting layer 120.
It should be noted that the first sub-encapsulation layer 131 may include only the first inorganic layer 1311, and may also include the first inorganic layer 1311 and the first organic layer 1312 sequentially disposed in a direction away from the array substrate 110.
In the embodiment, the first inorganic layer 1311 may be formed on the light emitting layer 120 by chemical deposition or atomic deposition, and then the first organic layer 1312 may be formed on the first inorganic layer 1311 by evaporation or inkjet printing. The thicknesses of the first inorganic layer 1311 and the first organic layer 1312 may be adjusted according to actual needs.
The first inorganic layer 1311 is used to isolate moisture and oxygen from corroding the light-emitting material, so as to avoid the display panel 100 from failing due to the damage of the light-emitting layer 120, and the first inorganic layer 1311 can also increase the light-emitting rate of the display panel 100.
The first organic layer 1312 is used for covering particles on the surface of the first inorganic layer 1311, so as to further improve the moisture and oxygen insulation effect, and meanwhile, the first organic layer 1312 can relieve the stress generated on the surface of the first inorganic layer 1311, thereby preventing the cracking phenomenon of the encapsulation layer 130.
S302, sequentially forming a first adhesive layer 150 and a color film layer 140 on the first sub-package layer 131.
It should be noted that, because the color film layer 140 is located in the package layer 130, the adhesion effect between the color film layer 140 and the first sub-package layer 131 is poor, and the first adhesive layer 150 needs to be disposed between the color film layer 140 and the first sub-package layer 131 to improve the adhesion between the color film layer 140 and the first sub-package layer 131, so as to ensure the stability of the color film layer 140 in the package layer 130.
In the embodiment of the present invention, after the first sub-encapsulation layer 131 is formed on the light emitting layer 120, the first adhesion layer 150 may be formed on the first sub-encapsulation layer 131 by using a chemical deposition or atomic deposition process, and then the color film layer 140 may be formed on the adhesion layer 150 by using a photolithography or printing method.
The material of the adhesion layer 150 includes one or more of silicon oxynitride and silicon nitride. In the process of manufacturing the adhesive layer 150, the adhesiveness of the adhesive layer 150 can be adjusted by adjusting the nitrogen-oxygen ratio in the adhesive layer 150. For example, when the adhesive layer 150 is manufactured, nitrous oxide may be added to adjust the adhesion of the adhesive layer 150, so as to ensure the adhesion effect of the adhesive layer 150 and ensure the stability of the color film layer 140 in the encapsulation layer 130.
S303, forming a second sub-encapsulation layer 132 on the color film layer 140. It should be noted that the second sub-encapsulation layer 132 may include only the second inorganic layer 1322, or may include the second organic layer 1321 and the second inorganic layer 1322 that are sequentially disposed along a direction away from the array substrate 110.
When the second sub-encapsulation layer 132 includes the second organic layer 1321 and the second inorganic layer 1322 sequentially disposed along the direction away from the array substrate 110, because the adhesion between the second organic layer 1321 and the color film layer 140 is poor, before step S303, the second sub-encapsulation layer may further include forming the second adhesive layer 150 on the color film layer 140, so that the adhesive layers 150 are formed on the two side surfaces of the color film layer 140, thereby further improving the stability of the color film layer 140 in the encapsulation layer 130 and preventing the color film layer 140 from falling off during the manufacturing or using process of the display panel 100.
It should be noted that the provision of the multiple adhesive layers 150 may increase the overall thickness of the display panel 100, thereby affecting the overall performance of the display panel 100, and the thickness of the adhesive layer 150 may be adjusted according to actual requirements when the adhesive layer 150 is manufactured.
In the embodiment of the present application, the thickness of the adhesive layer 150 is greater than or equal to 50nm and less than or equal to 100nm, so that the adhesive effect of the adhesive layer 150 is ensured, and the thickness of the adhesive layer 150 is reduced as much as possible, thereby ensuring the overall performance of the display panel 100.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The display panel, the display device and the method for manufacturing the display panel provided by the embodiment of the present application are described in detail above, and a specific example is applied to illustrate the principle and the implementation manner of the present application, and the description of the above embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (11)
1. A display panel, comprising:
an array substrate;
the light emitting layer is arranged on the array substrate;
the packaging layer is arranged on the luminous layer and comprises a first sub-packaging layer, a color film layer and a second sub-packaging layer which are sequentially arranged on the luminous layer, and at least one side surface of the color film layer is provided with an adhesive layer.
2. The display panel according to claim 1, wherein the adhesive layer is disposed on both sides of the color film layer.
3. The display panel according to claim 1 or 2, wherein the adhesive layer has a thickness of 50nm or more and 100nm or less.
4. The display panel according to claim 1 or 2, wherein the material of the adhesive layer comprises one or more of silicon oxynitride and silicon nitride.
5. The display panel of claim 1, wherein the first sub-encapsulation layer comprises a first inorganic layer and a first organic layer sequentially disposed along the substrate away from the array substrate, and the second sub-encapsulation layer comprises a second organic layer and a second inorganic layer sequentially disposed along the substrate away from the array substrate.
6. The display panel of claim 5, wherein the first organic layer has a thickness greater than or equal to 2 microns.
7. The display panel of claim 1, wherein the thickness of the first sub-encapsulation layer is less than or equal to the thickness of the second sub-encapsulation layer.
8. A display device characterized by comprising the display panel according to any one of claims 1 to 7.
9. A method for manufacturing a display panel, the method comprising:
providing an array substrate;
forming a light emitting layer on the array substrate;
and forming an encapsulation layer on the luminous layer, wherein the encapsulation layer comprises a first sub-encapsulation layer, a color film layer and a second sub-encapsulation layer, and at least one side surface of the color film layer is provided with an adhesive layer.
10. The method of claim 9, wherein forming an encapsulation layer over the light-emitting layer comprises:
forming a first sub-encapsulation layer on the light emitting layer;
sequentially forming a first adhesive layer and a color film layer on the first sub-packaging layer;
and forming a second sub-packaging layer on the color film layer.
11. The method for manufacturing a display panel according to claim 10, wherein before forming the second sub-encapsulation layer on the color film layer, the method further comprises: and forming a second bonding layer on the color film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110253390.3A CN113054131A (en) | 2021-03-10 | 2021-03-10 | Display panel, display device and manufacturing method of display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110253390.3A CN113054131A (en) | 2021-03-10 | 2021-03-10 | Display panel, display device and manufacturing method of display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113054131A true CN113054131A (en) | 2021-06-29 |
Family
ID=76510756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110253390.3A Pending CN113054131A (en) | 2021-03-10 | 2021-03-10 | Display panel, display device and manufacturing method of display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113054131A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115283820A (en) * | 2022-08-29 | 2022-11-04 | 苏州科韵激光科技有限公司 | Laser repair system and repair method based on Micro OLED |
| WO2023015719A1 (en) * | 2021-08-12 | 2023-02-16 | 惠州Tcl云创科技有限公司 | Display screen film layer structure, mobile terminal, and manufacturing method for film layer structure |
| EP4322729A3 (en) * | 2022-08-08 | 2024-05-15 | Samsung Display Co., Ltd. | Display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894922A (en) * | 2010-06-29 | 2010-11-24 | 深圳丹邦投资集团有限公司 | Organic light-emitting device and composite anode and manufacturing method thereof |
| CN105977391A (en) * | 2016-05-16 | 2016-09-28 | 信利（惠州）智能显示有限公司 | Patterned rigid carrier substrate and combined substrate for organic light-emitting device |
| CN109713026A (en) * | 2019-02-26 | 2019-05-03 | 京东方科技集团股份有限公司 | A kind of silicon substrate electroluminescence display panel and its manufacturing method, display device |
-
2021
- 2021-03-10 CN CN202110253390.3A patent/CN113054131A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894922A (en) * | 2010-06-29 | 2010-11-24 | 深圳丹邦投资集团有限公司 | Organic light-emitting device and composite anode and manufacturing method thereof |
| CN105977391A (en) * | 2016-05-16 | 2016-09-28 | 信利（惠州）智能显示有限公司 | Patterned rigid carrier substrate and combined substrate for organic light-emitting device |
| CN109713026A (en) * | 2019-02-26 | 2019-05-03 | 京东方科技集团股份有限公司 | A kind of silicon substrate electroluminescence display panel and its manufacturing method, display device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023015719A1 (en) * | 2021-08-12 | 2023-02-16 | 惠州Tcl云创科技有限公司 | Display screen film layer structure, mobile terminal, and manufacturing method for film layer structure |
| EP4322729A3 (en) * | 2022-08-08 | 2024-05-15 | Samsung Display Co., Ltd. | Display device |
| CN115283820A (en) * | 2022-08-29 | 2022-11-04 | 苏州科韵激光科技有限公司 | Laser repair system and repair method based on Micro OLED |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10580843B2 (en) | Substrate and fabrication method thereof, and display device | |
| EP3166149B1 (en) | Preparation method for an amoled display panel | |
| US8674596B2 (en) | Organic light emitting display device and fabrication method for the same | |
| US11329104B2 (en) | Display panel and display device | |
| US7928646B2 (en) | Organic electroluminescent display with improved barrier structure | |
| WO2022017020A1 (en) | Display apparatus and manufacturing method therefor | |
| US11133488B2 (en) | Display substrate, display apparatus, and method of fabricating display substrate having enclosure ring in buffer area | |
| CN109830186B (en) | Display panel and method for manufacturing the same | |
| CN113054131A (en) | Display panel, display device and manufacturing method of display panel | |
| WO2020024765A1 (en) | Display panel and method for manufacturing same, and display apparatus | |
| WO2023245959A1 (en) | Display panel and display device | |
| WO2020098151A1 (en) | Display panel and mobile device | |
| CN114665041A (en) | Display panel and preparation method thereof | |
| CN113066829A (en) | Display panel, preparation method thereof and display device | |
| CN110707235B (en) | Display panel, display device and preparation method of display panel | |
| WO2022016749A1 (en) | Display panel, method for manufacturing display panel, and display apparatus | |
| US20230107293A1 (en) | Display device | |
| CN111029385A (en) | OLED display panel and display device | |
| US20240016004A1 (en) | Display panel and display device | |
| CN114188495A (en) | Display panel and preparation method thereof | |
| CN112714969B (en) | Light emitting device, method of manufacturing light emitting device, and electronic apparatus | |
| CN112327535A (en) | Color film substrate and preparation method thereof, and display device and preparation method thereof | |
| KR20210059484A (en) | Display device | |
| US20240107848A1 (en) | Display panel and display device | |
| US11737334B2 (en) | Display panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210629 |
|
| RJ01 | Rejection of invention patent application after publication |