CN113594209B - Display panel, manufacturing method thereof and electronic equipment - Google Patents
Display panel, manufacturing method thereof and electronic equipment Download PDFInfo
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- CN113594209B CN113594209B CN202110852869.9A CN202110852869A CN113594209B CN 113594209 B CN113594209 B CN 113594209B CN 202110852869 A CN202110852869 A CN 202110852869A CN 113594209 B CN113594209 B CN 113594209B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 98
- 239000010409 thin film Substances 0.000 claims abstract description 90
- 239000010408 film Substances 0.000 claims abstract description 55
- 238000004806 packaging method and process Methods 0.000 claims abstract description 35
- 238000003475 lamination Methods 0.000 claims abstract description 19
- 238000005538 encapsulation Methods 0.000 claims description 18
- 238000005452 bending Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 238000001704 evaporation Methods 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 10
- 229910052760 oxygen Inorganic materials 0.000 abstract description 10
- 239000001301 oxygen Substances 0.000 abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 30
- 238000010586 diagram Methods 0.000 description 11
- 239000011521 glass Substances 0.000 description 10
- 238000002834 transmittance Methods 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229920006280 packaging film Polymers 0.000 description 1
- 239000012785 packaging film Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application discloses a display panel, a manufacturing method thereof and electronic equipment, wherein the display panel comprises: the pixel array, the thin film transistor circuit and the thin film packaging layer are sequentially stacked, and the substrate is a transparent substrate; on a cross section, two ends of the thin film transistor circuit are provided with a first convex body end and a second convex body end, the first convex body end and the second convex body end are connected with the substrate, and the first direction is intersected with or mutually perpendicular to the direction of sequential lamination; the first end convex body is provided with a flip chip film bonding area for bonding the flip chip film and the integrated circuit in the direction of sequential lamination. Through the mode, the black edge can be reduced, the pixel array is arranged between the substrate and the thin film transistor circuit, and the packaging path for isolating water and oxygen is longer, so that the packaging reliability is improved.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to a display panel, a manufacturing method thereof, and an electronic device.
Background
The display panel is used as an important component of the information industry, plays an important role in the development process of the information technology, and is large enough for televisions, notebooks and mobile phones and tablets, and the support of the display panel is not needed.
In recent years, with the development of technology and increasing demands, flexible display panels are becoming popular due to their deformability, thinness, low power consumption, small size, and good waterproof performance.
In general, when a display panel is arranged on an electronic device, other components such as a middle frame often have a distance when the display panel is surrounded, and a light emitting source under the flexible display panel is bent by itself to be larger than the edge distance of the middle frame, so that a dark frame exists between the display panel and the middle frame to generate a black edge, and the distance between a pixel array under the display panel and the outside is often realized through a packaging film, so that the packaging path for isolating water and oxygen is too short, and the packaging reliability is reduced.
Disclosure of Invention
A first aspect of an embodiment of the present application provides a display panel including: the pixel array, the thin film transistor circuit and the thin film packaging layer are sequentially stacked, and the substrate is a transparent substrate;
on a cross section, two ends of the thin film transistor circuit are provided with a first convex body end and a second convex body end, the first convex body end and the second convex body end are connected with the substrate, and the first direction is intersected with or mutually perpendicular to the direction of sequential lamination;
the first end convex body is provided with a flip chip film bonding area for bonding the flip chip film and the integrated circuit in the direction of sequential lamination.
A second aspect of an embodiment of the present application provides another display panel including: the pixel array, the thin film transistor circuit and the thin film packaging layer are sequentially stacked, and the substrate is a transparent substrate;
on a cross section, two ends of the thin film transistor circuit are provided with a first convex body end and a second convex body end, the first convex body end and the second convex body end are connected with the substrate, and the first direction is intersected with or mutually perpendicular to the direction of sequential lamination;
the first end convex body is provided with a bent substrate and a bent flip-chip film bonding area, and the inner side of the flip-chip film bonding area is provided with a bent thin film transistor circuit with the same radian;
The flip chip film bonding area is connected with the flip chip film, and one side of the flip chip film far away from the thin film transistor circuit is provided with an integrated circuit.
A third aspect of an embodiment of the present application provides a manufacturing method of a display panel, the manufacturing method including:
Providing a substrate, wherein the substrate is a substrate of a display panel;
setting a pixel array on a substrate based on an evaporation method;
a thin film transistor circuit is arranged on the pixel array, and two ends of the thin film transistor circuit are connected with two ends of the substrate so as to seal the pixel array;
a thin film encapsulation layer is disposed over the thin film transistor circuit.
A fourth aspect of an embodiment of the present application provides an electronic device, including: the display device at least comprises a circuit board, a memory, a middle frame and a shell, wherein the memory is arranged on the circuit board, the circuit board is surrounded by the shell and the middle frame, and the display panel according to the first aspect and the second aspect of the embodiment of the application is arranged on the circuit board.
The beneficial effects of the application are as follows: the pixel array is arranged between the substrate and the thin film transistor circuit, the packaging path for isolating water and oxygen is longer, so that the packaging reliability is improved, and the first end convex body is provided with the flip chip film bonding area for bonding the flip chip film and the integrated circuit in the direction of sequential lamination, so that the distance between the pixel array and the frame is shorter than that of the bent flexible display panel, and the black edge can be reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view showing a structure of a substrate in a flattened state according to a first embodiment of the present application;
FIG. 2 is a schematic diagram of a first embodiment of the present application in which a substrate is bent;
FIG. 3 is a schematic flow chart of a laminated structure implementation of the first embodiment of the present application;
FIG. 4 is a schematic diagram of a second embodiment of the present application;
FIG. 5 is a schematic view of a specific laminated structure of a second embodiment of the present application;
FIG. 6 is a schematic flow chart of a laminated structure implementation of a second embodiment of the present application;
FIG. 7 is a schematic view of the structure of a third embodiment of the present application;
Fig. 8 is a schematic block diagram of the hardware architecture of the electronic device of the present application.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, techniques, etc., in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.
It should be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
As used in this specification and the appended claims, the term "if" may be interpreted as "when..once" or "in response to a determination" or "in response to detection" depending on the context. Similarly, the phrase "if a determination" or "if a [ described condition or event ] is detected" may be interpreted in the context of meaning "upon determination" or "in response to determination" or "upon detection of a [ described condition or event ]" or "in response to detection of a [ described condition or event ]".
Referring to fig. 1, fig. 1 is a schematic structural diagram of a first embodiment of the present application for flattening a substrate; a first embodiment of the present application provides an Organic Light-Emitting Diode (OLED) flexible screen including a substrate 1, a thin film transistor (Thin Film Transistor, TFT) circuit 2, an integrated circuit (INTEGRATED CIRCUIT, IC) 3, a pixel array 4, and a thin film encapsulation layer (Thin Film Encapsulation, TFE) 5.
The substrate 1, the TFT circuit 2, the pixel array 4, and the TFE5 are sequentially stacked, and light is emitted from the substrate 1 to the TFE5, thereby obtaining a light emission direction AB. That is, the light emission direction AB may be a lamination direction in which the light emission layers are laminated in this order.
The pixel array 4 is formed by a plurality of pixel points, wherein the pixel points at least comprise three pixels of red, green and blue, and the pixels are sequentially arranged to form the pixel array 4, for example, in fig. 1, a lattice in a layer represented by the pixel array 4 may represent one pixel, and the three pixels of red, green and blue are sequentially and alternately arranged to form the pixel array layer in fig. 1.
The substrate 1 can be a polyimide (Polymide, PI) substrate, polyimide is an organic polymer material, has high temperature resistance and good flexibility, and is a main material of an OLED flexible screen flexible board. PI has various properties, and is excellent in abrasion resistance and insulation properties, as well as high temperature resistance.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a substrate in a bent state according to a first embodiment of the present application; the connection part between the TFT circuit 2 and the IC3 is a flip-chip thin film connection area 6, so as to avoid that the distance between the TFE5 and the frame is larger, and the substrate 1 has the characteristic of good flexibility, so that the substrate 1 and the flip-chip thin film connection area 6 externally attached to the substrate 1 can be bent, and the distance between the TFE5 and the frame can be reduced, thereby reducing the black edge.
In order to manufacture the OLED flexible screen more clearly, referring to fig. 3, fig. 3 is a schematic diagram of a laminated structure implementation flow of the first embodiment of the present application, and the specific manufacturing flow includes the following steps:
s11: coating PI (polyimide) to form a Panel substrate;
Specifically, the coated PI is fabricated on the glass plate, so that the coated PI is convenient to define boundaries with other substances, and the coated PI is used as a Panel substrate, wherein the glass plate only serves as a bearing, and the Panel is removed later in the fabrication process.
S12: a TFT circuit is manufactured on PI, namely, a TFT circuit 2 is arranged on a PI substrate;
S13: evaporating a pixel layer on the TFT circuit, namely arranging the pixel array 4 on the TFT circuit 2 in an evaporation manner;
S14: encapsulating the organic pixel layer with TFE, i.e. encapsulating the pixel array 4 with TFE 5;
S15: and removing the bearing glass to form a flexible panel, wherein the flexible display panel is in a flattened state.
The display panel performs light-emitting display from bottom to top as a whole, and specifically, the substrate 1 may be in a flattened state and a folded state. When the substrate 1 is in a flattened state, TFE5, pixel array 4, TFT circuit 2, and substrate 1 are stacked in this order, and integrated circuit 3 is also disposed on top of TFT circuit 2, TFE5 encapsulating pixel array 4. When the substrate 1 is in a flattened state, the arrangement is basically the same, and the display panel is in a bent state due to the panel bending region (Panel Bending Area) 6, so that the distance between the display panel and the frame in the flattened state can be reduced to a certain extent, and the black edge is reduced, but the black edge is deficient in terms of water and oxygen resistance, because the bending region exists in the lower blackboard at this time, on one hand, the lower black edge is large, on the other hand, the bending stress causes easy disconnection of the bending region, the pixel light emitting direction is upward TFE, and the TFE is usually SiN, siO, an organic adhesive layer and the like, so that the light is blocked to a certain extent, and the light emitting efficiency is lower to a certain extent.
In order to illustrate the technical solution of the present application, the first aspect of the present application provides a display panel according to the present application, referring to fig. 4, fig. 4 is a schematic structural diagram of a second embodiment of the present application, where the display panel includes a substrate 1, a pixel array 4, a thin film transistor circuit 2 and a thin film encapsulation layer 5 sequentially stacked; as shown in fig. 4, the direction of the sequential lamination may be the vertical direction AB.
Based on the requirement of the display panel, the substrate 1 is usually a transparent substrate, the substrate 1 may be a PI substrate or a glass substrate, and the light transmittance of the substrate may reach more than 90%, so as to meet the requirement of the display panel on optics.
The pixel array 4 is close to a PI substrate or a glass substrate with higher transmittance, wherein the PI substrate can be used for a flexible screen, the glass substrate can be used for a hard screen, and the efficiency of the panel to external light emission can be further improved.
The cross section of the display panel is viewed from one side of the side, and on one cross section, the two ends of the thin film transistor circuit 2 are provided with a first convex end 21 and a second convex end 22, the first convex end 21 and the second convex end 22 are connected with the substrate 1, the first direction is intersected with or perpendicular to the direction of sequential lamination, and if the direction of sequential lamination can be the vertical direction AB, the first direction can be the horizontal direction.
The first end bump 21 is provided with a flip Chip Film bonding region 61, specifically, may be disposed in an extending direction of the first end bump 21, for bonding a flip Chip Film (COF) 7 and an integrated circuit 3 in a direction in which the flip Chip films are sequentially stacked.
Therefore, the pixel array 4 is arranged between the substrate 1 and the thin film transistor circuit 2, the packaging path for isolating water and oxygen is longer, so that the packaging reliability is improved, and the first end convex body 21 is provided with the flip chip film bonding region 61 for bonding the flip chip film 7 and the integrated circuit 3 in the direction of sequential lamination, which is shorter than the distance between the pixel array and the frame due to the bent flexible display panel, so that the black edge can be reduced.
Further, the thin film transistor circuit 2 is further provided with a first body portion 23 connecting the first bump end 21 and the second bump end 22; as shown in fig. 4, the thin film transistor circuit 2 is actually a member with a groove formed by connecting the first bump end 21, the first body portion 23 and the second bump end 22, and is used for receiving the pixel array 4, or may be used for receiving the pixel array 4.
In the direction of the sequential lamination, the pixel array 4 is sandwiched between the substrate 1 and the first main body portion 23; in the first direction, the pixel array 4 is sandwiched between the first convex end 21 and the second convex end 22.
The first convex end 21 and the second convex end 22 of the thin film transistor circuit 2 are connected with two ends of the substrate 1, so that the pixel array 4 is tightly packaged between the substrate 1 and the thin film transistor circuit 2, the thickness of the substrate 1 is larger than that of the thin film packaging layer 5, and the edge of the pixel array 4 is further sealed through the thin film transistor circuit 2, so that the packaging path for isolating water and oxygen is longer, and the packaging reliability is improved.
Wherein, a plurality of through holes are arranged on the other side of the thin film encapsulation layer 5, which is close to the pixel array 4 and far away from the thin film encapsulation layer, and are used for connecting and driving the pixel array 4.
Further, referring to fig. 5, fig. 5 is a schematic diagram of a laminated structure of a second embodiment of the present application, wherein thicknesses of the first main body portion 23, the first convex body end 21 and the second convex body end 22 in a direction of lamination are equal; the flip chip film 7 is provided with a convex body part 71; based on fig. 4, a first accommodating area 101 is formed between the plane of the first bump end 21 and the plane of the first body 23 of the thin film transistor circuit 2, and is used for accommodating the bump 71, so that the flip chip film bonding area 61 is bonded with the flip chip film 7 through the bump 71. As shown in fig. 5, the thickness of the first accommodating area 101 in the sequentially stacking direction is identical to the thickness of the first bump end 21, so that when the thin film transistor circuit 2 is manufactured, the two ends of the thin film transistor circuit 2 can be bent according to a preset depth by adopting a more mature bending process, so that the thin film transistor circuit 2 is manufactured with the first bump end 21 and the second bump end 22 connected with the first main body 23, and the feasibility of the scheme is improved.
Further, the film packaging layer 5 is provided with a third convex body end 51 and a fourth convex body end 52 at two ends; the first accommodating area 101 is further configured to accommodate the third convex body end 51; since the film encapsulation layer 5 is mainly used for sealing and packaging the thin film transistor circuit 2, when the shape of the thin film transistor circuit 2 is changed, the film encapsulation layer 5 is actually changed to meet the packaging requirement.
A second accommodating area 102 is formed between the plane of the second bump end 22 and the plane of the first body portion 23 of the thin film transistor circuit 2, where the second accommodating area 102 is used for accommodating the fourth bump end 52, so that two ends of the thin film transistor circuit 2 are connected with two ends of the thin film encapsulation layer 5.
In order to better encapsulate the thin film transistor circuit 2, two ends of the thin film encapsulation layer 5 are disposed at two ends of the thin film transistor circuit 2, and a main body portion of the thin film encapsulation layer 5 is disposed above the first main body portion 23 of the thin film transistor circuit 2, so that a further sealed space is formed, so that the pixel array 4 and the thin film transistor circuit 2 are better isolated from water and oxygen.
Further, the film packaging layer 5 is further provided with a second main body portion 53 connected with the third convex body end 51 and the fourth convex body end 52; that is, the film encapsulation layer 5 is actually composed of the third land end 51, the fourth land end 52, and the second body portion 53 connecting the third land end 51 and the fourth land end 52.
Since the flip chip film 7 is simply arranged by bonding other members through the flip chip film bonding region 61, the thickness of the convex body portion 71 of the flip chip film 7 is greater than or equal to the sum of the thickness of the first accommodation region 101 and the thickness of the second main body portion 53 in the direction in which the flip chip films are sequentially stacked.
Further, to further reduce the lower black edge, the flip chip film 7 is further provided with a third main body portion 72 which is connected with the convex body portion 71 in a bending manner; and the TFT circuit 2 is downward, the flip chip film 7 can be directly adhered to the back of the display panel, the flip chip film adhesion area 61 is omitted, and the integrated circuit 3 is arranged on the side of the third main body part 72 far away from the film packaging layer 5. Therefore, the possibility of wire breakage can be reduced, the reliability of the display panel is improved, and the lower black edge can be further reduced.
Further, the thin film transistor circuit 2 is provided with a circuit, and the circuit is disposed at a side far from the pixel array 4 and close to the thin film encapsulation layer 5 for connecting the integrated circuit 3.
Therefore, by eliminating the bending area, the lower black edge is reduced, the possibility of broken wires is reduced, and the connection reliability is improved; in addition, the packaging path of the pixels for isolating water and oxygen is longer, the packaging reliability is better, and furthermore, the pixel array 4 is made of high-transmittance materials, so that the luminous efficiency of the display panel is higher.
Specifically, firstly, the display panel structure of the application can cancel the bending area of the substrate 1, and directly use the flip chip film 7 to set up the bonding structure on the back of the display panel, so as to achieve the purposes of reducing the lower black edge and improving the broken line reliability.
Second, as opposed to the first embodiment, in which the organic material of the pixel array 4 is directly over Thin Film Encapsulation (TFE), TFE breakage can directly cause the pixel organic material to be oxidized to fail. The upper surface of the pixel array 4 is provided with the PI substrate, wherein the PI substrate is not easy to damage and fail, the lower surface is provided with the TFT circuit 2 and a plurality of layers of inorganic materials and the TFE5, the packaging path of the pixel array 4 for isolating water and oxygen is longer, and the packaging reliability is better.
Third, the pixel array 4 of the first embodiment is TFE5, and because TFE5 is a multilayer structure, the light transmission path is complex, and there is a large loss. The high-transmittance PI material is directly arranged on the structural pixel array 4 of the first aspect of the present application, and a single-layer structure can achieve higher luminous efficiency. The luminous efficiency may be further improved with the transmittance of PI or iteration of the new material.
In order to make the display panel more clear, a third aspect of the present application provides a method for manufacturing a display panel, referring to fig. 6, fig. 6 is a schematic diagram of a laminated structure implementation flow chart of a second embodiment of the present application, and the manufacturing flow specifically includes the following steps:
s21: coating PI (polyimide) to form a Panel substrate;
Providing a substrate, wherein the substrate is a substrate of a display panel; specifically, this step is similar to step S11 in fig. 2, and will not be described here again.
S22: evaporating a pixel layer on PI, that is, disposing a pixel array on a substrate based on an evaporation method, specifically, disposing a pixel array 4 on a PI substrate 1 by evaporation;
S23: a TFT circuit is manufactured on the pixel layer, namely a driving circuit TFT circuit 2 is manufactured on the pixel array 4, the TFT circuit 2 is arranged on the pixel array 4, and two ends of the TFT circuit 2 are connected with two ends of the substrate 1 so as to seal the pixel array 4;
S24: the organic pixel layer is encapsulated by using TFE, namely the pixel array 4 is encapsulated by using a TFE encapsulation layer 5, namely the TFE encapsulation layer 5 is arranged on the TFT circuit 2;
s25: and removing the bearing glass to form a flexible panel, wherein the flexible display panel is in a flattened state.
Referring to fig. 7, fig. 7 is a schematic structural diagram of a second embodiment of the present application, where the display panel includes a substrate 1, a pixel array 4, a thin film transistor circuit 2 and a thin film encapsulation layer 5 sequentially stacked.
Based on the requirement of the display panel, the substrate 1 is usually a transparent substrate, the substrate 1 may be a PI substrate or a glass substrate, and the light transmittance of the substrate may reach more than 90%, so as to meet the requirement of the display panel on optics.
The pixel array 4 is close to a PI substrate or a glass substrate with higher transmittance, wherein the PI substrate can be used for a flexible screen, the glass substrate can be used for a hard screen, and the efficiency of the panel to external light emission can be further improved.
Looking at the cross section of the display panel from one side of the side, on a cross section, the two ends of the thin film transistor circuit 2 are provided with a first convex body end 21 and a second convex body end 22, the first convex body end 21 and the second convex body end 22 are connected with the substrate 1, the first direction is intersected with or perpendicular to the direction of sequential lamination, and if the direction of sequential lamination is the vertical direction AB, the first direction can be the horizontal direction.
The first convex body end 21 is provided with a bent substrate 1 and a bent flip-chip film bonding area 62, and the inner side of the flip-chip film bonding area 62 is provided with a bent thin film transistor circuit 2 with the same radian; because the thickness of the substrate 1 is greater than that of the thin film transistor circuit 2, the bent thin film transistor circuit 2 with the same radian is arranged at the inner side of the bent flip-chip film bonding region 62, so that the thin film transistor circuit 2 is arranged at the inner side of the substrate 1 and then bent, and the possibility of disconnection of the thin film transistor circuit 2 can be obviously reduced compared with the case that the thin film transistor circuit 2 is arranged at the outer side of the substrate 1 and then bent.
The flip-chip film bonding region 62 is connected to the flip-chip film 7, and the integrated circuit 3 is disposed on the side of the flip-chip film 7 away from the thin film transistor circuit 2. Specifically, the folded flip chip film bonding area 62 is provided with the flip chip film 7 in the inward extending direction in a connected manner, so that the lower black margin can be reduced to some extent.
Therefore, the pixel array 4 is arranged between the substrate 1 and the thin film transistor circuit 2, the packaging path for isolating water and oxygen is longer, so that the packaging reliability is improved, and the bent thin film transistor circuit 2 with the same radian is arranged at the inner side of the bent flip chip bonding region 62, and compared with the thin film transistor circuit 2 arranged at the outer side of the substrate 1 and then bent, the possibility of disconnection of the thin film transistor circuit 2 can be obviously reduced, so that the black edge can be reduced.
The fourth aspect of the present application further provides an electronic device, where the electronic device at least includes a circuit board, a memory, a middle frame, and a housing, the circuit board is provided with the memory, the housing and the middle frame enclose the circuit board, and the circuit board is provided with the display panels according to the first aspect and the second aspect of the embodiments of the present application.
Specifically, referring to fig. 8, fig. 8 is a schematic block diagram of a hardware architecture of an electronic device 700 according to the present application, which may be an industrial computer, a tablet computer, a mobile phone, a notebook computer, etc., and this embodiment illustrates the mobile phone as an example.
The structure of the electronic device 700 may include a Radio Frequency (RF) circuit 710, a memory 720, an input unit 730, a display unit 740, a sensor 750, audio circuits 760, wiFi (wireless fidelity) module 770, a processor 780, a power supply 790, and the like. The RF circuit 710, the memory 720, the input unit 730, the display unit 740, the sensor 750, the audio circuit 760, and the WiFi module 770 are connected to the processor 780, respectively; the power supply 790 is used to provide power to the overall electronic device 700.
Specifically, RF circuit 710 is used to send and receive signals; memory 720 is used to store data instruction information; the input unit 730 is used for inputting information, and may specifically include a touch panel 731 and other input devices 732 such as operation keys; the display unit 740 may include a display panel, etc.; the sensor 750 includes an infrared sensor, a laser sensor, etc. for detecting a user proximity signal, a distance signal, etc.; the speaker 761 and microphone (or microphone) 762 are connected to the processor 780 through the audio circuit 760 for receiving and transmitting sound signals; the WiFi module 770 is configured to receive and transmit WiFi signals, and the processor 780 is configured to process data information of the mobile phone.
The foregoing description is only a partial embodiment of the present application, and is not intended to limit the scope of the present application, and all equivalent devices or equivalent processes using the descriptions and the drawings of the present application or directly or indirectly applied to other related technical fields are included in the scope of the present application.
Claims (10)
1. A display panel, the display panel comprising:
The pixel array comprises a substrate, a pixel array, a thin film transistor circuit and a thin film packaging layer which are sequentially stacked, wherein the substrate is a transparent substrate;
On a cross section, two ends of the thin film transistor circuit are provided with a first convex end and a second convex end, the first convex end and the second convex end are connected with the substrate, wherein the first direction is a direction intersecting or mutually perpendicular to a direction in which the substrate, the pixel array, the thin film transistor circuit and the thin film packaging layer of the display panel are sequentially laminated;
And the first convex body end is provided with a flip chip film bonding area for bonding the flip chip film and the integrated circuit in the direction of sequential lamination.
2. The display panel of claim 1, wherein the display panel comprises,
The thin film transistor circuit is also provided with a first main body part connected with the first convex body end and the second convex body end;
In the direction of the sequential lamination, the pixel array is sandwiched between the substrate and the first main body part;
In the first direction, the pixel array is sandwiched between the first convex end and the second convex end.
3. The display panel of claim 2, wherein the display panel comprises,
The thicknesses of the first main body part, the first convex body end and the second convex body end in the direction of sequential lamination are all equal;
the flip chip film is provided with a convex body part;
and a first accommodating area is formed between the plane where the first convex body end is positioned and the plane where the first main body part is positioned and is used for accommodating the convex body part, so that the flip chip film bonding area is bonded with the flip chip film through the convex body part.
4. The display panel according to claim 3, wherein,
The two ends of the film packaging layer are provided with a third convex body end and a fourth convex body end;
the first accommodating area is also used for accommodating the third convex body end;
And a second accommodating area is formed between the plane where the second convex body end is positioned and the plane where the first main body part is positioned, and the second accommodating area is used for accommodating the fourth convex body end so that two ends of the thin film transistor circuit are connected with two ends of the thin film packaging layer.
5. The display panel of claim 4, wherein the display panel comprises,
The film packaging layer is also provided with a second main body part connected with the third convex body end and the fourth convex body end;
In the direction of the sequential lamination, the thickness of the convex body part is larger than the sum of the thickness of the first accommodating area and the thickness of the second main body part.
6. The display panel according to claim 3, wherein,
The flip chip film is also provided with a third main body part which is connected with the convex body part in a bending way;
and an integrated circuit is arranged on one side of the third main body part far away from the film packaging layer.
7. The display panel of claim 1, wherein the display panel comprises,
The thin film transistor circuit is provided with a circuit, and the circuit is arranged at one side far away from the pixel array and close to the thin film packaging layer and is used for connecting the integrated circuit;
the thin film transistor circuit is provided with a plurality of through holes on the other side, which is close to the pixel array and far away from the thin film packaging layer, for connecting and driving the pixel array.
8. A display panel, which is characterized in that,
The pixel array comprises a substrate, a pixel array, a thin film transistor circuit and a thin film packaging layer which are sequentially stacked, wherein the substrate is a transparent substrate;
On a cross section, two ends of the thin film transistor circuit are provided with a first convex end and a second convex end, the first convex end and the second convex end are connected with the substrate, wherein the first direction is a direction intersecting or mutually perpendicular to a direction in which the substrate, the pixel array, the thin film transistor circuit and the thin film packaging layer of the display panel are sequentially laminated;
The first convex body end is provided with a bent substrate and a bent flip-chip film bonding area, and the inner side of the flip-chip film bonding area is provided with the thin film transistor circuit bent in the same radian;
The flip chip film bonding area is connected with the flip chip film, and an integrated circuit is arranged on one side of the flip chip film far away from the thin film transistor circuit.
9. A method of manufacturing a display panel, the method comprising:
providing a substrate, wherein the substrate is a substrate of the display panel;
setting a pixel array on the substrate based on an evaporation method;
A thin film transistor circuit is arranged on the pixel array, and two ends of the thin film transistor circuit are connected with two ends of the substrate so as to seal the pixel array;
and a thin film encapsulation layer is arranged on the thin film transistor circuit.
10. An electronic device, characterized in that the electronic device at least comprises a circuit board, a memory, a middle frame and a shell, wherein the memory is arranged on the circuit board, the circuit board is surrounded by the shell and the middle frame, and the display panel as claimed in any one of claims 1-8 is arranged on the circuit board.
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