CN114973979B - Display module and display device - Google Patents
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- CN114973979B CN114973979B CN202210557578.1A CN202210557578A CN114973979B CN 114973979 B CN114973979 B CN 114973979B CN 202210557578 A CN202210557578 A CN 202210557578A CN 114973979 B CN114973979 B CN 114973979B
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
- G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Abstract
The application provides a display module and a display device, wherein the display module comprises a display area, a splicing area and a binding area, and the splicing area and the binding area are respectively positioned at different sides of the display area; the display module comprises at least two display panels arranged along a first direction, wherein the display panels comprise a substrate, a display part arranged on the substrate and positioned in a display area, and a binding part arranged on the substrate and positioned in a binding area, and the binding part and the display part are arranged in parallel along the first direction; the display device comprises a display panel, a first packaging layer, a second packaging layer and a display module, wherein the display panel further comprises a first packaging sub-part adjacent to the display part, the first packaging sub-part is arranged in a splicing area, the first packaging sub-part is arranged between two display parts in any two adjacent display panels, and the first packaging sub-part of one display panel is arranged in parallel with the first packaging sub-part of the other display panel adjacent to the first packaging sub-part, so that seamless splicing of the display module is realized, and the display device has the characteristics of narrow frame and seamless display.
Description
Technical Field
The application relates to the technical field of display, in particular to a display module and a display device.
Background
With the development of display technologies, the demands of various oversized display devices are increasing, and the applications of the oversized display devices in various scenes are also becoming wider, so that the tiled display devices are becoming more and more important, and compared with a liquid crystal display (LiquidCrystalDisplay, LCD) and an organic light-emitting diode (organic light-EmittingDiode, OLED), a Micro light-emitting diode (Mini/Micro LED/Micro-LED, collectively referred to as MLED) is becoming a mainstream of display technologies due to advantages of lower power consumption, lower response time, higher PPI, higher color gamut, and the like.
In the prior art, a splicing technology is generally adopted to realize large-size display of the MLED, but at present, a frame with a certain width needs to be reserved on the periphery of a display area of the MLED display screen so as to be used for accommodating components such as a driving circuit, and the like, therefore, when the MLED display screens are spliced, the frames between adjacent MLED display screens form a splice, the continuity and the integrity of images are damaged, and the splicing effect is seriously influenced.
Disclosure of Invention
The embodiment of the application provides a display module and a display device, which are used for relieving the defects in the related art.
In order to achieve the above functions, the technical solution provided in the embodiments of the present application is as follows:
the embodiment of the application provides a display module, which comprises a display area, a splicing area and a binding area, wherein the splicing area and the binding area are respectively positioned at different sides of the display area;
the display module comprises at least two display panels arranged along a first direction, wherein the display panels comprise a substrate, a display part arranged on the substrate and positioned in the display area, and a binding part arranged on the substrate and positioned in the binding area, and the binding part and the display part are arranged in parallel along the first direction;
the display panel further comprises a first packaging layer adjacent to the display part, the first packaging layer comprises a first packaging sub-part positioned in the splicing area, the first packaging sub-part is arranged between any two adjacent display panels, and the first packaging sub-part of one display panel and the first packaging sub-part of the adjacent other display panel are arranged in parallel.
In the display module provided by the embodiment of the application, the display module comprises at least two display panel groups arranged along a second direction, each display panel group comprises two display panels arranged along the first direction, and the first direction is set to form a preset included angle with the second direction;
and the first packaging sub-parts of one display panel and the first packaging sub-parts of the other display panel are arranged in parallel.
In the display module provided by the embodiment of the application, the display panel further includes a second packaging layer located at one side of the display part far away from the substrate, the second packaging layer is located in the display area, and orthographic projection of the second packaging layer in a direction perpendicular to the display module covers the display part;
the first packaging layer further comprises a second packaging sub-part which is positioned on one side, far away from the display part, of the second packaging layer, the second packaging sub-part is positioned in the display area and the binding area, and orthographic projection of the second packaging sub-part in the direction perpendicular to the display module covers the second packaging layer and the binding area.
In the display module provided in the embodiment of the present application, the first packaging layer is an inorganic packaging layer, and the second packaging layer is an organic packaging layer.
In the display module provided by the embodiment of the application, the transmittance of the first packaging layer is greater than 99%, and the transmittance of the second packaging layer is greater than 95%.
In the display module provided in this embodiment of the present application, in the splicing area, along a direction perpendicular to the display module, a width of the first encapsulation layer ranges from 100 micrometers to 200 micrometers.
In the display module provided by the embodiment of the application, the display panel further includes a third packaging layer located at one side of the first packaging sub-portion away from the second packaging layer, and the third packaging layer is located in the splicing region;
and the third packaging layers are arranged between the two first packaging sub-parts in any two adjacent display panels, and the third packaging layer of one display panel and the third packaging layer of the other display panel are arranged in parallel.
In the display module provided in the embodiment of the present application, the third packaging layer is an organic packaging layer.
In the display module provided in this embodiment of the present application, in the splicing area, along a direction perpendicular to the display module, a sum of widths of the third encapsulation layer and the first encapsulation sub-portion ranges from 100 micrometers to 200 micrometers.
The embodiment of the application provides a display device, which comprises any one of the display modules.
The beneficial effects of the embodiment of the application are that: according to the embodiment of the application, the display module comprises a display area, a splicing area and a binding area, the splicing area and the binding area are respectively located on different sides of the display area, the display module comprises at least two display panels arranged along a first direction, each display panel comprises a substrate, a display part located in the display area and a binding part located in the binding area, the binding parts and the display parts are arranged in parallel along the first direction, the display panel further comprises a first packaging layer adjacent to the display part, the first packaging layer comprises a first packaging sub-part located in the splicing area, the first packaging sub-part is arranged between any two adjacent display panels, and the first packaging sub-part of one display panel and the first packaging sub-part of the other display panel are arranged in parallel, so that the display module is spliced in a seamless mode, and the display device has the characteristics of narrow frame and display.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;
fig. 2 is a first top cross-sectional view of a display module according to an embodiment of the disclosure;
fig. 3 is a schematic diagram of a second structure of the display module provided in the embodiment of the application;
fig. 4 is a schematic diagram of a third structure of the display module provided in the embodiment of the application;
fig. 5 is a second top cross-sectional view of the display module provided in the embodiment of the application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and explanation only and is not intended to limit the present application. In this application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used to generally refer to the upper and lower positions of the device in actual use or operation, and specifically the orientation of the drawing figures; while "inner" and "outer" are for the outline of the device.
The embodiment of the application provides a display module and a display device. The following will describe in detail. The following description of the embodiments is not intended to limit the preferred embodiments.
Referring to fig. 1 to 5, an embodiment of the present application provides a display module and a display device, where the display module 1 includes a display area a, a splicing area B, and a binding area C, where the splicing area B and the binding area C are located at different sides of the display area a respectively;
the display module 1 includes at least two display panels 100 disposed along a first direction X, where the display panels 100 include a substrate 10, a display portion 20 disposed on the substrate 10 and located in the display area a, and a binding portion 30 disposed on the substrate 10 and located in the binding area C, and the binding portion 30 and the display portion 20 are disposed in parallel along the first direction X;
the display panel 100 further includes a first encapsulation layer 41 adjacent to the display portion 20, the first encapsulation layer 41 includes a first encapsulation sub-portion 41A located in the splicing region B, the first encapsulation sub-portion 41A is disposed between any two adjacent display panels 100, and the first encapsulation sub-portion 41A of one display panel 100 and the first encapsulation sub-portion 41A of another adjacent display panel 100 are disposed in parallel.
It can be understood that in the prior art, a splicing technology is generally adopted to realize large-size display of Micro light emitting diodes (Mini/Micro light emitting diodes, mini/-LEDs/Micro-LEDs, collectively called MLEDs), but currently, a frame with a certain width needs to be reserved on the periphery of a display area of an MLED display screen so as to be used for accommodating components such as a driving circuit, and therefore, when the MLED display screen is spliced, a splice is formed by the frames between adjacent MLED display screens, thereby destroying continuity and integrity of images and seriously affecting the splicing effect.
According to the embodiment of the application, the display module 1 comprises a display area A, a splicing area B and a binding area C, the splicing area B and the binding area C are respectively located on different sides of the display area A, the display module 1 comprises at least two display panels 100 arranged along a first direction X, each display panel 100 comprises a substrate 10, a display part 20 located in the display area A and a binding part 30 located in the binding area C, the binding parts 30 and the display parts 20 are arranged in parallel along the first direction X, each display panel 100 further comprises a first packaging layer 41 adjacent to the display part 20, each first packaging layer 41 comprises a first packaging sub-part 41A located in the splicing area B, each two adjacent display panels 100 is provided with the first packaging sub-parts 41A, each first packaging sub-part 41A of each display panel 100 and each adjacent first packaging sub-part A of each display panel 100 are arranged in parallel, and therefore the display module has the advantage of being seamless, and the display module 1 is further provided with seamless display.
The technical solutions of the present application will now be described with reference to specific embodiments.
In one embodiment, please refer to fig. 1 and 2; fig. 1 is a schematic structural diagram of a display module provided in an embodiment of the present application; fig. 2 is a first top cross-sectional view of a display module according to an embodiment of the disclosure.
The embodiment provides a display module 1, the display module 1 includes a display area a, a splicing area B and a binding area C, where the splicing area B and the binding area C are respectively located at different sides of the display area a.
The display module 1 includes at least two display panels 100 disposed along a first direction X, where the display panels 100 include a substrate 10, a display portion 20 disposed on the substrate 10 and located in the display area a, and a binding portion 30 disposed on the substrate 10 and located in the binding area C, and the binding portion 30 and the display portion 20 are disposed in parallel along the first direction X; it can be appreciated that in this embodiment, by setting the splicing area B and the binding area C to be located at different sides of the display area a in the display module 1, the binding portion 30 is located outside the splicing area B, so that seamless display of two adjacent display panels 100 at the splicing position is achieved.
In this embodiment, the substrate 10 may include a rigid material or a flexible material, and when the material of the substrate 10 is a rigid material, the material of the substrate 10 may be metal or glass, and when the material of the substrate 10 is a flexible material, the material of the substrate 10 may include at least one of an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl resin, an epoxy-based resin, a polyurethane-based resin, a cellulose resin, a silicone resin, a polyimide-based resin, and a polyamide-based resin; it will be appreciated that the material of the substrate 10 is not particularly limited in this embodiment.
The display portion 20 includes a thin film transistor layer 21 and a display functional layer 22 that are stacked on the substrate 10, the display functional layer 22 includes a plurality of light emitting devices 221, and the bonding portion 30 and the thin film transistor layer 21 are arranged in parallel along the first direction X, wherein, hereinafter, the light emitting devices 221 are illustrated as Mini light emitting diodes (Mini/-LEDs) in this embodiment, and the light emitting devices 221 may be transferred to the thin film transistor layer 21 through a mass transfer process or a wave Soldering (SMT) process, without being limited thereto.
Further, in the present embodiment, the binding portion 30 includes a wiring layer 31 extending from the display area a into the binding area C, and the display panel 100 further includes a circuit board 60 electrically connected to the wiring layer 31; it can be understood that the light emitting device 221 is disposed in the display area a, and the wiring layer 31 includes a plurality of metal wires, and the plurality of metal wires extend into the display area a and are in signal connection with the light emitting device 221, so as to realize transmission of display signals.
It should be noted that, the thin film transistor layer 21 includes, but is not limited to, an active layer, a gate insulating layer, a gate electrode, an interlayer insulating layer, a source/drain electrode layer, a passivation layer, and other common film layers, which are not described in detail in this embodiment, it is understood that the type or structure of the thin film transistor is not specifically limited in this embodiment, and preferably, the thin film transistor layer 21 includes a plurality of top gate thin film transistors, and the light transmittance of the thin film transistor layer 21 is greater than 80%; in specific implementation, the thin film transistor layer 21 may be configured to perform a driving or switching function of the light emitting device 221.
Further, in the present embodiment, the display module 1 includes at least two display panel sets 1000 arranged along a second direction Y, each display panel set 1000 includes two display panels 100 arranged along the first direction X, and the first direction X is set to form a preset included angle with the second direction Y; in this embodiment, the range of the preset included angle and the directions of the first direction X and the second direction Y are not limited, but for convenience of description, the preset included angle is 90 °, the first direction is the X direction, and the second direction is the Y direction.
It should be noted that, in this embodiment, the technical solution of the present application is exemplified by the display module 1 including two display panel sets 1000 arranged along the second direction Y, where each display panel set 1000 includes two display panels 100 arranged along the first direction X.
In this embodiment, the display panel 100 further includes a first encapsulation layer 41 adjacent to the display portion 20, the first encapsulation layer 41 includes a first encapsulation sub-portion 41A located in the splicing region B, the first encapsulation sub-portion 41A is disposed between any two adjacent display panels 100 disposed along the first direction X, and the first encapsulation sub-portion 41A of one display panel 100 is disposed in parallel with the first encapsulation sub-portion 41A of another adjacent display panel 100.
Specifically, in this embodiment, in any two adjacent display panels 100 of the two adjacent display panel sets 1000 disposed along the second direction Y, the first package sub-portion 41A is disposed between the two display portions 20, and the first package sub-portion 41A of one display panel 100 and the first package sub-portion 41A of the other display panel 100 are disposed in parallel, preferably, in the splicing region B, the width of the first package layer 41 ranges from 100 micrometers to 200 micrometers along the direction perpendicular to the display module 1.
It can be appreciated that, in this embodiment, the first encapsulation layer 41 includes a first encapsulation sub-portion 41A located in the splicing region B, any two adjacent display panels 100 disposed along the first direction X are disposed between any two adjacent display panels 20, the first encapsulation sub-portion 41A is disposed between any two adjacent display panels 20 disposed along the second direction Y, and the first encapsulation sub-portion 41A is disposed between any two display panels 20, where the first encapsulation sub-portion 41A of one display panel 100 and the first encapsulation sub-portion 41A of another adjacent display panel 100 are disposed in parallel, that is, in this embodiment, the first encapsulation sub-portion 41A and the second encapsulation sub-portion 41A are disposed along the first direction X, and any two adjacent display panels 100 are bonded and spliced together by the first encapsulation sub-portion 41A, so that the seamless encapsulation of two adjacent display panels 100 is realized, and the display module 1 has the characteristics of narrow frame and seamless display, and compared with the conventional LCD device, the width of the OLED device is only about 3500 micrometers, and the display device has the width of the splice seam is about 3500, and the display device is provided with the width of the splice seam is about 400.
In this embodiment, the display panel 100 further includes a second encapsulation layer 42 located on a side of the display portion 20 away from the substrate 10, the second encapsulation layer 42 is located in the display area a, and a front projection of the second encapsulation layer 42 in a direction perpendicular to the display module 1 covers the display portion 20; specifically, the second encapsulation layer 42 is an organic encapsulation layer, the materials of the second encapsulation layer 42 include, but are not limited to, materials such as silica gel and epoxy resin, the transmittance of the materials of the second encapsulation layer 42 is greater than 95%, the shrinkage is lower than 4%, and the second encapsulation layer 42 is disposed on the side of the display function layer 22 away from the thin film transistor layer 21 and covers the plurality of light emitting devices 221, so as to achieve encapsulation protection for the plurality of light emitting devices 221, and prevent failure problems caused by interference of external environments, for example: water vapor, oxygen, etc.
The curing mode of the second encapsulation layer 42 includes Ultraviolet (UV) curing or heat curing, or ultraviolet and heat mixed curing, and the curing temperature of the second encapsulation layer 42 is lower than 150 ℃, preferably, the curing temperature of the second encapsulation layer 42 is lower than 100 ℃.
Further, the first encapsulation layer 41 further includes a second encapsulation sub-portion 41B located at a side of the second encapsulation layer 42 away from the display portion 20, the second encapsulation sub-portion 41B is located in the display area a and the binding area C, and an orthographic projection of the second encapsulation sub-portion 41B in a direction perpendicular to the display module 1 covers the second encapsulation layer 42 and the binding portion 30.
Specifically, as shown in fig. 1, the second packaging sub-portion 41B packages a side of the display portion 20 away from the substrate 10, the second packaging sub-portion 41B packages a side of the display portion 20 close to the binding portion 30, the second packaging sub-portion 41B packages a side of the binding portion 30 away from the substrate 10, and the second packaging sub-portion 41B packages a side of the substrate 10 close to the binding portion 30; preferably, the first encapsulation layer 41 is an inorganic encapsulation layer, and the material of the first encapsulation layer 41 includes, but is not limited to, at least one of silicon nitride SiNx, titanium dioxide TiO2 and silicon oxide SiOx, where the transmittance of the first encapsulation layer 41 is greater than 99%, and it is understood that, in this embodiment, by setting the transmittance of the first encapsulation layer 41 to be greater than 99%, the transmittance of the second encapsulation layer 42 to be greater than 95%, so that on the premise that the light emitting effect of the display panel 100 is not affected, the encapsulation protection is implemented on the display panel 100, and the service life of the display panel 100 is further improved; in addition, the second packaging sub-portion 41B packages the side of the binding portion 30 away from the substrate 10, so as to effectively improve the binding strength and prevent the metal of the binding portion 30 from being oxidized; it should be noted that, the first encapsulation layer 41 may be prepared by chemical vapor deposition, atomic layer deposition, or the like, which is not particularly limited in this embodiment.
In this embodiment, the display module 1 further includes a glass cover plate 50 (cover glass, CG) located on a side of the second package sub-portion 41B away from the substrate 10, where a front projection of the glass cover plate 50 in a direction perpendicular to the display module 1 covers the second package sub-portion 41B, and a surface of the glass cover plate 50 adjacent to the second package sub-portion 41B is parallel to a surface of the second package sub-portion 41B adjacent to the glass cover plate 50, and the second package sub-portion 41B can provide a flat supporting surface for the glass cover plate 50.
Specifically, the display module 1 includes a plurality of glass cover plates 50, one glass cover plate 50 corresponds to one display panel 100, and two adjacent glass cover plates 50 are bonded and packaged in the splicing area B, so as to realize integration of the plurality of glass cover plates 50; the thickness of the glass cover 50 may be selected according to the actual process conditions, which is not particularly limited in this embodiment.
It should be noted that, referring to fig. 3, in a second structural schematic diagram of the display module 1 provided in the embodiment of the present application, in another embodiment, the first encapsulation layer 41 further includes a third encapsulation sub-layer 41C located on a side of the substrate 10 away from the display portion 20, and the third encapsulation sub-layer 41C encapsulates a side of the substrate 10 away from the display portion 20, thereby further improving the service life of the display module 1, and using the first encapsulation layer 41 to effectively protect the display panel 100.
Please refer to fig. 4 and 5; fig. 4 is a schematic diagram of a third structure of the display module provided in the embodiment of the present application; fig. 5 is a second top cross-sectional view of the display module provided in the embodiment of the application.
In another embodiment, the structure of the display module is similar to/the first structure of the display module provided in the above embodiment, and please refer to the description of the display module in the above embodiment, which is not repeated herein, and the difference between the two is that:
in this embodiment, the display panel 100 further includes a third encapsulation layer 43 located on a side of the first encapsulation sub-portion 41A away from the second encapsulation layer 42, where the third encapsulation layer 43 is located in the splicing region B; in any two adjacent display panels 100, the third encapsulation layer 43 is disposed between the two first encapsulation sub-portions 41A, and the third encapsulation layer 43 of one display panel 100 is disposed in parallel with the third encapsulation layer 43 of the other display panel 100; preferably, in the splicing region B, the sum of the widths of the third encapsulation layer 43 and the first encapsulation sub-portion 41A in the direction perpendicular to the display module 1 ranges from 100 micrometers to 200 micrometers, wherein the width of the third encapsulation layer 43 is less than 300 micrometers, the width of the first encapsulation sub-portion 41A is less than 15 micrometers, preferably the width of the third encapsulation layer 43 is less than 200 micrometers, and the width of the first encapsulation sub-portion 41A ranges from 5 micrometers to 10 micrometers.
It can be appreciated that in this embodiment, the display panel 100 includes the third encapsulation layer 43 located in the splicing area B, where the third encapsulation layer 43 is disposed between two first encapsulation sub-portions 41A of any two adjacent display panels 100, and the third encapsulation layer 43 of one display panel 100 and the third encapsulation layer 43 of the other adjacent display panel 100 are disposed in parallel, that is, in this embodiment, in the first direction X and in the second direction Y, any two adjacent display panels 100 are spliced by the third encapsulation layer 43, so that seamless encapsulation of two adjacent display panels 100 is achieved, and further, the display module 1 has the characteristics of narrow frame and seamless display, where compared with the minimum splice width in the existing LCD display device, which is 1700 micrometers, and compared with the minimum splice width of the existing OLED display device, the splice width of the display module 1 provided in this embodiment is only about 400 micrometers, and the splice width of the splice is reduced, which has wide prospects.
It should be noted that, compared to the above embodiment, the two adjacent display panels 100 are bonded and spliced by the first package sub-portion 41A, because the first package sub-portion 41A is an inorganic package layer, when the two adjacent first package sub-portions 41A are bonded, the inorganic package layer is easy to be impacted by external force to generate cracks, so as to cause package failure, in this embodiment, the two adjacent display panels 100 are bonded and spliced by the third package layer 43, the third package layer 43 is an organic package layer, and a composite package layer formed by the inorganic layer and the organic layer is adopted in the splicing region B, so that the composite package layer has a better packaging effect, and the splicing effect of the two adjacent display panels 100 is improved.
Specifically, the third encapsulation layer 43 is disposed around the display panel 100, the third encapsulation layer 43 encapsulates a side of the first encapsulation sub-portion 41A away from the second encapsulation layer 42, the third encapsulation layer 43 encapsulates a side of the second encapsulation sub-portion 41B away from the binding portion 30, and the third encapsulation layer 43 encapsulates a side of the second encapsulation sub-portion 41B away from the substrate 10; preferably, the third packaging layer 43 is an organic packaging layer, the material of the third packaging layer 43 includes but is not limited to high molecular polymers such as epoxy resin, acrylic resin and polyurethane, the transmittance of the third packaging layer 43 is more than 90%, and the Water Vapor Transmittance (WVTR) is less than 4g/m 2 24h, thereby further realizing package protection for the plurality of light emitting devices 221, preventing failure problems of the light emitting devices 221 due to interference of external environment, for example: water vapor, oxygen, etc.
The embodiment provides a display device, which includes the display module set described in any one of the embodiments.
It will be appreciated that the light emitting module has been described in detail in the above embodiments, and the description thereof will not be repeated here.
When the display device is specifically applied, the display device can be a display screen of equipment such as a smart phone, a tablet personal computer, a notebook computer, a smart bracelet, a smart watch, smart glasses, a smart helmet, a desktop computer, a smart television or a digital camera, and even can be applied to electronic equipment with a flexible display screen.
In summary, the application provides a display module and display device, through setting up the display module includes display area, splice area and binding area, splice area with binding area is located respectively the different sides of display area, the display module includes two at least display panel that set up along first direction, display panel includes the basement, is located display portion in the display area and be located binding portion in the binding area, binding portion with display portion is followed the first direction and is set up side by side, display panel still includes with the adjacent first encapsulation layer of display portion, first encapsulation layer is including being located in the splice area, in any two adjacent display panel, two all be equipped with between the display portion first encapsulation sub-portion, and one of them display panel first encapsulation sub-portion with adjacent another display panel first encapsulation sub-portion sets up, thereby has realized display module's concatenation, and then has seamless display device has characteristics that the seamless is narrow.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
The foregoing has described in detail a display module and a display device provided by embodiments of the present application, and specific examples have been applied herein to illustrate principles and embodiments of the present application, where the foregoing description of the embodiments is only for aiding in understanding of the method and core ideas of the present application; meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.
Claims (9)
1. The display module is characterized by comprising a display area, a splicing area and a binding area, wherein the splicing area and the binding area are respectively positioned at different sides of the display area;
the display module comprises at least two display panels arranged along a first direction, wherein the display panels comprise a substrate, a display part arranged on the substrate and positioned in the display area, and a binding part arranged on the substrate and positioned in the binding area, and the binding part and the display part are arranged in parallel along the first direction;
the display panel further comprises a first packaging layer adjacent to the display part, the first packaging layer comprises a first packaging sub-part positioned in the splicing area and a third packaging sub-layer positioned on one side of the substrate far away from the display part, orthographic projection of the display part on the first packaging sub-part is positioned in the first packaging sub-part, the first packaging sub-part is arranged between any two adjacent display panels, the first packaging sub-part of one display panel and the first packaging sub-part of the other adjacent display panel are arranged in parallel, and the third packaging sub-layer packages one side of the substrate far away from the display part; and in the splicing area, the width of the first packaging layer ranges from 100 micrometers to 200 micrometers along the direction perpendicular to the display module.
2. The display module of claim 1, wherein the display module comprises at least two display panel groups arranged along a second direction, each display panel group comprising two display panels arranged along the first direction, the first direction being disposed at a predetermined angle with respect to the second direction;
and the first packaging sub-parts of one display panel and the first packaging sub-parts of the other display panel are arranged in parallel.
3. The display module according to claim 2, wherein the display panel further comprises a second encapsulation layer located on a side of the display portion away from the substrate, the second encapsulation layer being located in the display area, and an orthographic projection of the second encapsulation layer in a direction perpendicular to the display module covering the display portion;
the first packaging layer further comprises a second packaging sub-part which is positioned on one side, far away from the display part, of the second packaging layer, the second packaging sub-part is positioned in the display area and the binding area, and orthographic projection of the second packaging sub-part in the direction perpendicular to the display module covers the second packaging layer and the binding area.
4. A display module according to claim 3, wherein the first encapsulation layer is an inorganic encapsulation layer and the second encapsulation layer is an organic encapsulation layer.
5. The display module of claim 4, wherein the first encapsulation layer has a transmittance of greater than 99% and the second encapsulation layer has a transmittance of greater than 95%.
6. The display module of claim 3, wherein the display panel further comprises a third encapsulation layer located on a side of the first encapsulation sub-portion away from the second encapsulation layer, the third encapsulation layer being located within the stitching region;
and the third packaging layers are arranged between the two first packaging sub-parts in any two adjacent display panels, and the third packaging layer of one display panel and the third packaging layer of the other display panel are arranged in parallel.
7. The display module of claim 6, wherein the third encapsulation layer is an organic encapsulation layer.
8. The display module of claim 7, wherein a sum of widths of the third encapsulation layer and the first encapsulation sub-portion in a direction perpendicular to the display module within the stitching region ranges from 100 micrometers to 200 micrometers.
9. A display device comprising a display module according to any one of claims 1-8.
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