CN114951095B - Automatic cleaning method for digital array module - Google Patents
Automatic cleaning method for digital array module Download PDFInfo
- Publication number
- CN114951095B CN114951095B CN202210381476.9A CN202210381476A CN114951095B CN 114951095 B CN114951095 B CN 114951095B CN 202210381476 A CN202210381476 A CN 202210381476A CN 114951095 B CN114951095 B CN 114951095B
- Authority
- CN
- China
- Prior art keywords
- cleaning
- pressure
- solvent
- digital array
- resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
Abstract
The invention discloses an automatic cleaning method for a digital array module, which adopts an integral cleaning device for the digital array module, when the digital array module to be cleaned is fixed on a carrying device, after reaching the vacuum degree in a pressure-resistant cleaning cavity, a vacuum device suspends working cleaning solvent and is pressurized by a liquid pressurizing device and then injected into the pressure-resistant cleaning cavity to spray and clean the digital array module; after the spraying and cleaning are finished, the heat exchange device starts to work, heat exchange heating is carried out on the cleaning solvent at the bottom of the pressure-resistant cleaning cavity, the cleaning solvent gradually reaches the boiling point, and the pressure-resistant cleaning cavity is kept in a negative pressure state to accelerate the gasification of the solvent; saturated steam of the solvent is sent to a buffer tank at the outlet end of the vacuum device, and the saturated steam is quickly liquefied under the double actions of high pressure and large temperature difference and is pressed back to the pressurization liquid storage tank; the invention realizes the automatic cleaning of the whole digital array module, improves the environmental protection property by recycling the solvent, and greatly reduces the energy consumption compared with the traditional solvent cleaning machine.
Description
Technical Field
The invention relates to the technical field of module cleaning, in particular to an automatic cleaning method for a digital array module.
Background
The digital array module integrates various technologies such as a photoelectric modulation and demodulation technology, a digital receiving and transmitting technology, an integration technology and the like, can finish radar radio frequency receiving and transmitting digitization and related data preprocessing, can realize high-speed transmission of a large amount of data, and has various functions such as formation of multi-channel digital beams, generation of multi-channel waveforms, multi-channel power amplification, multi-channel digitization and the like.
The digital array module with multiple functions contains components made of different materials, such as metal, rubber, plastic, a power module, a PCB (printed circuit board), ceramic, heat conducting ester, sealant and the like. Traditional halogen solvents, fc (fluorocarbon) solvents, and water-based cleaning agents all cause severe corrosion of one or more materials in the digital array module, resulting in poor performance. Meanwhile, the volatility of the high-boiling-point solvent and the water-based cleaning agent is poor, and the cleaning agent is not easy to dry and can easily cause the corrosion of welding spot pins.
Therefore, the digital array module can not be wholly cleaned for a long time, only parts of the digital array module can be assembled after being cleaned in a classified mode, and after the assembly is completed, a cotton swab can be used for dipping a solvent to locally clean welding points of the digital array module manually, so that the efficiency is low, and the cleaning quality is unstable.
In view of the above-mentioned drawbacks, the inventors of the present invention have finally obtained the present invention through a long period of research and practice.
Disclosure of Invention
In order to solve the technical defects, the invention adopts a technical scheme that an automatic cleaning method for a digital array module is provided, and comprises the following steps:
after the digital array module to be cleaned is fixed on the carrying device, the pressure-resistant cleaning cavity is closed and sealed;
the vacuum device starts to work, air in the pressure-resistant cleaning cavity is exhausted, and the vacuum device stops working after the vacuum degree in the pressure-resistant cleaning cavity is reached;
the cleaning solvent in the pressurized liquid storage tank is pressurized by the liquid pressurizing device and then injected into the pressure-resistant cleaning cavity to spray and clean the digital array module, and meanwhile, the carrying device operates to drive the digital array module to reciprocate back and forth; after the spraying and cleaning are finished, the carrying device and the liquid pressurizing device stop working;
the heat exchange device starts to work, and heat exchange and temperature rise are carried out on the cleaning solvent at the bottom of the pressure-resistant cleaning cavity, so that the cleaning solvent gradually reaches the boiling point; the vacuum device works simultaneously in the process of gradually gasifying the cleaning solvent, so that the negative pressure state is kept in the pressure-resistant cleaning cavity to accelerate the solvent gasification;
the outlet end of the vacuum device sends saturated steam of the solvent into the buffer tank, after the pressure in the buffer tank gradually rises to reach the starting pressure of the gas supercharging device, the gas supercharging device starts to work to further pressurize the saturated steam of the cleaning solvent, the temperature difference of the saturated steam of the cleaning solvent is further increased when the cold exchange device provides cold energy, and the saturated steam of the cleaning solvent is rapidly liquefied under the dual effects of high pressure and large temperature difference and is pressed back to the pressurizing liquid storage tank.
Preferably, the weighing devices are arranged at the bottoms of the pressurizing liquid storage tank and the pressure-resistant cleaning cavity, the amount of the solvent used in the spraying and cleaning process and the amount of the solvent recovered in the pressure return stage are monitored, and when the recovered solvent is used for achieving the recovery target, the cleaning period is completed.
The whole cleaning device for the digital array module comprises a pressure-resistant cleaning cavity, a buffer tank, a heat exchange device, a pressurization liquid storage tank, a cold exchange device, a waste liquid recovery tank and a vacuum device, wherein a carrying device is arranged in the pressure-resistant cleaning cavity, the pressure-resistant cleaning cavity is communicated with the pressurization liquid storage tank, a liquid pressurization device is arranged between the pressure-resistant cleaning cavity and the pressurization liquid storage tank, a cleaning solvent is arranged in the pressurization liquid storage tank, the heat exchange device is connected with the pressure-resistant cleaning cavity through a thermal circulation pipeline, the upper portion of the pressure-resistant cleaning cavity is communicated with the vacuum device, the vacuum device is connected with the buffer tank, the buffer tank is communicated with the pressurization liquid storage tank through a cold circulation pipeline, the cold exchange device is communicated with the pressurization liquid storage tank, a gas pressurization device is further arranged between the buffer tank and the cold exchange device, the pressure-resistant cleaning cavity is provided with the bottom of the pressurization liquid storage tank, and the waste liquid recovery tank is connected with the pressure-resistant cleaning cavity through a waste discharge pipeline.
Preferably, the cleaning solvent is a hydrofluoroether or hydrofluorooxy solvent.
Preferably, the pressure-resistant cleaning cavity is sealed by pneumatic sealing or thread sealing.
Preferably, the carrying device adopts magnetic fluid seal transmission or permanent magnet seal transmission.
Preferably, the liquid boosting device is an electric booster pump or a pneumatic booster pump.
Preferably, the heat exchange device adopts a shell-and-tube heat exchanger or a plate heat exchanger.
Preferably, the cold exchange device is a shell-and-tube type cold exchanger or a plate type cold exchanger, and the cold source is a refrigerant refrigerator or a cold water refrigerator.
Preferably, the vacuum device adopts an air-cooled or water-cooled vacuum generator, and adopts air drive or electric drive.
Preferably, the buffer tank is a pressure-resistant buffer tank or a pressure-resistant buffer tank.
Preferably, the gas supercharging device adopts an electric booster pump or a pneumatic booster pump.
Preferably, the weighing device is a weighing sensor or a weighing electronic scale.
Compared with the prior art, the invention has the beneficial effects that: the invention directly carries out integral cleaning on the digital array module, replaces manual cleaning, and improves the efficiency and the quality stability; 2, the invention solves the problems of water pollution and solvent residue after cleaning and drying by utilizing the physical characteristics of the volatile solvent with low boiling point; meanwhile, the low boiling point characteristic of the solvent ensures that the heat and cold absorbed in the solvent recovery process are little, thereby greatly reducing the energy consumption; the solvent is recycled, so that better environmental protection is realized, and the defect that the low-boiling-point volatile solvent is difficult to use is overcome; 3, the invention has strong universality, small occupied area, low manufacturing cost and more flexible layout.
Drawings
FIG. 1 is a schematic connection diagram of the integrated cleaning apparatus for digital array modules;
FIG. 2 is a structural view of the overall cleaning apparatus for the digital array module;
fig. 3 is a schematic view of the internal structure of the pressure-resistant cleaning chamber.
The figures in the drawings represent:
1-pressure-resistant cleaning cavity; 2-a buffer tank; 3-heat exchange means; 4-a pressurized liquid storage tank; 5-a cold exchange device; 6-a waste liquid recovery tank; 7-liquid pressurizing means; 8-vacuum device; 9-a gas pressurization device; 10-a weighing device; 11-a carrier; 12-a digital array module; 13-nozzle.
Detailed Description
The above and further features and advantages of the present invention are described in more detail below with reference to the accompanying drawings.
As shown in fig. 1 and 2, fig. 1 is a schematic connection diagram of the overall cleaning device for the digital array module; fig. 2 is a structural view of the overall cleaning apparatus for the digital array module.
The integral cleaning device for the digital array module comprises a pressure-resistant cleaning cavity 1, a buffer tank 2, a heat exchange device 3, a pressurized liquid storage tank 4, a cold exchange device 5, a waste liquid recovery tank 6 and a vacuum device 8, wherein a carrying device 11 is arranged in the pressure-resistant cleaning cavity 1, the pressure-resistant cleaning cavity 1 is communicated with the pressurized liquid storage tank 4, a liquid pressurizing device 7 is arranged between the pressure-resistant cleaning cavity 1 and the pressurized liquid storage tank 4, a cleaning solvent is arranged in the pressurized liquid storage tank 4, the heat exchange device 3 is connected with the pressure-resistant cleaning cavity 1 through a thermal circulation pipeline, the upper part of the pressure-resistant cleaning cavity 1 is communicated with the vacuum device 8, the vacuum device 8 is connected with the buffer tank 2, the buffer tank 2 is communicated with the pressurized liquid storage tank 4 through the cold circulation pipeline 5 to realize the closed loop of a gas path and a liquid path, a gas pressurizing device 9 is further arranged between the buffer tank 2 and the cold exchange device 5, weighing devices 10 are arranged at the bottoms of the pressure-resistant cleaning cavity 1 and the pressurized liquid storage tank 4, and the waste liquid recovery tank 6 are connected with the pressure-resistant cleaning cavity 1 through a waste liquid recovery tank.
Preferably, the cleaning solvent is an HFE (hydrofluoroether family) or HFO (hydrofluorooxygen family) solvent.
Preferably, the pressure-resistant cleaning cavity 1 is sealed by pneumatic sealing or thread sealing, and can resist vacuum and positive pressure.
Preferably, the carrying device 11 adopts magnetic fluid seal transmission or permanent magnet seal transmission.
Preferably, the liquid supercharging device 7 is an electric booster pump or a pneumatic booster pump.
Preferably, the heat exchange device 3 is a shell-and-tube heat exchanger or a plate heat exchanger.
Preferably, the cold exchanging device 5 is a shell-and-tube type cold exchanger or a plate type cold exchanger, and the cold source is a refrigerant refrigerator or a cold water refrigerator.
Preferably, the vacuum device 8 adopts an air-cooled or water-cooled vacuum generator, and is driven by air or electricity.
Preferably, the buffer tank 2 is a pressure-resistant buffer tank or a pressure-resistant buffer tank.
Preferably, the gas supercharging device 9 is an electric booster pump or a pneumatic booster pump.
Preferably, the weighing device 10 is a weighing sensor or a weighing electronic scale.
The invention directly carries out integral cleaning on the digital array module, replaces manual cleaning, and improves the efficiency and the quality stability.
The invention utilizes the physical characteristics of the volatile solvent with low boiling point to solve the problems of water pollution and solvent residue after cleaning and drying. Meanwhile, the low boiling point of the solvent ensures that the heat and the cold absorbed in the solvent recovery process are less, thereby greatly reducing the energy consumption. The recycling of the solvent realizes better environmental protection and also solves the defect that the low-boiling-point volatile solvent is difficult to use.
The invention has strong universality, small occupied area, low manufacturing cost and more flexible layout.
The invention discloses an automatic cleaning method for a digital array module, which comprises the following steps:
after the digital array module 12 to be cleaned is fixed on the carrier 11, the pressure-resistant cleaning chamber 1 is closed and sealed.
And the vacuum device 8 starts to work, the air in the pressure-resistant cleaning cavity 1 is exhausted as much as possible, the influence of water vapor in the air on the cleaning and drying process is avoided, and the vacuum device 8 stops working after the vacuum degree is reached.
The cleaning solvent in the pressurized liquid storage tank 4 is pressurized by the liquid pressurizing device 7 and then injected into the pressure-resistant cleaning cavity 1, the pipeline terminal is provided with a nozzle 13 to enable the solvent to be uniformly dispersed and distributed, and meanwhile, the carrying device 11 operates to drive the digital array module to reciprocate back and forth, so that no dead angle exists in the spraying and cleaning process of the digital array module.
The high-pressure spraying cleaning mode can ensure that each part of the digital array module can be contacted with the solvent, the impact force after the solvent is pressurized can be used for washing away the dirt welding slag, meanwhile, the time for contacting the solvent can be as short as possible, and the possibility of undesirable occurrence of corrosion and the like is reduced.
After the spraying and cleaning are finished, the carrying device 11 and the liquid pressurizing device 7 stop working.
At this time, the heat exchange device 3 starts to operate, and heat exchange is performed on the cleaning solvent at the bottom of the pressure-resistant cleaning chamber 1 to raise the temperature, so that the cleaning solvent gradually reaches the boiling point. The preferred solvent boiling point of the cleaning solvent in this example is as low as about 20 c, which is very energy efficient near room temperature.
And in the process of gradually gasifying the solvent, the vacuum device 8 works simultaneously, so that the pressure-resistant cleaning cavity 1 is kept in a negative pressure state to accelerate the solvent gasification.
The outlet end of the vacuum device 8 sends saturated steam of the solvent into the buffer tank 2, the pressure in the buffer tank 2 gradually rises to reach the starting pressure of the gas pressurizing device 9, at the moment, the gas pressurizing device 9 starts to work to further pressurize the saturated steam of the cleaning solvent, meanwhile, heat is generated along with the compression process to further heat the gaseous cleaning solvent, the heat is also utilized, the temperature difference is further increased when the solvent saturated steam is subsequently used for providing cold energy by the cold exchange device 3, and the saturated steam of the cleaning solvent is rapidly liquefied under the double effects of high pressure and large temperature difference and is pressed back to the pressurizing liquid storage tank 4.
The weighing device 10 is installed at the bottom of the pressurizing liquid storage tank 4 and the pressure-resistant cleaning cavity 1, the solvent with the mass is injected in the spraying stage, the solvent with the mass is recovered in the recovery stage, and when the recovery target is reached, the device stops working. And discharging the residual waste liquid and waste residues in the pressure-resistant cleaning cavity 1 into the waste liquid recovery tank 6, and finishing a cleaning beat.
To sum up, this digital array module belt cleaning device has realized the holistic automatic washing of digital array module, and solvent recovery recycles and has improved the feature of environmental protection, and the energy consumption is also greatly reduced than traditional solvent cleaning machine.
The foregoing is merely a preferred embodiment of the invention, which is intended to be illustrative and not limiting. It will be understood by those skilled in the art that various changes, modifications and equivalents may be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. An automatic cleaning method for a digital array module is characterized in that an integral cleaning device for the digital array module is adopted, the integral cleaning device for the digital array module comprises a pressure-resistant cleaning cavity, a buffer tank, a heat exchange device, a pressurized liquid storage tank, a cold exchange device, a waste liquid recovery tank and a vacuum device, a carrying device is arranged in the pressure-resistant cleaning cavity, the pressure-resistant cleaning cavity is communicated with the pressurized liquid storage tank, a liquid pressurizing device is arranged between the pressure-resistant cleaning cavity and the pressurized liquid storage tank, a cleaning solvent is arranged in the pressurized liquid storage tank, the heat exchange device is connected with the pressure-resistant cleaning cavity through a thermal circulation pipeline, the upper part of the pressure-resistant cleaning cavity is communicated with the vacuum device, the vacuum device is connected with the buffer tank, the buffer tank is communicated with the pressurized liquid storage tank through a cold circulation pipeline through the cold exchange device, a gas pressurization device is further arranged between the buffer tank and the cold exchange device, weighing devices are arranged at the bottoms of the pressure-resistant cleaning cavity and the pressurized liquid storage tank, and the waste liquid recovery tank is connected with the pressure-resistant cleaning cavity through a waste discharge pipeline;
the automatic cleaning method for the digital array module comprises the following steps:
after the digital array module to be cleaned is fixed on the carrying device, the pressure-resistant cleaning cavity is closed and sealed;
the vacuum device starts to work, air in the pressure-resistant cleaning cavity is exhausted, and the vacuum device stops working after the vacuum degree in the pressure-resistant cleaning cavity is reached;
the cleaning solvent in the pressurized liquid storage tank is pressurized by the liquid pressurizing device and then injected into the pressure-resistant cleaning cavity to spray and clean the digital array module, and meanwhile, the carrying device operates to drive the digital array module to reciprocate back and forth; after the spraying and cleaning are finished, the carrying device and the liquid pressurizing device stop working;
the heat exchange device starts to work, and heat exchange and temperature rise are carried out on the cleaning solvent at the bottom of the pressure-resistant cleaning cavity, so that the cleaning solvent gradually reaches the boiling point; the vacuum device works simultaneously in the process of gradually gasifying the cleaning solvent, so that the negative pressure state is kept in the pressure-resistant cleaning cavity to accelerate the solvent gasification;
the outlet end of the vacuum device sends saturated steam of a solvent into the buffer tank, after the pressure in the buffer tank gradually rises to reach the starting pressure of the gas supercharging device, the gas supercharging device starts to work to further pressurize the saturated steam of the cleaning solvent, the temperature difference of the saturated steam of the cleaning solvent is further increased when the cold exchange device provides cold energy, and the saturated steam of the cleaning solvent is rapidly liquefied under the dual effects of high pressure and large temperature difference and is pressed back to the pressurizing liquid storage tank;
the cleaning solvent is a hydrofluoro-oxygen family solvent.
2. The automatic cleaning method for digital array module according to claim 1, wherein said weighing device is installed at the bottom of said pressurized liquid storage tank and said pressure-resistant cleaning chamber, the amount of solvent used in the spray cleaning process and the amount of solvent recovered in the press-back stage are monitored, and when the recovered amount of solvent reaches the recovery target, the cleaning cycle is completed.
3. The automated cleaning method for digital array modules according to claim 2, wherein the pressure-resistant cleaning chamber is sealed by pneumatic sealing or thread sealing.
4. The automated cleaning method for digital array modules according to claim 2, wherein the carrier device employs a magnetic fluid seal drive or a permanent magnet seal drive.
5. The method of claim 2, wherein the heat exchange device is a shell and tube heat exchanger or a plate heat exchanger.
6. The method according to claim 2, wherein the cold exchanging device is a shell-and-tube type cold exchanger or a plate type cold exchanger, and the cold source is a refrigerant refrigerator or a cold water refrigerator.
7. The automated cleaning method for digital array modules according to claim 2, wherein the vacuum means employs an air-cooled or water-cooled vacuum generator, and is driven pneumatically or electrically.
8. The automated cleaning method for digital array modules according to claim 2, wherein the liquid pressurizing means and the gas pressurizing means employ electric booster pumps or pneumatic booster pumps.
9. The automated cleaning method for digital array modules of claim 2, wherein the weighing device is a load cell or a weighing scale.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210381476.9A CN114951095B (en) | 2022-04-11 | 2022-04-11 | Automatic cleaning method for digital array module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210381476.9A CN114951095B (en) | 2022-04-11 | 2022-04-11 | Automatic cleaning method for digital array module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114951095A CN114951095A (en) | 2022-08-30 |
| CN114951095B true CN114951095B (en) | 2023-04-18 |
Family
ID=82977501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210381476.9A Active CN114951095B (en) | 2022-04-11 | 2022-04-11 | Automatic cleaning method for digital array module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114951095B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5538025A (en) * | 1991-11-05 | 1996-07-23 | Serec Partners | Solvent cleaning system |
| JPH09117603A (en) * | 1995-10-26 | 1997-05-06 | Muramoto Kosakusho:Kk | Solvent-recovering apparatus |
| JP2004025074A (en) * | 2002-06-27 | 2004-01-29 | Nok Corp | Degreasing and washing apparatus |
| JP2011016079A (en) * | 2009-07-09 | 2011-01-27 | Denso Corp | Cleaning apparatus |
| JP2012009705A (en) * | 2010-06-25 | 2012-01-12 | Tokyo Electron Ltd | High temperature and high pressure processing method, high temperature and high pressure processing device, and memory medium |
| CN107413760A (en) * | 2017-08-29 | 2017-12-01 | 中国电子科技集团公司第三十八研究所 | The water base Environment protection cleaning method and cleaning device of a kind of scaling powder on radar electric component |
| JP2020131068A (en) * | 2019-02-14 | 2020-08-31 | アクトファイブ株式会社 | Cleaning liquid recovery device |
| JP2020192515A (en) * | 2019-05-30 | 2020-12-03 | アクトファイブ株式会社 | Steam cleaning/decompression drying device |
| CN212998418U (en) * | 2020-06-24 | 2021-04-20 | 山东东岳高分子材料有限公司 | Low boiling point solvent regeneration and recovery device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102091508A (en) * | 2010-12-27 | 2011-06-15 | 北京工业大学 | Gas washing and recovering device for preparing macromonomers of poly carboxylic acid water reducing agent |
| CN102825022B (en) * | 2012-09-06 | 2014-12-10 | 天津杰科同创科技发展有限公司 | Workpiece cleaner |
| CN106583367B (en) * | 2016-11-24 | 2019-11-22 | 北京航天试验技术研究所 | A kind of vapour phase cleaning system and method for propellant tank |
| CN107243477A (en) * | 2017-05-26 | 2017-10-13 | 深圳市科伟达超声波设备有限公司 | A kind of Cleaning of Parts system and cleaning method |
| CN208758215U (en) * | 2018-08-14 | 2019-04-19 | 上海台姆超声设备有限公司 | Full-automatic hydrocarbon vacuum ring protects cleaning machine |
| CN214184324U (en) * | 2020-12-25 | 2021-09-14 | 安图实验仪器(郑州)有限公司 | Cleaning system for automatic sample adding system |
| CN215691833U (en) * | 2021-02-20 | 2022-02-01 | 中国石油天然气股份有限公司 | Integral straight-run diesel oil furfural extraction small test device |
-
2022
- 2022-04-11 CN CN202210381476.9A patent/CN114951095B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5538025A (en) * | 1991-11-05 | 1996-07-23 | Serec Partners | Solvent cleaning system |
| JPH09117603A (en) * | 1995-10-26 | 1997-05-06 | Muramoto Kosakusho:Kk | Solvent-recovering apparatus |
| JP2004025074A (en) * | 2002-06-27 | 2004-01-29 | Nok Corp | Degreasing and washing apparatus |
| JP2011016079A (en) * | 2009-07-09 | 2011-01-27 | Denso Corp | Cleaning apparatus |
| JP2012009705A (en) * | 2010-06-25 | 2012-01-12 | Tokyo Electron Ltd | High temperature and high pressure processing method, high temperature and high pressure processing device, and memory medium |
| CN107413760A (en) * | 2017-08-29 | 2017-12-01 | 中国电子科技集团公司第三十八研究所 | The water base Environment protection cleaning method and cleaning device of a kind of scaling powder on radar electric component |
| JP2020131068A (en) * | 2019-02-14 | 2020-08-31 | アクトファイブ株式会社 | Cleaning liquid recovery device |
| JP2020192515A (en) * | 2019-05-30 | 2020-12-03 | アクトファイブ株式会社 | Steam cleaning/decompression drying device |
| CN212998418U (en) * | 2020-06-24 | 2021-04-20 | 山东东岳高分子材料有限公司 | Low boiling point solvent regeneration and recovery device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114951095A (en) | 2022-08-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN217121040U (en) | Integral cleaning device for digital array module | |
| CN114951095B (en) | Automatic cleaning method for digital array module | |
| CN212041740U (en) | Cleaning equipment for electronic display screen | |
| CN202570687U (en) | Electronic component cleaning device | |
| CN204730518U (en) | Organic Rankine-function of mechanical steam recompression the heat pump of Driven by Solar Energy | |
| CN108630522A (en) | The cleaning method of chip surface | |
| CN210536533U (en) | Production waste heat recovery cyclic utilization device | |
| CN208116272U (en) | A kind of ultrasonic cleaning equipment | |
| CN210036046U (en) | A drying-machine for OLED manufacturing installation | |
| CN214020068U (en) | Yellow phosphorus tail gas purification power generation facility | |
| KR20180137297A (en) | Inspection equipment and method for recycled radiator | |
| CN101728747B (en) | Cleaning method of probe and chip socket | |
| CN204710773U (en) | A kind of automobile batteries is integrated and connected the cleaning equipment of aluminium sheet | |
| CN210304889U (en) | Plasma cleaning machine for automobile power battery | |
| CN112845391A (en) | Low-temperature maintenance method and low-temperature maintenance device applied to circuit board production equipment | |
| CN109631365B (en) | Method for cleaning glass outer tube of solar vacuum heat collecting tube | |
| CN215314439U (en) | Be applied to low temperature maintenance device of circuit board production facility | |
| CN108439513B (en) | Low-temperature atomization evaporator for wastewater | |
| CN219425102U (en) | Cleaning device for etching VC soaking plate | |
| CN216008616U (en) | Liquid-air energy storage power generation device | |
| CN202308012U (en) | Washing device of solar battery silicon wafers | |
| CN111800933A (en) | Medium-temperature annealing method for superconducting cavity | |
| CN220872003U (en) | Pneumatic element testing arrangement | |
| CN215951831U (en) | Condenser with high heat exchange efficiency | |
| CN108856071A (en) | A kind of porous, multichannel auto parts and components cleaning system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |