CN114927450A - Transmission device and semiconductor processing equipment - Google Patents

Transmission device and semiconductor processing equipment Download PDF

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Publication number
CN114927450A
CN114927450A CN202210587775.8A CN202210587775A CN114927450A CN 114927450 A CN114927450 A CN 114927450A CN 202210587775 A CN202210587775 A CN 202210587775A CN 114927450 A CN114927450 A CN 114927450A
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China
Prior art keywords
wafer
assembly
pushing
clamping
bearing
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Granted
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CN202210587775.8A
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Chinese (zh)
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CN114927450B (en
Inventor
郭亨
巫双
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Beijing Naura Microelectronics Equipment Co Ltd
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Beijing Naura Microelectronics Equipment Co Ltd
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Priority to CN202210587775.8A priority Critical patent/CN114927450B/en
Publication of CN114927450A publication Critical patent/CN114927450A/en
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Publication of CN114927450B publication Critical patent/CN114927450B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a transmission device and semiconductor process equipment, and relates to the technical field of semiconductor manufacturing. The conveying device comprises a first bearing mechanism, a second bearing mechanism and a first clamping assembly. The first bearing mechanism and the second bearing mechanism are both used for placing the film box. The first clamping assembly comprises a moving frame, a clamping mechanism and a material pushing assembly, the material pushing assembly is used for pushing the wafer out of the wafer box, and the clamping mechanism is used for clamping the wafer to clamp the wafer pushed out by the material pushing assembly. Clamping mechanism and pushing assembly all set up in removing the frame, and remove the frame and can drive clamping mechanism and pushing assembly and remove between primary importance and second place. Under the condition that the movable rack is located at the first position, the material pushing assembly is opposite to the first bearing mechanism. And under the condition that the movable rack is positioned at the second position, the clamping mechanism is opposite to the second bearing mechanism. The scheme can solve the problem that the motion structure of the wafer transmission system is complex.

Description

Transmission device and semiconductor processing equipment
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a transmission device and semiconductor process equipment.
Background
Wafer cleaning is an important step in semiconductor processing. During the cleaning process of the wafer, the transmission of the wafer comprises a front-end transmission part and a process-end transmission part. The front-end transmission refers to a transmission process of transmitting the wafer into the wafer cleaning equipment. The process-side transfer refers to a transfer process of the wafer in the cleaning equipment.
The front-end transmission of the wafer is mainly completed by the wafer transmission system. In the related art, a wafer transmission system includes a robot, a first carrier assembly, a second carrier assembly, a third carrier assembly, a second feeding and discharging device, and a first feeding and discharging device. Specifically, the second feeding and discharging device is used for conveying the wafer box filled with the wafers to the first bearing assembly; the first feeding and discharging device is used for conveying the wafer box filled with the wafers to the second bearing assembly. The manipulator is used for clamping the wafers in the first bearing component and the second bearing component cassette to the third bearing component. The first bearing assembly, the second bearing assembly and the third bearing assembly comprise a lifting mechanism and a rotating mechanism, and the first bearing assembly, the second bearing assembly and the third bearing assembly can be lifted or lowered through the lifting mechanism to prepare for loading or unloading of wafers or wafer boxes. The first bearing assembly, the second bearing assembly and the third bearing assembly can also rotate under the drive of the respective corresponding rotating mechanisms so as to adjust the orientation of the wafer. Because the first bearing assembly, the second bearing assembly and the third bearing assembly all involve rotary motion and lifting motion, and the manipulator involves horizontal transmission motion, and then the transmission motion mechanism of the wafer transmission system is complicated, and the transmission efficiency is low.
Disclosure of Invention
The invention discloses a transmission device and semiconductor process equipment, which aim to solve the problem that a wafer transmission system in the related art is complex in motion structure.
In order to solve the problems, the invention adopts the following technical scheme:
the conveying device comprises a first bearing mechanism, a second bearing mechanism and a first clamping assembly; the first bearing mechanism and the second bearing mechanism are used for placing a wafer box, and the wafer box is used for accommodating wafers;
the first clamping assembly comprises a moving frame, a clamping mechanism and a material pushing assembly, the material pushing assembly is used for pushing the wafer out and putting the wafer into the wafer box, and the clamping mechanism is used for clamping the wafer so as to clamp the wafer pushed out by the material pushing assembly or place the clamped wafer on the material pushing assembly; the clamping mechanism and the pushing assembly are both arranged on the movable frame, and the movable frame can drive the clamping mechanism and the pushing assembly to move between a first position and a second position,
under the condition that the movable frame is located at the first position, the pushing assembly is opposite to the first bearing mechanism, and the pushing assembly can put the wafer into a wafer box located at the first bearing mechanism or push the wafer out of the wafer box located at the first bearing mechanism;
when the movable frame is located at the second position, the clamping mechanism is opposite to the second bearing mechanism, and the pushing assembly can place the wafer into the wafer box located in the second bearing mechanism or push the wafer out of the wafer box located in the second bearing mechanism.
Based on the transmission device, the invention also discloses semiconductor process equipment. The semiconductor processing equipment comprises the transmission device.
The technical scheme adopted by the invention can achieve the following beneficial effects:
the first clamping assembly in the transmission device disclosed by the embodiment of the invention is provided with a clamping mechanism and a pushing assembly. Specifically, the pushing assembly pushes out the wafers on the first bearing mechanism and the second bearing mechanism, so that the clamping mechanism can clamp the wafers. After the clamping mechanism clamps and fixes the wafer pushed out by the pushing assembly, the pushing assembly moves to the initial position before the wafer is taken, so that the pushing assembly can avoid the first bearing mechanism or the second bearing mechanism in the moving process of the first clamping assembly. Furthermore, the clamping mechanism and the pushing assembly are arranged on the movable frame, so that the pushing assembly can move between a first position and a second position along with the movable frame, and the pushing assembly can be used for taking and placing wafers on the first bearing mechanism and the second bearing mechanism. According to the scheme, the first bearing mechanism and the second bearing mechanism can share the same pushing assembly, the structure of the transmission device can be simplified, and the utilization rate of the pushing assembly can be improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not limit the invention. In the drawings:
FIG. 1 is a schematic illustration of a transmission device in accordance with one or more alternative embodiments of the present invention;
FIG. 2 is a schematic view of a first grasping assembly according to one or more alternative embodiments of the present invention;
FIG. 3 is an illustration of the assembly of the first transport mechanism and the first grasping assembly in one or more alternative embodiments of the present invention;
FIG. 4 is a schematic illustration of control of semiconductor processing equipment in accordance with one or more alternative embodiments of the present invention;
FIG. 5 is a schematic view of a third carriage mechanism according to some embodiments of the present invention in a fourth position;
FIG. 6 is a schematic view of a third carriage mechanism according to some embodiments of the present invention in a third position;
fig. 7 is a schematic diagram of the second clamping assembly clamping the wafer according to some embodiments of the invention.
In the figure: 100-a first carrier mechanism; 200-a second carrying mechanism; 300-a first grasping assembly; 310-a mobile rack; 320-a pusher assembly; 321-a first support; 322-a first pusher; 323-a second pusher; 324-a first drive mechanism; 325-a second transfer mechanism; 330-a second drive mechanism; 340-a first guide rail; 350-a clamping mechanism; 400-a wafer; 500-a third bearing mechanism; 600-a first transport mechanism; 700-first feeding and discharging equipment; 800-second feeding and discharging equipment; 900-a second grasping assembly; 910-a second guide rail; 101-a first position; 102-a second position; 103-a third position; 104-fourth position.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to fig. 1 to 7.
In one or more alternative embodiments, the transporting apparatus of the present invention includes a first carrying mechanism 100, a second carrying mechanism 200, and a first gripping assembly 300. Illustratively, the first carriage mechanism 100 and the second carriage mechanism 200 are used for placing cassettes. Wherein the cassette is used to accommodate the wafer 400.
The first gripper assembly 300 includes a moving frame 310, a gripper mechanism 350, and a pusher assembly 320. The pushing assembly 320 is used for pushing the wafer 400 out of and into the cassette. The clamping mechanism 350 is used for clamping the wafer 400 to clamp the wafer 400 pushed out by the pushing assembly 320, or placing the clamped wafer 400 on the pushing assembly 320. Illustratively, the pushing assembly 320 pushes the wafer 400 out of the wafer 400 in the cassette on the first carrying mechanism 100 or the second carrying mechanism 200 to a position where the clamping mechanism 350 can clamp the wafer 400, i.e., the pushing assembly 320 pushes the wafer 400 in the cassette on the first carrying mechanism 100 or the second carrying mechanism 200 so that the wafer 400 can move into the clamping range of the clamping mechanism 350.
Referring to fig. 1, 2 and 7, the clamping mechanism 350 and the pushing assembly 320 are disposed on the moving frame 310, so that the moving frame 310 can drive the clamping mechanism 350 and the pushing assembly 320 to move. Illustratively, the moving rack 310 may move the clamping mechanism 350 and the pusher assembly 320 between the first position 101 and the second position 102. With the movable frame 310 located at the first position 101, the pushing assembly 320 is opposite to the first support mechanism 100, and the pushing assembly 320 can place the wafer 400 into the cassette located in the first support mechanism 100 or push the wafer 400 out of the cassette located in the first support mechanism 100. With the movable frame 310 at the second position 102, the clamping mechanism 350 is opposite to the second supporting mechanism 200, and the pushing assembly 320 can place the wafer 400 into the cassette of the second supporting mechanism 200 or push the wafer 400 out of the cassette on the second supporting mechanism 200.
It should be noted that the pushing assembly 320 is opposite to the first carrying mechanism 100, that is, the wafer 400 placed in the cassette of the first carrying mechanism 100 is located in the operation range of the pushing assembly 320 for picking and placing the wafer 400. Similarly, the clamping mechanism 350 is opposite to the second supporting mechanism 200, that is, the wafer 400 placed in the cassette of the first supporting mechanism 100 is located in the operation range of the pusher assembly 320 for picking and placing the wafer 400.
In the above embodiment, the pushing assembly 320 and the clamping mechanism 350 are both disposed on the moving frame 310, so that the pushing assembly 320 and the clamping mechanism 350 can move synchronously with the moving frame 310. Illustratively, during the process of the first gripper assembly 300 gripping the wafer 400 pushed out of the cassette on the first carrier mechanism 100, the moving frame 310 moves to the first position 101 so that the pushing assembly 320 is opposite to the first carrier mechanism 100, and thus the wafer 400 in the cassette on the first carrier mechanism 100 is located within the working range of the pushing assembly 320.
In the above embodiment, the wafer 400 may be placed in a cassette for transportation during transportation, so as to protect the wafer 400 through the cassette and prevent the wafer 400 from being damaged during transportation.
In one or more alternative embodiments, the pushing assembly 320 moves in the third direction and drives the wafer 400 in the cassette on the first supporting mechanism 100 to move out of the cassette, so that the wafer 400 in the cassette on the first supporting mechanism 100 moves to the working range of the clamping mechanism 350 for clamping the wafer 400 under the action of the pushing assembly 320. It should be noted that, during the process of pushing the wafer 400 out of the cassette on the first carrier mechanism 100, the pushing assembly 320 is at least partially located in the first carrier mechanism 100 and/or the cassette for placing the wafer 400. Further, the clamping mechanism 350 clamps and fixes the wafer 400 removed from the first carrier mechanism 100. The pushing assembly 320 moves in a fourth direction, which is opposite to the third direction, so that the pushing assembly 320 can be moved out of the first carrier mechanism 100 and/or the cassette for holding the wafer 400, thereby preventing the first carrier mechanism 100 from interfering with the movement of the pushing assembly 320 during the movement of the moving frame 310.
In one or more alternative embodiments, the pushing assembly 320 may be a telescopic mechanism, so that the pushing or placing of the wafer 400 in the cassette on the first supporting mechanism 100 or the second supporting mechanism 200 can be realized by extending or shortening the pushing assembly 320. Illustratively, the pusher assembly 320 may be lengthened or shortened in the third direction so that the pusher assembly 320 may push the wafer 400 out of the cassette or place the wafer 400 into the cassette.
Alternatively, the third direction is vertically upward, and the fourth direction is vertically downward, that is, the pushing assembly 320 may push the wafer 400 in the cassette vertically upward, or put the wafer 400 in the cassette along the vertically downward direction.
The telescopic mechanism may be of various types, such as a hydraulic cylinder, an air cylinder, a link mechanism, a slider-crank mechanism, a screw mechanism, etc., and therefore, the present embodiment is not limited to the specific structure of the pusher assembly 320.
During the process of placing the wafer 400 in the first supporting mechanism 100, the moving frame 310 moves to the first position 101, so that the pushing assembly 320 is opposite to the first supporting mechanism 100, and thus the area of the wafer 400 in the cassette on the first supporting mechanism 100 is within the operation range of the pushing assembly 320. Illustratively, the pusher assembly 320 is moved in a third direction so that the pusher assembly 320 can support the wafer 400 on the gripper mechanism 350. Further, the clamping mechanism 350 places the wafer 400 on the pusher assembly 320. The pusher assembly 320 moves in a fourth direction to place the wafer 400 in a cassette on the first carrier mechanism 100.
Similarly, the method for placing the wafer 400 in the cassette on the second carrier 200 by the first gripper assembly 300 may be the same as the method for placing the wafer 400 in the cassette on the first carrier 100 by the first gripper assembly 300. The first gripper assembly 300 may push the wafer 400 out of the cassette on the second carrier mechanism 200 in the same manner as the first gripper assembly 300 pushes the wafer 400 out of the cassette on the first carrier mechanism 100. The method for the first gripper assembly 300 to place the wafer 400 in the cassette on the second carrier mechanism 200 and the method for the first gripper assembly 300 to push the wafer 400 out of the cassette on the second carrier mechanism 200 will not be further described in this specification.
In the above embodiment, the pushing assembly 320 is disposed on the moving frame 310, so that the pushing assembly 320 can be used to take out the wafer 400 in the cassettes of the first carrying mechanism 100 and the second carrying mechanism 200, or place the wafer 400 in the cassettes of the first carrying mechanism 100 and the second carrying mechanism 200, which not only can improve the utilization rate of the pushing assembly 320, but also is beneficial to reducing the number of the pushing assembly 320 and simplifying the movement structure of the transmission device.
In one or more alternative embodiments, the transfer device of the present invention may be used for front end transfer in semiconductor processing equipment. Illustratively, the conveying device can be used for front-end conveying of a 200mm tank type cleaning machine.
In the related art, a transfer system for front end transfer of a 200mm tank washer includes a plurality of wafer support platforms and a robot. The manipulator is limited by the wafer box, the supporting platform structure and the manipulator mechanism in the process of grabbing the wafer on the supporting platform, so that the wafer cannot be directly pushed out from the wafer box. Specifically, each supporting platform is provided with a lifting device, and the lifting devices are used for moving the wafer on the supporting platform out of a wafer box of the supporting platform and grabbing the moved wafer through a mechanical arm.
In the embodiment, the transmission device provided by the invention is applied to the front-end transmission of the 200mm groove type cleaning machine, so that the number of the lifting devices can be reduced, the transmission system for the front-end transmission of the cleaning machine can be simplified, and the transmission efficiency for the front-end transmission of the 200mm groove type cleaning machine can be improved. Thereby contributing to the improvement of the cleaning efficiency of the wafer 400.
Referring to fig. 1, 5 and 6, in one or more alternative embodiments, the conveying apparatus further includes a third carrying mechanism 500, a first conveying mechanism 600 and a first feeding and discharging apparatus 700, the third carrying mechanism 500 is connected to the first conveying mechanism 600, and the first conveying mechanism 600 can move the third carrying mechanism 500 between the third position 103 and the fourth position 104. When the third carrier 500 is located at the third position 103 and the moving frame 310 is located at the first position 101, the third carrier 500 is opposite to the pushing assembly 320, and the pushing assembly 320 can place the wafer 400 in a cassette located on the third carrier 500 or push the wafer 400 out of the cassette located on the third carrier 500. With the third carriage 500 in the fourth position 104, the third carriage 500 is opposite the first in and out apparatus 700, and the first in and out apparatus 700 is used to carry the cassette and place the cassette on the third carriage 500 or transfer the cassette out of the third carriage 500.
It should be noted that, the third bearing mechanism 500 and the pushing assembly 320 of the present invention refer to: the wafer 400 in the cassette of the third support mechanism 500 is located within the operation range of the pushing assembly 320, that is, the pushing assembly 320 can be used to push out the wafer 400 in the cassette of the third support mechanism 500 or place the wafer 400 in the cassette of the third support mechanism 500.
For example, the method of placing the wafer 400 in the cassette on the third carrier 500 by the first gripper assembly 300 may be the same as the method of placing the wafer 400 in the cassette on the first carrier 100 by the first gripper assembly 300. The method of pushing the wafer 400 out of the cassette located on the third carrier 500 by the first gripper assembly 300 may be the same as the method of pushing the wafer 400 out of the cassette located on the first carrier 100 by the first gripper assembly 300. The method of the first gripper assembly 300 placing the wafer 400 in the cassette on the third carrier 500 and the method of the first gripper assembly 300 pushing the wafer 400 out of the cassette on the third carrier 500 will not be further described in this specification.
The above embodiment can perform the synchronous picking and placing of the wafer 400 by the first gripper assembly 300 on the first carrying mechanism 100 and the third carrying mechanism 500, which is further beneficial to improve the transmission efficiency of the wafer 400.
In an alternative embodiment, the first transfer mechanism 600 includes a guide rail, a slider, and a second servo motor. Optionally, the slider is in sliding engagement with the rail such that the slider is slidable along the rail. Further optionally, the third carriage 500 is disposed on a sliding member, and the sliding member can drive the third carriage 500 to slide between the third position 103 and the fourth position 104 along the guide rail. Illustratively, the second servo motor is coupled to the slide, and the second servo motor drives the slide to slide along the guide. Alternatively, the second servomotor may be coupled to the slide via a magnetic linkage mechanism, a rack and pinion mechanism, a lead screw mechanism, and/or a cam mechanism, such that the second servomotor drives the slide to slide along the guide rail.
Of course, the first transfer mechanism 600 is of a wide variety, such as a conveyor belt, a linear slide, and the like. For this reason, the present embodiment does not limit the specific kind of the first transmission mechanism 600.
Referring to fig. 1, in one or more alternative embodiments, the transfer apparatus further comprises a second feeding and discharging device 800, the second feeding and discharging device 800 is opposite to the first carrier mechanism 100, and the second feeding and discharging device 800 is used for carrying the sheet and placing the sheet cassette in the first carrier mechanism 100 or transferring the sheet cassette from the first carrier mechanism 100. Exemplarily, the second feeding and discharging device 800 is opposite to the first carrier mechanism 100, and means: the first carrier mechanism 100 is located within the operation range of the second loading and unloading apparatus 800, so that the second loading and unloading apparatus 800 can place the cassette containing the wafer 400 on the first carrier mechanism 100, or the second loading and unloading apparatus 800 can unload the cassette placed on the first carrier mechanism 100.
In an alternative embodiment, the first transmission mechanism 600 may drive the third carrying mechanism 500 to move in the fifth direction, so that the third carrying mechanism 500 may move between the third position 103 and the fourth position 104. Further alternatively, the first bearing mechanism 100 and the third bearing mechanism 500 are arranged along the sixth direction with the third bearing mechanism 500 located at the third position 103. Illustratively, the sixth direction is perpendicular to the grasping direction of the first grasping assembly 300. Optionally, the fifth direction is perpendicular to the sixth direction.
It should be noted that the feeding direction of the feeding and discharging device is the same as the axial direction of the wafer 400 during feeding. Specifically, the feeding direction of the feeding and discharging device refers to: the feeding and discharging device places the cassette containing the wafer 400 on the carrying mechanism in the moving direction. During the cleaning process of the wafer 400, the wafer 400 transferred by the second material inlet and outlet apparatus 800 and the first material inlet and outlet apparatus 700 is required to be overlapped along the axial direction of the wafer 400. Due to the influence of the structural dimensions of the semiconductor process equipment and the feeding and discharging equipment, the second feeding and discharging equipment 800 and the first feeding and discharging equipment 700 cannot be arranged in the sixth direction, so that the feeding directions of the second feeding and discharging equipment 800 and the first feeding and discharging equipment 700 are parallel to each other.
In the above embodiment, the first conveying mechanism 600 moves the third carrying mechanism 500, so that the feeding position of the first feeding and discharging device 700 can be arranged along the fifth direction relative to the feeding position of the second feeding and discharging device 800, and the feeding directions of the second feeding and discharging device 800 and the first feeding and discharging device 700 can be the same. Illustratively, with the third carrier mechanism 500 moved to the third position 103, the axis of the wafer 400 in the cassette on the third carrier mechanism 500 coincides with the axis of the wafer 400 in the cassette on the first carrier mechanism 100, so that the wafers 400 transported by the second and first material in and out apparatuses 800 and 700 can be stacked in the axial direction of the wafer 400. In this embodiment, in order to realize synchronous transmission of the wafers 400 on the first carrying mechanism 100 and the third carrying mechanism 500, the transmission efficiency of the transmission equipment is improved.
In one or more alternative embodiments, the pushing assembly 320 includes a first support 321, a first pushing member 322, a second pushing member 323, and a first driving mechanism 324, where the first pushing member 322 and the second pushing member 323 are disposed on the first support 321. When the third support mechanism 500 is located at the third position 103 and the moving frame 310 is located at the first position 101, the first pushing member 322 is opposite to the first support mechanism 100, and the second pushing member 323 is opposite to the third support mechanism 500. The first driving mechanism 324 is connected to the first support 321 and the moving frame 310, and the first driving mechanism 324 is used for driving the first support 321 and driving the first material pushing member 322 and the second material pushing member 323 to move toward or away from the clamping mechanism 350.
For example, during the process that the first driving mechanism 324 drives the first support 321 to move in the direction close to the clamping mechanism 350, the first support 321 may drive the first material pushing member 322 and the second material pushing member 323 to push the wafer 400 out of the cassette on the first supporting mechanism 100, the third supporting mechanism 500, or the second supporting mechanism 200. In the process that the first driving mechanism 324 drives the first support 321 to move away from the clamping mechanism 350, the first support 321 can drive the first material pushing member 322 and the second material pushing member 323 to place the wafer 400 into the cassette located on the first carrying mechanism 100, the third carrying mechanism 500 or the second carrying mechanism 200.
Illustratively, the first driving mechanism 324 may drive the first support 321 to move between the initial position and the transferring position relative to the moving frame 310. Illustratively, with the first bracket 321 in the initial position, the first pushing member 322 and the second pushing member 323 are located outside the first carrying mechanism 100, the third carrying mechanism 500, or the second carrying mechanism 200, so that the pushing assembly 320 can be switched between the first position 101 and the second position 102 by being carried by the moving bracket 310. With the first support 321 in the transfer position, the first pushing member 322 and the second pushing member 323 push the wafer 400 out to the operating range of the clamping mechanism 350, so that the clamping mechanism 350 can clamp and fix the wafer 400 pushed out by the pushing assembly 320, or the clamping mechanism 350 can place the clamped wafer 400 in the pushing assembly 320 to prepare for the pushing assembly 320 to place the wafer 400 in the cassette.
In one or more alternative embodiments, first drive mechanism 324 includes a first servomotor and a lift mechanism. Illustratively, the first servo motor is connected with the lifting mechanism, and the first servo motor is used for driving the lifting mechanism to ascend or descend.
There are many types of lifting mechanisms, such as a screw mechanism, a cam slider mechanism, a vertically arranged linear module, and the like. For this reason, the present embodiment does not limit the specific kind of the elevating mechanism.
In one or more optional embodiments, the pushing assembly 320 further includes a second transmission mechanism 325, the second transmission mechanism 325 is disposed on the first support 321, and the second transmission mechanism 325 is connected to the second pushing member 323, and the second transmission mechanism 325 can drive the second pushing member 323 to move in a direction away from or close to the first pushing member 322.
In the above embodiment, the second transferring mechanism 325 drives the second pushing member 323 to move toward the direction close to the first pushing member 322 to adjust the distance between the second pushing member 323 and the first pushing member 322, and further adjust the distance between the first pushing member 322 and the wafer 400 on the second pushing member 323, so that the distance between the wafer 400 on the first pushing member 322 and the wafer 400 on the second pushing member 323 can be adapted to the process segment transfer of the semiconductor processing equipment.
Illustratively, the second transmission mechanism 325 is of a wide variety, such as a linear slide, a lead screw mechanism, a slider-crank mechanism, a rack-and-pinion mechanism, and the like.
In an alternative embodiment, the second transfer mechanism 325 includes a third servo motor to power the second transfer mechanism 325 via the third servo motor.
Of course, the structure of the second transfer mechanism 325 may be the same as that of the first transfer mechanism 600. For this reason, the present embodiment does not describe a specific structure of the second transfer mechanism 325.
In one or more alternative embodiments, the transferring apparatus further includes a rotating mechanism, the rotating mechanism is connected to the first supporting mechanism 100, and the rotating mechanism can drive the first supporting mechanism 100 to rotate around a first axis, which is parallel to or coincides with a diameter of the wafer 400 placed in the cassette of the first supporting mechanism 100. Optionally, the first axis intersects vertically with an axis corresponding to the wafer 400 placed on the first supporting mechanism 100, so that the height of the wafer 400 on the first supporting mechanism 100 relative to the third supporting mechanism 500 is not changed before and after the wafer 400 rotates, so that the wafer 400 on the first supporting mechanism 100 and the wafer 400 on the third supporting mechanism 500 can be coaxially arranged.
It should be noted that, during the cleaning process of the wafer 400, the two adjacent wafers 400 in the partial wafer 400 cleaning apparatus are placed at different positions, which requires the orientation of the wafer 400 to be different. In the above embodiment, the rotating mechanism is connected to the first supporting mechanism 100, and further the rotating mechanism can drive the first supporting mechanism 100 and/or the wafer 400 placed on the first supporting mechanism 100 to rotate, so that the orientation of the wafer 400 on the first supporting mechanism 100 can be adjusted as required. Illustratively, the rotation mechanism implements the Face _ to _ Back function by driving the first carrier 100 to rotate 180 ° around the first axis such that the orientation of the wafer 400 on the first carrier 100 is opposite to the orientation of the wafer 400 on the third carrier 500. Optionally, the front side of the wafer is a process side of the wafer. Illustratively, a work surface during semiconductor processing. The back side of the wafer refers to the surface opposite the process side of the wafer.
Of course, during the transportation of the wafer 400, the orientation of the wafer 400 on the first supporting mechanism 100 may be kept unchanged according to the requirement of the wafer 400 cleaning apparatus, so as to realize Face _ to _ Face (front side is opposite to front side), that is, the orientation of the wafer 400 on the first supporting mechanism 100 is the same as the orientation of the wafer 400 on the third supporting mechanism 500.
In one or more alternative implementations, the first bearing mechanism 100 is provided with a first rotating shaft, and the first rotating shaft is arranged along a first axis, so that the first bearing mechanism 100 can be rotatably arranged through the first rotating shaft. Further, under the condition that the third bearing mechanism 500 is located at the third position 103, an avoidance space is provided between the third bearing mechanism 500 and the first bearing mechanism 100, so as to prevent the third bearing mechanism 500 or the first transmission mechanism 600 from interfering with the rotation of the first bearing mechanism 100 around the first axis, and further enable the rotation of the first bearing mechanism 100 around the first axis to be independent from the movement of the third bearing mechanism 500 along with the first transmission mechanism 600, that is, in the process of switching the third bearing mechanism 500 between the third position 103 and the fourth position 104, the first bearing mechanism 100 can rotate around the first axis, so that the second feeding and discharging device 800 and the first feeding and discharging device 700 can synchronously feed materials, and the wafer 400 transmission efficiency is improved.
It should be noted that, in the case that the third carrier 500 is located at the third position 103, in order to avoid the third carrier 500 interfering with the rotation of the first carrier 100 around the first axis, the distance between the first carrier 100 and the third carrier 500 is increased, and the distance between the wafer 400 on the first carrier 100 and the wafer 400 on the third carrier 500 is increased. For example, during the process of transferring the wafer 400, the second transfer mechanism 325 may be used to drive the second pusher 323 to move closer to or away from the first pusher 322, so that the distance between the wafer 400 transferred by the third carrier 500 and the wafer 400 transferred by the first carrier 100 may be reduced or increased, and thus the transfer apparatus may be applied to front-end transfer of a wider variety of semiconductor processing equipment.
In an alternative embodiment, the rotation mechanism includes a fourth servo motor and a transmission assembly. An exemplary drive assembly may be a gearbox or a drive shaft. Specifically, the fourth servo motor is connected to the first carrying mechanism 100 through the transmission assembly, so that the fourth servo motor can drive the first carrying mechanism 100 to rotate around the first axis through the transmission assembly.
In an alternative embodiment, the first gripper assembly 300 further comprises a second driving mechanism 330 and a first rail 340, the movable frame 310 is slidably engaged with the first rail 340, the second driving mechanism 330 is connected to the movable frame 310, and the second driving mechanism 330 drives the movable frame 310 to move along the first rail 340. Illustratively, the second driving mechanism 330 may drive the movable frame 310 to move along the first guide rail 340 between the first position 101 and the second position 102.
Exemplarily, the second driving mechanism 330 includes a fifth servomotor. Illustratively, a fifth servomotor is used to power the second drive mechanism 330.
In one or more alternative embodiments, the transport apparatus further comprises a second gripper assembly 900, the second gripper assembly 900 being adapted for end-of-process transport. The direction in which the first gripper assembly 300 grips the wafer 400 is a first direction, and the axial direction of the wafer 400 is perpendicular to the first direction when the wafer 400 is located in the first gripper assembly 300. The direction in which the second gripper assembly 900 grips the wafer 400 is a second direction, and when the wafer 400 is located in the second gripper assembly 900, the axial direction of the wafer 400 is perpendicular to the second direction, and the second direction is parallel to the first direction.
In an alternative embodiment, the transport device further comprises a second guide rail 910. Second grasping assembly 900 is slidably engaged with second rail 910 such that second grasping assembly 900 can drive second grasping assembly 900 to move along second rail 910. Exemplarily, the transmission device further comprises a sixth servo motor. Illustratively, a sixth servo motor is coupled to the second gripper assembly 900 such that the sixth servo motor drives the second gripper assembly 900 to move along the second guide 910.
In the above embodiment, the first direction is parallel to the second direction, so that the posture of the wafer 400 during the front end transmission is the same as the posture of the wafer 400 during the process of the process end transmission of the wafer 400, and the orientation of the wafer 400 does not need to be adjusted by rotating the wafer 400 at the connection between the front end transmission and the process end transmission, so that the structure and the movement of the transmission device are simplified, and the purpose of improving the transmission efficiency of the transmission device is achieved. In the transfer device described herein, the second carrying mechanism 200 is exemplarily connected to the front-end transfer and the process-end transfer. Therefore, in the above embodiment, the rotation mechanism for adjusting the orientation of the wafer 400 does not need to be disposed on the second carrier mechanism 200.
In one or more alternative embodiments, the transferring apparatus further includes a controller for controlling the first transferring mechanism 600 to move the third carrying mechanism 500 between the third position 103 and the fourth position 104. Illustratively, the controller is coupled to the fifth servomotor such that the controller drives the moving frame 310 to move between the first position 101 and the second position 102 by controlling the fifth servomotor.
Further, the controller may be further connected to the first servo motor, the third servo motor, and the sixth servo motor, so that the controller may control the first servo motor, the third servo motor, the fifth servo motor, and the sixth servo motor, respectively. For example, in the above embodiment, the controller may drive the first clamping assembly 300 to transfer the wafer 400 on the first carrier mechanism 100 and/or the third carrier mechanism 500 to the second carrier mechanism 200 by controlling the first servo motor, the third servo motor, the fifth servo motor and the sixth servo motor.
It should be noted that, in the related art, the transmission device uses a stepping motor to provide power, and although the position can also be located, the stepping motor needs to be matched with a position sensor to perform the location, and calibration and correction are needed to be performed on the position during the location process. The transmission device of the embodiment provides power through the servo motor, and the absolute value encoder is adopted to accurately position the position, so that the accuracy of wafer transmission and the stability of the transmission device are improved beneficially.
In one or more alternative embodiments, the transmission device further comprises a plurality of position sensors. Illustratively, position sensors are disposed on the moving frame 310, the first support 321, the second pusher 323, the first bearing mechanism 100, the second bearing mechanism 200, and the third bearing mechanism 500. Illustratively, the position sensors are used to sense the positions of the moving rack 310, the first rack 321, the second pusher 323, and/or the third carrier 500. Further, the position sensor is also used for sensing the position of the wafer 400 on the first carrier mechanism 100, the second carrier mechanism 200 and/or the third carrier mechanism 500.
In one or more alternative embodiments, each position sensor is connected to the controller, so that the controller can control the first gripper assembly 300 to transfer the wafer 400 on the first carrier 100 and/or the third carrier 500 to the second carrier 200 based on the sensed information of each position sensor.
In one or more alternative embodiments, the feeding method for front-end conveying by the conveying device comprises the following steps:
step 101: the second feeding and discharging equipment transmits the wafer box loaded with the wafers to the first bearing mechanism;
step 102: moving the first clamping assembly until the pushing assembly is opposite to the first bearing mechanism;
step 103: the pushing assembly moves from the initial position to the transmission position to drive the wafer in the wafer box on the first bearing mechanism to be in the operation range of the clamping mechanism;
step 104: the clamping mechanism clamps and fixes the wafer pushed out by the pushing component;
step 105: the pushing assembly moves from the transmission position to the initial position;
step 106: the movable frame is driven to move to the second position until the material pushing assembly is opposite to the second bearing mechanism;
step 107: the pushing assembly moves from the initial position to the transmission position;
step 108: the clamping mechanism places the wafer on the material pushing assembly;
step 109: the pushing assembly moves from the transmission position to the initial position, so that the wafer on the pushing assembly is placed in the wafer box on the second bearing mechanism.
It should be noted that the pushing assembly moves to the initial position, that is, the pushing assembly is located outside the second carrying mechanism, the first carrying mechanism and/or the sheet cassette.
In one or more alternative embodiments, the pushing assembly is a lifting mechanism. Illustratively, the pusher assembly moves to an initial position, i.e., the pusher assembly descends directly beneath the second carriage mechanism, the first carriage mechanism, and/or the cassette. The pushing assembly moves to the transmission position, namely the pushing assembly rises, and at least part of the pushing assembly moves to the second bearing mechanism, the first bearing mechanism and/or the wafer box so as to move the wafer in the wafer box on the second bearing mechanism or the first bearing mechanism to the operation range of the clamping mechanism, so that the clamping mechanism can clamp and fix the wafer pushed out by the pushing assembly.
In one or more alternative embodiments, the feeding method for front-end delivery by the delivery device before step 103 further comprises:
step 110: the first feeding and discharging equipment transmits the wafer box loaded with the wafers to the third bearing mechanism;
step 111: the first transmission mechanism drives the third bearing mechanism to move to the third position until the third bearing mechanism is opposite to the pushing assembly.
In one or more alternative embodiments, after step 104 and before step 109, the method for feeding a front end transport by a transport device further comprises:
step 112: the second transmission mechanism drives the second pushing piece to move towards the direction close to the first pushing piece until the distance between the wafer on the first pushing piece and the wafer on the second pushing piece reaches a first preset value.
Illustratively, the first preset value is the distance between the wafer passing through the second material inlet and outlet device and the wafer transported by the first material inlet and outlet device, which is required in the process transporting end wafer transporting process. Under the condition that the conveying device can be used for front-end conveying of a 200mm groove type cleaning machine, the first preset value can be the distance between two adjacent feeding holes or feeding and discharging positions of the cleaning machine.
The distance between two adjacent feed inlets or feed discharge positions corresponding to different wafer cleaning machines is different. For this reason, the present embodiment does not limit the specific size of the first preset value.
In one or more alternative embodiments, after step 109, the feeding method for front end conveying by the conveying device further includes:
step 113: the second transmission mechanism drives the second pushing piece to move towards the direction far away from the first pushing piece until the distance between the wafer on the first pushing piece and the wafer on the second pushing piece reaches a second preset value.
For example, the second preset value may be a distance between the third carriage and the first carriage when the third carriage is located at the third position.
In one or more alternative embodiments, after step 105, the feeding method for front end conveying by the conveying device further includes:
step 114: the first transmission mechanism drives the third bearing mechanism to move to the fourth position until the third bearing mechanism is opposite to the second feeding and discharging device.
In one or more alternative embodiments, after step 101 and before step 102, the method for feeding a front end transport by a transport device further comprises:
step 115: the first bearing mechanism is driven to rotate 180 degrees around the first axis along the first time hand direction.
In one or more alternative embodiments, after step 113, the feeding method for front-end delivery by the delivery device further comprises:
step 116: and moving the first clamping assembly to the first bearing mechanism between the first position and the second position.
In the embodiment, the first clamping assembly can be moved between the first position and the second position to avoid interference of the first clamping assembly with rotation of the first bearing mechanism and/or interference of the second feeding and discharging device with loading of the wafer on the first bearing mechanism.
In one or more alternative embodiments, after step 106, the method for feeding a front end transport by a transport device further comprises:
step 117: the first bearing mechanism is driven to rotate 180 DEG around the first axis in a second clockwise direction, which is opposite to the first clockwise direction.
In one or more alternative embodiments, the discharging method for front-end transmission of the transmission device comprises the following steps:
step 201: moving the first clamping assembly until the pushing assembly is opposite to the second bearing mechanism;
step 202: the pushing assembly moves from the initial position to the transmission position to drive the wafer in the wafer box on the second bearing mechanism to be in the operation range of the clamping mechanism;
step 203: the clamping mechanism clamps and fixes the wafer pushed out by the pushing component;
step 204: the pushing assembly moves from the transmission position to the initial position;
step 205: driving the movable frame to move to the first position until the material pushing assembly is opposite to the first bearing mechanism;
step 206: the pushing assembly moves from the initial position to the transmission position;
step 207: the clamping mechanism places the wafer on the material pushing assembly;
step 208: the pushing assembly moves from the transmission position to the initial position, so that the wafer on the pushing assembly is placed in the wafer box of the first bearing mechanism and/or the third bearing mechanism;
step 209: and the second feeding and discharging equipment transmits the wafer box loaded with the wafers to the first bearing mechanism.
In one or more alternative embodiments, before step 203, the discharging method for front-end transmission by the transmission device of the present invention includes:
step 209: the second transmission mechanism drives the second pushing piece to move towards the direction close to the first pushing piece until the distance between the wafer on the first pushing piece and the wafer on the second pushing piece reaches a first preset value.
Illustratively, the first preset value is the distance between the wafer passing through the second material inlet and outlet device and the wafer transported by the first material inlet and outlet device, which is required in the process transporting end wafer transporting process. Under the condition that the conveying device can be used for front-end conveying of a 200mm groove type cleaning machine, the first preset value can be the distance between two adjacent feeding holes or feeding and discharging positions of the cleaning machine.
The distance between two adjacent feed inlets or feed discharge positions corresponding to different wafer cleaning machines is different. For this reason, the present embodiment does not limit the specific size of the first preset value.
Based on the transmission device, the invention also provides semiconductor process equipment. The semiconductor processing equipment comprises the transmission device.
In one or more optional embodiments, the semiconductor processing equipment further comprises a machine table upper computer, and the machine table upper computer is connected with the controller.
Illustratively, the upper machine station is connected with the controller in an EtherCAT (ethernet control automation technology) bus communication mode, so that the upper machine station can realize quick and accurate control over a servo motor in the transmission device through communication with the controller, and the accuracy of wafer transmission is improved. Optionally, the upper computer of the machine can be a double-good control system, so that the calculation Task period can reach 50 microseconds at the fastest speed, and further, the calculation speed is favorably increased, and more accurate positioning transmission is realized.
In the above embodiment, the control logic of the servo motor is centralized on the upper computer of the machine station to complete, so that the control test of the transmission device is facilitated, and the reliability of the transmission device is improved.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims (11)

1. A conveying device, characterized by comprising a first bearing mechanism (100), a second bearing mechanism (200) and a first clamping assembly (300); the first bearing mechanism (100) and the second bearing mechanism (200) are used for placing a wafer box, and the wafer box is used for accommodating a wafer (400);
the first clamping assembly (300) comprises a moving frame (310), a clamping mechanism (350) and a material pushing assembly (320), the material pushing assembly (320) is used for pushing the wafer (400) out and putting the wafer into the wafer box, and the clamping mechanism (350) is used for clamping the wafer (400) so as to clamp the wafer (400) pushed out by the material pushing assembly (320) or place the clamped wafer (400) on the material pushing assembly (320); the clamping mechanism (350) and the pushing assembly (320) are arranged on the moving frame (310), the moving frame (310) can drive the clamping mechanism (350) and the pushing assembly (320) to move between a first position and a second position,
when the moving frame (310) is located at the first position, the pushing assembly (320) is opposite to the first bearing mechanism (100), and the pushing assembly (320) can put the wafer (400) into the cassette of the first bearing mechanism (100) or push the wafer (400) out of the cassette of the first bearing mechanism (100);
under the condition that the movable frame (310) is located at the second position, the clamping mechanism (350) is opposite to the second bearing mechanism (200), and the material pushing assembly (320) can put the wafer (400) into a box located in the second bearing mechanism (200) or push the wafer (400) out of the box located in the second bearing mechanism (200).
2. The conveying device according to claim 1, wherein the conveying apparatus further comprises a third carrying mechanism (500), a first conveying mechanism (600) and a first feeding and discharging apparatus (700), the third carrying mechanism (500) is connected to the first conveying mechanism (600), and the first conveying mechanism (600) can drive the third carrying mechanism (500) to move between a third position and a fourth position,
when the third bearing mechanism (500) is located at the third position and the moving frame (310) is located at the first position, the third bearing mechanism (500) is opposite to the pushing assembly (320), and the pushing assembly (320) can put the wafer (400) into the cassette on the bearing mechanism (500) or push the wafer (400) out of the cassette on the third bearing mechanism (500);
in the case that the third carriage (500) is located at the fourth position, the third carriage (500) is opposite to the first feeding and discharging device (700), and the first feeding and discharging device (700) is configured to carry the cassette and place the cassette in the third carriage (500) or transfer the cassette out of the third carriage (500).
3. The transfer device according to claim 2, wherein the pushing assembly (320) comprises a first bracket (321), a first pushing member (322), a second pushing member (323), and a first driving mechanism (324), the first pushing member (322) and the second pushing member (323) are both arranged on the first bracket (321),
when the third bearing mechanism (500) is located at the third position and the moving frame (310) is located at the first position, the first material pushing piece (322) is opposite to the first bearing mechanism (100), and the second material pushing piece (323) is opposite to the third bearing mechanism (500);
the first driving mechanism (324) is respectively connected with the first support (321) and the moving frame (310), and the first driving mechanism (324) is used for driving the first support (321) and driving the first material pushing piece (322) and the second material pushing piece (323) to move towards the direction close to or far away from the clamping mechanism (350).
4. The conveying device according to claim 3, wherein the pushing assembly (320) further comprises a second conveying mechanism (325), the second conveying mechanism (325) is disposed on the first support (321), the second conveying mechanism (325) is connected to the second pushing member (323), and the second conveying mechanism (325) can drive the second pushing member (323) to move in a direction away from or close to the first pushing member (322).
5. The transfer device according to any of claims 1 to 4, further comprising a rotation mechanism, wherein the rotation mechanism is connected to the first carrier (100), and the rotation mechanism can rotate the first carrier (100) around a first axis, and the first axis is parallel to and/or coincides with a diameter of the wafer (400) placed in the cassette of the first carrier (100).
6. The transfer device of any one of claims 1 to 4, wherein the first gripper assembly (300) further comprises a second driving mechanism (330) and a first guide rail (340), the movable frame (310) is slidably engaged with the first guide rail (340), the second driving mechanism (330) is connected to the movable frame (310), and the second driving mechanism (330) can drive the movable frame (310) to move along the first guide rail (340).
7. A transfer device according to any of claims 1-4, further comprising a second feeding and discharging device (800), the second feeding and discharging device (800) being opposite to the first carrier (100), and the second feeding and discharging device (800) being adapted to carry and place the cassettes on the first carrier (100) or to transfer the cassettes from the first carrier (100).
8. The conveying apparatus according to any one of claims 1 to 4, further comprising a second gripper assembly (900), wherein the second gripper assembly (900) is used for end-of-line conveying, the first gripper assembly (300) grips the wafer (400) in a first direction, and the wafer (400) has an axis direction perpendicular to the first direction when the wafer (400) is located in the first gripper assembly (300);
the direction in which the second clamping component (900) clamps the wafer (400) is a second direction, and when the wafer (400) is located in the second clamping component (900), the axis direction of the wafer (400) is perpendicular to the second direction, and the second direction is parallel to the first direction.
9. The transfer device according to claim 2, further comprising a controller for controlling the first transfer mechanism (600) to move the third carrying mechanism (500) between a third position and a fourth position; controlling the first clamping assembly (300) to transfer the wafer (400) on the first carrier mechanism (100) and/or the third carrier mechanism (500) to the second carrier mechanism (200).
10. A semiconductor processing apparatus comprising the transport apparatus of claim 9.
11. The semiconductor processing equipment of claim 10, further comprising a machine upper computer, wherein the machine upper computer is connected to the controller.
CN202210587775.8A 2022-05-27 2022-05-27 Transmission device and semiconductor process equipment Active CN114927450B (en)

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CN113078089A (en) * 2021-06-07 2021-07-06 北京北方华创微电子装备有限公司 Wafer transfer device, semiconductor process equipment and wafer transfer control method
CN113745139A (en) * 2021-05-07 2021-12-03 上海大族富创得科技有限公司 Wafer transfer system and method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230244A (en) * 1988-03-09 1989-09-13 Tel Sagami Ltd Wafer conveying method
JP2001168172A (en) * 1999-12-03 2001-06-22 Sharp Corp Wafer transfer apparatus
KR20070044126A (en) * 2005-10-24 2007-04-27 주식회사 케이씨텍 Wafer array apparatus and method for arraying wafer
WO2013000428A1 (en) * 2011-06-28 2013-01-03 清华大学 A wafer holding device using a pusher rod drawn by strings and springs
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