CN114915176A

CN114915176A - LLC circuit and LLC power

Info

Publication number: CN114915176A
Application number: CN202210333846.1A
Authority: CN
Inventors: 李学军; 张克旺; 陈家词
Original assignee: Anhui Aoyuan Electronic Technology Co ltd
Current assignee: Anhui Aoyuan Electronic Technology Co ltd
Priority date: 2022-03-31
Filing date: 2022-03-31
Publication date: 2022-08-16
Anticipated expiration: 2042-03-31
Also published as: CN114915176B; CN116545263B; CN116545263A

Abstract

The invention provides a high-safety quick-charging power supply, an LLC circuit, an LLC power supply and a bridgeless PFC switch power supply circuit.

Description

LLC circuit and LLC power

Technical Field

The invention relates to the technical field of charging, in particular to an LLC circuit and an LLC power supply.

Background

Mobile terminal devices such as mobile phones, tablet computers, electric vehicles, electric tools, etc. have become one of the indispensable articles for people in daily life, and under the condition that the contradiction between the lightness and thinness of mobile terminal devices and the battery endurance is increasingly sharp, various rapid charging technologies are generated. The shortening of the charging waiting time brings convenience to the use of the mobile terminal equipment, but brings about not little potential safety hazard at the same time. The conventional quick charging technology mainly has three realization modes, namely, charging current is not changed, charging voltage is increased, charging voltage is not changed, charging current is increased, and charging current and charging voltage are increased simultaneously. However, in any implementation manner, increasing the charging current or the charging voltage inevitably increases the heat generation amount of the power supply, which may lead to a reduction in the circuit aging life of the power supply, or even to a short circuit or a fire due to burning out of the charging circuit of the power supply.

Disclosure of Invention

Based on the problems, the invention provides a fast charging power supply, an LLC circuit, an LLC power supply and a bridgeless PFC switch power supply circuit with high safety, which can reduce the potential safety hazard caused by fast charging and improve the safety.

In view of this, a first aspect of the present invention provides a high-safety fast charging source, including a housing, and a PCB, an insulating layer, a heat conducting layer, and a sensor layer disposed inside the housing, where a first surface of the PCB is used for mounting electronic components, a second surface of the PCB is attached to an insulating and heat conducting material on the first surface of the insulating layer, the heat conducting layer is disposed on a side of the insulating layer away from the second surface of the PCB, the insulating and heat conducting layer penetrates through the insulating layer and is attached to a heat conducting fin disposed on the first surface of the heat conducting layer, the sensor layer is disposed on a side of the heat conducting layer away from the second surface of the insulating layer, and the heat conducting fin penetrates through the heat conducting layer and is attached to a temperature sensor disposed on the first surface of the sensor layer; the power supply further comprises a controller, wherein the controller is connected with the temperature sensor and used for controlling the corresponding charging parameters of the power supply according to the temperature information of the corresponding electronic component detected by the temperature sensor.

Furthermore, in the quick charging source, the electronic components mounted on the first surface of the PCB include high heat components, the insulating layer is provided with first through holes at positions corresponding to the high heat components, the insulating and heat conducting material is disposed in the first through holes, the heat conducting layer is provided with second through holes at positions corresponding to the high heat components, and the heat conducting fins are disposed in the second through holes.

Further, in the quick charging source, the pins of the high heat component extend from the first surface of the PCB to the second surface of the PCB through the pad through holes on the PCB, and the pins of the high heat component have a certain height in the direction of the insulating layer relative to the second surface of the PCB.

Further, in the quick charging source, the attaching of the second surface of the PCB board and the insulating heat conducting material on the first surface of the insulating layer is specifically that the pins of the high heat component on the second surface of the PCB board are connected with the insulating heat conducting material on the first surface of the insulating layer, and the insulating heat conducting material is adjacent to and does not contact with other areas of the second surface of the PCB board except the pins of the high heat component.

Further, in the above quick charging source, the body of the heat conduction layer is made of a material with low heat conduction performance, and the plurality of heat conduction sheets on the heat conduction layer are not connected with each other.

Further, in the rapid charging source, the high heat component includes the controller.

Further, in the fast charging source, the PCB board is provided with a bridgeless PFC circuit, an LLC resonant circuit and a synchronous rectification circuit which are connected in sequence, and the controller is connected to the bridgeless PFC circuit, the LLC resonant circuit and the synchronous rectification circuit.

Further, in the quick charging source, a groove is formed in the surface of the housing, the heat conducting sheet includes a first portion and a second portion that are connected to each other, the first portion of the heat conducting sheet is disposed in the heat conducting layer, and the second portion of the heat conducting sheet is disposed in the groove in the surface of the housing.

Further, in the quick charging source, the housing includes a first portion and a second portion, the electronic component, the PCB, the insulating layer, the heat conducting layer and the sensor layer are disposed in a cavity formed by combining the first portion and the second portion, and one end of the first portion of the heat conducting sheet on the heat conducting layer extends through a gap at a junction of the first portion and the second portion of the housing to the groove on the surface of the housing to form the second portion of the heat conducting sheet.

Further, in the quick charging source, a bonding gap of at least one surface of the first portion and the second portion of the housing is in a plane with the heat conductive layer, and one end of the heat conductive layer abuts against the bonding gap of at least one surface of the first portion and the second portion of the housing.

The invention provides an LLC circuit, which comprises a first MOS switch tube, a second MOS switch tube, a first resonant capacitor, a second resonant capacitor, a resonant inductor, a parallel inductor and a transformer, wherein the first MOS switch tube, the second MOS switch tube, the first resonant capacitor, the second resonant capacitor, the resonant inductor, the parallel inductor and a transformer are arranged on a first surface of a PCB board, a pin of at least one component in the transformer penetrates through a pad through hole in the PCB board from the first surface of the PCB board and extends to a second surface of the PCB board, the LLC circuit further comprises at least one temperature sensor which is arranged on one side of the second surface of the PCB board and corresponds to the pin of the at least one component, and the LLC circuit further comprises a controller which is connected with the temperature sensor and is used for controlling the LLC circuit to correspond to the LLC circuit according to temperature information of the corresponding electronic component detected by the temperature sensor The charging parameter of (1).

Further, in the LLC circuit, the first resonant capacitor and the second resonant capacitor connected in series with each other are connected in parallel with the first MOS switch tube and the second MOS switch tube connected in series with each other, one end of the resonant inductor is connected between the first MOS switch tube and the second MOS switch tube, the other end of the resonant inductor is connected with the parallel inductor and one end of the transformer connected in parallel with each other, and the parallel inductor and the other end of the transformer are connected between the first resonant capacitor and the second resonant capacitor.

Further, in the LLC circuit, the LLC circuit further includes an insulating layer, a first through hole is formed in the insulating layer at a position corresponding to the pin of the at least one component, and an insulating heat-conducting material is disposed in the first through hole.

Further, in the LLC circuit, the pins of the at least one component have a certain height with respect to the second surface of the PCB in a direction away from the PCB and extend into the insulating and thermally conductive material disposed on the insulating layer.

Furthermore, in the LLC circuit, the LLC circuit further includes a heat conducting layer, wherein the heat conducting layer is provided with a second through hole at a position corresponding to the pin of the at least one component, and the second through hole is provided with a heat conducting fin.

Further, in the LLC circuit, the heat-conducting fins may be bonded to the insulating and heat-conducting material at corresponding positions.

Further, in the LLC circuit, the body of the heat conducting layer is made of a material with low heat conductivity, and the plurality of heat conducting fins on the heat conducting layer are not connected to each other.

Further, in the LLC circuit, the at least one temperature sensor is attached to the heat-conducting plate at a corresponding position.

Further, in the LLC circuit, the LLC circuit further includes a sensor layer, and the temperature sensor is disposed in the sensor layer.

A third aspect of the invention proposes an LLC power supply comprising an LLC circuit according to the second aspect of the invention.

The invention provides a bridgeless PFC switch power supply circuit, which comprises a first energy storage inductor, a second energy storage inductor, a first MOS (metal oxide semiconductor) switch tube, a second MOS switch tube, a first fast recovery diode, a second fast recovery diode, a third fast recovery diode, a fourth fast recovery diode and an output capacitor, wherein the first energy storage inductor, the second energy storage inductor, the first MOS switch tube, the second MOS switch tube, the first fast recovery diode, the second fast recovery diode, the third fast recovery diode, the fourth fast recovery diode and the output capacitor are arranged on the first surface of a PCB (printed circuit board), pins of at least one of the first energy storage inductor, the second energy storage inductor, the first MOS switch tube, the second MOS switch tube, the first fast recovery diode, the second fast recovery diode, the third fast recovery diode, the fourth fast recovery diode and the output capacitor extend to the second surface of the PCB from the first surface of the PCB through bonding pads on the PCB, and the bridgeless PFC switch power supply circuit also comprises at least one pin which is arranged on one side of the second surface of the PCB and corresponds to the positions of the at least one pin The bridge-free PFC switch power supply circuit further comprises a controller, and the controller is connected with the temperature sensor and used for controlling corresponding charging parameters of the bridge-free PFC switch power supply circuit according to temperature information of corresponding electronic components detected by the temperature sensor.

Further, in the bridgeless PFC switching power supply circuit, a first end of the first energy storage inductor and a first end of the second energy storage inductor are respectively connected to a first input end and a second input end of the bridgeless PFC switching power supply circuit, two ends of the first fast recovery diode and the second fast recovery diode after being connected in series are respectively connected to a second end of the first energy storage inductor and a second end of the second energy storage inductor, two ends of the first MOS switch tube and the second MOS switch tube after being connected in series are respectively connected to a second end of the first energy storage inductor and a second end of the second energy storage inductor, a first end of the third fast recovery diode is connected to the second end of the first energy storage inductor, a second end of the third fast recovery diode is connected to the first end of the output capacitor, and a first end of the fourth fast recovery diode is connected to the second end of the second energy storage inductor, and the second end of the fourth fast recovery diode is connected to the second end of the output capacitor.

Further, in the bridgeless PFC switching power supply circuit, a current sampling resistor is further disposed on the first surface of the PCB, a pin of the current sampling resistor penetrates through a pad through hole in the PCB from the first surface of the PCB and extends to the second surface of the PCB, a first end of the current sampling resistor is connected between the first fast recovery diode and the second fast recovery diode, and a second end of the current sampling resistor is connected between the first MOS switch tube and the second MOS switch tube.

Furthermore, in the bridgeless PFC switching power supply circuit, the bridgeless PFC switching power supply circuit further comprises an insulating layer, a first through hole is formed in the insulating layer at a position corresponding to the pin of the at least one component, and an insulating heat conduction material is arranged in the first through hole.

Further, in the bridgeless PFC switching power supply circuit, the pin of the at least one component has a certain height relative to the second surface of the PCB along a direction away from the PCB and extends into the insulating and heat-conducting material disposed on the insulating layer.

Furthermore, in the bridgeless PFC switching power supply circuit, the bridgeless PFC switching power supply circuit further includes a heat conduction layer, the heat conduction layer is provided with a second through hole at a position corresponding to the pin of the at least one component, and the second through hole is internally provided with a heat conduction sheet.

Further, in the bridgeless PFC switching power supply circuit, the heat conducting sheet is attached to the insulating heat conducting material at the corresponding position.

Further, in the bridgeless PFC switching power supply circuit, the body of the heat conduction layer is made of a material with low heat conduction performance, and the plurality of heat conduction sheets on the heat conduction layer are not connected with each other.

Further, in the bridgeless PFC switching power supply circuit, the at least one temperature sensor is attached to the heat-conducting sheet at the corresponding position.

Further, in the bridgeless PFC switching power supply circuit, the bridgeless PFC switching power supply circuit further includes a sensor layer, and the temperature sensor is disposed in the sensor layer.

According to the high-safety quick-charging power supply, the LLC circuit, the LLC power supply and the bridgeless PFC switch power supply circuit, the insulating layer, the heat conducting layer and the sensor layer are arranged, and the electronic components on the PCB provide heat for the temperature sensor of the sensor layer for temperature detection through the insulating heat conducting material on the insulating layer, so that the controller can control charging parameters according to the temperature, and the heat is transmitted to the outside for heat dissipation through the heat conducting fins on the heat conducting layer, so that potential safety hazards caused by quick charging can be reduced, and the safety is improved.

Drawings

Fig. 1 is a schematic diagram of a position relationship among a PCB, an insulating layer, a heat conducting layer and a sensor layer according to an embodiment of the present invention;

fig. 2 is a schematic diagram of a positional relationship among an electronic component, a PCB, an insulating and heat-conducting material, a heat-conducting fin, and a sensor according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of the position relationship of the PCB, the insulating layer, the heat conducting layer and the sensor layer according to one embodiment of the present invention;

FIG. 4 is a schematic view of a thermally conductive layer provided by one embodiment of the present invention;

fig. 5 is a schematic circuit diagram of a fast charging power supply according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of a fast charge power supply provided by one embodiment of the present invention;

FIG. 7 is a schematic diagram of an LLC circuit provided by an embodiment of the invention;

fig. 8 is a schematic diagram of a bridgeless PFC switching power supply circuit according to an embodiment of the present invention.

Detailed Description

In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced otherwise than as specifically described herein and, therefore, the scope of the present invention is not limited by the specific embodiments disclosed below.

In the description of the present invention, the terms "plurality" or "a plurality" refer to two or more, and unless otherwise specifically limited, the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. The terms "connected," "mounted," "secured," and the like are to be construed broadly and include, for example, fixed connections, removable connections, or integral connections; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the specification, reference to "one embodiment," "some embodiments," "a specific embodiment," or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

A fast charging power supply, an LLC circuit, an LLC power supply, and a bridgeless PFC switching power supply circuit with high safety according to some embodiments of the present invention are described below with reference to fig. 1 to 8.

As shown in fig. 1 to 6, a first aspect of the present invention provides a fast charging source with high safety, which includes a housing 100, and a PCB 200, an insulating layer 300, a heat conducting layer 400 and a sensor layer 500 disposed inside the housing 100, wherein the first surface of the PCB 200 is used for mounting the electronic component 210, the second surface of the PCB 200 is attached to the insulating and heat conducting material 310 on the first surface of the insulating layer 300, the heat conducting layer 400 is disposed on a side of the second surface of the insulating layer 300 facing away from the PCB board 200, the insulating and heat conducting material 310 is attached to the heat conducting sheet 410 disposed on the first surface of the heat conducting layer 400 through the insulating layer 300, the sensor layer 500 is disposed on a side of the second surface of the thermally conductive layer 400 facing away from the insulating layer 300, the heat conducting sheet 410 passes through the heat conducting layer 400 and is attached to a temperature sensor 510 disposed on a first surface of the sensor layer 500; the power supply further comprises a controller 220, wherein the controller 220 is connected with the temperature sensor 510 and is used for controlling the corresponding charging parameters of the power supply according to the temperature information of the corresponding electronic component 210 detected by the temperature sensor 510. According to the high-safety quick charging source provided by the embodiment of the invention, the insulating layer, the heat conducting layer and the sensor layer are arranged, and the electronic components on the PCB provide heat for the temperature sensor of the sensor layer for temperature detection through the insulating heat conducting material on the insulating layer, so that the controller can control charging parameters according to the temperature, and the heat is transmitted to the outside through the heat conducting sheet on the heat conducting layer for heat dissipation, so that the potential safety hazard caused by quick charging can be reduced, and the safety is improved.

Further, as shown in fig. 3, in the quick charging source, the electronic component 210 mounted on the first surface of the PCB 200 includes a high heat component, the insulating layer 300 is provided with a first through hole 320 at a position corresponding to the high heat component, the insulating and heat conducting material 310 is disposed in the first through hole 320, the heat conducting layer 400 is provided with a second through hole 420 at a position corresponding to the high heat component, and the heat conducting sheet 410 is disposed in the second through hole 420. The high heat component is an electronic component 210 that is disposed on the PCB 200 and easily generates high heat. The insulating and heat conducting material 310 may be a heat conducting silicone sheet, a heat conducting silicone grease, a heat conducting silicone tape, etc. Through the setting of insulating layer, can realize the non-invasive installation of heat-conducting layer and sensor layer, avoid producing the influence to the charging circuit of power.

Further, referring to fig. 2 and 3, in the quick charging source, the pin 211 of the high heat component extends from the first surface of the PCB 200 to the second surface of the PCB through the pad through hole 230 on the PCB 200, and the pin 211 of the high heat component has a certain height in the direction of the insulating layer 300 with respect to the second surface of the PCB 200. Further, in the quick charging source, the second surface of the PCB 200 is attached to the insulating and heat conducting material 310 on the first surface of the insulating layer 300, specifically, the pins 211 of the high heat component on the second surface of the PCB 200 are connected to the insulating and heat conducting material 310 on the first surface of the insulating layer 300, and the insulating and heat conducting material 310 is adjacent to and does not contact with other areas of the second surface of the PCB 200 except the pins 211 of the high heat component. In the technical solution of the above embodiment, the insulating and heat conducting material 310 conducts the heat of the high heat component from the pin 211 of the high heat component to the heat conducting sheet 410, and a gap is left between the insulating and heat conducting material 310 and the second surface of the PCB board 200, so that the corresponding area of the second surface of the PCB board 200 at the high heat component can improve the heat dissipation effect through air circulation of the gap.

Further, as shown in fig. 4, in the above-mentioned quick charging source, the body 430 of the heat conductive layer 400 is made of a material having a low heat conductive property, and the plurality of heat conductive sheets 410 on the heat conductive layer 400 are not connected to each other. Because the temperature of each high heat component is different under the working state of different electrical parameters, that is, the reason for generating high heat by each high heat component is different, a temperature sensor needs to be arranged at the corresponding position of each high heat component to detect the temperature of each high heat component, and when a certain temperature sensor detects that the temperature of the corresponding high heat component is greater than a preset value, the controller controls the corresponding electrical parameters to reduce the heat generated by the corresponding high heat component.

Further, as shown in fig. 5, in the quick charging source, the high heat component includes the controller 220 disposed on the PCB 200. The controller is one of main electronic components which are easy to generate heat in the power supply, and once the temperature of the controller is abnormally increased, the controller is possibly caused by aging or damage of other electronic components, and the temperature of the controller is monitored, so that abnormal conditions can be rapidly found to control corresponding electrical parameters, and potential safety hazards caused by further increase of the temperature of the power supply can be avoided. Further, in the fast charging source, the PCB 200 is provided with a bridgeless PFC circuit 240, an LLC resonant circuit 250 and a synchronous rectification circuit 260 which are connected in sequence, and the controller 220 is connected to the bridgeless PFC circuit 240, the LLC resonant circuit 250 and the synchronous rectification circuit 260. The energy storage inductor in the bridgeless PFC circuit 240 and the transformer in the LLC resonant circuit 250 are high-heat components that are prone to generate heat, and a temperature sensor needs to be disposed at a corresponding position to monitor the temperature condition of the components in the working state, and corresponding heat dissipation fins need to be disposed to dissipate heat of the components.

Further, as shown in fig. 4 and 6, in the quick charging source, the surface of the housing 100 is provided with a groove 110, the heat conducting sheet 410 includes a first portion 411 and a second portion 412 connected to each other, the first portion 411 of the heat conducting sheet 410 is disposed in the heat conducting layer 400, and the second portion 412 of the heat conducting sheet 410 is disposed in the groove 110 on the surface of the housing 100. When a power supply of a mobile terminal device such as a mobile phone is used, operations such as plugging and unplugging are often required. For example, when a user goes out and needs to carry a power supply, the user needs to pull out the power supply that has just been used from an outlet. In order to prevent the user from contacting the second portion 412 of the heat conducting sheet 410 on the surface of the housing 100, the groove 110 is formed on the surface of the housing 100 to accommodate the second portion 412 of the heat conducting sheet 410. Since a user generally needs to touch and pinch the power supply with at least two fingers when plugging and unplugging the power supply, the fingers, if placed in the groove, may partially sink into the groove 110 and contact the second portion 412 of the heat conductive sheet 410, the width of the groove 110 should not be greater than 3mm, and the depth of the groove 110 should not be less than 3 mm.

Further, in the fast charging source, the housing 100 includes a first portion and a second portion, the electronic component 210, the PCB 200, the insulating layer 300, the heat conducting layer 400 and the sensor layer 500 are disposed in a cavity formed by combining the first portion and the second portion, and one end of the first portion 411 of the heat conducting sheet 410 on the heat conducting layer 400 extends to the groove 110 on the surface of the housing 100 through a gap at the combination of the first portion and the second portion of the housing 100 to form the second portion 412 of the heat conducting sheet 410. Further, in the quick charging source, a bonding gap of at least one surface of the first portion and the second portion of the housing 100 is in a plane with the heat conductive layer 400, and one end of the heat conductive layer 400 abuts against the bonding gap of at least one surface of the first portion and the second portion of the housing 100. With the above-mentioned technical solution of the embodiment, the heat conducting sheet 410 directly extends from the gap at the joint of the first portion and the second portion of the housing 100 to the outside, and since one end of the heat conducting layer 400 directly abuts against the joint gap of at least one surface of the first portion and the second portion of the housing 100, that is, the heat conducting sheet 410 can extend from the heat conducting layer 400 to the outside of the housing 100, the first portion 411 of the heat conducting sheet 410 is prevented from having a suspended portion inside the housing 100, thereby improving the reliability of the heat conducting sheet.

As shown in fig. 7, a second aspect of the present invention provides an LLC circuit including a first MOS switch Q1, a second MOS switch Q2, a first resonant capacitor C1, a second resonant capacitor C2, a resonant inductor Lr, a parallel inductor Lm, and a transformer T disposed on a first surface of a PCB board 200, wherein a pin 211 of at least one component 210 of the first MOS switch Q1, the second MOS switch Q2, the first resonant capacitor C1, the second resonant capacitor C2, the resonant inductor Lr, the parallel inductor Lm, and the transformer T extends from the first surface of the PCB board 200 to a second surface of the PCB board 200 through a through hole 230 on the PCB board 200, the LLC circuit further including at least one temperature sensor 510 disposed on a side of the second surface of the PCB board 200 corresponding to a position of the pin 211 of the at least one component 210, the LLC circuit further including a controller 220, the controller 220 is connected to the temperature sensor 510, and is configured to control a charging parameter corresponding to the LLC circuit according to the temperature information of the corresponding electronic component 210 detected by the temperature sensor 510. According to the LLC circuit provided by the embodiment of the invention, the insulating layer, the heat conducting layer and the sensor layer are arranged, and the electronic components on the PCB provide heat for the temperature sensor of the sensor layer to carry out temperature detection through the insulating heat conducting material on the insulating layer, so that the controller can control the charging parameters according to the temperature, and the heat is transmitted to the outside through the heat conducting sheets on the heat conducting layer to carry out heat dissipation, so that the potential safety hazard caused by quick charging can be reduced, and the safety is improved.

Further, in the LLC circuit, the first resonant capacitor C1 and the second resonant capacitor C2 connected in series with each other are connected in parallel with the first MOS switch Q1 and the second MOS switch Q2 connected in series with each other, one end of the resonant inductor Lr is connected between the first MOS switch Q1 and the second MOS switch Q2, the other end of the resonant inductor Lr is connected to the parallel inductor Lm and one end of the transformer T connected in parallel with each other, and the other end of the parallel inductor Lm and the other end of the transformer T are connected between the first resonant capacitor C1 and the second resonant capacitor C2. By adopting the LLC circuit of the embodiment, the single resonance capacitor is divided into two discrete capacitors, the capacity of each resonance capacitor is half of that of the single resonance capacitor, the effective value of the flowing resonance current is also half, and the input voltage of the resonance network of the symmetrical half-bridge topology is bipolar symmetrical voltage, so that the defects caused by unipolar input, such as the overshoot phenomenon of the resonance current when the circuit is started, can be effectively avoided.

Further, in the LLC circuit, the LLC circuit further includes an input voltage sampling circuit, a resonant current sampling circuit, and an output voltage sampling circuit, which are disposed on the first surface of the PCB 200 and connected to the controller 220, and the controller 220 is further configured to obtain an input voltage value, a resonant current value, an output voltage value, and a temperature value of each high-temperature electronic component through the input voltage sampling circuit, the resonant current sampling circuit, the output voltage sampling circuit, and the temperature sensor 510, and when one or more of the input voltage value, the resonant current value, the output voltage value, and the temperature value of each high-temperature electronic component is greater than a preset value, control the charging parameter to perform corresponding adjustment, such as turning off an input power supply, and adjusting a frequency/amplitude value of the input voltage or input current.

Further, in the LLC circuit described above, the resonant current sampling circuit includes a first sampling capacitor Cs1, a second sampling capacitor Cs2, a first sampling diode Ds1, a second sampling diode Ds2, and a sampling resistor Rs, a first end of the first sampling capacitor Cs1 is connected between the first resonant capacitor C1, the second resonant capacitor C2, and the parallel inductor Lm, a second end of the first sampling capacitor Cs1 is connected between an output end (negative electrode) of the first sampling diode Ds1 and an input end (positive electrode) of the second sampling diode Ds2, an input end (positive electrode) of the first sampling diode Ds1 is connected between the second resonant capacitor C2 and the second MOS switch Q2, the sampling resistor Rs is connected in parallel with the second sampling capacitor Cs2 and has a first end connected to an input end (positive electrode) of the first sampling diode Ds1, the sampling resistor Rs and the second terminal of the second sampling capacitor Cs2 are connected between the output terminal (negative electrode) of the second sampling diode Ds2, and the controller is connected to the first terminal and the second terminal of the second sampling capacitor Cs2 to sample the resonant current. By adopting the technical scheme of the embodiment of the invention, the resonant current sampling circuit has smaller volume.

Further, as shown in fig. 3, in the LLC circuit, the LLC circuit further includes an insulating layer 300, the insulating layer 300 is provided with a first through hole 320 at a position corresponding to the pin 211 of the at least one component 210, and the insulating heat conduction material 310 is disposed in the first through hole 320. The high heat component is an electronic component 210 that is disposed on the PCB 200 and easily generates high heat. The insulating and heat conducting material 310 may be a heat conducting silicone sheet, a heat conducting silicone grease, a heat conducting silicone tape, etc. Through the setting of insulating layer, can realize the non-invasive installation of heat-conducting layer and sensor layer, avoid producing the influence to the charging circuit of power.

Further, as shown in fig. 2 and 3, in the LLC circuit, the pin 211 of the at least one component 210 has a certain height with respect to the second surface of the PCB board 200 along a direction away from the PCB board 200 and extends into the insulating and heat-conducting material 310 disposed on the insulating layer 300. Further, in the LLC circuit, the LLC circuit further includes a heat conducting layer 400, the heat conducting layer 400 is provided with second through holes 420 at positions corresponding to the pins 211 of the at least one component 210, and heat conducting fins 410 are disposed in the second through holes 420. Further, in the LLC circuit, the heat-conducting sheet 410 is bonded to the corresponding insulating and heat-conducting material 310. In the technical solution of the above embodiment, the insulating and heat conducting material 310 conducts the heat of the high heat component from the pin 211 of the high heat component to the heat conducting sheet 410, and a gap is left between the insulating and heat conducting material 310 and the second surface of the PCB board 200, so that the corresponding area of the second surface of the PCB board 200 at the high heat component can improve the heat dissipation effect through air circulation of the gap.

Further, in the LLC circuit, the body 430 of the heat conducting layer 400 is made of a material with low heat conductivity, and the plurality of heat conducting fins 410 on the heat conducting layer 400 are not connected to each other. Further, in the LLC circuit, the at least one temperature sensor 510 is attached to the corresponding position of the heat-conducting fin 410. Further, in the LLC circuit, the LLC circuit further includes a sensor layer 500, and the temperature sensor 510 is disposed in the sensor layer 500. Because the temperature of each high heat component is different under the working state of different electrical parameters, that is, the reason for generating high heat by each high heat component is different, a temperature sensor needs to be arranged at the corresponding position of each high heat component to detect the temperature of each high heat component, and when a certain temperature sensor detects that the temperature of the corresponding high heat component is greater than a preset value, the controller controls the corresponding electrical parameters to reduce the heat generated by the corresponding high heat component.

As shown in fig. 8, a fourth aspect of the present invention provides a bridgeless PFC switching power supply circuit, which includes a first energy storage inductor L1, a second energy storage inductor L2, a first MOS switch Q3, a second MOS switch Q4, a first fast recovery diode D1, a second fast recovery diode D2, a third fast recovery diode D3, a fourth fast recovery diode D3, and an output capacitor C3, wherein at least one of the first energy storage inductor L1, the second energy storage inductor L2, the first MOS switch Q3, the second MOS switch Q4, the first fast recovery diode D1, the second fast recovery diode D2, the third fast recovery diode D3, the fourth fast recovery diode D4, and the output capacitor C3 has a pin extending from a first surface of the PCB 200 to a second surface of the PCB 230 through a through hole formed in the PCB 200, the bridgeless PFC switch power supply circuit further comprises at least one temperature sensor 510 arranged on one side of the second surface of the PCB 200 and corresponding to the position of the pin 211 of the at least one component 210, and the bridgeless PFC switch power supply circuit further comprises a controller 220, wherein the controller 220 is connected with the temperature sensor 510 and is used for controlling corresponding charging parameters of the bridgeless PFC switch power supply circuit according to the temperature information, detected by the temperature sensor 510, of the corresponding electronic component 210. According to the bridgeless PFC switch power supply circuit provided by the embodiment of the invention, the insulating layer, the heat conducting layer and the sensor layer are arranged, and the electronic components on the PCB supply heat to the temperature sensor of the sensor layer for temperature detection through the insulating heat conducting material on the insulating layer, so that the controller can control the charging parameters according to the temperature, and on the other hand, the heat is transmitted to the outside for heat dissipation through the heat conducting sheet on the heat conducting layer, so that the potential safety hazard caused by quick charging can be reduced, and the safety is improved.

Further, in the bridgeless PFC switching power supply circuit, a first end of the first energy storage inductor L1 and a first end of the second energy storage inductor L2 are respectively connected to a first input end and a second input end of the bridgeless PFC switching power supply circuit, two ends of the first fast recovery diode D1 and the second fast recovery diode D2 after being connected in series are respectively connected to a second end of the first energy storage inductor L1 and a second end of the second energy storage inductor L2, two ends of the first MOS switch tube Q3 and the second MOS switch tube Q4 after being connected in series are respectively connected to a second end of the first energy storage inductor L1 and a second end of the second energy storage inductor L2, a first end of the third fast recovery diode D3 is connected to a second end of the first energy storage inductor L1, a second end of the third fast recovery diode D3 is connected to a first end of the output capacitor C3, and a first end of the fourth fast recovery diode D4 is connected to a second end of the second energy storage inductor L2, a second terminal of the fourth fast recovery diode D4 is connected to a second terminal of the output capacitor C3. Further, in the bridgeless PFC switching power supply circuit, the first surface of the PCB board 200 is further provided with a current sampling resistor R1, a pin 211 of the current sampling resistor R1 extends from the first surface of the PCB board 200 to the second surface of the PCB board 200 through a pad through hole 230 on the PCB board 200, a first end of the current sampling resistor R1 is connected between the first fast recovery diode D1 and the second fast recovery diode D2, and a second end of the current sampling resistor R1 is connected between the first MOS switch Q3 and the second MOS switch Q4. By adopting the technical scheme of the embodiment, the power factor can be corrected by detecting the sampling current of the current sampling resistor without detecting the input voltage.

Further, as shown in fig. 3, in the bridgeless PFC switching power supply circuit, the bridgeless PFC switching power supply circuit further includes an insulating layer 300, a first through hole 320 is formed in the insulating layer 300 at a position corresponding to the pin 211 of the at least one component 210, and an insulating heat conduction material 310 is disposed in the first through hole 320. The high heat component is an electronic component 210 that is disposed on the PCB 200 and easily generates high heat. The insulating and heat conducting material 310 may be a heat conducting silicone sheet, a heat conducting silicone grease, a heat conducting silicone tape, etc. Through the setting of insulating layer, can realize the non-invasive installation of heat-conducting layer and sensor layer, avoid producing the influence to the charging circuit of power.

Further, as shown in fig. 2 and fig. 3, in the bridgeless PFC switching power supply circuit, the pin 211 of the at least one component 210 has a certain height with respect to the second surface of the PCB 200 along a direction away from the PCB 200 and extends into the insulating and heat conducting material 310 disposed on the insulating layer 300. Further, in the bridgeless PFC switching power supply circuit, the LLC circuit further includes a heat conducting layer 400, the heat conducting layer 400 is provided with a second through hole 420 at a position corresponding to the pin 211 of the at least one component 210, and a heat conducting fin 410 is disposed in the second through hole 420. Further, in the bridgeless PFC switching power supply circuit, the heat conducting sheet 410 is attached to the insulating and heat conducting material 310 at a corresponding position. In the technical solution of the above embodiment, the insulating and heat conducting material 310 conducts the heat of the high heat component from the pin 211 of the high heat component to the heat conducting sheet 410, and a gap is left between the insulating and heat conducting material 310 and the second surface of the PCB board 200, so that the corresponding area of the second surface of the PCB board 200 at the high heat component can improve the heat dissipation effect through air circulation of the gap.

Further, in the bridgeless PFC switching power supply circuit, the body 430 of the heat conducting layer 400 is made of a material with low heat conductivity, and the plurality of heat conducting fins 410 on the heat conducting layer 400 are not connected to each other. Further, in the bridgeless PFC switching power supply circuit, the at least one temperature sensor 510 is attached to the heat conductive sheet 410 at a corresponding position. Further, in the bridgeless PFC switching power supply circuit, the sensor layer 500 and the temperature sensor 510 are disposed in the sensor layer 500. Because the temperature of each high heat component is different under the working state of different electrical parameters, that is, the reason for generating high heat by each high heat component is different, a temperature sensor needs to be arranged at the corresponding position of each high heat component to detect the temperature of each high heat component, and when a certain temperature sensor detects that the temperature of the corresponding high heat component is greater than a preset value, the controller controls the corresponding electrical parameters to reduce the heat generated by the corresponding high heat component.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

While embodiments in accordance with the invention have been described above, these embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention and various embodiments with various modifications as are suited to the particular use contemplated. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. The LLC circuit is characterized by comprising a first MOS switch tube, a second MOS switch tube, a first resonant capacitor, a second resonant capacitor, a resonant inductor, a parallel inductor and a transformer which are arranged on a first surface of a PCB (printed Circuit Board), wherein the first MOS switch tube, the second MOS switch tube, the first resonant capacitor, the second resonant capacitor, the resonant inductor, the parallel inductor and a pin of at least one component in the transformer penetrate through a first surface of the PCB and a pad through hole in the PCB and extend to a second surface of the PCB, the LLC circuit further comprises at least one temperature sensor which is arranged on one side of the second surface of the PCB and corresponds to the position of the pin of the at least one component, the LLC circuit further comprises a controller which is connected with the temperature sensor and is used for controlling charging of the LLC circuit according to temperature information of the corresponding electronic component detected by the temperature sensor And (4) parameters.

2. The LLC circuit of claim 1, wherein the first resonant capacitor and the second resonant capacitor connected in series with each other are connected in parallel with the first MOS switch tube and the second MOS switch tube connected in series with each other, one end of the resonant inductor is connected between the first MOS switch tube and the second MOS switch tube, the other end of the resonant inductor is connected with the parallel inductor and one end of the transformer connected in parallel with each other, and the parallel inductor and the other end of the transformer are connected between the first resonant capacitor and the second resonant capacitor.

3. The LLC circuit of claim 1 or 2, further comprising an insulating layer, wherein the insulating layer is provided with a first through hole at a pin position corresponding to the at least one component, and an insulating and heat conducting material is arranged in the first through hole.

4. The LLC circuit of claim 3, wherein the pin of said at least one component is raised relative to the second surface of the PCB in a direction away from the PCB and extends into the insulating and thermally conductive material disposed on the insulating layer.

5. The LLC circuit of claim 4, further comprising a heat conducting layer, wherein the heat conducting layer is provided with a second through hole at a position corresponding to the pin of the at least one component, and a heat conducting fin is arranged in the second through hole.

6. The LLC circuit of claim 5, wherein the heat conducting fins are attached to the corresponding locations of the insulating and heat conducting material.

7. The LLC circuit of claim 5 or 6 wherein said body of said heat conducting layer is made of a material having low thermal conductivity, said plurality of heat conducting fins of said heat conducting layer being unconnected to each other.

8. The LLC circuit of claim 7, wherein said at least one temperature sensor is bonded to a correspondingly located thermally conductive plate.

9. The LLC circuit of claim 8, further comprising a sensor layer, said temperature sensor being disposed within said sensor layer.

10. An LLC power supply, characterized in that it comprises an LLC circuit as claimed in claims 1-9.