CN114907124B - 一种微波介质材料TmVO4及其制备方法 - Google Patents

一种微波介质材料TmVO4及其制备方法 Download PDF

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CN114907124B
CN114907124B CN202210384760.1A CN202210384760A CN114907124B CN 114907124 B CN114907124 B CN 114907124B CN 202210384760 A CN202210384760 A CN 202210384760A CN 114907124 B CN114907124 B CN 114907124B
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李波
谌祝廷
穆宁波
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University of Electronic Science and Technology of China
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Abstract

本发明属于电子陶瓷及其制造领域,提供一种微波介质材料及其制备方法;所述微波介质材料为TmVO4,晶相为TmVO4,属于四方晶体结构。本发明提供一种微波介质材料在1100~1250℃烧结温度下具有低的介电损耗,Q×f值为40000~60000GHz,介电常数为11~12,谐振频率温度系数为‑35~‑50ppm/℃。该微波介质材料制备工艺简单、生产成本低,有利于实现工业化生产。

Description

一种微波介质材料TmVO4及其制备方法
技术领域
本发明属于电子陶瓷及其制造领域,具体涉及一种微波介质材料TmVO4及其制备方法。
背景技术
5G时代移动通信技术的不断发展对微波器件提出了更高的要求,低的介电损耗能够降低信号的衰减,因此研究低损耗的微波介质材料具有极大的实际应用价值。钒酸盐陶瓷的固有烧结温度低、微波介电性能优良等优点而被广泛关注。WEI LI等人在文章“Preparation,Crystal Structure and Microwave Dielectric Properties of Rare-Earth Vanadates:ReVO4(Re=Nd,Sm)”中报道了在1160℃烧结制备出NdVO4微波介质,εr=12、Q×f=36440GHz、τf=-44.3ppm/℃。但是该材料的Q×f值偏低,需研究介电损耗更低的微波介质材料。
基于上述背景,本发明提供一种微波介质材料TmVO4及其制备方法。
发明内容
本发明的目的在于提供了一种微波介质材料TmVO4及其制备方法
为实现上述目的,本发明采用的技术方案如下:
一种微波介质材料,其特征在于,所述微波介质材料的化学式为:TmVO4
进一步的,所述微波介质材料的晶相为TmVO4,属于四方晶体结构。
进一步的,所述微波介质材料的制备方法,其特征在于,包括以下步骤:
步骤1:以V2O5、Tm2O3为原料按照化学式TmVO4的摩尔比进行配料;
步骤2:将混合料、去离子水和锆球在球磨罐中球磨6~8小时,球磨后浆料于烘箱内烘干;
步骤3:将干燥粉料过筛后,放在坩埚中于800~900℃预烧3~4小时,得到预烧粉料;
步骤4:将预烧料、去离子水和锆球在球磨罐中球磨4~6小时,球磨后浆料于烘箱内烘干;
步骤5:将干燥料通过聚乙烯醇溶液造粒,在10~20MPa干压得到生坯;
步骤6:生坯在1100~1250℃烧结4~6小时,得到所述的微波介质材料。
本发明的有益效果在于:
本发明提供一种新型的微波介质材料TmVO4,晶相为TmVO4,属于四方晶体结构。具有低的介电损耗,在1200℃的烧结温度下Q×f值为53594GHz;
本发明提供微波介质材料TmVO4,在1100℃~1250℃烧结温度下具有优良的微波介电性能:介电常数为11~12、Q×f值为40000~60000GHz、谐振频率温度系数为-35~-50ppm/℃;该微波介质材料的制备工艺简单、生产成本低,有利于实现工业化生产。
附图说明
图1为实施例3制备得微波介质材料TmVO4的XRD图。
图2为实施例3制备得微波介质材料TmVO4的SEM图。
具体实施方案
下面结合附图和实施例对本发明做进一步详细说明。
本发明共提供4个实施例,每个实施例提供的微波介质材料配方皆为TmVO4;所述微波陶瓷材料均采用如下方法进行制备:
步骤1:以V2O5、Tm2O3为原料按照化学式TmVO4的摩尔比进行配料;
步骤2:将混合料、去离子水和锆球在球磨罐中球磨6~8小时,球磨后浆料于烘箱内烘干;
步骤3:将干燥粉料过筛后,放在坩埚中于800~900℃预烧3~4小时,得到预烧粉料;
步骤4:将预烧料、去离子水和锆球在球磨罐中球磨4~6小时,球磨后浆料于烘箱内烘干;
步骤5:将干燥料通过聚乙烯醇溶液造粒,在10~20MPa干压得到生坯;
步骤6:生坯在1100~1250℃烧结4~6小时,得到所述的微波介质材料。
以上4个实施例的具体工艺参数及微波介电性能如下表所示:
由上表可见,本发明提供的微波介质材料TmVO4,其在1100~1250℃烧结温度下拥有优良的微波介电性能:介电常数为11~12、Q×f值为40000~60000GHz、谐振频率温度系数为-35~-50ppm/℃。实施例3制备得微波介质材料TmVO4的XRD图、SEM图分别如图1、图2所示。
以上所述,仅为本发明的具体实施方式,本说明书中所公开的任一特征,除非特别叙述,均可被其他等效或具有类似目的的替代特征加以替换;所公开的所有特征、或所有方法或过程中的步骤,除了互相排斥的特征和/或步骤以外,均可以任何方式组合。

Claims (1)

1.一种微波介质材料,其特征在于,所述微波介质材料的化学式为TmVO4;所述微波介质材料的晶相为TmVO4,属于四方晶体结构;所述微波介质材料的品质因数Q×f值为40000~60000GHz,介电常数为11~12,谐振频率温度系数为-35~-50ppm/℃;所述微波介质材料的制备方法,包括以下步骤:
步骤1:以V2O5、Tm2O3为原料按照化学式TmVO4的摩尔比进行配料;
步骤2:将混合料、去离子水和锆球在球磨罐中球磨6~8小时,球磨后浆料于烘箱内烘干;
步骤3:将干燥粉料过筛后,放在坩埚中于800~900℃预烧3~4小时,得到预烧粉料;
步骤4:将预烧料、去离子水和锆球在球磨罐中球磨4~6小时,球磨后浆料于烘箱内烘干;
步骤5:将干燥料通过聚乙烯醇溶液造粒,在10~20MPa干压得到生坯;
步骤6:生坯在1100~1250℃烧结4~6小时,得到所述的微波介质材料。
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CN115353388A (zh) * 2022-09-19 2022-11-18 电子科技大学 一种微波陶瓷材料PrVO4及其制备方法

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