CN114900995A - Multi-stage plating-proof structure, through hole manufacturing method with multi-layer network and PCB - Google Patents
Multi-stage plating-proof structure, through hole manufacturing method with multi-layer network and PCB Download PDFInfo
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- CN114900995A CN114900995A CN202210743573.8A CN202210743573A CN114900995A CN 114900995 A CN114900995 A CN 114900995A CN 202210743573 A CN202210743573 A CN 202210743573A CN 114900995 A CN114900995 A CN 114900995A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000007747 plating Methods 0.000 claims abstract description 83
- 238000005192 partition Methods 0.000 claims abstract description 65
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- 239000010949 copper Substances 0.000 claims abstract description 27
- 230000008021 deposition Effects 0.000 claims abstract description 26
- 238000009713 electroplating Methods 0.000 claims abstract description 25
- 239000003814 drug Substances 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 238000000151 deposition Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 20
- 238000001465 metallisation Methods 0.000 claims description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 230000000903 blocking effect Effects 0.000 claims description 6
- 238000005553 drilling Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 75
- 239000000243 solution Substances 0.000 description 9
- 230000002265 prevention Effects 0.000 description 8
- 229920003023 plastic Polymers 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000012670 alkaline solution Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to the technical field of PCBs (printed circuit boards), and discloses a multi-stage plating-proof structure, a through hole manufacturing method with a multi-layer network and a PCB. The multi-stage plating-proof structure comprises a hard inner pipe, wherein the pipe wall of the hard inner pipe is divided into a first pipe wall partition and a second pipe wall partition which are distributed in a crossed manner along the axial direction or the radial direction; the first pipe wall subareas correspond to the quasi-metallized hole wall subareas one by one, and hollow structures for circulating copper deposition/electroplating liquid medicine are formed in the first pipe wall subareas; the second pipe wall subareas correspond to the quasi-nonmetallic hole wall subareas one by one, and the outer side walls of the second pipe wall subareas are respectively wrapped with an anti-plating layer for preventing the corresponding quasi-nonmetallic hole wall subareas from contacting with copper deposition/electroplating liquid medicine. The embodiment of the invention utilizes the multi-stage anti-plating structure to realize at least three parts of electroplated layers separated from each other on the inner wall of the same through hole, and each part of electroplated layer can be used for connecting different signals, so that the through hole realizes the multilayer network manufacturing, and the wiring density is greatly improved compared with the prior art.
Description
Technical Field
The invention relates to the technical field of Printed Circuit Boards (PCBs), in particular to a multi-stage plating-proof structure, a method for manufacturing a through hole with a multi-layer network and a PCB.
Background
Pcb (printed Circuit board), which is called a printed Circuit board (pcb), is an important electronic component as a support for electronic components.
As PCBs are developed to be dense, thin, and flat, the density of wiring on PCBs is increasing. In the PCB design, the interlayer circuit patterns are connected through the metallization holes, namely networking. However, the conventional metalized holes can only realize the connection of a single network, and at this time, in order to realize the design of different network wirings between layers, a plurality of metalized holes are usually required to be processed, which seriously affects the wiring density and the processing and preparation efficiency of the PCB.
Disclosure of Invention
The invention aims to provide a multi-stage plating-proof structure, a through hole manufacturing method with a multi-layer network and a PCB (printed circuit board), so as to solve the problem of low wiring density in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
a multi-stage plating-proof structure is used for plugging a through hole to be metallized, the hole wall of the through hole is divided into a plurality of pseudo-metallized hole wall subareas and pseudo-nonmetallic hole wall subareas which are distributed in a cross way along the axial direction or the radial direction of the through hole, and the number of the pseudo-metallized hole wall subareas is more than that of the pseudo-metallized hole wall subareas,
the multistage anti-plating structure comprises a hard inner pipe, wherein the pipe wall of the hard inner pipe is divided into a first pipe wall partition and a second pipe wall partition which are distributed in a crossed manner along the axial direction or the radial direction;
each first pipe wall partition corresponds to each pseudo-metallized hole wall partition one by one, and a hollow structure for circulating copper deposition/electroplating liquid medicine is formed in each first pipe wall partition;
each second pipe wall partition corresponds to each quasi-nonmetallic hole wall partition one by one, and the outer side wall of each second pipe wall partition is respectively wrapped with an anti-plating layer for preventing the corresponding quasi-nonmetallic hole wall partition from contacting with copper deposition/electroplating liquid medicine.
Optionally, the anti-plating layer is specifically made of a material with a thermal expansion coefficient exceeding a preset threshold, and the hard inner tube is made of a material with a thermal expansion coefficient lower than the preset threshold; and the axial two ends of the outer side wall of each second pipe wall partition of the hard inner pipe are respectively provided with a blocking structure for preventing the anti-plating layer from expanding along the axial direction of the through hole.
Optionally, the anti-plating layer is a dry film layer.
Optionally, the thickness of the dry film layer is 100um-500 um.
Optionally, the surfaces of the hard inner tubes except for the surfaces wrapped with the plating-resistant layers are coated with non-polar materials.
A method for manufacturing a through hole with a multilayer network comprises the following steps:
drilling a through hole on the printed circuit board, wherein the hole wall of the through hole is divided into a pseudo-metallization hole wall subarea and a pseudo-non-metallization hole wall subarea which are distributed in a cross mode along the axial direction or the radial direction of the through hole, and the number of the pseudo-metallization hole wall subareas is multiple;
inserting the multi-stage anti-plating structure into the through hole, so that the outer side wall of each anti-plating layer is respectively attached to the corresponding quasi-nonmetallic hole wall in a partition manner;
and carrying out copper deposition electroplating on the through hole plugged into the multi-stage anti-plating structure so as to form an electroplated layer on the surface of each pseudo-metallized hole wall subarea of the through hole.
Optionally, the plating prevention layer is specifically made of a material with a thermal expansion coefficient exceeding a preset threshold, and the hard inner tube is made of a material with a thermal expansion coefficient lower than the preset threshold; and the axial two ends of the outer side wall of each second pipe wall partition of the hard inner pipe are respectively provided with a blocking structure for preventing the anti-plating layer from expanding along the axial direction of the through hole;
the through hole manufacturing method further comprises the following steps: and after the multi-stage plating-proof structure is plugged into the through hole, the multi-stage plating-proof structure is heated, so that the plating-proof layer radially expands along the through hole to be attached to the corresponding quasi-nonmetallic hole wall partition in an increasing manner.
Optionally, the anti-plating layer is a dry film layer;
the through hole manufacturing method further comprises the following steps: and after the copper deposition electroplating is finished, dissolving and removing the dry film layer until the multi-stage plating-proof structure is separated from the through hole and then automatically falls off.
Optionally, the dry film layer is dissolved and removed by 5% NaOH alkaline solution.
A PCB comprising a via with a multilayer network, the via being made according to any of the above via making methods with a multilayer network.
Compared with the prior art, the invention has the beneficial effects that:
according to the embodiment of the invention, when the multi-stage anti-plating structure is plugged into the through hole, the periphery of each first pipe wall partition of the multi-stage anti-plating structure is not wrapped with the anti-plating layer, the pipe wall is provided with the hollow structure, and the periphery of each second pipe wall partition is wrapped with the anti-plating layer, so that the copper deposition/electroplating liquid medicine can penetrate through each first pipe wall partition to contact with each quasi-metallized hole wall partition of the through hole so as to form the electroplated layer on the surface of the through hole, and meanwhile, each quasi-nonmetallic hole wall partition of the through hole can not form the electroplated layer due to the shielding of the anti-plating layer. Therefore, by utilizing the multi-stage plating-proof structure, at least three parts of electroplated layers which are mutually separated can be realized on the inner wall of the same through hole, and each part of electroplated layer can be used for connecting different signals, so that the through hole realizes multilayer network manufacturing, and compared with the prior art, the wiring density is greatly improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a cross-sectional view of a multi-stage plating prevention structure with a plurality of plating prevention layers distributed along an axial direction of a through hole according to an embodiment of the present invention.
Fig. 2 is a top view of a multi-stage plating prevention structure with a plurality of plating prevention layers distributed along a radial direction of a through hole according to an embodiment of the present invention.
Fig. 3 is a flowchart of a method for fabricating a via with a multilayer network according to an embodiment of the present invention.
Fig. 4 is a schematic process diagram of manufacturing a through hole having a multilayer network by using the multi-stage plating resist structure shown in fig. 1 according to an embodiment of the present invention.
Fig. 5 is a schematic process diagram of manufacturing a through hole having a multilayer network by using the multi-stage plating resist structure shown in fig. 2 according to an embodiment of the present invention.
Description of reference numerals: the multi-stage anti-plating structure comprises a multi-stage anti-plating structure 1, a hard inner tube 11, an anti-plating layer 12, a hollow structure 13, a printed circuit board 2 and a through hole 3.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to solve the problem of low wiring density in the prior art, the embodiment of the invention provides a brand-new solution, firstly, a novel multi-stage plating-proof structure 1 with a partial plating-resisting function is plugged into a through hole 3, then, conventional copper deposition electroplating is carried out on the through hole 3, namely, an electroplated layer can be plated on at least three hole walls of the through hole 3, and an electroless plated layer is plated on the rest hole walls, so that the same through hole 3 realizes a multi-layer network.
For convenience of description, for the through-hole 3 made to have a multilayer network, the hole wall of the through-hole 3 is hereinafter divided into a pseudo-metallized hole wall partition and a pseudo-nonmetallic hole wall partition distributed crosswise in the axial direction or the radial direction thereof, and the number of the pseudo-metallized hole wall partitions is plural (i.e., not less than three).
Referring to fig. 1 and 2, an embodiment of the present invention provides a multi-stage plating-proof structure 1 for plugging a through hole 3 to be partially metallized, where the multi-stage plating-proof structure 1 includes a hard inner tube 11, and a tube wall of the hard inner tube 11 is axially and/or radially divided into a first tube wall partition and a second tube wall partition which are distributed in a cross manner;
each first pipe wall partition corresponds to each pseudo-metallized hole wall partition of the through hole 3 one by one, and a hollow structure 13 for circulating copper deposition/electroplating liquid medicine is arranged on each first pipe wall partition;
each second pipe wall partition corresponds to each quasi-nonmetallic hole wall partition of the through hole 3 one by one, and the outer side wall of each first pipe wall partition is respectively wrapped with an anti-plating layer 12 for preventing the corresponding quasi-nonmetallic hole wall partition from contacting with copper deposition/electroplating liquid medicine.
It should be noted that, in this embodiment, "one-to-one correspondence" means that the sizes and the positions of the two are basically matched to ensure that, when the multi-stage plating resist structure 1 is plugged into the through hole 3, the plating resist layer 12 wrapped around the periphery of each second pipe wall partition can be in a good overall fit state with the quasi-nonmetallic hole wall partition of the through hole 3 at the corresponding position.
It can be understood that, when the through hole 3 is plugged in, the periphery of each first pipe wall partition of the multistage anti-plating structure 1 is not wrapped by the anti-plating layer 12, and the pipe wall of each first pipe wall partition is provided with the hollow structure 13, so that the copper deposition/electroplating liquid medicine can pass through each first pipe wall partition to contact with each quasi-metallized hole wall partition of the through hole 3, so that an electroplated layer is formed on the surface of the through hole. Meanwhile, the periphery of each second pipe wall partition of the multi-stage plating-proof structure 1 is wrapped with a plating-proof layer 12, the outer side wall of the plating-proof layer 12 can keep a fitting state with the quasi-nonmetallic hole wall partition of the through hole 3, so that when the through hole 3 is completely immersed in the copper deposition/electroplating liquid medicine, the plating-proof layer 12 can block the copper deposition/electroplating liquid medicine, the contact of the copper deposition/electroplating liquid medicine and the quasi-nonmetallic hole wall partition of the through hole 3 is avoided, and the plating layer can not be plated on the quasi-nonmetallic hole wall partition surface of the through hole 3. Therefore, by utilizing the multi-stage plating-proof structure 1, at least three parts of electroplated layers separated from each other can be realized on the inner wall of the same through hole 3, and each part of electroplated layer can be used for connecting different signals, so that the through hole 3 realizes multilayer network manufacturing, and the wiring density is greatly improved compared with the prior art.
In this embodiment, in the multi-stage plating-preventing structure 1, the plating-preventing layers 12 may be distributed on the outer side wall of the hard inner tube 11 at intervals along the axial direction of the through hole 3 (as shown in fig. 1), at intervals along the radial direction of the through hole 3 (as shown in fig. 2), and at intervals along the axial direction and the radial direction of the through hole 3. In practical applications, the distribution design of the plating resist layer 12 can be selected according to the network connection requirement of the through holes 3.
In an alternative embodiment, the hard inner tube 11 is a hard plastic, which refers to a plastic with a higher hardness. Because the hard inner tube 11 is hard plastic, the hard plastic has good supporting performance due to the large hardness, and the whole length of the multi-stage plating-proof structure 1 can keep a stable state in the hole plugging process, so that the multi-stage plating-proof structure 1 can be conveniently and quickly plugged into the through hole 3, the plating-proof layer 12 and the quasi-nonmetallic hole wall partition of the through hole 3 can be ensured to have high alignment degree, and the hole plugging precision is improved. Illustratively, the rigid plastic is a PC (polycarbonate) material or an AS (styrene-acrylonitrile copolymer) material.
In order to achieve the plating-resistant effect, the plating-resistant layer 12 may be made of any material such as non-conductive plastic, as long as it cannot penetrate the copper deposition/plating solution to cause the copper deposition/plating solution to contact the inner wall of the through hole 3 at the corresponding position.
In order to improve the fitting degree, the plating resist layer 12 is specifically made of a material having a thermal expansion coefficient exceeding a predetermined threshold, and the plating resist layer 12 is generally thermally expanded at a higher temperature. Based on this, after inserting multistage anti-plating structure 1 into through-hole 3, can heat so that prevent that cladding material 12 from taking place the thermal expansion to promote the laminating degree of preventing cladding material 12 and the partial region of the quasi-non-metallizing pore wall of through-hole 3, further promote the effect of preventing plating to the partial region of quasi-non-metallizing pore wall.
As another example, in order to improve the manufacturing efficiency, the plating resist layer 12 may be a dry film layer. Based on this, in order to manufacture the multi-stage plating-preventing structure 1 with the plating-preventing layer 12 in the outer local area of the hard inner tube 11, a dry film layer can be coated on the whole outer side wall of the hard inner tube 11 in advance, and then the dry film layer in a partial area can be selectively removed, so that the multi-stage plating-preventing structure 1 with different selective multi-stage plating-preventing functions can be simply, quickly and accurately manufactured. Of course, in order to ensure good fitting degree of the dry film layer with the quasi-nonmetallic hole wall partition of the through hole 3, the through hole 3 of the current size can be adapted by adjusting the thickness of the dry film layer, and optionally, the thickness of the dry film layer is 100um-500 um.
In order to further improve the reusability of the multi-stage plating-resistant structure 1, designated areas of the hard inner tube 11 and the plating-resistant layer 12 are coated with non-polar materials, and the designated areas are non-contact surfaces of the multi-stage plating-resistant structure 1 which are not in contact with the hole wall of the through hole 3 in the state of being plugged into the through hole 3. When the multi-stage plating-proof structure is immersed in the copper deposition/electroplating liquid medicine, the non-polar material can prevent the surface of the multi-stage plating-proof structure 1 from being corroded or forming an electroplated layer due to the chemical reaction between the surface of the multi-stage plating-proof structure 1 and the liquid medicine.
Referring to fig. 3 to fig. 5, an embodiment of the present invention further provides a method for manufacturing a via with a multilayer network, including the steps of:
The hole wall of the through hole 3 is divided into a pseudo-metallization hole wall subarea and a pseudo-non-metallization hole wall subarea which are distributed in a cross mode along the axial direction and/or the radial direction, and the number of the pseudo-metallization hole wall subareas is multiple.
Specifically, the printed circuit board 2 can be obtained by laminating and pressing according to the conventional procedure, and then the through hole 3 is drilled on the printed circuit board 2.
102, plugging the multi-stage anti-plating structure 1 into the through hole 3, so that the outer side walls of the anti-plating layers 12 are respectively attached to the quasi-nonmetallic hole wall partitions at the corresponding positions.
It should be noted that, in this embodiment, the overall length of the hard inner tube 11 of the multi-stage plating-proof structure 1 is equal to the overall depth of the through hole 3, and the partition mode of the hard inner tube 11 is completely the same as the partition mode of the inner wall of the through hole 3, so that when the through hole 3 is completely plugged in, the plating-proof layer 12 of the multi-stage plating-proof structure 1 is completely aligned and attached to the partition of the quasi-nonmetallic hole wall of the through hole 3, so as to make the quasi-nonmetallic hole wall of the through hole 3 perform non-metallization in partition mode.
Because the multistage anti-plating structure 1 and the through hole 3 are manufactured in a mode of completely matching the sizes, the difficulty and the complexity of hole plugging depth control are avoided in hole plugging operation, and the multistage anti-plating structure 1 only needs to be plugged into the through hole 3 until the end part is basically leveled.
And 103, carrying out copper deposition electroplating on the through hole 3 plugged into the multi-stage plating-proof structure 1 so as to form an electroplated layer on the surface of each pseudo-metallized hole wall subarea of the through hole 3.
After the multi-stage plating-proof structure 1 is plugged, the quasi-nonmetallic hole wall subareas of the through holes 3 are shielded by the plating-proof layer 12, and the quasi-metalized hole wall subareas are not shielded, so that the quasi-nonmetallic hole wall subareas of the through holes 3 cannot form an electroplated layer after copper deposition electroplating, and the quasi-metalized hole wall subareas of the through holes 3 form the electroplated layer, and meanwhile, the through holes 3 with the multi-layer network are manufactured because the number of the quasi-metalized hole wall subareas is at least three.
It should be noted that, because the multi-stage plating-proof structure 1 is a hollow structure as a whole, in the copper deposition electroplating process, the copper deposition/electroplating solution can smoothly realize good exchange through the middle gap of the multi-stage plating-proof structure 1, so as to ensure the thickness uniformity and the evenness of the electroplated layer on the surface of each partition of the quasi-metallized hole wall.
In an alternative embodiment, the plating-prevention layer 12 is made of a material having a coefficient of thermal expansion exceeding a preset threshold, and the hard inner tube 11 is made of a material having a coefficient of thermal expansion below a preset threshold; and the two axial ends of the outer side wall of each second pipe wall partition of the hard inner pipe 11 are respectively provided with a blocking structure for preventing the anti-plating layer 12 from expanding along the axial direction of the through hole 3. In this case, the method for manufacturing the through hole 3 further includes: after filling the multi-stage anti-plating structure 1 into the through hole 3, heating the multi-stage anti-plating structure 1, wherein the expansion rate of the hard inner tube 11 is within the allowable error range due to the lower expansion coefficient, and the anti-plating layer 12 is limited by the blocking structure and can not expand along the axial direction of the through hole 3 and can only expand along the radial direction of the through hole 3, so that the anti-plating layer 12 expands along the radial direction of the through hole 3 to the degree of fitting with the corresponding quasi-nonmetallic hole wall partition.
And 104, removing the multi-stage plating-proof structure 1.
In practical application, if the multi-stage plating prevention structure 1 does not affect the normal use of the subsequent printed circuit board 2, the multi-stage plating prevention structure 1 in the through hole 3 can be retained without additional removal operation.
Of course, the multi-stage plating resist structure 1 may also be selectively removed, and different removal methods may be specifically adopted according to specific materials of the multi-stage plating resist structure 1, which is not limited in this embodiment of the present invention. Two general types of multi-stage plating resist 1 removal are provided here: the multi-stage plating resist structure 1 is pushed out from the through hole 3 by using an external tool, or the multi-stage plating resist structure 1 is pulled out from the through hole 3 manually or by using an external tool.
When the plating resist layer 12 is a dry film layer, the removing mode of the multi-stage plating resist structure 1 may be: and after the copper deposition electroplating is finished, dissolving and removing the dry film layer until the multi-stage plating-resistant structure 1 is separated from the through hole 3 and then automatically falls off. Wherein, 5% NaOH alkaline solution can be used for dissolving and removing the dry film layer. This mode of getting rid of structure 1 is prevented plating by multistage owing to get rid of in the operation process and prevent plating the effect of any power not taking place between structure 1 and the 3 inner walls of through-hole, consequently prevents plating the equal not damaged of structure 1 and the 3 inner walls of through-hole to multistage, and has easy operation, the degree of difficulty is low, work efficiency is high and advantage with low costs.
In summary, according to the method for manufacturing the through hole 3 with the multilayer network provided by the embodiment of the invention, the multilayer network can be manufactured in the same through hole 3 only by inserting the adaptive multi-stage plating prevention structure 1 into the through hole 3 and then depositing copper for electroplating, and compared with the prior art, the wiring density of the PCB can be effectively improved.
The embodiment of the invention also provides a PCB which comprises a through hole 3 with a multilayer network, and the through hole 3 is manufactured according to the manufacturing method. The through holes 3 of the PCB are manufactured by the method, so that the wiring density is higher.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A multi-stage plating-proof structure is used for plugging a through hole to be metallized, the hole wall of the through hole is divided into a plurality of pseudo-metallized hole wall subareas and pseudo-nonmetallic hole wall subareas which are distributed in a cross way along the axial direction or the radial direction of the through hole, and the number of the pseudo-metallized hole wall subareas is multiple,
the multistage anti-plating structure comprises a hard inner pipe, wherein the pipe wall of the hard inner pipe is divided into a first pipe wall partition and a second pipe wall partition which are distributed in a crossed manner along the axial direction or the radial direction;
each first pipe wall partition corresponds to each pseudo-metallized hole wall partition one by one, and a hollow structure for circulating copper deposition/electroplating liquid medicine is formed in each first pipe wall partition;
each second pipe wall partition corresponds to each quasi-nonmetallic hole wall partition one by one, and the outer side wall of each second pipe wall partition is respectively wrapped with an anti-plating layer for preventing the corresponding quasi-nonmetallic hole wall partition from contacting with copper deposition/electroplating liquid medicine.
2. The multi-stage plating resist structure according to claim 1, wherein the plating resist is made of a material having a coefficient of thermal expansion exceeding a preset threshold, and the hard inner tube is made of a material having a coefficient of thermal expansion lower than the preset threshold; and the axial two ends of the outer side wall of each second pipe wall partition of the hard inner pipe are respectively provided with a blocking structure for preventing the anti-plating layer from expanding along the axial direction of the through hole.
3. The multi-stage plating resist structure of claim 1, wherein the plating resist layer is a dry film layer.
4. The multi-stage plating resist structure of claim 3, wherein the thickness of the dry film layer is 100-500 um.
5. The multi-stage plating resist structure according to claim 1, wherein the surface of the hard inner tube other than the surface coated with the plating resist layer is coated with a non-polar material.
6. A method for manufacturing a through hole with a multilayer network is characterized by comprising the following steps:
drilling a through hole on the printed circuit board, wherein the hole wall of the through hole is divided into a pseudo-metallization hole wall subarea and a pseudo-non-metallization hole wall subarea which are distributed in a cross mode along the axial direction or the radial direction of the through hole, and the number of the pseudo-metallization hole wall subareas is multiple;
plugging the multi-stage plating-proof structure of claim 1 into the through hole, so that the outer side wall of each plating-proof layer is respectively attached to the corresponding quasi-nonmetallic hole wall partition;
and carrying out copper deposition electroplating on the through hole plugged into the multi-stage anti-plating structure so as to form an electroplated layer on the surface of each pseudo-metallized hole wall subarea of the through hole.
7. The method for manufacturing a through hole with a multilayer network according to claim 6, wherein the plating-proof layer is made of a material with a thermal expansion coefficient exceeding a preset threshold, and the hard inner tube is made of a material with a thermal expansion coefficient lower than the preset threshold; and the axial two ends of the outer side wall of each second pipe wall partition of the hard inner pipe are respectively provided with a blocking structure for preventing the anti-plating layer from expanding along the axial direction of the through hole;
the through hole manufacturing method further comprises the following steps: and after the multi-stage plating-proof structure is plugged into the through hole, the multi-stage plating-proof structure is heated, so that the plating-proof layer radially expands along the through hole to be attached to the corresponding quasi-nonmetallic hole wall partition in an increasing manner.
8. The method for forming a via having a multilayer network according to claim 6, wherein the plating resist layer is a dry film layer;
the through hole manufacturing method further comprises the following steps: and after the copper deposition electroplating is finished, dissolving and removing the dry film layer until the multi-stage plating-proof structure is separated from the through hole and then automatically falls off.
9. The method of claim 8, wherein the dry film layer is removed by dissolving with 5% NaOH solution.
10. A PCB comprising a via having a multilayer network, wherein the via is made according to the via making method having a multilayer network of any one of claims 6 to 9.
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