CN114340159A - PCB preparation method and PCB - Google Patents
PCB preparation method and PCB Download PDFInfo
- Publication number
- CN114340159A CN114340159A CN202111529675.1A CN202111529675A CN114340159A CN 114340159 A CN114340159 A CN 114340159A CN 202111529675 A CN202111529675 A CN 202111529675A CN 114340159 A CN114340159 A CN 114340159A
- Authority
- CN
- China
- Prior art keywords
- conductive layer
- water
- board
- core
- absorbent resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 117
- 239000011347 resin Substances 0.000 claims abstract description 117
- 239000002250 absorbent Substances 0.000 claims abstract description 93
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 58
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 21
- 238000005553 drilling Methods 0.000 claims abstract description 18
- 238000000151 deposition Methods 0.000 claims abstract description 15
- 238000003825 pressing Methods 0.000 claims abstract description 15
- 238000001035 drying Methods 0.000 claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 21
- 238000005530 etching Methods 0.000 claims description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 10
- 239000012670 alkaline solution Substances 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 7
- 238000000608 laser ablation Methods 0.000 claims description 6
- 230000008021 deposition Effects 0.000 abstract description 8
- 239000000126 substance Substances 0.000 abstract description 6
- 238000010030 laminating Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 108
- 230000002745 absorbent Effects 0.000 description 43
- 230000006835 compression Effects 0.000 description 10
- 238000007906 compression Methods 0.000 description 10
- 239000000243 solution Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010981 drying operation Methods 0.000 description 3
- 239000000017 hydrogel Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000011093 chipboard Substances 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Abstract
The invention discloses a PCB preparation method and a PCB, wherein the PCB preparation method comprises the steps of attaching first water-absorbing resin to a corresponding pre-opening area of a first core plate; laminating the first core board and the second core board after stacking to form a multilayer board, wherein the first water-absorbent resin is positioned between the first core board and the second core board; drilling holes in the corresponding pre-opening area of the multilayer board to form through holes; carrying out chemical copper deposition on the multilayer board to enable the first water-absorbing resin to absorb water, and depositing a conductive layer on the inner wall of the through hole; drying the multilayer board to enable the first water-absorbent resin to expand in volume and protrude out of the inner wall surface of the through hole; and disconnecting the conductive layer positioned on the first core board from the conductive layer positioned on the second core board. The technical scheme of the invention solves the problems of multiple pressing plates and multiple drilling of the PCB.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a PCB and a preparation method thereof.
Background
The double-sided compression joint circuit board has the effect of improving the wiring density of compression joint devices, and obviously improves the number of the devices so as to achieve the effect of increasing the signal transmission capacity, so that the double-sided compression joint circuit board becomes a typical circuit board with the effect of increasing the effect. In the related art, the main manufacturing process of the double-sided compression circuit board comprises double-sided compression with big and small holes and blind compression with N + N double sides. The large-hole and small-hole double-face pressing method needs drilling for multiple times, the N + N double-face blind pressing method needs pressing for multiple times, and the manufacturing process is complex.
Disclosure of Invention
The invention mainly aims to provide a PCB preparation method and a PCB, and aims to solve the problems of repeated pressing and repeated drilling.
In order to achieve the above purpose, the method for preparing the PCB provided by the present invention comprises the following steps:
attaching first water-absorbing resin to the corresponding pre-opening area of the first core plate;
laminating the first core board and the second core board after stacking to form a multilayer board, wherein the first water-absorbent resin is positioned between the first core board and the second core board;
drilling holes in the corresponding pre-opening area of the multilayer board to form through holes;
carrying out chemical copper deposition on the multilayer board to enable the first water-absorbing resin to absorb water, and depositing a conductive layer on the inner wall of the through hole;
drying the multilayer board to enable the first water-absorbent resin to expand in volume and protrude out of the inner wall surface of the through hole;
and disconnecting the conductive layer positioned on the first core board from the conductive layer positioned on the second core board.
In an embodiment, the step of disconnecting the conductive layer on the first core board from the conductive layer on the second core board specifically includes the following steps: and laser ablating the conductive layer positioned on the first water-absorbing resin and/or the first water-absorbing resin protruding out of the inner wall of the through hole so as to disconnect the conductive layer positioned on the first core plate and the conductive layer positioned on the second core plate.
In an embodiment, the step of disconnecting the conductive layer located in the first core board from the conductive layer located in the second core board specifically includes the following steps: and cleaning the through hole by using an alkaline solution to remove the first water-absorbing resin, so that the conductive layer positioned on the first core plate is separated from the conductive layer positioned on the second core plate.
In an embodiment, the step of disconnecting the conductive layer located in the first core board from the conductive layer located in the second core board specifically includes the following steps: laser ablation is carried out on the conductive layer of the first water-absorbing resin and/or the first water-absorbing resin protruding out of the inner wall of the through hole; and cleaning the through hole by adopting an alkaline solution to remove the first water-absorbing resin.
In one embodiment, before the step of forming the multilayer board, the method further comprises the following steps: and attaching a second water-absorbent resin to the corresponding pre-opening area of the second core plate.
In an embodiment, the step of forming the multilayer board specifically includes the following steps: and clamping a third core plate between the first core plate and the second core plate, stacking and pressing to form the multilayer plate, wherein the first water-absorbent resin and the second water-absorbent resin face the third core plate.
In an embodiment, after the step of disconnecting the conductive layer of the first core board from the conductive layer of the second core board, the method further includes the following steps: and etching the multilayer board, and removing the conducting layer positioned on the third chip board.
In one embodiment, the method further comprises, before etching the multilayer board, the steps of: plating copper and/or tin on the inner wall of the through hole, the surfaces of the first core plate and the second core plate.
In one embodiment, after etching the multilayer board, the method further comprises the following steps: and removing the tin layer of the multilayer board.
The invention also provides a PCB which is prepared by adopting the preparation method of the PCB; the preparation method of the PCB comprises the following steps:
attaching first water-absorbing resin to the corresponding pre-opening area of the first core plate;
laminating the first core board and the second core board after stacking to form a multilayer board, wherein the first water-absorbent resin is positioned between the first core board and the second core board;
drilling holes in the corresponding pre-opening area of the multilayer board to form through holes;
carrying out chemical copper deposition on the multilayer board to enable the first water-absorbing resin to absorb water, and depositing a conductive layer on the inner wall of the through hole;
drying the multilayer board to enable the first water-absorbent resin to expand in volume and protrude out of the inner wall surface of the through hole;
and disconnecting the conductive layer positioned on the first core board from the conductive layer positioned on the second core board.
According to the technical scheme, the first water-absorbent resin is arranged in the pre-opening area of the first core plate, and then the first water-absorbent resin is positioned between the first core plate and the second core plate and is pressed to form the multilayer plate; drilling a hole at the position of the pre-opening hole to form a through hole, so that the first water-absorbing resin is exposed on the inner wall surface of the through hole; and then, chemically depositing copper, forming a conductive layer on the inner wall surface of the through hole, simultaneously absorbing water by the first water-absorbing resin, generating water vapor by the first water-absorbing resin through board drying operation, expanding the volume of the water vapor and protruding out of the inner wall surface of the through hole, and finally disconnecting the conductive layer positioned on the first core board from the conductive layer positioned on the second core board, so that the first core board and the second core board are mutually independent to obtain the double-sided compression joint circuit board.
The preparation method of the PCB is simple, short in flow, not too large in overall thickness, only needs one-time pressing and one-time drilling, does not need multiple pressing or multiple drilling, improves the production efficiency of the PCB, is high in hole site precision, is not limited in aperture size, completely meets the requirement of double-sided different network compression joint, and is suitable for large-scale production of the PCB.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a flow chart of one embodiment of a PCB manufacturing method of the present invention;
FIG. 2 is a schematic structural view of an embodiment of a first core sheet and a first water-absorbent resin according to the present invention;
FIG. 3 is a schematic diagram of the structure of a multilayer sheet of the present invention according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of the structure of a multi-layer board of the present invention after drilling;
FIG. 5 is a schematic structural diagram of a multi-layer board of the present invention after copper deposition;
FIG. 6 is a schematic view of a construction of a subsequent embodiment of the multi-panel board of the present invention;
FIG. 7 is a schematic structural view of an embodiment of the present invention after removing the first water-absorbent resin and the second water-absorbent resin protruding from the cell walls;
FIG. 8 is a schematic structural view of an embodiment of the present invention after removing the water-absorbent resin from the multi-layer sheet;
FIG. 9 is a schematic structural view of an embodiment of the multi-layer board of the present invention after being tinned;
FIG. 10 is a schematic structural view of a multilayer board according to an embodiment of the present invention after etching;
FIG. 11 is a schematic structural diagram of a multilayer board of the present invention after the tin layer is removed.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) | |
| 10 | Multilayer board | 130 | |
|
| 10a | Through |
210 | First Water- |
|
| | Void hole | 220 | Second Water-absorbent resin | |
| 110 | |
300 | Conductive layer | |
| 120 | |
400 | Tin layer |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if appearing throughout the text, "and/or" is meant to include three juxtaposed aspects, taking "A and/or B" as an example, including either the A aspect, or the B aspect, or both A and B satisfied aspects. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a preparation method of a PCB.
Fig. 1 is a flow chart of a PCB manufacturing method of the present invention, and fig. 2 to 11 are schematic structural views of the PCB manufacturing process of the present invention in sequence.
In an embodiment of the present invention, referring to fig. 1, the method for manufacturing the PCB includes the following steps:
s100, attaching first water-absorbing resin 210 to the corresponding pre-opening area of the first core plate 110;
s200, stacking the first core board 110 and the second core board 120, and then pressing to form the multilayer board 10, wherein the first water-absorbent resin 210 is positioned between the first core board 110 and the second core board 120;
s300, drilling holes in the corresponding pre-opening area of the multilayer board 10 to form a through hole 10 a;
s400, carrying out chemical copper deposition on the multilayer board 10 to enable the first water-absorbent resin 210 to absorb water, and depositing a conductive layer 300 on the inner wall of the through hole 10 a;
s500, drying the multilayer board 10 to enable the first water-absorbent resin 210 to expand in volume and protrude out of the inner wall surface of the through hole 10 a;
s600, the conductive layer 300 on the first core board 110 is separated from the conductive layer 300 on the second core board 120.
Specifically, the method for manufacturing the first core board 110 may include: the first core plate 110 may be manufactured by using the method for manufacturing a PCB in the prior art, as well as the process steps of inner layer manufacturing, drilling, desmearing, copper deposition, electroplating, hole plugging, micro etching, and the like. That is, the inside of the first core board 110 may also form a circuit. Referring to fig. 2, a metal pattern layer may be disposed on the first core board 110 by means of dry film pasting, exposure and development, etching, film stripping, etc., and the metal pattern layer is disposed on one surface of the first core board 110, or both surfaces of the first core board 110 may be disposed with metal pattern layers. It is understood that the metal pattern layer may be a simple metal pattern layer or a composite metal pattern layer. It is conceivable by those skilled in the art that the structure of the second core plate 120 may be set with reference to the structure of the first core plate 110, or the structures of the first core plate 110 and the second core plate 120 may be different from each other.
According to the position of the invalid hole 10b and the aperture of the invalid hole 10b, the attaching position and the size of the first water-absorbing resin 210 are set, namely the invalid hole 10b is formed at the position where the first water-absorbing resin 210 is arranged, so that the position of the invalid hole 10b does not need to be drilled, the hole position precision is high, the aperture size is not limited, the manufacturing precision of the invalid hole 10b is high, and the processing requirement of a product can be met. Referring to fig. 2, the first water absorbent resin 210 is attached to the first core plate 110 in a corresponding pre-opening area, and the first water absorbent resin 210 is attached to the first core plate 110 in various ways, in one embodiment, the first water absorbent resin 210 is silk-screened on the first core plate 110.
Referring to fig. 3, in step S200, the second core board 120 is placed on the first core board 110, and the water-absorbent resin faces the second core board 120, and the second core board 120 is stacked and pressed to form the multi-layer board 10. One or both of the first core board 110 and the second core board 120 may be a multilayer board 10, and the multilayer board 10 formed by pressing may only include the first core board 110 and the second core board 120, or may include other core boards, and the core board may be located between the first core board 110 and the second core board 120, or located on a side of the first core board 110 away from the second core board 120.
Referring to fig. 4, a drilling operation is performed on the multilayer board 10, and a through hole 10a is formed in a pre-opened area of the multilayer board 10 according to the position and size of the opening. The through-hole 10a penetrates the first water absorbent resin 210 so that the first water absorbent resin 210 is exposed on the hole wall surface of the through-hole 10a so that the first water absorbent resin 210 can come into contact with the liquid so that the first water absorbent resin 210 can absorb the liquid.
Referring to fig. 5, after the drilling operation is completed, the multilayer board 10 is subjected to a chemical copper deposition operation, the multilayer board 10 is immersed in a copper deposition chemical solution, water contacts the first water absorbent resin 210 through the through holes 10a and is adsorbed by the first water absorbent resin 210, and the first water absorbent resin 210 sufficiently adsorbs liquid. Meanwhile, the conductive layer 300 is deposited on the hole wall surface of the via hole 10 a. The thickness of the conductive layer 300 is relatively small and may be 0.3 to 0.5 microns.
In step S500, referring to fig. 6, the multi-layer board 10 is heated at a high temperature by the baking plate, and the moisture absorbed by the first water-absorbent resin 210 is evaporated by heating, so that the first water-absorbent resin 210 is fluffy and expands into the through hole 10a, so that the conductive layer 300 is cracked, thereby facilitating the subsequent disconnection operation of the conductive layer 300. The conductive layer 300 of the cracked portion is an incomplete copper layer, exposing a portion of the first water absorbent resin 210.
The temperature of the drying plate is only required to be higher than the evaporation temperature of water, and can be 100-125 ℃, and the drying time is 10-20 minutes. In one embodiment, the drying temperature of the multi-layer sheet 10 is 110 ℃ and the drying time is 15 minutes, so that the volume expansion of the first water-absorbent resin 210 is realized, the energy consumption is reduced, and the production cost is reduced.
The material of the first water absorbent resin 210 can be varied, and in one embodiment, the first water absorbent resin 210 comprises hydrogel which swells when heated, and expands in volume and protrudes from the wall surface of the through hole 10a when heated. The hydrogel may be of various types, and in one embodiment, the hydrogel may include one or both of sodium polyacrylate and polyacrylamide. The first water-absorbent resin 210 may be another polymer resin that expands when heated, as long as it expands in volume when heated after absorbing water.
In order to realize the mutual independence between the first core board 110 and the second core board 120, the two are not conductive, please refer to fig. 7, the conductive layer 300 located in the first core board 110 is disconnected from the conductive layer 300 located in the second core board 120, so that the conductive layer 300 is not connected, so as to prevent the conductive layer 300 located in the first core board 110 and the conductive layer 300 located in the second core board 120 from being connected and not conductive, thereby realizing the mutual independence between the first core board 110 and the second core board 120.
According to the technical scheme, the first water-absorbent resin 210 is arranged in the pre-opening area of the first core plate 110, and then the first water-absorbent resin 210 is positioned between the first core plate 110 and the second core plate 120 and is pressed to form the multilayer plate 10; drilling a through hole 10a at the pre-hole position so that the first water absorbent resin 210 is exposed on the inner wall surface of the through hole 10 a; and then, chemically depositing copper, forming a conductive layer 300 on the inner wall surface of the through hole 10a, simultaneously absorbing water by the first water-absorbing resin 210, generating water vapor by the first water-absorbing resin 210 through plate drying operation, expanding the volume of the water vapor and protruding out of the inner wall surface of the through hole 10a, and finally disconnecting the conductive layer 300 positioned on the first core plate 110 from the conductive layer 300 positioned on the second core plate 120, so that the first core plate 110 and the second core plate 120 are mutually independent, and the double-sided compression joint circuit board is obtained.
The preparation method of the PCB is simple, short in flow, not too large in overall thickness, only needs one-time pressing and one-time drilling, does not need multiple pressing or multiple drilling, improves the production efficiency of the PCB, is high in hole site precision, is not limited in aperture size, completely meets the requirement of double-sided different network compression joint, and is suitable for large-scale production of the PCB.
Referring to fig. 6 and 7, in an embodiment, the step of separating the conductive layer 300 located on the first core board 110 from the conductive layer 300 located on the second core board 120 includes the following steps:
the conductive layer 300 of the first water absorbent resin 210 and/or the first water absorbent resin 210 protruding from the inner wall of the through hole 10a are laser-ablated to separate the conductive layer 300 of the first core board 110 from the conductive layer 300 of the second core board 120.
The S600 step removes the conductive layer 300 on the first water absorbent resin 210 by means of laser ablation, so that the conductive layer 300 on the first core plate 110 is disconnected from the conductive layer 300 on the second core plate 120. Or, the first water absorbent resin 210 protruding from the inner wall of the through hole 10a is removed, so that the conductive layer 300 located in the first water absorbent resin 210 is removed, and the conductive layer 300 located in the first core board 110 is disconnected from the conductive layer 300 located in the second core board 120.
Unlike the previous embodiment, referring to fig. 6 and fig. 8, in an embodiment, the step of separating the conductive layer 300 located in the first core board 110 from the conductive layer 300 located in the second core board 120 specifically includes the following steps:
the through hole 10a is cleaned with an alkaline solution to remove the first water absorbent resin 210, so that the conductive layer 300 on the first core plate 110 is disconnected from the conductive layer 300 on the second core plate 120.
Since the first water absorbent resin 210 expands after baking the board and protrudes into the through hole 10a, the conductive layer 300 is cracked, the cracked portion of the conductive layer 300 is an incomplete copper layer, and a portion of the first water absorbent resin 210 is exposed. Thus, the first water absorbent resin 210 on the multilayer board 10 is washed away by the alkaline solution immersion cleaning, so that the conductive layer 300 on the first water absorbent resin 210 loses its adhesion to the main body and falls, thereby achieving the disconnection between the conductive layer 300 on the first core board 110 and the conductive layer 300 on the second core board 120, that is, the disconnection between the upper and lower conductive layers 300.
Referring to fig. 6 to 8, in an embodiment, the step of separating the conductive layer 300 of the first core board 110 from the conductive layer 300 of the second core board 120 includes the following steps:
laser ablation of the conductive layer 300 on the first water absorbent resin 210 and/or the first water absorbent resin 210 protruding from the inner wall of the through hole 10 a;
and cleaning the through hole 10a by using an alkaline solution to remove the first water absorbent resin 210.
The conductive layer 300 on the first water absorbent resin 210 is removed by means of laser ablation and alkali cleaning, and the conductive layer 300 on the first core plate 110 is disconnected from the conductive layer 300 on the second core plate 120. The conductive layer 300 on the first water absorbent resin 210 or the first water absorbent resin 210 protruding from the inner wall of the through hole 10a may be removed by laser ablation, and then the first water absorbent resin 210 may be washed away, so that the first water absorbent resin 210 is completely removed to expose the dummy holes 10 b.
The multilayer sheet 10 may be provided with one water-absorbent resin or a plurality of water-absorbent resins. Referring to fig. 3, in an embodiment, before the step of forming the multilayer board 10, the method further includes the following steps:
and a second water-absorbent resin 220 is attached to the corresponding pre-perforated area of the second core plate 120.
The second water-absorbent resin 220 forms another ineffective hole 10b, the second water-absorbent resin 220 and the first water-absorbent resin 210 are arranged at intervals in the thickness direction of the multi-time plate, and the size of the second water-absorbent resin 220 may be the same as or different from that of the first water-absorbent resin 210, and may be specifically set according to actual conditions. The second water-absorbent resin 220 is located between the first core plate 110 and the second core plate 120, and the second water-absorbent resin 220 increases the distance between the first core plate 110 and the second core plate 120 in the vertical direction, thereby further preventing the first core plate 110 and the second core plate 120 from conducting electricity.
Further, referring to fig. 1 and 3, in an embodiment, the step of forming the multilayer board 10 specifically includes the following steps:
and (3) clamping a third core plate 130 between the first core plate 110 and the second core plate 120, stacking, and pressing to form the multilayer plate 10, wherein the first water-absorbent resin 210 and the second water-absorbent resin 220 face the third core plate 130.
The third core plate 130 is located between the first water absorbent resin 210 and the second water absorbent resin 220, so that the first water absorbent resin 210 and the second water absorbent resin 220 are not directly laminated together, and the multilayer plate 10 is prevented from being tilted in a pre-opening area after being laminated, and the quality of the multilayer plate 10 is not affected.
Referring to fig. 4 to 5, in the electroless copper plating step, the first water absorbent resin 210 and the second water absorbent resin 220 both absorb water, and a conductive layer 300 is formed on the inner wall of the through hole 10 a. Referring to fig. 6, the first water absorbent resin 210 and the second water absorbent resin 220 are expanded in volume and protrude from the inner wall surface of the through-hole 10a during the drying operation. Similarly, referring to fig. 6 to 8, the conductive layer 300 of the second water absorbent resin 220 or the second water absorbent resin 220 protruding from the inner wall of the through hole 10a is laser-ablated; the alkaline solution washes away the second water absorbent resin 220 to expose the ineffective pores 10 b.
In the step of electroless copper plating, a conductive layer 300 is formed on the sidewall of the third core board 130, the conductive layer 300 located on the third core board 130 is a section of the non-effective hole 10b, and in order to avoid the non-effective hole 10b from being conductive with the upper and lower conductive layers 300, referring to fig. 10, in an embodiment, after the step of disconnecting the conductive layer 300 located on the first core board 110 from the conductive layer 300 located on the second core board 120, the method further includes the following steps:
the multilayer board 10 is etched to remove the conductive layer 300 on the third chip 130.
By means of etching, the conductive layer 300 on the third core board 130 is removed, thereby further preventing the first core board 110 and the second core board 120 from generating conductive interference, and realizing mutual independence of the first core board 110 and the second core board 120.
In order to avoid etching the first core board 110 and the second core board 120, referring to fig. 9 and 10, in an embodiment, before etching the multilayer board 10, the following steps are further included:
the inner wall of the through-hole 10a, the surfaces of the first core plate 110 and the second core plate 120 are plated with copper and/or tin.
Since the conductive layer 300 of the third core board 130 is not in conduction with the conductive layer 300 of the first core board 110 and the conductive layer 300 of the second core board 120, copper plating and tin plating cannot be performed, so that copper plating and/or tin plating is performed on the inner walls of the through holes 10a and the surfaces of the first core board 110 and the second core board 120. The etching protective layer is formed by tin plating so that the conductive layer 300 located at the third chip 130 is completely etched away at the time of the etching operation.
After removing the conductive layer 300 on the third chip board 130, the etching protection layer may be removed or may not be removed. Referring to fig. 10 and 11, in an embodiment, after etching the multilayer board 10, the method further includes the following steps:
the tin layer 400 (etching protection layer) of the multilayer board 10 is removed.
The conductive layer 300 on the inner wall of the through hole 10a, the copper layers of the first core board 110 and the second core board 120 are exposed by removing the protective tin layer 400, so as to facilitate the subsequent normal process.
It should be noted that, according to actual product requirements, the multilayer board 10 may further include a fourth core board, a fifth core board, a sixth core board, and so on, and a third resin is provided on the fourth core board and a fourth resin is provided on the sixth core board, so that a plurality of dummy holes 10b are formed in the multilayer board 10.
The invention also provides a PCB which is prepared by adopting the preparation method of the PCB. The specific method for preparing the PCB refers to the above embodiments, and since the PCB adopts all technical solutions of all the above embodiments, the PCB at least has all the beneficial effects brought by the technical solutions of the above embodiments, and details are not repeated herein. Wherein, this PCB is two-sided crimping circuit board.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A preparation method of a PCB is characterized by comprising the following steps:
attaching a first water-absorbent resin (210) to the first core plate (110) corresponding to the pre-perforated area;
stacking the first core plate (110) and the second core plate (120) and then pressing to form the multilayer plate (10), wherein the first water-absorbent resin (210) is positioned between the first core plate (110) and the second core plate (120);
drilling holes in the corresponding pre-hole areas of the multilayer board (10) to form through holes (10 a);
performing electroless copper plating on the multilayer board (10) to make the first water-absorbent resin (210) absorb water, and depositing a conductive layer (300) on the inner wall of the through hole (10 a);
drying the multilayer board (10) to make the first water-absorbent resin (210) expand in volume and protrude out of the inner wall surface of the through hole (10 a);
the conductive layer (300) located on the first core board (110) is disconnected from the conductive layer (300) located on the second core board (120).
2. The method for manufacturing a PCB according to claim 1, wherein the step of disconnecting the conductive layer (300) located on the first core board (110) from the conductive layer (300) located on the second core board (120) comprises the following steps:
and laser ablating the conductive layer (300) positioned on the first water-absorbing resin (210) and/or the first water-absorbing resin (210) protruding out of the inner wall of the through hole (10a) to disconnect the conductive layer (300) positioned on the first core plate (110) from the conductive layer (300) positioned on the second core plate (120).
3. The method for manufacturing a PCB according to claim 1, wherein the step of disconnecting the conductive layer (300) of the first core board (110) from the conductive layer (300) of the second core board (120) comprises the steps of:
and cleaning the through hole (10a) by using an alkaline solution to remove the first water-absorbent resin (210) so as to disconnect the conductive layer (300) positioned on the first core plate (110) from the conductive layer (300) positioned on the second core plate (120).
4. The method for manufacturing a PCB according to claim 1, wherein the step of disconnecting the conductive layer (300) of the first core board (110) from the conductive layer (300) of the second core board (120) comprises the steps of:
laser ablation of the conductive layer (300) on the first water-absorbent resin (210) and/or the first water-absorbent resin (210) protruding from the inner wall of the through-hole (10 a);
and cleaning the through hole (10a) by using an alkaline solution to remove the first water-absorbent resin (210).
5. A method of manufacturing a PCB according to any of claims 1 to 4 further comprising, before the step of forming the multilayer board (10), the steps of:
and attaching a second water-absorbent resin (220) to the corresponding pre-perforated area of the second core plate (120).
6. The method for manufacturing a PCB according to claim 5, wherein the step of forming the multilayer board (10) comprises in particular the steps of:
and clamping a third core plate (130) between the first core plate (110) and the second core plate (120), stacking and pressing to form the multilayer plate (10), wherein the first water-absorbent resin (210) and the second water-absorbent resin (220) face the third core plate (130).
7. The method for manufacturing a PCB according to claim 6, wherein the step of separating the conductive layer (300) of the first core board (110) from the conductive layer (300) of the second core board (120) further comprises the steps of:
and etching the multilayer board (10) to remove the conductive layer (300) on the third chip (130).
8. The method for manufacturing a PCB according to claim 7, wherein before the etching of the multilayer board (10), further comprising the steps of:
plating copper and/or tin on the inner wall of the through-hole (10a), the surfaces of the first core board (110) and the second core board (120).
9. The method for manufacturing a PCB according to claim 8, further comprising the following steps after etching the multilayer board (10):
removing the tin layer (400) of the multilayer sheet (10).
10. A PCB manufactured by the method of manufacturing a PCB according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111529675.1A CN114340159A (en) | 2021-12-14 | 2021-12-14 | PCB preparation method and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111529675.1A CN114340159A (en) | 2021-12-14 | 2021-12-14 | PCB preparation method and PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114340159A true CN114340159A (en) | 2022-04-12 |
Family
ID=81049913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111529675.1A Pending CN114340159A (en) | 2021-12-14 | 2021-12-14 | PCB preparation method and PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114340159A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06232559A (en) * | 1993-02-08 | 1994-08-19 | Hitachi Chem Co Ltd | Multilayer printed wiring board and manufacture thereof |
| TW201221000A (en) * | 2010-05-19 | 2012-05-16 | Panasonic Elec Works Co Ltd | Wiring method, construction being wired on the surface thereof, semiconductor device, printed circuit board, memory card, electrical device, module, and multi-layered circuit board |
| CN108012417A (en) * | 2018-01-11 | 2018-05-08 | 广合科技（广州）有限公司 | Prevent the separated pcb board of hole wall and its processing technology |
| CN108901146A (en) * | 2018-08-10 | 2018-11-27 | 重庆方正高密电子有限公司 | Circuit board and its selective electroplating technique, manufacture craft |
-
2021
- 2021-12-14 CN CN202111529675.1A patent/CN114340159A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06232559A (en) * | 1993-02-08 | 1994-08-19 | Hitachi Chem Co Ltd | Multilayer printed wiring board and manufacture thereof |
| TW201221000A (en) * | 2010-05-19 | 2012-05-16 | Panasonic Elec Works Co Ltd | Wiring method, construction being wired on the surface thereof, semiconductor device, printed circuit board, memory card, electrical device, module, and multi-layered circuit board |
| CN108012417A (en) * | 2018-01-11 | 2018-05-08 | 广合科技（广州）有限公司 | Prevent the separated pcb board of hole wall and its processing technology |
| CN108901146A (en) * | 2018-08-10 | 2018-11-27 | 重庆方正高密电子有限公司 | Circuit board and its selective electroplating technique, manufacture craft |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3319317A (en) | Method of making a multilayered laminated circuit board | |
| CN110312380B (en) | Manufacturing and production method of multilayer insulated isolation circuit board with side metallized edges | |
| TWI454191B (en) | Flexible circuit board and method for manufacturing same | |
| JP4760506B2 (en) | Manufacturing method of double-sided wiring board | |
| CN109890149B (en) | Manufacturing method of double-sided compression-joint PCB and PCB | |
| CN114222445B (en) | Circuit board manufacturing method and circuit board | |
| CN114040580A (en) | Manufacturing method of universal blind slot plate | |
| WO2023109051A1 (en) | Method for preparing pcb, and pcb | |
| CN114340159A (en) | PCB preparation method and PCB | |
| CN109862719B (en) | PCB manufacturing method for realizing one-hole multi-network and PCB | |
| CN115843155A (en) | PCB manufacturing method | |
| CN114206025B (en) | PCB preparation method and PCB | |
| CN114364144A (en) | Preparation method of PCB | |
| CN216122994U (en) | Circuit board and motor controller | |
| CN214413126U (en) | Circuit board | |
| CN103635006A (en) | Circuit board and manufacturing method thereof | |
| CN112672545A (en) | Method for manufacturing multilayer circuit board | |
| CN114007343B (en) | Printed circuit board electro-thick gold, printed circuit board and manufacturing method thereof | |
| CN114340224A (en) | PCB preparation method and PCB | |
| TWI830644B (en) | Flexible circuit board and preparation method thereof | |
| CN114269074A (en) | Circuit board and preparation method thereof | |
| TWI768761B (en) | Method for optimizing hole filling and making fine lines on printed circuit boards | |
| WO2024055259A1 (en) | Circuit board connection structure and manufacturing method therefor | |
| CN114340214A (en) | PCB manufacturing method and PCB | |
| JPH06302959A (en) | Manufacture of multilayer printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |