CN117956704A - Method for controlling high-frequency microwave printed board to produce expansion and contraction - Google Patents
Method for controlling high-frequency microwave printed board to produce expansion and contraction Download PDFInfo
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- CN117956704A CN117956704A CN202311710391.1A CN202311710391A CN117956704A CN 117956704 A CN117956704 A CN 117956704A CN 202311710391 A CN202311710391 A CN 202311710391A CN 117956704 A CN117956704 A CN 117956704A
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- plate
- contraction
- frequency microwave
- controlling
- printed board
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 230000008602 contraction Effects 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 claims abstract description 28
- 238000009713 electroplating Methods 0.000 claims abstract description 15
- 238000005553 drilling Methods 0.000 claims abstract description 14
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 7
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 28
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 238000011282 treatment Methods 0.000 claims description 12
- 238000005137 deposition process Methods 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 6
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 5
- 230000014759 maintenance of location Effects 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 claims 1
- 238000011161 development Methods 0.000 abstract description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 abstract description 2
- 230000008961 swelling Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 235000012907 honey Nutrition 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001595 contractor effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to a method for controlling the production expansion and contraction of a high-frequency microwave printed board, which comprises the following specific steps: s1, cutting an original material into a set size to obtain single sheets, and stacking one or more layers of single sheets to form a multi-layer plate; s2, drilling holes in the stacked plates; s3, electroplating the plate with the drilled holes; s4, performing resistance welding on the electroplated plate to finish expansion and contraction control production of the plate. Compared with the prior art, the invention mainly aims at PCB production controlled by PTFE sheet expansion and contraction, ensures simplification of production operation, has qualified and reliable product quality, forms standardized operation guidance and operation tools, and accords with the development trend of modern PCBs.
Description
Technical Field
The invention relates to the technical field of electronic components, in particular to a method for controlling the production expansion and contraction of a high-frequency microwave printed board.
Background
Microstrip lines are microstrip lines that consist of a single conductor strip supported on a dielectric substrate. The method is suitable for manufacturing the planar structure transmission line of the microwave integrated circuit board. Compared with the metal waveguide, the metal waveguide has the advantages of small volume, light weight, wide use frequency, high reliability, low manufacturing cost and the like; but with slightly larger losses and less power capacity.
The dielectric substrate is made of a material with high dielectric constant and low microwave loss, and the conductor has the characteristics of high conductivity, good stability, strong adhesion with the substrate and the like. The characteristics of the plastic are closely related to the line width, the flatness and the dimensional tolerance of a printed circuit board, particularly, the board is a special board, and the plastic has very great challenges to the microwave sheet resin plugging and grinding process due to the characteristics of thinner board and softer material, and the expansion coefficient of the plastic is easily influenced by external force, so that the board is deformed due to extrusion, high-temperature baking and grinding in the plugging process, and the expansion coefficient is increased to cause offset, short circuit and other rejection.
Disclosure of Invention
The invention aims to provide a method for controlling the production expansion and contraction of a high-frequency microwave printed board. The processing control method is mainly aimed at PCB production controlled by expansion and contraction of PTFE plates, ensures simplification of production operation, is qualified and reliable in product quality, forms standardized operation guidance and operation tools, and accords with the development trend of modern PCBs.
The aim of the invention can be achieved by the following technical scheme:
a method for controlling the production expansion and contraction of a high-frequency microwave printed board comprises the following specific steps:
S1, cutting an original material into a set size to obtain single sheets, and stacking one or more layers of single sheets to form a multi-layer plate;
S2, drilling holes in the stacked plates;
s3, electroplating the plate with the drilled holes;
s4, performing resistance welding on the electroplated plate to finish expansion and contraction control production of the plate.
Further, in step S1, the thickness of the single sheet is 0.25-0.30mm.
Further, in step S1, the raw material is a PTFE sheet.
Further, in step S2, during drilling, the plate is drilled by using a drilling machine, and after drilling is completed, a wind gun is used for blowing holes.
Further, in step S3, the electroplating treatment includes direct copper plating, frame-clamped copper plating, and dry film plating hole resin plugging after frame-clamped copper plating.
The specific steps of the direct copper plating are as follows: the surface of the plate is metallized by deposition processes such as evaporation, magnetron sputtering and the like, titanium is sputtered under vacuum, copper particles are then sputtered, electroplating is finally thickened, and then circuit manufacturing is completed by a common PCB process.
The method further comprises the following specific steps of: and (3) clamping the plate by adopting double-sided rivets, and then metallizing the surface of the plate by adopting deposition processes such as evaporation, magnetron sputtering and the like.
The specific steps of the hole plugging of the dry film plating hole resin after the copper plating of the frame are as follows: and (3) clamping the plate by adopting double-sided rivets, pasting dry films on the upper surface and the lower surface of the plate body, plugging holes by adopting resin, and baking and solidifying in sections.
Further to the above, the dry film types include Forst 2740, honey HD-240 or active LEF-215.
The film pressing temperature is 105-130 ℃, the film pressing pressure is 3-7kg/cm 2, and the retention time is 6-24h;
the method further comprises the specific steps of:
(1) After plugging, baking is carried out firstly, and then cooling is carried out;
(2) Grinding the mixture once by a ceramic brush;
(3) Then baking and curing at high temperature;
(4) And grinding the mixture once by using a ceramic brush to finish sectional baking and curing.
In the step (1), the baking is performed at 80 ℃ for 30min and then at 120 ℃ for 30min.
In the step (3), the high-temperature baking and curing is performed at 150 ℃ for 60min.
Further, in step S4, the solder resist specifically includes the steps of: pre-resist treatment, resist spray printing, resist pre-baking, exposure and resist curing.
The specific steps of the solder resist are as follows: the special jig is used in the pretreatment, the solder resist spray printing and the solder resist pre-baking processes, so that the deformation of the plate in the production process is effectively prevented, the solder resist pre-baking temperature is 70-80 ℃ and the time is 40-60min;
the exposure is carried out by using a regional solder mask laser LDI exposure, and the exposure parameter is 800-1200mj/11 grid;
The temperature of the solder resist solidification is 110-130 ℃ for 30-50min.
Compared with the prior art, the beneficial effects of the invention are as follows:
1. The invention further confirms the influence degree of different electroplating treatment modes on the residual lead by evaluating the swelling and shrinking influence of different electroplating treatment modes.
2. The invention evaluates the influence of the production expansion and shrinkage of PTFE plates and researches and provides an effective production method and a lead residual control solution.
3. The invention evaluates the influence of regional exposure on the expansion and contraction, and researches and provides an effective lead residual management and control scheme.
4. The invention provides the best operation parameters, namely the frame clamping copper plating is used for making the dry film plating hole resin plug hole, so that the problem of PTFE production is effectively solved, and the process capability is obviously improved.
Drawings
Fig. 1 is a schematic illustration of a borehole in an area of the present invention.
Reference numerals illustrate: c1, first hole, C2, second hole, C3, third hole, C4 and fourth hole.
Detailed Description
The invention will now be described in detail with reference to the drawings and specific examples. The present embodiment is implemented on the premise of the technical scheme of the present invention, and a detailed implementation manner and a specific operation process are given, but the protection scope of the present invention is not limited to the following examples.
Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The embodiments described below and features of the embodiments may be combined with each other without conflict.
Example 1
The embodiment provides a method for controlling the production expansion and contraction of a high-frequency microwave printed board, which comprises the following specific steps:
S1, cutting an original material into a set size to obtain single sheets, and stacking one or more layers of single sheets to form a multi-layer plate;
S2, drilling holes in the stacked plates;
s3, electroplating the plate with the drilled holes;
s4, performing resistance welding on the electroplated plate to finish expansion and contraction control production of the plate.
In this embodiment, in step S1, the thickness of the single sheet is 0.25-0.30mm.
In this embodiment, in step S1, the raw material is a PTFE sheet.
In this embodiment, in step S2, during drilling, a drilling machine is used to drill the plate, and after drilling is completed, an air gun is used to blow the hole.
In this embodiment, in step S3, the electroplating treatment includes direct copper plating, frame-clamped copper plating, and dry film plating hole resin plugging after frame-clamped copper plating.
In this embodiment, the specific steps of direct copper plating are: the surface of the plate is metallized by deposition processes such as evaporation, magnetron sputtering and the like, titanium is sputtered under vacuum, copper particles are then sputtered, electroplating is finally thickened, and then circuit manufacturing is completed by a common PCB process.
In this embodiment, the specific steps of the copper plating of the clamping frame are as follows: and (3) clamping the plate by adopting double-sided rivets, and then metallizing the surface of the plate by adopting deposition processes such as evaporation, magnetron sputtering and the like.
In this embodiment, the specific steps of hole plugging by the dry film plating resin after copper plating of the clamping frame are as follows: and (3) clamping the plate by adopting double-sided rivets, pasting dry films on the upper surface and the lower surface of the plate body, plugging holes by adopting resin, and baking and solidifying in sections.
In this embodiment, the dry film model includes Forst 2740, honey HD-240, or active LEF-215.
In the embodiment, the film pressing temperature is 105-130 ℃, the film pressing pressure is 3-7kg/cm 2, and the retention time is 6-24h;
In this embodiment, the specific steps of the sectional baking and curing are as follows:
(1) After plugging, baking is carried out firstly, and then cooling is carried out;
(2) Grinding the mixture once by a ceramic brush;
(3) Then baking and curing at high temperature;
(4) And grinding the mixture once by using a ceramic brush to finish sectional baking and curing.
In the step (1), the baking is performed at 80 ℃ for 30min and then at 120 ℃ for 30min.
In the step (3), the high-temperature baking and curing is performed at 150 ℃ for 60min.
In this embodiment, in step S4, the solder resist specifically includes the steps of: pre-resist treatment, resist spray printing, resist pre-baking, exposure and resist curing.
In this embodiment, the specific steps of the solder resist are as follows: the special jig is used in the pretreatment, the solder resist spray printing and the solder resist pre-baking processes, so that the deformation of the plate in the production process is effectively prevented, the solder resist pre-baking temperature is 70-80 ℃ and the time is 40-60min;
the exposure is carried out by using a regional solder mask laser LDI exposure, and the exposure parameter is 800-1200mj/11 grid;
The temperature of the solder resist solidification is 110-130 ℃ for 30-50min.
Example 2
Referring to fig. 1, in order to determine the significance of the influence of the electroplating treatment on the swelling factor, in this embodiment, different types of copper plating plug holes, influence of copper plating on swelling, influence of plug holes on swelling, and different types are selected for analysis; specifically as shown in table 1:
TABLE 1 influence of different electroplating treatments on the swelling and shrinkage of plates
The experimental results are shown in table 1, and it can be seen from the above different electroplating treatment modes that the significant effect of the expansion and contraction is that the expansion and contraction is the largest after the direct copper plating and hole plugging is polished, the expansion and contraction is performed after the copper plating and hole plugging of the clamping frame is polished, and the dry film plating hole resin hole plugging is performed after the copper plating of the clamping frame is optimized.
The expansion and contraction effects of the direct copper plating plug hole and the copper plating plug hole of the clamping frame are not great, the expansion and contraction of the resin plug hole of the dry film plating plug hole formed by the copper plating of the clamping frame can be controlled within 3mil, and the problems of the expansion and contraction of the resin plug hole of the high-frequency microwave printed board and the residual lead can be solved by adopting the electroplating treatment mode.
The previous description of the embodiments is provided to facilitate a person of ordinary skill in the art in order to make and use the present invention. It will be apparent to those skilled in the art that various modifications can be readily made to these embodiments and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above-described embodiments, and those skilled in the art, based on the present disclosure, should make improvements and modifications without departing from the scope of the present invention.
Claims (10)
1. A method for controlling the production expansion and contraction of a high-frequency microwave printed board is characterized by comprising the following specific steps:
S1, cutting an original material into a set size to obtain single sheets, and stacking one or more layers of single sheets to form a multi-layer plate;
S2, drilling holes in the stacked plates;
s3, electroplating the plate with the drilled holes;
s4, performing resistance welding on the electroplated plate to finish expansion and contraction control production of the plate.
2. The method for controlling the production of high-frequency microwave printed boards according to claim 1, wherein in the step S1, the thickness of the single sheet is 0.25-0.30mm.
3. The method for controlling expansion and contraction of a high-frequency microwave printed board according to claim 1, wherein in step S1, the raw material is a PTFE board.
4. The method for controlling the expansion and contraction of the high-frequency microwave printed board according to claim 1, wherein in the step S2, a drilling machine is used for drilling the board member during drilling, and an air gun is used for blowing holes after the drilling is completed.
5. The method for controlling the expansion and contraction of a high-frequency microwave printed board according to claim 1, wherein in the step S3, the electroplating treatment mode comprises direct copper plating, frame-clamping copper plating and frame-clamping copper plating, and then dry film plating hole resin plugging.
6. The method for controlling the production of the high-frequency microwave printed board to be expanded and contracted according to claim 5, wherein the specific steps of directly plating copper are as follows: and (5) carrying out plate surface metallization by using deposition processes such as evaporation, magnetron sputtering and the like.
7. The method for controlling the production of the high-frequency microwave printed board to be expanded and contracted according to claim 5, wherein the concrete steps of the copper plating of the clamping frame are as follows: and (3) clamping the plate by adopting double-sided rivets, and then metallizing the surface of the plate by adopting deposition processes such as evaporation, magnetron sputtering and the like.
8. The method for controlling the production of the high-frequency microwave printed board to expand and contract according to claim 5, wherein the concrete steps of making a dry film hole plating resin plug hole after the copper plating of the clamping frame are as follows: and (3) clamping the plate by adopting double-sided rivets, pasting dry films on the upper surface and the lower surface of the plate body, plugging holes by adopting resin, and baking and solidifying in sections.
9. The method for controlling the production of the high-frequency microwave printed board according to claim 8, wherein the dry film comprises the types of foster 2740, hong rui HD-240 or active LEF-215;
the film pressing temperature is 105-130 ℃, the film pressing pressure is 3-7kg/cm 2, and the retention time is 6-24h.
10. The method for controlling the expansion and contraction of a high-frequency microwave printed board according to claim 1, wherein in step S4, the solder resist specifically comprises the steps of: pre-resist treatment, resist spray printing, resist pre-baking, exposure and resist curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311710391.1A CN117956704A (en) | 2023-12-13 | 2023-12-13 | Method for controlling high-frequency microwave printed board to produce expansion and contraction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311710391.1A CN117956704A (en) | 2023-12-13 | 2023-12-13 | Method for controlling high-frequency microwave printed board to produce expansion and contraction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117956704A true CN117956704A (en) | 2024-04-30 |
Family
ID=90795406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311710391.1A Pending CN117956704A (en) | 2023-12-13 | 2023-12-13 | Method for controlling high-frequency microwave printed board to produce expansion and contraction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117956704A (en) |
-
2023
- 2023-12-13 CN CN202311710391.1A patent/CN117956704A/en active Pending
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