CN114887842A - Automatic glass paste scraping and coating equipment for diode processing - Google Patents
Automatic glass paste scraping and coating equipment for diode processing Download PDFInfo
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- CN114887842A CN114887842A CN202210356752.6A CN202210356752A CN114887842A CN 114887842 A CN114887842 A CN 114887842A CN 202210356752 A CN202210356752 A CN 202210356752A CN 114887842 A CN114887842 A CN 114887842A
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- 238000000576 coating method Methods 0.000 title claims abstract description 59
- 239000011248 coating agent Substances 0.000 title claims abstract description 57
- 239000011521 glass Substances 0.000 title claims abstract description 51
- 238000007790 scraping Methods 0.000 title claims abstract description 37
- 238000009434 installation Methods 0.000 claims abstract description 51
- 230000005540 biological transmission Effects 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims description 31
- 239000007788 liquid Substances 0.000 claims description 18
- 239000002002 slurry Substances 0.000 claims description 14
- 238000003754 machining Methods 0.000 claims description 7
- 230000001360 synchronised effect Effects 0.000 claims description 6
- 241000252254 Catostomidae Species 0.000 claims description 5
- 230000001154 acute effect Effects 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 48
- 229910052710 silicon Inorganic materials 0.000 abstract description 46
- 239000010703 silicon Substances 0.000 abstract description 46
- 230000007547 defect Effects 0.000 abstract description 18
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 35
- 238000010345 tape casting Methods 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
The invention relates to the technical field of diode production, in particular to automatic glass paste scraping and coating equipment for diode processing, which comprises a rack and a scraping and coating assembly, wherein the scraping and coating assembly comprises a linear driver, a telescopic rod and a scraper; the utility model discloses a processing control assembly, including the installation disc, first rotary driving subassembly, sucking disc and first rotary actuator, the rotatable installation in the frame of installation disc, first rotary driving subassembly fixed mounting is in the frame, first rotary driving subassembly's drive end is connected with the installation disc transmission, sucking disc and first rotary actuator are equipped with a plurality ofly and one-to-one, a plurality of sucking discs fixed mounting just its axis central symmetry installation about the installation disc on the installation disc, first rotary actuator fixed mounting is on the installation disc, first rotary actuator's drive end and sucking disc transmission are connected. The defect that the traditional automatic glass paste scraping and coating equipment can only process one silicon wafer at a time is overcome.
Description
Technical Field
The invention relates to the technical field of diode production, in particular to automatic glass paste scraping and coating equipment for diode processing.
Background
The diode is an electronic device made of semiconductor material and having unidirectional conductivity, and the diode has unidirectional conductivity, namely, when a forward voltage is applied to the anode of the diode, the diode is conducted. The diode needs to be coated with glass slurry in the manufacturing process, and the existing process adopts manual processing, but the manual processing efficiency is low, and the cost is high.
Therefore, chinese patent CN202122252202.3 discloses a scraping glass slurry device for diode production, which is characterized in that a scraping mechanism and a liquid pumping mechanism are arranged, so as to achieve glass slurry feeding on the diode, when a motor output shaft rotates, the glass slurry is pumped into a liquid pumping cylinder by piston reciprocating motion, and finally enters the diode through a liquid outlet pipe, so as to achieve glass slurry feeding, the sucker can be driven to rotate when the motor output shaft rotates, so that relative motion occurs between the diode and a first scraper, scraping of the glass slurry on the diode is achieved, an electric telescopic rod moves, so that the second scraper reciprocates, so that the scraping area is larger, and the scraping effect is better.
However, this application once only can process a silicon chip, and still need the manual work to go on going up unloading, and silicon chip mounted position only relies on the naked eye to judge to it is low excessively to cause the blade coating quality, and for this, it is higher to need a degree of automation, with the better automatic blade coating equipment of glass thick liquid of quality urgently.
Disclosure of Invention
In view of the above, there is a need to provide an automatic glass paste scraping device for diode processing, which is directed to the problems of the prior art.
In order to solve the problems of the prior art, the invention adopts the technical scheme that:
the glass paste automatic scraping and coating equipment for diode processing comprises a rack and a scraping and coating assembly, wherein the scraping and coating assembly comprises a linear driver, a telescopic rod and a scraper, the linear driver is fixedly arranged on the rack, the telescopic rod is fixedly connected with the driving end of the linear driver, and the scraper is fixedly arranged at the end part of the telescopic rod; the utility model discloses a processing control assembly, including the installation disc, first rotary driving subassembly, sucking disc and first rotary actuator, the rotatable installation in the frame of installation disc, first rotary driving subassembly fixed mounting is in the frame, first rotary driving subassembly's drive end is connected with the installation disc transmission, sucking disc and first rotary actuator are equipped with a plurality ofly and one-to-one, a plurality of sucking discs fixed mounting just its axis central symmetry installation about the installation disc on the installation disc, first rotary actuator fixed mounting is on the installation disc, first rotary actuator's drive end and sucking disc transmission are connected.
Preferably, the processing control assembly further comprises a clutch assembly, the clutch assembly comprises a second linear driver, a sleeve, a first rotating shaft, a matching key, an elastic part, a second rotating shaft and a groove, the second linear driver is fixedly installed on the rack, the first rotating shaft is rotatably installed on the rack, the first rotating shaft is provided with a first shaft body and a second shaft body, the two shaft bodies of the first rotating shaft are in sliding fit, the first shaft body is positioned above the second shaft body, the second shaft body is fixedly connected with the driving end of the first rotating driver, the sleeve is rotatably sleeved on the first shaft body of the first rotating shaft and fixedly connected with the driving end of the second linear driver, the matching key and the elastic part are provided with a plurality of matching keys in one-to-one correspondence, the matching keys are slidably installed in the first shaft body of the first rotating shaft, two ends of the elastic part are respectively fixedly connected with the matching key and the first shaft body of the first rotating shaft, the second rotation axis is rotatably installed on the installation disc, second rotation axis and sucking disc fixed connection, the recess be equipped with a plurality ofly and with cooperation key one-to-one, the recess is fixed to be set up on the second rotation axis.
Preferably, first rotary driving subassembly includes awl fluted disc, second rotary actuator and first bevel gear, and the awl fluted disc is fixed to be cup jointed on the installation disc, and second rotary actuator fixed mounting is in the frame, and the fixed cover of first bevel gear is served at the drive of second rotary actuator, and first bevel gear is connected with awl fluted disc transmission.
Preferably, this application still includes locating component, and locating component includes infrared emitter and light sensitive element, and infrared emitter fixed mounting is in the frame, light sensitive element be equipped with a plurality ofly and with the sucking disc one-to-one.
Preferably, this application still includes moves the material subassembly, moves the material subassembly and includes to move material robot and belt conveyor, moves material robot and belt conveyor and is equipped with two, moves material robot fixed mounting in the frame, belt conveyor and frame fixed connection.
Preferably, the frame includes the vibration subassembly, the vibration subassembly includes the third rotation axis, the second bevel gear, the fourth rotation axis, hold-in range and cam, the rotatable installation of third rotation axis is in the frame, the fixed cover of second bevel gear connects on the third rotation axis, second bevel gear and bevel gear dish transmission are connected, the rotatable installation of fourth rotation axis is in the frame, connect through synchronous belt drive between third rotation axis and the fourth rotation axis, the cam is fixed to be cup jointed on the fourth rotation axis.
Preferably, the blade coating assembly further comprises a mounting seat, the mounting seat is fixedly mounted on the telescopic rod, the scraper is fixedly mounted on the mounting seat, and the mounting seat and the mounting surface of the telescopic rod form an acute angle with the included angle of the scraper.
Preferably, the blade coating assembly further comprises a pressure sensor, wherein the pressure sensor is fixedly arranged on the mounting seat and is positioned between the mounting seat and the telescopic rod.
Preferably, the positioning assembly further comprises a positioning tool, the positioning tool is provided with a plurality of suckers in one-to-one correspondence, and the positioning tool is fixedly installed on the installation disc.
Preferably, the mounting disc comprises a leakage-proof ring, and the leakage-proof ring is fixedly arranged on the mounting disc.
Compared with the prior art, the beneficial effect of this application is:
1. this application has realized carrying out the automatic blade coating function of glass thick liquid to the diode in succession through frame, blade coating subassembly and processing control assembly, has solved the defect that traditional automatic blade coating equipment of glass thick liquid once can only process a silicon chip.
2. This application has realized through second linear actuator, sleeve, first rotation axis, cooperation key, elastic component, second rotation axis and recess that it is rotatory to drive a plurality of sucking discs in turn through a first rotary actuator, has solved every sucking disc and has all need install a first rotary actuator, and first rotary actuator only just starts at the knife coating subassembly during operation, leads to the defect that wasting of resources and cost increase.
3. This application has realized the function of drive installation disc at the uniform velocity rotation through awl fluted disc, second rotary drive ware and first bevel gear, has solved the rotatory technical problem of how first rotary drive subassembly drive installation disc.
4. This application has realized accurate location knife coating subassembly and sucking disc at the function of vertical direction projection position through infrared emitter and photosensitive element, has solved the rotation distance that needs operating personnel to judge the debugging installation disc by oneself, nevertheless is not only long consuming time through artifical debugging, the great defect of error moreover.
5. This application has realized the function of unloading in the automation through moving material robot and belt conveyor, has solved the defect that needs the manual unloading of operating personnel.
6. This application has realized the function of vibration installation disc through third rotation axis, second bevel gear, fourth rotation axis, hold-in range and cam, has solved the defect in the recess that glass thick liquid can't cover the silicon chip completely.
7. This application has realized making scraper slope blade coating silicon chip's function through the mount pad, has solved the scraper and need has rotated repeatedly and constantly scrapes into the recess of silicon chip with glass thick liquid to reduce machining efficiency's defect.
8. This application has realized the function of automatic adjustment telescopic link knife coating height through pressure sensor, when having solved the different thickness silicon chips of processing, need adjust the knife coating height of telescopic link, and the linear actuator in long-time drive process, has drive error to lead to the defect of processing failure.
9. According to the silicon wafer positioning device, the function of accurately positioning the silicon wafer mounting position is realized through the positioning tool, and the defect that the scraping coating quality of a scraper is reduced due to the fact that the mounting precision of the silicon wafer cannot be accurately guaranteed when the material moving robot carries out feeding is overcome.
10. The function that the glass thick liquid that this application had realized preventing dripping flows out the installation disc through the leak protection ring, has solved the blade coating in-process glass thick liquid and can follow the edge drippage of silicon chip to pollute the defect of blade coating equipment.
Drawings
FIG. 1 is a perspective view of the present application;
FIG. 2 is a first perspective view of the machining control apparatus of the present application;
FIG. 3 is a front view of the process control apparatus of the present application;
FIG. 4 is an exploded perspective view of the blade coating assembly and clutch assembly of the present application;
FIG. 5 is an enlarged partial schematic view of FIG. 4 of the present application at A;
FIG. 6 is a second perspective view of the machining control apparatus of the present application;
FIG. 7 is an enlarged partial schematic view of the present application at B in FIG. 6;
FIG. 8 is an enlarged partial schematic view at C of FIG. 6 of the present application;
FIG. 9 is a front view of the present application;
FIG. 10 is a perspective view of the clutch assembly of the present application shown in connection with a suction cup;
the reference numbers in the figures are:
1-a frame; 1 a-a vibrating assembly; 1a 1-third axis of rotation; 1a2 — second bevel gear; 1a 3-fourth axis of rotation; 1a 4-synchronous belt; 1a 5-cam;
2-blade coating of components; 2 a-linear drive; 2 b-a telescopic rod; 2 c-a scraper; 2 d-mounting base; 2 e-a pressure sensor;
3-a processing control device; 3 a-mounting the disc; 3a 1-leakproof ring; 3 b-a first rotary drive assembly; 3b 1-bevel disk; 3b2 — second rotary drive; 3b3 — first bevel gear; 3 c-a suction cup; 3 d-a first rotary drive; 3 e-a clutch assembly; 3e1 — second linear drive; 3e 2-sleeve; 3e3 — first axis of rotation; 3e 4-mating key; 3e 5-elastic piece; 3e6 — second axis of rotation; 3e 7-groove;
4-a positioning assembly; 4 a-an infrared emitter; 4 b-a photosensitive element; 4c, positioning a tool;
5-moving the material component; 5 a-a material moving robot; 5 b-belt conveyor.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
As shown in fig. 1-10:
the glass paste automatic scraping and coating equipment for diode processing comprises a rack 1 and a scraping and coating assembly 2, wherein the scraping and coating assembly 2 comprises a linear driver 2a, an expansion link 2b and a scraper 2c, the linear driver 2a is fixedly arranged on the rack 1, the expansion link 2b is fixedly connected with the driving end of the linear driver 2a, and the scraper 2c is fixedly arranged at the end part of the expansion link 2 b; the application also comprises a processing control component 3, the processing control component 3 comprises an installation disc 3a, a first rotary driving component 3b, a sucker 3c and a first rotary driver 3d, the installation disc 3a is rotatably installed on the rack 1, the first rotary driving component 3b is fixedly installed on the rack 1, the driving end of the first rotary driving component 3b is in transmission connection with the installation disc 3a, the sucker 3c and the first rotary driver 3d are provided with a plurality of and one-to-one correspondence, the suckers 3c are fixedly installed on the installation disc 3a and are symmetrically installed about the axis center of the installation disc 3a, the first rotary driver 3d is fixedly installed on the installation disc 3a, and the driving end of the first rotary driver 3d is in transmission connection with the sucker 3 c.
Based on the above embodiments, the technical problem to be solved by the present application is how to realize the continuous processing of the diode. Therefore, the function of continuously carrying out automatic glass paste scraping on the diode is realized through the rack 1, the scraping component 2 and the processing control component 3, and the defect that the traditional automatic glass paste scraping equipment can only process one silicon wafer at a time is overcome. The linear driver 2a is preferably an electric push rod, the first rotary driver 3d is preferably a servo motor, and the electric push rod, the servo motor, the first rotary driving component 3b and the sucker 3c are electrically connected with the controller; an operator firstly installs a silicon wafer on a sucking disc 3c, paints glass slurry on the surface of the silicon wafer, fixes the silicon wafer through the sucking disc 3c, then sends a signal to a first rotary driving component 3b through a controller, the first rotary driving component 3b drives an installation disc 3a to rotate, the installation disc 3a drives the sucking disc 3c to rotate, moves the sucking disc 3c to be right below a scraping component 2, then sends a signal to a linear driver 2a through the controller, the linear driver 2a drives an expansion rod 2b to descend until a scraper 2c is contacted with the silicon wafer, and then scrapes the silicon wafer through the scraper 2c, so that the groove on the silicon wafer is completely covered by the glass slurry; and in the blade coating process, an operator installs the next silicon wafer again and takes down the processed silicon wafer, so that a processing period is formed, and the processing efficiency is greatly improved.
Further, the present application still has the drawback that each suction cup 3c needs to be equipped with a first rotary actuator 3d, and the first rotary actuator 3d is only activated when the blade coating assembly 2 is in operation, resulting in wasted resources and increased costs, and in order to solve this problem, as shown in fig. 3-6:
the machining control assembly 3 further comprises a clutch assembly 3e, the clutch assembly 3e comprises a second linear driver 3e1, a sleeve 3e2, a first rotating shaft 3e3, a matching key 3e4, an elastic member 3e5, a second rotating shaft 3e6 and a groove 3e7, the second linear driver 3e1 is fixedly installed on the frame 1, the first rotating shaft 3e3 is rotatably installed on the frame 1, the first rotating shaft 3e3 is provided with a first shaft body and a second shaft body, the two shaft bodies of the first rotating shaft 3e3 are in sliding fit, the first shaft body is positioned above the second shaft body, the second shaft body is fixedly connected with the driving end of the first rotating driver 3d, the sleeve 3e2 is rotatably sleeved on the first shaft body of the first rotating shaft 3e3, the sleeve 3e2 is fixedly connected with the driving end of the second linear driver 3e1, the matching key 3e4 and the elastic member 3e5 are provided with a plurality of matching keys 3e4 which are in one-to one correspondence, and the matching key 3e4 is slidably installed in the first shaft body 3 of the first rotating shaft body, two ends of the elastic element 3e5 are respectively fixedly connected with the first shaft body of the matching key 3e4 and the first rotating shaft 3e3, the second rotating shaft 3e6 is rotatably installed on the installation disc 3a, the second rotating shaft 3e6 is fixedly connected with the suction cup 3c, a plurality of grooves 3e7 are arranged and correspond to the matching keys 3e4 one by one, and the grooves 3e7 are fixedly arranged on the second rotating shaft 3e 6.
Based on the above embodiments, the technical problem to be solved by the present application is how to save the equipment cost. For this purpose, the present application realizes the function of driving the plurality of suction cups 3c to rotate in turn by one first rotary driver 3d by the second linear driver 3e1, the sleeve 3e2, the first rotary shaft 3e3, the mating key 3e4, the elastic member 3e5, the second rotary shaft 3e6 and the recess 3e 7. The second linear driver 3e1 is preferably a cylinder, and the cylinder is electrically connected with the controller; an operator sends a signal to the first rotary driving component 3b and the first rotary driver 3d through the controller, the first rotary driving component 3b drives the mounting disc 3a to rotate, after the sucker 3c is moved to the position right below the blade coating component 2 through the mounting disc 3a, the controller sends a signal to the air cylinder, the air cylinder drives the sleeve 3e2 to move upwards, the sleeve 3e2 drives the first shaft body of the first rotary shaft 3e3 to move upwards, meanwhile, the first rotary driving component 3b drives the first rotary shaft 3e3 to rotate, the second shaft body of the first rotary shaft 3e3 is sleeved on the second rotary shaft 3e6 and then rotates relative to the first rotary shaft 3e6 until the matching key 3e4 is clamped into the groove 3e7, the matching key 3e4 and the groove 3e7 are matched to drive the second rotary shaft 3e6 to rotate, so as to drive the sucker 3c to rotate, after the first silicon wafer is processed, the controller sends a signal to the air cylinder, the cylinder driving sleeve 3e2 moves downwards to separate the first rotating shaft 3e3 from the second rotating shaft 3e6, then the first rotating driving assembly 3b drives the mounting disc 3a to rotate, and after the next suction cup 3c moves to a position right below the blade coating assembly 2, the above steps are repeated, thereby realizing the function that one first rotating driver 3d drives a plurality of suction cups 3c to rotate in turn.
Further, in order to solve the technical problem of how the first rotary driving assembly 3b drives the mounting disc 3a to rotate, as shown in fig. 6 to 7:
the first rotary driving assembly 3b comprises a bevel gear plate 3b1, a second rotary driver 3b2 and a first bevel gear 3b3, the bevel gear plate 3b1 is fixedly sleeved on the mounting disc 3a, the second rotary driver 3b2 is fixedly mounted on the frame 1, the first bevel gear 3b3 is fixedly sleeved on the driving end of the second rotary driver 3b2, and the first bevel gear 3b3 is in transmission connection with the bevel gear plate 3b 1.
Based on the above-described embodiment, the technical problem that the present application intends to solve is how to drive the mounting disk 3a to rotate. For this reason, the bevel gear plate 3b1, the second rotary driver 3b2 and the first bevel gear 3b3 are used for driving the mounting disc 3a to rotate at a constant speed. The second rotary driver 3b2 is preferably a servo motor, and the servo motor is electrically connected with the controller; after an operator installs the silicon wafer on the sucking disc 3c, send a signal to the servo motor through the controller, the servo motor drives the rotation of the first bevel gear 3b3, the first bevel gear 3b3 drives the rotation of the bevel gear disc 3b1 connected with the transmission of the first bevel gear 3b3, the bevel gear disc 3b1 drives the installation disc 3a to rotate, the installation disc 3a drives the sucking disc 3c to rotate until the next sucking disc 3c is moved to the position right below the blade coating component 2, the blade coating processing is carried out on the silicon wafer through the blade coating component 2, after the processing is finished, the servo motor drives the installation disc 3a to rotate again, and therefore the automatic continuous processing of the silicon wafer is achieved.
Further, this application still has the rotation distance that needs operating personnel to judge debugging installation disc 3a by oneself, but not only takes time through the manual debugging, and the great defect of error, in order to solve this problem, as shown in fig. 1, fig. 2 and fig. 6:
this application still includes locating component 4, and locating component 4 includes infrared emitter 4a and light sensitive element 4b, and infrared emitter 4a fixed mounting is in frame 1, and light sensitive element 4b is equipped with a plurality ofly and with sucking disc 3c one-to-one.
Based on the above-described embodiments, the technical problem that the present application intends to solve is how to improve the rotational accuracy of the mounting disk 3 a. Therefore, the function of accurately positioning the projection position of the blade coating component 2 and the suction cup 3c in the vertical direction is realized through the infrared emitter 4a and the photosensitive element 4 b. The infrared emitter 4a and the photosensitive element 4b are electrically connected with the controller; after an operator installs a silicon wafer on the suction cup 3c, the operator sends signals to the second rotary driver 3b2, the infrared emitter 4a and the photosensitive element 4b through the controller, the second rotary driver 3b2 drives the first bevel gear 3b3 to rotate, the first bevel gear 3b3 drives the bevel gear 3b1 in transmission connection with the first bevel gear to rotate, the bevel gear 3b1 drives the installation disc 3a to rotate, the installation disc 3a drives the suction cup 3c to rotate, meanwhile, the infrared emitter 4a sends out infrared rays after receiving the signals, when the next suction cup 3c moves to the position right below the blade coating component 2, the photosensitive element 4b senses the rays sent out by the infrared emitter 4a and feeds back the signals to the controller, the controller stops driving of the second rotary driver 3b2 after receiving the signals, then blade coating processing is carried out on the silicon wafer through the blade coating component 2, after the processing is completed, the second rotary driver 3b2 drives the installation disc 3a to rotate, thereby realizing the automatic continuous processing of the silicon chip.
Further, this application still has the defect that the unloading needs the manual unloading of operating personnel, in order to solve this problem, as shown in fig. 1 and fig. 9:
this application still includes moves material subassembly 5, moves material subassembly 5 including moving material robot 5a and belt conveyor 5b, moves material robot 5a and belt conveyor 5b and is equipped with two, moves material robot 5a fixed mounting in frame 1, belt conveyor 5b and frame 1 fixed connection.
Based on the above embodiments, the technical problem to be solved by the present application is how to improve the automation degree of the device. Therefore, the automatic feeding and discharging function is achieved through the material moving robot 5a and the belt conveyor 5 b. The material moving robot 5a and the belt conveyor 5b are electrically connected with the controller; an operator transports a silicon wafer to be processed to the position of the mounting disc 3a through one of the belt conveyors 5b, then the material moving robot 5a moves the silicon wafer to the sucker 3c, then the first rotary driving assembly 3b drives the mounting disc 3a to rotate, then the blade coating assembly 2 processes the silicon wafer, meanwhile, the material moving robot 5a carries out material loading, and the other material moving robot 5a moves the processed silicon wafer to the other belt conveyor 5b to complete material unloading, so that automatic blade coating processing is realized.
Further, the present application still has a defect that the glass paste cannot completely cover the grooves on the silicon wafer, and to solve this problem, as shown in fig. 3, fig. 6 and fig. 8:
the frame 1 comprises a vibration assembly 1a, the vibration assembly 1a comprises a third rotating shaft 1a1, a second bevel gear 1a2, a fourth rotating shaft 1a3, a synchronous belt 1a4 and a cam 1a5, the third rotating shaft 1a1 is rotatably mounted on the frame 1, the second bevel gear 1a2 is fixedly sleeved on the third rotating shaft 1a1, the second bevel gear 1a2 is in transmission connection with a bevel gear 3b1, the fourth rotating shaft 1a3 is rotatably mounted on the frame 1, the third rotating shaft 1a1 is in transmission connection with the fourth rotating shaft 1a3 through the synchronous belt 1a4, and the cam 1a5 is fixedly sleeved on the fourth rotating shaft 1a 3.
Based on the above embodiments, the technical problem to be solved by the present application is how to improve the glass paste coverage. For this reason, the present application realizes the function of vibrating the mounting disc 3a by the third rotating shaft 1a1, the second bevel gear 1a2, the fourth rotating shaft 1a3, the timing belt 1a4, and the cam 1a 5. When the first rotary driving component 3b drives the mounting disc 3a to rotate, the bevel gear disc 3b1 simultaneously drives the second bevel gear 1a2 to rotate, the second bevel gear 1a2 drives the third rotating shaft 1a1 to rotate, the third rotating shaft 1a1 drives the fourth rotating shaft 1a3 to rotate through the transmission of the synchronous belt 1a4, the fourth rotating shaft 1a3 drives the cam 1a5 to rotate, and the bulge of the cam 1a5 periodically impacts the mounting disc 3a along with the rotation, so that the mounting disc 3a vibrates, bubbles in the glass slurry are shaken out, and the glass slurry completely covers the grooves of the silicon wafer.
Further, the present application still has the defect that the scraper 2c needs to rotate repeatedly to continuously scrape the glass slurry into the groove of the silicon wafer, thereby reducing the processing efficiency, and in order to solve the problem, as shown in fig. 4:
Based on the above embodiments, the technical problem to be solved by the present application is how to improve the blade coating efficiency of the blade. For this reason, the present application realizes the function of obliquely scraping the silicon wafer by the scraper 2c through the mounting seat 2 d. Through the setting of mount pad 2d, can make the contained angle between scraper 2c and the silicon chip be the acute angle to increase the stress surface of glass thick liquid, improve the knife coating efficiency, thereby further improve machining efficiency.
Further, when this application still has the different thickness silicon chips of processing, need adjust the knife coating height of telescopic link 2b, and linear actuator 2a is in long-time drive process, has drive error to lead to the defect of processing failure, in order to solve this problem, as shown in fig. 4:
the blade coating assembly 2 further comprises a pressure sensor 2e, and the pressure sensor 2e is fixedly mounted on the mounting base 2d and is located between the mounting base 2d and the telescopic rod 2 b.
Based on the above embodiment, the technical problem that the present application intends to solve is how to improve the adjusting efficiency of the blade coating height of the telescopic rod 2 b. For this reason, this application has realized the function of automatic adjustment telescopic link 2b knife coating height through pressure sensor 2 e. The pressure sensor 2e is electrically connected with the controller; after the controller sends a signal to the linear driver 2a, the linear driver 2a drives the telescopic rod 2b to move downwards, after the scraper 2c is contacted with the silicon wafer, the pressure sensor 2e senses a pressure value, after the pressure value reaches a set value, the pressure sensor 2e feeds back a signal to the controller, and the controller stops driving of the linear driver 2a, so that the scraping height of the scraper 2c is automatically adjusted, and the silicon wafer scraper is suitable for silicon wafers with different thicknesses.
Further, the present application still has a defect that the mounting precision of the silicon wafer cannot be accurately ensured when the material moving robot 5a carries out material loading, so that the blade coating quality of the scraper 2c is reduced, and in order to solve the problem, as shown in fig. 2:
the positioning assembly 4 further comprises a positioning tool 4c, the positioning tool 4c is provided with a plurality of suckers 3c in one-to-one correspondence, and the positioning tool 4c is fixedly installed on the installation disc 3 a.
Based on the above embodiments, the technical problem to be solved by the present application is how to improve the mounting accuracy of the silicon wafer. Therefore, the function of accurately positioning the silicon wafer mounting position is achieved through the positioning tool 4 c. When an operator sends a signal to the material moving robot 5a and the belt conveyor 5b through the controller, the silicon wafer is installed on the sucker 3c under the matching of the material moving robot 5a and the belt conveyor 5b, and in the installation process, the installation precision of the silicon wafer is greatly improved through the positioning of the positioning tool 4c, so that the scraper 2c can effectively scrape and coat glass slurry.
Further, the present application still has the defect that the glass paste may drip from the edge of the silicon wafer during the coating process, thereby contaminating the coating equipment, and in order to solve the problem, as shown in fig. 2:
the mounting disc 3a comprises a leakage-proof ring 3a1, and the leakage-proof ring 3a1 is fixedly arranged on the mounting disc 3 a.
Based on the above-described embodiments, the technical problem that the present application intends to solve is how to prevent the dripping glass paste from contaminating the apparatus. For this reason, the present application achieves the function of preventing the dripping glass paste from flowing out of the mounting disk 3a by the leakage preventing ring 3a 1. Because blade coating in-process can hardly avoid having some glass thick liquids to drip from the silicon chip, and the glass thick liquids that drip can drop earlier on installation disc 3a, on glass thick liquids for preventing on the installation disc 3a flowed other parts, the border position at installation disc 3a has set up leak protection ring 3a1, through the flow range of leak protection ring 3a1 restriction glass thick liquids, prevented promptly that other parts from receiving the pollution, and the glass thick liquids that will drip are collected, make things convenient for the follow-up clearance glass thick liquids of operating personnel.
The above examples only show one or more embodiments of the present invention, and the description is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The utility model provides an automatic blade coating equipment of glass thick liquid for diode processing, includes frame (1) and blade coating subassembly (2), blade coating subassembly (2) include linear actuator (2a), telescopic link (2b) and scraper (2c), linear actuator (2a) fixed mounting is on frame (1), telescopic link (2b) and the drive end fixed connection of linear actuator (2a), scraper (2c) fixed mounting is at the tip of telescopic link (2 b);
it is characterized by also comprising a processing control device (3), wherein the processing control device (3) comprises a mounting disc (3a) and a first rotary driving component (3b), sucking disc (3c) and first rotary actuator (3d), rotatable the installing in frame (1) of installation disc (3a), first rotary actuator subassembly (3b) fixed mounting is in frame (1), the drive end and the installing disc (3a) transmission of first rotary actuator subassembly (3b) are connected, sucking disc (3c) and first rotary actuator (3d) are equipped with a plurality ofly and one-to-one, a plurality of sucking discs (3c) fixed mounting are on installing disc (3a) and its axis central symmetry installation about installing disc (3a), first rotary actuator (3d) fixed mounting is on installing disc (3a), the drive end and sucking disc (3c) transmission of first rotary actuator (3d) are connected.
2. The automatic glass paste scraping and coating equipment for diode machining according to claim 1, characterized in that the machining control device (3) further comprises a clutch assembly (3e), the clutch assembly (3e) comprises a second linear driver (3e1), a sleeve (3e2), a first rotating shaft (3e3), an engagement key (3e4), an elastic member (3e5), a second rotating shaft (3e6) and a groove (3e7), the second linear driver (3e1) is fixedly mounted on the frame (1), the first rotating shaft (3e3) is rotatably mounted on the frame (1), the first rotating shaft (3e3) has a first shaft body and a second shaft body, two shaft bodies of the first rotating shaft (3e3) are slidably engaged and the first shaft body is positioned above the second shaft body, the second shaft body is fixedly connected with the driving of the first rotating driver (3d), the sleeve (3e2) is rotatably sleeved on the first shaft body 3 of the first rotating shaft (3e3), the sleeve (3e2) is fixedly connected with the driving end of the second linear driver (3e1), the matching keys (3e4) and the elastic pieces (3e5) are arranged in a plurality of and in one-to-one correspondence, the matching keys (3e4) are slidably mounted in the first shaft body of the first rotating shaft (3e3), two ends of each elastic piece (3e5) are fixedly connected with the matching keys (3e4) and the first shaft body of the first rotating shaft (3e3), the second rotating shaft (3e6) is rotatably mounted on the mounting disc (3a), the second rotating shaft (3e6) is fixedly connected with the sucker (3c), the grooves (3e7) are arranged in a plurality and in one-to-one correspondence with the matching keys (3e4), and the grooves (3e7) are fixedly arranged on the second rotating shaft (3e 6).
3. The automatic glass slurry scraping and coating equipment for diode processing as claimed in claim 1, wherein the first rotary driving assembly (3b) comprises a conical-toothed disc (3b1), a second rotary driver (3b2) and a first bevel gear (3b3), the conical-toothed disc (3b1) is fixedly sleeved on the mounting disc (3a), the second rotary driver (3b2) is fixedly mounted on the machine frame (1), the first bevel gear (3b3) is fixedly sleeved on the driving end of the second rotary driver (3b2), and the first bevel gear (3b3) is in transmission connection with the conical-toothed disc (3b 1).
4. The automatic glass paste scraping and coating equipment for diode processing is characterized by further comprising a positioning assembly (4), wherein the positioning assembly (4) comprises an infrared emitter (4a) and a photosensitive element (4b), the infrared emitter (4a) is fixedly installed on the rack (1), and the photosensitive element (4b) is provided with a plurality of suckers (3c) in one-to-one correspondence.
5. The automatic glass paste scraping and coating equipment for diode processing is characterized by further comprising a material moving assembly (5), wherein the material moving assembly (5) comprises a material moving robot (5a) and a belt conveyor (5b), the number of the material moving robots (5a) and the number of the belt conveyors (5b) are two, the material moving robot (5a) is fixedly installed on the rack (1), and the belt conveyor (5b) is fixedly connected with the rack (1).
6. The automatic glass slurry scraping and coating equipment for diode processing according to claim 3, the vibration machine is characterized in that the rack (1) comprises a vibration assembly (1a), the vibration assembly (1a) comprises a third rotating shaft (1a1), a second bevel gear (1a2), a fourth rotating shaft (1a3), a synchronous belt (1a4) and a cam (1a5), the third rotating shaft (1a1) is rotatably mounted on the rack (1), the second bevel gear (1a2) is fixedly sleeved on the third rotating shaft (1a1), the second bevel gear (1a2) is in transmission connection with a bevel gear disc (3b1), the fourth rotating shaft (1a3) is rotatably mounted on the rack (1), the third rotating shaft (1a1) and the fourth rotating shaft (1a3) are in transmission connection through the synchronous belt (1a4), and the cam (1a5) is fixedly sleeved on the fourth rotating shaft (1a 3).
7. The automatic glass paste scraping and coating equipment for diode processing as claimed in claim 1, wherein the scraping and coating assembly (2) further comprises a mounting base (2d), the mounting base (2d) is fixedly mounted on the telescopic rod (2b), the scraper (2c) is fixedly mounted on the mounting base (2d), and an included angle between the mounting base (2d) and the mounting surface of the telescopic rod (2b) and the scraper (2c) is an acute angle.
8. The automatic glass paste scraping and coating equipment for diode processing as claimed in claim 7, characterized in that the scraping and coating assembly (2) further comprises a pressure sensor (2e), the pressure sensor (2e) is fixedly mounted on the mounting base (2d) and is positioned between the mounting base (2d) and the telescopic rod (2 b).
9. The automatic glass paste scraping and coating equipment for diode processing according to claim 4, wherein the positioning assembly (4) further comprises a plurality of positioning tools (4c), the positioning tools (4c) correspond to the suckers (3c) one by one, and the positioning tools (4c) are fixedly installed on the installation disc (3 a).
10. The automatic glass paste scraping apparatus for diode processing according to claim 1, characterized in that the mounting disc (3a) comprises a leakproof ring (3a1), the leakproof ring (3a1) being fixedly arranged on the mounting disc (3 a).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210356752.6A CN114887842A (en) | 2022-03-31 | 2022-03-31 | Automatic glass paste scraping and coating equipment for diode processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210356752.6A CN114887842A (en) | 2022-03-31 | 2022-03-31 | Automatic glass paste scraping and coating equipment for diode processing |
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| CN114887842A true CN114887842A (en) | 2022-08-12 |
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| CN202210356752.6A Pending CN114887842A (en) | 2022-03-31 | 2022-03-31 | Automatic glass paste scraping and coating equipment for diode processing |
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| US20120177825A1 (en) * | 2011-01-12 | 2012-07-12 | Lin Kwang-Huo | Method of coating a fabric using a blade-coating device |
| CN107983563A (en) * | 2017-11-28 | 2018-05-04 | 济宁学院 | A kind of one master and multiple slaves formula arrangement of clutch |
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Application publication date: 20220812 |