CN114884578A

CN114884578A - Multifunctional infrared receiving module with LED indicating lamp or sensor

Info

Publication number: CN114884578A
Application number: CN202210391513.4A
Authority: CN
Inventors: 黄大玮; 刘彬
Original assignee: Shenzhen Wenyao Semiconductor Technology Co ltd
Current assignee: Shenzhen Wenyao Semiconductor Technology Co ltd
Priority date: 2022-04-14
Filing date: 2022-04-14
Publication date: 2022-08-09

Abstract

The invention discloses a multifunctional infrared receiving module with an LED indicating lamp or a sensor, which comprises: first PCB board, second PCB board, photoelectric conversion chip, decode chip and luminous LED and/or sensor, second PCB board is folded to be located on the first PCB board, be equipped with a plurality of through-holes on the second PCB board, luminous LED, photoelectric conversion chip, decode chip and sensor all set up on the first PCB board, just it all is located corresponding to decode chip and photoelectric conversion chip in the through-hole. The invention adopts the double-layer PCB structure to replace the traditional bracket structure as the carrier of the chip and the IC, and does not need to invest high-amount capital development moulds like the traditional bracket, thereby increasing the flexibility of the development design change of the product, simplifying the production process and reducing the production cost; the original independent light-emitting LED and the receiving module are integrated together, so that the LED lamp is more convenient to use.

Description

Multifunctional infrared receiving module with LED indicating lamp or sensor

Technical Field

The invention relates to the technical field of infrared receiving modules, in particular to a multifunctional infrared receiving module with an LED indicating lamp or a sensor.

Background

In order to facilitate control and real-time performance, a plurality of household appliances such as televisions, air conditioners, dehumidifiers and the like can be switched on and off or set and adjust functions by using a remote controller, under the condition that intelligent home is more and more popular, a mobile phone has an infrared emission function to replace a traditional remote controller, and the infrared remote control function is also a new trend, and is more and more widely applied to various home products, and the remote control needs to be realized by correspondingly matching infrared receiving modules on remote-controlled commodities, and the remote controller sends out corresponding instructions to enable the household appliances to execute corresponding actions after decoding signals by the infrared receiving modules; the light emitting LED on the device has the function of a power supply or a status indicator light, and generally keeps a long-time bright state when the device is powered on. In order to avoid the interference of the light-emitting LED on the infrared receiving module and the influence on the receiving capability of the infrared receiving module, the infrared receiving module and the light-emitting LED are arranged at a certain distance in the current products which simultaneously use the infrared receiving module and the light-emitting LED. However, due to the lightness, thinness, integration and low cost of household electrical appliances, sensing devices such as light emitting LEDs and ambient light sensing ICs need to be packaged in a module, which causes problems of light interference and large module size. Referring to fig. 4 and 5, fig. 4 and 5 are schematic structural views of an infrared receiving module in the prior art. The size and the style of an infrared receiving module on the market are very small at present, mainly in the existing structure, an internal support structure and an external plastic structure are required to be molded by opening a die, the cost of the die is high, equipment or instruments must be spent during development and design, the structure of the general specification on the market is shared as much as possible, and the elasticity of product design is limited.

Accordingly, the prior art is deficient and needs improvement.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a multifunctional infrared receiving module with an LED indicating lamp or a sensor.

The technical scheme of the invention is as follows: the invention provides a multifunctional infrared receiving module with an LED indicating lamp or a sensor, which comprises: first PCB board, second PCB board, photoelectric conversion chip, decode chip and luminous LED and/or sensor, second PCB board lamination is located on the first PCB board, be equipped with a plurality of through-holes on the second PCB board, luminous LED, photoelectric conversion chip, decode chip and sensor all set up on the first PCB board, just it all is located the correspondence to decode chip and photoelectric conversion chip in the through-hole.

Further, the light emitting LEDs and/or sensors are also located within the corresponding through holes.

Furthermore, each light-emitting LED, the decoding chip, the photoelectric conversion chip and the sensor are correspondingly arranged in one through hole.

Furthermore, the number of the light-emitting LEDs, the decoding chips, the photoelectric conversion chips and the sensors arranged in one through hole is more than 1.

Furthermore, a protection device is arranged in the through hole.

Furthermore, the infrared receiving module also comprises an electromagnetic shielding device, and the electromagnetic shielding device is correspondingly arranged at the decoding chip.

Furthermore, the second PCB board comprises materials with the light filtering function.

Furthermore, the inner wall of the through hole of the second PCB board is provided with a light-blocking design structure.

Furthermore, the outer side wall of the second PCB is provided with a light-blocking design structure.

Further, the light-emitting LED is an LED wafer or an LED lamp bead.

Further, the sensor is a sensor chip or a finished product obtained after the sensor chip is packaged.

By adopting the scheme, the invention has the beneficial effects that: the double-layer PCB structure is adopted to replace the traditional bracket structure to be used as a carrier of the chip and the IC, so that a high-capital development mould is not required to be invested like the traditional bracket, the flexibility of product development design change is increased, the production process is simplified, and the production cost is reduced; the originally separated light-emitting LED and the receiving module are integrated together, so that the use is more convenient; the developed new structure can isolate the light interference of the light-emitting LED and further reduce the volume of the original module.

Drawings

Fig. 1 is a schematic structural diagram of an infrared receiving module according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of an infrared receiving module according to another embodiment of the invention.

Fig. 3 is a schematic structural diagram of an alternative second PCB of the present invention.

Fig. 4 is a top view of a conventional infrared receiving module.

Fig. 5 is a side view of a conventional infrared receiving module.

Detailed Description

The invention is described in detail below with reference to the figures and the specific embodiments.

Referring to fig. 1, in the present embodiment, the present invention provides a multifunctional infrared receiving module with an LED indicator or a sensor, including: first PCB board 1, second PCB board 4, luminous LED7, photoelectric conversion chip 2, decode chip 3 and sensor 8, second PCB board 4 is range upon range of to be located on the first PCB board 1, be formed with the circuit on the first PCB board 1, be equipped with a plurality of through-holes on the second PCB board 4, luminous LED7, photoelectric conversion chip 2, decode chip 3 and sensor 8 all set up on the first PCB board 1, just it all is located the correspondence to decode chip 3 and photoelectric conversion chip 2 in the through-hole. Specifically, the second PCB board 4 may be disposed on the first PCB board 1 by means of adhesive bonding.

Further, in some embodiments of the present solution, the light emitting LEDs and/or sensors may also be located in the corresponding through holes, as in the embodiment of fig. 2, the light emitting LEDs and sensors are also located in the through holes of the second PCB board 9.

Further, in some embodiments of the present disclosure, as shown in fig. 1 and fig. 2, each of the light emitting LED7, the decoding chip 3, the photoelectric conversion chip 2, and the sensor 8 is correspondingly disposed in one through hole, the through hole may be a circular hole or a through hole with other shape and different size due to different functional requirements of devices or instruments, and if the number of the photoelectric conversion chip 2, the light emitting LED7, or the sensor 8 needs to be increased, the number of the through holes on the second PCB 4 may be correspondingly increased, and the sizes of the first PCB 1 and the second PCB 4 may also be correspondingly adjusted.

Further, in some embodiments of the present disclosure, the number of the light emitting LEDs, the decoding chips, the photoelectric conversion chips, and the sensors disposed in one through hole is greater than 1, that is, the number of the chips disposed in one through hole may be 2 or more than 2, for example, in the embodiment shown in fig. 3, the through hole on the second PCB 10 shown in fig. 3 is a waist-shaped hole, and 2 or more than 2 chips may be disposed in the waist-shaped hole.

Further, as shown in the embodiment shown in fig. 1, a protection device 5 is further disposed in the through hole, and the protection device 5 may be formed by filling a curable molding substance in the through hole, and may be used for protection.

Further, as shown in the embodiment of fig. 1, the infrared receiving module further includes an electromagnetic shielding device 6, the electromagnetic shielding device 6 is correspondingly disposed at the decoding chip 3, the electromagnetic shielding device 1 is connected to a ground line on the first PCB 1 or connected to other ground lines, so as to prevent the decoding chip 3 from being subjected to electromagnetic interference, and the electromagnetic shielding device 6 may be in the form of a metal shell, an electromagnetic shielding cloth, or the like. The electromagnetic shielding means 6 may be provided in the form of a snap, an adhesive, etc.

Further, the light-emitting LED can be in the form of an LED wafer, an LED lamp bead and the like. The sensor is a sensor chip or a finished product obtained after the sensor chip is packaged. The light-emitting LED, the sensor and the like can be electrically connected with the circuit on the first PCB board in a welding mode, and the photoelectric conversion chip, the decoding chip and the like can be electrically connected with the circuit on the first PCB board in a gold wire bonding mode.

In order to prevent the photoelectric conversion chip from being interfered by other light, a corresponding shielding measure can be arranged to improve the receiving accuracy.

Optionally, the second PCB includes a material with a light filtering function, so that the second PCB has a function of blocking visible light as a whole.

Optionally, the inner wall of the through hole of the second PCB or the outer side wall of the second PCB is provided with a light blocking design structure, which may be formed by spraying, electroplating, or by installing a corresponding copper ring in the corresponding through hole, and the light blocking design structure may be made of metal or a material with a corresponding light blocking capability.

To sum up, this scheme's beneficial effect lies in: the double-layer PCB structure is adopted to replace the traditional bracket structure to be used as a carrier of the chip and the IC, so that a high-capital development mould is not required to be invested like the traditional bracket, the flexibility of product development design change is increased, the production process is simplified, and the production cost is reduced; the originally separated light-emitting LED and the receiving module are integrated together, so that the use is more convenient; the developed new structure can isolate the light interference of the light-emitting LED and further reduce the volume of the original module.

The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a take multi-functional infrared receiving module of LED pilot lamp or sensor which characterized in that includes: first PCB board, second PCB board, photoelectric conversion chip, decode chip and luminous LED and/or sensor, second PCB board is folded to be located on the first PCB board, be equipped with a plurality of through-holes on the second PCB board, luminous LED, photoelectric conversion chip, decode chip and sensor all set up on the first PCB board, just it all is located corresponding to decode chip and photoelectric conversion chip in the through-hole.

2. The multifunctional infrared receiving module with the LED indicator light or the sensor as claimed in claim 1, wherein the light emitting LED and/or the sensor are also located in the corresponding through hole.

3. The multifunctional infrared receiving module with the LED indicator lamp or the sensor as claimed in claim 1, wherein each of the light emitting LED, the decoding chip, the photoelectric conversion chip and the sensor is correspondingly disposed in one of the through holes.

4. The multifunctional infrared receiving module with the LED indicator lamp or the sensor as claimed in claim 1, wherein the number of the light emitting LEDs, the decoding chips, the photoelectric conversion chips and the sensors arranged in one through hole is more than 1.

5. The multifunctional infrared receiving module with the LED indicator lamp or the sensor as claimed in claim 1, wherein a protection device is further arranged in the through hole.

6. The multifunctional infrared receiving module with the LED indicator lamp or the sensor as claimed in claim 1, further comprising an electromagnetic shielding device, wherein the electromagnetic shielding device is correspondingly arranged at the decoding chip.

7. The multifunctional infrared receiving module with LED indicator light or sensor as claimed in any one of claims 1 to 6, wherein the second PCB board comprises a material with a light filtering function.

8. The multifunctional infrared receiving module with the LED indicating lamp or the sensor as claimed in any one of claims 1 to 6, wherein the inner wall of the through hole of the second PCB board is provided with a light blocking design structure.

9. The multifunctional infrared receiving module with the LED indicating lamp or the sensor as claimed in any one of claims 1 to 6, wherein the outer side wall of the second PCB board is provided with a light blocking design structure.

10. The multifunctional infrared receiving module with the LED indicator light or the sensor according to any one of claims 1 to 6, wherein the light-emitting LED is an LED wafer or an LED lamp bead; the sensor is a sensor chip or a finished product obtained after the sensor chip is packaged.