CN114883226A - Automatic production line for grinding and polishing semiconductor wafer - Google Patents
Automatic production line for grinding and polishing semiconductor wafer Download PDFInfo
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- CN114883226A CN114883226A CN202210652531.3A CN202210652531A CN114883226A CN 114883226 A CN114883226 A CN 114883226A CN 202210652531 A CN202210652531 A CN 202210652531A CN 114883226 A CN114883226 A CN 114883226A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
Abstract
The invention discloses an automatic production line for sticking, grinding and polishing semiconductor wafers, which comprises a ceramic disc wax sticking system, a wafer polishing system, a dewaxing and wafer taking system and a master control system, wherein the ceramic disc wax sticking system is connected with the wafer polishing system through a wax removing and wafer taking system; the ceramic disc wax pasting system comprises a wax pasting machine, a chip taking manipulator and a wax pasting manipulator, wherein the chip taking manipulator is used for transferring a wafer into the wax pasting machine and stacking ceramic discs on a ceramic disc conveying track in a movable ceramic disc storage rack through a ceramic disc stacking mechanism; the wafer polishing system comprises a polishing machine and a ceramic disc manipulator, wherein the polishing manipulator is used for grabbing and placing a ceramic disc attached with a polished wafer in a ceramic disc storage rack; the dewaxing wafer taking system comprises a dewaxing wafer taking machine and a dewaxing manipulator, wherein the dewaxing manipulator is used for peeling off wafers attached to the surface of the ceramic disc, and grabbing the separated ceramic disc by the dewaxing manipulator to place in a ceramic disc storage rack. The invention can effectively improve the production efficiency of the whole process of wafer pasting, grinding and polishing through the cooperation of all the systems.
Description
Technical Field
The invention relates to the technical field of chip manufacturing, in particular to an automatic production line for pasting, grinding and polishing semiconductor wafers.
Background
The manufacturing industry is turning towards the industrial automation and flexible manufacturing technology at present, the purpose is to improve efficiency, reduce human input, reduce cost, the semiconductor chip substrate manufacturing field is also developing towards the direction of large batch, high technology and high quality, the chip substrate material is mainly sapphire wafer or silicon wafer at present, the wafer surface must have extremely high flatness, smoothness and cleanliness, and chemical mechanical polishing is the most effective wafer planarization technology at present, and the method combines the mechanical polishing and the alkali solution type chemical polishing, so that the wafer surface can be relatively flat, and the method lays a foundation for the post-process wafer processing procedure of products. The general practice in the industry is to put the wafers after linear cutting, grinding and annealing into a cleaning machine for cleaning, then use a wax pasting machine to paste the wafers on the surface of a flat circular ceramic disc, then move the ceramic disc pasted with the wafers onto a polishing machine for polishing, then move the polished ceramic disc onto the cleaning machine for cleaning, and then dewax and take the wafers.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide an automatic production line for pasting, grinding and polishing semiconductor wafers, and aims to solve the problems in the prior art
In order to achieve the purpose, the invention is realized by the following technical scheme: a semiconductor wafer pasting, grinding and polishing automatic production line comprises a ceramic disc wax pasting system, a wafer polishing system, a dewaxing and wafer taking system and a master control system;
the ceramic disc wax pasting system comprises a wax pasting machine, a chip taking manipulator and a wax pasting manipulator, wherein the chip taking manipulator is used for transferring wafers stored in a wafer storage device into the wax pasting machine, the wax pasting manipulator is used for transferring the wafers which are pasted with wax in the wax pasting machine to a preset position, the wafers placed at the preset position are pasted to ceramic discs which can move along a ceramic disc conveying track through the chip taking manipulator, and the ceramic discs on the ceramic disc conveying track are stacked in a movable ceramic disc storage rack through a ceramic disc stacking mechanism;
the wafer polishing system comprises a polishing machine and a ceramic disc manipulator, wherein the polishing manipulator is used for grabbing ceramic discs in the ceramic disc storage rack, transferring the ceramic discs to the polishing discs of the polishing machine to polish wafers through the polishing machine, and grabbing and placing the ceramic discs attached with polished wafers in the ceramic disc storage rack;
the dewaxing wafer taking system comprises a dewaxing wafer taking machine and a dewaxing manipulator, wherein the dewaxing manipulator is used for grabbing ceramic discs in the ceramic disc storage rack, moving the ceramic discs into the dewaxing wafer taking machine so as to peel off wafers attached to the surfaces of the ceramic discs through the dewaxing wafer taking machine, and grabbing separated ceramic discs through the dewaxing manipulator to be placed in the ceramic disc storage rack.
Compared with the prior art, the automatic production line for sticking, grinding and polishing the semiconductor wafer has the advantages that:
by arranging a ceramic disk conveying track penetrating through a production line, wherein the ceramic disk conveying track is used for conveying ceramic disks participating in system treatment, firstly, a ceramic disk wax pasting system can be used for taking, pasting wax and pasting ceramic disks for wafers stored in advance, so that the wafer after being pasted with wax can be attached to the surface of the ceramic disc, the wafer stored in the storage rack of the ceramic disc is grabbed by the wafer polishing system, and the wafer on the ceramic disc is polished, and the dewaxing wafer taking system peels off the wafer on the ceramic disc after the wafer on the ceramic disc is polished, thereby facilitating the next processing procedure of the wafer and the storage or the recycling of the ceramic disc, therefore, in the embodiment, the wafers and the ceramic discs which penetrate through the front and rear processes of the production line are not carried by manpower, and the cooperative operation of the systems in the production line can be beneficial to the improvement of the production efficiency.
According to one aspect of the technical scheme, the wafer storage device comprises a wafer box for storing wafers and a material box rack for storing the wafer box, the wafer taking mechanical arm is arranged between the material box rack and a material supply position of the wax pasting machine, and the wafer box is placed between the material box rack and the material supply position in a circulating mode through the wafer taking mechanical arm.
According to an aspect of the above technical solution, the number of the wafer storage devices is equal to the number of the wax attaching machines, and when the number of the wax attaching machines is multiple, each wafer storage device is opposite to each wax attaching machine, and the pick-up manipulator moves between the plurality of wafer storage devices and the plurality of wax attaching machines through a reciprocating mechanism, so as to drive the pick-up manipulator to reciprocate between the plurality of wafer storage devices and the plurality of wax attaching machines through the reciprocating mechanism.
According to one aspect of the technical scheme, the ceramic disc conveying rail is provided with a heating assembly at the front end close to the wafer mounting station, so that the ceramic disc needing to be subjected to mounting processing is preheated through the heating assembly.
According to one aspect of the technical scheme, the ceramic disc conveying track is provided with a refrigerating assembly at the rear end close to the wafer mounting station, so that the ceramic disc provided with the wafer is cooled through the refrigerating assembly.
According to an aspect of the above technical scheme, the polishing manipulator is arranged on an upright column, and the polishing manipulator can move and rotate in multiple degrees of freedom, so that the polishing manipulator can grab and store the ceramic discs with different heights on the ceramic disc storage rack.
According to one aspect of the above technical solution, the wafer polishing system further includes a first liquid preparation device for automatically preparing a polishing mixed liquid and supplying the polishing mixed liquid to the polishing machine.
According to one aspect of the technical scheme, the production line further comprises a ceramic disc cleaning system, and the ceramic disc cleaning system is used for cleaning the ceramic discs which are recycled and conveying the ceramic discs to the ceramic disc conveying track at the front end of the ceramic disc wax pasting system.
According to one aspect of the technical scheme, the ceramic disc cleaning system comprises a plurality of cleaning grooves and cleaning manipulators, the cleaning grooves are used for containing different types of cleaning liquid respectively, the cleaning manipulators are used for grabbing ceramic discs on the ceramic disc storage rack and sequentially placing the ceramic discs in each cleaning groove according to a preset cleaning rule, and the ceramic discs are placed on the ceramic disc conveying track at the front end of the ceramic disc wax pasting system after cleaning.
According to an aspect of the above technical solution, the ceramic tray cleaning system further includes a second liquid preparation device for automatically preparing the first cleaning liquid and supplying the first cleaning liquid to one of the plurality of cleaning tanks, and a third liquid preparation device for preparing the second cleaning liquid and supplying the second cleaning liquid to another one of the plurality of cleaning tanks.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic view of an automatic production line for grinding and polishing a semiconductor wafer according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a ceramic tray wax-pasting system and a ceramic tray conveying track in an automatic semiconductor wafer pasting, grinding and polishing production line according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a wafer polishing system in an automatic semiconductor wafer lapping and polishing production line according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a dewaxing wafer-taking system and a ceramic tray conveying track in an automatic semiconductor wafer polishing line according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a ceramic tray cleaning system and a ceramic tray conveying track in an automatic semiconductor wafer grinding and polishing production line according to an embodiment of the present invention;
description of reference numerals:
the device comprises a wafer 100, a ceramic disc wax pasting system 10, a wax pasting machine 11, a wax pasting mechanical hand 12, a wafer storage device 13, a material box frame 131, a wafer box 132, a reciprocating mechanism 14, a wafer taking mechanical hand 15, a chip pasting mechanical hand 16, a wafer temporary storage platform 17, a preheating assembly 18, a refrigerating assembly 19, a wafer polishing system 20, a polishing machine frame 21, a polishing disc 22, a vertical column 23, a polishing mechanical hand 24, a first liquid distribution device 25, a dewaxing and chip taking system 30, a dewaxing and chip taking machine 31, a dewaxing and chip taking system controller 32, a master control system 40, a ceramic disc conveying rail 50, a ceramic disc 51, a ceramic disc storage frame 52, a ceramic disc cleaning system 60, a first cleaning tank 61, a second cleaning tank 62, a third cleaning tank 63, a fourth cleaning tank 64, a second liquid distribution device 65, a third liquid distribution device 66 and a ceramic disc cleaning system controller 67.
Detailed Description
In order to make the objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. Several embodiments of the invention are presented in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "left," "right," "up," "down," and the like are used for descriptive purposes only and not for purposes of indicating or implying that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Example one
Referring to fig. 1-5, a first embodiment of the present invention provides an automatic production line for polishing and pasting semiconductor wafers, which includes a ceramic disk wax pasting system 10 for pasting wax on a wafer 100, a wafer polishing system 20 for polishing the wafer 100, a dewaxing wafer picking system 30 for peeling off the wafer 100 on a ceramic disk 51, and a general control system 40;
in this embodiment, the ceramic disc wax pasting system 10 includes a wax pasting machine 11, a pick-up robot 15 and a wax pasting robot 12, wherein the pick-up robot 15 is configured to transfer the wafers 100 stored in the wafer storage device 13 into the wax pasting machine 11, the wax pasting robot 12 is configured to transfer the wax pasted wafers 100 in the wax pasting machine 11 to a preset position, paste the wafers 100 placed at the preset position onto the ceramic discs 51 movable along the ceramic disc conveying rails 50 by the pick-up robot 16, and stack the ceramic discs 51 on the ceramic disc conveying rails 50 in the movable ceramic disc storage rack 52 by the ceramic disc stacking mechanism;
specifically, the wax pasting machine 11 comprises a machine table and a wax pasting table top arranged on the machine table, the wax pasting manipulator 12 is arranged on the wax pasting table top, the wafer taking manipulator 15 is arranged on the outer side of the wax pasting table top, the wafer taking manipulator 15 is used for clamping and transferring the wafer 100 stored in a preset mode to the wax pasting table top of the wax pasting machine 11, and wax pasting processing is carried out on the wafer 100 through the work of the wax pasting manipulator 12; after the wax attaching process is performed on the wafer 100, the wax attached wafer 100 temporarily stored in the preset position is clamped and transferred onto the ceramic disc 51 for carrying the wafer 100 by the attaching robot 16 arranged outside the wax attaching table, and the ceramic disc 51 can move along the arrangement path of the ceramic disc conveying track 50 under the driving of the ceramic disc conveying track 50 to connect all the systems of the production line in series to form a closed loop.
In other embodiments, the wax-coated wafer 100 on the wax-coated table surface may be picked up by the wax-coating robot 12 and transferred to the ceramic tray 51 for coating the wafer 100; compared with the previous processing method, the processing method has higher requirement for the synergy between the wax pasting process of the wax pasting machine 11 and the transferring process of the wax pasting mechanical arm 12, and the previous processing method can temporarily store the wafer 100 after the wax pasting process on the wax pasting platform on a preset position, such as on a temporary wafer storage platform 17, by the wax pasting mechanical arm 12, and then the wafer 100 temporarily stored on the temporary wafer storage platform 17 is clamped and transferred and pasted on the ceramic disc 51 by the wax pasting mechanical arm 12.
Wherein, paste wax machine 11 rather than getting piece manipulator 15, paste wax manipulator 12, a set of wax unit of pasting can be constituteed to paster manipulator 16 of corresponding, and in order to promote the production efficiency of this production line, paste the wax unit and can set up multiunit and even setting up in ceramic dish delivery track 50's both sides, but should guarantee that the multiple manipulator of two sets of wax units of pasting can not bump at the during operation, area's problem also should be considered simultaneously, consequently, interval between the adjacent wax unit that sets up should rationally set up.
In order to facilitate the transportation of the ceramic disks, in the present embodiment, the ceramic disks 51 to which the wafers 100 subjected to the wax attaching treatment are attached are transported by the ceramic disk transport rails 50, and are stacked in a predetermined manner at a predetermined position by a ceramic disk stacking mechanism, and the stacked ceramic disks 51 are transported in a unified manner after a certain number of ceramic disks are stacked.
Specifically, a ceramic disc stacking mechanism is arranged at an output intersection position of the ceramic discs 51 on the ceramic disc conveying track 50 among the multiple groups of wax sticking units, the ceramic discs 51 output by the multiple groups of wax sticking units are stacked in a ceramic disc storage rack 52 through the ceramic disc stacking mechanism, and the ceramic disc storage rack 52 is provided with a plurality of storage grids for storing the ceramic discs respectively, so that the ceramic discs 51 and the wafers 100 stuck on the ceramic discs 51 can be prevented from colliding. In the present embodiment, the ceramic disk storage rack 52 is provided on the ceramic disk conveying rail 50, and is driven by the ceramic disk conveying rail 50 to move along the arrangement path.
After the wax attaching process and the chip attaching process are performed on the wafer 100, the wafer 100 attached on the ceramic disc 51 and subjected to the wax attaching process needs to be polished, therefore, in the embodiment, the wafer polishing system 20 for polishing the wafer 100 is disposed at the rear end of the ceramic disc wax attaching system 10, that is, the wafer polishing system 20 is disposed in a downstream process of the ceramic disc wax attaching system 10, and in order to improve the transfer efficiency before and after polishing the wafer 100, the wafer polishing system 20 is disposed outside the ceramic disc conveying track 50.
In the present embodiment, the wafer polishing system 20 includes a polishing machine and a ceramic disc robot, the polishing robot 24 is configured to grasp the ceramic discs 51 in the ceramic disc storage rack 52, transfer the ceramic discs 51 onto the polishing discs 22 of the polishing machine to polish the wafers 100 by the polishing machine, and grasp the ceramic discs 51 with the polished wafers 100 attached thereto and place them in the ceramic disc storage rack 52;
specifically, the polishing machine is provided with a polishing frame 21, a clamping assembly arranged on the frame and used for clamping a ceramic disc 51, and a polishing assembly used for polishing a wafer 100 on the ceramic disc, wherein the clamping assembly can be provided with a plurality of groups and respectively used for clamping one ceramic disc 51, and the polishing assembly can be provided with a group and respectively used for polishing the wafer 100 on the ceramic disc 51 clamped by the clamping assembly, and can also be correspondingly provided with a plurality of groups of polishing assemblies; preferably, the clamping assembly is provided with a plurality of sets, and the polishing assembly is provided with only one set.
After the polishing process is performed on the wafer 100 on the ceramic disc 51 by the polishing machine, the ceramic disc on the clamping assembly is grabbed by the ceramic disc manipulator, and the ceramic disc 51 is placed in the ceramic disc storage rack 52 again according to the preset rule.
When polishing the wafer 100, in order to improve the polishing efficiency and the polishing quality, in this embodiment, the wafer polishing system 20 further includes a first liquid preparation device 25 for automatically preparing a polishing mixed liquid and supplying the polishing mixed liquid to the polishing machine, and the first liquid preparation device is fixedly disposed at an upper position and a lower position of the polishing assembly in the polishing machine, and is mainly used for mixing and preparing the polishing mixed liquid and the alkaline solution in a certain proportion, producing the polishing mixed liquid meeting the requirements, pumping the polishing mixed liquid into the corresponding polishing machine through a delivery pipe, using the waste liquid without the polishing effect, and discharging the waste liquid to a drainage ditch on the ground through an automatic switch valve to enter a sewage pipeline for environmental protection treatment.
After the wafer 100 is polished, the wafer 100 attached to the ceramic disc 51 needs to be peeled off until the wafer 100 is separated from the ceramic disc 51, so as to facilitate the processing of the wafer 100 (for example, wafer dewaxing 100) and the storage or reuse of the ceramic disc 51 in the subsequent processes, in this embodiment, a dewaxing pick-up system 30 for peeling the wafer 100 on the ceramic disc is disposed at the rear end of the wafer polishing system 20, that is, the dewaxing pick-up system 30 is disposed in the downstream process of the wafer polishing system 20, and in order to improve the transfer efficiency before and after dewaxing pick-up, the dewaxing pick-up system 30 is disposed at the outer side of the ceramic disc conveying track 50.
In this embodiment, the dewaxing wafer taking system 30 includes a dewaxing wafer taking machine 31 and a dewaxing robot, the dewaxing robot is configured to grasp the ceramic discs 51 in the ceramic disc storage rack 52, move the ceramic discs 51 into the dewaxing wafer taking machine 31, peel off the wafers 100 attached to the surfaces of the ceramic discs 51 by the dewaxing wafer taking machine 31, and grasp the separated ceramic discs 51 by the dewaxing robot and place the ceramic discs in the ceramic disc storage rack 52.
Specifically, the dewaxing robot is configured to grasp the ceramic disc 51 on which the wafer 100 is stuck and stored in the ceramic disc storage rack 52, transfer the ceramic disc 51 into the dewaxing wafer extractor 31, and peel off the wafer 100 on the ceramic disc 51 by a dewaxing wafer extracting assembly of the dewaxing wafer extractor 31, thereby separating the ceramic disc 51 from the wafer 100; and automatically loading the wafer 100 into the wafer cassette 132 and the ceramic disks 51 into the ceramic disk storage rack 52 after the ceramic disks 51 are separated from the wafer 100; specifically, the dewaxing and slide extracting system 30 is controlled by a dewaxing and slide extracting system controller 32.
In summary, the automatic production line for semiconductor wafer grinding and polishing shown in the embodiment has the following beneficial effects:
by arranging a ceramic disc conveying track 50 penetrating through the production line, the ceramic disc conveying track 50 is used for conveying ceramic discs 51 participating in system processing, firstly, a ceramic disc wax pasting system 10 can be used for carrying out chip taking, wax pasting and chip pasting on wafers 100 which are stored in advance, so that the waxed wafer 100 can be attached to the surface of the ceramic disc 51, and then the wafer 100 stored in the ceramic disc storage rack 52 is grabbed by the wafer polishing system 20 and the wafer 100 on the ceramic disc 51 is polished, and the wafer 100 on the ceramic disc 51 is peeled off by the dewaxing wafer-taking system 30 after the polishing process is performed on the wafer 100 on the ceramic disc 51, thereby facilitating further processing of the wafer 100 and storage or recycling of the ceramic disks 51, therefore, in the present embodiment, the wafer 100 and the ceramic disc 51 that pass through the processes before and after the production line are not manually transported, and the cooperative operation of the systems in the production line can also contribute to the improvement of the production efficiency.
Example two
Referring to fig. 1-5 again, a second embodiment of the present invention provides an automatic production line for polishing and pasting semiconductor wafers, in which mechanical devices of various systems are mainly improved, so that the cooperative operation of the system components can be smoother and more efficient.
In this embodiment, the wafer storage device 13 includes a wafer cassette 132 for storing the wafer 100 and a cassette rack 131 for storing the wafer cassette 132, the pick-up robot 15 is disposed between the cassette rack 131 and the material supply position of the wax-applying machine 11, and the wafer cassette 132 is placed between the cassette rack 131 and the material supply position by the pick-up robot 15 in a circulating manner. The number of the wafer storage devices 13 is equal to the number of the wax attaching machines 11, and when the number of the wax attaching machines 11 is plural, that is, when a plurality of wax attaching units are provided, each of the wafer storage devices 13 is opposite to each of the wax attaching machines 11, the pick-up robot 15 is movable between the plurality of wafer storage devices 13 and the plurality of wax attaching machines 11 through a reciprocating mechanism 14, so as to drive the pick-up robot 15 to reciprocate between the plurality of wafer storage devices 13 and the plurality of wax attaching machines 11 through the reciprocating mechanism 14.
Specifically, the magazine rack 131 is a frame structure and has multiple layers, each layer has multiple storage locations, and the wafer cassettes 132 are stored in the storage locations of the magazine rack 131; when the number of the wax sticking machines 11 is two, namely, when the number of the wax sticking units is two, the sheet taking mechanical arm 15 is arranged on a reciprocating mechanism 14 and comprises a track and a driving mechanism, the sheet taking mechanical arm 15 is movably arranged on the track and is driven by the driving mechanism to reciprocate, so that the two sets of the wax sticking units are simultaneously taken by one sheet taking mechanical arm 15, and the sheet taking rhythm is reasonably set; for example, when the wax pasting machine 11 in one set of wax pasting units pastes wax on the wafer 100, the driving mechanism drives the pick-up robot 15 to move along the track to a position between the wax pasting machine 11 and the wafer storage device 13 in the other set of wax pasting units, so that the pick-up robot 15 clamps and transfers the wafer cassette 132 stored in the magazine rack 131 to a preparation station of the wax pasting machine 11, and the wax pasting robot 12 on the wax pasting table surface takes out and places the wafer 100 in the wafer cassette 132 on the wax pasting table surface, thereby facilitating the wax pasting process on the wafer 100.
In order to improve the efficiency of sticking wax on the ceramic disc to the wafer 100, the ceramic disc conveying track 50 is provided with a preheating assembly 18 at the front end close to the wafer 100 sticking station, so that the ceramic disc to be subjected to sticking processing is preheated by the preheating assembly 18, after the ceramic disc reaches a certain temperature, the ceramic disc conveying track 50 drives the ceramic disc to move to the sticking station, and at the moment, the wafer 100 stored in a preset position is stuck to the surface of the preheated ceramic disc by the sticking manipulator 16, so that the wafer 100 and the ceramic disc are combined into a whole. In addition, the ceramic disk conveying track 50 is provided with a refrigerating assembly 19 at the rear end close to the wafer 100 mounting station, so that the ceramic disk to which the wafer 100 is attached is cooled by the refrigerating assembly 19, after the wafer 100 and the ceramic disk are lowered to a certain temperature, the ceramic disk conveying track 50 can continue to convey the ceramic disk to the preparation station of the ceramic disk stacking mechanism, and the ceramic disk stacking mechanism stacks the cooled wafer 100 and the ceramic disk in the ceramic disk storage rack 52 according to a preset stacking rule.
In the wafer polishing system 20, the polishing robot 24 is disposed on a column, and the polishing robot 24 can move and rotate in a plurality of degrees of freedom, that is, can move horizontally in a horizontal plane, move in a vertical plane, and rotate 360 ° at any position, so as to grasp the ceramic disks stored at different heights on the ceramic disk storage rack 52 by the polishing robot 24.
In the preferred embodiment of the present invention, after the ceramic disks are separated, in order to facilitate recycling of the ceramic disks, the production line further includes a ceramic disk cleaning system 60 for cleaning the recycled ceramic disks and conveying the cleaned ceramic disks onto the ceramic disk conveying rail 50 at the front end of the ceramic disk wax-pasting system 10.
Specifically, the ceramic tray cleaning system 60 includes a plurality of cleaning tanks and a cleaning robot, wherein the plurality of cleaning tanks can be arranged side by side on a cleaning cabinet, and include a first cleaning tank 61, a second cleaning tank 62, a third cleaning tank 63 and a fourth cleaning tank 64, and the plurality of cleaning tanks are respectively used for accommodating different types of cleaning solutions, such as a dewaxing agent, a cleaning agent and the like, so as to remove wax chips and impurities remained on the surface of the ceramic tray; the cleaning robot (not shown) is configured to grab the ceramic discs on the ceramic disc storage rack 52 and sequentially place the ceramic discs in each cleaning tank according to a preset cleaning rule, for example, firstly, the ceramic discs need to be dewaxed, then the ceramic discs are grabbed and placed in the first cleaning tank 61 in which the dewaxing agent is stored by the cleaning robot, after the dewaxing is completed, the ceramic discs are taken out and placed in the next second cleaning tank 62 in which the cleaning agent is stored by the cleaning robot, and the remaining third cleaning tank 63 and the remaining fourth cleaning tank 64 are respectively used for solute purified water, and after the cleaning, the ceramic discs are placed on the ceramic disc conveying track 50 at the front end of the ceramic disc wax attaching system 10.
Wherein the ceramic tray cleaning system 60 further comprises a second liquid preparation device 65 and a third liquid preparation device 66, the second liquid preparation device 65 is used for automatically preparing the first cleaning liquid and supplying the first cleaning liquid to one of the plurality of cleaning tanks, namely, figure 64, and the second liquid preparation device 65 is used for preparing the second cleaning liquid and supplying the second cleaning liquid to the other one of the plurality of cleaning tanks, namely, figure 63; specifically, the ceramic disk cleaning system 60 is controlled by a ceramic disk cleaning system controller 67.
In other possible embodiments of the present invention, the ceramic tray cleaning system 60 further includes an air drying assembly or baking unit for removing the residual cleaning agent on the surface of the ceramic tray, and the cleaning robot clamps the ceramic tray and performs an air drying or baking process, so as to quickly remove the cleaning agent or purified water remaining on the surface of the ceramic tray, and after the removal, the ceramic tray is returned to the ceramic tray conveying track 50 to participate in the circulation of the next cycle of the mounting, polishing and picking.
In summary, the automatic production line for semiconductor wafer polishing in the embodiment has the following advantages:
by arranging a ceramic disc conveying track 50 penetrating through the production line, the ceramic disc conveying track 50 is used for conveying ceramic discs 51 participating in system processing, firstly, a ceramic disc wax pasting system 10 can be used for carrying out chip taking, wax pasting and chip pasting on wafers 100 which are stored in advance, so that the waxed wafer 100 can be attached to the surface of the ceramic disc 51, and then the wafer 100 stored in the ceramic disc storage rack 52 is grabbed by the wafer polishing system 20 and the wafer 100 on the ceramic disc 51 is polished, and the wafer 100 on the ceramic disc 51 is peeled off by the dewaxing wafer-taking system 30 after the polishing process is performed on the wafer 100 on the ceramic disc 51, thereby facilitating further processing of the wafer 100 and storage or recycling of the ceramic disks 51, therefore, in the present embodiment, the wafer 100 and the ceramic disc 51 that pass through the processes before and after the production line are not manually transported, and the cooperative operation of the systems in the production line can also contribute to the improvement of the production efficiency.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A semiconductor wafer pastes to grind and throws the automatic production line, characterized by that, the said production line includes the wax system of ceramic disc pasting, wafer polishing system, dewaxing and fetches the system and total control system;
the ceramic disc wax pasting system comprises a wax pasting machine, a chip taking manipulator and a wax pasting manipulator, wherein the chip taking manipulator is used for transferring wafers stored in a wafer storage device into the wax pasting machine, the wax pasting manipulator is used for transferring the wafers which are pasted with wax in the wax pasting machine to a preset position, the wafers placed at the preset position are pasted to ceramic discs which can move along a ceramic disc conveying track through the chip taking manipulator, and the ceramic discs on the ceramic disc conveying track are stacked in a movable ceramic disc storage rack through a ceramic disc stacking mechanism;
the wafer polishing system comprises a polishing machine and a ceramic disc manipulator, wherein the polishing manipulator is used for grabbing ceramic discs in the ceramic disc storage rack, transferring the ceramic discs to the polishing discs of the polishing machine to polish wafers through the polishing machine, and grabbing and placing the ceramic discs attached with polished wafers in the ceramic disc storage rack;
the dewaxing wafer taking system comprises a dewaxing wafer taking machine and a dewaxing manipulator, wherein the dewaxing manipulator is used for grabbing ceramic discs in the ceramic disc storage rack, moving the ceramic discs into the dewaxing wafer taking machine so as to peel off wafers attached to the surfaces of the ceramic discs through the dewaxing wafer taking machine, and grabbing separated ceramic discs through the dewaxing manipulator to be placed in the ceramic disc storage rack.
2. The automatic production line for grinding and polishing semiconductor wafers as claimed in claim 1, wherein the wafer storage device comprises a wafer box for storing wafers and a magazine rack for storing the wafer box, the wafer taking manipulator is arranged between the magazine rack and a material supply position of the wax pasting machine, and the wafer box is placed between the magazine rack and the material supply position in a circulating manner through the wafer taking manipulator.
3. The automatic production line for grinding and polishing semiconductor wafers as claimed in claim 2, wherein the number of the wafer storage devices is equal to the number of the wax attaching machines, and when the number of the wax attaching machines is plural, each wafer storage device is opposite to the position of each wax attaching machine, and the pick-up robot moves between the plurality of wafer storage devices and the plurality of wax attaching machines through a reciprocating mechanism so as to drive the pick-up robot to reciprocate between the plurality of wafer storage devices and the plurality of wax attaching machines through the reciprocating mechanism.
4. The automatic production line for grinding and polishing semiconductor wafers as claimed in claim 1, wherein the ceramic tray conveying track is provided with a heating assembly at a front end near the wafer mounting station, so as to preheat the ceramic tray to be mounted with the ceramic tray by the heating assembly.
5. The automatic production line for grinding and polishing semiconductor wafers as claimed in claim 4, wherein the ceramic tray conveying track is provided with a cooling component at a rear end near the wafer mounting station, so as to cool the ceramic tray on which the wafer is mounted by the cooling component.
6. The automatic production line for grinding and polishing semiconductor wafers as claimed in claim 1, wherein the polishing robot is disposed on a column, and the polishing robot can move and rotate in multiple degrees of freedom to grasp the ceramic disks stored on the ceramic disk storage rack at different heights by the polishing robot.
7. The automatic production line for pasting, grinding and polishing semiconductor wafers as claimed in claim 1, wherein the wafer polishing system further comprises a first liquid preparation device for automatically preparing and supplying a polishing mixture to the polishing machine.
8. The automatic production line for pasting, grinding and polishing semiconductor wafers as claimed in any one of claims 1 to 7, further comprising a ceramic disk cleaning system for cleaning and conveying recycled ceramic disks onto the ceramic disk conveying rail at the front end of the ceramic disk waxing system.
9. The automatic production line for bonding, grinding and polishing semiconductor wafers as claimed in claim 8, wherein the ceramic tray cleaning system comprises a plurality of cleaning tanks and a cleaning robot, the cleaning tanks are respectively used for containing different types of cleaning solutions, the cleaning robot is used for grabbing the ceramic trays on the ceramic tray storage rack and sequentially placing the ceramic trays in each cleaning tank according to a preset cleaning rule, and placing the ceramic trays on the ceramic tray conveying track at the front end of the ceramic tray wax bonding system after cleaning.
10. The automatic production line for polishing and grinding semiconductor wafers as claimed in claim 9, wherein the cleaning system further comprises a second liquid preparation device and a third liquid preparation device, the second liquid preparation device is used for automatically preparing the first cleaning liquid and supplying the first cleaning liquid to one of the plurality of cleaning tanks, and the second liquid preparation device is used for preparing the second cleaning liquid and supplying the second cleaning liquid to another one of the plurality of cleaning tanks.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210652531.3A CN114883226A (en) | 2022-06-09 | 2022-06-09 | Automatic production line for grinding and polishing semiconductor wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210652531.3A CN114883226A (en) | 2022-06-09 | 2022-06-09 | Automatic production line for grinding and polishing semiconductor wafer |
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| CN114883226A true CN114883226A (en) | 2022-08-09 |
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| CN202210652531.3A Pending CN114883226A (en) | 2022-06-09 | 2022-06-09 | Automatic production line for grinding and polishing semiconductor wafer |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115415913A (en) * | 2022-08-16 | 2022-12-02 | 上海汉虹精密机械有限公司 | Automatic production line for single-side polishing of silicon carbide wafers |
| CN117457548A (en) * | 2023-12-22 | 2024-01-26 | 北京特思迪半导体设备有限公司 | Wafer paster device and wafer waxless polishing feeding equipment |
-
2022
- 2022-06-09 CN CN202210652531.3A patent/CN114883226A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115415913A (en) * | 2022-08-16 | 2022-12-02 | 上海汉虹精密机械有限公司 | Automatic production line for single-side polishing of silicon carbide wafers |
| CN117457548A (en) * | 2023-12-22 | 2024-01-26 | 北京特思迪半导体设备有限公司 | Wafer paster device and wafer waxless polishing feeding equipment |
| CN117457548B (en) * | 2023-12-22 | 2024-03-22 | 北京特思迪半导体设备有限公司 | Wafer paster device and wafer waxless polishing feeding equipment |
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