CN114872971B - Automatic bonding and edge-wrapping system for golden finger high-temperature adhesive tape - Google Patents
Automatic bonding and edge-wrapping system for golden finger high-temperature adhesive tape Download PDFInfo
- Publication number
- CN114872971B CN114872971B CN202210593563.0A CN202210593563A CN114872971B CN 114872971 B CN114872971 B CN 114872971B CN 202210593563 A CN202210593563 A CN 202210593563A CN 114872971 B CN114872971 B CN 114872971B
- Authority
- CN
- China
- Prior art keywords
- pcb
- golden finger
- adhesive tape
- temperature adhesive
- linear module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 82
- 230000007246 mechanism Effects 0.000 claims abstract description 82
- 238000010030 laminating Methods 0.000 claims description 45
- 230000005540 biological transmission Effects 0.000 claims description 43
- 238000003825 pressing Methods 0.000 claims description 21
- 230000033001 locomotion Effects 0.000 claims description 10
- 230000000712 assembly Effects 0.000 claims description 7
- 238000000429 assembly Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 230000001360 synchronised effect Effects 0.000 claims description 5
- 238000007688 edging Methods 0.000 claims 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B33/00—Packaging articles by applying removable, e.g. strippable, coatings
- B65B33/02—Packaging small articles, e.g. spare parts for machines or engines
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Abstract
The invention discloses an automatic bonding and edge-covering system for a golden finger high-temperature adhesive tape, which is used for bonding the high-temperature adhesive tape to a golden finger part on a PCB (printed circuit board), and comprises a workbench and an edge-covering device, wherein the edge-covering device comprises a main body fixing plate, the main body fixing plate is fixedly connected with the workbench, the edge-covering device is used for bonding the high-temperature adhesive tape to the other surface of the golden finger of the PCB, by arranging an edge-covering assembly, a set of high-temperature adhesive tape bonding mechanism can bond the upper surface and the lower surface of the golden finger of the PCB simultaneously, a vertical adjusting cylinder is arranged, the vertical direction height of the edge-covering assembly can be adjusted, and interference between the edge-covering assembly and other equipment is prevented.
Description
Technical Field
The invention relates to a packaging system of a PCB (printed circuit board), in particular to an automatic bonding and edge-wrapping system of a high-temperature adhesive tape of a golden finger.
Background
The golden finger part is protected by a high-temperature adhesive tape, the high-temperature adhesive tape of the current golden finger part is manually stuck, the manual sticking efficiency is low, the sticking position is not uniform, the automatic sticking device is easy to appear, but the high-temperature adhesive tape sticking mechanism is adopted in the prior art to stick the golden finger parts on the upper and lower surfaces of the PCB respectively because of the fact that the chemical agents such as soldering flux and the like which are permeated in the process or the welding position are offset and the like in the production process of the hardware, the device is relatively complex, and the cost is relatively high.
Disclosure of Invention
The invention provides an automatic bonding and edge-covering system for gold finger high-temperature adhesive tapes, which is used for solving the problems that in the prior art, two sets of high-temperature adhesive tape bonding mechanisms are adopted to bond gold fingers on the upper surface and the lower surface of a PCB respectively, equipment is complex, and cost is high.
According to one aspect of the invention, an automatic bonding and edge covering system for a golden finger high-temperature adhesive tape is provided, which is used for bonding the high-temperature adhesive tape to a golden finger part on a PCB, and comprises a workbench, a supporting mechanism, a PCB conveying device and an edge covering device;
the PCB transmission device is fixedly arranged on the workbench and used for transmitting and fixing the PCB;
the device of borduring sets up in PCB board transmission device's below and with workstation fixed connection, the device of borduring includes:
the main body fixing plate is fixedly connected with the workbench;
the edge covering assembly comprises an edge covering Bian Qigang, a roller bracket, an edge covering wheel and an upward pressing positioning wheel, wherein a cylinder body of an edge covering cylinder is fixedly connected with a main body fixing plate, a piston rod of the edge covering cylinder is fixedly connected with the roller bracket, the edge covering wheel is fixed on the upper part of the roller bracket and is close to the direction of a golden finger, the upward pressing positioning wheel is fixed on the roller bracket and is positioned below the edge covering wheel, and the edge covering assembly can do telescopic motion towards the direction of the golden finger under the driving of the edge covering cylinder;
the supporting mechanism comprises a supporting cylinder and a supporting piece, a cylinder body of the supporting cylinder is fixedly connected with the main body fixing plate, a piston rod of the supporting cylinder is fixedly connected with the supporting piece, the piston rod of the supporting cylinder can drive the supporting piece to move up and down along the vertical direction, and the supporting mechanism is used for supporting the PCB.
Further, the subassembly of borduring still includes vertical adjustment cylinder, and vertical adjustment cylinder sets up between borduring cylinder and main part fixed plate, and the piston rod of vertical adjustment cylinder and the cylinder body fixed connection of borduring cylinder, the cylinder body of vertical adjustment cylinder and main part fixed plate fixed connection, vertical adjustment cylinder are used for controlling the position of subassembly in the vertical direction of borduring.
Further, the two groups of the edge wrapping assemblies are symmetrically arranged.
Further, the automatic bonding and edge covering system of the golden finger high-temperature adhesive tape further comprises camera equipment, and the camera equipment is used for shooting the position of the PCB.
Further, the automatic bonding system of borduring of golden finger high temperature sticky tape still includes first straight line module, and first straight line module sets up between vertical adjustment cylinder and main part fixed plate, and first straight line module and main part fixed plate fixed connection, vertical adjustment cylinder are fixed to be set up on the slip table of first straight line module, and first straight line module is hold-in range straight line module, including first step motor, first lead screw, first slip table and first guide rail, first step motor is used for driving first lead screw and rotates, and first lead screw drives first slip table reciprocating motion on first guide rail.
Further, the automatic bonding and edge covering system of the golden finger high-temperature adhesive tape further comprises a second linear module, the second linear module is arranged between the first linear module and the main body fixing plate, the second linear module is perpendicular to the first linear module, the first linear module is fixedly arranged on a sliding table of the second linear module, and the second linear module is used for driving the first linear module to reciprocate along the direction perpendicular to the two sides of the golden finger of the PCB.
Further, the second linear module is a synchronous belt linear module and comprises a second stepping motor, a second screw rod, a second sliding table and a second guide rail, wherein the second stepping motor is used for driving the second screw rod to rotate, and the second screw rod drives the second sliding table to reciprocate on the second guide rail.
Further, the automatic bonding and edge-wrapping system of the golden finger high-temperature adhesive tape further comprises a waiting station and a finishing station, wherein the waiting station and the finishing station are symmetrically arranged on two sides of the PCB conveying device and used for placing and conveying the PCB to be bonded, and the finishing station is used for placing and conveying the PCB to be bonded.
Further, the taping wheel is made of a flexible material.
Further, the automatic bonding system of borduring of golden finger high temperature sticky tape still includes laminating device, laminating device sets up in PCB board transmission device's top for paste high temperature sticky tape to PCB board golden finger position, laminating device includes laminating actuating mechanism and high temperature sticky tape laminating mechanism, laminating actuating mechanism sets up on the workstation, high temperature sticky tape laminating mechanism and laminating actuating mechanism fixed connection, laminating actuating mechanism is used for driving high temperature sticky tape laminating mechanism and moves in three-dimensional space, high temperature sticky tape laminating mechanism sets up in PCB board transmission device's top, high temperature sticky tape laminating mechanism is used for pasting high temperature sticky tape to PCB board golden finger position.
The invention has the beneficial effects that:
after the high-temperature adhesive tape is attached to the upper surface or the lower surface of the golden finger of the PCB by the high-temperature adhesive tape attaching assembly, part of the high-temperature adhesive tape leaks out of the golden finger, when the driving edge wrapping assembly of the edge wrapping cylinder moves towards the golden finger direction, the upper pressing positioning wheel in the edge wrapping assembly reversely folds the high-temperature adhesive tape outside the golden finger, the PCB is clamped between the edge wrapping wheel and the upper pressing positioning wheel along with the continuous movement of the edge wrapping wheel and the upper pressing positioning wheel, and the reversely folded high-temperature adhesive tape is pressed to the other surface of the golden finger of the PCB and is attached to the other surface of the golden finger of the PCB. Through setting up the subassembly of borduring, realized that a set of high temperature sticky tape laminating mechanism can paste upper and lower two sides of PCB board golden finger simultaneously, simplified equipment, the cost is reduced.
The vertical adjusting cylinder is arranged, the height of the vertical direction of the edge covering assembly can be adjusted, when the edge covering assembly does not work, the vertical adjusting cylinder contracts, the edge covering assembly is pulled downwards, the high-temperature adhesive tape attaching mechanism is far away, the edge covering assembly and other equipment are prevented from interfering, after the PCB is fixed in position, the vertical adjusting cylinder stretches out, the edge covering assembly is pushed upwards, and the edge covering assembly is sent to a working position.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention. In the drawings:
FIG. 1 is a schematic perspective view of an automatic bonding and taping system for a golden finger according to an embodiment of the present invention;
FIG. 2 is a schematic perspective view of an edge covering device according to an embodiment of the present invention;
FIG. 3 is a top view of a feed structure according to one embodiment of the invention;
in the figure: A-PCB feeding direction; 1-a workbench; 2-a PCB board transmission device; 3-attaching device; 31-a double-guide rail gantry linear module; 32-a high-temperature adhesive tape attaching mechanism; 4-edge covering device; 41-an edge-covering assembly; 411-pack Bian Qigang; 412-a roller bracket; 413-edge rollers; 414-pressing the positioning wheel; 415-vertical adjustment cylinder; 42-a first linear module; 43-a second linear module; 44-a body securing plate; 5-waiting for a station; 51-waiting station drive motor; 6-a laminating station; 61-a laminating station driving motor; 7-finishing a station; 71-finishing a station driving motor; 8-an adjusting mechanism.
Detailed Description
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The invention will be described in detail below with reference to the drawings in connection with embodiments.
It is noted that all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs unless otherwise indicated.
In the present invention, unless otherwise indicated, terms of orientation such as "upper, lower, top, bottom" are used generally with respect to the orientation shown in the drawings or with respect to the component itself in the vertical, upright or gravitational direction; also, for ease of understanding and description, "inner and outer" refers to inner and outer relative to the profile of each component itself, but the above-mentioned orientation terms are not intended to limit the present invention.
According to one aspect of the invention, there is provided an automatic bonding and taping system for a golden finger high-temperature adhesive tape, which is used for bonding the high-temperature adhesive tape to a golden finger part on a PCB, the automatic bonding and taping system for the golden finger high-temperature adhesive tape comprises a workbench 1, a PCB conveying device 2, a bonding device 3 and a taping device 4, the PCB conveying device 2 is used for automatically conveying a PCB on a bonding station 6, and the PCB conveying device 2 is arranged on the workbench 1 and is positioned below the bonding device 3;
the upper part of the workbench 1 is provided with a horizontal workbench surface.
The attaching device 3 includes;
the high-temperature adhesive tape laminating assembly comprises a laminating driving mechanism and a high-temperature adhesive tape laminating mechanism 32, wherein the laminating driving mechanism can be a double-guide rail gantry linear module 31, the double-guide rail gantry linear module 31 is fixedly arranged on the table top of the workbench 1, the high-temperature adhesive tape laminating mechanism 32 is vertically downwards fixed on a sliding table of the double-guide rail gantry linear module 31, the double-guide rail gantry linear module 31 comprises a vertical linear module and a parallel linear module, the vertical linear module is fixedly arranged on the table top of the workbench 1, the vertical linear module comprises two linear guide rails perpendicular to the feeding direction A of a PCB, each linear guide rail is provided with at least one sliding table, the parallel linear module is fixed on the sliding tables of the two linear guide rails of the vertical linear module, the parallel linear module is parallel to the feeding direction A of the PCB, the parallel linear module can slide along the two linear guide rails of the vertical linear module, the high-temperature adhesive tape laminating mechanism 32 is vertically downwards fixed on the sliding tables of the parallel linear module, the laminating driving mechanism 32 is used for driving the high-temperature adhesive tape laminating mechanism 32 to move in a two-dimensional space, and the high-temperature adhesive tape laminating mechanism 32 is arranged above the conveying device 2 for laminating the high-temperature adhesive tape on the PCB;
the PCB board transmission device 2 is arranged on the table top of the workbench 1 and is located below the high-temperature adhesive tape attaching mechanism 32, the PCB board transmission device 2 comprises two transmission supporting frames which are arranged in parallel, two belt transmission mechanisms and a motor, the opposite sides of the two transmission supporting frames are respectively provided with the belt transmission mechanisms, the motor drives the belt transmission mechanisms to rotate, the PCB board is transmitted forwards, the motor is preferably a servo motor, and the servo motor can accurately transmit the PCB board to a preset position.
Preferably, the corresponding positions of the two parallel transmission supporting frames are respectively provided with a PCB fixing mechanism, the PCB fixing mechanism comprises a pressing plate and a fixing cylinder, the cylinder body of the fixing cylinder is fixedly connected with the transmission supporting frames, the pressing plate is fixedly connected with a piston rod of the fixing cylinder, the stretching of the fixing cylinder drives the pressing plate to compress or loosen the PCB, after the PCB is transmitted to the position by the belt transmission mechanism, the servo motor stops rotating, the fixing cylinder contracts to drive the pressing plate to compress the PCB, the high-temperature adhesive tape attaching assembly attaches the high-temperature adhesive tape to the PCB, after the high-temperature adhesive tape is attached, the fixing cylinder stretches out to drive the pressing plate to loosen the PCB, the servo motor continues to rotate to drive the belt transmission mechanism to move, and accordingly the PCB is driven to continue to move forwards, so that a space is reserved for attaching the high-temperature adhesive tape next time.
The edge covering device 4 is arranged below the PCB board transmission device 2, and the edge covering device 4 comprises;
the main body fixing plate 44, the main body fixing plate 44 may be a single part, and if the main body fixing plate 44 is a single part, the main body fixing plate 44 is fixedly connected with the workbench 1, and the main body fixing plate 44 may also be a part of the workbench 1;
the edge covering assembly 41 is located below the PCB fixing mechanism and is located on one side of the direction of the golden finger of the PCB, the edge covering assembly 41 comprises an edge covering Bian Qigang, a roller bracket 412, an edge covering wheel 413, an upper pressing positioning wheel 414 and a vertical adjusting cylinder 415, the vertical adjusting cylinder 415 is arranged between the edge covering cylinder 411 and a main body fixing plate 44, a cylinder body of the vertical adjusting cylinder 415 is fixedly connected with the main body fixing plate 44, a piston rod of the vertical adjusting cylinder 415 is fixedly connected with the cylinder body of the edge covering cylinder 411, the vertical adjusting cylinder 415 is used for controlling the edge covering assembly 41 to be at the position in the vertical direction, a piston rod of the edge covering cylinder 411 is fixedly connected with the roller bracket 412, the edge covering wheel 413 is fixed on the upper portion of the roller bracket 412 and is close to the direction of the golden finger, the upper pressing positioning wheel 414 is fixed on the roller bracket 412 and located below the edge covering wheel 413, and the edge covering assembly 41 can stretch and move towards the direction of the golden finger under the driving of the edge covering cylinder 411.
After the high-temperature adhesive tape is adhered to the upper surface or the lower surface of the golden finger of the PCB by the high-temperature adhesive tape adhering component, part of the high-temperature adhesive tape leaks out of the golden finger, when the driving edge covering component 41 of the edge covering air cylinder 411 moves towards the golden finger direction, the upper pressure positioning wheel 414 in the edge covering component 41 reversely folds the high-temperature adhesive tape outside the golden finger, and the PCB is clamped between the edge covering wheel 413 and the upper pressure positioning wheel 414 along with the continuous movement of the edge covering wheel 413 and the upper pressure positioning wheel 414, and the reversely folded high-temperature adhesive tape is pressed to the other surface of the golden finger of the PCB and is adhered to the other surface of the golden finger of the PCB. By arranging the edge covering assembly 41, the upper surface and the lower surface of the PCB golden finger can be simultaneously pasted by the high-temperature adhesive tape pasting mechanism 32, equipment is simplified, and cost is reduced.
The vertical adjustment cylinder 415 is arranged, the height of the edge covering component 41 in the vertical direction can be adjusted, when the edge covering component 41 does not work, the vertical adjustment cylinder 415 contracts, the edge covering component 41 is pulled downwards, the high-temperature adhesive tape attaching mechanism 32 is far away, the edge covering component 41 and other devices are prevented from being interfered, after the PCB is fixed in position, the vertical adjustment cylinder 415 stretches out, the edge covering component 41 is pushed upwards, and the edge covering component 41 is sent to a working position.
Further, the two sets of edge wrapping assemblies 41 are symmetrically arranged, and after the PCB board is fixed, the two sets of edge wrapping assemblies are respectively located at two sides of the PCB board, and each set of edge wrapping assemblies is located at one side.
When the two sides of the PCB are provided with the golden finger parts, the high-temperature adhesive tape needs to be pasted, or when the PCB is provided with the high-temperature adhesive tape only on one side, but when the two boards are spliced together, the two sides are provided with the golden finger parts, the high-temperature adhesive tape needs to be pasted, and the two groups of edge-covering assemblies 41 are arranged, so that the working efficiency can be improved, and the yield can be improved.
Further, the high temperature adhesive tape attaching mechanism 32 further includes an image pickup apparatus for photographing a position of the PCB board, and the image pickup apparatus may be disposed on the high temperature adhesive tape attaching mechanism 32, or the image pickup apparatus may be disposed above the PCB board fixing mechanism alone, as long as the image pickup apparatus can clearly photograph the position of the PCB board.
The camera shooting device shoots the actual fixed position of the PCB and sends graphic data to the central processing unit, the central processing unit compares the actual position of the PCB with the standard position of the preset position, and when the actual fixed position of the PCB deviates from the preset standard position, the central processing unit calculates the actual distance of the deviation and controls the laminating device 3 to make compensation movement, and the high-temperature adhesive tape laminating mechanism 32 is conveyed to the correct position to prepare for laminating the high-temperature adhesive tape.
Further, the automatic bonding and edge covering system for the golden finger high-temperature adhesive tape further comprises a first linear module 42, the first linear module 42 is arranged between the vertical adjustment cylinder 415 and the main body fixing plate 44, the first linear module 42 is fixedly connected with the main body fixing plate 44, the vertical adjustment cylinder 415 is fixedly arranged on a sliding table of the first linear module 42, and the first linear module 42 is used for driving the edge covering assembly 41 to reciprocate along the vertical direction with the feeding direction A of the PCB.
For different types of PCB boards, the positions of the golden fingers may be different, the first linear module 42 can adjust the positions of the edge covering components 41 in the parallel directions at the two sides of the golden fingers of the PCB board, when different PCB boards are replaced by a production line, the positions of the golden fingers are changed, and the positions of the edge covering components 41 in the vertical direction of the feeding direction A of the PCB board are adjusted through the first linear module 42, so that the positions of the edge covering components 41 and the golden fingers are corresponding.
Further, the first linear module 42 is a synchronous belt linear module, and includes a first stepper motor, a first screw rod, a first sliding table and a first guide rail, where the first stepper motor is used to drive the first screw rod to rotate, and the first screw rod drives the first sliding table to reciprocate on the first guide rail.
The first linear module 42 is specifically a combination of a first stepper motor, a first screw rod, a first sliding table and a first guide rail, and simply and effectively realizes the position adjustment of the edge-wrapping assembly 41 in the parallel direction of the two sides of the golden finger of the PCB.
Further, the automatic bonding and edge-wrapping system for the golden finger high-temperature adhesive tape further comprises a second linear module 43, the second linear module 43 is arranged between the first linear module 42 and the main body fixing plate 44, the second linear module 43 is perpendicular to the first linear module 42, the first linear module 42 is fixedly arranged on a sliding table of the second linear module 43, and the second linear module 43 is used for driving the first linear module 42 to reciprocate along the direction perpendicular to two sides of the golden finger of the PCB.
The production line needs to paste the kind of the PCB board of high temperature sticky tape in the golden finger and is many, and PCB board width size is also different, and this embodiment adjusts the position of subassembly 41 of borduring at PCB board feed direction A through second sharp module 43, and when the width size of PCB board was great, the distance of borduring subassembly 41 with two sets of is big, and when the width size of PCB board is less, the distance of borduring subassembly 41 with two sets of is little with the distance adjustment between to the golden finger high temperature sticky tape of different width size PCB boards is realized pasting.
Further, the second linear module 43 is a synchronous belt linear module, and includes a second stepper motor, a second screw rod, a second sliding table and a second guide rail, where the second stepper motor is used to drive the second screw rod to rotate, and the second screw rod drives the second sliding table to reciprocate on the second guide rail.
The second linear module 43 is specifically a second stepper motor, a second screw rod, a second sliding table and a second guide rail, and simply and effectively realizes the position adjustment of the edge covering assembly 41 on two sides of the golden finger of the PCB in the vertical direction.
Further, the automatic bonding and edge covering system of the golden finger high-temperature adhesive tape further comprises a supporting mechanism, the supporting mechanism comprises a supporting air cylinder and a supporting piece, a cylinder body of the supporting air cylinder is fixedly connected with the main body fixing plate 44, a piston rod of the supporting air cylinder is fixedly connected with the supporting piece, the piston rod of the supporting air cylinder can drive the supporting piece to move up and down along the vertical direction, and the supporting mechanism is used for supporting the PCB.
In the process of pasting the high-temperature adhesive tape on the golden finger of the PCB by the high-temperature adhesive tape pasting mechanism 32, downward force is applied to the PCB, the stress of the PCB is deformed, the pasting effect of the high-temperature adhesive tape is affected, and a set of supporting mechanism is arranged at the lower part of the golden finger position or near the lower part of the golden finger position, so that the supporting of pasting the high-temperature adhesive tape on the golden finger of the PCB is realized, the deformation of the PCB is prevented, and the pasting effect of the high-temperature adhesive tape is improved.
Further, the automatic bonding and edge-wrapping system of the golden finger high-temperature adhesive tape further comprises a waiting station 5 and a finishing station 7, wherein the waiting station 5 and the finishing station 7 are symmetrically arranged on two sides of the PCB conveying device 2, the waiting station 5 is used for placing and conveying the PCB to be bonded, and the finishing station is used for placing and conveying the PCB to be bonded.
The waiting station 5 comprises a waiting station driving motor 51 and a waiting station transmission mechanism, wherein the waiting station driving motor 51 and the waiting station transmission mechanism are fixedly arranged on the waiting station 5, and the waiting station driving motor 51 is used for driving the waiting station transmission mechanism to transmit the PCB to be attached.
Laminating station 6 includes PCB board transmission device 2 and workstation 1, and PCB board transmission device 2 sets up at workstation 1 upper surface, and laminating station 6 is used for laminating high temperature sticky tape to PCB board golden finger, and PCB board transmission device 2 includes laminating station driving motor 61 for drive PCB board transmission device 2 transmits the PCB board.
The finishing station 7 comprises a finishing station driving motor 71 and a finishing station transmission mechanism, wherein the finishing station driving motor 71 and the finishing station transmission mechanism are fixedly arranged on the finishing station 7, and the finishing station driving motor 71 is used for driving the finishing station transmission mechanism to transmit the laminated PCB.
The adjustment mechanism 8 is used for adjusting the distance between two sides of the transmission mechanism so as to adapt to the PCBs with different lengths, when the length dimension of the PCBs to be transmitted is longer, the distance between the two sides of the transmission mechanism is increased through the adjustment mechanism 8, when the length dimension of the PCBs to be transmitted is shorter, the distance between the two sides of the transmission mechanism is reduced through the adjustment mechanism 8, and the adjustment mechanism 8 can simultaneously adjust the waiting station transmission mechanism, the completion station 7 transmission mechanism and the PCBs transmission device 2 in the laminating station 6.
The adjusting mechanism 8 may have various modes, and preferably the adjusting mechanism 8 adjusts a motor and a screw, and the adjusting motor controls the waiting station transmission mechanism, the finishing station transmission mechanism and the same side movement of the PCB board transmission device 2 in the attaching station 6 through the screw.
Further, the taping wheel 413 is made of a flexible material.
In the process of pasting the high-temperature adhesive tape, in order to prevent the edge covering wheel 413 from scratching the surface of the golden finger in the rolling process, the edge covering wheel 413 is made of a flexible material, for example, a silica gel material, rubber or the like is selected.
The working principle of the invention is as follows:
after the PCB is transferred to the waiting station 5, after the sensing device senses that the bonding device 3 does not have the PCB, the waiting station driving motor 51 drives the waiting station transmission mechanism to transmit the PCB to be bonded to move forwards, the PCB is transferred to the bonding station 6, the PCB is transferred to a preset position by the PCB transmission device 2 in the bonding station 6, the PCB is pressed by the PCB fixing mechanism, the actual fixing position of the PCB is shot by the shooting device, the offset distance between the actual position and the preset position is calculated by the CPU, the bonding device 3 is controlled to make compensating motion, the high-temperature adhesive tape bonding mechanism 32 is transferred to the correct position, after the high-temperature adhesive tape bonding assembly is used for bonding the high-temperature adhesive tape onto the upper surface or the lower surface of the golden finger of the PCB, part of the high-temperature adhesive tape leaks out of the golden finger, when the golden finger direction is moved by the edge bonding assembly 41 driven by the edge bonding cylinder 411, the upper pressing positioning wheel 414 in the golden finger is reversely folded, and the PCB is clamped to the middle of the edge bonding wheel 413 and the upper pressing positioning wheel 414 is continuously moved along with the continuous movement of the edge bonding wheel 413 and the upper pressing positioning wheel 414, and the high-temperature adhesive tape is reversely bonded onto the other surface of the golden finger of the PCB. After the printed circuit board is attached, the printed circuit board fixing mechanism loosens the printed circuit board, the printed circuit board conveying device 2 is conveyed to the completing station 7, and the completing station driving motor 71 drives the completing station conveying mechanism to convey the attached printed circuit board.
It will be apparent that the embodiments described above are merely some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be implemented in sequences other than those illustrated or described herein.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The automatic bonding and edge covering system for the golden finger high-temperature adhesive tape is used for bonding the golden finger part on the PCB and is characterized by comprising a workbench, a supporting mechanism, a PCB conveying device, a first linear module, a second linear module, a bonding device and an edge covering device;
the PCB transmission device is fixedly arranged on the workbench and used for transmitting and fixing the PCB;
the laminating device is arranged above the PCB transmission device and is used for laminating a high-temperature adhesive tape on the position of the golden finger of the PCB, the laminating device comprises a laminating driving mechanism and a high-temperature adhesive tape laminating mechanism, the laminating driving mechanism is arranged on the workbench, the high-temperature adhesive tape laminating mechanism is fixedly connected with the laminating driving mechanism, the laminating driving mechanism is used for driving the high-temperature adhesive tape laminating mechanism to move in a three-dimensional space, the high-temperature adhesive tape laminating mechanism is arranged above the PCB transmission device and is used for laminating the high-temperature adhesive tape on the golden finger of the PCB;
the device of borduring set up in PCB board transmission device's below and with workstation fixed connection, the device of borduring includes:
the main body fixing plate is fixedly connected with the workbench;
the edge covering assembly comprises an edge covering Bian Qigang, a roller bracket, an edge covering wheel and an upper pressing positioning wheel, wherein a piston rod of the edge covering cylinder is fixedly connected with the roller bracket, the edge covering wheel is fixed on the upper part of the roller bracket and is close to the direction of the golden finger, the upper pressing positioning wheel is fixed on the roller bracket and is positioned below the edge covering wheel, and the edge covering assembly is driven by the edge covering cylinder to do telescopic motion towards the direction of the golden finger;
the vertical adjusting cylinder is arranged between the bag Bian Qigang and the main body fixing plate, a piston rod of the vertical adjusting cylinder is fixedly connected with a cylinder body of the edge wrapping cylinder, and the vertical adjusting cylinder is used for controlling the position of the edge wrapping assembly in the vertical direction;
the first linear module is arranged between the vertical adjusting cylinder and the main body fixing plate, the vertical adjusting cylinder is fixedly arranged on a sliding table of the first linear module, the first linear module is a synchronous belt linear module and comprises a first stepping motor, a first screw rod, a first sliding table and a first guide rail, the first stepping motor is used for driving the first screw rod to rotate, and the first screw rod drives the first sliding table to reciprocate on the first guide rail;
the second linear module is arranged between the first linear module and the main body fixing plate, the second linear module is perpendicular to the first linear module, the first linear module is fixedly arranged on a sliding table of the second linear module, and the second linear module is used for driving the first linear module to reciprocate along the direction perpendicular to the two sides of the PCB golden finger;
the supporting mechanism comprises a supporting cylinder and a supporting piece, a cylinder body of the supporting cylinder is fixedly connected with the main body fixing plate, a piston rod of the supporting cylinder is fixedly connected with the supporting piece, the piston rod of the supporting cylinder can drive the supporting piece to move up and down along the vertical direction, and the supporting mechanism is used for supporting the PCB;
after the high-temperature adhesive tape is attached to the upper surface or the lower surface of the golden finger of the PCB by the attaching device, part of the high-temperature adhesive tape leaks out of the golden finger, the edge wrapping cylinder drives the edge wrapping assembly to move towards the golden finger, the upper pressing positioning wheel in the edge wrapping assembly reversely folds the high-temperature adhesive tape outside the golden finger, the PCB is clamped between the edge wrapping wheel and the upper pressing positioning wheel along with the continuous movement of the edge wrapping wheel and the upper pressing positioning wheel, and the reversely folded high-temperature adhesive tape is pressed to the other surface of the golden finger of the PCB.
2. The automatic bonding and taping system for golden finger high temperature adhesive tape according to claim 1, wherein the taping assemblies are two groups, and the taping assemblies are symmetrically arranged.
3. The automatic bonding and taping system for a golden finger high temperature tape according to claim 2, further comprising an image pickup device for photographing a position of a PCB board.
4. The automatic bonding and edge-wrapping system for the golden finger high-temperature adhesive tape according to claim 3, wherein the second linear module is a synchronous belt linear module and comprises a second stepping motor, a second screw rod, a second sliding table and a second guide rail, wherein the second stepping motor is used for driving the second screw rod to rotate, and the second screw rod drives the second sliding table to reciprocate on the second guide rail.
5. The automatic bonding and taping system for golden finger high-temperature adhesive tape according to any one of claims 1 to 4, further comprising a waiting station and a finishing station, wherein the waiting station and the finishing station are symmetrically arranged on two sides of the PCB board transmission device, the waiting station is used for placing and transmitting a PCB board to be bonded, and the finishing station is used for placing and transmitting a bonded PCB board.
6. The automatic bonding and edging system for high-temperature golden finger tapes according to claim 5, characterized in that: the taping wheel is made of a flexible material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210593563.0A CN114872971B (en) | 2022-05-27 | 2022-05-27 | Automatic bonding and edge-wrapping system for golden finger high-temperature adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210593563.0A CN114872971B (en) | 2022-05-27 | 2022-05-27 | Automatic bonding and edge-wrapping system for golden finger high-temperature adhesive tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114872971A CN114872971A (en) | 2022-08-09 |
| CN114872971B true CN114872971B (en) | 2024-03-29 |
Family
ID=82680003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210593563.0A Active CN114872971B (en) | 2022-05-27 | 2022-05-27 | Automatic bonding and edge-wrapping system for golden finger high-temperature adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114872971B (en) |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3447285A (en) * | 1966-05-13 | 1969-06-03 | Walter Hornlein Metallwarenfab | Two-stage edge-folding machine for foil-wrapped items |
| CN102630128A (en) * | 2012-04-24 | 2012-08-08 | 深圳市安耐节科技有限公司 | High-temperature protection adhesive-tape pasting device for PCB board golden finger |
| CN103600865A (en) * | 2013-08-13 | 2014-02-26 | 深圳市永能机械有限公司 | Automatic edge covering device and method for PCB (printed circuit board) |
| WO2018076424A1 (en) * | 2016-10-26 | 2018-05-03 | 江苏比微曼智能科技有限公司 | Automatic film application mechanism and method |
| CN208768337U (en) * | 2018-07-30 | 2019-04-19 | 东莞市鸿硕机械设备有限公司 | A kind of wiring board taping machine |
| CN209710464U (en) * | 2019-01-03 | 2019-11-29 | 易泛特技术（深圳）有限公司 | A kind of golden finger reverse side encapsulation mechanism |
| CN211169205U (en) * | 2019-08-29 | 2020-08-04 | 惠州市成泰自动化科技有限公司 | PCB board mechanism of borduring |
| CN211792325U (en) * | 2020-09-07 | 2020-10-27 | 东莞栢能电子科技有限公司 | Automatic package golden finger equipment |
| CN112829996A (en) * | 2020-12-30 | 2021-05-25 | 深圳市伟鸿科科技有限公司 | Multi-connected automatic edge covering equipment |
| CN213638388U (en) * | 2020-12-02 | 2021-07-06 | 昆山昊旺机械有限公司 | Mechanism is disassembled to automatic PIN down after drilling of PCB board |
| WO2021174556A1 (en) * | 2020-03-06 | 2021-09-10 | 诸暨中澳自动化设备有限公司 | Wire harness tape bundling device, integrated apparatus, and method |
| CN113911436A (en) * | 2021-11-13 | 2022-01-11 | 千禾半导体(深圳)有限公司 | Taping machine based on sheet adhesive tape |
| CN215581936U (en) * | 2021-08-20 | 2022-01-18 | 深圳鹏鑫智造科技有限公司 | PCB rubberizing equipment |
| CN216101158U (en) * | 2021-10-15 | 2022-03-22 | 瑞安市国安印刷机械有限公司 | Feeding, edge covering and blanking device of full-automatic leather shell machine |
-
2022
- 2022-05-27 CN CN202210593563.0A patent/CN114872971B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3447285A (en) * | 1966-05-13 | 1969-06-03 | Walter Hornlein Metallwarenfab | Two-stage edge-folding machine for foil-wrapped items |
| CN102630128A (en) * | 2012-04-24 | 2012-08-08 | 深圳市安耐节科技有限公司 | High-temperature protection adhesive-tape pasting device for PCB board golden finger |
| CN103600865A (en) * | 2013-08-13 | 2014-02-26 | 深圳市永能机械有限公司 | Automatic edge covering device and method for PCB (printed circuit board) |
| WO2018076424A1 (en) * | 2016-10-26 | 2018-05-03 | 江苏比微曼智能科技有限公司 | Automatic film application mechanism and method |
| CN208768337U (en) * | 2018-07-30 | 2019-04-19 | 东莞市鸿硕机械设备有限公司 | A kind of wiring board taping machine |
| CN209710464U (en) * | 2019-01-03 | 2019-11-29 | 易泛特技术（深圳）有限公司 | A kind of golden finger reverse side encapsulation mechanism |
| CN211169205U (en) * | 2019-08-29 | 2020-08-04 | 惠州市成泰自动化科技有限公司 | PCB board mechanism of borduring |
| WO2021036079A1 (en) * | 2019-08-29 | 2021-03-04 | 惠州市成泰自动化科技有限公司 | Pcb edge wrapping mechanism |
| WO2021174556A1 (en) * | 2020-03-06 | 2021-09-10 | 诸暨中澳自动化设备有限公司 | Wire harness tape bundling device, integrated apparatus, and method |
| CN211792325U (en) * | 2020-09-07 | 2020-10-27 | 东莞栢能电子科技有限公司 | Automatic package golden finger equipment |
| CN213638388U (en) * | 2020-12-02 | 2021-07-06 | 昆山昊旺机械有限公司 | Mechanism is disassembled to automatic PIN down after drilling of PCB board |
| CN112829996A (en) * | 2020-12-30 | 2021-05-25 | 深圳市伟鸿科科技有限公司 | Multi-connected automatic edge covering equipment |
| CN215581936U (en) * | 2021-08-20 | 2022-01-18 | 深圳鹏鑫智造科技有限公司 | PCB rubberizing equipment |
| CN216101158U (en) * | 2021-10-15 | 2022-03-22 | 瑞安市国安印刷机械有限公司 | Feeding, edge covering and blanking device of full-automatic leather shell machine |
| CN113911436A (en) * | 2021-11-13 | 2022-01-11 | 千禾半导体(深圳)有限公司 | Taping machine based on sheet adhesive tape |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114872971A (en) | 2022-08-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108773082B (en) | High-precision laminating machine for curved surface products | |
| CN109838434A (en) | Automation point sticker screen system | |
| CN110683336A (en) | Camera module laminating equipment | |
| CN108470519B (en) | Polaroid attaching machine | |
| CN215815812U (en) | Full-automatic lens chip dispensing and pasting machine | |
| CN114872971B (en) | Automatic bonding and edge-wrapping system for golden finger high-temperature adhesive tape | |
| CN111911503B (en) | FPC dispensing and laminating machine | |
| CN106912167A (en) | FPC bonding machines | |
| CN218587404U (en) | PCB circuit board golden finger anchor clamps and device of borduring | |
| CN110979866B (en) | Automatic paste equipment of glass bar code label and binding post sticky tape | |
| CN111977112A (en) | Multi-station automatic labeling equipment | |
| CN217533374U (en) | Automatic laminating system of borduring of gold finger high temperature sticky tape | |
| CN205522852U (en) | Laminating machine | |
| CN107461387B (en) | Dispensing and gluing equipment and dispensing and gluing method | |
| CN111683514B (en) | False pressure equipment | |
| CN212220801U (en) | Double-head automatic labeling device | |
| CN110143324B (en) | Novel rubberizing mechanism | |
| CN112208106A (en) | Six-axis manipulator CCD (Charge coupled device) adhesive film laminating device | |
| CN113856989A (en) | Intelligent dispensing equipment for display screen after bonding IC and FPC | |
| CN208013668U (en) | A kind of automatic alignment machine | |
| CN111694173A (en) | Flat cable prepressing device of liquid crystal display ACF pressing equipment and using method thereof | |
| CN220439567U (en) | Quick press-fit mechanism of COF bonding machine | |
| CN220392578U (en) | Product transfer mechanism for COF bonding machine | |
| CN219107808U (en) | Multifunctional system for attaching adhesive tape to PCB (printed Circuit Board) without board edge | |
| CN220570739U (en) | Pre-pressing mechanism for COF bonding machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |