CN114872971A - Automatic laminating system of borduring of gold finger high temperature sticky tape - Google Patents
Automatic laminating system of borduring of gold finger high temperature sticky tape Download PDFInfo
- Publication number
- CN114872971A CN114872971A CN202210593563.0A CN202210593563A CN114872971A CN 114872971 A CN114872971 A CN 114872971A CN 202210593563 A CN202210593563 A CN 202210593563A CN 114872971 A CN114872971 A CN 114872971A
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- China
- Prior art keywords
- pcb
- adhesive tape
- cylinder
- laminating
- temperature adhesive
- Prior art date
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Links
- 238000010030 laminating Methods 0.000 title claims description 72
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims description 16
- 239000010931 gold Substances 0.000 title claims description 16
- 229910052737 gold Inorganic materials 0.000 title claims description 16
- 230000007246 mechanism Effects 0.000 claims abstract description 81
- 239000002390 adhesive tape Substances 0.000 claims abstract description 66
- 230000005540 biological transmission Effects 0.000 claims description 51
- 230000033001 locomotion Effects 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 9
- 230000000712 assembly Effects 0.000 claims description 8
- 238000000429 assembly Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 230000001360 synchronised effect Effects 0.000 claims description 4
- 238000009957 hemming Methods 0.000 claims description 2
- 238000007688 edging Methods 0.000 abstract description 9
- 230000002452 interceptive effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B33/00—Packaging articles by applying removable, e.g. strippable, coatings
- B65B33/02—Packaging small articles, e.g. spare parts for machines or engines
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses an automatic golden finger high-temperature adhesive tape attaching and edging system which is used for attaching a high-temperature adhesive tape to a golden finger part on a PCB (printed circuit board) and comprises a workbench and an edging device, wherein the edging device comprises a main body fixing plate, the main body fixing plate is fixedly connected with the workbench, the edging device is used for attaching the high-temperature adhesive tape to the other side of the golden finger on the PCB, through arranging an edging assembly, a set of high-temperature adhesive tape attaching mechanism can be used for simultaneously attaching the upper surface and the lower surface of the golden finger on the PCB, a vertical adjusting cylinder is arranged, the height of the edging assembly in the vertical direction can be adjusted, and the edging assembly and other equipment are prevented from interfering.
Description
Technical Field
The invention relates to a packaging system of a PCB (printed circuit board), in particular to an automatic bonding and edge covering system of a gold finger high-temperature adhesive tape.
Background
Part of computer hardware and external signal transmission are transmitted by golden fingers, such as memory bars and video cards, the golden fingers are composed of a plurality of golden conductive contact pieces, because the surfaces of the golden fingers are plated with gold and the conductive contact pieces are arranged like fingers, the golden fingers are called the golden fingers, in the production process of the hardware, residues can be remained at the golden finger positions due to the situations of chemical agents such as soldering flux and the like infiltrated in the manufacturing process or welding position deviation, meanwhile, the golden finger positions are easy to scratch in the production and transportation processes, the quality and the appearance of products are influenced, so the golden finger positions need to be protected by high-temperature adhesive tapes, the high-temperature adhesive tapes at the golden finger positions at present are adhered by hands, the manual adhering efficiency is low, the adhering positions are not uniform, the missing adhering phenomenon is easy to occur, and automatic adhering equipment is also generated, but because the golden finger positions are arranged on the upper and lower surfaces of a PCB board, in the prior art, two sets of high-temperature adhesive tape laminating mechanisms are adopted to respectively carry out high-temperature adhesive tape pasting on the golden fingers on the upper surface and the lower surface of the PCB, the equipment is complex, the cost is high, and therefore an automatic golden finger high-temperature adhesive tape laminating and edge covering system is needed, and the high-temperature adhesive tape pasting on the golden fingers on the upper surface and the lower surface of the PCB can be realized by adopting one set of high-temperature adhesive tape laminating mechanism.
Disclosure of Invention
The invention provides an automatic gold finger high-temperature adhesive tape attaching and edge covering system which is used for solving the problems that in the prior art, two sets of high-temperature adhesive tape attaching mechanisms are adopted to respectively attach high-temperature adhesive tapes to gold fingers on the upper surface and the lower surface of a PCB, equipment is complex, and cost is high.
According to one aspect of the invention, the automatic golden finger high-temperature adhesive tape attaching and edge covering system is used for attaching the high-temperature adhesive tape to a golden finger part on a PCB and comprises a workbench, a supporting mechanism, a PCB conveying device and an edge covering device;
the PCB transmission device is fixedly arranged on the workbench and used for transmitting and fixing the PCB;
the device of borduring sets up in PCB board transmission device's below and with workstation fixed connection, and the device of borduring includes:
the main body fixing plate is fixedly connected with the workbench;
the edge covering assembly comprises an edge covering cylinder, a roller support, an edge covering wheel and an upper pressing positioning wheel, the cylinder body of the edge covering cylinder is fixedly connected with the main body fixing plate, the piston rod of the edge covering cylinder is fixedly connected with the roller support, the edge covering wheel is fixed on the upper portion of the roller support and is close to the direction of the golden finger, the upper pressing positioning wheel is fixed on the roller support and is positioned below the edge covering wheel, and the edge covering assembly can do telescopic motion towards the direction of the golden finger under the driving of the edge covering cylinder;
the supporting mechanism comprises a supporting cylinder and a supporting piece, the cylinder body of the supporting cylinder is fixedly connected with the main body fixing plate, the piston rod of the supporting cylinder is fixedly connected with the supporting piece, the piston rod of the supporting cylinder can drive the supporting piece to move up and down along the vertical direction, and the supporting mechanism is used for supporting the PCB.
Furthermore, the edge covering assembly further comprises a vertical adjusting cylinder, the vertical adjusting cylinder is arranged between the edge covering cylinder and the main body fixing plate, a piston rod of the vertical adjusting cylinder is fixedly connected with a cylinder body of the edge covering cylinder, the cylinder body of the vertical adjusting cylinder is fixedly connected with the main body fixing plate, and the vertical adjusting cylinder is used for controlling the position of the edge covering assembly in the vertical direction.
Furthermore, the edge covering assemblies are divided into two groups, and the two groups of edge covering assemblies are symmetrically arranged.
Furthermore, the high-temperature adhesive tape attaching mechanism further comprises a camera device, and the camera device is used for shooting the position of the PCB.
Further, the automatic laminating system of borduring of gold finger high temperature sticky tape still includes first sharp module, first sharp module sets up between vertical adjustment cylinder and main part fixed plate, first sharp module and main part fixed plate fixed connection, the fixed slip table that sets up at first sharp module of vertical adjustment cylinder, first sharp module is hold-in range sharp module, including first step motor, first lead screw, first slip table and first guide rail, first step motor is used for driving first lead screw and rotates, first lead screw drives first slip table reciprocating motion on first guide rail.
Further, automatic laminating of gold finger high temperature sticky tape system of borduring still includes the second sharp module, and the setting of second sharp module is between first sharp module and main part fixed plate, and the second sharp module sets up with first sharp module is perpendicular, and first sharp module is fixed to be set up on the slip table of second sharp module, and second sharp module is used for driving first sharp module along with PCB board golden finger both sides vertically direction be reciprocating motion.
Further, the second linear module is a synchronous belt linear module and comprises a second stepping motor, a second screw rod, a second sliding table and a second guide rail, the second stepping motor is used for driving the second screw rod to rotate, and the second screw rod drives the second sliding table to reciprocate on the second guide rail.
Furthermore, the automatic laminating of gold finger high temperature sticky tape system of borduring still includes waits for the station and accomplishes the station, waits for the station and accomplishes the setting of station symmetry in PCB board transmission device's both sides, waits for the station to be used for placing and transmits the PCB board of treating the laminating, accomplishes the station and is used for placing and transmitting the PCB board of treating the laminating completion.
Further, the edge covering wheel is made of flexible materials.
Further, automatic laminating system of borduring of golden finger high temperature sticky tape still includes the laminating device, the laminating device sets up in PCB board transmission device's top, be used for pasting the high temperature sticky tape to PCB board golden finger position, the laminating device is including laminating actuating mechanism and high temperature sticky tape laminating mechanism, laminating actuating mechanism sets up on the workstation, high temperature sticky tape laminating mechanism and laminating actuating mechanism fixed connection, laminating actuating mechanism is arranged in driving high temperature sticky tape laminating mechanism and moves in three-dimensional space, high temperature sticky tape laminating mechanism sets up in PCB board transmission device's top, high temperature sticky tape laminating mechanism is used for pasting the high temperature sticky tape to PCB board golden finger position. The invention has the beneficial effects that:
the PCB board is fixed to preset position, high temperature sticky tape laminating subassembly pastes the high temperature sticky tape behind PCB board golden finger above or below, the high temperature glue has the outside that the golden finger partially spills, the drive of borduring the cylinder is bordured the subassembly and is moved to golden finger direction, the high temperature sticky tape of golden finger outside is turned over to last pressure positioning wheel in the subassembly of borduring, along with the continuation removal of borduring wheel and last pressure positioning wheel, the PCB board is pressed to borduring wheel and last pressure positioning wheel, the another side of PCB board golden finger is pressed to the high temperature sticky tape of turning over, and paste on the another side of PCB board golden finger. Through setting up the subassembly of borduring, realized that one set of high temperature sticky tape laminating mechanism can paste two upper and lower faces of PCB board golden finger simultaneously, simplified equipment, the cost is reduced.
Set up the vertical adjustment cylinder, can adjust the height of the subassembly vertical direction of borduring, when the subassembly of borduring is out of work, the vertical adjustment cylinder shrink will bordure the subassembly and draw down, keep away from high temperature sticky tape laminating mechanism, prevent that subassembly and other equipment of borduring from taking place to interfere, after the PCB board is fixed good position, the vertical adjustment cylinder stretches out, will bordure the subassembly and upwards push away, will bordure the subassembly and send operating position.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic perspective view of an automatic bonding and taping system for a gold finger high-temperature adhesive tape according to an embodiment of the present invention;
FIG. 2 is a schematic perspective view of a taping device in accordance with an embodiment of the present invention;
FIG. 3 is a top view of a feed structure according to an embodiment of the present invention;
in the figure: A-PCB feeding direction; 1-a workbench; 2-PCB board transmission device; 3-a laminating device; 31-a double-guide rail gantry linear module; 32-a high temperature tape applying mechanism; 4-a wrapping device; 41-a hemming assembly; 411-a taping cylinder; 412-a roller carriage; 413-edge wrapping wheel; 414-pressing the positioning wheel; 415-vertical adjustment cylinder; 42-a first linear module; 43-a second linear module; 44-body fixation plate; 5-waiting for the station; 51-waiting station drive motor; 6-laminating station; 61-a drive motor for the laminating station; 7-finishing the station; 71-finishing station drive motor; 8-adjusting mechanism.
Detailed Description
It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
It is noted that, unless otherwise indicated, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
In the present invention, unless specified to the contrary, use of the terms of orientation such as "upper, lower, top, bottom" or the like, generally refer to the orientation as shown in the drawings, or to the component itself in a vertical, perpendicular, or gravitational orientation; likewise, for ease of understanding and description, "inner and outer" refer to the inner and outer relative to the profile of the components themselves, but the above directional words are not intended to limit the invention.
According to one aspect of the invention, the automatic golden finger high-temperature adhesive tape attaching and edging system is used for attaching a high-temperature adhesive tape to a golden finger position on a PCB (printed circuit board), and comprises a workbench 1, a PCB transmission device 2, an attaching device 3 and an edging device 4, wherein the PCB transmission device 2 is used for automatically transmitting a PCB on an attaching station 6, and the PCB transmission device 2 is arranged on the workbench 1 and is positioned below the attaching device 3;
the upper part of the worktable 1 is provided with a horizontal worktable surface.
The attaching device 3 includes;
a high-temperature adhesive tape laminating assembly comprises a laminating driving mechanism and a high-temperature adhesive tape laminating mechanism 32, the laminating driving mechanism can be a double-guide rail gantry linear module 31, the double-guide rail gantry linear module 31 is fixedly arranged on the table top of a workbench 1, the high-temperature adhesive tape laminating mechanism 32 is vertically and downwards fixed on a sliding table of the double-guide rail gantry linear module 31, concretely, the double-guide rail gantry linear module 31 comprises a vertical linear module and a parallel linear module, the vertical linear module is fixedly arranged on the table top of the workbench 1, the vertical linear module comprises two linear guide rails perpendicular to the feeding direction A of a PCB, each linear guide rail is provided with at least one sliding table, the parallel linear module is fixed on the sliding table of the two linear guide rails of the vertical linear module, the parallel linear module is parallel to the feeding direction A of the PCB, and can slide along the two linear guide rails of the vertical linear module, the high-temperature adhesive tape attaching mechanism 32 is vertically fixed on a sliding table of the parallel linear module downwards, the attaching driving mechanism is used for driving the high-temperature adhesive tape attaching mechanism 32 to move in a two-dimensional space, the high-temperature adhesive tape attaching mechanism 32 is arranged above the PCB transmission device 2, and the high-temperature adhesive tape attaching mechanism 32 is used for attaching a high-temperature adhesive tape to a golden finger part of the PCB;
PCB board transmission device 2 sets up on the mesa of workstation 1, and is located the below of high temperature sticky tape laminating mechanism 32, PCB board transmission device 2 includes two parallel arrangement's transmission support frame, two belt transmission mechanism and motor, the opposite side of two transmission support frames is provided with a belt transmission mechanism respectively, motor drive belt transmission mechanism rotates, with the PCB board forward transmission, the preferred servo motor of motor, select servo motor can be accurate transmit the PCB board to predetermined position.
Preferably, two parallel arrangement's transmission support frame's corresponding position is provided with a PCB board fixed establishment respectively, PCB board fixed establishment includes clamp plate and fixed cylinder, the cylinder body and the transmission support frame fixed connection of fixed cylinder, the piston rod fixed connection of clamp plate and fixed cylinder, the flexible clamp plate that drives of fixed cylinder compresses tightly or loosens the PCB board, after the PCB board is transmitted this position by belt transmission mechanism, servo motor stall, fixed cylinder shrink drives the clamp plate and compresses tightly the PCB board, high temperature sticky tape laminating subassembly pastes the high temperature sticky tape to the PCB board, after the high temperature sticky tape has been pasted, fixed cylinder stretches out and drives the clamp plate and loosen the PCB board, servo motor continues to rotate, drive belt transmission mechanism motion, thereby drive the PCB board subsides and continue to move forward, give up the space for next high temperature sticky tape of pasting.
The edge covering device 4 is arranged below the PCB board transmission device 2, and the edge covering device 4 comprises;
a main body fixing plate 44, wherein the main body fixing plate 44 may be a single component, if the main body fixing plate 44 is a single component, the main body fixing plate 44 is fixedly connected with the workbench 1, and the main body fixing plate 44 may also be a part of the workbench 1;
the edge covering component 41, the edge covering component 41 is positioned below the PCB fixing mechanism and at one side of the PCB in the finger direction, the edge covering component 41 comprises an edge covering cylinder 411 and a roller bracket 412, the edge covering device comprises an edge covering wheel 413, an upper pressing positioning wheel 414 and a vertical adjusting cylinder 415, wherein the vertical adjusting cylinder 415 is arranged between the edge covering cylinder 411 and a main body fixing plate 44, a cylinder body of the vertical adjusting cylinder 415 is fixedly connected with the main body fixing plate 44, a piston rod of the vertical adjusting cylinder 415 is fixedly connected with a cylinder body of the edge covering cylinder 411, the vertical adjusting cylinder 415 is used for controlling the position of the edge covering assembly 41 in the vertical direction, a piston rod of the edge covering cylinder 411 is fixedly connected with a roller support 412, the edge covering wheel 413 is fixed on the upper portion of the roller support 412 and is close to the golden finger direction, the upper pressing positioning wheel 414 is fixed on the roller support 412 and is located below the edge covering wheel 413, and the edge covering assembly 41 can make telescopic movement towards the golden finger direction under the driving of the edge covering cylinder 411.
The PCB is fixed to a preset position, after the high-temperature adhesive tape is attached to the upper surface or the lower surface of a golden finger of the PCB by the high-temperature adhesive tape attaching assembly, a part of the high-temperature adhesive tape leaks out of the golden finger, when the edge-covering assembly 41 is driven by the edge-covering cylinder 411 to move towards the golden finger, the high-temperature adhesive tape outside the golden finger is reversely folded by the upper pressure positioning wheel 414 in the edge-covering assembly 41, along with the continuous movement of the edge-covering wheel 413 and the upper pressure positioning wheel 414, the PCB is clamped between the edge-covering wheel 413 and the upper pressure positioning wheel 414, and the reversely folded high-temperature adhesive tape is pressed to the other surface of the golden finger of the PCB and is attached to the other surface of the golden finger of the PCB. Through setting up the subassembly 41 of borduring, realized that one set of high temperature sticky tape laminating mechanism 32 can paste two upper and lower faces of PCB board golden finger simultaneously, simplified equipment, the cost is reduced.
Set up vertical adjustment cylinder 415, can adjust the height of borduring subassembly 41 vertical direction, when borduring subassembly 41 was out of work, vertical adjustment cylinder 415 shrink, with subassembly 41 of borduring draw down, keep away from high temperature sticky tape laminating mechanism 32, prevent that subassembly 41 of borduring and other equipment from taking place to interfere, after the PCB board is fixed well the position, vertical adjustment cylinder 415 stretched out, will borduring subassembly 41 upwards pushes away, will borduring subassembly 41 and send operating position.
Further, the edge covering assemblies 41 are two groups, the two groups of edge covering assemblies are symmetrically arranged, when the PCB is fixed, the two groups of edge covering assemblies are respectively positioned on two sides of the PCB, and one group of edge covering assembly is arranged on each side.
When both sides of the PCB are provided with golden finger parts, high-temperature adhesive tapes need to be pasted, or when only one side of the PCB is provided with high-temperature adhesive tapes, the two boards are spliced together, the golden finger parts on the left side and the right side need to be pasted, and two groups of edge covering assemblies 41 are arranged, so that the working efficiency can be improved, and the yield can be increased.
Further, the high-temperature adhesive tape attaching mechanism 32 further comprises a camera device, the camera device is used for shooting the position of the PCB, the camera device can be arranged on the high-temperature adhesive tape attaching mechanism 32, or the camera device can be arranged above the PCB fixing mechanism independently, as long as the camera device can clearly shoot the position of the PCB.
The camera equipment shoots the actual fixed position of the PCB, and sends the graphic data to the central processing unit, the central processing unit compares the actual position of the PCB with the standard position of the preset position, after the actual fixed position of the PCB deviates from the preset standard position, the central processing unit calculates the actual distance of the deviation, and controls the laminating device 3 to perform compensation movement, so that the high-temperature adhesive tape laminating mechanism 32 is conveyed to the correct position, and preparation is made for laminating the high-temperature adhesive tape.
Further, the automatic laminating of gold finger high temperature sticky tape system of borduring still includes first straight line module 42, and first straight line module 42 sets up between vertical adjustment cylinder 415 and main part fixed plate 44, first straight line module 42 and main part fixed plate 44 fixed connection, and vertical adjustment cylinder 415 is fixed to be set up on the slip table of first straight line module 42, and first straight line module 42 is used for driving subassembly 41 of borduring along with PCB board feed direction A's vertical direction and is reciprocating motion.
For different types of PCB boards, the positions of the golden fingers are possibly different, the positions of the edge covering assembly 41 in the parallel directions of the two sides of the golden fingers of the PCB boards can be adjusted by the first straight line module 42, when different PCB boards are changed in a production line, the positions of the golden fingers are changed, the position of the edge covering assembly 41 in the vertical direction of the feeding direction A of the PCB boards is adjusted by the first straight line module 42, and the edge covering assembly 41 corresponds to the positions of the golden fingers.
Further, first sharp module 42 is hold-in range sharp module, including first step motor, first lead screw, first slip table and first guide rail, and first step motor is used for driving first lead screw and rotates, and first lead screw drives first slip table reciprocating motion on first guide rail.
First straight line module 42 specifically is the combination of first step motor, first lead screw, first slip table and first guide rail, and simple effectual realization is to borduring subassembly 41 at the position adjustment of PCB board golden finger both sides parallel direction.
Further, automatic laminating of golden finger high temperature sticky tape system of borduring still includes second straight line module 43, and second straight line module 43 sets up between first straight line module 42 and main part fixed plate 44, and second straight line module 43 sets up with first straight line module 42 is perpendicular, and first straight line module 42 is fixed to be set up on the slip table of second straight line module 43, and second straight line module 43 is used for driving first straight line module 42 along with PCB board golden finger both sides vertically direction and is reciprocating motion.
The production line need paste the kind of the PCB board of high temperature sticky tape at the golden finger many, PCB board width size is also different, this embodiment adjusts the position of borduring subassembly 41 at PCB board feed direction A through second straight line module 43, when the width size of PCB board is great, adjust two sets of distances of borduring between the subassembly 41 and enlarge, when the width size of PCB board is less, adjust two sets of distances of borduring between the subassembly 41 and reduce, thereby realize the pasting to the golden finger high temperature sticky tape of different width sizes PCB board.
Further, the second linear module 43 is a synchronous belt linear module and comprises a second stepping motor, a second lead screw, a second sliding table and a second guide rail, the second stepping motor is used for driving the second lead screw to rotate, and the second lead screw drives the second sliding table to reciprocate on the second guide rail.
The second linear module 43 is specifically a second stepping motor, a second screw rod, a second sliding table and a second guide rail, and simply and effectively realizes the position adjustment of the edge covering assembly 41 in the vertical direction of the two sides of the golden finger of the PCB.
Furthermore, the automatic gold finger high-temperature adhesive tape laminating and edge covering system further comprises a supporting mechanism, the supporting mechanism comprises a supporting cylinder and a supporting piece, the cylinder body of the supporting cylinder is fixedly connected with the main body fixing plate 44, the piston rod of the supporting cylinder is fixedly connected with the supporting piece, the piston rod of the supporting cylinder can drive the supporting piece to move up and down along the vertical direction, and the supporting mechanism is used for supporting the PCB.
High temperature sticky tape laminating mechanism 32 can have a decurrent power to the PCB board to the in-process of PCB board golden finger paste high temperature sticky tape, and the PCB board atress can take place to warp, can influence the effect of pasting of high temperature sticky tape, and in the lower part of golden finger position, or near the lower part of golden finger position sets up one set of supporting mechanism, and the support when realizing pasting high temperature sticky tape to PCB board golden finger prevents that the PCB board from taking place to warp, improves the effect of pasting of high temperature sticky tape.
Further, the automatic laminating of gold finger high temperature sticky tape system of borduring still includes waits for station 5 and accomplishes station 7, waits for the setting of station 5 and 7 symmetries of accomplishing the station to be in the both sides of PCB board transmission device 2, waits for station 5 to be used for placing and transmits the PCB board of waiting to laminate, accomplishes the station and is used for placing and transmitting the PCB board that the laminating was accomplished.
Wait for station 5 including waiting for station driving motor 51 and waiting for station transmission device, wait for station driving motor 51 and wait for station transmission device fixed setting on waiting for station 5, wait for station driving motor 51 and be used for the drive to wait for station transmission device to transmit the PCB board of waiting for the laminating.
Laminating station 6 includes PCB board transmission device 2 and workstation 1, and PCB board transmission device 2 sets up at 1 upper surface of workstation, and laminating station 6 is used for the high temperature sticky tape of laminating to PCB board golden finger, and PCB board transmission device 2 is including laminating station driving motor 61 for drive PCB board transmission device 2 transmission PCB board.
The completion station 7 comprises a completion station driving motor 71 and a completion station transmission mechanism, the completion station driving motor 71 and the completion station transmission mechanism are fixedly arranged on the completion station 7, and the completion station driving motor 71 is used for driving the completion station transmission mechanism to transmit the PCB which is completely attached.
The adjusting mechanism 8 is used for adjusting the distance between the two sides of the transmission mechanism to adapt to PCBs with different lengths, when the length size of the PCB to be transmitted is longer, the distance between the two sides of the transmission mechanism is increased through the adjusting mechanism 8, when the length size of the PCB to be transmitted is shorter, the distance between the two sides of the transmission mechanism is decreased through the adjusting mechanism 8, and the adjusting mechanism 8 can simultaneously adjust the PCB transmission devices 2 in the waiting station transmission mechanism, the finishing station 7 transmission mechanism and the laminating station 6.
The adjusting mechanism 8 can be in various modes, and preferably, the adjusting mechanism 8 adjusts a motor and a screw rod, and the adjusting motor controls the waiting station transmission mechanism, the finishing station transmission mechanism and the PCB transmission device 2 in the laminating station 6 to move on the same side through the screw rod.
Further, the taping wheel 413 is made of a flexible material.
In the process of attaching the high-temperature adhesive tape, in order to avoid the edge wrapping wheel 413 from scratching the surface of the golden finger in the rolling process, the edge wrapping wheel 413 is made of a flexible material, for example, a silica gel material, rubber and the like.
The working principle of the invention is as follows:
after the PCB is transmitted to the waiting station 5, when the sensing device senses that no PCB exists on the attaching device 3, the waiting station driving motor 51 drives the waiting station transmission mechanism to transmit the PCB to be attached to move forwards, the PCB is transmitted to the attaching station 6, the PCB transmission device 2 in the attaching station 6 transmits the PCB to a preset position, the PCB is tightly pressed by the PCB fixing mechanism, the camera device shoots the actual fixed position of the PCB, the central processing unit calculates the offset distance between the actual position and the preset position, the attaching device 3 is controlled to carry out compensation movement, the high-temperature adhesive tape attaching mechanism 32 is transmitted to the correct position, the high-temperature adhesive tape is attached to the upper surface or the lower surface of the golden finger of the PCB by the high-temperature adhesive tape attaching assembly, part of the high-temperature adhesive tape leaks out of the golden finger, when the edge covering assembly 41 driven by the edge covering cylinder 411 moves towards the golden finger direction, the upper pressure positioning wheel 414 in the edge covering assembly 41 reversely folds the high-temperature adhesive tape outside the golden finger, as the edge covering wheel 413 and the upper pressing and positioning wheel 414 continue to move, the PCB board is clamped between the edge covering wheel 413 and the upper pressing and positioning wheel 414, and the reversely folded high-temperature adhesive tape is pressed to the other side of the golden finger of the PCB board and is adhered to the other side of the golden finger of the PCB board. After the PCB which is completely laminated is attached, the PCB fixing mechanism loosens the PCB, the PCB transmission device 2 is transmitted to the completing station 7, and the completing station driving motor 71 drives the completing station transmission mechanism to transmit the PCB which is completely attached.
It is to be understood that the above-described embodiments are only a few, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular is intended to include the plural unless the context clearly dictates otherwise, and it should be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of features, steps, operations, devices, components, and/or combinations thereof.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An automatic golden finger high-temperature adhesive tape attaching and edge covering system is used for attaching a high-temperature adhesive tape to a golden finger part on a PCB and is characterized by comprising a workbench, a supporting mechanism, a PCB transmission device and an edge covering device;
the PCB transmission device is fixedly arranged on the workbench and used for transmitting and fixing the PCB;
the device of borduring set up in PCB board transmission device's below and with workstation fixed connection, the device of borduring includes:
the main body fixing plate is fixedly connected with the workbench;
the edge covering assembly comprises an edge covering cylinder, a roller support, an edge covering wheel and an upper pressing positioning wheel, the cylinder body of the edge covering cylinder is fixedly connected with the main body fixing plate, the piston rod of the edge covering cylinder is fixedly connected with the roller support, the edge covering wheel is fixed on the upper portion of the roller support and is close to the direction of the golden finger, the upper pressing positioning wheel is fixed on the roller support and is positioned below the edge covering wheel, and the edge covering assembly can do telescopic motion towards the direction of the golden finger under the driving of the edge covering cylinder;
the supporting mechanism comprises a supporting cylinder and a supporting piece, the cylinder body of the supporting cylinder is fixedly connected with the main body fixing plate, the piston rod of the supporting cylinder is fixedly connected with the supporting piece, the piston rod of the supporting cylinder can drive the supporting piece to move up and down along the vertical direction, and the supporting mechanism is used for supporting the PCB.
2. The automatic gold finger high-temperature adhesive tape attaching and taping system of claim 1, wherein the taping assembly further comprises a vertical adjusting cylinder, the vertical adjusting cylinder is arranged between the taping cylinder and the main body fixing plate, a piston rod of the vertical adjusting cylinder is fixedly connected with a cylinder body of the taping cylinder, the cylinder body of the vertical adjusting cylinder is fixedly connected with the main body fixing plate, and the vertical adjusting cylinder is used for controlling the position of the taping assembly in the vertical direction.
3. The automatic bonding and taping system of claim 2, wherein the taping assemblies are in two groups, and the taping assemblies are symmetrically arranged in the two groups.
4. The automatic gold finger high-temperature adhesive tape attaching and taping system of claim 3, wherein the high-temperature adhesive tape attaching mechanism further comprises a camera device for shooting the position of the PCB.
5. The automatic golden finger high-temperature adhesive tape laminating and taping system of claim 4, wherein the automatic golden finger high-temperature adhesive tape laminating and taping system further comprises a first linear module, the first linear module is arranged between the vertical adjustment cylinder and the main body fixing plate, the first linear module is fixedly connected with the main body fixing plate, the vertical adjustment cylinder is fixedly arranged on the sliding table of the first linear module, the first linear module is a synchronous belt linear module and comprises a first stepping motor, a first lead screw, a first sliding table and a first guide rail, the first stepping motor is used for driving the first lead screw to rotate, and the first lead screw drives the first sliding table to reciprocate on the first guide rail.
6. The automatic golden finger high-temperature adhesive tape laminating and taping system of claim 5, further comprising a second linear module, wherein the second linear module is arranged between the first linear module and the main body fixing plate, the second linear module is perpendicular to the first linear module, the first linear module is fixedly arranged on the sliding table of the second linear module, and the second linear module is used for driving the first linear module to reciprocate along a direction perpendicular to two sides of a golden finger of a PCB (printed circuit board).
7. The automatic golden finger high-temperature adhesive tape laminating and taping system of claim 6, wherein the second linear module is a synchronous belt linear module and comprises a second stepping motor, a second lead screw, a second sliding table and a second guide rail, the second stepping motor is used for driving the second lead screw to rotate, and the second lead screw drives the second sliding table to reciprocate on the second guide rail.
8. The automatic golden finger high-temperature adhesive tape attaching and covering system according to any one of claims 1 to 7, further comprising a waiting station and a finishing station, wherein the waiting station and the finishing station are symmetrically arranged on two sides of the PCB conveying device, the waiting station is used for placing and conveying a PCB to be attached, and the finishing station is used for placing and conveying a PCB to be attached.
9. The automatic bonding and taping system of gold finger high temperature adhesive tape according to claim 8, characterized in that: the hemming wheel is made of a flexible material.
10. The automatic golden finger high-temperature adhesive tape laminating and taping system of claim 9, further comprising a laminating device, wherein the laminating device is arranged above the PCB conveying device and used for laminating a high-temperature adhesive tape on a golden finger of a PCB, the laminating device comprises a laminating driving mechanism and a high-temperature adhesive tape laminating mechanism, the laminating driving mechanism is arranged on the workbench and fixedly connected with the laminating driving mechanism, the laminating driving mechanism is used for driving the high-temperature adhesive tape laminating mechanism to move in a three-dimensional space, the high-temperature adhesive tape laminating mechanism is arranged above the PCB conveying device, and the high-temperature adhesive tape laminating mechanism is used for laminating a high-temperature adhesive tape on a golden finger of a PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210593563.0A CN114872971B (en) | 2022-05-27 | 2022-05-27 | Automatic bonding and edge-wrapping system for golden finger high-temperature adhesive tape |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210593563.0A CN114872971B (en) | 2022-05-27 | 2022-05-27 | Automatic bonding and edge-wrapping system for golden finger high-temperature adhesive tape |
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| CN114872971A true CN114872971A (en) | 2022-08-09 |
| CN114872971B CN114872971B (en) | 2024-03-29 |
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|---|---|
| CN114872971B (en) | 2024-03-29 |
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