CN114867216A - Process for manufacturing conductive circuit - Google Patents
Process for manufacturing conductive circuit Download PDFInfo
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- CN114867216A CN114867216A CN202210325879.1A CN202210325879A CN114867216A CN 114867216 A CN114867216 A CN 114867216A CN 202210325879 A CN202210325879 A CN 202210325879A CN 114867216 A CN114867216 A CN 114867216A
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 7
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a process for manufacturing a conductive circuit, which comprises the following steps: s1: combining a prepared base material layer material with a protective layer material through a composite process; s2: die-cutting a dividing line of the circuit and the non-circuit area on the substrate layer by using a die-cutting process; s3: carrying out vacuum metal layer plating on the whole base material layer by using a vacuum plating process; s4: removing the unnecessary metal layer in the substrate layer and reserving the required metal layer; s5: the substrate layer with the metal layer is covered with another protective layer. The invention solves the technical problems of high use cost, insufficient bonding strength and single material selection of the silk-screen circuit in the prior art.
Description
Technical Field
The invention relates to the technical field of silk-screen flexible circuits, in particular to a process for manufacturing a conductive circuit.
Background
Flexible circuit boards are often used as basic accessories for various electronic devices. The manufacturing method of the flexible circuit board in the prior art is complex, and a plurality of processes such as copper deposition, etching and the like are required. Thereby leading to the defect of low production efficiency of the prior flexible circuit board. In addition, the existing process also has the technical problems that the manufacturing cost of the flexible circuit board is high, the manufacturing process of the flexible circuit board is difficult to control, and the like. Based on this, chinese patent CN111867265A discloses a method for manufacturing a flexible circuit board, which includes the following steps: the flexible silver paste drying device comprises a flexible substrate, flexible silver paste and a screen printing device, wherein the screen printing device is used for printing the flexible silver paste on one side of the flexible substrate to form a conductive circuit and provide a drying device, and the drying device is used for drying the flexible silver paste on the flexible substrate so as to solidify the conductive circuit. According to the manufacturing method of the flexible circuit board, the processes of copper deposition, etching and the like of the flexible circuit board in the prior art are omitted in the manufacturing of the flexible circuit board, so that the production process flow of the flexible circuit board is simplified, and the production of the flexible circuit board is simpler and more controllable.
However, the manufacturing method of the flexible circuit board mainly adopts a silver paste material to perform the process of silk-screening the conductive circuits, and the cost of the silver paste material is high, so that heavy cost pressure is brought to a manufacturing enterprise in large-scale production practice. In addition, the silver paste material in the above-mentioned method for manufacturing a flexible printed circuit board needs to be combined with a substrate, and the substrate material commonly used in the method generally includes a film member, a bonding adhesive and a PET plastic layer. Because the bonding strength of the silver paste and the substrate is insufficient, the structures of the silver paste and the substrate are unstable, and the silver paste and the substrate are easily separated in use to lose efficacy. Although the injection molding part is additionally added in the manufacturing method of the flexible circuit board to further limit the structure of the silver paste material and the substrate, the process still causes additional increase of the manufacturing cost of enterprises. In addition, many materials capable of conducting electricity exist, but the manufacturing method of the flexible circuit board limits that the conducting circuit can only use silver paste, so that the defect of single material exists.
Disclosure of Invention
Therefore, it is necessary to provide a process for manufacturing a conductive circuit for solving the technical problems of high use cost, insufficient bonding strength and single material selection of a silk-screen circuit in the prior art.
A process for fabricating conductive lines, comprising the steps of:
s1: combining a prepared base material layer material with a protective layer material through a composite process;
s2: die-cutting a dividing line of the circuit and the non-circuit area on the substrate layer by using a die-cutting process;
s3: carrying out vacuum metal layer plating on the whole base material layer by using a vacuum plating process;
s4: removing the unnecessary metal layer in the substrate layer and reserving the required metal layer;
s5: the base material layer with the metal layer is covered with another protective layer.
Specifically, the protective layer is made of PP, PET, PI or LCP.
Specifically, the material of the substrate layer is PP, PET, PI or LCP.
Further, the protective layer and the substrate layer are made of the same material.
Specifically, the compounding process comprises dry compounding, wet compounding, extrusion compounding and co-extrusion compounding.
Preferably, the compounding process in step S1 is a dry compounding process.
Specifically, the material used in the vacuum plating process in step S3 is silver, copper, aluminum, nickel, gold, or other alloy material.
Specifically, the vacuum plating process is a physical vapor deposition process or a chemical vapor deposition process.
In summary, the flexible circuit board product with a stable structure can be obtained by the process for manufacturing the conductive circuit sequentially through the composite process, the die cutting process, the vacuum plating process, the peeling process and the secondary composite process. Specifically, the protective layer and the substrate layer may be made of the same material or materials with similar material characteristics; therefore, in the composite process, the protective layer and the base material layer can form a composite layer product with high composite strength, high stability and high product transparency; compared with the silk-screen process of the silver paste material and the base material in the prior art, the composite process of the same or similar materials used in the process for manufacturing the conductive circuit can obtain a product with a more stable structure. Further, the vacuum plating process used in the present invention allows the user to use metallic materials such as silver, copper, aluminum, nickel, gold, or other alloys; therefore, the defect that the circuit of the conductive layer in the prior art is limited to the silver paste material is overcome. By using metal materials such as copper, aluminum or nickel with lower cost, the user saves the use cost of the materials in large-scale production and production; in addition, the user can have more free material selectivity, and the practicability of the process for manufacturing the conducting circuit is further improved, so that the process is easy to realize large-batch production.
Drawings
FIG. 1 is a flow chart of a process for fabricating conductive traces according to the present invention;
FIG. 2 is a schematic structural diagram of a composite process combined with a later embodiment of the present invention in a process for manufacturing conductive traces;
FIG. 3 is a schematic structural diagram of a conductive trace manufacturing process using a die cutting process according to one embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a vacuum plating process used in a process for manufacturing conductive traces according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram illustrating a conductive trace manufacturing process according to a second embodiment of the present invention;
fig. 6 is a schematic structural diagram of an embodiment of the present invention after a protective film is added in the process of manufacturing a conductive circuit.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being permanently connected, detachably connected, or integral; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are for purposes of illustration only and do not denote a single embodiment.
Referring to fig. 1, fig. 1 is a flow chart of a process for fabricating conductive lines according to the present invention. As shown in fig. 1, a process for manufacturing a conductive circuit according to the present invention includes the following steps:
s1: combining a prepared base material layer material with a protective layer material through a composite process;
s2: die-cutting a dividing line of the circuit and the non-circuit area on the substrate layer by using a die-cutting process;
s3: carrying out vacuum metal layer plating on the whole base material layer by using a vacuum plating process;
s4: removing the unnecessary metal layer in the substrate layer and reserving the required metal layer;
s5: the substrate layer with the metal layer is covered with another protective layer.
Specifically, please continue to refer to fig. 2; fig. 2 is a schematic structural diagram of an embodiment of a composite process combination used in a process for manufacturing a conductive circuit according to the present invention. As shown in fig. 2, the protective layer 1 and the substrate layer 2 bonded by the composite process can be closely and seamlessly bonded together. The material of the protective layer 1 can be PP, PET, PI or LCP and other common film materials; the substrate layer 2 can also be made of common film materials such as PP, PET, PI or LCP; that is, the same material as the protective layer 1 may be used for the base material layer 2. Further, the protective layer 1 and the substrate layer 2 can be combined through a composite process; the composite process is also commonly referred to as a lamination process. The composite process specifically comprises the following steps: the film materials with different properties are adhered together in a certain way and then sealed to play a role in protecting the contents. Common composite processing methods include dry compounding, wet compounding, extrusion compounding, co-extrusion compounding, and the like. Among various processing techniques for composite films, the dry lamination is currently one of the most widely used lamination techniques. The dry compounding means that: coating a layer of solvent adhesive on the plastic film by using a coating device; then, removing the solvent through a film coating machine and drying; and then is compounded with other base materials under the hot pressing state, such as films, aluminum foils and the like, to form a composite film. The whole process is compounded in a state that the adhesive is dry, that is, in a state that no solvent is present, and thus the compounding is called dry compounding. The coating apparatus is generally referred to as gravure wire roll coating. Further, the wet lamination is a lamination process of coating a layer of adhesive on the surface of the composite base material, laminating the adhesive with other materials through a compression roller under the condition that the adhesive is not dried, and drying the adhesive through a hot drying channel to form the composite film. Further, the extrusion lamination is a lamination process in which a thermoplastic material such as polyethylene is melted in an extruder and then extruded into a flat die orifice, and when the thermoplastic material becomes a sheet-shaped film and flows out, the sheet-shaped film is immediately compounded with another film or two films through a cooling roller and a lamination roller. Further, the co-extrusion lamination refers to a molding method for preparing a composite film by respectively melting and plasticizing two or more different plastics through two or more extruders and then feeding the various plastics into a pair of dies or converging the plastics supplied by the various extruders through a distributor and then feeding the plastics into the dies. In the co-extrusion compounding, the different plastics can be different types of plastics, also can be the same type of plastics with different marks, or the same type of plastics with different formulas. The composite process used in the process for manufacturing the conductive circuit can be dry composite, wet composite, extrusion composite or co-extrusion composite and other composite processes.
Specifically, please continue to refer to fig. 3; fig. 3 is a schematic structural diagram of a die-cutting process used in a process for manufacturing a conductive circuit according to an embodiment of the present invention. As shown in fig. 3, the substrate layer in the embodiment shown in fig. 2 is processed by a die cutting process by a user to obtain a predetermined shape. Specifically, the die cutting process is to combine a die cutting plate through a die cutting knife according to a pattern of a product design requirement; then, under the action of the pressure generated by the die cutting equipment, the film-shaped product is roll-cut into the required shape or cut mark. The die cutting process needs to be performed by a die cutter. The die cutting machine can be called a beer machine, a cutting machine or a numerical control punching machine; the die cutting machine has the working principle that a template and the like carved by a die cutter, a steel knife, a hardware die, a steel wire or a steel plate are utilized, certain pressure is applied to a processed material through the stamping plate, and therefore the processed material is cut into a preset shape. The die cut line 3 shown in fig. 3 is an example of a die cut line produced by a die cutting machine using a die cutting process.
Specifically, please continue to refer to fig. 4; fig. 4 is a schematic structural diagram of a vacuum plating process used in a process for manufacturing a conductive circuit according to an embodiment of the present invention. As shown in fig. 4, the substrate layer 2 and the die cut line 3 after die cutting are processed by vacuum plating to obtain an integral vacuum plated metal layer 4. The material used for vacuum plating can be silver, copper, aluminum, nickel, gold or other metal materials such as alloys. That is, the defect that the prior art for manufacturing the lead wire is limited to only using silver paste material can be avoided through the vacuum plating process. The user can have higher freedom of material selection and effectively control the cost of the product according to the application scenes of different products. More specifically, the vacuum plating process refers to: heating metal or non-metal material under high vacuum condition to evaporate and condense the metal or non-metal material on the plated part; the plated piece can be a metal, a semiconductor or an insulator; further, a method of forming a thin film on the surface of the plated article. The vacuum plating process may be classified into a physical vapor deposition process and a chemical vapor deposition process. The physical vapor deposition process is as follows: a method of vaporizing the plating material into atoms, molecules or ionizing it into ions under vacuum conditions by various physical methods and then depositing it directly on the surface of the substrate. The physical vapor deposition process utilizes a physical process, such as thermal evaporation of a substance or sputtering of atoms on the surface of a substance when subjected to ion bombardment, to achieve a controlled transfer of atoms of the substance from a source substance to a thin film. In addition, the chemical vapor deposition process refers to: a method of forming a metal or compound thin film on a substrate by supplying a simple substance gas or a compound containing an element constituting the thin film to the substrate and by gas phase action or chemical reaction on the surface of the substrate. The vacuum plating process used in the process for manufacturing the conductive circuit can be a physical vapor deposition process or a chemical vapor deposition process.
Specifically, please continue to refer to fig. 5; fig. 5 is a schematic structural diagram of a conductive circuit manufacturing process according to a later embodiment of the present invention. As can be seen from fig. 3, 4 and 5, in the die cutting process, the predetermined die cut line 3 is die-cut on the base material 2 in advance, and then, all areas of the base material 2 including the die cut line 3 are vacuum-plated with the required metal conductive material in the vacuum plating process; then, in the process of forming the conductive circuit, the user may remove the metal layer that is plated but not needed at the same time in the vacuum plating process, and then, the metal layer that is needed by the user is remained. The required metal layer is the conductive line 5 shown in fig. 5. The conductive line 5 is the shape of the line processed by the user in the die cutting process according to a preset shape. Furthermore, a user can remove the metal layer material which is not needed by the user through a common metal stripping process, for example, a photoresist can be used as a mask, and after the photoresist is subjected to conventional exposure, chlorobenzene is used for soaking the product to be stripped for a preset time; then, before developing, hardening treatment is carried out, and then, developing is slightly carried out, so that the photoresist graph is in a chamfer suspension shape; at this time, the substrate is etched according to a preset procedure; and depositing a metal film on the basis, and finally, soaking by using acetone to remove the photoresist and the redundant metal, thereby completing the stripping of the metal.
Specifically, please continue to refer to fig. 6; fig. 6 is a schematic structural diagram of an embodiment of the present invention after a protective film is added in the process of manufacturing a conductive circuit. As shown in fig. 6; after removing the unnecessary metal layer and retaining the desired conductive traces 5, the user needs to further protect the retained conductive traces 5. More specifically, the user can compound another protective layer 1 on the side surface of the substrate layer 2 with the conductor line 5 by a compound process; that is, the two protection layers 1 are respectively compounded on two sides of the substrate layer 2, so that the conductor circuit attached to the substrate layer 2 is effectively protected.
In summary, the flexible circuit board product with a stable structure can be obtained by the process for manufacturing the conductive circuit sequentially through the composite process, the die cutting process, the vacuum plating process, the peeling process and the secondary composite process. Specifically, the protective layer 1 and the base material layer 2 may be made of the same material or materials having similar material characteristics; therefore, in the composite process, the protective layer 1 and the substrate layer 2 can form a composite layer product with high composite strength, good stability and high product transparency; compared with the silk-screen process of the silver paste material and the base material in the prior art, the composite process of the same or similar materials used in the process for manufacturing the conductive circuit can obtain a product with a more stable structure. Further, the vacuum plating process used in the present invention allows the user to use metallic materials such as silver, copper, aluminum, nickel, gold, or other alloys; therefore, the defect that the circuit of the conductive layer in the prior art is limited to the silver paste material is overcome. By using metal materials such as copper, aluminum or nickel with lower cost, the user saves the use cost of the materials in large-scale production and production; moreover, the user can have more free material selectivity, and the practicability of the process for manufacturing the conductive circuit is further increased.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. A process for fabricating a conductive line, comprising the steps of:
s1: combining a prepared base material layer material with a protective layer material through a composite process;
s2: die-cutting a dividing line of the circuit and the non-circuit area on the substrate layer by using a die-cutting process;
s3: performing vacuum metal layer plating on the whole base material layer by using a vacuum plating process;
s4: removing the unnecessary metal layer in the substrate layer and reserving the required metal layer;
s5: the substrate layer with the metal layer is covered with another protective layer.
2. A process for manufacturing a conductive line according to claim 1, wherein: the protective layer is made of PP, PET, PI or LCP.
3. A process for manufacturing a conductive line according to claim 1, wherein: the material of the substrate layer is PP, PET, PI or LCP.
4. A process for manufacturing a conductive line according to claim 2 or 3, wherein: the protective layer and the substrate layer are made of the same material.
5. A process for manufacturing a conductive line according to claim 1, wherein: the compounding process comprises dry compounding, wet compounding, extrusion compounding and co-extrusion compounding.
6. A process for manufacturing a conductive line according to claim 5, wherein: the compounding process described in step S1 is a dry compounding process.
7. A process for manufacturing a conductive line according to claim 1, wherein: the material used in the vacuum plating process in step S3 is silver, copper, aluminum, nickel, gold, or other alloy material.
8. A process for manufacturing a conductive line according to claim 1, wherein: the vacuum plating process is a physical vapor deposition process or a chemical vapor deposition process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210325879.1A CN114867216B (en) | 2022-03-30 | 2022-03-30 | Process for manufacturing conductive circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210325879.1A CN114867216B (en) | 2022-03-30 | 2022-03-30 | Process for manufacturing conductive circuit |
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| Publication Number | Publication Date |
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| CN114867216A true CN114867216A (en) | 2022-08-05 |
| CN114867216B CN114867216B (en) | 2024-05-17 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130050056A (en) * | 2011-11-07 | 2013-05-15 | 삼성전기주식회사 | Printed circuit board and method for manufacturing the same |
| CN104735915A (en) * | 2013-12-20 | 2015-06-24 | 台湾立讯精密有限公司 | Method for forming conductor line on insulating substrate |
| KR20160064386A (en) * | 2014-11-28 | 2016-06-08 | 주식회사 아모센스 | Flexible printed circuit board and manufacturing method of the same |
| KR20160064466A (en) * | 2014-11-28 | 2016-06-08 | 주식회사 아모센스 | Method for manufacturing flexible printed circuit board, and flexible printed circuit board manufactured thereby |
| CN107911949A (en) * | 2017-11-06 | 2018-04-13 | 王国清 | A kind of wiring thin film board manufacturing method |
| CN108174519A (en) * | 2017-12-27 | 2018-06-15 | 江西鑫力华数码科技有限公司 | A kind of preparation method of flexible circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130050056A (en) * | 2011-11-07 | 2013-05-15 | 삼성전기주식회사 | Printed circuit board and method for manufacturing the same |
| CN104735915A (en) * | 2013-12-20 | 2015-06-24 | 台湾立讯精密有限公司 | Method for forming conductor line on insulating substrate |
| KR20160064386A (en) * | 2014-11-28 | 2016-06-08 | 주식회사 아모센스 | Flexible printed circuit board and manufacturing method of the same |
| KR20160064466A (en) * | 2014-11-28 | 2016-06-08 | 주식회사 아모센스 | Method for manufacturing flexible printed circuit board, and flexible printed circuit board manufactured thereby |
| CN107911949A (en) * | 2017-11-06 | 2018-04-13 | 王国清 | A kind of wiring thin film board manufacturing method |
| CN108174519A (en) * | 2017-12-27 | 2018-06-15 | 江西鑫力华数码科技有限公司 | A kind of preparation method of flexible circuit board |
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