CN114864746B - Photovoltaic module preparation method - Google Patents
Photovoltaic module preparation method Download PDFInfo
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- CN114864746B CN114864746B CN202210513001.0A CN202210513001A CN114864746B CN 114864746 B CN114864746 B CN 114864746B CN 202210513001 A CN202210513001 A CN 202210513001A CN 114864746 B CN114864746 B CN 114864746B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 239000002131 composite material Substances 0.000 claims abstract description 251
- 238000000151 deposition Methods 0.000 claims abstract description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052709 silver Inorganic materials 0.000 claims abstract description 12
- 239000004332 silver Substances 0.000 claims abstract description 12
- 239000002313 adhesive film Substances 0.000 claims description 55
- 238000007731 hot pressing Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 7
- 238000002310 reflectometry Methods 0.000 claims description 7
- 239000002390 adhesive tape Substances 0.000 claims description 6
- 238000003475 lamination Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 238000007641 inkjet printing Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 239000005341 toughened glass Substances 0.000 claims description 3
- 238000010023 transfer printing Methods 0.000 claims description 3
- 238000010248 power generation Methods 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 210000004027 cell Anatomy 0.000 description 9
- 230000008021 deposition Effects 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 241000276425 Xiphophorus maculatus Species 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 101001073212 Arabidopsis thaliana Peroxidase 33 Proteins 0.000 description 2
- 101001123325 Homo sapiens Peroxisome proliferator-activated receptor gamma coactivator 1-beta Proteins 0.000 description 2
- 102100028961 Peroxisome proliferator-activated receptor gamma coactivator 1-beta Human genes 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/02168—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells the coatings being antireflective or having enhancing optical properties for the solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Energy (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a preparation method of a photovoltaic module, which comprises the following steps: 1) Preparing a first composite member and a second composite member; 2) Paving an inter-chip electric connector; 3) Laying conductive wires; 4) Dividing the conductive wire; 5) Depositing conductive paste; 6) Paving a battery piece; 7) Paving a second composite part; 8) The assembly is laminated. The invention can simply and effectively realize low silver consumption and low front shading, improve the light utilization rate and improve the power generation performance of the photovoltaic module.
Description
Technical Field
The invention relates to a preparation method of a photovoltaic module.
Background
The solar photovoltaic cell is a large-area semiconductor device which directly converts light energy into electric energy, has low voltage and high current, and is generally used in series in photovoltaic application to stabilize current and boost voltage. The surface of the battery piece receives illumination to generate current, the current is collected through uniformly distributed metal grid lines on the surface of the battery piece and then is collected on a metal wire with larger cross section area, and is transmitted to the next battery piece to form a current path, and the current density is generally up to 40mA/cm due to high current 2 As described above, the battery surface must be made of a metal having high conductivity, and silver or copper is generally used.
Although the above conventional contact designs can meet the long-term outdoor photovoltaic applications, there are still some problems: (1) the surface metal can shade 3% -5% or even higher on the battery piece, which is not beneficial to photoelectric conversion; (2) the surface metal still has 2% -3% of electrical loss; (3) no good simple and effective surface metallization and connection technology is available to balance metal shading and metal electrical loss, so that the output efficiency and metal consumption of the photovoltaic cell assembly are optimized.
Disclosure of Invention
The invention aims to provide a preparation method of a photovoltaic module, which comprises the following steps:
1) Preparing a composite part: paving a low-fluidity transparent packaging adhesive film on the plate-shaped piece, and pressing the adhesive film and the plate-shaped piece into a composite piece; the composite pieces comprise a first composite piece and a second composite piece, wherein the platy piece of one composite piece is a photovoltaic panel, and the platy piece of the other composite piece is a photovoltaic backboard; taking the surface of the adhesive film facing the plate-shaped member as the inner side surface of the adhesive film; taking the surface of the adhesive film opposite to the plate-shaped piece as the outer side surface of the adhesive film;
2) Lay the electrical connector between the pieces: (the plate-shaped parts of the first composite part and the second composite part are arranged downwards, the adhesive films of the first composite part and the second composite part are arranged upwards), a plurality of parallel strip-shaped inter-chip electrical connectors are respectively paved on the outer side surfaces of the adhesive films of the first composite part and the second composite part, and battery pieces can be paved between two adjacent inter-chip electrical connectors on the same composite part; taking the interval between two adjacent electric connectors on the same composite piece as the interval between the pieces, wherein the interval between the pieces of the first composite piece and the interval between the pieces of the second composite piece are the same; taking one surface of the inter-chip electric connector facing the plate-shaped piece as the inner side surface of the inter-chip electric connector; the surface of the inter-chip electric connector opposite to the plate-shaped piece is taken as the outer side surface of the inter-chip electric connector; the inner side surface of the inter-chip electric connector is provided with a reflecting structure; embedding the inter-chip electric connector into the adhesive film of the composite part where the inter-chip electric connector is positioned, wherein the outer side surface of the inter-chip electric connector is not lower than the outer side surface of the adhesive film (namely, the outer side surface of the inter-chip electric connector protrudes out of the outer side surface of the adhesive film, or the outer side surface of the inter-chip electric connector is leveled with the outer side surface of the adhesive film);
3) Laying conductive wires: (the plate-shaped parts of the first composite part and the second composite part are arranged downwards, the adhesive films of the first composite part and the second composite part are arranged upwards), and a plurality of parallel conductive wires are respectively paved on the outer side surfaces of the adhesive films of the first composite part and the second composite part, so that the conductive wires on the same composite part are perpendicular to the inter-chip electrical connectors on the composite part, and the conductive wires span all the inter-chip electrical connectors on the composite part; the cross section of the conductive wire is triangular (the cross section is a cross section perpendicular to the extending direction of the conductive wire), one corner of the conductive wire (namely, one corner of the triangular cross section of the conductive wire) faces to a plate-shaped piece of the composite piece where the conductive wire is positioned, one corner facing the plate-shaped piece is taken as the vertex angle of the conductive wire, and the surface, opposite to the vertex angle, of the conductive wire is taken as the bottom surface of the conductive wire; embedding a conductive wire between two adjacent electrical connectors on the same composite part into the adhesive film of the composite part, wherein the bottom surface of the conductive wire is not lower than the outer side surface of the adhesive film (namely, the bottom surface of the conductive wire protrudes out of the outer side surface of the adhesive film or the bottom surface of the conductive wire is leveled with the outer side surface of the adhesive film);
4) Dividing the conductive wire: dividing the conductive wires on the first composite part and the second composite part into a plurality of conductive wire small sections; the small sections of the conductive wires which are cut out by the same conductive wire are in one-to-one correspondence with the inter-chip electrical connectors on the composite part where the conductive wires are positioned, one ends of the small sections of the conductive wires are lapped on the outer side surfaces of the corresponding inter-chip electrical connectors, and the other ends of the small sections of the conductive wires are not contacted with the adjacent inter-chip electrical connectors; taking the direction of the conductive wire small section far away from the electric connector between the overlapped sheets as the extending direction of the conductive wire small section, wherein the extending directions of the conductive wire small sections on the same composite part are the same;
5) Depositing conductive paste: (the plate-shaped parts of the first composite part and the second composite part are arranged downwards, the adhesive films of the first composite part and the second composite part are arranged upwards), and conductive paste is deposited on the bottom surfaces of the conductive wire segments of the first composite part and the second composite part (namely the bottom surfaces of the conductive wires where the conductive wire segments are originally positioned) and the outer side surfaces of the inter-chip electrical connectors;
6) Paving a battery piece: paving battery pieces between two adjacent inter-chip electrical connectors of a first composite part (the plate-shaped part of the first composite part is arranged downwards and the adhesive film of the first composite part is arranged upwards), so that the battery pieces cover small conductive wire sections between the two adjacent inter-chip electrical connectors; if the plate-shaped member of the first composite member is a panel, the front surface of the battery piece faces the plate-shaped member of the first composite member; if the plate-shaped piece of the first composite piece is a photovoltaic backboard, the back surface of the battery piece faces to the plate-shaped piece of the first composite piece; taking one surface of the battery piece, facing the plate-shaped piece of the first composite piece, as a first surface of the battery piece; the surface of the battery piece opposite to the plate-shaped piece of the first composite piece is taken as a second surface of the battery piece;
7) Paving a second composite part: the second composite piece is paved on the battery piece, so that the inter-piece electric connector of the second composite piece faces to the first composite piece (the plate-shaped piece of the second composite piece is upwards, the adhesive film of the second composite piece is downwards), the inter-piece electric connectors of the second composite piece are in one-to-one correspondence with the inter-piece electric connectors of the first composite piece, the inter-piece electric connectors of the second composite piece are parallel to the corresponding inter-piece electric connectors of the first composite piece, and the inter-piece electric connectors of the second composite piece cover the corresponding inter-piece electric connectors of the first composite piece; the extending direction of the conductive wire small section on the second composite part is opposite to the extending direction of the conductive wire small section on the first composite part; a small conductive wire section between two adjacent inter-chip electrical connectors on the second composite member is attached to the battery piece between the two adjacent inter-chip electrical connectors; at this time, a component to be laminated is formed;
8) Lamination of the components: laminating the components into a whole to obtain an integrated component; in the integrated component: the first surface of the battery piece is electrically connected with the conductive wire small section covered by the battery piece on the first composite piece, the second surface of the battery piece is electrically connected with the conductive wire small section attached to the battery piece on the second composite piece, the inter-piece electric connector of the first composite piece and the second composite piece is electrically connected with the conductive wire small section lapped on the inter-piece electric connector, and the inter-piece electric connector of the second composite piece is electrically connected with the corresponding inter-piece electric connector of the first composite piece.
Preferably, in step 1): the adhesive film is made of EVA film or POE film; the panel is made of toughened glass; and pressing the adhesive film and the plate-shaped piece into a composite piece by adopting a vacuum hot pressing mode.
Preferably, in step 2): the light reflecting structure on the inner side surface of the inter-chip electric connector is a sawtooth-shaped light reflecting structure; embedding the inter-chip electrical connector into the adhesive film by adopting a hot pressing mode.
Preferably, in step 2): the tooth top angle of the sawtooth-shaped reflective structure is 90-140 degrees, and the chamfer radius R of the tooth top angle is less than or equal to 0.03mm.
Preferably, in step 3): the conductive wire has an equilateral triangle shape in cross section (the cross section is a cross section perpendicular to the extending direction of the conductive wire).
Preferably, in step 3): the vertex angle of the conductive wire is smaller than 90 degrees, and the chamfer radius R of the vertex angle of the conductive wire is smaller than or equal to 0.01mm; the width of the bottom surface of the conductive wire is 0.05-0.2 mm; the distance between two adjacent conductive wires on the same composite part is 1-3 mm; the height of the bottom surface of the conductive wire protruding out of the outer side surface of the adhesive film is 0-0.05 mm.
Preferably, in step 3): the surface of the conductive wire is covered with a reflecting layer, and the reflectivity of the reflecting layer is more than or equal to 80 percent.
Preferably, in step 3): the conductive wire is copper wire, the reflecting layer is silver layer, and the thickness of the reflecting layer is 0.05-5 mu m.
Preferably, in step 3): embedding the conductive wire into the adhesive film in a hot-pressing mode; the bottom surface of the conductive wire is parallel to the outer side surface of the adhesive film.
Preferably, in step 5): depositing conductive paste by adopting a screen printing mode, an ink-jet printing mode or a laser transfer printing mode and the like; the conductive paste can be solder paste or silver paste.
Preferably, in step 5): the conductive paste is low-temperature conductive paste, the low-temperature conductive paste can be low-temperature solder paste or low-temperature silver paste and other materials, the curing temperature of the low-temperature conductive paste is lower than 150 ℃, and the low-temperature conductive paste can be cured in the component lamination step.
Preferably, in step 6): the first surface of the battery piece is provided with a plurality of grid lines (which can be main grids), the grid lines on the first surface of the battery piece are in one-to-one correspondence with the conductive wire small sections covered by the battery piece on the first composite piece, the grid lines on the first surface of the battery piece are parallel to the corresponding conductive wire small sections on the first composite piece, and the grid lines on the first surface of the battery piece are covered on the corresponding conductive wire small sections of the first composite piece.
Preferably, in the integrated assembly: the grid line on the first surface of the battery piece is electrically connected with the corresponding conductive wire small section on the first composite piece, and the contact resistance between the grid line and the corresponding conductive wire small section is less than or equal to 0.5 omega mm 2 。
Preferably, in step 6): the battery piece is provided with a metal electrode on the surface; alternatively, the battery sheet is a battery sheet having no metal electrode on the surface.
Preferably, in step 6): the battery piece is PERC, PERT, TOPCon or HJT battery piece.
Preferably, in step 6): the battery piece is pre-fixed on the first composite piece, and the battery piece is prevented from being displaced relative to the first composite piece.
Preferably, in step 6): pre-fixing the battery piece on the first composite piece in a hot-pressing mode; alternatively, the battery tab is pre-secured to the first composite member using an adhesive tape.
Preferably, in step 7): the second surface of the battery piece is provided with a plurality of grid lines (which can be a main grid), the grid lines on the second surface of the battery piece are in one-to-one correspondence with the small sections of the conductive wires attached to the battery piece on the second composite piece, the grid lines on the second surface of the battery piece are parallel to the corresponding small sections of the conductive wires on the second composite piece, and the small sections of the conductive wires on the second composite piece are covered on the corresponding grid lines on the second surface of the battery piece.
Preferably, in the integrated assembly: the grid line on the second surface of the battery piece is electrically connected with the corresponding conductive wire small section on the second composite piece, and the contact resistance between the grid line and the corresponding conductive wire small section is less than or equal to 0.5 omega mm 2 。
Preferably, in step 7): the second composite member is pre-fastened to the first composite member to prevent displacement of the second composite member relative to the first composite member.
Preferably, in step 7): pre-fixing the second composite part on the first composite part in a hot-pressing mode; alternatively, the second composite member is pre-fastened to the first composite member using an adhesive tape.
Preferably, in step 6): the first side of the cell is covered with a TCO transparent conductive layer electrode.
Preferably, in step 7): and the second surface of the cell is covered with a TCO transparent conductive layer electrode.
The invention has the advantages and beneficial effects that:
the surface of the battery piece in the component can only have small sections of the conductive wires, the surface of the battery piece is basically not shaded, and the photoelectric conversion efficiency of the component is high.
However, the conductive wire can cause a certain actual shadow shading on the surface of the battery, and the conductive wire with the triangular cross section is adopted in the invention, so that the light irradiated on the conductive wire can be reflected to the surface of the battery piece, the utilization rate of the light is improved, and the power generation performance of the photovoltaic module is further improved; the surface of the conductive wire is covered with the reflective layer, the reflective layer can improve the reflectivity of the conductive wire, more light can be reflected to the surface of the battery piece, the utilization rate of the light is further improved, and the power generation performance of the photovoltaic module is further improved.
The invention also provides the inter-sheet electric connectors with the sawtooth-shaped reflecting structures on the two sides of the battery sheet respectively, and the sawtooth-shaped reflecting structures can reflect the light irradiated on the inter-sheet electric connectors to the surface of the battery sheet, so that the light utilization rate can be improved, and the power generation performance of the photovoltaic module is further improved.
The invention also optimizes and selects the angle of the vertex angle of the conductive wire, the chamfer radius of the vertex angle of the conductive wire, the width of the bottom surface of the conductive wire, the reflectivity of the reflective layer of the conductive wire, the distance between two adjacent conductive wires on the same composite piece, the angle of the tooth-shaped reflective structure of the inter-chip electric connector, the chamfer radius of the tooth top angle, the contact resistance between the conductive wire (conductive wire small section) and the surface electrode of the battery piece:
1) The vertex angle of the conductive wire is smaller than 90 degrees; if the vertex angle of the conductive wire is more than or equal to 90 degrees, incident light cannot be effectively reflected to the surface of the battery piece;
2) The chamfer radius R of the top angle of the conductive wire is less than or equal to 0.01mm, and the reflectivity of the reflective layer of the conductive wire is more than or equal to 80 percent; if the chamfer radius R of the vertex angle of the conductive wire is more than 0.01mm and the reflectivity of the reflective layer of the conductive wire is less than 80 percent, reflection utilization light is greatly reduced;
3) The invention controls the width of the bottom surface of the conductive wire to be 0.05-0.2 mm, can meet the requirement of low current thermal resistance loss, and simultaneously, the equivalent shading is not too high (the equivalent shading is the actual shading minus the light reflected to the surface of the battery piece), and can balance the two;
4) The invention controls the distance between two adjacent conductive wires on the same composite part to be 1-3 mm, thereby meeting the surface resistance requirement of the battery piece;
5) The invention controls the tooth top angle of the sawtooth-shaped reflecting structure of the inter-chip electric connector to be 90-140 degrees, and controls the chamfer radius R of the tooth top angle to be less than or equal to 0.03mm; 90-140 degrees is that reflected light forms a total reflection angle interval at the interface of a photovoltaic panel (glass) and air, when the angle of the tooth top angle is large, the arc surface of a circular chamfer of the tooth top angle is small, the requirement of the chamfer radius R can be properly relaxed, the utilization influence on the reflected light is relatively small, and the manufacturing difficulty of the sawtooth-shaped reflecting structure of the inter-chip electric connector can be greatly reduced;
6) In the integrated component of the invention, the contact resistance between the conductive wire (conductive wire small section) and the surface electrode (such as grid line) of the battery piece is less than or equal to 0.5 omega mm 2 The contact resistance directly affects the current loss; the contact resistance is less than or equal to 0.5 omega mm 2 When the power output of the component is hardly affected by the heat resistance loss caused by the heat resistance loss; the contact resistance is more than 0.5 omega mm 2 When the thermal resistance loss caused by the heat-resistant material is linearly increased, the output power of the component is directly lowered.
According to the invention, the transparent adhesive film is adhered to the plate-shaped piece (the photovoltaic panel or the photovoltaic backboard) which is not easy to twist, and then the arrangement and the press-embedding of the inter-chip electric connector and the conductive wire are carried out on the adhesive film which is effectively supported by the plate-shaped piece, so that the inter-chip electric connector and the conductive wire are easy to fix and not easy to deviate, and further the graphical arrangement implementation of the inter-chip electric connector and the conductive wire is simpler and more convenient.
The invention firstly completes the arrangement and the press-fit of the inter-chip electric connector and the conductive wire, and then deposits the conductive paste on the inter-chip electric connector and the conductive wire small section, so that the deposition of the conductive paste on the outer side surface of the inter-chip electric connector (the surface of the inter-chip electric connector opposite to the sawtooth-shaped reflective structure) is simpler and more convenient and more accurate, and the deposition of the conductive paste on the bottom surface of the conductive wire small section (the surface of the original conductive wire opposite to the vertex angle) is simpler and more convenient and more accurate.
If the conductive paste is deposited first and then the conductive wire is embedded, the conductive paste needs to be deposited on one surface (the surface, opposite to the vertex angle, of the original conductive wire) of the conductive wire, and the deposited surface is found in the process of embedding the conductive wire, so that the operation difficulty is high and the error recognition rate is high. The invention deposits the conductive paste on the small section of the conductive wire which is completely pressed and embedded, greatly simplifies the manufacturing process of the component, can avoid the identification problem of the deposition surface and the reflecting surface of the conductive wire, and avoids the complex and erroneous operation such as single-sided deposition of the conductive paste and identification of the deposition surface before pressing and embedding.
The current transmission path of the assembly is simple, and current can be gathered from the surface of a battery piece to the bottom surface of a small section of the conductive wire and transmitted to the small section of the conductive wire on the other side through the inter-piece electric connector to flow to the next battery piece; the component of the invention can be free of a conduction path of a traditional battery metal fine grid, so that the thermal resistance loss in the whole current transmission process is small, and the output power of the component is further improved.
According to the invention, only current longitudinal conduction is required between the cell surface electrode (such as a grid line) and the conductive wire small section, so that only a very thin layer of conductive paste is required between the conductive wire small section and the cell surface electrode; the conductive paste of the existing component is mainly silver paste, and the thinner the conductive paste is, the better the conductive paste is, compared with the existing component, the use amount of the conductive paste of the invention can be greatly reduced, and the silver consumption can be saved by more than 80 percent.
The invention firstly performs the press-embedding on the whole conductive wire, and then cuts the conductive wire into a plurality of conductive wire segments in a segmented way, thus being easy to realize on an automatic assembly line. The invention can realize the application of extremely fine and extremely multiple conductive wires in the photovoltaic cell assembly, has simple and effective method, does not basically influence the assembly process speed, and can even be faster than the traditional welding process speed.
The process steps of the invention can be connected in series through the assembly line, the automatic manufacture of the assembly can be simply realized, and the manufacture speed is high.
The invention can simply and effectively realize low silver consumption and low front shading.
The preparation method of the component is applicable to battery pieces with metal electrodes (such as PERC, PERT, TOPCon, HJT battery pieces) and battery pieces without metal electrodes on the surfaces (such as HJT battery pieces).
Detailed Description
The following describes the invention in further detail with reference to examples. The following examples are only for more clearly illustrating the technical aspects of the present invention, and are not intended to limit the scope of the present invention.
The technical scheme of the invention is as follows:
example 1
The invention provides a preparation method of a photovoltaic module, which comprises the following steps:
1) Preparing a composite part: paving a low-fluidity transparent packaging adhesive film on the plate-shaped piece, and pressing the adhesive film and the plate-shaped piece into a composite piece in a vacuum hot pressing mode; the composite pieces comprise a first composite piece and a second composite piece, wherein the platy piece of one composite piece is a photovoltaic panel, and the platy piece of the other composite piece is a photovoltaic backboard; taking the surface of the adhesive film facing the plate-shaped member as the inner side surface of the adhesive film; taking the surface of the adhesive film opposite to the plate-shaped piece as the outer side surface of the adhesive film;
specific: the adhesive film is made of EVA film or POE film; the panel is made of toughened glass;
2) Lay the electrical connector between the pieces: a plurality of parallel strip-shaped inter-chip electrical connectors (the strip-shaped inter-chip electrical connectors are arranged at intervals side by side) are respectively paved on the outer side surfaces of the adhesive films of the first composite piece and the second composite piece, and battery pieces can be paved between two adjacent inter-chip electrical connectors on the same composite piece; taking the interval between two adjacent electric connectors on the same composite piece as the interval between the pieces, wherein the interval between the pieces of the first composite piece and the interval between the pieces of the second composite piece are the same; taking one surface of the inter-chip electric connector facing the plate-shaped piece as the inner side surface of the inter-chip electric connector; the surface of the inter-chip electric connector opposite to the plate-shaped piece is taken as the outer side surface of the inter-chip electric connector; the inner side surface of the inter-chip electric connector is provided with a sawtooth-shaped reflecting structure; embedding the inter-chip electric connector into the adhesive film of the composite part where the inter-chip electric connector is positioned in a hot-pressing mode, wherein the outer side surface of the inter-chip electric connector is not lower than the outer side surface of the adhesive film (namely, the outer side surface of the inter-chip electric connector protrudes out of the outer side surface of the adhesive film, or the outer side surface of the inter-chip electric connector is leveled with the outer side surface of the adhesive film);
specific: the tooth top angle of the sawtooth-shaped reflective structure is 90-140 degrees, and the chamfer radius R of the tooth top angle is less than or equal to 0.03mm;
3) Laying conductive wires: a plurality of parallel conductive wires (a plurality of conductive wires on the same composite piece are arranged side by side at intervals) are respectively paved on the outer side surfaces of the adhesive films of the first composite piece and the second composite piece; making the conductive wires on the same composite member perpendicular to the inter-chip electrical connectors on the composite member, and making the conductive wires cross each inter-chip electrical connector on the composite member; the surface of the conductive wire is covered with a reflecting layer; the cross section of the conductive wire is in an equilateral triangle (the cross section is a cross section perpendicular to the extending direction of the conductive wire), one corner of the conductive wire (namely, one corner of the cross section triangle of the conductive wire) faces to a plate-shaped piece of a composite piece where the conductive wire is positioned, one corner of the plate-shaped piece is taken as the vertex angle of the conductive wire, and one surface, opposite to the vertex angle, of the conductive wire is taken as the bottom surface of the conductive wire; embedding a conductive wire between two adjacent electrical connectors on the same composite part into a glue film of the composite part in a hot-pressing mode, so that the bottom surface of the conductive wire is parallel to the outer side surface of the glue film, and the bottom surface of the conductive wire is not lower than the outer side surface of the glue film (namely, the bottom surface of the conductive wire protrudes out of the outer side surface of the glue film or the bottom surface of the conductive wire is leveled with the outer side surface of the glue film);
specific: the conductive wire is a copper wire; the reflective layer on the surface of the conductive wire is a silver layer, the thickness of the reflective layer is 0.05-5 mu m, and the reflectivity of the reflective layer is more than or equal to 80%; the vertex angle of the conductive wire is smaller than 90 degrees, and the chamfer radius R of the vertex angle of the conductive wire is smaller than or equal to 0.01mm; the width of the bottom surface of the conductive wire is 0.05-0.2 mm; the distance between two adjacent conductive wires on the same composite part is 1-3 mm; the height of the bottom surface of the conductive wire protruding out of the outer side surface of the adhesive film is 0-0.05 mm;
4) Dividing the conductive wire: dividing the conductive wires on the first composite part and the second composite part into a plurality of conductive wire small sections; the small sections of the conductive wires which are cut out by the same conductive wire are in one-to-one correspondence with the inter-chip electrical connectors on the composite part where the conductive wires are positioned, one ends of the small sections of the conductive wires are lapped on the outer side surfaces of the corresponding inter-chip electrical connectors, and the other ends of the small sections of the conductive wires are not contacted with the adjacent inter-chip electrical connectors; taking the direction of the conductive wire small section far away from the electric connector between the overlapped sheets as the extending direction of the conductive wire small section, wherein the extending directions of the conductive wire small sections on the same composite part are the same;
5) Depositing conductive paste: depositing conductive paste on the bottom surfaces of the conductive wire segments of the first composite part and the second composite part (namely the bottom surfaces of the conductive wires where the conductive wire segments are originally positioned) in a screen printing mode, an ink-jet printing mode or a laser transfer printing mode and the like;
specific: the conductive paste can be tin paste or silver paste and other materials;
preferably: the conductive paste can be low-temperature conductive paste, the low-temperature conductive paste can be low-temperature solder paste or low-temperature silver paste and other materials, the curing temperature of the low-temperature conductive paste is lower than 150 ℃, and the low-temperature conductive paste can be cured in the component lamination step;
6) Paving a battery piece: paving battery pieces between two adjacent inter-chip electrical connectors of a first composite part (the plate-shaped part of the first composite part is arranged downwards and the adhesive film of the first composite part is arranged upwards), so that the battery pieces cover small conductive wire sections between the two adjacent inter-chip electrical connectors; if the plate-shaped member of the first composite member is a panel, the front surface of the battery piece faces the plate-shaped member of the first composite member; if the plate-shaped piece of the first composite piece is a photovoltaic backboard, the back surface of the battery piece faces to the plate-shaped piece of the first composite piece; taking one surface of the battery piece, facing the plate-shaped piece of the first composite piece, as a first surface of the battery piece; the surface of the battery piece opposite to the plate-shaped piece of the first composite piece is taken as a second surface of the battery piece;
pre-fixing the battery piece on the first composite piece in a hot-pressing mode; or, pre-fixing the battery piece on the first composite piece by adopting an adhesive tape; preventing the battery piece from being displaced relative to the first composite member;
7) Paving a second composite part: the second composite piece is paved on the battery piece, so that the inter-piece electric connector of the second composite piece faces to the first composite piece (the plate-shaped piece of the second composite piece is upwards, the adhesive film of the second composite piece is downwards), the inter-piece electric connectors of the second composite piece are in one-to-one correspondence with the inter-piece electric connectors of the first composite piece, the inter-piece electric connectors of the second composite piece are parallel to the corresponding inter-piece electric connectors of the first composite piece, and the inter-piece electric connectors of the second composite piece cover the corresponding inter-piece electric connectors of the first composite piece; the extending direction of the conductive wire small section on the second composite part is opposite to the extending direction of the conductive wire small section on the first composite part; a small conductive wire section between two adjacent inter-chip electrical connectors on the second composite member is attached to the battery piece between the two adjacent inter-chip electrical connectors; at this time, a component to be laminated is formed;
pre-fixing the second composite part on the first composite part in a hot-pressing mode; alternatively, the second composite member is pre-fixed to the first composite member using an adhesive tape; preventing displacement of the second composite member relative to the first composite member;
8) Lamination of the components: laminating the components into a whole to obtain an integrated component;
in the integrated component: the first surface of the battery piece is electrically connected with the small section of the conductive wire covered by the battery piece on the first composite piece; the second surface of the battery piece is electrically connected with the conductive wire small section attached to the battery piece on the second composite piece; the inter-chip electric connectors of the first composite piece and the second composite piece are electrically connected with the conductive wire small sections which are lapped on the inter-chip electric connectors; the inter-chip electrical connector of the second composite is electrically connected with the corresponding inter-chip electrical connector of the first composite.
Example 2
On the basis of example 1, the difference is that:
step 6): the first surface of the battery piece is provided with a plurality of grid lines (which can be main grids), the grid lines on the first surface of the battery piece are in one-to-one correspondence with the conductive wire small sections covered by the battery piece on the first composite piece, the grid lines on the first surface of the battery piece are parallel to the corresponding conductive wire small sections on the first composite piece, and the grid lines on the first surface of the battery piece are covered on the corresponding conductive wire small sections of the first composite piece.
In the integrated assembly prepared in example 2:
the grid line on the first surface of the battery piece is electrically connected with the corresponding conductive wire small section on the first composite piece, and the contact resistance between the grid line and the corresponding conductive wire small section is less than or equal to 0.5 omega mm 2 ；
The second surface of the battery piece is electrically connected with the conductive wire small section attached to the battery piece on the second composite piece;
the inter-chip electric connectors of the first composite piece and the second composite piece are electrically connected with the conductive wire small sections which are lapped on the inter-chip electric connectors;
the inter-chip electrical connector of the second composite is electrically connected with the corresponding inter-chip electrical connector of the first composite.
Example 3
On the basis of example 1, the difference is that:
step 7): the second surface of the battery piece is provided with a plurality of grid lines (which can be a main grid), the grid lines on the second surface of the battery piece are in one-to-one correspondence with the small sections of the conductive wires attached to the battery piece on the second composite piece, the grid lines on the second surface of the battery piece are parallel to the corresponding small sections of the conductive wires on the second composite piece, and the small sections of the conductive wires on the second composite piece are covered on the corresponding grid lines on the second surface of the battery piece.
In the integrated assembly prepared in example 3:
the first surface of the battery piece is electrically connected with the small section of the conductive wire covered by the battery piece on the first composite piece;
the grid line on the second surface of the battery piece is electrically connected with the corresponding conductive wire small section on the second composite piece, and the contact resistance between the grid line and the corresponding conductive wire small section is less than or equal to 0.5 omega mm 2 ；
The inter-chip electric connectors of the first composite piece and the second composite piece are electrically connected with the conductive wire small sections which are lapped on the inter-chip electric connectors;
the inter-chip electrical connector of the second composite is electrically connected with the corresponding inter-chip electrical connector of the first composite.
Example 4
On the basis of example 1, the difference is that:
step 6): the first surface of the battery piece is provided with a plurality of grid lines (which can be main grids), the grid lines on the first surface of the battery piece are in one-to-one correspondence with the conductive wire small sections covered by the battery piece on the first composite piece, the grid lines on the first surface of the battery piece are parallel to the corresponding conductive wire small sections on the first composite piece, and the grid lines on the first surface of the battery piece are covered on the corresponding conductive wire small sections of the first composite piece;
step 7): the second surface of the battery piece is provided with a plurality of grid lines (which can be a main grid), the grid lines on the second surface of the battery piece are in one-to-one correspondence with the small sections of the conductive wires attached to the battery piece on the second composite piece, the grid lines on the second surface of the battery piece are parallel to the corresponding small sections of the conductive wires on the second composite piece, and the small sections of the conductive wires on the second composite piece are covered on the corresponding grid lines on the second surface of the battery piece.
In the integrated assembly prepared in example 4:
the grid line on the first surface of the battery piece is electrically connected with the corresponding conductive wire small section on the first composite piece, and the grid line is electrically connected with the corresponding conductive wireThe contact resistance between the small sections of the electric wire is less than or equal to 0.5 omega mm 2 ；
The grid line on the second surface of the battery piece is electrically connected with the corresponding conductive wire small section on the second composite piece, and the contact resistance between the grid line and the corresponding conductive wire small section is less than or equal to 0.5 omega mm 2 ；
The inter-chip electric connectors of the first composite piece and the second composite piece are electrically connected with the conductive wire small sections which are lapped on the inter-chip electric connectors;
the inter-chip electrical connector of the second composite is electrically connected with the corresponding inter-chip electrical connector of the first composite.
Example 5
On the basis of example 1, the difference is that:
step 6): a TCO transparent conductive layer electrode is coated on the first surface of the cell;
step 7): and the second surface of the cell is covered with a TCO transparent conductive layer electrode.
In the integrated assembly prepared in example 5:
the TCO transparent conductive layer electrode on the first surface of the battery piece is electrically connected with the conductive wire small section covered by the battery piece on the first composite piece;
the TCO transparent conductive layer electrode on the second surface of the battery piece is electrically connected with the conductive wire small section attached to the battery piece on the second composite piece;
the inter-chip electric connectors of the first composite piece and the second composite piece are electrically connected with the conductive wire small sections which are lapped on the inter-chip electric connectors;
the inter-chip electrical connector of the second composite is electrically connected with the corresponding inter-chip electrical connector of the first composite.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that it will be apparent to those skilled in the art that several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the scope of the invention.
Claims (1)
1. The preparation method of the photovoltaic module is characterized by comprising the following steps of:
1) Preparing a composite part: paving the adhesive film on the plate-shaped piece, and pressing the adhesive film and the plate-shaped piece into a composite piece by adopting vacuum hot pressing; the composite pieces comprise a first composite piece and a second composite piece, wherein the plate-shaped piece of one composite piece is a panel, and the plate-shaped piece of the other composite piece is a back panel; the adhesive film is an EVA film or a POE film; the panel is made of toughened glass;
2) Lay the electrical connector between the pieces: a plurality of parallel strip-shaped inter-chip electrical connectors are paved on the outer side surfaces of the adhesive films of the first composite piece and the second composite piece respectively, and battery pieces can be paved between two adjacent inter-chip electrical connectors; taking the interval between two adjacent electric connectors as the interval between the sheets, wherein the interval between the sheets of the first composite piece and the interval between the sheets of the second composite piece are the same; the inner side surface of the inter-chip electric connector is provided with a sawtooth-shaped reflecting structure; the tooth top angle of the sawtooth-shaped reflective structure is 90-140 degrees, and the chamfer radius R of the tooth top angle is less than or equal to 0.03mm; embedding the inter-chip electrical connector into the adhesive film by adopting hot pressing, wherein the outer side surface of the inter-chip electrical connector is not lower than the outer side surface of the adhesive film;
3) Laying conductive wires: a plurality of parallel conductive wires are respectively paved on the outer side surfaces of the adhesive films of the first composite part and the second composite part, so that the conductive wires on the same composite part are perpendicular to the inter-chip electrical connectors on the composite part, and the conductive wires span across all the inter-chip electrical connectors on the composite part; the section of the conductive wire is in an equilateral triangle shape, so that one corner of the conductive wire faces to the plate-shaped piece, one corner of the plate-shaped piece is taken as the top angle of the conductive wire, and one surface of the conductive wire opposite to the top angle is taken as the bottom surface of the conductive wire; embedding the conductive wires into the adhesive film by adopting hot pressing, wherein the bottom surface of the conductive wires is not lower than the outer side surface of the adhesive film; the vertex angle of the conductive wire is smaller than 90 degrees, and the chamfer radius R of the vertex angle of the conductive wire is smaller than or equal to 0.01mm; the width of the bottom surface of the conductive wire is 0.05-0.2 mm; the distance between two adjacent conductive wires is 1-3 mm; the height of the bottom surface of the conductive wire protruding out of the outer side surface of the adhesive film is less than or equal to 0.05mm; the surface of the conductive wire is covered with a reflecting layer, and the reflectivity of the reflecting layer is more than or equal to 80%; the conductive wire is a copper wire, the reflecting layer is a silver layer, and the thickness of the reflecting layer is 0.05-5 mu m;
4) Dividing the conductive wire: dividing the conductive wires on the first composite part and the second composite part into a plurality of conductive wire small sections; the small sections of the conductive wires which are cut out by the same conductive wire are in one-to-one correspondence with the inter-chip electrical connectors on the composite part where the conductive wires are positioned, one ends of the small sections of the conductive wires are lapped on the outer side surfaces of the corresponding inter-chip electrical connectors, and the other ends of the small sections of the conductive wires are not contacted with the adjacent inter-chip electrical connectors; taking the direction of the conductive wire small section far away from the electric connector between the overlapped sheets as the extending direction of the conductive wire small section, wherein the extending directions of the conductive wire small sections on the same composite part are the same;
5) Depositing conductive paste: depositing conductive paste on the bottom surfaces of the conductive wire segments of the first composite part and the second composite part and the outer side surfaces of the inter-chip electrical connectors; depositing conductive paste by screen printing, ink-jet printing or laser transfer printing; the conductive paste is low-temperature conductive paste; the curing temperature of the low-temperature conductive paste is lower than 150 ℃;
6) Paving a battery piece: paving a battery piece between two adjacent inter-piece electrical connectors of the first composite part, and enabling the battery piece to cover a small section of the conductive wire between the two adjacent inter-piece electrical connectors; if the plate-shaped member of the first composite member is a panel, the front surface of the battery piece faces the plate-shaped member of the first composite member; if the plate-shaped piece of the first composite piece is a photovoltaic backboard, the back surface of the battery piece faces to the plate-shaped piece of the first composite piece; taking the surface of the battery piece facing the plate-shaped piece as a first surface of the battery piece; the surface of the battery piece opposite to the plate-shaped piece is taken as a second surface of the battery piece; the first surface of the battery piece is provided with a plurality of grid lines, the grid lines on the first surface of the battery piece are in one-to-one correspondence with the conductive wire segments covered by the battery piece, the grid lines on the first surface of the battery piece are parallel to the corresponding conductive wire segments on the first composite piece, and the grid lines on the first surface of the battery piece are covered on the corresponding conductive wire segments of the first composite piece; pre-fixing the battery piece on the first composite piece by adopting hot pressing or adopting an adhesive tape;
7) Paving a second composite part: paving the second composite piece on the battery piece, enabling the inter-piece electric connector of the second composite piece to face the first composite piece, enabling the inter-piece electric connector of the second composite piece to correspond to the inter-piece electric connector of the first composite piece one by one, enabling the inter-piece electric connector of the second composite piece to be parallel to the corresponding inter-piece electric connector of the first composite piece, and enabling the inter-piece electric connector of the second composite piece to cover the corresponding inter-piece electric connector of the first composite piece; the extending direction of the conductive wire small section on the second composite part is opposite to the extending direction of the conductive wire small section on the first composite part; a small conductive wire section between two adjacent inter-chip electrical connectors on the second composite member is attached to the battery piece between the two adjacent inter-chip electrical connectors; the second surface of the battery piece is provided with a plurality of grid lines, the grid lines on the second surface of the battery piece are in one-to-one correspondence with the small sections of the conductive wires attached to the battery piece, the grid lines on the second surface of the battery piece are parallel to the corresponding small sections of the conductive wires on the second composite piece, and the small sections of the conductive wires on the second composite piece are covered on the corresponding grid lines on the second surface of the battery piece; pre-fixing the second composite part on the first composite part by hot pressing or by using adhesive tape; at this time, a component to be laminated is formed;
8) Lamination of the components: laminating the components into a whole to obtain an integrated component; in the integrated component: the grid line on the first surface of the battery piece is electrically connected with the corresponding conductive wire small section, and the contact resistance between the grid line and the corresponding conductive wire small section is less than or equal to 0.5 omega mm 2 The method comprises the steps of carrying out a first treatment on the surface of the The grid line on the second surface of the battery piece is electrically connected with the corresponding conductive wire small section, and the contact resistance between the grid line and the corresponding conductive wire small section is less than or equal to 0.5 omega mm 2 The method comprises the steps of carrying out a first treatment on the surface of the The inter-chip electrical connector is electrically connected with the conductive wire small section lapped on the inter-chip electrical connector, and the inter-chip electrical connector of the second composite member is electrically connected with the corresponding inter-chip electrical connector of the first composite member.
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