CN114859666B - Full-field exposure apparatus and full-field exposure method - Google Patents
Full-field exposure apparatus and full-field exposure method Download PDFInfo
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- CN114859666B CN114859666B CN202210176429.0A CN202210176429A CN114859666B CN 114859666 B CN114859666 B CN 114859666B CN 202210176429 A CN202210176429 A CN 202210176429A CN 114859666 B CN114859666 B CN 114859666B
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- 238000000034 method Methods 0.000 title claims abstract description 43
- 238000006073 displacement reaction Methods 0.000 claims abstract description 62
- 230000033001 locomotion Effects 0.000 claims abstract description 50
- 230000005540 biological transmission Effects 0.000 claims description 10
- 238000009434 installation Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000001259 photo etching Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 269
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The application provides full-field exposure equipment and a full-field exposure method, which belong to the technical field of semiconductor photoetching processes, wherein a translation module and a longitudinal displacement module which are aligned with a motion control platform in the full-field exposure equipment carry out horizontal movement and vertical movement on a wafer carrying platform according to a shooting result of an image recognition motion platform; the wafer carrying platform alignment device is used for realizing parallel alignment of the wafer and the mask; the wafer carrying platform is fixed on the wafer carrying platform alignment device; the mask plate fixing device is used for fixing the mask plate in vacuum; the image recognition moving table comprises two groups of image recognition units for positioning the wafer, a horizontal movement unit for horizontally moving the image recognition units and a vertical movement unit for vertically moving the image recognition units; the exposure device is arranged above the image recognition moving table and is used for exposing the wafer. The processing scheme of the application has the advantages of full automation, high productivity, high resolution, high alignment precision, high reliability and the like.
Description
Technical Field
The invention relates to the technical field of semiconductor photoetching processes, in particular to full-field exposure equipment and a full-field exposure method.
Background
An exposure apparatus is an apparatus that projects a desired pattern onto a photoresist surface of a wafer by means of a UV light source (ultraviolet light source). Exposure equipment is commonly used in the production and fabrication of large-scale integrated circuits. In order to ensure the definition and integrity of the mask required pattern projected onto the wafer adhesive surface, the parallelism of the mask surface and the wafer surface, the UV illumination intensity of the wafer surface, the alignment precision of the wafer and the mask mark, the recognition precision of the wafer and the mask mark image and the like are required to be ensured. However, the existing exposure equipment is installed manually, and the precision of each data cannot be guaranteed, so that the definition and the integrity of the required graph projected onto the wafer adhesive surface cannot be guaranteed, and the exposure equipment cannot exert an ideal operation effect.
Disclosure of Invention
Therefore, in order to overcome the disadvantages of the prior art, the present invention provides a full-field exposure apparatus and a full-field exposure method with full automation, high productivity, high resolution, high alignment accuracy, and high reliability.
In order to achieve the above object, the present invention provides a full-field exposure apparatus for performing full-field exposure on a wafer, including an alignment motion control console, a wafer stage alignment device, a wafer stage, a reticle fixing device, an image recognition motion stage, an exposure device, and an upper computer for controlling the above devices, which are sequentially disposed from bottom to top, wherein the alignment motion control console has a translation module for controlling the wafer stage alignment device to horizontally move and a longitudinal displacement module for controlling the wafer stage alignment device to vertically move, and the translation module and the longitudinal displacement module perform horizontal movement and vertical movement on the wafer stage according to a photographing result of the image recognition motion stage; the wafer carrying platform alignment device is arranged on an installation plane at the upper end of the alignment motion control platform and is used for realizing parallel alignment of a wafer carried by the wafer carrying platform and a mask; the wafer carrying platform is fixed on the wafer carrying platform alignment device; the mask fixing device is arranged above the wafer carrying platform and is used for fixing the mask in vacuum; the image recognition motion stage comprises at least one image recognition unit for positioning the wafer, a horizontal movement unit for horizontally moving the image recognition unit and a vertical movement unit for vertically moving the image recognition unit; the exposure device is arranged above the image recognition moving table and is used for exposing the wafer.
In one embodiment, the reticle fixture comprises: a reticle frame for accommodating a reticle; a vacuum suction assembly having a vacuum channel communicating with the reticle frame, the accommodated reticle being fixed in the reticle frame by vacuum suction; and the frame locking assembly is used for fixing the mask frame for accommodating the mask.
In one embodiment, the alignment motion console comprises: the turntable module is provided with an installation plane for installing the wafer carrying platform alignment device and is used for driving the wafer carrying platform to horizontally rotate under the driving of external force; the translation module is arranged below the turntable module and used for controlling the turntable module to horizontally move; and the longitudinal displacement module is arranged below the translation module and is crisscrossed with the translation module in the vertical direction, and is used for controlling the vertical movement of the turntable module and the translation module.
In one embodiment, the translation module includes: the first translation unit is sleeved on the outer side of the longitudinal displacement module and drives all parts above the first translation unit to move vertically along with the longitudinal displacement module or drive all parts above the first translation unit to move horizontally along a first horizontal direction, and the first translation unit is provided with a first guide sliding rail fixed on the outer side of the longitudinal displacement module and a first sliding block moving in the first guide sliding rail; the second translation unit is arranged above the first translation unit and is in cross sliding connection with the first translation unit in the horizontal direction, and the second translation unit is provided with a second guide sliding rail arranged in the first translation unit and a second sliding block which moves in the second guide sliding rail and is fixedly connected with the turntable module.
In one embodiment, the longitudinal displacement module comprises a longitudinal motor, a longitudinal guide sliding rail and a longitudinal displacement screw rod, the longitudinal displacement screw rod is in transmission connection with the longitudinal motor, the turntable module is arranged on the longitudinal guide sliding rail and in transmission connection with the longitudinal displacement screw rod, and the longitudinal motor is used for driving the turntable module to reciprocate along the longitudinal guide sliding rail.
In one embodiment, the wafer stage alignment device includes: the lower end surface of the flexible mechanism is connected with the longitudinal displacement module, the upper end surface of the flexible mechanism is connected with the wafer carrying platform, and the wafer carrying platform is driven by the longitudinal displacement module to move; the wafer carrying platform positioning assembly is arranged between the wafer carrying platform and the mask plate and is used for positioning the wafer carrying platform; and the flexible locking unit is used for receiving the current force value fed back by the longitudinal displacement module and locking the current position of the flexible mechanism when the current force value reaches a preset force value.
The invention also provides a full-field exposure method, which comprises the following steps: controlling each device in the full-field exposure equipment to perform initialization reset; when the initialization is completed, replacing the mask plate, and judging whether the wafer carrying platform is positioned at a corresponding position with the mask plate by adopting a wafer carrying platform positioning assembly; focusing the mask plate by adopting an image recognition unit of an image recognition moving table, and storing a marked image and marked coordinates of the mask plate; the image recognition unit is adopted to focus the marked image on the wafer and the marked image on the mask plate at the same time, and the marked image on the wafer is aligned with the marked image of the mask plate; after the wafer is aligned with the mask plate mark image, all patterns on the mask plate are projected onto the adhesive surface of the wafer through an ultraviolet light source, so that the exposure of the wafer is completed.
In one embodiment, the determining, by using the wafer stage positioning assembly, whether the wafer stage is at a position corresponding to the reticle includes the steps of: controlling the wafer carrying platform to move in the vertical direction until the wafer carrying platform contacts with the lower surface of the wafer carrying platform positioning component and the upper surface of the wafer carrying platform positioning component contacts with the mask plate; detecting the current force value fed back by the motor in the vertical direction in real time in the whole process; when the current force value reaches a preset force value, the current position of the flexible mechanism is locked, and the wafer carrying table and the mask plate are positioned at corresponding positions.
In one embodiment, an image recognition unit of an image recognition motion stage is used to focus the mask, and a mark image and a mark coordinate of the mask are stored, including the following steps: the horizontal moving unit controls the image recognition unit to move into a preset area above the mask plate according to the instruction of the upper computer; the image recognition unit shoots the mask plate in the preset area and feeds back the shot image to an upper computer until the upper computer feeds back and recognizes a mark image on the mask plate; the image recognition unit focuses the marked image until the marked image of the mask plate is clearly displayed; and the upper computer acquires the position coordinate parameters of the current camera and simultaneously stores the mark image and the mark coordinates of the mask.
In one embodiment, the image recognition unit is used to focus the mark image on the wafer and the mark image on the mask plate at the same time, and align the mark image on the wafer and the mark image of the mask plate, and includes: after taking out the wafer from the wafer box through the mechanical arm, carrying out wafer position adjustment on the prealignment device, and then placing the wafer on a wafer carrying table; the upper computer controls the image recognition unit to move to a mark coordinate above the mask along with the image recognition moving table; moving the image recognition unit in the horizontal direction to recognize the graphic marks on the wafer, and ensuring that the mark images on the mask plate are positioned in the view field of the image recognition unit; the image recognition unit focuses until the marked image of the wafer is clearly displayed, and acquires the marked image and the coordinate parameters of the wafer in real time; comparing the coordinate parameters of the wafer with the mark coordinates of the mask plate in real time, and calculating a deviation value of a center point; and adjusting the alignment motion control console according to the deviation value to enable the wafer mark to be overlapped with the mask plate mark, so that the mark image on the wafer is aligned with the mark image of the mask plate.
Compared with the prior art, the invention has the advantages that: the wafer and the mask plate are aligned through the wafer carrying platform alignment device, so that accurate torque control is realized, good parallelism between the surface of the mask plate and the surface of the wafer is ensured, and the mask plate and the carrying platform are not damaged; the UV illumination intensity of the surface of the wafer is controlled by the upper computer, the alignment precision of the wafer and the mask plate mark and the recognition precision of the image of the wafer and the mask plate mark are ensured by adopting the image recognition moving table, and the actual measurement can reach 300nm, so that the full-automatic high-yield, high-resolution, high-alignment precision and high-reliability wafer production is realized. Moreover, the structure of the exposure equipment is more compact, and the functional integration level is higher; the exposure equipment adopts a non-contact exposure mode, so that the mask plate has higher repeated use rate and longer service life; the exposure equipment adopts a full-field exposure mode, so that the exposure efficiency is higher; the wafer exposure under the same mask plate is in a full-automatic mode, and the productivity can reach 200 wafers/hour; in addition, the exposure time, the exposure intensity and the distance between the wafer and the mask plate can be adjusted by the upper computer according to the types of the mask plate and the wafer photoresist, so that the equipment can achieve the best exposure effect; the image recognition process can clearly display marks of the mask plate and the wafer, and further alignment of mark points is accurately achieved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic configuration diagram of a full field exposure apparatus in an embodiment of the present invention;
FIG. 2 is a schematic diagram of a wafer stage alignment apparatus according to an embodiment of the present invention;
FIG. 3 is a flow chart of a full field exposure method in an embodiment of the invention;
FIG. 4 is a graphical indicia of a reticle acquired in an embodiment of the invention;
FIG. 5 is a graphical indicia of a wafer collected in an embodiment of the invention;
FIG. 6 is a graphical indicia and wafer indicia overlay of a reticle acquired in an embodiment of the invention;
FIG. 7 is a wafer exposure process in an embodiment of the invention;
FIG. 8 is a flow chart of inspection for 8inch and 6inch wafer surfaces in an embodiment of the invention;
Fig. 9 is a trajectory diagram of movement of the image recognition unit in the embodiment of the present invention.
Detailed Description
Embodiments of the present application will be described in detail below with reference to the accompanying drawings.
Other advantages and effects of the present application will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present application with reference to specific examples. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. The application may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It is noted that various aspects of the embodiments are described below within the scope of the following claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present disclosure, one skilled in the art will appreciate that one aspect described herein may be implemented independently of any other aspect, and that two or more of these aspects may be combined in various ways. For example, apparatus may be implemented and/or methods practiced using any number and aspects set forth herein. In addition, such apparatus may be implemented and/or such methods practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should also be noted that the illustrations provided in the following embodiments merely illustrate the basic concept of the present application by way of illustration, and only the components related to the present application are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
In addition, in the following description, specific details are provided in order to provide a thorough understanding of the examples. However, it will be understood by those skilled in the art that aspects may be practiced without these specific details.
As shown in fig. 1, an embodiment of the present application provides a full field exposure apparatus for performing full field exposure on a wafer. The full-field exposure apparatus includes an alignment motion console 10, a wafer stage alignment device 5, a wafer stage 6, a reticle fixing device 7, an image recognition motion stage 8, an exposure device 9, and a host computer (not shown in the figure) that control the above devices, which are sequentially arranged from bottom to top.
The alignment motion control console 10 is provided with a translation module 11 for controlling the wafer carrying platform alignment device to horizontally move and a longitudinal displacement module 1 for controlling the wafer carrying platform alignment device to vertically move, and the translation module 11 and the longitudinal displacement module 1 perform horizontal movement and vertical movement on the wafer carrying platform according to the shooting result of the image recognition motion platform. In one embodiment, the alignment motion console includes a turntable module 4, a translation module 11, and a longitudinal displacement module 1. The longitudinal displacement module 1 is arranged on a chassis (not shown in the figure), the translation module is arranged on the longitudinal displacement module, the turntable module is arranged on the translation module, the longitudinal displacement module is used for driving the turntable module to longitudinally move, and the transverse displacement module is used for driving the turntable module to horizontally and transversely move.
The turntable module 4 is provided with a mounting plane for mounting the wafer carrying platform alignment device, and is used for driving the wafer carrying platform to horizontally rotate under the driving of external force. The turntable module 4 ensures that the wafer carrier rotates at a predetermined angle in the horizontal plane.
And the translation module 11 is arranged below the turntable module and used for controlling the turntable module to horizontally move. The translation module 11 ensures that the wafer carrying platform moves in the horizontal plane along the preset XY axis direction in the horizontal plane.
The longitudinal displacement module 1 is arranged below the translation module and is crisscrossed with the translation module in the vertical direction and is used for controlling the vertical movement of the turntable module and the translation module. The longitudinal displacement module 1 ensures that the wafer carrying platform moves vertically in a direction perpendicular to the horizontal plane direction.
The wafer carrying platform alignment device 5 is arranged on an installation plane at the upper end of the alignment motion control platform 10 and is used for realizing parallel alignment of the wafer carried by the wafer carrying platform 6 and the mask. The wafer stage 6 is fixed on the wafer stage alignment device 5.
The mask fixing device 7 is arranged above the wafer carrying platform 6 and is used for fixing the mask in vacuum.
The image recognition moving stage 8 includes at least two image recognition units for positioning the wafer, a horizontal movement unit for horizontally moving the image recognition units, and a vertical movement unit for vertically moving the image recognition units. In one embodiment, the image recognition stage 8 is provided with two image recognition units, and the image recognition units are respectively aligned with any one of the two marks on the wafer, so as to ensure the accuracy of image acquisition within a predetermined field of view. The image recognition unit may be a video camera or an industrial camera or the like. When more than two image recognition units exist, the images shot by the redundant image recognition units can be used as auxiliary images, so that the accuracy of the images is further ensured.
An exposure device 9 is provided above the image recognition stage for exposing the wafer.
According to the full-field exposure equipment, wafer alignment and mask plate alignment are realized through the wafer bearing table alignment device, accurate torque control is realized, good parallelism between the surface of the mask plate and the surface of the wafer is ensured, and the mask plate and the wafer bearing table are not damaged; the UV illumination intensity of the surface of the wafer is controlled by the upper computer, the alignment precision of the wafer and the mask plate mark and the recognition precision of the image of the wafer and the mask plate mark are ensured by adopting the image recognition moving table, and the actual measurement can reach 300nm, so that the full-automatic high-yield, high-resolution, high-alignment precision and high-reliability wafer production is realized. Moreover, the structure of the exposure equipment is more compact, and the functional integration level is higher; the exposure equipment adopts a non-contact exposure mode, so that the mask plate has higher repeated use rate and longer service life; the exposure equipment adopts a full-field exposure mode, so that the exposure efficiency is higher; the wafer exposure under the same mask plate is in a full-automatic mode, and the productivity can reach 200 wafers/hour; in addition, the exposure time, the exposure intensity and the distance between the wafer and the mask plate can be adjusted by the upper computer according to the types of the mask plate and the wafer photoresist, so that the equipment can achieve the best exposure effect; the image recognition process can clearly display marks of the mask plate and the wafer, and further alignment of mark points is accurately achieved.
In one embodiment, the reticle fixture 7 includes a reticle frame, a vacuum chuck assembly, and a frame lock assembly.
The reticle frame is used to house a reticle. The mask frame has a positioning mark for positioning the mask. The positioning mark can be a positioning paste or a mark etched on the outer side of the frame, etc.
And a vacuum suction assembly having a vacuum passage communicating with the reticle frame, the accommodated reticle being fixed in the reticle frame by vacuum suction. In one embodiment, a vacuum adsorption assembly includes a vacuum channel and a vacuum adsorption unit. The vacuum adsorption unit is connected with a positive pressure air inlet pipeline, an exhaust pipeline and a negative pressure air suction pipeline, the vacuum channel comprises an adsorption channel communicated with the negative pressure air suction pipeline, the vacuum channel can be of a double-layer structure, a cavity can be arranged in the vacuum channel, one end of the cavity is communicated with the exhaust pipeline, the other end of the cavity is communicated with the positive pressure air inlet pipeline, a sealing movable valve is arranged between the cavity and the positive pressure air inlet pipeline, gas flowing into the cavity through the exhaust pipeline jacks up the sealing movable valve, and gas flows back into the positive pressure air inlet pipeline.
And the frame locking assembly is used for fixing a mask frame for accommodating the mask.
In this embodiment, the reticle replacement process includes the following steps:
the frame locking assembly is unlocked, the mask frame is turned over, and the mask is turned over to the upper side;
Stopping vacuumizing the vacuum channel of the vacuum adsorption assembly, and properly supplementing gas through the positive pressure air inlet pipeline, so that the mask is not adsorbed on the mask frame any more, and removing the mask;
The new mask plate is close to a positioning block on the mask plate frame, and a negative pressure air suction pipeline of the vacuum suction assembly is opened again to vacuumize the vacuum channel, so that the mask plate is sucked on the mask plate frame;
And turning the mask frame back to the original position, locking the frame locking assembly again, fixing the mask frame, and ending the mask replacement process.
The full-field exposure equipment is simple to operate, the mask plate is adsorbed on the mask plate frame through vacuum, the contact between the mechanical structure and the mask plate is reduced in the whole process, the mask plate is prevented from being damaged, the image on the mask plate is not polluted, and the full-field exposure equipment is safer and more reliable.
In one embodiment, the wafer fixing mode is consistent with the mask fixing mode, and the mask fixing mode is fixed through vacuum adsorption, so that contact between a mechanical structure and a wafer is reduced, the wafer is prevented from being damaged, the image on the wafer is not polluted, and the mask fixing device is safer and more reliable.
In one embodiment, the translation module 11 comprises a first translation unit 2 and a second translation unit 3.
The first translation unit 2 is sleeved on the outer side of the longitudinal displacement module 1 and drives all parts above the first translation unit to move vertically along with the longitudinal displacement module 1 or drive all parts above the first translation unit to move horizontally along the first horizontal direction. In one embodiment, the first translation unit 2 has a first guide rail fixed outside the longitudinal displacement module, and a first slider moving inside the first guide rail. In this embodiment, the first horizontal direction may be defined as the X-axis direction.
The second translation unit 3 is arranged above the first translation unit and is in crossed sliding connection with the first translation unit in the horizontal direction, and is provided with a second guide sliding rail arranged in the first translation unit and a second sliding block which moves in the second guide sliding rail and is fixedly connected with the turntable module. In this embodiment, the second horizontal direction may be defined as the Y-axis direction. In another embodiment, the second translation unit 3 may include a second motor, a second guiding rail, and a lateral displacement screw, where the second motor, the second guiding rail, and the lateral displacement screw are all installed on the turntable module, the lateral displacement screw is in transmission connection with the second motor, the turntable module is disposed on the second guiding rail, and the turntable module is in transmission connection with the lateral displacement screw, and the second motor is used to drive the turntable module to reciprocate along the second guiding rail. The distance of the turntable module translating along the second guide sliding rail is accurately controlled through the transverse displacement screw rod, and the precision of the turntable module in transverse translation is improved. And the extending direction of the first guide sliding rail is mutually perpendicular to the extending direction of the second guide sliding rail.
In one embodiment, the longitudinal displacement module comprises a longitudinal motor, a longitudinal guide sliding rail and a longitudinal displacement screw rod, the longitudinal displacement screw rod is in transmission connection with the longitudinal motor, the turntable module is arranged on the longitudinal guide sliding rail and in transmission connection with the longitudinal displacement screw rod, and the longitudinal motor is used for driving the turntable module to reciprocate along the longitudinal guide sliding rail.
In this embodiment, the longitudinal direction may be defined as the Z-axis direction. The longitudinal displacement module comprises a longitudinal motor, a longitudinal guide sliding rail and a longitudinal displacement screw rod, wherein the longitudinal motor, the longitudinal guide sliding rail and the longitudinal displacement screw rod are all arranged on the underframe, the longitudinal displacement screw rod is in transmission connection with the longitudinal motor, an intermediate carrying platform connected with the turntable module 4 is arranged on the longitudinal guide sliding rail, the intermediate carrying platform is in transmission connection with the longitudinal displacement screw rod, the longitudinal motor is used for driving the intermediate carrying platform to reciprocate along the longitudinal guide sliding rail, the distance of the intermediate carrying platform moving along the longitudinal guide sliding rail is accurately controlled through the longitudinal displacement screw rod, and the accuracy of the turntable module 4 in longitudinal translation is improved.
As shown in fig. 2, in one embodiment, the wafer stage alignment device 5 includes a flexible mechanism 51, a wafer stage positioning assembly 52, and a flexible locking unit (not shown).
The lower end surface of the flexible mechanism 51 is connected with the longitudinal displacement module 1, the upper end surface is connected with the wafer carrying table 6, and the wafer carrying table 6 is moved under the drive of the longitudinal displacement module.
The wafer stage positioning assembly 52 is disposed between the wafer stage and the reticle 13 for positioning the wafer stage. In this embodiment, the wafer stage positioning assembly 52 has two positioning members disposed in alignment.
The flexible locking unit receives the current force value fed back by the longitudinal displacement module 1, and locks the current position of the flexible mechanism when the current force value reaches a preset force value.
The wafer and the mask plate realize a relatively parallel process through the wafer carrying platform alignment device 5, and the method comprises the following steps:
the wafer carrying platform moves upwards under the control of a Z-direction electric cylinder (or a Z-direction motor) of the longitudinal displacement module 1, and is contacted with the lower surface of the wafer carrying platform positioning component 52;
The wafer carrying platform continues to ascend along Z, so that the upper surface of the wafer carrying platform positioning component 52 is contacted with the mask;
Detecting a force value fed back by a Z-direction electric cylinder motor in real time in the whole process;
Judging whether the force value fed back by the motor of the Z-direction electric cylinder is more than or equal to 5N, if the force value is less than 5N, continuing to operate the Z-direction electric cylinder upwards, and stopping operating the Z-direction electric cylinder and keeping the position when the force value is more than or equal to 5N;
the flexible mechanism below the wafer carrying platform is deformed in the process that the wafer carrying platform positioning assembly 52 is extruded to be attached to the mask plate when the wafer carrying platform moves upwards along with the Z-direction electric cylinder, and the flexible locking unit is locked after the feedback force value of the motor of the Z-direction electric cylinder reaches a set value, so that the wafer on the current wafer carrying platform at the current position is determined to be relatively parallel to the mask plate;
the Z-direction electric cylinder drives the wafer carrying platform positioning device to return to the original point, the wafer carrying platform positioning component 52 is reset, and the carrying platform and mask plate alignment process is finished.
As shown in fig. 3, the present embodiment further provides a full field exposure method, which includes the following steps:
S1, controlling all devices in the full-field exposure equipment to perform initialization reset.
The full field exposure apparatus needs to ensure that each device is located at the origin position. For example, the exposure device needs to be driven back to the original point, and the UV light source moves to the original point along with the Z-direction module. The image recognition moving table returns to the original point, the Z-direction moving modules (longitudinal displacement modules) of the two image recognition units of the image recognition moving table return to the original point firstly, and then the XY modules return to the original point, so that collision of cameras in the moving process is avoided. The flexible locking unit of the wafer carrying platform alignment device pops up, the flexible mechanism releases elastic potential energy, and both the flexible locking unit and the flexible mechanism keep a loose state. The Z-direction cylinder of the motion control console, the XY module (translation module 11) and the turntable module are aligned back to the original position. The prealignment device, the manipulator, etc. are returned to the original position. The vacuum channel on the mask plate fixing device is opened, the digital pressure gauge feedback on the vacuum loop is read, whether the mask plate is in the fixing device or not is judged, if the mask plate is arranged on the fixing device, the mask plate is required to be manually removed, detection is carried out again, and the next operation is carried out after no mask plate is determined. And the vacuum channel on the wafer carrying platform is opened, and the feedback of the digital pressure gauge on the vacuum path is read, so that whether the wafer is on the wafer carrying platform is judged. If the wafer is arranged on the wafer carrying table, the wafer is manually removed, and is detected again, and the next operation is performed after the fact that no wafer exists is determined. After the above flow is completed, the device initialization is ended.
S2, when the initialization is completed, replacing the mask plate, and judging whether the wafer carrying platform and the mask plate are at corresponding positions by adopting a wafer carrying platform positioning assembly.
In one embodiment, the wafer stage positioning assembly is used to determine whether the wafer stage is at a position corresponding to the reticle, and the method comprises the following steps:
Controlling the wafer carrying platform to move in the vertical direction until the wafer carrying platform contacts with the lower surface of the wafer carrying platform positioning component and the upper surface of the wafer carrying platform positioning component contacts with the mask plate;
detecting the current force value fed back by the motor in the vertical direction in real time in the whole process;
When the current force value reaches the preset force value, the current position of the flexible mechanism is locked, and the wafer carrying table and the mask plate are positioned at the corresponding positions.
After the mask plate is replaced each time by the equipment, one alignment action is carried out, the flexible mechanism of the alignment device ensures that the plane of the wafer carrying platform, the wafer carrying platform positioning assembly and the mask plate are in close contact, the mask plate cannot be damaged by controlling force value, and the plane of the wafer carrying platform and the plane of the mask plate can be relatively parallel after locking and separating.
And S3, focusing the mask plate by adopting an image recognition unit of the image recognition moving table, and storing a mark image and a mark coordinate of the mask plate.
In one embodiment, an image recognition unit of an image recognition motion stage is used to focus a mask, and a mark image and a mark coordinate of the mask are stored, including the following steps:
The horizontal moving unit controls the image recognition unit to move into a preset area above the mask plate according to the instruction of the upper computer;
The image recognition unit shoots the mask plate in a preset area and feeds back the shot image to the upper computer until the upper computer feeds back and recognizes a mark image on the mask plate;
the image recognition unit focuses the marked image until the marked image of the mask plate is clearly displayed;
The upper computer acquires the position coordinate parameters of the current camera, and simultaneously stores the mark image and the mark coordinates of the mask.
The steps can be carried out on the image information marked on the mask plate under the working state of small view field and high resolution of the camera, the image recognition moving table firstly moves in the XY direction to find the mark of the mask plate for focusing, the clear image and resolution of the image are ensured, meanwhile, the mechanical structure of the image recognition moving table is ensured to be more compact, and the equipment space is saved.
S4, focusing the marked image on the wafer and the marked image on the mask plate at the same time by adopting an image recognition unit, and aligning the marked image on the wafer and the marked image of the mask plate.
In one embodiment, the method for focusing the mark image on the wafer and the mark image on the mask plate simultaneously with the image recognition unit and aligning the mark image on the wafer and the mark image of the mask plate includes:
after taking out the wafer from the wafer box through the mechanical arm, carrying out wafer position adjustment on the prealignment device, and then placing the wafer on a wafer carrying table;
the upper computer controls the image recognition unit to move to a mark coordinate above the mask along with the image recognition moving table;
moving the image recognition unit in the horizontal direction to recognize the graphic marks on the wafer, and simultaneously ensuring that the mark images on the mask are positioned in the field of view of the image recognition unit, as shown in fig. 4;
The image recognition unit focuses until the marked image of the wafer is clearly displayed, and acquires the marked image and the coordinate parameters of the wafer in real time, as shown in fig. 5;
Comparing the coordinate parameters of the wafer with the mark coordinates of the mask in real time, and calculating the deviation value of the center point;
Based on the deviation values, the alignment motion console is adjusted to coincide the wafer mark with the reticle mark so that the mark image on the wafer is aligned with the mark image of the reticle, as shown in fig. 6.
The method ensures that the coordinate of the mark image obtained by calculation is more accurate, and further ensures the alignment precision.
S5, after the wafer is aligned with the mask plate mark image, all patterns on the mask plate are projected onto the adhesive surface of the wafer through an ultraviolet light source, and the exposure of the wafer is completed.
According to the types of the mask and the photoresist on the surface of the wafer, the upper computer acquires parameters such as a preset wafer surface light intensity value, exposure time and the like; then the upper computer controls the image recognition moving table to move out of the exposure area, so that damage to a camera and a light path caused by a UV light source is avoided; the exposure device moves downwards in the Z direction, so that the UV light source is ensured to reach a position (30+/-0.1) mm away from the upper surface of the mask; setting UV light source power by the upper computer according to the types of the obtained mask plate and the photoresist on the surface of the wafer, and ensuring that the UV light intensity on the surface of the wafer is 40mW/cm 2 to 200mW/cm 2; the Z-direction electric cylinder of the alignment motion control platform carries the wafer carrying platform to a position which is 10+/-0.05 mm away from the lower surface of the mask plate; the upper computer controls the UV light source to be turned on for exposure, and the UV light source is turned off after the exposure time is up; the exposure device Z returns upwards to the original point, the wafer carrying table Z moves downwards to the wafer carrying position, and the exposure process is finished.
The state reset is a process that when one wafer exposure is completed, the manipulator takes out the wafer from the wafer bearing table and puts the wafer into the wafer box, and the wafer is waited to be transferred into the wafer again for exposure.
Example 1
The load capacity of the Z-direction electric cylinder 1 in the alignment motion control table as shown in fig. 1 is 30kg, and the stroke is 300mm; the stroke of the X module 2 is 20mm, the self weight is 1kg, the load capacity is 15kg, and the X module is arranged on the front guide installation plane of the Z-direction electric cylinder; the stroke of the Y module 3 is 20mm, the self weight is 1kg, the load capacity is 15kg, and the Y module is arranged on the X module installation plane. The rotating module 4 rotates 360 degrees in stroke, the dead weight is 1kg, the load capacity is 15kg, and the rotating module is arranged on the Y module installation plane. The wafer carrying platform alignment device 5 has elastic deformation of + -2 mm, dead weight of 2kg and load capacity of 10kg and is arranged on the installation plane of the rotary module. The wafer carrying platform 6 can control and adsorb 6inch and 8inch wafers through a vacuum electromagnetic valve and is arranged on the mounting surface of the wafer carrying platform alignment device 5. The mask fixing device 7 can control and adsorb 80 mm-sized mask plates through a vacuum electromagnetic valve, and is positioned and fixed on the frame above the wafer bearing table. The image recognition moving table 8 comprises two groups of camera XYZ displacement modules, wherein the X-direction travel is 100mm, the Y-direction travel is 100mm, and the Z-direction travel is 50mm, and the image recognition moving table is fixed on a frame above the mask. The exposure device 9 is arranged above the image recognition moving table 8, can translate up and down in a Z way, has a stroke of 50mm, and is arranged in the frame.
Example 2
Fig. 7 schematically illustrates a wafer exposure process of one embodiment.
In the embodiment, the dimension of the mask plate is 80mm, the thickness is 6mm, the wafer is 6inch wafer, and the thickness of the photoresist is 2um.
1 The upper computer obtains the configuration technological parameters that the illumination intensity of the wafer surface is 80mW/cm 2 ,, the exposure time is 6s, and the exposure distance is 30cm.
2, After power-on, initializing equipment, and moving the exposure device to an original point in the Z direction according to the S1 initialization flow; the image recognition motion platform returns to the original point; the wafer bearing table aligning device returns to the original point; automatically aligning the motion platform to return to the original point, and returning the prealignment device and the manipulator to the original point; judging whether the mask is in place or not through the on-off of a vacuum loop of the mask fixing device, and if so, taking down the mask; judging whether the wafer is in place or not through the on-off of the vacuum loop of the wafer carrying table, and taking down the wafer to judge again if the wafer is in place; after the steps are finished, equipment initialization is finished; if the initialization fails, the upper computer checks the fault information, and the initialization is performed again after the fault is removed.
And 3, after the initialization is finished, installing or replacing the mask, installing and adsorbing the 80 mm-sized mask on the mask frame according to the mask replacement process, locking the frame locking assembly, and judging whether the mask is correctly and reasonably installed or not through feedback of a digital vacuum pressure gauge of the fixing device.
4, After the mask plate is installed, the upper computer automatically controls the alignment process of the wafer carrying platform and the mask plate, and the upper computer sends out an instruction to enable the wafer carrying platform positioning assembly to go deep between the wafer carrying platform and the mask plate; the wafer carrying platform is lifted along with the Z-direction electric cylinder and is contacted with the lower surface of the wafer carrying platform positioning component; the Z-direction electric cylinder continuously ascends, and the upper surface of the wafer carrying platform positioning component is contacted with the mask plate; the Z-direction electric cylinder continuously ascends, a spring flexible mechanism in the wafer bearing table alignment device extrudes and deforms, meanwhile, an upper computer monitors a force value fed back by the Z-direction electric cylinder in real time, and when the force value reaches 5N, the Z-direction electric cylinder is controlled to stop running and keep at a position; the spring flexible mechanism is locked and kept to elastically deform through the locking mechanism; and the Z-direction electric cylinder descends to return to the original point, the wafer carrying platform positioning assembly retracts to the original point, and the alignment process of the carrying platform and the mask plate is finished.
And 5, after the wafer carrying platform and the mask plate are aligned, the upper computer automatically controls the image recognition moving platform to complete the focusing of the mask plate by the camera and the positioning of the marked patterns on the mask plate. And meanwhile, the upper computer collects the marked image on the mask plate in real time and records the coordinate parameters of the feature points of the graph. Fig. 4 shows the reticle mark pattern acquired under this example.
And 6, after focusing and marking positioning of the mask plate are finished, the upper computer controls the mechanical arm to take the wafer from the wafer box according to the wafer scanning result of the wafer box, and the wafer is firstly transmitted to the pre-alignment device to perform alignment and angle adjustment of the wafer.
After the alignment of the wafer in the pre-alignment device is completed, the upper computer controls the manipulator to take out the wafer from the pre-alignment device, place the wafer above the wafer carrying table to align the wafer with the mark pattern of the mask, and firstly, the Z-direction electric cylinder of the automatic alignment control table is lifted to a distance of 1mm from the wafer carrying table; the automatic alignment control console XY displacement module moves the wafer until the camera can observe the mark pattern on the wafer; the camera focuses in the Z direction until the mark patterns on the wafer and the mask can be clearly detected at the same time, as shown in fig. 5; the upper computer records the coordinates of the feature points of the wafer mark patterns and compares the coordinates with the coordinates of the feature points of the mask mark patterns to calculate a deviation value; the upper computer controls the alignment control console XY displacement module and the rotation module to adjust the wafer position, and finally ensures that the wafer mark pattern and the mask mark pattern are reasonably overlapped together as shown in figure 6.
8, After the alignment of the wafer on the mask plate mark is completed, the upper computer controls the exposure system device to expose the mask plate pattern, and the upper computer controls the image recognition moving table to move out of the exposure area with the camera; the upper computer exposure system moves in the Z direction to enable the surface of the UV light source to be 30cm away from the surface of the mask plate; the upper computer adjusts the power of the UV light source to ensure that the light power of the UV light source reaching the surface of the wafer is 80mW/cm 2; the upper computer controls the UV light source to be turned on, the light source is turned off after timing for 6s, and the exposure process is finished.
9, Resetting the equipment state after exposure is completed, and moving the UV light source to an original point in the Z direction; the image recognition moving table belt camera returns to the coordinate position of the mask plate mark graph; the wafer bearing table Z descends to a wafer bearing position; the upper computer controls the mechanical arm to take out the exposed wafer and put the wafer back into the wafer box.
And 10, if the exposure of the next wafer is required to be carried out under the same mask, returning to 6 for continuous operation, and if the mask is required to be replaced, returning to 2 for operation.
Example 3
The embodiment discloses a method for detecting the surfaces of 8inch and 6inch wafers as shown in fig. 8, which comprises the following specific implementation steps:
1, after the equipment is electrified, initializing, and moving the exposure device to an original point in the Z direction according to the initialization flow of the S1 equipment; the image recognition motion platform returns to the original point; the wafer bearing table aligning device returns to the original point; automatically aligning the motion platform to return to the original point, and returning the prealignment device and the manipulator to the original point; judging whether the mask is in place or not through the on-off of a vacuum loop of the mask fixing device, and if so, taking down the mask; judging whether the wafer is in place or not through the on-off of the vacuum loop of the wafer carrying table, and taking down the wafer to judge again if the wafer is in place; after the steps are finished, equipment initialization is finished; if the initialization fails, the upper computer checks the fault information, and after the fault is removed, the initialization is performed again;
2, after the initialization is finished, the upper computer controls the manipulator to take the wafer from the wafer box according to the wafer scanning result of the wafer box, and the wafer is firstly transmitted to the pre-alignment device to be aligned and angle-adjusted;
and 3, after the wafer is aligned in the pre-alignment device, the upper computer controls the manipulator to take out the wafer from the pre-alignment device, and place the wafer above the wafer carrying table for identifying the wafer mark point and positioning the wafer position. Firstly, moving an image recognition moving table belt camera to the upper part of a wafer; respectively finding out two mark point diagrams on the wafer image through focusing of an XY module and a Z module of the image recognition moving table; the upper computer records the characteristic point coordinates of two marking points on the current wafer, and obtains the initial scanning coordinate position on the wafer through calculation;
4, after finding out the initial scanning coordinate point on the wafer, moving the image recognition moving table belt camera to the wafer scanning initial coordinate point; the upper computer controls the image recognition moving table to enable the camera to complete scanning of the wafer surface image according to the motion schematic track of FIG. 9; after the scanning is completed, the upper computer splices the pictures together to form a complete wafer surface image;
5, analyzing the image and the image according to the predefined characteristics to find out required characteristic parameters;
6, converting the format of the characteristic parameters according to a predefined format and outputting the characteristic parameters;
7, after the detection of one wafer is finished, the equipment resets the state, and the wafer is taken out from the wafer carrying table by the manipulator and then is put back into the wafer box;
8, determining whether to replace the wafer box according to the wafer detection condition in the wafer box, if the wafer in the current wafer box is completely detected, manually replacing the wafer box, and returning to the step 1 for initialization again; if the remaining wafers in the wafer cassette are not inspected, the process returns to step 2 to continue.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present application should be included in the present application. Therefore, the protection scope of the application is subject to the protection scope of the claims.
Claims (8)
1. A full-field exposure device for full-field exposure of a wafer is characterized by comprising an alignment motion control console, a wafer carrying platform alignment device, a wafer carrying platform, a mask plate fixing device, an image recognition motion platform, an exposure device and an upper computer for controlling the devices which are sequentially arranged from bottom to top,
The alignment motion control console is provided with a translation module for controlling the wafer carrying platform alignment device to horizontally move and a longitudinal displacement module for controlling the wafer carrying platform alignment device to vertically move, and the translation module and the longitudinal displacement module are used for horizontally moving and vertically moving the wafer carrying platform according to the shooting result of the image recognition motion platform;
The wafer carrying platform alignment device is arranged on an installation plane at the upper end of the alignment motion control platform and is used for realizing parallel alignment of a wafer carried by the wafer carrying platform and a mask plate;
the wafer carrying platform is fixed on the wafer carrying platform alignment device;
the mask fixing device is arranged above the wafer carrying platform and is used for fixing the mask in vacuum;
The image recognition moving table comprises two image recognition units for positioning the wafer, a horizontal moving unit for horizontally moving the image recognition units and a vertical moving unit for vertically moving the image recognition units;
the exposure device is arranged above the image recognition moving table and is used for exposing the wafer,
The wafer carrying platform alignment device comprises:
The lower end surface of the flexible mechanism is connected with the longitudinal displacement module, the upper end surface of the flexible mechanism is connected with the wafer carrying platform, and the wafer carrying platform is driven by the longitudinal displacement module to move;
The wafer carrying platform positioning assembly is arranged between the wafer carrying platform and the mask plate and used for positioning the wafer carrying platform, the wafer carrying platform is contacted with the lower surface of the wafer carrying platform positioning assembly, and the upper surface of the wafer carrying platform positioning assembly is contacted with the mask plate;
And the flexible locking unit is used for receiving the current force value fed back by the longitudinal displacement module in real time in the whole process, locking the current position of the flexible mechanism when the current force value reaches a preset force value, and determining that the wafer on the wafer carrying platform at the current position is relatively parallel to the mask plate.
2. The full field exposure apparatus of claim 1, wherein the reticle fixture comprises:
a reticle frame for accommodating a reticle;
a vacuum suction assembly having a vacuum channel communicating with the reticle frame, the accommodated reticle being fixed in the reticle frame by vacuum suction;
And the frame locking assembly is used for fixing the mask frame for accommodating the mask.
3. The full field exposure apparatus of claim 1, wherein the alignment motion console comprises:
The turntable module is provided with an installation plane for installing the wafer carrying platform alignment device and is used for driving the wafer carrying platform to horizontally rotate under the driving of external force;
the translation module is arranged below the turntable module and used for controlling the turntable module to horizontally move;
And the longitudinal displacement module is arranged below the translation module and is crisscrossed with the translation module in the vertical direction, and is used for controlling the vertical movement of the turntable module and the translation module.
4. The full field exposure apparatus of claim 3, wherein the translation module comprises:
the first translation unit is sleeved on the outer side of the longitudinal displacement module and drives all parts above the first translation unit to move vertically along with the longitudinal displacement module or drive all parts above the first translation unit to move horizontally along a first horizontal direction, and the first translation unit is provided with a first guide sliding rail fixed on the outer side of the longitudinal displacement module and a first sliding block moving in the first guide sliding rail;
The second translation unit is arranged above the first translation unit and is in cross sliding connection with the first translation unit in the horizontal direction, and the second translation unit is provided with a second guide sliding rail arranged in the first translation unit and a second sliding block which moves in the second guide sliding rail and is fixedly connected with the turntable module.
5. The full-field exposure apparatus according to claim 3, wherein the longitudinal displacement module comprises a longitudinal motor, a longitudinal guide rail and a longitudinal displacement screw rod, the longitudinal displacement screw rod is in transmission connection with the longitudinal motor, the turntable module is arranged on the longitudinal guide rail and in transmission connection with the longitudinal displacement screw rod, and the longitudinal motor is used for driving the turntable module to reciprocate along the longitudinal guide rail.
6. A full field exposure method, comprising the steps of:
Controlling each device in the full-field exposure apparatus according to any one of claims 1 to 5 to perform initialization reset;
When initialization is completed, replacing a mask plate, judging whether a wafer carrying platform is positioned at a corresponding position with the mask plate by adopting a wafer carrying platform positioning assembly, and controlling the wafer carrying platform to move in a vertical direction until the wafer carrying platform is contacted with the lower surface of the wafer carrying platform positioning assembly and the upper surface of the wafer carrying platform positioning assembly is contacted with the mask plate; detecting the current force value fed back by the motor in the vertical direction in real time in the whole process; when the current force value reaches a preset force value, locking the current position of the flexible mechanism, wherein the wafer carrying table and the mask plate are positioned at the corresponding positions;
Focusing the mask plate by adopting an image recognition unit of an image recognition moving table, and storing a marked image and marked coordinates of the mask plate;
The image recognition unit is adopted to focus the marked image on the wafer and the marked image on the mask plate at the same time, and the marked image on the wafer is aligned with the marked image of the mask plate;
After the wafer is aligned with the mask plate mark image, all patterns on the mask plate are projected onto the adhesive surface of the wafer through an ultraviolet light source, so that the exposure of the wafer is completed.
7. The method of claim 6, wherein focusing the reticle using an image recognition unit of an image recognition stage and saving a mark image and mark coordinates of the reticle, comprises the steps of:
The horizontal moving unit controls the image recognition unit to move into a preset area above the mask plate according to the instruction of the upper computer;
The image recognition unit shoots the mask plate in the preset area and feeds back the shot image to an upper computer until the upper computer feeds back and recognizes a mark image on the mask plate;
The image recognition unit focuses the marked image until the marked image of the mask plate is clearly displayed;
And the upper computer acquires the position coordinate parameters of the current camera and simultaneously stores the mark image and the mark coordinates of the mask.
8. The method of claim 6, wherein using the image recognition unit to focus the mark image on the wafer and the mark image on the reticle simultaneously and to align the mark image on the wafer and the mark image of the reticle comprises:
after taking out the wafer from the wafer box through the mechanical arm, carrying out wafer position adjustment on the prealignment device, and then placing the wafer on a wafer carrying table;
the upper computer controls the image recognition unit to move to a mark coordinate above the mask along with the image recognition moving table;
Moving the image recognition unit in the horizontal direction to recognize the graphic marks on the wafer, and ensuring that the mark images on the mask plate are positioned in the view field of the image recognition unit;
the image recognition unit focuses until the marked image of the wafer is clearly displayed, and acquires the marked image and the coordinate parameters of the wafer in real time;
comparing the coordinate parameters of the wafer with the mark coordinates of the mask plate in real time, and calculating a deviation value of a center point;
And adjusting the alignment motion control console according to the deviation value to enable the wafer mark to be overlapped with the mask plate mark, so that the mark image on the wafer is aligned with the mark image of the mask plate.
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| CN117406560A (en) * | 2023-11-03 | 2024-01-16 | 苏州天准科技股份有限公司 | Multi-degree-of-freedom adjusting table and exposure equipment |
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| CN212060869U (en) * | 2020-05-25 | 2020-12-01 | 大族激光科技产业集团股份有限公司 | Platform device for bearing material sheet and photoetching machine |
| CN111796488A (en) * | 2020-07-03 | 2020-10-20 | 北京华卓精科科技股份有限公司 | Stepping exposure method based on UV-LED photoetching light source |
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| CN102576189A (en) * | 2010-02-15 | 2012-07-11 | 聚斯微技术平版印刷有限公司 | Method and device for active wedge error compensation between two objects that can be positioned substantially parallel to each other |
| CN111796489A (en) * | 2020-07-03 | 2020-10-20 | 北京华卓精科科技股份有限公司 | Mask alignment photoetching machine based on UV-LED (ultraviolet-light emitting diode) area array type light source |
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