CN114843220B - Semiconductor material of new material gets piece device - Google Patents
Semiconductor material of new material gets piece device Download PDFInfo
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- CN114843220B CN114843220B CN202210469095.6A CN202210469095A CN114843220B CN 114843220 B CN114843220 B CN 114843220B CN 202210469095 A CN202210469095 A CN 202210469095A CN 114843220 B CN114843220 B CN 114843220B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a new material semiconductor material sheet taking device which comprises a connecting frame, wherein a double-shaft motor is fixedly connected to the upper surface of the connecting frame through a bolt, a lower rotating rod is arranged at the output end of the lower part of the double-shaft motor through a bolt, a driving bevel gear is fixedly connected to the outer surface of the lower rotating rod through a bolt, a connecting rod is arranged on the inner side of the connecting frame, a limiting groove is formed in the inner side of the connecting frame, a purifying frame is fixedly connected to the outer surface of the double-shaft motor through a bolt, and a connecting block is connected to the outer surface of the connecting rod through threads. This semiconductor material of new material get piece device has solved and has made semiconductor material stabilize slowly and has been got the piece, causes the cracked of semiconductor easily, accomplishes the negative pressure through various transmissions moreover and adsorbs and clean to the platform, makes the structure of whole device comparatively complicated, and then makes the cost of whole device improve to and application scope narrow problem.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a new material semiconductor material taking device.
Background
With the development of science and technology, people can optimize the performance of devices by inventing new materials, for example, the invention of semiconductor materials can greatly reduce the transmission consumption of electric signals, the semiconductor materials are prepared into various shapes, such as circles and the like according to the actual use condition, and during the processing of the semiconductor materials, the semiconductor materials need to be subjected to sheet taking operation, while the existing sheet taking devices of some semiconductor materials still have some defects during use, such as:
CN108987329A describes a semiconductor material sheet taking device, a plurality of sensing points 901 are uniformly arranged on a bearing surface of a worktable 9, specifically, the sensing points 901 may be light sensors or pressure sensors, preferably, light sensors are used, and the device further includes a single chip, a clamping device 8, a first motor 5, a third motor 10, and the sensing points 901 are respectively and electrically connected to the single chip, when a sheet-shaped semiconductor part is placed on the bearing surface of the worktable 9, the semiconductor part covers part of the sensing points 901, so that the illumination intensity sensed by the part of the sensing points 901 decreases suddenly, after the single chip receives a change of a signal, the shape and the area of the semiconductor part can be estimated, in addition, the thickness of the sheet-shaped semiconductor part can be considered to be uniform, and further, the gravity center position of the semiconductor part can be estimated, then, the single chip controls the first motor 5 and the third motor 10 to operate, so that the clamping device 8 moves to a position above the gravity center of the semiconductor part, and then controls the clamping device 8 to clamp the semiconductor part. The design of the sensing point 901 on the worktable 9 can make the clamping device 8 find the gravity center position of the semiconductor part for clamping, because the positioning is carried out through various sensors, and the position is adjusted through the left and right horizontal levels of the threaded rod, the position adjusting efficiency of the whole device is poor, and the center point of the semiconductor must be positioned on the same horizontal plane with the horizontal central axis of the threaded rod, the position placing of the semiconductor has higher requirements, because the worker can not ensure the placing accuracy when placing, the use of the whole device is more inconvenient, and further the wafer taking efficiency of the semiconductor is reduced, meanwhile, the application passes through negative pressure adsorption, because the wafer taking device described in CN108987329A can not carry out up and down adjustment, when the negative pressure adsorption is caused, the stress of the gravity center position is the largest in the adsorption and lifting process of the semiconductor (CN 108987329A describes that the semiconductor material is thin), the wafer can not be taken slowly and stably, and further the semiconductor is easy to cause the fragmentation of the semiconductor, and the negative pressure adsorption and the cleaning of the platform can be completed through various transmissions, the structure of the whole device is more complicated, and the cost of the whole device is increased, and the application can be applied to clamping only for semiconductor materials in different horizontal directions and can be applied to be not carried out the operation of semiconductor material.
We therefore propose a new material semiconductor material take-out device in order to solve the problems set out above.
Disclosure of Invention
The invention aims to provide a new material semiconductor material taking device, which solves the problems that the existing taking device in the market needs to be positioned by various sensors, the position is adjusted by the left and right levels of a threaded rod, the position adjusting efficiency of the whole device is poor, the central point of a semiconductor needs to be positioned on the same horizontal plane with the horizontal central axis of the threaded rod, the position placing of the semiconductor has high requirements, the placing accuracy cannot be ensured when a worker places the semiconductor, the whole device is more inconvenient to use, the taking efficiency of the semiconductor is reduced, the application adopts negative pressure adsorption, the taking device described in CN108987329A cannot be adjusted up and down, the semiconductor cannot be taken slowly and stably, the semiconductor is easy to crack when the negative pressure adsorption is carried out, the structure of a negative pressure adsorption platform is completed by various transmissions, the cleaning structure of the whole device is complex, and the manufacturing cost of the whole device is increased.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a semiconductor material's of new material piece device of getting, includes the carriage, the last surface bolt fixedly connected with biax motor of carriage, the lower part output end bolt of biax motor is equipped with down the bull stick, the surface bolt fixedly connected with drive bevel gear of bull stick down, the connecting rod has been established to the inboard of carriage, the spacing groove has been seted up to the inboard of carriage, bolt fixedly connected with purifies the frame on the surface of biax motor, the surface threaded connection of connecting rod has the connecting block.
A preferable embodiment of the device for taking a semiconductor material as a new material according to the present invention, wherein: the outer surface of the lower rotating rod is in threaded connection with a connecting block, the outer surface of the connecting block is in welded connection with inserting rods, the inserting rods are distributed on the outer surface of the connecting block in an equiangular mode, an upper rotating rod is fixedly connected to the output end of the upper portion of the double-shaft motor through bolts, and an air suction fan is fixedly connected to the outer surface of the upper rotating rod through bolts.
A preferable embodiment of the sheet taking device for semiconductor material as a new material according to the present invention is one in which: the outer surface threaded connection of connecting rod has the slurcam, the slurcam passes through the spacing groove and constitutes sliding construction with the connecting frame, the inboard bolt fixedly connected with grip block of surface of slurcam.
A preferable embodiment of the device for taking a semiconductor material as a new material according to the present invention, wherein: the inside of the pushing plate is hollow, the upper portion of the inner side of the pushing plate is in threaded communication with a connecting pipe, the connecting pipe is communicated with the guide pipe, and the upper portion of the guide pipe is in threaded communication with a splicing pipe.
A preferable embodiment of the device for taking a semiconductor material as a new material according to the present invention, wherein: the inner side of the clamping plate is elastically connected with an elastic ball, the elastic ball is arranged on the outer surface of the clamping plate at equal angles, the clamping plate corresponds to the connecting rods one by one, and the outer surface of the connecting rods is fixedly connected with a gas release block through bolts.
A preferable embodiment of the device for taking a semiconductor material as a new material according to the present invention, wherein: the connecting pipe and the guide pipe form a clamping sliding structure, and the guide pipe and the connecting frame are fixedly connected through bolts.
A preferable embodiment of the sheet taking device for semiconductor material as a new material according to the present invention is one in which: the plug pipes are distributed in central symmetry about the central axis of the purification frame and are communicated with the purification frame.
A preferable embodiment of the device for taking a semiconductor material as a new material according to the present invention, wherein: the air outlet is formed in the upper surface of the air discharging block and penetrates through the air discharging block, the air outlet is connected with the insertion rod in an embedded mode, and the vertical length of the side of the insertion rod is larger than the sliding distance of the pushing plate.
A preferable embodiment of the device for taking a semiconductor material as a new material according to the present invention, wherein: the external surface threaded connection of connecting block has about conical gear, conical gear around the external surface threaded connection of connecting block, the size between conical gear and the front and back conical gear is equal, the structure is the same about,.
A preferable embodiment of the device for taking a semiconductor material as a new material according to the present invention, wherein: the left and right conical gears are connected with the driving conical gear in a meshing manner, and the friction force between the left and right conical gears and the driving conical gear is smaller than the friction force between the left and right conical gears and the connecting block.
Compared with the prior art, the invention has the beneficial effects that:
1. through the arrangement of the driving bevel gear, the left and right bevel gears and the front and rear bevel gears, when the driving bevel gear rotates, the left and right bevel gears and the front and rear bevel gears drive the multiple groups of pushing plates to move simultaneously, so that the pushing plates enable the clamping blocks to simultaneously clamp semiconductor materials from multiple directions, and through rotating the connecting blocks, workers can detach and install the left and right bevel gears and the front and rear bevel gears according to working requirements, so that the whole device can take the semiconductor materials in different dimensions, the practicability of the whole device is improved, and the application range of the whole device is wider;
2. through the arrangement of the elastic ball, under the rotation of the suction fan, gas is purified by the purification frame through the guide block and enters the guide tube through the insertion tube, so that the gas enters the clamping plate through the pushing plate and is further inflated by the gas, the clamping plate can elastically clamp the semiconductor material, the occurrence of damage to the semiconductor material during clamping is reduced, meanwhile, through the forward and reverse rotation of the double-shaft motor, the insertion rod can block and open a gas outlet on the air discharge block, and further the whole device can be more stable during inflation clamping, and can automatically discharge gas when the semiconductor material is placed, so that the semiconductor material can fall more conveniently;
3. through setting up the grip block, under the diversified centre gripping of multiunit grip block, can make the diversified centre gripping of carrying out semiconductor material of whole device, and then make whole device when carrying out the centre gripping to semiconductor material, make semiconductor material can not appear violent vibration, simultaneously through multi-angle centre gripping on a large scale, make placing position of semiconductor material need not fixedly, and then make whole device when carrying out the centre gripping, efficiency is higher, the structure that makes whole device through the positive and negative rotation of biax motor is simpler moreover, the cost of whole device has been reduced.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic cross-sectional structural view of the present invention;
FIG. 3 is an enlarged view of the structure at A in FIG. 2 according to the present invention;
FIG. 4 is an enlarged view of the structure at B in FIG. 2 according to the present invention;
FIG. 5 is a schematic bottom view of the drive bevel gear of the present invention;
FIG. 6 is a schematic bottom view of the bayonet rod of the present invention;
fig. 7 is a schematic perspective view of the pushing plate of the present invention.
In the figure: 1. a connecting frame; 2. a double-shaft motor; 201. a lower rotating rod; 202. a joining block; 203. an upper rotating rod; 204. an air suction fan; 205. a plug rod; 3. a drive bevel gear; 4. a connecting rod; 401. a push plate; 402. a clamping plate; 403. a resilient ball; 404. a connecting pipe; 405. a guide tube; 406. inserting a tube; 407. a gas release block; 408. an air outlet; 5. a limiting groove; 6. connecting blocks; 601. left and right bevel gears; 602. front and rear bevel gears; 7. a purification frame; 701. and a guide block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, the present invention provides a technical solution: the utility model provides a semiconductor material's of new material piece device of getting, including connecting frame 1, the last surface bolt fixedly connected with biax motor 2 of connecting frame 1, biax motor 2's lower part output bolt is equipped with down bull stick 201, the surface bolt fixedly connected with drive bevel gear 3 of bull stick 201 down, connecting rod 4 has been established to the inboard of connecting frame 1, spacing groove 5 has been seted up to the inboard of connecting frame 1, bolt fixedly connected with purifies frame 7 on biax motor 2's the surface, the surface threaded connection of connecting rod 4 has connecting block 6.
Opening through double-shaft motor 2, make down bull stick 201 drive bevel gear 3 and rotate, and then under the transmission action, make connecting rod 4 rotate, thereby make the centre gripping structure carry out the centre gripping from the multi-azimuth to semiconductor material, and then make whole device when carrying out the centre gripping to semiconductor material, the condition that semiconductor material takes place great displacement appears has been reduced, the condition that the semiconductor takes place to break appears, and rotation through double-shaft motor 2, make purification frame 7 purify the air, through aerifing supplementary centre gripping to semiconductor material, further the security when semiconductor material gets the piece has been improved, and through rotating connecting block 6, make whole device can dismantle the installation, and then make whole device can be according to the centre gripping demand of different dimensions, come to centre gripping to semiconductor material, thereby whole device's application scope has been improved, simultaneously under double-shaft motor 2's opening, through simple transmission, can make stable semiconductor material of whole device press from both sides and get, and then whole device's cost has been reduced.
In this embodiment, the outer surface of the lower rotating rod 201 is connected with the connecting block 202 through a thread, the outer surface of the connecting block 202 is connected with the inserting rod 205 through welding, the inserting rod 205 is distributed on the outer surface of the connecting block 202 at equal angles, the upper output end of the double-shaft motor 2 is fixedly connected with the upper rotating rod 203 through a bolt, and the outer surface of the upper rotating rod 203 is fixedly connected with the air suction fan 204 through a bolt.
The upper rotating rod 203 and the lower rotating rod 201 are driven to rotate through the double-shaft motor 2, so that the air suction fan 204 is inflated, the connecting block 202 moves on the lower rotating rod 201, the inserting rod 205 can control the inflation state of the whole device, the whole device can be effectively clamped through inflation assistance, and the clamping safety of semiconductor materials is improved.
In this embodiment, the outer surface of the connecting rod 4 is connected with a pushing plate 401 through a thread, the pushing plate 401 and the connecting frame 1 form a sliding structure through a limiting groove 5, and a clamping plate 402 is fixedly connected to the inner side of the outer surface of the pushing plate 401 through a bolt.
Through the spacing of spacing groove 5, when making connecting rod 4 rotate, can make the catch bar 401 slide in the link frame 1, and then make the centre gripping operation of whole device more smooth.
In this embodiment, the interior of the push plate 401 is hollow, the upper portion of the inner side of the push plate 401 is in threaded communication with a connecting pipe 404, the connecting pipe 404 is in communication with a guide pipe 405, and the upper portion of the guide pipe 405 is in threaded communication with a bayonet pipe 406.
Through the communication of guide tube 405, bayonet tube 406, connecting pipe 404 and catch plate 401, can make whole device aerify supplementary centre gripping, make the centre gripping operation of semiconductor material safer, when having reduced the centre gripping of semiconductor material, the condition that takes place the breakage appears.
In this embodiment, the elastic balls 403 are elastically connected to the inner side of the clamping plate 402, the elastic balls 403 are disposed on the outer surface of the clamping plate 402 at equal angles, the clamping plate 402 and the connecting rods 4 are in one-to-one correspondence, and the air release blocks 407 are fixedly connected to the outer surface of the connecting rods 4 through bolts.
Through the inflation of the elastic balls 403 and the multi-directional clamping of the clamping plate 402, the semiconductor material can be clamped by the whole device, the occurrence of large displacement of the semiconductor material is reduced, and the stability of the semiconductor material in the process of taking the wafer is improved.
In this embodiment, the connection pipe 404 and the guide pipe 405 constitute a clamping sliding structure, the connection mode between the guide pipe 405 and the connection frame 1 is bolt fixed connection, and the whole device can be assisted in clamping through inflating through the transmission of the guide pipe 405 and the connection pipe 404, so that the clamping of the semiconductor material is more convenient and efficient.
In this embodiment, the central axis of the inserting pipe 406 relative to the purifying frame 7 is distributed in central symmetry, the inserting pipe 406 is communicated with the purifying frame 7, and the gas is transmitted through the inserting pipe 406, so that the purified gas is conveyed by the purifying frame 7, the occurrence of blockage of the whole clamping device is reduced, and the clamping of the semiconductor material is not influenced.
In this embodiment, gas outlet 408 has been seted up to gassing piece 407 upper surface, gas outlet 408 runs through gassing piece 407, the connected mode between gas outlet 408 and the peg graft pole 205 is for inlaying the connection, the vertical length of avris of peg graft pole 205 is greater than the sliding distance of slurcam 401, through the opening and closing of peg graft pole 205 to gas outlet 408, make whole device can control gassing and aerify through the positive and negative rotation of biax motor 2, thereby make the structure of whole device simpler, reduced the cost of whole device.
In this embodiment, the outer surface of the connecting block 6 is screwed with the left and right bevel gears 601, the outer surface of the connecting block 6 is screwed with the front and rear bevel gears 602, and the left and right bevel gears 601 and the front and rear bevel gears 602 have the same size and the same structure.
Through the rotation transmission of front and back conical gear 602 and left and right conical gear 601, can make whole device carry out diversified centre gripping, make semiconductor material's clamp get more stable, make semiconductor material when being got the piece, more stable.
In the present embodiment, the left and right bevel gears 601 and the driving bevel gear 3 are connected in a meshing manner, and the frictional force between the left and right bevel gears 601 and the driving bevel gear 3 is smaller than the frictional force between the left and right bevel gears 601 and the connecting block 6.
By driving the rotation of the bevel gear 3, the whole device can complete the clamping of the semiconductor material through simple transmission, and further the manufacturing cost of the whole device is reduced.
The invention is a new material semiconductor material sheet taking device, when a semiconductor material sheet is required to be taken, a worker places the semiconductor material on a processing table, then turns on a double-shaft motor 2, the double-shaft motor 2 is turned on to drive an upper rotating rod 203 and a lower rotating rod 201 to rotate, when the upper rotating rod 203 rotates, the upper rotating rod 203 drives an air suction fan 204 to rotate, so that external air enters the interior of a purification frame 7 through the guide of a guide block 701 to be purified, the air enters an insertion pipe 406, the air enters a clamping plate 402 through a pushing plate 401 through the transmission of a guide pipe 405, and at the moment, an elastic ball is inflated.
When the lower rotating rod 201 rotates, the driving bevel gear 3 drives the front and rear bevel gears 602 and the left and right bevel gears 601 to rotate, and simultaneously, under the limit of the air release block 407, the connection block 202 moves on the lower rotating rod 201, so that the air outlet 408 is blocked by the insertion rod 205, and the inflation of the elastic ball 403 is more stable.
When bevel gear 601 rotated around with front and back bevel gear 602, drive connecting rod 4 and rotate, and then made the pushing plate 401 slide in spacing groove 5, multiunit pushing plate 401 moved to the inboard this moment, and then made whole device can carry out the centre gripping to semiconductor material, and the staff can rotate connecting block 6 according to actual need simultaneously, makes connecting block 6 break away from in the connection of connecting rod 4, and then makes whole device can adapt to the semiconductor material's of different dimensions the operation of getting the piece.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.
Claims (8)
1. A new material's semiconductor material gets piece device, includes connection frame (1), its characterized in that: the upper surface of the connecting frame (1) is fixedly connected with a double-shaft motor (2) through bolts, the lower output end of the double-shaft motor (2) is provided with a lower rotating rod (201) through bolts, the outer surface of the lower rotating rod (201) is fixedly connected with a driving bevel gear (3) through bolts, a connecting rod (4) is arranged on the inner side of the connecting frame (1), a limiting groove (5) is formed in the inner side of the connecting frame (1), a purifying frame (7) is fixedly connected to the outer surface of the double-shaft motor (2) through bolts, and the outer surface of the connecting rod (4) is in threaded connection with a connecting block (6);
the outer surface of the connecting rod (4) is in threaded connection with a pushing plate (401), the pushing plate (401) and the connecting frame (1) form a sliding structure through a limiting groove (5), and the inner side of the outer surface of the pushing plate (401) is fixedly connected with a clamping plate (402) through bolts;
the external surface threaded connection of connecting block (6) has about conical gear (601), conical gear (602) around the external surface threaded connection of connecting block (6), about conical gear (601) and around conical gear (602) between equal, the structure the same of size.
2. A device for taking sheets of semiconductor material of new material according to claim 1, characterized in that: the outer surface of the lower rotating rod (201) is in threaded connection with a connecting block (202), the outer surface of the connecting block (202) is in welded connection with a plug-in rod (205), the plug-in rod (205) is distributed on the outer surface of the connecting block (202) in an equiangular mode, the upper output end of the double-shaft motor (2) is fixedly connected with an upper rotating rod (203) through bolts, and the outer surface of the upper rotating rod (203) is fixedly connected with an air suction fan (204).
3. The device for taking out a semiconductor material of a new material according to claim 2, wherein: the interior of the pushing plate (401) is hollow, the upper portion of the inner side of the pushing plate (401) is in threaded communication with a connecting pipe (404), the connecting pipe (404) is communicated with a guide pipe (405), and the upper portion of the guide pipe (405) is in threaded communication with an inserting pipe (406).
4. A device for taking sheets of semiconductor material of new material according to claim 2, characterized in that: the inboard elastic connection of grip block (402) has bouncing ball (403), bouncing ball (403) wait the angle setting at the surface of grip block (402), grip block (402) and connecting rod (4) one-to-one, connecting rod (4) surface bolt fixedly connected with deflate piece (407).
5. The device for taking out a semiconductor material of a new material according to claim 3, wherein: the connecting pipe (404) and the guide pipe (405) form a clamping sliding structure, and the guide pipe (405) and the connecting frame (1) are fixedly connected through bolts.
6. The device for taking out a semiconductor material of a new material according to claim 3, wherein: the plug pipes (406) are distributed in a central symmetry mode about the central axis of the purification frame (7), and the plug pipes (406) are communicated with the purification frame (7).
7. A device for taking sheets of semiconductor material of new material according to claim 4, characterized in that: air outlet (408) have been seted up to gassing piece (407) upper surface, gassing piece (407) are run through to air outlet (408), the connected mode between air outlet (408) and bayonet rod (205) is for inlaying the connection, the vertical length of avris of bayonet rod (205) is greater than the sliding distance of pushing plate (401).
8. A device for taking sheets of semiconductor material of new material according to claim 1, characterized in that: the left and right bevel gears (601) are connected with the driving bevel gear (3) in a meshing manner, and the friction force between the left and right bevel gears (601) and the driving bevel gear (3) is smaller than the friction force between the left and right bevel gears (601) and the connecting block (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210469095.6A CN114843220B (en) | 2022-04-29 | 2022-04-29 | Semiconductor material of new material gets piece device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210469095.6A CN114843220B (en) | 2022-04-29 | 2022-04-29 | Semiconductor material of new material gets piece device |
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| Publication Number | Publication Date |
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| CN114843220A CN114843220A (en) | 2022-08-02 |
| CN114843220B true CN114843220B (en) | 2022-11-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210469095.6A Active CN114843220B (en) | 2022-04-29 | 2022-04-29 | Semiconductor material of new material gets piece device |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6405739B1 (en) * | 1999-11-09 | 2002-06-18 | Liu Yu-Tsai | Spin chuck capable of providing simultaneous dual-sided processing |
| US10493618B1 (en) * | 2018-11-20 | 2019-12-03 | Jiangsu Fine Storage Information Technology Co., Ltd. | Multi-axis mechanical gripper with symmetrically fixed pair of racks |
| CN211090184U (en) * | 2019-12-10 | 2020-07-24 | 武汉中尚电子科技有限公司 | PCB printing is with brush board clamping device |
| CN212705918U (en) * | 2020-08-13 | 2021-03-16 | 莆田市晟熠光电科技有限公司 | C-lens cold processing burnishing device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112109132A (en) * | 2020-10-26 | 2020-12-22 | 黄嘉慧 | But environmental protection is with automatic slicing's degradable plastics processingequipment |
-
2022
- 2022-04-29 CN CN202210469095.6A patent/CN114843220B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6405739B1 (en) * | 1999-11-09 | 2002-06-18 | Liu Yu-Tsai | Spin chuck capable of providing simultaneous dual-sided processing |
| US10493618B1 (en) * | 2018-11-20 | 2019-12-03 | Jiangsu Fine Storage Information Technology Co., Ltd. | Multi-axis mechanical gripper with symmetrically fixed pair of racks |
| CN211090184U (en) * | 2019-12-10 | 2020-07-24 | 武汉中尚电子科技有限公司 | PCB printing is with brush board clamping device |
| CN212705918U (en) * | 2020-08-13 | 2021-03-16 | 莆田市晟熠光电科技有限公司 | C-lens cold processing burnishing device |
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| Publication number | Publication date |
|---|---|
| CN114843220A (en) | 2022-08-02 |
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