CN114613690B - Semiconductor thickness detection and comparison device - Google Patents
Semiconductor thickness detection and comparison device Download PDFInfo
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- CN114613690B CN114613690B CN202210512642.4A CN202210512642A CN114613690B CN 114613690 B CN114613690 B CN 114613690B CN 202210512642 A CN202210512642 A CN 202210512642A CN 114613690 B CN114613690 B CN 114613690B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
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Abstract
The invention belongs to the field of semiconductor detection, and particularly relates to a semiconductor thickness detection and comparison device which comprises a workbench, a fixed frame and a light-transmitting plate, wherein a supporting base is welded and fixed on the bottom end surface of the workbench, a clamping assembly is installed on the workbench, a fixed pipe is fixedly connected in the workbench, an anti-warping assembly is installed on the fixed pipe, a supporting rod is welded and fixed on the top end surface of the workbench, a fixed top plate is welded and fixed on the top end of the supporting rod, a dust removal assembly is installed on the fixed top plate, a threaded rod is rotatably connected in the fixed frame, an adjusting frame is in threaded connection on the threaded rod, the problems that the traditional thickness detection device cannot simultaneously carry out non-contact comparison detection work in different directions on the same semiconductor and cannot conveniently and stably clamp and position semiconductors with different specifications and sizes are solved, meanwhile, the problem that the edge warping phenomenon of the semiconductor in the placing process cannot be effectively avoided.
Description
Technical Field
The invention relates to the field of semiconductor detection, in particular to a semiconductor thickness detection and comparison device.
Background
With the progress of science and technology, semiconductors are widely applied in daily life, and because semiconductor sheets have high requirements on surfaces, after the semiconductors are produced and processed, detection devices are required to be combined to detect the thickness and the flatness of the semiconductors, and follow-up treatment is carried out in time, so that the performance and the efficiency of the semiconductor sheets are improved, technical support is provided for process improvement, and some semiconductor thickness detection devices have some problems in use.
Because the detection of the semiconductor sheet is not suitable for direct contact, the end face of the semiconductor is very easy to be scratched or polluted, the conventional thickness detection device cannot carry out convenient and stable non-contact detection work on the thickness and the flatness of the semiconductor in the working process, and further cannot ensure the stability and the safety of the detection work of the thickness of the semiconductor, and the conventional detection device cannot simultaneously carry out comparison detection work in different directions on the same semiconductor in the working process, therefore, the conventional detection device needs to carry out multiple detections on the same semiconductor and carry out comparison analysis on the results, thereby avoiding the error of the detection result, and the conventional detection device cannot carry out convenient and stable clamping and positioning on the semiconductors with different specifications and sizes in the working process, and simultaneously cannot effectively avoid the edge warping phenomenon of the semiconductor in the placing process, and further cannot ensure the accuracy of the subsequent detection result, the working efficiency is low and the practicability is poor, so that the semiconductor thickness detection and comparison device needs to be provided to meet the requirements of users.
Disclosure of Invention
The invention provides a semiconductor thickness detection and comparison device.
To solve the above technical problem, according to an aspect of the present invention, the present invention provides the following technical solutions: the utility model provides a semiconductor thickness detects contrast device, includes workstation, fixed frame and light-passing board, welded fastening has the support base on the bottom face of workstation, install the centre gripping subassembly on the workstation, the fixed pipe of fixedly connected with in the workstation, install on the fixed pipe and prevent upwarping the subassembly, welded fastening has the bracing piece on the top face of workstation, the top welded fastening of bracing piece has fixed roof, install the subassembly that removes dust on the fixed roof, fixed frame internal rotation is connected with the threaded rod, threaded connection has the adjust the frame on the threaded rod, the spacing sliding connection of adjust the frame is on fixed frame, install the laser lamp on the adjust the frame, be provided with the scale on the light-passing board.
As a preferable aspect of the semiconductor thickness detection and comparison device of the present invention, wherein: the centre gripping subassembly includes the worm, the worm rotates to be connected in the workstation, the meshing is connected with the worm wheel on the worm, the worm wheel rotates to be connected on fixed pipe, run through on the worm wheel and seted up the guide way, spacing sliding connection has the guide bar in the worm wheel, the top welded fastening of guide bar has the limiting plate, the spacing sliding connection of limiting plate is on the workstation, be fixed connection between the bottom face of limiting plate and fixed frame and the bottom face of light-passing board, welded fastening has the grip block on the top face of limiting plate, screwed connection has the rubber slab on the grip block.
As a preferable aspect of the semiconductor thickness detection and comparison apparatus of the present invention, wherein: the central axis of worm wheel is located same vertical central line with the central axis of workstation, angular distribution such as guide way is on the worm wheel, the guide way is circular-arcly, the guide way passes through guide bar and limiting plate one-to-one, the equal symmetric distribution of fixed frame and light-passing board is on the limiting plate of adjacent both sides, be parallel distribution between fixed frame and the light-passing board.
As a preferable aspect of the semiconductor thickness detection and comparison apparatus of the present invention, wherein: the anti-warping assembly comprises a mounting plate, the mounting plate is movably connected to the bottom of a connecting rod, the top of the connecting rod is movably connected to the bottom face of a limiting plate, a connecting push rod is welded and fixed to the top face of the mounting plate, a rubber piston is welded and fixed to the top of the connecting push rod, the rubber piston is connected to the fixing pipe in a limiting sliding mode, and a rubber sucker is connected to the top of the fixing pipe through a bolt.
As a preferable aspect of the semiconductor thickness detection and comparison apparatus of the present invention, wherein: the connecting push rod is fixed at the middle part of the bottom of the rubber piston, the side end face of the rubber piston is attached to the inner wall of the fixed pipe, the top end face of the rubber sucker is flush with the top end face of the workbench, and the connecting rod is hinged to the mounting plate and the limiting plate.
As a preferable aspect of the semiconductor thickness detection and comparison apparatus of the present invention, wherein: the threaded rod is connected in the middle of fixed frame, the outer terminal surface of fixed frame is laminated with the inner end face of adjusting the frame mutually, the width of adjusting the frame is less than the length of threaded rod, the laser lamp equidistance distributes on the adjusting the frame.
As a preferable aspect of the semiconductor thickness detection and comparison apparatus of the present invention, wherein: the dust removal assembly comprises a ventilating duct, the ventilating duct is fixedly welded on a fixed top plate, a filter screen plate is fixedly welded on the top end of the inner portion of the ventilating duct, a servo motor is fixedly welded on the top end face of the filter screen plate, the output end of the servo motor is connected with a fixed shaft, a connecting scraping rod is fixedly welded on the top of the fixed shaft, an exhaust fan is fixedly welded on the bottom end of the fixed shaft, a conveying pipe is connected on the side end face of the ventilating duct through a bolt, a collecting box is connected on the other end of the conveying pipe through a bolt, and the collecting box is fixedly welded on the top end face of the fixed top plate.
As a preferable aspect of the semiconductor thickness detection and comparison apparatus of the present invention, wherein: the middle part at fixed roof is fixed to the draft tube, the internal diameter of draft tube is greater than the diameter of exhaust fan, the top end face of draft tube and the top end face parallel and level of filter plate, the bottom face of filter plate laminates with the top end face of connecting the pole of scraping mutually, the side end face of connecting the pole of scraping laminates with the inner wall of draft tube mutually, it is circular-arcly to connect the pole of scraping, connect angular distribution such as the pole of scraping on the fixed axle.
As a preferable aspect of the semiconductor thickness detection and comparison apparatus of the present invention, wherein: the bottom end face of the filter screen plate is flush with the top end face of the conveying pipe, the conveying pipes are symmetrically distributed on two sides of the ventilating duct, and the conveying pipes correspond to the collecting boxes one to one.
Compared with the prior art, the invention has the beneficial effects that:
1. the device is provided with the adjusting frame and the light-transmitting plate, the adjusting frame can be driven to stably move up and down on the fixing frame by utilizing the threaded rod, the working height of the laser lamp can be conveniently and rapidly adjusted, the thickness and the flatness of the semiconductor can be conveniently and stably detected in a non-contact mode visually by combining scales on the light-transmitting plate through irradiation of the laser lamp, the thickness and the flatness of the semiconductor can be detected and contrastively analyzed in different directions by utilizing the symmetrically distributed adjusting frame and the corresponding light-transmitting plate, the accuracy of the detection results of the thickness and the flatness of the semiconductor can be further ensured, the detection efficiency can be effectively improved, and the working efficiency of the device is effectively improved;
2. the clamping assembly is arranged, each clamping plate can be driven to move towards the middle simultaneously by utilizing the driving of the worm and the worm wheel and through the limiting guide among the guide groove, the guide rod and the limiting plate, the convenient and efficient clamping and fixing work can be carried out on semiconductors of different specifications and sizes by combining with the corresponding rubber plate, and further the stability and the safety of the subsequent detection work can be ensured;
3. the anti-warping component is arranged, the mounting plate can be pushed to stably move downwards through the corresponding connecting rods in the process that each limiting plate moves towards the middle at the same time, the mounting plate can drive the rubber piston to move downwards in the fixed pipe through the connecting push rod at the moment, the rubber sucker can be used for automatically and stably adsorbing and attaching the semiconductor, the problem that the detection result is inaccurate due to the fact that the edge warping phenomenon occurs in the placing and clamping process of the semiconductor can be effectively avoided, and therefore the accuracy and the stability of the subsequent detection work of the semiconductor can be guaranteed;
4. be provided with the dust removal subassembly, utilize air funnel and exhaust fan can stabilize the suction with dust and impurity in the air around the semiconductor to filter through filter plate, meanwhile, utilize each to connect the rotation of scraping the pole, can pass through filterable dust and impurity in conveyer pipe autostabilization's propelling movement to the collecting box, accomplish the automatic collection work of dust, and then can effectively avoid dust and impurity in the air around the semiconductor to influence the detection achievement of follow-up thickness and roughness.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
Wherein:
FIG. 1 is a schematic diagram of an overall three-dimensional structure of a semiconductor thickness detection and comparison device according to the present invention;
FIG. 2 is a schematic diagram of an overall front view structure of a semiconductor thickness detection and comparison apparatus according to the present invention;
FIG. 3 is a schematic side view of a laser lamp of the semiconductor thickness detection and comparison apparatus of the present invention;
FIG. 4 is a schematic diagram of a side view of a threaded rod of the semiconductor thickness inspection contrast device of the present invention;
FIG. 5 is a schematic top view of a clamping plate of a semiconductor thickness inspection and comparison device according to the present invention;
FIG. 6 is a schematic top view of a guide slot of a semiconductor thickness measurement and comparison apparatus according to the present invention;
FIG. 7 is a schematic view of a rubber piston structure of a semiconductor thickness detection and comparison device according to the present invention;
FIG. 8 is a schematic top view of an exhaust fan of the semiconductor thickness inspection and comparison apparatus of the present invention;
FIG. 9 is a schematic top view of a connecting scraping bar of a semiconductor thickness inspection and comparison device according to the present invention.
Reference numbers in the figures: 1. a work table; 2. a support base; 3. a clamping assembly; 301. a worm; 302. a worm gear; 303. a guide groove; 304. a guide bar; 305. a limiting plate; 306. a clamping plate; 307. a rubber plate; 4. a fixed tube; 5. a connecting rod; 6. a warpage prevention assembly; 601. mounting a plate; 602. connecting a push rod; 603. a rubber piston; 604. a rubber suction cup; 7. a fixing frame; 8. a threaded rod; 9. an adjusting frame; 10. a laser light; 11. a light-transmitting plate; 12. calibration; 13. a support bar; 14. fixing a top plate; 15. a dust removal assembly; 1501. a funnel; 1502. a filter screen plate; 1503. a servo motor; 1504. a fixed shaft; 1505. an exhaust fan; 1506. connecting the scraping rod; 1507. a delivery pipe; 1508. and a collection box.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described herein, and it will be apparent to those of ordinary skill in the art that the present invention may be practiced without departing from the spirit and scope of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Next, the present invention is described in detail with reference to the drawings, and in the detailed description of the embodiments of the present invention, the cross-sectional view illustrating the structure of the device is not enlarged partially in general scale for the convenience of illustration, and the drawings are only exemplary, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
Examples
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1-8, a semiconductor thickness detects contrast device, including workstation 1, fixed frame 7 and light-passing board 11, welded fastening has support base 2 on the bottom face of workstation 1, install centre gripping subassembly 3 on the workstation 1, fixed pipe 4 of fixedly connected with in the workstation 1, fixed pipe 4 is last to install warp-proof subassembly 6, welded fastening has bracing piece 13 on the top face of workstation 1, the top welded fastening of bracing piece 13 has fixed roof 14, install dust removal subassembly 15 on the fixed roof 14, fixed frame 7 internal rotation is connected with threaded rod 8, threaded rod 8 goes up threaded connection has adjusting frame 9, the spacing sliding connection of adjusting frame 9 is on fixed frame 7, install laser lamp 10 on adjusting frame 9, be provided with scale 12 on the light-passing board 11.
By utilizing the matching of the clamping component 3 and the anti-warping component 6, the semiconductor clamping device can conveniently and efficiently clamp, fix, attach and adsorb semiconductors with different specifications and sizes, further ensuring the stability and safety of the subsequent detection work, conveniently adjusting the working height of the laser lamp 10 by utilizing the matching of the threaded rod 8 and the adjusting frame 9, the thickness and the flatness of the semiconductor can be conveniently and stably visually detected by the irradiation of the laser lamp 10 and the combination of the scales 12 on the light-transmitting plate 11, and the symmetrically distributed adjusting frames 9 and the corresponding light-transmitting plates 11 can simultaneously detect and compare and analyze the thickness and the flatness of the same semiconductor in different directions, thereby ensuring the accuracy of the detection result of the thickness and the flatness of the semiconductor, effectively improving the detection efficiency and simultaneously, the dust removal assembly 15 can effectively prevent dust and impurities in the air around the semiconductor from influencing the subsequent detection work of thickness and flatness.
In this example, centre gripping subassembly 3 includes worm 301, worm 301 rotates to be connected in workstation 1, the meshing is connected with worm wheel 302 on the worm 301, worm wheel 302 rotates to be connected on fixed pipe 4, run through on the worm wheel 302 and seted up guide way 303, spacing sliding connection has guide bar 304 in the worm wheel 302, the top welded fastening of guide bar 304 has limiting plate 305, the spacing sliding connection of limiting plate 305 is on workstation 1, be fixed connection between limiting plate 305 and the bottom face of fixed frame 7 and the bottom face of light-passing board 11, welded fastening has clamping plate 306 on the top face of limiting plate 305, bolted connection has rubber slab 307 on clamping plate 306.
The central axis of worm wheel 302 and the central axis of workstation 1 are located same vertical central line, and angular distribution such as guide way 303 is on worm wheel 302, and guide way 303 is circular-arcly, and guide way 303 passes through guide bar 304 and limiting plate 305 one-to-one, and fixed frame 7 and the equal symmetric distribution of light-passing board 11 are on the limiting plate 305 of adjacent both sides, are parallel distribution between fixed frame 7 and the light-passing board 11.
The stability of the working state of the rubber plate 307 on the clamping plate 306 is ensured, and further the stability and the safety of the subsequent clamping state of the semiconductor can be ensured, so that the semiconductor can be effectively prevented from being damaged in the clamping process.
In this example, the anti-warp assembly 6 includes a mounting plate 601, the mounting plate 601 is movably connected to the bottom of the joint rod 5, the top of the joint rod 5 is movably connected to the bottom end surface of the limiting plate 305, a connecting push rod 602 is welded and fixed to the top end surface of the mounting plate 601, a rubber piston 603 is welded and fixed to the top end of the connecting push rod 602, the rubber piston 603 is in limited sliding connection in the fixed pipe 4, and a rubber suction cup 604 is bolted to the top end of the fixed pipe 4.
The connecting push rod 602 is fixed at the middle part of the bottom of the rubber piston 603, the side end face of the rubber piston 603 is attached to the inner wall of the fixed pipe 4, the top end face of the rubber sucker 604 is flush with the top end face of the workbench 1, and the connecting rod 5 is hinged with the mounting plate 601 and the limiting plate 305.
Threaded rod 8 is connected in the middle part of fixed frame 7, and the outer terminal surface of fixed frame 7 laminates with the interior terminal surface of adjusting frame 9 mutually, and the width of adjusting frame 9 is less than the length of threaded rod 8, and laser lamp 10 equidistance distributes on adjusting frame 9.
The stability of the connection state between the connecting rod 5 and the mounting plate 601 and the limiting plate 305 is guaranteed, and then the automatic stability of the follow-up driving work of the anti-warping assembly 6 can be guaranteed, so that the problem that the detection result is inaccurate due to the fact that the edge warping occurs in the process that the semiconductor is placed in the clamping process can be effectively avoided.
In this example, the dust removing assembly 15 includes a funnel 1501, the funnel 1501 is welded and fixed on the fixed top plate 14, a filter screen plate 1502 is welded and fixed on the top end surface of the inner portion of the funnel 1501, a servo motor 1503 is welded and fixed on the top end surface of the filter screen plate 1502, a fixed shaft 1504 is connected to the output end of the servo motor 1503, a connecting scraping rod 1506 is welded and fixed on the top of the fixed shaft 1504, a fan 1505 is welded and fixed on the bottom end of the fixed shaft 1504, a delivery pipe 1507 is bolted on the side end surface of the funnel 1501, a collection box 1508 is bolted on the other end of the delivery pipe 1507, and the collection box 1508 is welded and fixed on the top end surface of the fixed top plate 14.
The stability of the operating condition of the exhaust fan 1505 and the connecting scraping rod 1506 on the fixed shaft 1504 is ensured, and the convenience and high efficiency of the subsequent dust suction work and the pushing work can be further ensured.
In this example, the funnel 1501 is fixed to the middle of the fixed top plate 14, the inner diameter of the funnel 1501 is larger than the diameter of the fan 1505, the top end face of the funnel 1501 is flush with the top end face of the filter screen plate 1502, the bottom end face of the filter screen plate 1502 is attached to the top end face of the connecting scraping rod 1506, the side end face of the connecting scraping rod 1506 is attached to the inner wall of the funnel 1501, the connecting scraping rod 1506 is arc-shaped, and the connecting scraping rods 1506 are equiangularly distributed on the fixed shaft 1504.
The bottom end face of the screen plate 1502 is flush with the top end face of the conveying pipe 1507, the conveying pipe 1507 is symmetrically distributed on two sides of the ventilating funnel 1501, and the conveying pipe 1507 corresponds to the collecting box 1508 one by one.
The stability of the attaching state of the connecting scraping rod 1506 on the filter screen plate 1502 is ensured, and then the automatic stability of the subsequent pushing and collecting work of dust and impurities can be ensured, so that the accuracy and the safety of the subsequent detection work can be ensured.
It should be noted that, the invention is a semiconductor thickness detection and comparison device, firstly, a worker can place a semiconductor to be detected and compared on a workbench 1, then the worker can rotate a worm 301, at the same time, under the rotation action of the worm 301, a worm wheel 302 in meshing connection can be driven to stably rotate on a fixed pipe 4, at the same time, in the rotation process of the worm wheel 302, under the limiting and guiding action of a limiting plate 305, the limiting plates 305 on corresponding guide rods 304 can be driven to simultaneously move towards the middle through each guide groove 303, at the same time, under the movement action of each limiting plate 305, corresponding clamping plates 306 can be driven to simultaneously move towards the middle, semiconductors of different specifications and sizes can be conveniently positioned, clamped and fixed by combining a rubber plate 307, and in the process that each limiting plate 305 simultaneously moves towards the middle, a mounting plate 601 can be pushed to stably move downwards through corresponding connecting rods 5, mounting panel 601 can drive rubber piston 603 downstream in fixed pipe 4 through connecting push rod 602 this moment, and under rubber piston 603's motion effect, can suck the air in the rubber suction cup 604 through fixed pipe 4, the inside negative pressure that forms of rubber suction cup 604 this moment, and then can carry out automatic and stable absorption laminating work to the semiconductor to can effectively avoid the semiconductor place with the centre gripping in-process take place to stick up the limit phenomenon and lead to the inaccurate problem of testing result.
And in the process of the movement of each limit plate 305, the fixing frame 7 and the light-transmitting plate 11 can be driven to move simultaneously and close to the semiconductor, then the worker can control to open the laser lamps 10 on the adjusting frame 9, and the worker can rotate the threaded rod 8, at this time, under the rotating action of the threaded rod 8, the adjusting frame 9 can be driven to move upwards or downwards on the fixing frame 7, so as to conveniently adjust the working height of the laser lamps 10, at this time, the irradiation height of each laser lamp 10 is adjusted until each laser lamp 10 moves to just separate from the semiconductor, at this time, by observing the position of the laser lamp 10 irradiating on the light-transmitting plate 11, the thickness of the semiconductor can be conveniently and stably visually detected by combining the scales 12 on the light-transmitting plate 11, meanwhile, the worker can observe whether each laser lamp 10 can just separate from the semiconductor and irradiate on the light-transmitting plate 11 simultaneously, if partial laser lamp 10 is sheltered from by the semiconductor, then this semiconductor terminal surface unevenness, and in the same way, utilize symmetric distribution's adjusting frame 9 and corresponding light-passing board 11, can carry out the detection and the contrastive analysis work of thickness and the roughness of equidirectional simultaneously to same semiconductor, and then can guarantee the accuracy of semiconductor thickness and roughness testing result, can effectively improve detection efficiency simultaneously, effectively improve the work efficiency of device.
In the detection process, a worker can control the servo motor 1503 to be started, at the moment, the servo motor 1503 can drive the exhaust fan 1505 at the bottom of the fixed shaft 1504 to stably rotate in the ventilating duct 1501, at the moment, under the continuous rotation action of the exhaust fan 1505, dust and foreign substances in the air around the semiconductor can be stably sucked through the funnel 1501, and filtered and adsorbed through the screen plate 1502, and at the same time, the fixed shaft 1504 can drive the connecting scraping rods 1506 to rotate simultaneously when rotating, and the rotation of the connecting scraping rods 1506 can automatically and stably push the dust and impurities filtered by the filter screen plate 1502 into collecting boxes 1508 at two sides through the conveying pipe 1507 to complete the automatic collection of the dust, and then can effectively avoid dust and impurity in the air around the semiconductor to influence the detection work of follow-up thickness and roughness.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the various features of the disclosed embodiments of the invention may be used in any combination, provided that no structural conflict exists, and the combinations are not exhaustively described in this specification merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (4)
1. A semiconductor thickness detection and comparison device comprises a workbench (1), a fixed frame (7) and a light-transmitting plate (11), and is characterized in that; a supporting base (2) is welded and fixed on the bottom end surface of the workbench (1), a clamping assembly (3) is installed on the workbench (1), a fixed pipe (4) is fixedly connected in the workbench (1), an anti-warping component (6) is arranged on the fixed pipe (4), a supporting rod (13) is welded and fixed on the top end surface of the workbench (1), a fixed top plate (14) is welded and fixed on the top end of the supporting rod (13), a dust removal assembly (15) is arranged on the fixed top plate (14), a threaded rod (8) is rotationally connected in the fixed frame (7), the threaded rod (8) is in threaded connection with an adjusting frame (9), the adjusting frame (9) is in limited sliding connection with the fixed frame (7), a laser lamp (10) is mounted on the adjusting frame (9), and scales (12) are arranged on the light transmitting plate (11); the clamping assembly (3) comprises a worm (301), the worm (301) is rotatably connected in the workbench (1), a worm wheel (302) is connected to the worm (301) in a meshed mode, the worm wheel (302) is rotatably connected to the fixed pipe (4), a guide groove (303) is formed in the worm wheel (302) in a penetrating mode, a guide rod (304) is connected to the inner portion of the worm wheel (302) in a limiting sliding mode, a limiting plate (305) is fixedly welded to the top end of the guide rod (304), the limiting plate (305) is connected to the workbench (1) in a limiting sliding mode, the limiting plate (305) is fixedly connected to the bottom end face of the fixed frame (7) and the bottom end face of the light-transmitting plate (11), a clamping plate (306) is fixedly welded to the top end face of the limiting plate (305), and a rubber plate (307) is connected to the clamping plate (306) through screws; the central axis of the worm wheel (302) and the central axis of the workbench (1) are located on the same vertical central line, the guide grooves (303) are distributed on the worm wheel (302) at equal angles, the guide grooves (303) are arc-shaped, the guide grooves (303) correspond to the limiting plates (305) one by one through guide rods (304), the fixing frame (7) and the light-transmitting plate (11) are symmetrically distributed on the limiting plates (305) on two adjacent sides, and the fixing frame (7) and the light-transmitting plate (11) are distributed in parallel; the anti-warping assembly (6) comprises a mounting plate (601), the mounting plate (601) is movably connected to the bottom of a connecting rod (5), the top of the connecting rod (5) is movably connected to the bottom end face of the limiting plate (305), a connecting push rod (602) is fixedly welded to the top end face of the mounting plate (601), a rubber piston (603) is fixedly welded to the top end of the connecting push rod (602), the rubber piston (603) is connected into the fixing pipe (4) in a limiting and sliding mode, and the top end of the fixing pipe (4) is connected with a rubber sucker (604) through a bolt; the connecting push rod (602) is fixed in the middle of the bottom of the rubber piston (603), the side end face of the rubber piston (603) is attached to the inner wall of the fixed pipe (4), the top end face of the rubber sucker (604) is flush with the top end face of the workbench (1), and the connecting rod (5) is hinged to the mounting plate (601) and the limiting plate (305); threaded rod (8) are connected in the middle part of fixed frame (7), the outer terminal surface of fixed frame (7) is laminated mutually with the inner terminal surface of adjusting frame (9), the width of adjusting frame (9) is less than the length of threaded rod (8), laser lamp (10) equidistance distributes on adjusting frame (9).
2. The semiconductor thickness detection and comparison device as claimed in claim 1, wherein: dust removal subassembly (15) include funnel (1501), funnel (1501) welded fastening is on fixed roof (14), the inside top welded fastening of funnel (1501) has filter plate (1502), welded fastening is had servo motor (1503) on the top face of filter plate (1502), the output of servo motor (1503) is connected with fixed axle (1504), the top welded fastening of fixed axle (1504) has the connection and scrapes pole (1506), the bottom welded fastening of fixed axle (1504) has exhaust fan (1505), bolted connection has conveyer pipe (1507) on the side end face of funnel (1501), the other end bolted connection of conveyer pipe (1507) has collecting box (1508), collecting box (1508) welded fastening is on the top face of fixed roof (14).
3. A semiconductor thickness detection and comparison apparatus as claimed in claim 2, wherein: the ventilating cylinder (1501) is fixed in the middle of a fixed top plate (14), the inner diameter of the ventilating cylinder (1501) is larger than the diameter of an exhaust fan (1505), the top end face of the ventilating cylinder (1501) is flush with the top end face of a filter screen plate (1502), the bottom end face of the filter screen plate (1502) is attached to the top end face of a connecting scraping rod (1506), the side end face of the connecting scraping rod (1506) is attached to the inner wall of the ventilating cylinder (1501), the connecting scraping rod (1506) is in an arc shape, and the connecting scraping rod (1506) is distributed on a fixed shaft (1504) at equal angles.
4. A semiconductor thickness detection and comparison apparatus as claimed in claim 2, wherein: the bottom end face of filter screen board (1502) is flush with the top end face of conveyer pipe (1507), conveyer pipe (1507) symmetric distribution is in the both sides of draft tube (1501), conveyer pipe (1507) and collecting box (1508) one-to-one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210512642.4A CN114613690B (en) | 2022-05-12 | 2022-05-12 | Semiconductor thickness detection and comparison device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210512642.4A CN114613690B (en) | 2022-05-12 | 2022-05-12 | Semiconductor thickness detection and comparison device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114613690A CN114613690A (en) | 2022-06-10 |
| CN114613690B true CN114613690B (en) | 2022-07-29 |
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Denomination of invention: A semiconductor thickness measurement and comparison device Effective date of registration: 20221124 Granted publication date: 20220729 Pledgee: Zhejiang Tailong Commercial Bank Co.,Ltd. Lishui Branch Pledgor: Zhejiang Jingrui Electronic Technology Co.,Ltd. Registration number: Y2022330003178 |
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