CN114836737A - Inductively coupled plasma coating device - Google Patents

Inductively coupled plasma coating device Download PDF

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Publication number
CN114836737A
CN114836737A CN202110139689.6A CN202110139689A CN114836737A CN 114836737 A CN114836737 A CN 114836737A CN 202110139689 A CN202110139689 A CN 202110139689A CN 114836737 A CN114836737 A CN 114836737A
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China
Prior art keywords
inductively coupled
coupled plasma
reaction chamber
coating apparatus
plasma coating
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CN202110139689.6A
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Chinese (zh)
Inventor
宗坚
李福星
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Jiangsu Favored Nanotechnology Co Ltd
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Jiangsu Favored Nanotechnology Co Ltd
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Priority to CN202110139689.6A priority Critical patent/CN114836737A/en
Publication of CN114836737A publication Critical patent/CN114836737A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/507—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using external electrodes, e.g. in tunnel type reactors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4587—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially vertically
    • C23C16/4588—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially vertically the substrate being rotated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

The invention mainly provides an inductively coupled plasma coating device which is used for coating at least one substrate to be coated, and the inductively coupled plasma coating device comprises at least one device main body, a plasma generating unit based on inductive coupling, a dielectric plate and a support, wherein the device main body is provided with a reaction chamber, the substrate to be coated can be arranged on the support, the support is arranged in the reaction chamber, the plasma generating unit is arranged on the outer side wall of the device main body to generate a plasma area in the reaction chamber, and the dielectric plate is fixedly arranged between the plasma generating unit and the reaction chamber to separate the plasma generating unit and the plasma area.

Description

Inductively coupled plasma coating device
Technical Field
The invention relates to an inductively coupled plasma coating device, in particular to an inductively coupled plasma coating device applied to a chemical vapor deposition system.
Background
In recent years, the rapid development of film coating technology, especially the vapor deposition technology, has become mature, so that the improvement of the performance of electronic products by using the surface film coating technology becomes a technological hotspot. The surface coating technology can endow electronic products with performances such as high falling-resistant times, excellent scratch-resistant and wear-resistant properties, good heat dissipation, water resistance, water-down conductivity, corrosion resistance and the like. The plasma chemical vapor deposition technology is a commonly used coating technology at present, generates plasma under the action of an electric field, and makes gaseous substances containing film component atoms generate chemical reaction by means of the plasma to deposit a protective film on the surface of a product.
With the generation and rapid development of the coating technology, the plasma reaction device becomes an important processing device, and is widely applied to processes such as thin film deposition, etching, surface treatment and the like. The plasma reaction device is divided into a capacitive coupling plasma device and an inductive coupling plasma device due to different inductive coupling elements. At present, a plate-type capacitive coupling element is adopted in a capacitive coupling plasma device, the driving frequency is 13.56MHz, and an excitation electric field is provided for a reaction chamber to enable reaction gas to generate ionization to form plasma. The plasma reactor has low density of plasma generated due to the limitation of the capacitive coupling element, and the density is about 10 9 /cm 3 And meanwhile, the surface of the substrate is easy to be bombarded by active ions due to the high potential (> 20V) of the capacitively coupled plasma, so that the quality of material processing and surface modification is difficult to ensure.
Inductively Coupled Plasma (ICP) is a low temperature, high density Plasma source that performs radio frequency discharges through an inductive coil. The coupling element of the inductively coupled plasma coating device adopts an inductively coupled coil, and an excitation magnetic field is provided for the reaction chamber under the drive of a radio frequency power supply so as to ionize reaction gas to form plasma. The plasma of ICP and inductance coil have electrostatic coupling effect, which easily causes the sputtering of high energy ion to coil and discharge device, destroys the uniformity and stability of ICP discharge, and reduces plasma density.
Disclosure of Invention
One advantage of the present invention is to provide an inductively coupled plasma coating apparatus, which is capable of generating a higher plasma density than a conventional inductively coupled plasma, thereby improving the coating effect of a product to be coated.
One advantage of the present invention is to provide an inductively coupled plasma coating apparatus, which generates plasma with better uniformity than inductively coupled plasma in the prior art, thereby improving the coating effect of the product to be coated.
One advantage of the present invention is to provide an inductively coupled plasma coating apparatus, in which the potential of the plasma generated by the inductively coupled plasma coating apparatus is low, so that the bombardment damage of the energy ions on the surface of the product to be coated is correspondingly reduced, thereby improving the surface protection of the product to be coated.
One advantage of the present invention is to provide an inductively coupled plasma coating apparatus, which has a fast deposition rate and a good thickness uniformity of a formed film, so that the work efficiency of the inductively coupled plasma coating apparatus can be improved, and the coating effect of the inductively coupled plasma coating apparatus on a product to be coated can be ensured.
One advantage of the present invention is to provide an inductively coupled plasma coating apparatus, which can fully modify the surface of a product to be coated and has a low energy consumption characteristic on the basis of high power coupling efficiency.
One advantage of the present invention is to provide an inductively coupled plasma coating apparatus, which can obtain a stable and uniform high-density plasma source by increasing the density and uniformity of discharged plasma, thereby improving the operating stability of the inductively coupled plasma coating apparatus.
One advantage of the present invention is to provide an inductively coupled plasma coating apparatus, in which a coil structure is simple in design and a generated inductance is small, thereby improving a discharge performance of the inductively coupled plasma coating apparatus while ensuring a small occupied discharge space.
One advantage of the present invention is to provide an inductively coupled plasma coating apparatus, which effectively inhibits positive ions from bombarding the surface material of a coil by reducing the electrostatic coupling effect between the coil and a plasma and separating the induction coil and the plasma by a dielectric plate, thereby prolonging the service life of the coil.
An advantage of the present invention is to provide an inductively coupled plasma coating apparatus, which not only can obtain a stable and uniform high-density plasma source, but also can promote wide application of the inductively coupled plasma technology in the field of thin film deposition.
An advantage of the present invention is to provide an inductively coupled plasma coating apparatus capable of preparing not only a super-hydrophobic film but also a transparent and wear-resistant film, which can endure long-lasting friction without scratches.
To achieve at least one of the above advantages, the present invention provides an inductively coupled plasma coating apparatus for coating at least one substrate to be coated, the inductively coupled plasma coating apparatus including at least an apparatus body, a plasma generating unit based on inductive coupling, a dielectric plate and a support, wherein the apparatus body has a reaction chamber, the substrate to be coated can be disposed on the support, the support is disposed in the reaction chamber, the plasma generating unit is disposed on an outer sidewall of the apparatus body to generate a plasma region in the reaction chamber, the dielectric plate is fixedly disposed between the plasma generating unit and the reaction chamber to separate the plasma generating unit and the plasma region, the support is electrically connected to a negative electrode of a bias power supply, the positive electrode of the bias power supply is electrically connected with the reaction chamber, so that bias is generated in the reaction chamber.
In some embodiments, the reaction chamber is electrically connected to the positive terminal of the bias power supply and the reaction chamber is grounded, the support being insulated from the reaction chamber.
In some embodiments, the mobile phone further comprises at least one motor, and the bracket is electrically connected to the motor, so that the bracket can move under the driving of the motor.
In some embodiments, the support is a polygonal cylindrical support, and the substrate to be coated is arranged on the surface of the support and can rotate along with the rotation of the support.
In some embodiments, the substrate to be coated is fixedly attached to the outer circumferential surface of the stent.
In some embodiments, the electrode holder further comprises at least one electrode connector and a mounting fixture, wherein the electrode connector is fixedly connected to the lower end of the support through the mounting fixture and can be kept in contact with the support all the time during the rotation of the support.
In some embodiments, the electrode connecting device further comprises at least one elastic element, the elastic element is fixedly connected to the mounting fixing seat, and the electrode connecting piece is abutted to the lower end of the bracket through the elastic element so as to keep the electrode connecting piece in continuous contact with the bracket during the rotation of the bracket.
In some embodiments, the apparatus further comprises at least one gas inlet system disposed in the apparatus body and communicating with the reaction chamber to deliver the coating monomer raw material to the reaction chamber.
In some embodiments, the gas inlet system further comprises at least one evaporator capable of evaporating the coating monomer raw material into a gas state by heating.
In some embodiments, the gas inlet system further comprises a feed inlet disposed on an outer sidewall of the apparatus body and communicating with the reaction chamber, so as to deliver the coating monomer raw material to the reaction chamber.
In some embodiments, the apparatus further comprises at least one pumping system having a pumping port, the pumping port being connected to the reaction chamber to pump the gas from the reaction chamber.
In some embodiments, the pumping system further comprises at least one vacuum pump connected to the pumping port, so as to pump the gas in the reaction chamber to a predetermined vacuum degree through the vacuum pump.
In some embodiments, the plasma generating unit includes at least one inductive coupling coil, a radio frequency matcher and a radio frequency power supply, one end of the inductive coupling coil is electrically connected to an output end of the radio frequency matcher, and the other end of the inductive coupling coil is electrically connected to a ground end of the radio frequency matcher, and the radio frequency matcher is electrically connected to the radio frequency power supply, so that the inductive coupling coil, the radio frequency power supply and the radio frequency matcher can generate an electromagnetic field for providing an electromagnetic field for exciting a plasma to the reaction chamber.
In some embodiments, the inductive coupling coil includes two induction coils, the two induction coils are electrically connected at a middle section of each other to form an induction coil set, one end of the induction coil set is electrically connected to the output end of the radio frequency matcher, and the other end of the induction coil set is electrically connected to the ground end of the radio frequency matcher.
In some embodiments, the two induction coils are electrically connected in series and fixed on the outer side wall of the device body, and two ends of the induction coil set are electrically connected to the radio frequency matcher.
In some embodiments, the feed port is disposed on the same side as the plasma generation unit.
In some of these embodiments, the dielectric plate is provided as an insulating material.
In some of these embodiments, the dielectric plate is made of quartz material.
In some embodiments, the inductively coupled plasma coating apparatus is capable of producing at least one superhydrophobic film layer.
In some of these embodiments, the superhydrophobic film layer has a hydrophobic angle greater than 170 °.
In some embodiments, the inductively coupled plasma coating apparatus is capable of producing at least one transparent wear-resistant coating.
In some of these embodiments, the transparent abrasion resistant coating can withstand 500g of dust-free cloth rubbing more than 10000 times without scratching.
Drawings
Fig. 1 is a schematic perspective view of an inductively coupled plasma coating apparatus according to a preferred embodiment of the present invention.
Fig. 2 is another schematic perspective view of an inductively coupled plasma coating apparatus according to a preferred embodiment of the present invention.
Fig. 3 is a schematic perspective view of the connection between the bracket and the motor in the preferred embodiment of the inductively coupled plasma coating apparatus of the present invention.
Fig. 4a is a schematic view of a connection structure of the motor and the electrode connecting member in a preferred embodiment of the inductively coupled plasma coating apparatus of the present invention.
Fig. 4b is a partial enlarged structural diagram at a in fig. 4a, showing the connection relationship between the electrode connecting member and the mounting holder.
Fig. 5a is a schematic view of a connection structure of the motor and the electrode connecting member in a preferred embodiment of the inductively coupled plasma coating apparatus of the present invention.
Fig. 5B is a partial enlarged structural view at B in fig. 5a, showing the connection relationship of the spring and the electrode connecting member.
Fig. 6 is a schematic view of a connection structure of the bracket and the motor in the preferred embodiment of the inductively coupled plasma coating apparatus of the present invention.
Fig. 7 is a schematic perspective view of another preferred embodiment of the inductively coupled plasma coating apparatus according to the present invention.
Fig. 8 is a schematic structural diagram of the plasma generating unit in the preferred embodiment of the inductively coupled plasma coating apparatus of the present invention.
Fig. 9 is a modified embodiment of the above preferred embodiment of the inductively coupled plasma coating apparatus of the present invention, showing the modified position of the feed opening.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships that are based on those shown in the drawings, which are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus the terms should not be construed as limiting the present invention.
It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
As shown in fig. 1 to 9, the present invention mainly provides an inductively coupled plasma coating apparatus 10, where the inductively coupled plasma coating apparatus 10 includes an apparatus body 11, an inductively coupled plasma generating unit 12, a dielectric plate 13 and a support 15, the apparatus body 11 has a reaction chamber 110, the plasma generating unit 12 is disposed on an outer wall surface of the apparatus body 11 to generate a plasma region 100 in the reaction chamber 110, the dielectric plate 13 is fixedly disposed between the plasma generating unit 12 and the reaction chamber 110 to separate the plasma generating unit 12 from the plasma region 100, and the support 15 is disposed in the reaction chamber 110 to place at least one substrate 20 to be coated.
In this preferred embodiment, the inductive coupling-based plasma generating unit 12 includes at least one inductive coupling coil 121 and a radio frequency matcher 122, the inductive coupling coil 121 includes two induction coils 1211, the two induction coils 1211 form a group, the two induction coil groups 1210 are electrically connected to each other at a middle section to form an induction coil group 1210 and are fixed on an outer sidewall of the device body 11, two ends of the induction coil group 1210 are electrically connected to the rf matcher 122, wherein, one end of the induction coil assembly 1210 is electrically connected to the output end of the rf matcher 122, the other end of the induction coil assembly 1210 is electrically connected to the ground terminal of the radio frequency matcher 122, the radio frequency matcher 122 is electrically connected to a radio frequency power supply, so that the induction coil 1211, the rf power source and the rf matcher 122 can generate an electromagnetic field for providing plasma excitation to the reaction chamber 110.
Further, in a preferred embodiment of the present invention, the plasma generating unit 12 further comprises at least one mounting fixing plate 123, and the mounting fixing plate 123 is fixedly connected to the outer sides of the plurality of induction coils 1211 to fix the inductive coupling coil 121.
As a variation of the preferred embodiment of the present invention, a person skilled in the art may also change the type of the induction coil 1211 according to practical situations, such as using a honeycomb coil, etc., all of which fall within the protection scope of the present invention, and the specific embodiment of the present invention is not limited thereto.
The dielectric plate 13 is fixedly disposed on an outer side wall of the device body 11 and located between the induction coil 1211 and the plasma region 100, wherein the dielectric plate 13 is made of an insulating material, so as to electrically isolate the induction coil 1211 from the plasma region 100, and in addition, the dielectric plate 13 can also play a certain role in sealing.
In a preferred embodiment of the present invention, the induction coil 1211 is fixedly mounted on the dielectric plate 13, and the dielectric plate 13 is made of quartz material. Besides, the dielectric plate 13 may be made of other materials, including but not limited to ceramics, mica, marble, or the like.
In the preferred embodiment of the inductively coupled plasma coating apparatus 10 of the present invention, a negative electrode of a bias power supply a is electrically connected to the support 15, a positive electrode of the bias power supply a is electrically connected to the reaction chamber 110, and the reaction chamber 110 is grounded, so that a bias pulse discharge is generated in the reaction chamber 110 to cooperate with the inductively coupled plasma generating unit 12 to generate a plasma in the reaction chamber 110, so as to coat the substrate 20 to be coated, which is placed on the support 15.
As shown in fig. 6, the support 15 is disposed in the reaction chamber 110, and the substrate 20 to be coated is fixed or placed on the support 15. In a preferred embodiment of the present invention, the inductively coupled plasma coating apparatus 10 further includes a motor 16, the motor 16 includes a motor transmission shaft 161, and the lower end of the support 15 is connected to the motor transmission shaft 161 of the motor 16, so that the support 15 can be driven by the motor 16 to rotate, and further the substrate 20 to be coated on the support 15 can be driven to rotate, thereby further improving the coating uniformity of the substrate 20 to be coated in the reaction chamber 110.
As a variation of the preferred embodiment of the present invention, the support 15 may also be configured to be driven by the motor 16 to perform other movements, such as a back-and-forth movement, so as to drive the substrate 20 to be coated on the support 15 to perform corresponding movements, thereby improving the coating uniformity of the substrate 20 to be coated. Therefore, the relative position relationship between the support 15 and the reaction chamber 110 in the inductively coupled plasma coating apparatus 10 of the present invention is not limited to the above-described embodiments.
As shown in fig. 1 and 4b, in a preferred embodiment of the present invention, the bracket 15 is implemented as an octahedral cylindrical support frame, the inductively coupled plasma coating apparatus 10 further comprises at least one electrode connecting member 17 and a mounting fixture 18, the bracket 15 comprises a bottom plate 151, and the electrode connecting member 17 is fixedly connected to the lower end of the bottom plate 151 of the bracket 15 by the mounting fixture 18, so that the electrode connecting member 17 is always kept in contact with the bracket 15 during the rotation of the bracket 15.
As shown in fig. 3, in the preferred embodiment of the inductively coupled plasma coating apparatus 10 of the present invention, the substrate 20 to be coated is fixedly disposed on the surface of the support 15, and since the support 15 is configured as an octahedral cylindrical support, fixing the substrate 20 to be coated on the surface of the support 15 not only enables the substrate 20 to be coated to rotate along with the rotation of the support 15 during the coating process, thereby improving the coating uniformity of the substrate 20 to be coated, but also improves the number of the substrates 20 to be coated and enables the substrates 20 to be coated to tightly adhere to the surface of the support 15, thereby improving the coating efficiency and the coating quality of the substrate 20 to be coated.
Preferably, a plurality of substrates 20 to be coated may be placed on a double-sided tape 30 at the same time, and then the double-sided tape 30 is adhered around the periphery of the support 15, so that one circle of the substrates 20 to be coated can be fixed on the outer surface of the support 15 by adhering once, and then the outer surface of the support 15 is adhered to the substrates 20 to be coated by the same method in turn in a circle unit along the axial direction of the support 15, which only needs to be repeated several times.
Compared with the method that the base material 20 to be coated is attached to the surface of the bracket 15 or a circle of the base material 20 to be coated is fixed on the surface of the bracket 15 after surrounding the surface of the bracket 15, the method not only can greatly improve the working efficiency in the operation process, but also is convenient to operate, and reduces the operation steps and the operation time, thereby being beneficial to the fixing process of the base material 20 to be coated.
Further, as a modified implementation manner of the preferred embodiment of the present invention, the substrate 20 to be coated is attached to the surface of the support 15 by an adhesive tape, so as to increase the bonding firmness between the substrate 20 to be coated and the support 15, thereby improving the stability of the substrate 20 to be coated during the coating process.
Besides, a person skilled in the art may select or change the type of the support 15 and/or the fixing manner between the substrate 20 to be coated and the support 15 according to actual situations, such as a hexahedron or other shapes of columns, etc., as long as on the basis of the above disclosure of the present invention, the same or similar technical solutions as the present invention are adopted, the same or similar technical problems as the present invention are solved, and the same or similar technical effects as the present invention are achieved, which all fall within the protection scope of the present invention, and the specific embodiment of the present invention is not limited thereto.
Further, as shown in fig. 5a and 5b, an elastic element 181, such as a spring, is disposed on the mounting fixing seat 18, and the electrode connector 17 abuts against the lower end of the bottom plate 151 of the bracket 15 through the elastic element 181 on the mounting fixing seat 18, so as to maintain the electrode connector 17 in continuous contact with the bracket 15 during the rotation of the bracket 15, and further, the negative electrode of the bias power supply a is electrically connected to the bracket 15 through the electrode connector 17.
As a variation of the preferred embodiment of the present invention, a person skilled in the art may also change the connection manner of the bias power supply a according to practical situations, for example, connecting the negative electrode of the bias power supply a to the reaction chamber 110, and connecting the positive electrode of the bias power supply a to the bracket, all of which fall within the protection scope of the present invention.
Further, the inductively coupled plasma coating apparatus 10 of the present invention further includes at least one gas inlet system 14, wherein the gas inlet system 14 is disposed in the apparatus main body 11 and is communicated with the reaction chamber 110 for gasifying a coating monomer raw material and then feeding the gasified coating monomer raw material into the reaction chamber 110, so as to complete a coating process for the substrate 20 to be coated.
Correspondingly, the gas inlet system 14 includes at least one evaporator 142, the evaporator 142 can evaporate the coating monomer raw material into a gas state by heating, the apparatus main body 11 has at least one feed inlet 141, the feed inlet 141 is communicated with the reaction chamber 110, wherein the feed inlet 141 is connected with the evaporator 142, so as to feed the coating monomer raw material heated and gasified by the evaporator 142 into the reaction chamber 110, thereby providing the coating monomer raw material for the substrate 20 to be coated.
The inductively coupled plasma coating apparatus 10 further includes at least one pumping system 19, wherein the pumping system 19 has a pumping port 191, and the pumping port 191 is disposed to communicate with the reaction chamber 110, so as to pump the gas in the reaction chamber 110.
Accordingly, the pumping system 19 includes at least one vacuum pump, and the pumping port 191 is connected to the vacuum pump, so as to pump the gas in the reaction chamber 110 to a predetermined vacuum degree through the vacuum pump, so as to provide a coating environment for the substrate 20 to be coated.
In a preferred embodiment of the invention, the vacuum pump in the gas evacuation system 19 is implemented as a mechanical vacuum pump. However, the specific embodiment of the present invention is not limited thereto, and those skilled in the art can select and adapt the type of the vacuum pump according to actual needs, for example, a molecular vacuum pump is used. In other words, as long as the same or similar technical solution as the present invention is adopted on the basis of the above disclosure, the same or similar technical problem as the present invention is solved, and the same or similar technical effect as the present invention is achieved, all of which belong to the protection scope of the present invention, and the specific implementation manner of the present invention is not limited thereto.
A person skilled in the art can set the position and size of the feeding hole 141 according to actual situations, and as long as the technical solution identical to or similar to the present invention is adopted based on the above disclosure of the present invention, the technical problem identical to or similar to the present invention is solved, and the technical effect identical to or similar to the present invention is achieved, all of which belong to the protection scope of the present invention, and the specific embodiment of the present invention is not limited thereto.
Preferably, in a preferred embodiment of the present invention, the feeding hole 141 is disposed on a side wall of the apparatus main body 11 and located on the same side as the plasma generating unit 12, so that the coating monomer raw material entering the reaction chamber 110 through the feeding hole 141 can be plasmatized by the plasma generating unit 12 for the first time, thereby improving the plasmatization efficiency of the coating monomer raw material and the coating effect of the substrate 20 to be coated.
Fig. 9 shows a modified embodiment of the above preferred embodiment of the inductively coupled plasma coating apparatus according to the present invention. In this modified embodiment, the feed port 141 'is disposed at the back of the apparatus body 11' and near the plasma generation unit 12 ', so that the coating monomer raw material can be plasmatized by the plasma generation unit 12' even after entering the reaction chamber 110 'through the feed port 141'.
Besides, the skilled person can change or adjust the specific position of the feeding hole 141 according to the actual situation, for example, the feeding hole 141 is disposed at the top of the device body 11, so long as the feeding hole 11 and the plasma generating unit 12 are kept at a certain preset distance. In other words, as long as the same or similar technical solution as the present invention is adopted on the basis of the above disclosure, the same or similar technical problem as the present invention is solved, and the same or similar technical effect as the present invention is achieved, all of which belong to the protection scope of the present invention, and the specific implementation manner of the present invention is not limited thereto.
In operation, the gas in the reaction chamber 110 is first pumped to a predetermined degree of vacuum through the pumping port 101 of the pumping system 19 in the inductively coupled plasma coating apparatus 10. The support 15 in the reaction chamber 110 is driven by the motor 16 to drive the substrate 20 to be coated, which is disposed on the support 15, to rotate in the reaction chamber 110.
The coating monomer raw material enters the reaction chamber 110 through the feed inlet 141 in the air inlet system 14. The support 15 keeps the electrode connecting piece 17 in continuous contact with the support 15 in the process of rotating the support 15 through the elastic abutment of the elastic element 181 in the rotating process, so that the negative electrode of the bias power supply a is stably and electrically connected with the support 15 through the electrode connecting piece 17. The positive electrode of the bias power supply a is electrically connected to the reaction chamber 110, so as to provide a bias discharge in the reaction chamber 110.
Meanwhile, the rf power supply and the induction coil assembly 1210 form a closed loop through the rf matcher 122, and the output power of the rf power supply can be transmitted to the two ends of the induction coil assembly 1210 to the maximum extent through the adjustment of the rf matcher 122. Since there is a certain amount of rf current in the induction coil 1211, a certain magnitude of voltage is generated across the induction coil assembly 1210.
The rf current circulating in the induction coil 1211 excites a rf magnetic field in the space where the induction coil 1211 is located, and the rf magnetic field passes through the dielectric plate 13, thereby generating a rf magnetic flux in the reaction chamber. According to faraday's law of electromagnetic induction, the rf magnetic flux induces an rf electric field that accelerates the movement of electrons in the plasma region 100, causing them to collide with neutral gas molecules and ionize, thereby coupling the rf energy in the set of induction coils 1210 into the ionized gas in the plasma region 100 and maintaining the plasma discharge state.
Meanwhile, the support 15 is driven by the motor 16 to rotate in the plasma region 100, so that the substrate 20 to be coated, which is disposed on the support 15, can uniformly receive the fully ionized raw material of the coating monomer in the plasma region 100, thereby improving the coating uniformity of the substrate 20 to be coated.
Therefore, in the inductively coupled plasma coating apparatus 10 of the present invention, the rf power source is applied to the power end of the induction coil assembly 1210, and the bias power source a is applied to the support 15, so that the rf power coupling efficiency of the inductively coupled plasma coating apparatus of the present invention is much higher than that of a single-frequency capacitively coupled plasma generator (CCP), and thus a higher plasma density can be obtained, and the plasma density is 10 10 -10 12 /cm 3 In order of magnitude higher than the density of conventional inductively coupled plasmas in the prior art.
In a preferred embodiment of the inductively coupled plasma coating apparatus 10 of the present invention, the inductively coupled plasma coating apparatus 10 can be used to prepare a variety of functional coatings, including preparing a superhydrophobic film layer, wherein the hydrophobic angle of the superhydrophobic film layer can be up to 170 °.
The inductively coupled plasma coating device 10 can also be used for preparing a transparent wear-resistant coating, and the prepared transparent wear-resistant coating can not be scratched even if the coating is rubbed by 500g of dustless cloth for 10000 times.
In addition, the inductively coupled plasma coating device 10 of the present invention can improve the uniformity of the generated plasma, and can ensure that the potential of the generated plasma is small, so that the bombardment damage of the energy ions to the surface of the substrate 20 to be coated is small. Therefore, the film prepared by the inductively coupled plasma coating device 10 of the present invention has the advantages of high deposition rate, good thickness uniformity of the film, sufficient surface modification, high power coupling efficiency and low energy consumption.
In summary, the coil structure of the inductively coupled plasma coating apparatus 10 of the present invention is simple in design, the generated inductance is small, the occupied discharge space is small, and the discharge performance of the inductively coupled plasma coating apparatus 10 can be improved.
In addition, the inductively coupled plasma coating apparatus 10 of the present invention reduces the electrostatic coupling effect between the induction coil assembly 1210 and the plasma region 100, and adopts a dielectric plate to separate the induction coil from the plasma region, so as to effectively inhibit the bombardment of positive ions on the surface material of the induction coil assembly 1210, and obtain a stable and uniform high-density plasma source.
Therefore, the inductively coupled plasma coating device 10 of the present invention is used to coat the film on the substrate 20 to be coated, which can improve the density and uniformity of the discharged plasma, so as to obtain a high density plasma source with uniform stability, improve the working stability of the plasma, and further improve the wide application of the plasma technology in the field of film deposition.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims (21)

1. The inductively coupled plasma coating device is used for coating at least one substrate to be coated and is characterized by comprising at least one device main body, a plasma generating unit based on inductive coupling, a dielectric plate and a support, wherein the device main body is provided with a reaction chamber, the substrate to be coated can be arranged on the support, the support is arranged in the reaction chamber, the plasma generating unit is arranged on the outer side wall of the device main body to generate a plasma area in the reaction chamber, and the dielectric plate is fixedly arranged between the plasma generating unit and the reaction chamber to separate the plasma generating unit from the plasma area.
2. The inductively coupled plasma coating apparatus of claim 1, further comprising at least one bias power source, wherein the support is electrically connected to a negative terminal of the bias power source, and wherein a positive terminal of the bias power source is electrically connected to the reaction chamber, thereby generating a bias voltage in the reaction chamber.
3. The inductively coupled plasma coating apparatus of claim 2, wherein the reaction chamber is electrically connected to the positive terminal of the bias power supply and the reaction chamber is grounded, wherein the holder is insulated from the reaction chamber.
4. The inductively coupled plasma coating apparatus of claim 1, further comprising at least one motor, wherein the bracket is electrically connected to the motor, such that the bracket can move under the driving of the motor.
5. The inductively coupled plasma coating apparatus of claim 4, wherein the support is a polygonal cylindrical support, and the substrate to be coated is disposed on a surface of the support and can rotate along with the rotation of the support.
6. The inductively coupled plasma coating apparatus of claim 5, wherein the substrate to be coated is fixedly attached to the outer peripheral surface of the holder.
7. The inductively coupled plasma coating apparatus of claim 6, further comprising at least one electrode connecting member and a mounting fixture, wherein the electrode connecting member is fixedly connected to the lower end of the support through the mounting fixture, and is capable of maintaining the electrode connecting member in contact with the support at all times during rotation of the support.
8. The inductively coupled plasma coating apparatus of claim 7, further comprising at least one elastic element, wherein the elastic element is fixedly connected to the mounting fixture, and the electrode connecting member is abutted against the lower end of the bracket through the elastic element, so as to maintain the electrode connecting member in continuous contact with the bracket during the rotation of the bracket.
9. The inductively coupled plasma coating apparatus of claim 8, further comprising at least one gas inlet system disposed in the apparatus body and communicating with the reaction chamber to deliver the coating monomer raw material to the reaction chamber.
10. The inductively coupled plasma coating apparatus of claim 9, wherein the gas inlet system further comprises at least one evaporator, and the evaporator is capable of evaporating the coating monomer raw material into a gaseous state by heating.
11. The inductively coupled plasma coating apparatus as claimed in claim 10, wherein the gas inlet system further comprises a feed inlet, which is disposed on an outer sidewall of the apparatus body and communicates with the reaction chamber, so as to feed a coating monomer raw material to the reaction chamber.
12. The inductively coupled plasma coating apparatus of any one of claims 1-11, further comprising at least one pumping system, wherein the pumping system has a pumping port, and the pumping port is connected to the reaction chamber to pump the gas from the reaction chamber.
13. The inductively coupled plasma coating apparatus as claimed in claim 12, wherein the pumping system further comprises at least one vacuum pump, and the vacuum pump is connected to the pumping port, so that the gas in the reaction chamber is pumped to a predetermined degree of vacuum by the vacuum pump.
14. The inductively coupled plasma coating apparatus as claimed in any one of claims 1 to 11, wherein the plasma generating unit comprises at least one inductively coupled coil, a radio frequency adapter and a radio frequency power source, wherein one end of the inductively coupled coil is electrically connected to an output terminal of the radio frequency adapter, the other end of the inductively coupled coil is electrically connected to a ground terminal of the radio frequency adapter, and the radio frequency adapter is electrically connected to the radio frequency power source, so that the inductively coupled coil, the radio frequency power source and the radio frequency adapter can generate an electromagnetic field for exciting the plasma to the reaction chamber.
15. The inductively coupled plasma coating apparatus of claim 14, wherein the inductive coupling coil comprises two inductive coils, the two inductive coils are electrically connected at a middle portion of each other to form an inductive coil assembly, one end of the inductive coil assembly is electrically connected to the output end of the rf matcher, and the other end of the inductive coil assembly is electrically connected to the ground end of the rf matcher.
16. The inductively coupled plasma coating apparatus as claimed in claim 15, wherein the two induction coils are electrically connected in series and fixed on the outer sidewall of the apparatus body, and two ends of the induction coil assembly are electrically connected to the rf matching unit.
17. The inductively coupled plasma coating apparatus of claim 16, wherein the feed inlet is disposed on the same side as the plasma generating unit.
18. The inductively coupled plasma coating apparatus of claim 17, wherein the dielectric plate is made of an insulating material.
19. The inductively coupled plasma coating apparatus of claim 18, wherein the dielectric plate is made of quartz material.
20. The inductively coupled plasma coating apparatus of any one of claims 1-11, wherein the inductively coupled plasma coating apparatus is capable of producing at least one superhydrophobic film layer.
21. The inductively coupled plasma coating apparatus of any of claims 1-11, wherein the inductively coupled plasma coating apparatus is capable of producing at least one transparent wear resistant coating.
CN202110139689.6A 2021-02-01 2021-02-01 Inductively coupled plasma coating device Pending CN114836737A (en)

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