CN114830358A - 发光器件、发光基板及其制备方法和发光装置 - Google Patents

发光器件、发光基板及其制备方法和发光装置 Download PDF

Info

Publication number
CN114830358A
CN114830358A CN202080002883.3A CN202080002883A CN114830358A CN 114830358 A CN114830358 A CN 114830358A CN 202080002883 A CN202080002883 A CN 202080002883A CN 114830358 A CN114830358 A CN 114830358A
Authority
CN
China
Prior art keywords
light
material layer
light emitting
layer
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080002883.3A
Other languages
English (en)
Inventor
卢天豪
黄维
赵德江
田禹
刘晓云
孙倩
靳倩
李杨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of CN114830358A publication Critical patent/CN114830358A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0025—Processes relating to coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes

Abstract

一种发光器件，包括：发光元件、光转换层、第一材料层、第二材料层、第三材料层和第四材料层，发光元件包括出光面；光转换层设置于出光面一侧，光转换层包括位于出光面所在区域的部分和位于出光面所在区域沿一侧的部分；第一材料层和第二材料层设置于发光元件和光转换层之间，第三材料层和第四材料层设置于光转换层远离发光元件的一侧，第一材料层和第三材料层位于出光面所在区域，第二材料层和第四材料层位于出光面所在区域一侧；第一材料层被配置为使发光元件发出的光照射到光转换层中；第二材料层、第三材料层和第四材料层被配置为使未经光转换层转换的光在第二材料层、第三材料层和第四材料层围合的表面之间发生反射。

Description

PCT国内申请，说明书已公开。

Claims (19)

  1. PCT国内申请，权利要求书已公开。
CN202080002883.3A 2020-11-19 2020-11-19 发光器件、发光基板及其制备方法和发光装置 Pending CN114830358A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/130099 WO2022104646A1 (zh) 2020-11-19 2020-11-19 发光器件、发光基板及其制备方法和发光装置

Publications (1)

Publication Number Publication Date
CN114830358A true CN114830358A (zh) 2022-07-29

Family

ID=81708097

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080002883.3A Pending CN114830358A (zh) 2020-11-19 2020-11-19 发光器件、发光基板及其制备方法和发光装置

Country Status (3)

Country Link
US (1) US20220352434A1 (zh)
CN (1) CN114830358A (zh)
WO (1) WO2022104646A1 (zh)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI478370B (zh) * 2008-08-29 2015-03-21 Epistar Corp 一具有波長轉換結構之半導體發光裝置及其封裝結構
CN102347432B (zh) * 2010-07-30 2014-05-28 海洋王照明科技股份有限公司 发光装置
CN102227012A (zh) * 2011-06-28 2011-10-26 复旦大学 一种色温均匀的高显色性能白光led
CN104505451A (zh) * 2015-01-15 2015-04-08 佛山市香港科技大学Led-Fpd工程技术研究开发中心 多层远距式涂布荧光粉的led封装单元、模具及制备方法
US10825970B2 (en) * 2016-02-26 2020-11-03 Epistar Corporation Light-emitting device with wavelength conversion structure

Also Published As

Publication number Publication date
US20220352434A1 (en) 2022-11-03
WO2022104646A1 (zh) 2022-05-27

Similar Documents

Publication Publication Date Title
RU2477546C2 (ru) Светоизлучающий диод бокового излучения с силиконовой линзой, поддерживаемой криволинейным силиконовым участком
CN109585487B (zh) 显示面板及其像素结构
CN105929590B (zh) 显示基板、显示装置
TWI591405B (zh) 光致發光顯示裝置及其製造方法
CN110320703B (zh) 一种双面显示装置
CN107450218B (zh) 光致发光显示装置及其制造方法
WO2018051855A1 (ja) 光学部材、照明装置及び表示装置
TWI765491B (zh) 顯示基板及其製備方法、顯示裝置
WO2014166211A1 (zh) 导光板及其制作方法和包括其的显示装置
JP2003195058A (ja) 導光板、その製造方法、照明装置、及び液晶表示装置
TW200407628A (en) Liquid-crystal display device and method of fabricating same
JP2011076774A (ja) 発光装置および表示装置
JP2005011599A (ja) 面光源装置及び当該面光源装置を用いた機器
US9823410B2 (en) Light guiding plate and method for manufacturing the same and backlight source and display device comprising the same
CN114355658A (zh) 混接显示装置及拼接显示装置
JP5339773B2 (ja) 液晶表示装置
JP2014092601A (ja) マイクロレンズアレイ基板の製造方法、マイクロレンズアレイ基板、電気光学装置、および電子機器
JP4155274B2 (ja) 電気光学装置、電子機器及び照明装置
CN114830358A (zh) 发光器件、发光基板及其制备方法和发光装置
CN115663008A (zh) 发光芯片、发光结构及显示装置
CN114355657A (zh) 拼接显示面板及拼接显示装置
TWI437327B (zh) 背光模組
CN109445174B (zh) 一种显示面板及其制备方法、显示装置
WO2023025240A1 (zh) 发光模组和显示装置
WO2023201699A1 (zh) 显示基板及显示装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination