WO2023025240A1 - 发光模组和显示装置 - Google Patents

发光模组和显示装置 Download PDF

Info

Publication number
WO2023025240A1
WO2023025240A1 PCT/CN2022/114760 CN2022114760W WO2023025240A1 WO 2023025240 A1 WO2023025240 A1 WO 2023025240A1 CN 2022114760 W CN2022114760 W CN 2022114760W WO 2023025240 A1 WO2023025240 A1 WO 2023025240A1
Authority
WO
WIPO (PCT)
Prior art keywords
groove
substrate
signal line
light
slot
Prior art date
Application number
PCT/CN2022/114760
Other languages
English (en)
French (fr)
Inventor
张晟
刘理想
张世诚
黄毅
汪秀俊
Original Assignee
昇印光电（昆山）股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昇印光电（昆山）股份有限公司 filed Critical 昇印光电（昆山）股份有限公司
Publication of WO2023025240A1 publication Critical patent/WO2023025240A1/zh
Priority to US18/526,974 priority Critical patent/US20240113135A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present disclosure relates to the field of backlight display, in particular to a light emitting module and a display device.
  • Mini LED (submillimeter light-emitting diode) backlight display technology is a new display technology that is different from traditional liquid crystal display (Liquid Crystal Display, referred to as LCD) and organic light-emitting diode (Organic Light-Emitting Diode, referred to as OLED) display.
  • LCD Liquid Crystal Display
  • OLED Organic Light-Emitting Diode
  • Mini LED backlight panels have higher color contrast, brightness, color gamut, longer lifespan and thinner thickness. It is a key area for the development of the panel industry in recent years and has broad prospects.
  • the current Mini LED backlight panel is limited to its own structural design.
  • the lines used to drive the Mini LED will protrude from the substrate. During the production and application process, the lines may be damaged by friction, collision, etc., resulting in breakage of the lines. Make the Mini LED backlight panel malfunction.
  • the present disclosure provides a light-emitting module and a display device.
  • Grooves are provided in the substrate of the light-emitting module to accommodate the signal lines in the driving circuit layer, so that the signal lines will not be exposed outside the substrate.
  • damage such as wear and tear will occur, and the arrangement of the signal line will not increase the design thickness of the light-emitting module, which is conducive to the light and thin design of the light-emitting module.
  • the first aspect of the present disclosure provides a light emitting module, which includes a substrate, a first driving circuit layer and at least one first light emitting unit group. At least one first groove is arranged on the surface of the substrate.
  • the first driving circuit layer is located on the substrate and includes at least one first signal line located in the first groove.
  • the first light emitting unit group is located on the side of the substrate where the first driving circuit layer is provided, and includes at least one first lamp bead, and the first lamp bead is connected in series with the first signal line.
  • the first signal line is embedded in the first groove of the substrate, so that the first signal line will not be damaged due to exposure to the substrate, such as abrasion, and the arrangement of the first signal line will not increase.
  • the design thickness of the light-emitting module is conducive to the light and thin design of the light-emitting module.
  • the substrate further includes a substrate and a first structural layer substrate.
  • the first structural layer is located on one side of the substrate, and the first groove is formed in the first structural layer and located on the side of the first structural layer away from the substrate.
  • the first structural layer includes a plurality of first sub-structural layers stacked, and each first sub-structural layer is provided with a first sub-groove.
  • the first signal line includes a plurality of first sub-signal lines respectively located in the first sub-groove, a first through hole is arranged in the first sub-structure layer, so that the plurality of first sub-signal lines are connected through the first through hole, For example in series or in parallel.
  • the first signal line is configured to be composed of first sub-signal lines connected to each other and located in different layers, thereby further increasing the arrangement space of the first signal line, and The area occupied by the first signal line in the lateral direction of the substrate is reduced, thereby further reducing the resistance of the first signal line and reducing the voltage drop generated on the first signal line when driving the first lamp bead to emit light.
  • the first groove includes a plurality of first groove segments arranged at intervals
  • the light emitting module further includes a plurality of first connecting parts.
  • the first connection part is located on the first structural layer and between adjacent first slot segments, and each first connection part includes a first part and a first part respectively connected to the first signal line in the adjacent first slot segment. two parts. The first part and the second part are spaced apart from each other, and the first lamp bead is connected between the first part and the second part.
  • the first slot segment is divided into a first type slot segment and a second type slot segment, the length of the first type slot segment is shorter than the second type slot segment, and a plurality of first type slot segments
  • the slot segments are arranged in an array so that the first type slot segments in each row form a first slot group, a second type slot segment is arranged between adjacent first slot groups, and the two ends of the second type slot segments pass through
  • the first connecting parts are respectively connected to the ends of the adjacent first slot groups.
  • the first slot segments are arranged in an array such that each row of the first slot segments forms a first slot group, and the two ends of the first slot group are connected by a first The parts are respectively connected with the ends of the adjacent first groove groups.
  • the light emitting module further includes a second driving circuit layer, the second driving circuit layer is located on the side of the substrate away from the first driving circuit layer, and includes at least one second signal Wire.
  • the substrate is provided with at least one second through hole, and the first signal line and the second signal line are connected through the second through hole, for example, connected in series or in parallel.
  • the second signal line connected to the first signal line is provided on the side of the substrate away from the first lamp bead, and there is no need to arrange the circuit for driving the first lamp bead on the side of the substrate, thereby reducing the The area occupied by the line on the side of the substrate where the lamp bead is installed; in addition, if the connection is in parallel, then the first signal line and the second signal line are connected in parallel.
  • the overall resistance value When the first driving circuit layer and the second driving circuit layer are driven to make the first lamp beads emit light, the pressure loss is reduced, thereby reducing the brightness difference between the first lamp beads connected in series to improve the overall light emission The uniformity of the light emitted by the film group.
  • the substrate further includes a second structural layer.
  • the second structure layer is located on the side of the substrate away from the first structure layer, at least one second groove is provided on the surface of the second structure away from the substrate, and the second signal line is located in the second groove.
  • the second signal line is embedded in the second groove of the substrate, so that the second signal line will not be damaged due to being exposed to the outside of the substrate, such as abrasion, and the arrangement of the second signal line will not increase
  • the design thickness of the light-emitting module is conducive to the light and thin design of the light-emitting module.
  • the second structural layer includes a plurality of second sub-structural layers stacked, and each second sub-structural layer is provided with a second sub-groove.
  • the second signal line includes a plurality of second sub-signal lines respectively located in the second sub-groove, and a third through hole is arranged in the second sub-structure layer, so that the plurality of second sub-signal lines are connected through the third through hole, For example in series or in parallel.
  • the second signal line is configured to be composed of second sub-signal lines connected to each other and located in different layers, thereby further increasing the arrangement space of the second signal line, and The area occupied by the second signal line in the lateral direction of the substrate is reduced, thereby further reducing the resistance of the second signal line and reducing the voltage drop generated on the second signal line when the second lamp bead is driven to emit light.
  • the light-emitting module further includes at least one second light-emitting unit group, the second light-emitting unit group is located on the side of the substrate where the second driving circuit layer is provided, and includes a second At least one second lamp bead on the second signal line.
  • lamp beads can be arranged on both sides of the light-emitting module, so as to increase the arrangement density of the lamp beads and improve the overall luminous brightness of the light-emitting film group.
  • the second groove includes a plurality of second groove segments arranged at intervals
  • the light emitting module further includes a plurality of second connecting parts.
  • the second connecting portion is located on the second structural layer and between adjacent second slot segments, and each second connecting portion includes a third portion respectively connected to a second signal line in an adjacent second slot segment and fourth part.
  • the third part and the fourth part are spaced apart from each other, and the second lamp bead is connected between the third part and the fourth part.
  • the second slot segment is divided into a third type slot segment and a fourth type slot segment, the length of the third type slot segment is shorter than the fourth type slot segment, and a plurality of third type slot segments
  • the slot segments are arranged in an array so that the third type slot segments in each row form a second slot group, a fourth type slot segment is arranged between adjacent second slot groups, and the two ends of the fourth type slot segments pass through
  • the second connection parts are respectively connected to the end parts of the adjacent second slot groups.
  • the second groove segments are arranged in an array such that each row of the second groove segments forms a second groove group, and the two ends of the second groove group are connected by the first The parts are respectively connected with the ends of the adjacent second slot groups.
  • the orthographic projection of the second lamp bead on the surface where the substrate is located coincides with the orthographic projection of the first lamp bead on the surface where the substrate is located.
  • the orthographic projection of the second lamp bead on the surface of the substrate is located between the gaps of the orthographic projection of the first lamp bead on the surface of the substrate.
  • the light of the second lamp bead can be emitted through the gap of the first lamp bead, so that the distribution of light emitted by the luminescent film group is uniform.
  • the substrate is a transparent substrate
  • the first groove and the second groove are grid-like grooves so that the first signal line and the second signal line have a grid-like structure.
  • designing the first signal line and the second signal line as a grid structure can make the first signal line and the second signal line appear transparent as a whole, thereby increasing the light transmittance of the substrate to increase the brightness of light output .
  • a second aspect of the present disclosure provides a display device, which includes the light-emitting module in the above-mentioned first aspect.
  • the first lamp bead is configured to emit colored light.
  • the display device further includes a dodging plate and a display layer overlapped with the dodging plate.
  • the light emitting module is configured such that the emitted light enters the display layer after passing through the dodging plate.
  • FIG. 1 is a partial structural schematic diagram of a lighting module provided by an embodiment of the present disclosure
  • Fig. 2 is a partial structural schematic diagram of another lighting module provided by an embodiment of the present disclosure.
  • Fig. 3 is a partial structural schematic diagram of another lighting module provided by an embodiment of the present disclosure.
  • FIG. 4A is a schematic plan view of a light emitting module provided by an embodiment of the present disclosure.
  • FIG. 4B is a schematic diagram of an enlarged structure of the first connecting portion and the first lamp bead in the light emitting module shown in FIG. 4A;
  • FIG. 4C is a cross-sectional view of the first connecting portion and the first lamp bead shown in FIG. 4B;
  • FIG. 4D is a schematic diagram of the actual structure of the first connecting portion and the first groove shown in FIG. 4B;
  • Figure 4E is an enlarged schematic view of the S region shown in Figure 4A;
  • Fig. 5 is a schematic plan view of a light emitting module provided by an embodiment of the present disclosure.
  • Fig. 6 is a partial structural schematic diagram of another lighting module provided by an embodiment of the present disclosure.
  • FIG. 7 is a partial structural schematic diagram of another lighting module provided by an embodiment of the present disclosure.
  • FIG. 8 is a schematic structural diagram of a display device provided by an embodiment of the present disclosure.
  • the present disclosure provides a light-emitting module and a display device.
  • Grooves are provided in the substrate of the light-emitting module for accommodating signal lines in the driving circuit layer, so that the signal lines will not be exposed to the outside of the substrate, such as abrasion damage, etc., and the setting of the signal line will not increase the design thickness of the light-emitting module, which is conducive to the light and thin design of the light-emitting module.
  • Signal lines can be used to transmit signals, connect power, and so on.
  • At least one embodiment of the present disclosure provides a light emitting module, which includes a substrate, a first driving circuit layer and at least one first light emitting unit group. At least one first groove is arranged on the surface of the substrate.
  • the first driving circuit layer is located on the substrate and includes at least one first signal line located in the first groove.
  • the first light emitting unit group is located on the side of the substrate where the first driving circuit layer is provided, and includes at least one first lamp bead, and the first lamp bead is connected in series with the first signal line.
  • the first signal line is embedded in the first groove of the substrate, so that the first signal line will not be damaged due to exposure to the substrate, such as abrasion, and the arrangement of the first signal line will not increase the design of the light emitting module.
  • the thickness is conducive to the light and thin design of the light emitting module.
  • a spatial Cartesian coordinate system is established based on the plane of the substrate (in the case where the substrate includes a substrate, the plane is equivalent to the plane of the substrate), so as to coordinate the light-emitting module and the display device.
  • the position of each structure is described in terms of directionality.
  • the X-axis and Y-axis are parallel to the plane where the substrate is located, and the plane where the Z-axis is located is perpendicular to the plane where the substrate is located.
  • the first driving circuit layer 210 is located on one side of the substrate, and at least one first light-emitting unit group 310 is arranged on the first driving circuit layer 210, and the first light-emitting unit group 310 includes
  • the first driving circuit layer 210 includes the first signal line 211 .
  • the surface of the substrate 100 is provided with a first groove 111 , and the first signal line 211 is located in the first groove 111 .
  • the first signal lines 211 may be set in a one-to-one correspondence with the first light emitting unit groups 310 .
  • each first light-emitting unit group 310 includes a plurality of first lamp beads 311, the plurality of first light-emitting unit groups 310 can be connected in series to a corresponding first signal line 211. . Since the first signal line 211 is embedded in the first groove 111 , it will not be damaged by scratches or the like. In addition, due to the arrangement of the first groove 111 in the substrate 100, the average thickness of the substrate 100 is reduced, making it easier to bend, that is, the bending ability of the light-emitting module is stronger, which is more conducive to the application of the light-emitting module to bending Or in the field of flexible displays.
  • the surface of the substrate 100 can be stamped (such as hot pressing), etched (such as photolithography), etc.
  • a first groove 111 is formed.
  • the substrate 100 having the first groove 111 may be directly formed by casting a mold or the like.
  • the substrate further includes a substrate and a first structure layer.
  • the first structural layer is located on one side of the substrate, and the first groove is formed in the first structural layer and located on the side of the first structural layer away from the substrate.
  • the substrate 100 includes a substrate 110 and a first structure layer 120 on the substrate 110 .
  • the first structure layer 120 is used to form the first groove 111 .
  • the substrate 110 can be used as the base of the entire substrate. Compared with the first structural layer 120, the substrate 110 can have greater strength (such as tensile resistance, compression resistance, etc.) to provide support, and the substrate 110 can be designed as a flexible substrate.
  • the first structural layer 120 is UV glue.
  • UV glue can be coated on the substrate 110, and the UV glue can be embossed and cured with a corresponding mold, and then demolded to form the first groove. 111 , and then fill the first groove 111 with a conductive material to form a first signal line 211 .
  • apply UV glue on the other side of the substrate 110 use the corresponding mold to emboss the UV glue, solidify and release the mold to form the second groove 112, and then fill the second groove 112 with conductive material to form the second signal line 221 .
  • first through holes 101 by laser drilling at appropriate positions (selected according to the needs of the process), fill the first through holes 101 with conductive material, and the conductive material in the first through holes 101 and
  • the conductive materials in the first groove 111 and the second groove 112 are in contact with each other to realize the electrical connection between the first signal line 211 and the second signal line 221 .
  • the first groove 111 is in a grid shape
  • the second groove 112 is in a grid shape
  • the diameter of the first through hole 101 is larger than that of the first through hole 111 and the second groove.
  • the grid width of the grooves 112 ensures the communication between the first through hole 101 and the first groove 111 and the second groove 112 .
  • the first structure layer includes a plurality of stacked first substructure layers, and each first substructure layer is provided with a first subgroove.
  • the first signal line includes a plurality of first sub-signal lines respectively located in the first sub-groove, and a first through hole is arranged in the first sub-structure layer, so that the plurality of first sub-signal lines are connected through the first through hole.
  • the occupied area in the lateral direction of the substrate further reduces the resistance of the first signal line, and reduces the voltage drop generated on the first signal line when the first lamp bead is driven to emit light.
  • the first structure layer of the substrate includes two first substructure layers 121 laminated on the substrate 110, and the surface of each substructure layer 121 facing away from the substrate 110 is formed with the first A sub-groove 1111 , the first sub-signal line 2111 of the first signal line is filled in the first sub-groove 1111 .
  • the first groove is divided into first sub-grooves 1111 located in two layers, and the first signal line is also divided into first sub-signal lines 2111 located in two layers.
  • the two layers of first sub-signal lines 2111 can be connected together through the first through holes 102 in the first sub-structure layer 121 .
  • a plurality of first through holes 102 can be provided, so that multi-point connections can be realized between the first sub-signal lines 2111 of two layers.
  • the thickness of the first sub-signal line 2111 in FIG. 3 is equal to the thickness of the first signal line 211 in FIG. 1 or FIG.
  • the sum of the thicknesses of the first sub-signal lines 2111 in the structural layer 121 is greater than the thickness of the first signal lines 211 in FIG. 1 or FIG. 2 , in this case, the total resistance of the first signal lines in FIG. 1 or the total resistance of the first signal line 211 in FIG. 2 .
  • the first groove in the case where the first groove is provided on the substrate, there is no restriction on the extended shape of the first groove, and it can be designed according to actual process requirements. Below, several design structures of the first groove and the structure of the corresponding light emitting module will be described with reference to the accompanying drawings.
  • the first groove (or first sub-groove) corresponding to each first signal line may be a continuous groove structure, that is, the first signal line
  • the line (or the first sub-signal line) is a continuous and uninterrupted signal line.
  • the first groove includes a plurality of first groove segments arranged at intervals, and the light emitting module further includes a plurality of first connecting parts.
  • the first connection part is located on the first structural layer and between adjacent first slot segments, and each first connection part includes a first part and a first part respectively connected to the first signal line in the adjacent first slot segment. two parts.
  • the first part and the second part are spaced apart from each other, and the first lamp bead is connected between the first part and the second part. Because the first signal wire is embedded in the first groove, when the first lamp bead is installed, it is difficult for the first lamp bead to be in direct contact with the first signal wire.
  • the first part of the first connection part and the second part lead out the first signal wire, so that the first signal wire can be connected to the first lamp bead by means of the first connection part.
  • the first connection part Exemplarily, as shown in FIG. 2 and FIG. 4A to FIG.
  • the first groove 111 is configured to be formed by a plurality of first groove segments arranged at intervals, that is, the first groove 111 is broken into a plurality of grooves,
  • Each groove is a first groove segment
  • the first part 411 and the second part 412 of the first connecting part 410 are respectively connected to different first groove segments
  • each first lamp bead 311 includes pins 311a, 311b and a body part 311c (can be energized to emit light), the pin 311a is connected to the first part 411, and the pin 311b is connected to the second part 412, so that the first lamp bead 311 is connected in series with the first signal line.
  • the first connection part 410 can be designed such that a part of the first part 411 and the second part 412 covers a part of the first groove 111, thereby ensuring that the first part 411 and the second part 412 and the first part of the first groove 111 Connect for the signal line.
  • the first part 411 and the second part 412 of the first connecting part 410 can be designed according to the specific type of the first lamp bead, for example, for a conventional LED lamp bead, the first The first part 411 and the second part 412 of the connection part 410 can be designed as a structure as shown in FIG. 4 , that is, the first part 411 is designed like an "L" shape, and the second part 412 is designed like a rectangle.
  • the first slot segment is divided into a first type slot segment and a second type slot segment, the length of the first type slot segment is shorter than the second type slot segment, and multiple first type slot segments
  • the slot segments are arranged in an array so that the first type slot segments in each row form a first slot group, a second type slot segment is arranged between adjacent first slot groups, and the two ends of the second type slot segments pass through
  • the first connecting parts are respectively connected to the ends of the adjacent first slot groups. Exemplarily, as shown in FIG.
  • the lengths of the first groove segments of the first groove are inconsistent, and the first groove segments are divided into a first type groove segment 111a and a second type groove segment 111b, and the first type groove segment 111a
  • the length is smaller than the second type of groove segment 111b
  • the array of the first type of groove segment 111a is arranged in 4 rows (the row direction is parallel to the X-axis direction) and 3 columns (the column direction is parallel to the Y-axis direction), and a single first type of groove segment in each row
  • the groove segment 111a is formed as a first groove group, thereby forming four first groove groups, and a second type groove segment 111b is arranged between each adjacent first groove group, and the adjacent first groove groups pass through the second type
  • the slot segments 111b are connected together, that is, a plurality of first slot groups (the first type slot segments 111a therein) and a plurality of second type slot segments 111b are arranged alternately and connected end to end to form a multi-
  • the first groove segments are arranged in an array such that each row of the first groove segments forms a first groove group, and the two ends of the first groove group are connected by a first The parts are respectively connected with the ends of the adjacent first groove groups. Exemplarily, as shown in FIG.
  • the first slot segments of the first groove are all first type slot segments 111a, and the first type slot segments 111a are arranged in an array of 4 rows (the row direction is parallel to the X-axis direction) and 3 columns (the column direction is parallel to the Y-axis direction), the single first-type slot segment 111a in each row is formed into a first slot group, thereby forming 4 first slot groups, and the 4 first slot groups are connected end to end, That is, a plurality of first groove groups (the first type of groove segments 111 a therein) are connected end to end to form a multi-stage "S" shape.
  • the light emitting module further includes a second driving circuit layer, the second driving circuit layer is located on a side of the substrate away from the first driving circuit layer, and includes at least one second signal line.
  • the substrate is provided with at least one second through hole, and the first signal line and the second signal line are connected through the second through hole, for example, connected in series or in parallel.
  • the second signal line connected to the first signal line is arranged on the side of the substrate away from the first lamp bead, and the circuit for driving the first lamp bead does not need to be arranged on the side of the substrate, thereby reducing the number of lamps installed on the substrate.
  • the connection is in parallel, then the first signal line and the second signal line are connected together, compared with setting the first signal line alone, the overall resistance value becomes smaller, and the drive The first drive circuit layer and the second drive circuit layer reduce the pressure loss when the first lamp bead emits light, thereby reducing the brightness difference between the first lamp beads connected in series, so as to improve the uniformity of light emitted by the entire light-emitting film group Spend.
  • the first driving circuit layer 210 and the second driving circuit layer 220 are located on both sides of the substrate, and the second driving circuit layer 220 includes a second signal line 221 .
  • the substrate 100 is provided with a second through hole 101 , and the first signal line 211 and the second signal line 221 are connected through the second through hole 101 .
  • FIG. 2 and FIG. 3 are cross-sectional views showing only a partial structure of the light-emitting module 10.
  • a plurality of second through holes 101 are provided in the substrate 100, So that each first signal line 211 and the corresponding second signal line 221 can be connected at multiple points, that is, each first signal line 211 and the corresponding second signal line 221 are connected in parallel.
  • the width of the second through hole may be smaller than, equal to or larger than the width of the first groove in which it is located, and is not limited to the arrangement shown in FIG. 2 and FIG. 3 .
  • the size of the part of the first groove here is larger than the size of the part in other areas, so that the second through hole has a larger width, that is, in the second through hole.
  • the first groove and the second through hole 101 can be formed in the same photolithography process, thereby reducing the preparation of the light emitting module. process flow.
  • a photoresist may be deposited on the substrate 100, and then a two-tone mask is provided, that is, the mask includes a first light-transmitting region and a second light-transmitting region and the light-shielding area, the light transmittance of the first light-transmitting area is greater than the light transmittance of the second light-transmitting area, the position of the first light-transmitting area and the second through hole 101 to be formed, and the second light-transmitting area and the position of the second through hole 101 to be formed corresponding to the position of the first groove 111 (except the position where the second through hole 101 is located); then the photoresist is exposed and developed, and the part of the photoresist
  • the second driving circuit layer can be further arranged in a manner referring to the first driving circuit.
  • the second signal line of the second driving circuit layer can be arranged in the groove, and the second signal line can also be arranged to be formed by connecting a plurality of sub-signal lines, the second signal line and the recess for defining the second signal line
  • the shape of the groove can refer to the above-mentioned first signal line and the shape of the first groove that defines the first signal line.
  • the substrate further includes a second structural layer.
  • the second structure layer is located on the side of the substrate away from the first structure layer, at least one second groove is arranged on the surface of the second structure away from the substrate, and the second signal line is located in the second groove.
  • the second signal line is embedded in the second groove of the substrate, so that the second signal line will not be damaged due to exposure to the substrate, such as abrasion, and the setting of the second signal line will not increase the design of the light emitting module.
  • the thickness is conducive to the light and thin design of the light emitting module. Exemplarily, referring again to FIG. 2 or FIG.
  • the second structure layer 130 is provided on the surface of the substrate 100 away from the first driving circuit layer 210 , and the second structure layer 130 is provided on the surface of the second structure layer 130 away from the substrate 110 .
  • the groove 112 , the second signal line 221 is located in the second groove 112 .
  • the second structure layer includes a plurality of second substructure layers stacked, and each second substructure layer is provided with a second subgroove.
  • the second signal line includes a plurality of second sub-signal lines respectively located in the second sub-groove, and a third through hole is arranged in the second sub-structure layer, so that the plurality of second sub-signal lines are connected through the third through hole.
  • the occupied area in the lateral direction of the substrate further reduces the resistance of the second signal line, and reduces the voltage drop generated on the second signal line when the second lamp bead is driven to emit light.
  • the arrangement of the second structural layer and the second signal line may be the arrangement of the first structural layer and the first signal line in the above embodiment shown in FIG. 3 , and details are not repeated here.
  • the light-emitting module further includes at least one second light-emitting unit group, the second light-emitting unit group is located on the side of the substrate where the second driving circuit layer is provided, and includes a At least one second lamp bead on the second signal line.
  • lamp beads can be arranged on both sides of the light-emitting module, so as to increase the arrangement density of the lamp beads and improve the overall luminous brightness of the light-emitting film group.
  • a second light emitting unit group 320 is provided on a side of the second structure layer 130 away from the substrate 110 , and the second light emitting unit group includes a plurality of second lamp beads 321 .
  • the second groove includes a plurality of second groove segments arranged at intervals, and the light emitting module further includes a plurality of second connecting parts.
  • the second connecting portion is located on the second structural layer and between adjacent second slot segments, and each second connecting portion includes a third portion respectively connected to a second signal line in an adjacent second slot segment and fourth part.
  • the third part and the fourth part are spaced apart from each other, and the second lamp bead is connected between the third part and the fourth part. Exemplarily, as shown in FIG. 6 or FIG.
  • the second groove 112 is configured to be formed by a plurality of second groove segments arranged at intervals, that is, the second groove 112 is broken into a plurality of grooves, and each groove Both are a first slot segment, the third part 421 and the fourth part 422 of the second connecting part 420 are respectively connected to different first slot segments, and each second lamp bead 321 (or the part used to connect with the external circuit ) is located between the third part 421 and the fourth part 422.
  • the arrangement of the second lamp bead 321 and the second connecting portion 420 can refer to the relevant descriptions about the first lamp bead and the second connecting portion in the foregoing embodiments, and details are not repeated here.
  • the material of the substrate can be glass, plexiglass, PET (polyethylene terephthalate), PMMA (polymethyl methacrylate), PI (polyimide), CPI (transparent polyimide), etc., can have a thickness of 25-250 microns.
  • the material of the first and second structural layers may be ultraviolet curing acrylic resin or the like.
  • the first and second lamp beads may be LED lamp beads.
  • the materials of the first and second connecting parts may be solderable conductive materials, such as metal tin and the like.
  • the thickness of the first and second connecting parts may be 5-20 microns.
  • the second slot segment is divided into the third type slot segment and the fourth type slot segment, the length of the third type slot segment is shorter than the fourth type slot segment, and the plurality of third type slot segments
  • the slot segments are arranged in an array so that the third type slot segments in each row form a second slot group, a fourth type slot segment is arranged between adjacent second slot groups, and the two ends of the fourth type slot segments pass through
  • the second connection parts are respectively connected to the end parts of the adjacent second slot groups.
  • the arrangement of the second groove and the second groove segment therein can refer to the arrangement of the first groove and the first groove segment therein in Fig. 4A, wherein the first groove segment in this embodiment
  • the third type of slot segment and the fourth type of slot segment respectively correspond to the first type of slot segment and the second type of slot segment in the embodiment shown in FIG. 4A .
  • the second groove segments are arranged in an array such that each row of the second groove segments forms a second groove group, and the two ends of the second groove group are connected by the first The parts are respectively connected with the ends of the adjacent second slot groups.
  • the arrangement of the second groove and the second groove segment therein can refer to the arrangement of the first groove and the first groove segment therein in Fig. 5, wherein the first groove segment in this embodiment
  • the three types of groove segments correspond to the first type of groove segments in the embodiment shown in FIG. 5 .
  • the orthographic projection of the second lamp bead on the surface where the substrate is located coincides with the orthographic projection of the first lamp bead on the surface where the substrate is located.
  • the first lamp bead 311 and the second lamp bead 321 are overlapped. In this way, the arrangement of the second lamp bead 321 will not reduce the overall light transmittance of the light-emitting module, which is beneficial to the application of the light-emitting module to the field of transparent display.
  • the orthographic projection of the second lamp bead on the surface of the substrate is located between the gaps of the orthographic projection of the first lamp bead on the surface of the substrate.
  • the light of the second lamp bead can be emitted through the gap of the first lamp bead, so that the distribution of light emitted by the luminescent film group is uniform. Exemplarily, as shown in FIG.
  • the first lamp bead 311 and the second lamp bead 321 are arranged alternately, so that the direct light of the second lamp bead 321 (the light tends to be perpendicular to the surface where the substrate is located as a whole) can pass from the second lamp bead 321
  • the first lamp bead 311 emits from the gap, reducing the amount of light that is shielded by the first lamp bead 311 , and correspondingly increasing the brightness of the light emitted by the light emitting module 10 .
  • the substrate is a transparent substrate. In this way, the light emitted by the second lamp bead can pass through the substrate and be used as an auxiliary light source for the first lamp bead, thereby increasing the light output brightness of the light emitting module.
  • both the first groove and the second groove are grid-like grooves so that the first signal line and the second signal line are both grid-like structures.
  • the grid density at the first connecting portion of the first groove is greater than the grid density of other regions, and the unit shape of the grid is triangular, multi-deformed, honeycomb, random grid, etc., which has good electrical conductivity .
  • the first groove and the second groove are grid-shaped grooves so that the first signal line and the second signal line have a grid-like structure, so that the first signal line can be
  • the line and the second signal line are transparent as a whole, so as to increase the light transmittance of the substrate and improve the brightness of light output.
  • a grid structure with the entire layer may be formed first, and then the grid structure is divided to form the first and second signal lines.
  • the groove can be designed as a grid structure, so that the first and second signal lines formed in the groove appear in a grid shape.
  • the first and second signal lines can be obtained only by breaking the grid lines, that is, adjacent Residual grid structures are retained between the first signal lines and between adjacent second signal lines, and the residual grid structures do not participate in the formation of components such as signal lines, thus serving as dummy areas.
  • the grid structure can make the overall light transmittance of the substrate uniform, thereby improving the uniformity of light output from the substrate.
  • the entire grid structure as shown in FIG. 4E can be set first, and then the grid structure is divided along the lines P1 and P2 , the grid lines of the grid structure are disconnected at the lines P1 and P2, the part of the grid structure located between the lines P1 and P2 is the first signal line 211, and the part of the grid structure located outside the lines P1 and P2 is used as dummy part.
  • the first signal line 211 is accommodated in the first groove, as shown in FIG. Also accommodated by the corresponding first groove.
  • the structure shown in FIG. 4E can be applied to the case where the first signal line 211 includes a plurality of first sub-signal lines.
  • the cross-sectional shapes of the first and second grooves may be rectangles or inverted trapezoids.
  • the side walls of the first and second grooves are inclined (non-parallel and non-perpendicular) compared to the bottom, and the bottom of the trapezoid is located on the side of the top away from the substrate.
  • the angle between the side wall and the bottom of the first and second grooves is between 90° and 120°.
  • the aspect ratio of the first groove and/or the second groove (the width is the dimension of the groove in a direction perpendicular to its extending direction and parallel to the surface of the substrate) may be greater than or It is equal to 2.5, wherein the width range may be 4-40 microns, and the depth range may be 10-100 microns, such as 20 microns.
  • the first and second signal lines in the first and second grooves the first and second grooves have a larger aspect ratio, thereby effectively reducing production costs and improving the long-term use of the lines. stability.
  • Adopt an aspect ratio greater than or equal to 2.5, and the groove depth can be greater than or equal to 20 ⁇ m, so that the impedance of the line is very low (square resistance can reach 2-8m ⁇ / ⁇ ), and it can be combined with the first and second through holes.
  • Layer design so it has better electrical conductivity, which can ensure the feasibility of large-area high-density lamp bead array design.
  • the formation of the first and second signal lines in the first and second grooves can use substrate-free or flexible substrates (such as PET), so that the light-emitting module is transparent and flexible, so that it can be used for transparent display, such as outdoor advertising etc., the overall thickness of the light-emitting module can also be reduced, and the application range is wider.
  • the thicknesses of the first and second signal lines filled in the first and second grooves may be less than or equal to the depths of the first and second grooves.
  • the thickness of the first and second signal lines may be 18-20 microns.
  • the size of the first and second through holes may be 50-300 microns, such as 100, 150, 200, 250 microns and so on.
  • the distance between adjacent first lamp beads and/or the distance between adjacent second lamp beads can be designed according to actual process requirements, for example, it can be 200-2000 microns.
  • the materials of the first signal line and the second signal line may be gold, Silver, copper, iron, nickel, tin and other metals or metal alloys.
  • a reflective layer may be provided on the side of the second lamp bead away from the substrate to ensure that all the light emitted by the second lamp bead can be reflected to the first lamp bead, so as to improve the light output of the light-emitting module. brightness.
  • an optical film may be provided on the side of the first lamp bead away from the substrate, and the optical film may include a uniform light sheet, a diffuser, etc., and the optical film may make the light distribution uniform And the light can be straightened (converted into a linear beam, for example, the overall transmission direction of the linear beam is substantially perpendicular to the surface where the substrate is located).
  • At least one embodiment of the present disclosure provides a display device, and the display device includes the light emitting module in any one of the above embodiments. It should be noted that, in the display device, the light emitting module can directly display images, or serve as a light source of the device for displaying images.
  • the first lamp bead (or the first lamp bead and the second lamp bead) is configured to emit colored light.
  • the first lamp bead can serve as a sub-pixel of the display device, and multiple sub-pixels can be combined into a pixel unit (which can be called a large pixel or a display unit).
  • a pixel unit which can be called a large pixel or a display unit.
  • different first The lamp bead is set to emit light of different colors, so that the pixel unit can emit light of various colors, so that the display device has a color display function.
  • the light-emitting module adopts a flexible transparent substrate, and the display device formed is a transparent and flexible display device, which can be installed on transparent glass such as windows, and adapt to the shape of the glass. It is transparent when it is not powered on, and has a display function when it is powered on. , advertisements, etc. are displayed.
  • the display device further includes a display layer and a dodging plate.
  • the light emitted from the group enters the display layer after passing through the dodging plate.
  • the display layer is a structure including pixels to have a display function.
  • the display layer can control the light emitted by the light-emitting module to achieve display, for example, the display layer includes a liquid crystal layer to achieve display.
  • the display layer can be called a liquid crystal display panel or a liquid crystal display module, and
  • the light-emitting module is used as the light source module of the liquid crystal display panel, and the light source module can be used as a front light source or a backlight source (backlight module); or, the display layer can also be displayed by exciting the light emitted by the light-emitting module.
  • Panel for example, the display layer can be a quantum dot display panel, each pixel area of the display layer is provided with quantum dots, the light emitted by the light-emitting module is short-wavelength light, excited by short-wavelength light, the quantum dots can emit light in a specific wavelength range , further setting different types of quantum dots can make the display layer emit light of different colors.
  • the structure of the display device of the present disclosure will be described by taking the display layer including the liquid crystal layer as an example.
  • the light emitting module 10 is located on the backlight side of the display layer 20 , so as to serve as the backlight module of the display layer 20 .
  • the display layer 20 may be a liquid crystal display layer.
  • the light emitting module 10 is a direct type backlight module.
  • the display device further includes a dodging plate 30 , and the light emitting module 10 is disposed facing the main surface of the dodging plate 30 and is located on a side of the dodging plate 30 away from the display layer 20 .
  • the light homogenizing plate 30 may include optical films such as a diffusion film and a prism film, so that the light emitted by the light emitting module 10 can be uniformly dispersed and straightened.
  • the display layer 20 may specifically include a box structure composed of an array substrate and an opposite substrate, the liquid crystal layer is encapsulated between the array substrate and the opposite substrate, and a color filter and a polarizer (optionally provided with ) and other components, a polarizer is arranged between the array substrate and the light-emitting module.
  • further design of the display layer 20 can refer to the current related design of the panel-type structure (excluding the light source module structure) of the liquid crystal display, which will not be repeated here.
  • the display layer can be any panel structure that requires a backlight or a front light source (in this case, the display layer can be a reflective display layer with an additional light source), and is not limited to a liquid crystal display layer.
  • the display layer can be any panel structure that requires a backlight or a front light source (in this case, the display layer can be a reflective display layer with an additional light source), and is not limited to a liquid crystal display layer.
  • the display layer can be any panel structure that requires a backlight or a front light source (in this case, the display layer can be a reflective display layer with an additional light source), and is not limited to a liquid crystal display layer.
  • the display layer can be any panel structure that requires a backlight or a front light source (in this case, the display layer can be a reflective display layer with an additional light source), and is not limited to a liquid crystal display layer.
  • the display device may be any product or component with a display function such as a billboard, a vending machine, a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, a navigator, and the like.
  • a display function such as a billboard, a vending machine, a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, a navigator, and the like.

Abstract

本公开提供了一种发光模组和显示装置，该发光模组包括基板、第一驱动电路层和至少一个第一发光单元组。基板表面上设置有至少一条第一凹槽。第一驱动电路层位于基板上且包括至少一条位于第一凹槽中的第一信号线。第一发光单元组位于基板的设置有第一驱动电路层的一侧，且包括至少一个第一灯珠，第一灯珠串联在第一信号线上。该发光模组中，第一信号线设置在基板的第一凹槽中，相当于嵌入在基板中，使得第一信号线不会因暴露在基板之外而产生例如磨损等损坏，而且第一信号线的设置不会增加发光模组的设计厚度，有利于发光模组的轻薄化设计。

Description

发光模组和显示装置
本申请要求于2021年8月27日递交的中国专利申请第202110998521.0号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开涉及背光显示领域，特别涉及一种发光模组和显示装置。
背景技术
Mini LED(次毫米发光二极管)背光显示技术是一种区别于传统液晶显示器(Liquid Crystal Display，简称为LCD)和有机发光二极管(Organic Light-Emitting Diode，简称为OLED)显示器的新型显示技术。相比后两者，Mini LED背光面板存在更高的颜色对比度、亮度、色域，更高的寿命和更薄的厚度，是近几年面板行业发展的重点领域，有广阔的前景。然而，当前的Mini LED背光面板限于自身的结构设计，用于驱动Mini LED的线路会凸出在基板之上，在生产及应用过程中，线路可能会受到摩擦、碰撞等损坏，导致线路断裂，使得Mini LED背光面板出现功能不良。
发明内容
有鉴于此，本公开提供了一种发光模组和显示装置，该发光模组的基板中设置凹槽以用于容纳驱动电路层中的信号线，使得信号线不会因暴露在基板之外而产生例如磨损等损坏，而且信号线的设置不会增加发光模组的设计厚度，有利于发光模组的轻薄化设计。
本公开第一方面提供一种发光模组，该发光模组包括基板、第一驱动电路层和至少一个第一发光单元组。基板的表面上设置有至少一条第一凹槽。第一驱动电路层位于基板上且包括至少一条位于第一凹槽中的第一信号线。第一发光单元组位于基板的设置有第一驱动电路层的一侧，且包括至少一个第一灯珠，第一灯珠串联在第一信号线上。
在上述方案中，将第一信号线嵌入在基板的第一凹槽中，使得第一信号线不会因暴露在基板之外而产生例如磨损等损坏，而且第一信号线的设置不会增加发光模组的设计厚度，有利于发光模组的轻薄化设计。
在本公开第一方面的一个具体实施方式中，基板还包括衬底和第一结构层衬底。第一结构层位于衬底的一侧，第一凹槽形成在第一结构层中且位于第一结构层的背离衬底的一侧。
在本公开第一方面的一个具体实施方式中，第一结构层包括多个层叠设置的第一子结构层，每个第一子结构层中设置有第一子凹槽。第一信号线包括分别位于第一子凹槽的多条第一子信号线，第一子结构层中设置有第一通孔，以使得多条第一子信号线通过第一通孔连接，例如串联或者并联。
在上述方案中，通过将多个第一子结构层，将第一信号线设置为由彼此连接且位于不同层的第一子信号线构成，从而进一步增加了第一信号线的布置空间，以降低第一信号线在基板的横向方向上的占用面积，从而进一步降低第一信号线的电阻，并降低驱动第一灯珠发光时在第一信号线上产生的压降。
在本公开第一方面的一个具体实施方式中，第一凹槽包括间隔排布的多个第一槽段，发光模组还包括多个第一连接部。第一连接部位于第一结构层上且位于相邻的第一槽段之间，每个第一连接部包括与相邻的第一槽段中的第一信号线分别连接的第一部分和第二部分。第一部分和第二部分彼此间隔，第一灯珠连接在第一部分和第二部分之间。
在本公开第一方面的一个具体实施方式中，第一槽段分为第一类槽段和第二类槽段，第一类槽段的长度小于第二类槽段，多个第一类槽段呈现阵列排布以使得每行的第一类槽段形成为一个第一槽组，相邻的第一槽组之间设置一个第二类槽段，第二类槽段的两端通过第一连接部分别与相邻的第一槽组的端部连接。
在本公开第一方面的另一个具体实施方式中，第一槽段呈现阵列排布以使得每行的第一槽段形成为一个第一槽组，第一槽组的两端通过第一连接部分别与相邻的第一槽组的端部连接。
在本公开第一方面的另一个具体实施方式中，发光模组还包括第二驱动电路层，第二驱动电路层位于基板的背离第一驱动电路层的一侧，且包括至少一条第二信号线。基板设置有至少一个第二通孔，第一信号线和第二信号线通过第二通孔连接，例如串联或者并联。
在上述方案中，在基板的背离第一灯珠的一侧设置与第一信号线连接的第二信号线，不需要将用于驱动第一灯珠的线路设置在基板的一侧，从而降低基板的设置有灯珠的一侧的线路占用面积；此外，如果该连接为并联，那么第一信号线和第二信号线并联在一起，相比于单独设置第一信号线，整体的电阻值变小，在驱动第一驱动电路层和第二驱动电路层以使得第一灯珠发光时，压耗降低，从而减小串联在一起的第一灯珠之间的亮度差异，以提高整个发光膜组出光的均匀度。
在本公开第一方面的一个具体实施方式中，基板还包括第二结构层。第二结构层位于衬底的背离第一结构层的一侧，第二结构的背离衬底的表面设置有至少一条第二凹槽， 第二信号线位于第二凹槽中。
在上述方案中，将第二信号线嵌入在基板的第二凹槽中，使得第二信号线不会因暴露在基板之外而产生例如磨损等损坏，而且第二信号线的设置不会增加发光模组的设计厚度，有利于发光模组的轻薄化设计。
在本公开第一方面的一个具体实施方式中，第二结构层包括多个层叠设置的第二子结构层，每个第二子结构层中设置有第二子凹槽。第二信号线包括分别位于第二子凹槽的多条第二子信号线，第二子结构层中设置有第三通孔，以使得多条第二子信号线通过第三通孔连接，例如串联或者并联。
在上述方案中，通过将多个第二子结构层，将第二信号线设置为由彼此连接且位于不同层的第二子信号线构成，从而进一步增加了第二信号线的布置空间，以降低第二信号线在基板的横向方向上的占用面积，从而进一步降低第二信号线的电阻，并降低驱动第二灯珠发光时在第二信号线上产生的压降。
在本公开第一方面的一个具体实施方式中，发光模组还包括至少一个第二发光单元组，第二发光单元组位于基板的设置有第二驱动电路层的一侧，且包括串联在第二信号线上的至少一个第二灯珠。
在上述方案中，可以使得发光模组的两侧都能够布置灯珠，以提高灯珠的布置密度，以提高发光膜组的整体发光亮度。
在本公开第一方面的一个具体实施方式中，第二凹槽包括间隔排布的多个第二槽段，发光模组还包括多个第二连接部。第二连接部位于第二结构层上且位于相邻的第二槽段之间，每个第二连接部包括与相邻的第二槽段中的第二信号线分别连接的第三部分和第四部分。第三部分和第四部分彼此间隔，第二灯珠连接在第三部分和第四部分之间。
在本公开第一方面的一个具体实施方式中，第二槽段分为第三类槽段和第四类槽段，第三类槽段的长度小于第四类槽段，多个第三类槽段呈现阵列排布以使得每行的第三类槽段形成为一个第二槽组，相邻的第二槽组之间设置一个第四类槽段，第四类槽段的两端通过第二连接部分别与相邻的第二槽组的端部连接。
在本公开第一方面的另一个具体实施方式中，第二槽段呈现阵列排布以使得每行的第二槽段形成为一个第二槽组，第二槽组的两端通过第一连接部分别与相邻的第二槽组的端部连接。
在本公开第一方面的一个具体实施方式中，第二灯珠在基板所在面上的正投影和第一灯珠在基板所在面上的正投影重合。
在本公开第一方面的另一个具体实施方式中，第二灯珠在基板所在面上的正投影位 于第一灯珠在基板所在面上的正投影的间隙之间。
在上述方案中，第二灯珠的光线可以透过第一灯珠的间隙出射，从而使得发光膜组出射的光分布均匀。
在本公开第一方面的一个具体实施方式中，基板为透明基板，第一凹槽和第二凹槽为网格状凹槽以使得第一信号线和第二信号线为网格状结构。
在上述方案中，将第一信号线和第二信号线设计为网格结构，可以使得第一信号线和第二信号线整体呈现为透光，从而提高基板的透光率，以提高出光亮度。
本公开第二方面提供一种显示装置，该显示装置包括上述第一方面中的发光模组。
在本公开第二方面的一个具体实施方式中，第一灯珠设置为可出射彩色光线。
在本公开第二方面的另一个具体实施方式中，显示装置还包括匀光板和与匀光板重叠设置的显示层。发光模组配置为使得出射的光线经过匀光板后射入显示层。
附图说明
图1为本公开一实施例提供的一种发光模组的部分结构示意图；
图2为本公开一实施例提供的另一种发光模组的部分结构示意图；
图3为本公开一实施例提供的另一种发光模组的部分结构示意图；
图4A为本公开一实施例提供的一种发光模组的平面结构示意图；
图4B为图4A所示发光模组中的关于第一连接部和第一灯珠的放大结构示意图；
图4C为图4B的所示的第一连接部和第一灯珠的截面图；
图4D为图4B所示第一连接部和第一凹槽的实际结构示意图；
图4E为图4A所示的S区域的放大示意图；
图5为本公开一实施例提供的一种发光模组的平面结构示意图；
图6为本公开一实施例提供的另一种发光模组的部分结构示意图；
图7为本公开一实施例提供的另一种发光模组的部分结构示意图；以及
图8为本公开一实施例提供的一种显示装置的结构示意图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
本公开提供了一种发光模组和显示装置，该发光模组的基板中设置凹槽以用于容纳驱动电路层中的信号线，使得信号线不会因暴露在基板之外而产生例如磨损等损坏，而且信号线的设置不会增加发光模组的设计厚度，有利于发光模组的轻薄化设计。信号线可以用于传输信号、接通电源等。
本公开至少一个实施例提供一种发光模组，该发光模组包括基板、第一驱动电路层和至少一个第一发光单元组。基板的表面上设置有至少一条第一凹槽。第一驱动电路层位于基板上且包括至少一条位于第一凹槽中的第一信号线。第一发光单元组位于基板的设置有第一驱动电路层的一侧，且包括至少一个第一灯珠，第一灯珠串联在第一信号线上。将第一信号线嵌入在基板的第一凹槽中，使得第一信号线不会因暴露在基板之外而产生例如磨损等损坏，而且第一信号线的设置不会增加发光模组的设计厚度，有利于发光模组的轻薄化设计。
下面，结合附图对根据本公开至少一个实施例中的发光模组和显示装置进行说明。此外，在该些实施例中，以基板所在面(在基板包括衬底的情况下，该面相当于衬底所在面)为基准建立空间直角坐标系，以对发光模组和显示装置中的各个结构的位置进行指向性说明，在该空间直角坐标系中，X轴和Y轴与基板所在面平行，Z轴所在面与基板所在面垂直。
如图1所示，在发光模组10中，第一驱动电路层210位于基板的一侧，第一驱动电路层210上设置有至少一个第一发光单元组310，第一发光单元组310包括第一灯珠311，第一驱动电路层210包括第一信号线211。基板100的表面设置有第一凹槽111，第一信号线211位于该第一凹槽111中。例如，第一信号线211可以设置为和第一发光单元组310一一对应。例如，在每个第一发光单元组310包括多个第一灯珠311的情况下，该第一发光单元组310的多个第一灯珠311可以串联在对应的一条第一信号线211上。第一信号线211因嵌入在第一凹槽111中而不会受到刮伤等损坏。另外，基板100中因设置第一凹槽111而使得基板100的平均厚度减小，而变得更容易弯曲，即，发光模组的弯折能力更强，更有利于发光模组应用至弯曲或者柔性显示领域中。
例如，在本公开的一些实施例中，在发光模组的制备过程中，提供基板100之后，可以通过压印(例如热压)、刻蚀(例如光刻)等方式在基板100的表面上形成第一凹槽111。例如，在本公开的另一些实施例中，可以通过铸模等方式直接形成具有第一凹槽111的基板100。
在本公开至少一个实施例提供的发光模组中，基板还包括衬底和第一结构层。第一结构层位于衬底的一侧，第一凹槽形成在第一结构层中且位于第一结构层的背离衬底的一侧。示例性的，如图2所示，基板100包括衬底110和位于衬底110上的第一结构层120。第一结构层120用于形成第一凹槽111。衬底110可以作为整个基板的基底，衬底110相比较于第一结构层120可以具有较大的强度(例如抗拉、抗压等)以提供支撑，衬底110可以设计为 采用柔性基材且具有较小的厚度，以使得其具备良好的弯曲性能。示例性的，第一结构层120为UV胶，在制备过程中，可以在衬底110上涂布UV胶，使用对应的模具对UV胶进行压印并固化再脱模后形成第一凹槽111，再在第一凹槽111内填充导电材料以形成第一信号线211。同样的，在衬底110的另一侧涂布UV胶，使用对应的模具对UV胶进行压印并固化再脱模后形成第二凹槽112，再在第二凹槽112内填充导电材料以形成第二信号线221。然后，在适当的位置(根据工艺需要进行选择)，通过激光打孔的方式形成多个第一通孔101，在第一通孔101内填充导电材料，第一通孔101内的导电材料与第一凹槽111和第二凹槽112内的导电材料分别接触以实现第一信号线211和第二信号线221的电性连接。例如，在本公开至少一种实施例中，第一凹槽111呈网格状，第二凹槽112呈网格状，第一通孔101的孔径分别大于第一凹槽111和第二凹槽112的网格宽度，从而保证第一通孔101与第一凹槽111和第二凹槽112的连通。
在本公开至少一个实施例提供的发光模组中第一结构层包括多个层叠设置的第一子结构层，每个第一子结构层中设置有第一子凹槽。第一信号线包括分别位于第一子凹槽的多条第一子信号线，第一子结构层中设置有第一通孔，以使得多条第一子信号线通过第一通孔连接。通过将多个第一子结构层，将第一信号线设置为由彼此连接且位于不同层的第一子信号线构成，从而进一步增加了第一信号线的布置空间，以降低第一信号线在基板的横向方向上的占用面积，从而进一步降低第一信号线的电阻，并降低驱动第一灯珠发光时在第一信号线上产生的压降。示例性的，如图3所示，基板的第一结构层包括两个层叠在衬底110上的第一子结构层121，每一个子结构层121的背离衬底110的表面都形成有第一子凹槽1111，第一信号线的第一子信号线2111填充在第一子凹槽1111中。如此，第一凹槽拆分为位于两层的第一子凹槽1111，第一信号线也拆分为位于两层的第一子信号线2111。该两层第一子信号线2111可以通过位于第一子结构层121中的第一通孔102连接在一起。例如，第一通孔102可以设置为多个，以使得两层的第一子信号线2111之间可以实现多点连接。
例如，在本公开的实施例中，图3中的第一子信号线2111的厚度等于图1或者图2中的第一信号线211的厚度，或者图3中的位于不同层的第一子结构层121中的第一子信号线2111的厚度之和大于图1或者图2中的第一信号线211的厚度，在此情况下，图3中的第一信号线的总电阻会小于图1或者图2中的第一信号线211的总电阻。
在本公开的实施例中，在基板上设置有第一凹槽的情况下，对第一凹槽的延伸形状不做限制，可以根据实际工艺的需要进行设计。下面，结合附图对第一凹槽的几种设计结构，以及对应的发光模组的结构进行说明。
例如，在本公开一些实施例中，提供的发光模组中，对应于每一条第一信号线的第一凹 槽(或者第一子凹槽)可以为连续的槽结构，即，第一信号线(或者第一子信号线)为连续不间断的信号线。
例如，在本公开另一些实施例提供的发光模组中，第一凹槽包括间隔排布的多个第一槽段，发光模组还包括多个第一连接部。第一连接部位于第一结构层上且位于相邻的第一槽段之间，每个第一连接部包括与相邻的第一槽段中的第一信号线分别连接的第一部分和第二部分。第一部分和第二部分彼此间隔，第一灯珠连接在第一部分和第二部分之间。因为第一信号线嵌入在第一凹槽中，在安装第一灯珠时，第一灯珠会难以和第一信号线直接接触，在该些实施例中，通过第一连接部的第一部分和第二部分将第一信号线引出，以使得第一信号线可以借助第一连接部与第一灯珠连接。示例性的，如图2、图4A～图4C所示，第一凹槽111设置为由多个间隔排布的第一槽段形成，即，第一凹槽111断开为多个槽，每个槽都为一个第一槽段，第一连接部410的第一部分411和第二部分412分别连接不同的第一槽段，每一个第一灯珠311包括引脚311a、311b以及本体部分311c(可通电以发光)，引脚311a与第一部分411连接，引脚311b和第二部分412连接，从而使得第一灯珠311串联在第一信号线上。例如，第一连接部410可以设计为使得第一部分411和第二部分412的一部分覆盖第一凹槽111的一部分，从而保证第一部分411和第二部分412和第一凹槽111中的第一为信号线连接。
需要说明的是，在本公开的实施例中，第一连接部410的第一部分411和第二部分412可以跟第一灯珠的具体类型来设计，例如，对于常规的LED灯珠，第一连接部410的第一部分411和第二部分412可以设计为如图4所示的结构，即，第一部分411设计为类似“L”型，第二部分412设计为类似于矩形。
在本公开一些实施例提供的发光模组中，第一槽段分为第一类槽段和第二类槽段，第一类槽段的长度小于第二类槽段，多个第一类槽段呈现阵列排布以使得每行的第一类槽段形成为一个第一槽组，相邻的第一槽组之间设置一个第二类槽段，第二类槽段的两端通过第一连接部分别与相邻的第一槽组的端部连接。示例性的，如图4A所示，第一凹槽的第一槽段的长短不一致，第一槽段分为第一类槽段111a和第二类槽段111b，第一类槽段111a的长度小于第二类槽段111b，第一类槽段111a阵列排布为4行(行方向与X轴方向平行)和3列(列方向与Y轴方向平行)，每一行的单个第一类槽段111a形成为一个第一槽组，从而形成4个第一槽组，每相邻的第一槽组之间设置一个第二类槽段111b，相邻的第一槽组通过第二类槽段111b连接在一起，即，多个第一槽组(其中的第一类槽段111a)和多个第二类槽段111b交替排布且首尾相接以形成多级的“S”型。
在本公开另一些实施例提供的发光模组中，第一槽段呈现阵列排布以使得每行的第一槽 段形成为一个第一槽组，第一槽组的两端通过第一连接部分别与相邻的第一槽组的端部连接。示例性的，如图5所示，第一凹槽的第一槽段都为第一类槽段111a，第一类槽段111a阵列排布为4行(行方向与X轴方向平行)和3列(列方向与Y轴方向平行)，每一行的单个第一类槽段111a形成为一个第一槽组，从而形成4个第一槽组，4个第一槽组首尾相连在一起，即，多个第一槽组(其中的第一类槽段111a)首尾相接以形成多级的“S”型。
在本公开至少一个实施例中，发光模组还包括第二驱动电路层，第二驱动电路层位于基板的背离第一驱动电路层的一侧，且包括至少一条第二信号线。基板设置有至少一个第二通孔，第一信号线和第二信号线通过第二通孔连接，例如串联或者并联。在基板的背离第一灯珠的一侧设置与第一信号线连接的第二信号线，不需要将用于驱动第一灯珠的线路设置在基板的一侧，从而降低基板的设置有灯珠的一侧的线路占用面积；此外，如果该连接为并联，那么第一信号线和第二信号线连接在一起，相比于单独设置第一信号线，整体的电阻值变小，在驱动第一驱动电路层和第二驱动电路层以使得第一灯珠发光时，压耗降低，从而减小串联在一起的第一灯珠之间的亮度差异，以提高整个发光膜组出光的均匀度。
示例性，如图2或图3所示，在发光模组10中，第一驱动电路层210和第二驱动电路层220位于基板的两侧，第二驱动电路层220包括第二信号线221。基板100设置有第二通孔101，第一信号线211和第二信号线221通过第二通孔101实现连接。
需要说明的是，图2和图3为仅示出了发光模组10的部分结构的部分区域的截面图，在整个发光模组10中，基板100中设置有多个第二通孔101，以使得每条第一信号线211和对应的第二信号线221可以多点连接，即，每条第一信号线211和对应的第二信号线221实现并联。
需要说明的是，在本公开的实施例中，第二通孔的宽度可以小于、等于或者大于其所在的第一凹槽的宽度，不限于为如图2和图3所示设置形式。例如，在设置有第二通孔的区域，第一凹槽在此处的部分的尺寸大于位于其它区域的部分的尺寸，从而使得第二通孔具有较大的宽度，即，在第二通孔所在的位置，第一信号线的位于凹槽中的部分、填充在第二通孔中的导电材料(可以和第一信号线一体成型)形成了类似于接触垫的结构，通过具有相对较大的设计面积，以保证第一信号线、填充在第二通孔中的导电材料、第二信号线之间的对准，从而保证对一信号线和第二信号线之间的连接。
例如，在本公开的一些实施例中，第一凹槽由光刻方式形成的情况下，第一凹槽和第二通孔101可以在同一光刻工艺中形成，从而减少发光模组的制备工艺流程。例如，在基板100上形成第一凹槽111时，可以在基板100上沉积光刻胶，然后提供双色调掩膜板，即，该掩膜板包括第一透光区域和第二透光区域和遮光区域，第一透光区域的透光率大于第二透光区 域的透光率，第一透光区域和将要形成的第二通孔101的位置，而第二透光区域和将要形成的第一凹槽111(除了第二通孔101所在的位置)的位置对应；然后对光刻胶进行曝光、显影，光刻胶的与将要形成的第二通孔101的位置对应的部分被去除，光刻胶的与将要形成的第一凹槽111的位置对应的部分被减薄；然后以剩余的光刻胶为掩膜对基板100进行刻蚀，形成的第二通孔101的深度会大于第一凹槽111的深度。
在本公开的一些实施例中，可以参照第一驱动电路的方式来进一步设置第二驱动电路层。例如，可以将第二驱动电路层的第二信号线设置在凹槽中，第二信号线也可以设置为由多个子信号线连接形成，第二信号线以及用于限定第二信号线的凹槽的形状可以参照上述的第一信号线和由于限定第一信号线的第一凹槽的形状。下面，对该些实施例中的发光模组的结构进行说明。
在本公开至少一个实施例提供的发光模组中，基板还包括第二结构层。第二结构层位于衬底的背离第一结构层的一侧，第二结构的背离衬底的表面设置有至少一条第二凹槽，第二信号线位于第二凹槽中。将第二信号线嵌入在基板的第二凹槽中，使得第二信号线不会因暴露在基板之外而产生例如磨损等损坏，而且第二信号线的设置不会增加发光模组的设计厚度，有利于发光模组的轻薄化设计。示例性的，重新参见图2或图3，衬底100的背离第一驱动电路层210的表面上设置有第二结构层130，第二结构层130的背离衬底110的表面设置有第二凹槽112，第二信号线221位于该第二凹槽112中。
在本公开至少一个实施例提供的发光模组中，第二结构层包括多个层叠设置的第二子结构层，每个第二子结构层中设置有第二子凹槽。第二信号线包括分别位于第二子凹槽的多条第二子信号线，第二子结构层中设置有第三通孔，以使得多条第二子信号线通过第三通孔连接。通过将多个第二子结构层，将第二信号线设置为由彼此连接且位于不同层的第二子信号线构成，从而进一步增加了第二信号线的布置空间，以降低第二信号线在基板的横向方向上的占用面积，从而进一步降低第二信号线的电阻，并降低驱动第二灯珠发光时在第二信号线上产生的压降。在该实施例中，第二结构层以及第二信号线的设置方式可以上述图3所示实施例中关于第一结构层和第一信号线的设置方式，在此不做赘述。
在本公开至少一个实施例提供的发光模组中，发光模组还包括至少一个第二发光单元组，第二发光单元组位于基板的设置有第二驱动电路层的一侧，且包括串联在第二信号线上的至少一个第二灯珠。如此，可以使得发光模组的两侧都能够布置灯珠，以提高灯珠的布置密度，以提高发光膜组的整体发光亮度。示例性的，如图6所示，第二结构层130的背离衬底110的一侧设置有第二发光单元组320，第二发光单元组包括多个第二灯珠321。
在本公开至少一个实施例提供的发光模组中，第二凹槽包括间隔排布的多个第二槽段， 发光模组还包括多个第二连接部。第二连接部位于第二结构层上且位于相邻的第二槽段之间，每个第二连接部包括与相邻的第二槽段中的第二信号线分别连接的第三部分和第四部分。第三部分和第四部分彼此间隔，第二灯珠连接在第三部分和第四部分之间。示例性的，如图6或图7所示，第二凹槽112设置为由多个间隔排布的第二槽段形成，即，第二凹槽112断开为多个槽，每个槽都为一个第一槽段，第二连接部420的第三部分421和第四部分422分别连接不同的第一槽段，每一个第二灯珠321(或其用于与外部电路连接的部分)位于第三部分421和第四部分422之间。在该实施例中，第二灯珠321、第二连接部420的设置方式可以参见前述实施例中关于第一灯珠、第二连接部的相关说明，在此不做赘述。
在本公开的实施例中，衬底的材料可以为玻璃、有机玻璃、PET(聚对苯二甲酸乙二醇酯)、PMMA(聚甲基丙烯酸甲酯)、PI(聚酰亚胺)、CPI(透明聚酰亚胺)等，其厚度可以为25～250微米。第一、第二结构层的材料可以为紫外固化丙烯酸树脂等。
在本公开的实施例中，第一、第二灯珠可以为LED灯珠。
在本公开的实施例中，第一、第二连接部的材料可以为可焊接的导电材料，例如金属锡等。例如，第一、第二连接部的厚度可以为5～20微米。
在本公开一些实施例提供的发光模组中，第二槽段分为第三类槽段和第四类槽段，第三类槽段的长度小于第四类槽段，多个第三类槽段呈现阵列排布以使得每行的第三类槽段形成为一个第二槽组，相邻的第二槽组之间设置一个第四类槽段，第四类槽段的两端通过第二连接部分别与相邻的第二槽组的端部连接。该实施例中，第二凹槽及其中的第二槽段的排布方式可以参见图4A中关于第一凹槽及其中的第一槽段的排布方式，其中，该实施例中的第三类槽段和第四类槽段分别对应于图4A所示实施例中的第一类槽段和第二类槽段。
在本公开另一些实施例提供的发光模组中，第二槽段呈现阵列排布以使得每行的第二槽段形成为一个第二槽组，第二槽组的两端通过第一连接部分别与相邻的第二槽组的端部连接。该实施例中，第二凹槽及其中的第二槽段的排布方式可以参见图5中关于第一凹槽及其中的第一槽段的排布方式，其中，该实施例中的第三类槽段对应于图5所示实施例中的第一类槽段。
在本公开一些实施例提供的发光模组中，第二灯珠在基板所在面上的正投影和第一灯珠在基板所在面上的正投影重合。示例性的，如图6所示，第一灯珠311和第二灯珠321重叠设置。如此，第二灯珠321的设置并不会减少发光模组的整体透光率，有利于发光模组应用至透明显示领域。
在本公开至少一个实施例提供的发光模组中，第二灯珠在基板所在面上的正投影位于第一灯珠在基板所在面上的正投影的间隙之间。第二灯珠的光线可以透过第一灯珠的间隙出射， 从而使得发光膜组出射的光分布均匀。示例性的，如图7所示，第一灯珠311和第二灯珠321交错设置，从而使得第二灯珠321的直射光线(该光线整体趋向于和衬底所在面垂直)可以从第一灯珠311的间隙处出射，减少被第一灯珠311遮光的光线的出射量，相应地，增加发光模组10的出光亮度。
在本公开至少一个实施例提供的发光模组中，基板为透明基板。如此，可以使得第二灯珠出射的光线可以透过基板出射，以作为第一灯珠的辅助光源，从而增加发光模组的出光亮度。
例如，第一凹槽和第二凹槽均为网格状凹槽以使得第一信号线和第二信号线均为网格状结构。优选地，第一凹槽的第一连接部处的网格密度大于其他区域的网格密度，网格的单元形状为三角形、多变形、蜂窝状、随机网格等，具有较好的导电性能。
例如，在基板为透明基板的情况下，第一凹槽和第二凹槽为网格状凹槽以使得第一信号线和第二信号线为网格状结构，如此，可以使得第一信号线和第二信号线整体呈现为透光，从而提高基板的透光率，以提高出光亮度。
例如，在制备第一、第二信号线(或其包括的子信号线)时，可以先形成以整层的网格结构，然后对该网格结构进行划分以形成第一、第二信号线。例如，在第一、第二信号线形成凹槽中的情况下，可以将凹槽设计为网格状结构，以使得形成在凹槽中的第一、第二信号线呈现为网格形状。
需要说明的是，在对网格结构进行划分时，可以仅通过断开网格线的方式以获得第一、第二信号线(或者对该些信号线的凹槽)，即，相邻的第一信号线之间、相邻的第二信号线之间会保留残余的网格结构，该残余的网格结构并不参与信号线等元件的构成，从而充当为虚设区域，该些残余的网格结构可以使得基板整体的透光率均匀，从而提高基板出光的均匀性。
示例性的，如图4A和图4E所示，在第一信号线211的设计过程中，可以先设置如图4E所示的整面网格结构，然后沿着线P1、P2划分网格结构，网格结构的网格线在线P1和P2处断开，网格结构的位于线P1、P2之间的部分为第一信号线211，网格结构的位于线P1、P2之外的部分作为虚设部分。例如，在第一信号线211容纳在第一凹槽中的情况下，如图4E所示，第一凹槽实际同于容纳网格结构的网格线，相应地，虚设部分的网格线也由对应的第一凹槽容纳。需要说明的是，如图4E所示的结构可以应用至第一信号线211包括多条第一子信号线构成的情况。
在本公开的实施例中，第一、第二凹槽的截面形状可以为矩形，也可以为倒梯形。例如，在该截面形状为倒梯形的情况下，第一、第二凹槽的侧壁和底部相比是倾斜的(非平行且非 垂直)，梯形的底位于顶的背离衬底的一侧。例如，第一、第二凹槽的侧壁和底部的夹角为90°～120°之间。
在本公开的实施例中，第一凹槽和/或第二凹槽的深宽比(宽度为凹槽沿与其延伸方向垂直且与衬底所在面平行的方向上的尺寸)可以为大于或等于2.5，其中宽度范围可以为4～40微米，深度范围可以为10～100微米，比如为20微米。如此，通过将第一、第二信号线设置于第一、第二凹槽内，第一、第二凹槽具有较大的深宽比，从而有效降低了生产成本并提升了线路长期使用的稳定性。采用大于等于2.5的深宽比，且可将沟槽深度大于等于20μm，使得线路的阻抗非常低(方阻可达到2～8mΩ/□)，另可再结合第一、第二通孔的多层设计，从而具有较好的导电性能，可确保大面积高密度灯珠阵列设计的可行性。另外，使用第一、第二凹槽中形成第一、第二信号线可使用无基底或柔性基底(例如PET)，从而使发光模组呈现透明柔性，以方便用于透明显示，例如户外广告等，还可降低发光模组的整体厚度，应用范围更加广泛。
在本公开的实施例中，填充在第一、第二凹槽中的第一、第二信号线的厚度可以小于或等于第一、第二凹槽的深度。例如，第一、第二信号线的厚度可以为18～20微米。
在本公开的实施例中，第一、第二通孔的尺寸可以为50～300微米，例如为100、150、200、250微米等。
在本公开的实施例中，相邻的第一灯珠的间距和/或相邻的第二灯珠的间距可以根据实际工艺的需要进行设计，例如可以为200～2000微米。
在本公开的实施例中，在保证第一信号线和第二信号线导电的情况下，对证第一信号线和第二信号线的材料不做进一步限制，例如，该材料可以为金、银、铜、铁、镍、锡等金属或者金属合金。
例如，在本公开的实施例中，第二灯珠的背离基板的一侧可以设置反射层，以保证第二灯珠出射的光线都可以反射向第一灯珠，以提高发光模组的出光亮度。
例如，在本公开的实施例中，第一灯珠的背离基板的一侧，可以设置光学膜片，该光学膜片可以包括匀光片、扩散片等，该光学膜片可以使得光线分布均匀且可以使得光线取直(转换为线型光束，例如该线型光束的整体传输方向和基板所在面基本垂直)。
本公开至少一个实施例提供一种显示装置，该显示装置包括上述任一实施例中的发光模组。需要说明的是，在该显示装置中，发光模组可以直接显示图像，或者充当用于显示图像的装置的光源。
例如，在本公开一些实施例提供的显示装置中，第一灯珠(或者第一灯珠和第二灯珠)设置为可出射彩色光线。在该些实施例中，第一灯珠可以充当显示装置的子像素，多个子像 素可以组合为一个像素单元(可称为大像素或者显示单元)，在每个像素单元中，不同的第一灯珠设置为出射不同颜色的光线，以使得像素单元可以出射各种颜色的光线，进而使得显示装置具有彩色显示功能。例如，发光模组采用柔性透明基板，形成的显示装置为透明柔性显示装置，可设置于窗户等透明玻璃上，并适应玻璃形状，未通电时呈透明状，通电时具有显示功能，用于窗帘、广告等显示。
例如，在本公开另一些实施例提供的显示装置中，显示装置还包括显示层和匀光板，显示层与发光模组层叠设置，匀光板位于发光模组和显示层之间，从而使得发光模组出射的光线经过匀光板之后射入显示层。显示层为包括像素以具有显示功能的结构。例如，显示层可以为对发光模组出射的光进行控制以实现显示，例如为显示层包括液晶层以实现显示，此情况下显示层可以称为液晶显示面板或称为液晶显示模组，而发光模组作为液晶显示面板的光源模组，该光源模组可以作为前置光源或者背光源(背光模组)；或者，显示层还可以为由发光模组出射的光进行激发而进行显示的面板，例如显示层可以为量子点显示面板，显示层的各个像素区域设置有量子点，发光模组出射的光为短波长光线，经短波长的光线激发，量子点可以出射特定波长范围的光线，进一步设置不同类型的量子点，可以使得显示层出射不同颜色的光线。下面，以显示层包括液晶层为例，对本公开的显示装置的结构进行说明。
示例性的，如图8所示，发光模组10位于显示层20的背光侧，从而充当显示层20的背光模组。例如，该显示层20可以为液晶显示层。在该些实施例中，发光模组10为直下式背光模组。例如，显示装置还包括匀光板30，发光模组10面向匀光板30的主表面设置，且位于匀光板30的背离显示层20的一侧。例如，匀光板30可以包括扩散膜、棱镜膜等光学膜片，以使得发光模组10出射的光分散均匀并取直出射。例如，显示层20具体可以包括由阵列基板和对置基板构成的盒体结构，液晶层封装在阵列基板和对置基板之间，对置基板上设置有彩膜、偏光片(可选是否设置)等元件，阵列基板和发光模组之间设置偏光片。在包括上述结构的情况下，显示层20的进一步设计可以参见当前关于液晶显示的面板类结构(不包括光源模组结构)的相关设计，在此不作赘述。
在本公开的实施例中，显示层可以为一切需要背光源或者前置光源(在该情况下，显示层可以为附加光源的反射式显示层)的面板结构，而不限于为液晶显示层，具体可以参见当前的各类需要附加光源的显示面板，在此不做限制。
在本公开的实施例中，显示装置可以为广告牌、售卖机、电视、数码相机、手机、手表、平板电脑、笔记本电脑、导航仪等任何具有显示功能的产品或者部件。
以上所述仅为本申请的较佳实施例而已，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换等，均应包含在本申请的保护范围之内。

Claims (16)

  1. 一种发光模组，包括：
    基板，其表面上设置有至少一条第一凹槽；
    第一驱动电路层，位于所述基板上且包括至少一条位于所述第一凹槽中的第一信号线；以及
    至少一个第一发光单元组，位于所述基板的设置有所述第一驱动电路层的一侧，且包括至少一个第一灯珠，所述第一灯珠串联在所述第一信号线上。
  2. 根据权利要求1所述的发光模组，其中，所述基板还包括：
    衬底；以及
    第一结构层，位于所述衬底的一侧，所述第一凹槽形成在所述第一结构层中且位于所述第一结构层的背离所述衬底的一侧。
  3. 根据权利要2所述的发光模组，
    所述第一结构层包括多个层叠设置的第一子结构层，每个所述第一子结构层中设置有第一子凹槽；
    所述第一信号线包括分别位于所述第一子凹槽的多条第一子信号线，所述第一子结构层中设置有第一通孔，以使得多条所述第一子信号线通过所述第一通孔串联或者并联。
  4. 根据权利要2所述的发光模组，其中，所述第一凹槽包括间隔排布的多个第一槽段，所述发光模组还包括：
    多个第一连接部，位于所述第一结构层上且位于相邻的所述第一槽段之间，每个所述第一连接部包括与相邻的所述第一槽段中的第一信号线分别连接的第一部分和第二部分；
    其中，所述第一部分和所述第二部分彼此间隔，所述第一灯珠连接在所述第一部分和所述第二部分之间。
  5. 根据权利要4所述的发光模组，
    所述第一槽段分为第一类槽段和第二类槽段，所述第一类槽段的长度小于所述第二类槽段，多个所述第一类槽段呈现阵列排布以使得每行的所述第一类槽段形成为一个第一槽组，相邻的所述第一槽组之间设置一个所述第二类槽段，所述第二类槽段的两端通过所述第一连接部分别与相邻的所述第一槽组的端部连接；或者
    所述第一槽段呈现阵列排布以使得每行的所述第一槽段形成为一个第一槽组，所述第一槽组的两端通过所述第一连接部分别与相邻的所述第一槽组的端部连接。
  6. 根据权利要2-5中任一项所述的发光模组，还包括：
    第二驱动电路层，位于所述基板的背离所述第一驱动电路层的一侧，且包括至少一条第二信号线；
    其中，所述基板设置有至少一个第二通孔，所述第一信号线和所述第二信号线通过所述第二通孔连接。
  7. 根据权利要6所述的发光模组，其中，所述基板还包括：
    第二结构层，位于所述衬底的背离所述第一结构层的一侧；
    其中，所述第二结构的背离所述衬底的表面设置有至少一条第二凹槽，所述第二信号线位于所述第二凹槽中，以及
    所述基板设置有至少一个第二通孔，所述第一信号线和所述第二信号线通过所述第二通孔连接。
  8. 根据权利要7所述的发光模组，
    所述第二结构层包括多个层叠设置的第二子结构层，每个所述第二子结构层中设置有第二子凹槽；
    所述第二信号线包括分别位于所述第二子凹槽的多条第二子信号线，所述第二子结构层中设置有第三通孔，以使得多条所述第二子信号线通过所述第三通孔串联或者并联。
  9. 根据权利要7或8所述的发光模组，还包括：
    至少一个第二发光单元组，位于所述基板的设置有所述第二驱动电路层的一侧，且包括串联在所述第二信号线上的至少一个第二灯珠。
  10. 根据权利要9所述的发光模组，其中，所述第二凹槽包括间隔排布的多个第二槽段，所述发光模组还包括：
    多个第二连接部，位于所述第二结构层上且位于相邻的所述第二槽段之间，每个所述第二连接部包括与相邻的所述第二槽段中的第二信号线分别连接的第三部分和第四部分；
    其中，所述第三部分和所述第四部分彼此间隔，所述第二灯珠连接在所述第三部分和所述第四部分之间。
  11. 根据权利要10所述的发光模组，
    所述第二槽段分为第三类槽段和第四类槽段，所述第三类槽段的长度小于所述第四类槽段，多个所述第三类槽段呈现阵列排布以使得每行的所述第三类槽段形成为一个第二槽组，相邻的所述第二槽组之间设置一个所述第四类槽段，所述第四类槽段的两端通过所述第二连接部分别与相邻的所述第二槽组的端部连接；或者
    所述第二槽段呈现阵列排布以使得每行的所述第二槽段形成为一个第二槽组，所述第二槽组的两端通过所述第一连接部分别与相邻的所述第二槽组的端部连接。
  12. 根据权利要9-11中任一项所述的发光模组，
    所述第二灯珠在所述基板所在面上的正投影和所述第一灯珠在所述基板所在面上的正投影重合；或者
    所述第二灯珠在所述基板所在面上的正投影位于所述第一灯珠在所述基板所在面上的正投影的间隙之间。
  13. 根据权利要9-12中任一项所述的发光模组，
    所述基板为透明基板，所述第一凹槽和所述第二凹槽为网格状凹槽以使得所述第一信号线和所述第二信号线为网格状结构。
  14. 一种显示装置，包括权利要求1-13中任一项所述的发光模组。
  15. 根据权利要求14所述的显示装置，
    所述发光模组中的第一灯珠设置为可出射彩色光线。
  16. 根据权利要求14或15所述的显示装置，还包括：
    匀光板；以及
    显示层，与所述匀光板重叠设置；
    其中，所述发光模组配置为使得出射的光线经过所述匀光板后射入所述显示层。
PCT/CN2022/114760 2021-08-27 2022-08-25 发光模组和显示装置 WO2023025240A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US18/526,974 US20240113135A1 (en) 2021-08-27 2023-12-01 Light-emitting module and display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110998521.0 2021-08-27
CN202110998521.0A CN115911235A (zh) 2021-08-27 2021-08-27 发光模组和显示装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/526,974 Continuation US20240113135A1 (en) 2021-08-27 2023-12-01 Light-emitting module and display device

Publications (1)

Publication Number Publication Date
WO2023025240A1 true WO2023025240A1 (zh) 2023-03-02

Family

ID=85322442

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/114760 WO2023025240A1 (zh) 2021-08-27 2022-08-25 发光模组和显示装置

Country Status (3)

Country Link
US (1) US20240113135A1 (zh)
CN (1) CN115911235A (zh)
WO (1) WO2023025240A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140293148A1 (en) * 2013-03-30 2014-10-02 Shenzhen O-Film Tech Co., Ltd. Conductive film, method for making the same, and touch screen including the same
WO2014153898A1 (zh) * 2013-03-28 2014-10-02 南昌欧菲光科技有限公司 透明导电膜及其制备方法
CN110265460A (zh) * 2019-06-27 2019-09-20 京东方科技集团股份有限公司 Oled显示基板及其制作方法、显示装置
CN216389422U (zh) * 2021-08-27 2022-04-26 昇印光电（昆山）股份有限公司 发光模组和显示装置
CN216389423U (zh) * 2021-08-27 2022-04-26 昇印光电（昆山）股份有限公司 发光模组和显示装置
CN216958026U (zh) * 2021-12-28 2022-07-12 昇印光电（昆山）股份有限公司 一种复合基底Mini LED背光模组

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014153898A1 (zh) * 2013-03-28 2014-10-02 南昌欧菲光科技有限公司 透明导电膜及其制备方法
US20140293148A1 (en) * 2013-03-30 2014-10-02 Shenzhen O-Film Tech Co., Ltd. Conductive film, method for making the same, and touch screen including the same
CN110265460A (zh) * 2019-06-27 2019-09-20 京东方科技集团股份有限公司 Oled显示基板及其制作方法、显示装置
CN216389422U (zh) * 2021-08-27 2022-04-26 昇印光电（昆山）股份有限公司 发光模组和显示装置
CN216389423U (zh) * 2021-08-27 2022-04-26 昇印光电（昆山）股份有限公司 发光模组和显示装置
CN216958026U (zh) * 2021-12-28 2022-07-12 昇印光电（昆山）股份有限公司 一种复合基底Mini LED背光模组

Also Published As

Publication number Publication date
US20240113135A1 (en) 2024-04-04
CN115911235A (zh) 2023-04-04

Similar Documents

Publication Publication Date Title
TWI596406B (zh) 光導元件
US9625641B2 (en) Light guides
CN112670312A (zh) 显示装置
US20110051037A1 (en) Optical assembly, backlight unit, and display device
JP2013503431A (ja) バックライトユニット及びディスプレイ装置
KR20100024752A (ko) 프리즘 시트와 이를 구비한 액정표시장치
CN104421771A (zh) 发光二极管组件以及包括该组件的液晶显示装置
JPWO2009038072A1 (ja) 発光装置、表示装置、および発光装置の製造方法
JP4793191B2 (ja) 照明装置、液晶装置及び電子機器
JP2019091036A (ja) 異形液晶発光装置
JP2024518008A (ja) 発光基板及びその製造方法、表示装置
US8596848B2 (en) Liquid crystal display device, backlight and LED
KR20110022507A (ko) 광학 어셈블리, 그를 구비한 백라이트 유닛 및 디스플레이 장치
KR102123456B1 (ko) 액정표시장치
KR20110103729A (ko) 디스플레이 장치
WO2023173527A1 (zh) 混接显示装置以及拼接显示装置
CN216389423U (zh) 发光模组和显示装置
CN216389422U (zh) 发光模组和显示装置
JP4155274B2 (ja) 電気光学装置、電子機器及び照明装置
TWI798473B (zh) 發光裝置
WO2023025240A1 (zh) 发光模组和显示装置
GB2475510A (en) Light guides
WO2014185120A1 (ja) 照明装置、及び表示装置
KR101824037B1 (ko) 디스플레이 장치
CN114355657A (zh) 拼接显示面板及拼接显示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22860586

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE