CN114823365A - Chip injection molding device and method - Google Patents

Chip injection molding device and method Download PDF

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Publication number
CN114823365A
CN114823365A CN202110113777.9A CN202110113777A CN114823365A CN 114823365 A CN114823365 A CN 114823365A CN 202110113777 A CN202110113777 A CN 202110113777A CN 114823365 A CN114823365 A CN 114823365A
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CN
China
Prior art keywords
chip
injection molding
injection
coating liquid
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110113777.9A
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Chinese (zh)
Inventor
尹泰甲
杨红
杨涛
李俊杰
王文武
李俊峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institute of Microelectronics of CAS
Zhenxin Beijing Semiconductor Co Ltd
Original Assignee
Institute of Microelectronics of CAS
Zhenxin Beijing Semiconductor Co Ltd
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Filing date
Publication date
Application filed by Institute of Microelectronics of CAS, Zhenxin Beijing Semiconductor Co Ltd filed Critical Institute of Microelectronics of CAS
Priority to CN202110113777.9A priority Critical patent/CN114823365A/en
Publication of CN114823365A publication Critical patent/CN114823365A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds

Abstract

The invention provides a chip injection molding device and a method, wherein the injection molding device comprises: the injection molding device comprises a mold cover and a nozzle assembly, wherein the mold cover is used for being adhered to a chip structure to be injection molded, the chip structure to be injection molded comprises a substrate and a plurality of chips positioned on the substrate, the mold cover is provided with a plurality of grid structures matched with the number of the chips, each grid structure comprises a top wall and peripheral side walls surrounding the top wall, a cavity is formed inside each grid structure, the top wall of each grid structure is respectively provided with an opening, and when the mold cover is adhered to the chip structure to be injection molded, one chip is correspondingly accommodated in each cavity of each grid structure; the nozzle assembly includes a plurality of nozzles disposed in correspondence with the openings in the mold cover, each nozzle for injecting a coating liquid for injection molding into the cavities of the lattice structure through the corresponding opening. The invention can solve the problems of lead inclination and lead exposure in the injection molding process.

Description

Chip injection molding device and method
Technical Field
The invention relates to the technical field of semiconductors, in particular to a chip injection molding device and method.
Background
After the wafer is manufactured, a packaging process is performed. The packaging process is divided into a former process and a latter process. The former procedure mainly comprises wafer thinning, wafer cutting, chip pasting and lead welding, and the latter procedure mainly comprises injection molding, ball mounting and cutting. Wherein the injection molding (Mold) process is a process of completely sealing the chip and the leads using a sealing material.
Fig. 1 shows a conventional chip injection molding process flow. Fig. 1(a) shows an apparatus for injection molding, in which, as shown in fig. 1(b), a semi-finished product 500 having completed a previous process is placed between Bottom Chase (Bottom groove 1002) and Top Chase (Top frame 1001), then, as shown in fig. 1(c), Top Chase (1001) and Bottom Chase (1002) are closed, sealing material 1004 is heated to change sealing material 1004 from a solid state to a liquid state, then, as shown in fig. 1(d), piston 1003 applies pressure to squeeze sealing material 1004 in the liquid state, and when sealing material 1004 is hardened again, the injection molding process is completed.
In the prior art injection molding process, referring to fig. 2 and fig. 3, wherein fig. 3 is a partially enlarged view of the a chip marked in fig. 2, as shown in fig. 2, when a piston 1003 pushes a liquefied sealing material 1004 at a high pressure, the sealing material 1004 is forced into the direction of the arrow by the pressure. At this time, the wires may be sagged (tilted or inclined) under pressure, which may cause Short circuit (Short) between the wires. In addition, in the Wire Bond (Wire Bond) process, if the height of the lead exceeds a set value as shown in fig. 4, the lead may be exposed to the outside of the sealing material using the existing injection molding process. The above problems all cause poor products. Therefore, it is necessary to provide a new injection molding method to solve the problems of lead inclination and lead exposure in the injection molding process.
Disclosure of Invention
In order to solve the problems, the invention provides a chip injection molding device and a chip injection molding method, which can solve the problems of lead inclination and lead exposure in an injection molding process.
In a first aspect, the present invention provides a chip injection molding apparatus, comprising:
the die cover is used for being bonded to a chip structure to be injection-molded, the chip structure to be injection-molded comprises a substrate and a plurality of chips positioned on the substrate, the die cover is provided with a plurality of grid structures matched with the number of the chips, each grid structure comprises a top wall and peripheral side walls surrounding the top wall, a cavity is formed inside each grid structure, the top wall of each grid structure is provided with one or more openings, and when the die cover is bonded to the chip structure to be injection-molded, one chip is correspondingly accommodated in each grid structure cavity;
and the nozzle assembly comprises a plurality of nozzles which are arranged corresponding to the openings on the mold cover, and each nozzle is used for injecting coating liquid for injection molding into the cavities of the lattice structure through the corresponding opening.
Optionally, an adhesive is attached to the bottom of the lattice of the mold cap.
In a second aspect, the present invention provides a chip injection molding method, which is implemented by applying the chip injection molding apparatus provided in the first aspect, and the method includes:
coating adhesive on the bottom of the lattice structure of the mold cover;
bonding the die cover coated with the bonding agent to a chip structure substrate to be injection-molded, so that the die cover and the chip structure to be injection-molded are bonded into a whole, and a chip is arranged in a cavity of each lattice structure;
injecting a coating liquid into the cavities of the lattice structure through the openings in the mold cap using a nozzle assembly until the cavities are filled;
and removing the nozzle assembly and waiting for the coating liquid to harden.
Optionally, the method further comprises:
and after the coating liquid is hardened, carrying out planarization treatment on the surface of the mold cover.
Optionally, the coating liquid is an epoxy resin.
In a third aspect, the present invention provides a chip packaging method, including:
performing a front-end process on the manufactured wafer, wherein the front-end process comprises wafer thinning, wafer cutting, chip pasting and lead welding to obtain a chip structure to be subjected to injection molding, and the chip structure to be subjected to injection molding comprises a substrate and a plurality of chips positioned on the substrate;
coating adhesive on the bottom of the lattice structure of the mold cover;
bonding the die cover coated with the bonding agent to a chip structure substrate to be injection-molded, so that the die cover and the chip structure to be injection-molded are bonded into a whole, and a chip is arranged in a cavity of each lattice structure;
injecting a coating liquid into the cavities of the lattice structure through the openings in the mold cap using a nozzle assembly until the cavities are filled;
removing the nozzle assembly and waiting for the coating liquid to harden;
after the coating liquid is hardened, carrying out planarization treatment on the surface of the mold cover;
after planarization, the chip structure is ball-mounted and cut into individual packages.
By applying the chip injection molding device and the method provided by the invention, the pre-molded die cover is adhered to the chip structure which is welded with the lead, and the coating liquid is injected into the cavity of the die cover through the nozzle assembly and is hardened. In addition, the cavity of the die cover is filled with the coating liquid, so that the problem of lead exposure is avoided.
Drawings
FIG. 1 is a schematic view of a conventional chip injection molding process;
FIG. 2 is a schematic diagram of an extruded lead in a prior art injection molding process;
FIG. 3 is a schematic diagram of the chip A marked in FIG. 2 showing a short circuit;
FIG. 4 is a schematic view of a lead exposed in a prior art injection molding process;
FIG. 5 is a schematic diagram of a chip structure obtained through a previous process;
FIG. 6 is a schematic cross-sectional view of a mold cap according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a die cup bonded to a die structure according to an embodiment of the present invention;
FIG. 8 is a schematic view of a nozzle assembly of an embodiment of the present invention inserted into an opening of a mold cap;
FIG. 9 is a schematic view of a nozzle assembly for injecting a coating liquid, to which an embodiment of the present invention is applied;
FIG. 10 is a schematic view of a chip structure after hardening of the coating liquid;
FIG. 11 is a schematic diagram of a chip structure after planarization of the mold cap surface;
FIG. 12 is a schematic diagram of a chip structure after ball mounting;
fig. 13 is a schematic diagram of a chip structure after dicing.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, but it should be understood that the descriptions are only illustrative and are not intended to limit the scope of the present disclosure. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
Various structural schematics according to embodiments of the present disclosure are shown in the figures. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of various regions, layers, and relative sizes and positional relationships therebetween shown in the drawings are merely exemplary, and deviations may occur in practice due to manufacturing tolerances or technical limitations, and a person skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions, as actually required.
In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present. In addition, if a layer/element is "on" another layer/element in one orientation, then that layer/element may be "under" the other layer/element when the orientation is reversed.
The embodiment of the invention provides a chip injection molding device, which comprises a mold cover 200 and a nozzle assembly 300, wherein the mold cover 200 is used for being bonded to a chip structure 100 to be injection molded to form an injection molding mold. Fig. 5 shows a chip structure 100 to be injection molded, which includes a substrate 101 and a plurality of chips 102 on the substrate 101, and the chip structure is a semi-finished product obtained after a previous process.
Fig. 6 shows a schematic sectional structure of the mold cap 200. Fig. 7 shows the structure after the mold cap 200 is bonded to the chip structure 100. The mold cap 200 has a plurality of lattice structures matching the number of chips, each lattice structure includes a top wall and a peripheral side wall surrounding the top wall, a cavity 201 is formed inside each lattice structure, one or more openings 202 are respectively formed on the top wall of each lattice structure, only one opening is shown in the figure, and when the mold cap 200 is adhered to the chip structure 100 to be injection-molded, a chip is correspondingly accommodated in each cavity of the lattice structure. Further, an adhesive 203 is attached to the bottom of the lattice structure of the mold cap.
Fig. 8 shows the nozzle assembly 300 inserted into the opening of the mold cap 200, the nozzle assembly 300 comprising a plurality of nozzles arranged in correspondence with the openings 202 of the mold cap, each nozzle being adapted to inject a coating liquid for injection molding into the cavities of the lattice-like structure through the corresponding opening 202. The coating liquid is hardened after the cavity is filled with the coating liquid, and the injection molding process is completed.
Based on the chip injection molding device provided by the embodiment, the embodiment of the invention provides a chip injection molding method, which comprises the following steps:
at step 101, which may be seen in FIG. 6, an adhesive is applied to the bottom of the lattice structure of the mold cap.
Step 102, referring to fig. 7, the mold cover coated with the adhesive is bonded to the substrate of the chip structure to be injection molded, so that the mold cover and the chip structure to be injection molded are bonded into a whole, and one chip is located in each cavity of the lattice structure.
Step 103, which may be seen in fig. 8-9, is to inject a coating solution 400 into the cavities of the lattice through the openings in the mold cap using a nozzle assembly until the cavities are filled. In this embodiment, the coating liquid 400 may be an epoxy resin. The pressure applied by the nozzle is also small, and only the pressure of the common syringe is needed.
Step 104, referring to fig. 10, the nozzle assembly is removed and the coating solution 400 is allowed to harden.
In step 105, referring to fig. 11, after the coating liquid is hardened, the surface of the mold cover is planarized such that the coating liquid exposed at the openings of the mold cover is flush with the surface of the mold cover.
According to the chip injection molding method provided by the embodiment of the invention, the pre-molded die cover is adhered to the chip structure which is welded with the lead, and the coating liquid is injected into the cavity of the die cover through the nozzle assembly and is hardened. In addition, the cavity of the die cover is filled with the coating liquid, so that the problem of lead exposure is avoided. In addition, compared with the existing injection molding equipment, the injection molding device has the advantages of small volume, light weight, stability in the aspect of safety and relatively low price.
Further, an embodiment of the present invention further provides a chip packaging method, which specifically includes:
step 201, performing a front-end process on the manufactured wafer, including wafer thinning, wafer cutting, chip pasting and lead welding, to obtain a chip structure to be injection-molded, where the chip structure to be injection-molded includes a substrate and a plurality of chips located on the substrate. The structure of the chip to be injection molded can be referred to fig. 5.
At step 202, an adhesive is applied to the bottom of the lattice structure of the mold cap.
Step 203, adhering the mold cover coated with the adhesive to the chip structure substrate to be injection-molded, so that the mold cover and the chip structure to be injection-molded are adhered into a whole, and a chip is arranged in each cavity of the lattice structure. The bonded structure can be referred to fig. 7.
At step 204, referring to fig. 8-9, a nozzle assembly is used to inject a coating fluid 400 through the openings in the mold cap into the cavities of the lattice until the cavities are filled. In this embodiment, the coating liquid 400 may be an epoxy resin. The epoxy itself is opaque and is instead translucent for ease of illustration. The pressure applied by the nozzle is also small, and only the pressure of the common syringe is needed.
Referring to FIG. 10, the nozzle assembly is removed and the coating solution is allowed to harden, step 205.
In step 206, referring to fig. 11, after the coating liquid is hardened, the surface of the mold cap is planarized.
Step 207, after the planarization treatment, the chip structure is subjected to ball mounting and is cut into independent packages. The chip structure after ball mounting can refer to fig. 12, and the chip structure after cutting can refer to fig. 13.
The chip packaging method provided by the embodiment of the invention adopts a novel injection molding method, the pre-molded die cover is adhered to the chip structure which is welded with the lead, and the coating liquid is injected into the cavity of the die cover through the nozzle assembly and is hardened. In addition, the cavity of the die cover is filled with the coating liquid, so that the problem of lead exposure is avoided.
In the above description, the technical details of patterning, etching, and the like of each layer are not described in detail. It will be appreciated by those skilled in the art that layers, regions, etc. of the desired shape may be formed by various technical means. In addition, in order to form the same structure, those skilled in the art can also design a method which is not exactly the same as the method described above. In addition, although the embodiments are described separately above, this does not mean that the measures in the embodiments cannot be used in advantageous combination.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (6)

1. A chip injection molding apparatus, comprising:
the die cover is used for being bonded to a chip structure to be injection-molded, the chip structure to be injection-molded comprises a substrate and a plurality of chips positioned on the substrate, the die cover is provided with a plurality of grid structures matched with the number of the chips, each grid structure comprises a top wall and peripheral side walls surrounding the top wall, a cavity is formed inside each grid structure, the top wall of each grid structure is provided with one or more openings, and when the die cover is bonded to the chip structure to be injection-molded, one chip is correspondingly accommodated in each grid structure cavity;
and the nozzle assembly comprises a plurality of nozzles which are arranged corresponding to the openings on the mold cover, and each nozzle is used for injecting coating liquid for injection molding into the cavity of the lattice structure through the corresponding opening.
2. The apparatus of claim 1, wherein an adhesive is attached to the bottom of the lattice of the mold cap.
3. A chip injection molding method, which is implemented by using the chip injection molding apparatus according to claim 1, the method comprising:
coating adhesive on the bottom of the lattice structure of the mold cover;
bonding the die cover coated with the bonding agent to a chip structure substrate to be injection-molded, so that the die cover and the chip structure to be injection-molded are bonded into a whole, and a chip is arranged in a cavity of each lattice structure;
injecting a coating liquid into the cavities of the lattice structure through the openings in the mold cap using a nozzle assembly until the cavities are filled;
and removing the nozzle assembly and waiting for the coating liquid to harden.
4. The method of claim 3, further comprising:
and after the coating liquid is hardened, carrying out planarization treatment on the surface of the mold cover.
5. The method of claim 3, wherein the coating liquid is an epoxy resin.
6. A method of chip packaging, comprising:
performing a front-end process on the manufactured wafer, wherein the front-end process comprises wafer thinning, wafer cutting, chip pasting and lead welding to obtain a chip structure to be subjected to injection molding, and the chip structure to be subjected to injection molding comprises a substrate and a plurality of chips positioned on the substrate;
coating adhesive on the bottom of the lattice structure of the mold cover;
bonding the die cover coated with the bonding agent to a chip structure substrate to be injection-molded, so that the die cover and the chip structure to be injection-molded are bonded into a whole, and a chip is arranged in a cavity of each lattice structure;
injecting a coating liquid into the cavities of the lattice structure through the openings in the mold cap using a nozzle assembly until the cavities are filled;
removing the nozzle assembly and waiting for the coating liquid to harden;
after the coating liquid is hardened, carrying out planarization treatment on the surface of the mold cover;
after planarization, the chip structure is ball-mounted and cut into individual packages.
CN202110113777.9A 2021-01-27 2021-01-27 Chip injection molding device and method Pending CN114823365A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110113777.9A CN114823365A (en) 2021-01-27 2021-01-27 Chip injection molding device and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110113777.9A CN114823365A (en) 2021-01-27 2021-01-27 Chip injection molding device and method

Publications (1)

Publication Number Publication Date
CN114823365A true CN114823365A (en) 2022-07-29

Family

ID=82524406

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110113777.9A Pending CN114823365A (en) 2021-01-27 2021-01-27 Chip injection molding device and method

Country Status (1)

Country Link
CN (1) CN114823365A (en)

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