CN114803145A - Spring carrier tape and PCB production method applying same - Google Patents
Spring carrier tape and PCB production method applying same Download PDFInfo
- Publication number
- CN114803145A CN114803145A CN202210530716.7A CN202210530716A CN114803145A CN 114803145 A CN114803145 A CN 114803145A CN 202210530716 A CN202210530716 A CN 202210530716A CN 114803145 A CN114803145 A CN 114803145A
- Authority
- CN
- China
- Prior art keywords
- spring
- carrier tape
- springs
- pcb
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D73/00—Packages comprising articles attached to cards, sheets or webs
- B65D73/02—Articles, e.g. small electrical components, attached to webs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
The application relates to the technical field of PCB production, in particular to a spring carrier tape and a PCB production method using the same, and the common technical key points of the two schemes are as follows: place into in proper order with single spring in the storage tank of carrier band body, borrow this and distinguish the spring list in proper order to glue the adhesion splicing on the spring surface, make external equipment can be with the help of inhaling the accurate connection piece that snatchs of claw, and then realize snatching the accurate spacing of spring, promote the production yields of follow-up PCB in spring welding process.
Description
Technical Field
The application relates to the technical field of PCB production, in particular to a spring carrier tape and a PCB production method using the same.
Background
The PCB, which is called a printed circuit board in chinese, is an important electronic component, a support for electronic components, and a carrier for electrical interconnection of electronic components.
In the application process of the PCB, an important link is installation of the touch key, the spring needs to be welded on the PCB at a fixed point in advance in the process, but when the spring is welded by the existing automatic equipment, the spring is small in size, so that the manipulator is difficult to distinguish and grab the spring individually when grabbing the spring, and the defective rate is high.
Disclosure of Invention
To the not enough of above-mentioned prior art, the first purpose of this application provides a spring carrier band, and external equipment can be with the help of inhaling the accurate connection piece that snatchs of claw, and then realizes snatching the accurate spacing of spring, promotes the production yields of follow-up PCB in spring welding process.
The first purpose of the application is realized by the following technical scheme: a spring carrier tape comprises a carrier tape body and springs arranged in the carrier tape, wherein a plurality of accommodating grooves used for accommodating the single springs are uniformly distributed in the carrier tape body, and connecting pieces are adhered to the surfaces of the springs.
Preferably, the connecting piece is Mylar.
Preferably, the inner diameter of the accommodating groove is gradually decreased along the direction far away from the carrier tape body, an expansion opening is formed at the opening of the accommodating groove, and the expansion opening is arranged in a cross shape.
Preferably, a cover film for covering the accommodating groove is adhered to the surface of the carrier tape body.
Preferably, the side edge of the carrier tape body is provided with a plurality of through holes which are uniformly distributed.
In view of the above-mentioned deficiencies of the prior art, a second object of the present application is to provide a PCB manufacturing method using the spring carrier tape, so as to improve the production efficiency of PCB soldered springs.
The second purpose of the application is realized by the following technical scheme: a PCB production method using a spring carrier tape comprises the following steps:
s1, placing the carrier tape body along the conveyor belt;
s2, the suction claw sucks the connecting sheet, takes out the spring positioned in the containing groove and delivers the spring to the welding point of the PCB;
and S3, after the welding of the springs at the welding points is completed, returning the suction claws to the carrier tape body on the conveying belt, so as to weld the springs next time, and performing the previous operation in a reciprocating cycle.
Preferably, in the S1 step, the conveyor belt is intermittently transported at equal intervals.
Preferably, in the step S3, the suction claw tears off the connecting piece stuck on the spring after the welding is completed, during the process that the suction claw returns to the conveyor belt.
To sum up, the beneficial effect that this application has:
1. the single springs are sequentially placed into the containing grooves of the carrier tape body, so that the springs are sequentially separated, and the splicing pieces are adhered to the surfaces of the springs, so that the external equipment can accurately grab the splicing pieces by means of the suction claws, further accurate limiting grabbing of the springs is realized, and the production yield of the subsequent PCB in the spring welding process is improved;
2. the carrier band body is placed on the conveyor belt, the suction claws suck the connecting pieces, the springs located in the accommodating grooves are taken out and delivered to the welding points of the PCB, after the springs are welded at the welding points, the suction claws return to the carrier band body on the conveyor belt, the springs are welded next time, and the operation is circulated repeatedly, so that the traditional manual single-spring one-to-one welding mode is replaced, and the production efficiency of the PCB welding springs is improved.
Drawings
FIG. 1 is a schematic perspective view of an embodiment of the present application;
fig. 2 is a schematic winding diagram of an embodiment of the present application.
Reference numerals: 1. a carrier tape body; 11. a spring; 12. a containing groove; 13. connecting sheets; 14. an expansion port; 15. and a through hole.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, refer to an orientation or positional relationship illustrated in the drawings for convenience in describing the present application and to simplify description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
The first embodiment is as follows: a spring carrier band, see figure 1, comprises a carrier band body 1 and springs 11 arranged in the carrier band, wherein a plurality of accommodating grooves 12 for accommodating the single springs 11 are uniformly distributed on the carrier band body 1, and connecting sheets 13 are adhered to the surfaces of the springs 11.
Place into in proper order single spring 11 in the storage tank 12 of carrier band body 1, borrow this to distinguish spring 11 is single in proper order, and glue adhesion splicing 13 on spring 11 surface for external equipment can be with the help of inhaling the accurate connection piece 13 that snatchs of claw, and then realizes snatching spring 11 accurate spacing, promotes the production yields of follow-up PCB in spring 11 welding process.
Specifically, the connecting sheet 13 is a mylar sheet. The connecting sheet 13 adopted in the embodiment is Mylar, so that the Mylar is convenient to adhere and low in production cost.
Specifically, the inner diameters of the accommodating grooves 12 decrease gradually in the direction away from the carrier tape body 1, the opening of the accommodating groove 12 is provided with an expansion port 14, and the expansion port 14 is arranged in a cross shape.
The inner diameter of the containing groove 12 is gradually decreased along the direction far away from the carrier tape body 1, and the containing groove is formed according to the shape of the spring 11, so that the spring 11 can be conveniently placed, and the arrangement of the expansion port 14 reserves a space for external equipment when grabbing the spring 11.
Specifically, a cover film for covering the accommodating groove 12 is adhered to the surface of the carrier tape body 1. After the springs 11 are placed in the accommodating grooves 12 of the carrier tape body 1, in order to facilitate the transportation of the carrier tape body 1, film sealing treatment needs to be performed on the surface of the carrier tape body 1.
Specifically, the side of the carrier tape body 1 is provided with a plurality of through holes 15 which are uniformly distributed. The arrangement of the through hole 15 enables the film tearing to be smoother and more convenient.
Referring to fig. 2, the spring 11 carrier tape of the present embodiment can be wound up by a reel for placement.
Example two: a PCB production method using the spring 11 carrier tape comprises the following steps:
s1, placing the carrier tape body 1 along the conveyor belt;
s2, the suction claw sucks the connecting sheet 13, takes out the spring 11 in the containing groove 12 and delivers the spring to the welding point of the PCB;
and S3, after the welding of the spring 11 at the welding point is completed, returning the suction claw to the carrier tape body 1 on the conveying belt, so as to weld the spring 11 next time, and repeating the previous operation.
The carrier band body 1 is placed on a conveying belt which is transported intermittently at equal intervals, the suction claws suck the connecting pieces 13, the springs 11 located in the containing grooves 12 are taken out and delivered to the welding points of the PCB, after the springs 11 are welded at the welding points, the suction claws return to the carrier band body 1 on the conveying belt, and in the process that the suction claws return to the conveying belt, the suction claws tear the connecting pieces 13 which are stuck on the welded springs 11, so that the springs 11 are welded next time, and the operation is circulated repeatedly, so that the traditional manual one-to-one welding mode of the single springs 11 is replaced, and the production efficiency of the PCB welding springs 11 is improved.
The above-mentioned embodiments are merely illustrative and not restrictive, and those skilled in the art can make modifications to the embodiments without inventive contribution as required after reading the present specification, but only protected by the patent laws within the scope of the claims of the present application.
Claims (8)
1. A spring carrier tape, characterized by: the spring carrier tape comprises a carrier tape body and springs arranged in the carrier tape, wherein a plurality of accommodating grooves used for accommodating the single springs are uniformly distributed in the carrier tape body, and connecting pieces are adhered to the surfaces of the springs.
2. The spring loaded tape of claim 1 wherein: the connecting piece is Mylar.
3. The spring loaded tape of claim 1 wherein: the inner diameter of the containing groove is gradually decreased along the direction far away from the carrier tape body, an expansion opening is formed in the opening of the containing groove, and the expansion opening is arranged in a cross shape.
4. The spring loaded tape of claim 1 wherein: and a covering film for covering the accommodating groove is adhered to the surface of the carrier tape body.
5. The spring loaded tape of claim 4 wherein: the side of the carrier band body is provided with a plurality of through holes which are uniformly distributed.
6. A PCB production method using the spring carrier tape of claim 1, wherein: comprises that
S1, placing the carrier tape body along the conveyor belt;
s2, the suction claw sucks the connecting sheet, takes out the spring positioned in the containing groove and delivers the spring to the welding point of the PCB;
and S3, after the welding of the springs at the welding points is completed, returning the suction claws to the carrier tape body on the conveying belt, so as to weld the springs next time, and performing the previous operation in a reciprocating cycle.
7. A method of manufacturing a PCB according to claim 6 wherein: in the step S1, the conveyor belt is intermittently transported at equal intervals.
8. A method of manufacturing a PCB according to claim 6 wherein: and in the step S3, in the process that the suction claw returns to the conveying belt, the suction claw tears off the connecting sheet stuck on the spring after welding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210530716.7A CN114803145A (en) | 2022-05-16 | 2022-05-16 | Spring carrier tape and PCB production method applying same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210530716.7A CN114803145A (en) | 2022-05-16 | 2022-05-16 | Spring carrier tape and PCB production method applying same |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114803145A true CN114803145A (en) | 2022-07-29 |
Family
ID=82515041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210530716.7A Pending CN114803145A (en) | 2022-05-16 | 2022-05-16 | Spring carrier tape and PCB production method applying same |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114803145A (en) |
-
2022
- 2022-05-16 CN CN202210530716.7A patent/CN114803145A/en active Pending
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