CN114800107A - Chip layer removal adjusting device and sample preparation method - Google Patents
Chip layer removal adjusting device and sample preparation method Download PDFInfo
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- CN114800107A CN114800107A CN202210736420.0A CN202210736420A CN114800107A CN 114800107 A CN114800107 A CN 114800107A CN 202210736420 A CN202210736420 A CN 202210736420A CN 114800107 A CN114800107 A CN 114800107A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
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Abstract
The invention relates to a chip layer removing adjusting device and a sample preparation method, and is characterized in that the chip layer removing adjusting device comprises: a base; the height adjusting piece is movably connected with the base and used for adjusting the height of the chip sample relative to the base; the chip sample clamping device comprises a position adjusting piece and a height adjusting piece, wherein the base is provided with a clamping surface, the clamping surface is opposite to one end of the position adjusting piece, a clamping space is formed between the position adjusting piece and the clamping surface, the clamping space is used for clamping a chip sample, and the position adjusting piece is used for adjusting the clamping position of the chip sample on the clamping surface. The distance between the position adjusting piece and the clamping surface of the base is adjusted, so that the size of the clamping space is adjusted, the clamping position of the chip sample on the clamping surface is adjusted, and the chip sample can be ground to a multi-layer section of a surface to be observed simultaneously when ground; through adjusting the height adjusting piece, realize the control regulation to chip sample volume of grinding every time, guarantee to grind the quality.
Description
Technical Field
The invention relates to the technical field of chip detection and analysis, in particular to a chip layer removal adjusting device and a sample preparation method.
Background
At present, semiconductor process is continuously shrinking, and advanced packaging technologies such as flip chip, wafer level packaging, and 3D packaging are inevitably selected to improve the functional density of the product. The microscopic analysis technology is used for failure analysis of the chip, and can help designers to find defects in chip processing and design through failure analysis work, the chip is generally required to be subjected to layer removal treatment, and instruments are used for observing and analyzing all surface layers and longitudinal sections of the chip so as to accurately position the defects of the chip. The advanced packaging chip has small packaging volume and high packaging density, and the conventional sample preparation technology including mechanical grinding, ion etching and chemical corrosion cannot prepare an observable interface of a chip sample with high coplanarity, so that the subsequent analysis period is prolonged, and the accuracy is reduced. Therefore, a chip layer removal adjusting device and a sample preparation method capable of improving the coplanarity of chip samples are needed, the observable interface of the chip is improved, and good samples are provided for failure analysis.
Disclosure of Invention
In view of the above, it is necessary to provide a chip delamination conditioning apparatus having high coplanarity and low defect rate, which addresses the problem of poor coplanarity in chip delamination processes.
A chip delamination conditioning apparatus, the chip delamination conditioning apparatus comprising:
a base;
the height adjusting piece is movably connected with the base and used for adjusting the height of the chip sample relative to the base;
the chip sample clamping device comprises a position adjusting piece, the position adjusting piece is connected with a height adjusting piece, wherein the base is provided with a clamping surface, the clamping surface is opposite to one end of the position adjusting piece, a clamping space is formed between the position adjusting piece and the clamping surface, the clamping space is used for clamping a chip sample, and the position adjusting piece is used for adjusting the clamping position of the chip sample on the clamping surface.
In one embodiment, the chip layer removing adjusting device further comprises a connecting plate, the base comprises an adjusting part mounting part, one end of the height adjusting part is movably connected with the adjusting part mounting part, and the other end of the height adjusting part is fixedly connected with the connecting plate; and/or the presence of a gas in the gas,
the position adjusting piece is movably connected with the connecting plate.
In one embodiment, the height adjusting piece is a first bolt, and the adjusting piece mounting part is in threaded connection with the height adjusting piece; and/or the presence of a gas in the gas,
the position adjusting pieces are at least two second bolts, the position adjusting pieces are arranged along the longitudinal direction of the connecting plate at intervals, and the position adjusting pieces are in threaded connection with the connecting plate.
In one embodiment, the chip delamination adjusting device further comprises a mounting plate, the base further comprises a clamping portion, the mounting plate is connected with one end, close to the clamping portion, of the position adjusting member, the clamping surface is arranged on the clamping portion, and the clamping surface and the mounting plate form the clamping space.
In one embodiment, the chip delaminating adjusting device further comprises a lining plate fixedly connected with one side of the mounting plate close to the clamping part.
In one embodiment, the liner plate is fixedly connected with the mounting plate by bonding and/or riveting.
In one embodiment, the chip delaminating apparatus further comprises a grinder provided with a grinding table opposite to the holding space, the grinder grinding the surface to be observed of the chip sample.
A method of preparing a master sample, comprising the steps of:
grinding and removing a first solder ball connected with the bottom of the packaging substrate;
carrying out layered grinding to remove the copper-clad plate of the packaging substrate until a second solder ball connected with the bottom of the chip is exposed;
mounting the chip on a chip layer removal adjusting device, and adjusting the verticality of the chip through a position adjusting piece;
the grinding amount of the chip is adjusted through the height adjusting piece;
grinding the surface to be observed of the chip;
and polishing the surface to be observed.
In one embodiment, the amount of grinding is 0.05mm to 4 mm.
In one embodiment, the surface to be observed is a side surface or a cross section of the chip sample.
According to the chip layer removing adjusting device, the chip sample is stably clamped in the clamping space through the matched clamping of the position adjusting piece and the clamping surface of the base, the size of the clamping space is adjusted and the clamping position of the chip sample on the clamping surface is adjusted through adjusting the distance between the position adjusting piece and the clamping surface of the base, so that the chip sample is reliably clamped, the multilayer section of the surface to be observed can be ground simultaneously when the chip sample is ground, and the coplanarity is improved; through height-adjusting member, can adjust the chip sample for the height of base, realize the control regulation to chip sample grinding volume at every turn, guarantee to wait to observe the grinding quality at interface to chip sample. Above-mentioned chip delaminating adjusting device can improve the coplanarity to the chip sample grinding, reduces chip sample defect rate, provides good sample for follow-up failure analysis, effectively shortens analysis cycle, improves the analysis rate of accuracy.
Drawings
FIG. 1 is a schematic diagram illustrating an overall structure of a chip delamination conditioning apparatus according to an embodiment;
FIG. 2 is a schematic view of an embodiment of a wafer polishing process;
FIG. 3 is a schematic flow chart of a sample preparation method according to an embodiment;
FIG. 4 is a schematic diagram illustrating a first state of a chip de-layering in one embodiment;
FIG. 5 is a diagram illustrating a second state of a chip delamination in an embodiment;
FIG. 6 is a schematic diagram illustrating a third state of a chip delamination in an embodiment;
FIG. 7 is a diagram illustrating a fourth state of a chip delamination in an embodiment.
Description of reference numerals:
10. a height adjustment member; 20. a connecting plate; 30. a position adjustment member; 40. mounting a plate; 50. a liner plate; 60. a grinder; 70. a base; 71. an adjusting member mounting portion; 72. a clamping part; 80. a chip sample; 81. a second solder ball; 82. filling glue; 83. a single-sided copper-clad plate; 84. a double-sided copper-clad plate; 85. a first solder ball; 90. the surface to be observed.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
At present, semiconductor process is continuously shrinking, and advanced packaging technologies such as flip chip, wafer level packaging, and 3D packaging are inevitably selected to improve the functional density of the product. The microscopic analysis technology is used for failure analysis of the chip, and can help designers to find defects in chip processing and design through failure analysis work, the chip is generally required to be subjected to layer removal treatment, and instruments are used for observing and analyzing all surface layers and longitudinal sections of the chip so as to accurately position the defects of the chip. The advanced packaged chip has small packaging volume and high packaging density, and the conventional sample preparation technology including mechanical grinding, ion etching and chemical corrosion cannot prepare an observable interface of the chip sample 80 with high coplanarity, so that the subsequent analysis period is prolonged, and the accuracy is reduced. Therefore, a chip delamination conditioning device and a sample preparation method capable of improving coplanarity of the chip sample 80 are needed, and an observable interface of the chip is improved, so that a good sample is provided for failure analysis. In view of the above, it is necessary to provide a chip delamination conditioning apparatus and a sample preparation method, which have high coplanarity and low defect rate, in order to solve the problem of poor coplanarity in the chip delamination process.
Referring to fig. 1 and 2, fig. 1 is a schematic view illustrating an overall structure of a chip delamination conditioning apparatus according to an embodiment of the present invention, and fig. 2 is a schematic view illustrating a chip grinding process according to an embodiment of the present invention, the chip delamination conditioning apparatus according to an embodiment of the present invention includes: a base 70; the height adjusting piece 10 is movably connected with the base 70, and the height adjusting piece 10 is used for adjusting the height of the chip sample relative to the base 70; and a position adjusting member 30, the position adjusting member 30 being connected to the height adjusting member 10, wherein the base 70 has a clamping surface opposite to one end of the position adjusting member 30, a clamping space is formed between the position adjusting member 30 and the clamping surface, the clamping space is used for clamping the chip sample 80, and the position adjusting member 30 is used for adjusting the clamping position of the chip sample on the clamping surface. According to the chip layer removing adjusting device, the chip sample 80 is stably clamped in the clamping space by matching and clamping the position adjusting piece 30 and the clamping surface of the base 70, the size of the clamping space is adjusted and the clamping position of the chip sample on the clamping surface is adjusted by adjusting the distance between the position adjusting piece 30 and the clamping surface of the base 70, so that the chip sample 80 is reliably clamped, the chip sample 80 can be ground to a multi-layer section of a surface 90 to be observed simultaneously when being ground, and the coplanarity is improved; through adjusting height adjusting part 10, can adjust the height of chip sample 80 for base 70, realize the control regulation to chip sample 80 grinding volume at every turn, guarantee to wait to observe the grinding quality at interface to chip sample 80. Above-mentioned chip delaminating adjusting device can improve the coplanarity to chip sample 80 grinds, reduces chip sample 80 defect rate, provides good sample for follow-up failure analysis, effectively shortens analysis cycle, improves the analysis rate of accuracy.
In order to facilitate the control and adjustment of the grinding amount of the chip sample 80 at each time, improve the operability and simplify the structure, optionally, in one embodiment, the chip delamination adjusting apparatus further includes a connecting plate 20, the base 70 includes an adjusting member mounting portion 71, one end of the height adjusting member 10 is movably connected with the adjusting member mounting portion 71, and the other end of the height adjusting member 10 is fixedly connected with the connecting plate 20. Move high regulating part 10 through regulating part installation department 71 and connect on base 70, realize the relative base 70's of high regulating part 10 removal, position control part 30 is connected with high regulating part 10, and then can drive position control part 30 when high regulating part 10 removes and take place to remove relative base 70, through height regulating part 10, realize the adjustment to chip sample 80 for base 70 height, the realization is to the control regulation of chip sample 80 grinding volume at every turn, guarantee to treat the grinding quality of viewing interface to chip sample 80, provide good sample for follow-up failure analysis.
Alternatively, in one embodiment, the position adjuster 30 is movably coupled to the coupling plate 20. The position adjusting part 30 is connected with the height adjusting part 10 through the connecting plate 20, so that when the height adjusting part 10 moves relative to the base 70, the position adjusting part 30 can be driven to move through the connecting plate 20, the height of the chip sample 80 relative to the base 70 is adjusted, the position adjusting part 30 is movably connected with the connecting plate 20, through adjusting position control spare 30, make its relative connecting plate 20 removal, accomplish the regulation to the spacing of position control spare 30 to the clamping surface of base 70, realize the regulation to centre gripping space size and adjust the clamping position of chip sample on the clamping surface, accomplish the reliable clamping to chip sample 80, can grind the multilayer section of waiting to observe face 90 simultaneously when guaranteeing to grind chip sample 80, improve coplanarity, reduce chip sample 80 defect rate, provide good sample for follow-up failure analysis, with the reduction analysis cycle, improve the analysis rate of accuracy.
In order to simplify the structure and facilitate the operation, optionally, in one of the embodiments, the height adjusting member 10 is a first bolt, and the adjusting member mounting portion 71 is screwed with the height adjusting member 10. Through the rotation of control height adjustment spare 10 relative adjustment spare installation department 71, realize the removal of height adjustment spare 10 relative base 70, threaded connection is convenient for control height adjustment spare 10's the number of turns of rotation, simplifies structure, strong operability, with low costs.
In order to improve the coplanarity of the surface to be observed 90 of the chip sample 80, optionally, in one of the embodiments, the position adjustment members 30 are second bolts, the number of the position adjustment members 30 is at least two, the at least two position adjustment members 30 are arranged at intervals along the longitudinal direction of the connection plate 20, and the position adjustment members 30 are screwed with the connection plate 20. Through the relative connecting plate 20 rotation of control position adjusting part 30, realize the relative base 70's of position adjusting part 30 centre gripping surface's removal, realize the regulation to centre gripping space size, be convenient for adjust the chip sample at the centre gripping position on the surface, threaded connection is convenient for control position adjusting part 30's the number of turns of rotation, simplifies structure, strong operability. At least two position control members 30 are arranged along the longitudinal interval of the connecting plate 20, the verticality of the chip can be adjusted through the position control members 30, specifically, the moving distance of each position control member 30 relative to the clamping surface of the base 70 is controlled, the distance from one end, close to the clamping surface of the base 70, of each position control member 30 to the clamping surface is equal, the assembling error and the deformation error of the connecting plate 20, the adjusting member mounting part 71 and the height adjusting member 10 are compensated, the precision of the clamping space is ensured, the clamping precision of the chip sample 80 is ensured, the coplanarity of the to-be-observed surface 90 of the clamped chip sample 80 is ensured, the grinding effect of the to-be-observed surface 90 and the quality of the chip sample 80 are ensured, and the defect rate is reduced.
In order to further improve the clamping reliability of the chip sample 80, optionally, in one of the embodiments, the chip delamination adjusting apparatus further includes a mounting plate 40, the base 70 further includes a clamping portion 72, the mounting plate 40 is connected to an end of the position adjusting member 30 close to the clamping portion 72, a clamping surface is disposed on the clamping portion 72, and the clamping surface and the mounting plate 40 form a clamping space. The chip sample 80 is placed in the clamping space, the moving distance of each position adjusting piece 30 relative to the clamping surface is controlled and adjusted, so that the mounting plate 40 and the clamping part 72 are matched with the clamping surface to clamp the chip sample 80, the distances from one end, close to the clamping surface of the base 70, of each position adjusting piece 30 to the clamping surface are equal, the assembling errors and the deformation errors of the connecting plate 20, the adjusting piece mounting part 71 and the height adjusting piece 10 are compensated, the precision of the clamping space is ensured, the clamping precision of the chip sample 80 is ensured, and the coplanarity of the surface to be observed 90 of the clamped chip sample 80 is also ensured. The mounting plate 40 is used for homogenizing the stress of the chip sample 80, and the clamping reliability is further improved. Optionally, the clamping portion 72 is a convex pillar protruding toward the position adjusting member 30, so that the clamping and positioning are facilitated, and the operation efficiency is improved.
In order to protect the chip sample 80 and avoid damage caused by clamping, optionally, in one embodiment, the chip delamination adjusting apparatus further includes a lining plate 50, the lining plate 50 is fixedly connected to a side of the mounting plate 40 close to the clamping portion 72, the material of the lining plate 50 is softer than that of the mounting plate 40, optionally, the lining plate 50 is made of an elastic material, clamping stress of the mounting plate 40 and the clamping portion 72 of the base 70 on the chip sample 80 is absorbed by the lining plate 50, the chip sample 80 is protected, and the chip sample 80 is prevented from being damaged by clamping.
Optionally, in one embodiment, the backing plate 50 is fixedly attached to the mounting plate 40 by bonding and/or riveting.
Optionally, in one embodiment, the chip delamination conditioning apparatus further comprises a grinder 60, the grinder 60 is provided with a grinding platform, the grinding platform is opposite to the clamping space, and the grinder 60 is used for grinding the surface to be observed 90 of the chip sample 80. Through the centre gripping surface cooperation centre gripping of position control spare 30 and base 70, stabilize the centre gripping with chip sample 80 in the centre gripping space, rotate through control height control spare 10 relative regulation piece installation department 71, realize the removal of height control spare 10 relative base 70 and drive position control spare 30 relative base 70 and move, rotate through control position control spare 30 relative connecting plate 20, realize the removal of the relative base 70's of position control spare 30 centre gripping surface, realize the regulation to centre gripping space size, be convenient for adjust the clamping position of chip sample on the clamping surface, make the face 90 of waiting of chip sample 80 relative with the grinding platform of machine 60, guarantee the grinding effect.
The invention also provides a sample preparation method, which comprises the following steps:
as shown in fig. 4 and 5, the first solder balls 85 connected to the bottom of the package substrate are removed by grinding;
as shown in fig. 5 to 7, the copper clad laminate of the package substrate is removed by layered grinding until the second solder balls 81 connected to the bottom of the chip are exposed;
as shown in fig. 1 and 2, the chip is mounted on the chip layer removing adjusting device, and the verticality of the chip is adjusted by the position adjusting member 30;
the grinding amount of the chip is adjusted by the height adjusting piece 10;
grinding the surface to be observed 90 of the chip;
the surface to be observed 90 is polished.
In one embodiment, the grinding to remove the first solder balls 85 attached to the bottom of the package substrate includes: and grinding the first welding balls 85 connected to the bottom of the packaging substrate by adopting a mechanical grinding mode, wherein the sand paper is 80-600 meshes, and optionally, sand paper of 80 meshes, 200 meshes, 0 meshes, 400 meshes, 500 meshes and 600 meshes is adopted in sequence to grind the first welding balls 85 until the first welding balls 85 are removed.
In one embodiment, the step of removing the copper-clad plate of the packaging substrate by layered grinding comprises the following steps: and grinding the single-sided copper-clad plate 83 and/or the double-sided copper-clad plate 84 of the packaging substrate from the position where the first welding balls 85 are removed by adopting a mechanical grinding mode, and grinding the single-sided copper-clad plate 83 and/or the double-sided copper-clad plate 84 of the packaging substrate by adopting sand paper with the mesh number of 600-1500 meshes, optionally, grinding the single-sided copper-clad plate 83 and/or the double-sided copper-clad plate 84 of the packaging substrate by adopting sand paper with the mesh number of 600-1500 meshes, or adopting sand paper with the mesh number of 800-meshes, or 1000-meshes, or 1200-meshes, or 1500-meshes, until 10 layers, 5 layers, 4 layers, 3 layers or 2 layers of copper-clad plates are left on the packaging substrate.
In one embodiment, the remaining 10 or 5 or 4 or 3 or 2 copper clad laminates of the package substrate are mechanically ground with 2000-4000 mesh sandpaper, optionally 2000-2500, 00-3500 and 4000 mesh sandpaper, until the second solder balls 81 connected to the package substrate are exposed.
In one embodiment, the chip is mounted on the chip layer removal adjusting device, the verticality of the chip is adjusted by the position adjusting pieces 30, specifically, the chip sample 80 is placed in the clamping space, the moving distance of each position adjusting piece 30 relative to the clamping surface of the base 70 is controlled and adjusted, so that the distance from one end of each position adjusting piece 30 close to the clamping surface of the base 70 to the clamping surface is equal, the assembling error and the deformation error of the connecting plate 20, the adjusting piece mounting part 71 and the height adjusting piece 10 are compensated, the precision of the clamping space is ensured, the clamping precision of the chip sample 80 is ensured, the coplanarity of the surface to be observed 90 of the chip sample 80 after clamping is ensured, the grinding effect of the surface to be observed 90 and the quality of the chip sample 80 are further ensured, and the defect rate is reduced.
In one embodiment, the grinding amount of the chip is adjusted by the height adjusting part 10, the grinding amount is 0.05mm-4mm, specifically, the height adjusting part 10 moves relative to the base 70 to drive the position adjusting part 30 to move relative to the base 70, so that the height of the chip sample 80 relative to the base 70 is adjusted, the control and adjustment of the grinding amount of the surface 90 to be observed of the chip sample 80 each time is realized, optionally, the grinding amounts of the surface 90 to be observed of the chip sample 80 are sequentially 4mm, 2mm, 1mm, 0.08mm and 0.05mm, the grinding quality of the interface to be observed of the chip sample 80 is ensured, and a good sample is provided for subsequent failure analysis.
In one embodiment, grinding the side 90 of the chip to be viewed includes grinding the underfill 82 attached to the bottom of the chip sample 80.
In one embodiment, the surface to be observed 90 is a side surface or a cross section of the chip sample 80, so as to observe the interlayer structure of the chip sample 80.
In one embodiment, polishing the surface to be observed 90 comprises: and respectively polishing by using diamond particles and alumina particles, wherein the particle size of the diamond particles and the particle size of the alumina particles are 0.5-5 microns.
According to the chip layer removing adjusting device, the chip sample 80 is stably clamped in the clamping space by matching and clamping the position adjusting piece 30 and the clamping surface of the base 70, the size of the clamping space is adjusted and the clamping position of the chip sample on the clamping surface is adjusted by adjusting the distance between the position adjusting piece 30 and the clamping surface of the base 70, so that the chip sample 80 is reliably clamped, the chip sample 80 can be ground to a multi-layer section of a surface 90 to be observed simultaneously when being ground, and the coplanarity is improved; through adjusting height adjusting part 10, can adjust the height of chip sample 80 for base 70, realize the control regulation to chip sample 80 grinding volume at every turn, guarantee to wait to observe the grinding quality at interface to chip sample 80. Above-mentioned chip delaminating adjusting device can improve the coplanarity to chip sample 80 grinds, reduces chip sample 80 defect rate, provides good sample for follow-up failure analysis, effectively shortens analysis cycle, improves the analysis rate of accuracy.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only show several embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A chip delamination conditioning apparatus, comprising:
a base;
the height adjusting piece is movably connected with the base and used for adjusting the height of the chip sample relative to the base;
the chip sample clamping device comprises a position adjusting piece, the position adjusting piece is connected with a height adjusting piece, wherein the base is provided with a clamping surface, the clamping surface is opposite to one end of the position adjusting piece, a clamping space is formed between the position adjusting piece and the clamping surface, the clamping space is used for clamping a chip sample, and the position adjusting piece is used for adjusting the clamping position of the chip sample on the clamping surface.
2. The apparatus of claim 1, further comprising a connecting plate, wherein the base comprises an adjusting member mounting portion, one end of the height adjusting member is movably connected to the adjusting member mounting portion, and the other end of the height adjusting member is fixedly connected to the connecting plate; and/or the presence of a gas in the gas,
the position adjusting piece is movably connected with the connecting plate.
3. The device for adjusting chip delamination as defined in claim 2, wherein the height adjustment member is a first bolt, and the adjustment member mounting portion is threadedly connected to the height adjustment member; and/or the presence of a gas in the gas,
the position adjusting pieces are at least two second bolts, the position adjusting pieces are arranged along the longitudinal direction of the connecting plate at intervals, and the position adjusting pieces are in threaded connection with the connecting plate.
4. The device of claim 1, further comprising a mounting plate, wherein the base further comprises a clamping portion, wherein the mounting plate is connected to an end of the position adjuster proximate to the clamping portion, wherein the clamping surface is disposed on the clamping portion, and wherein the clamping surface and the mounting plate form the clamping space.
5. The device for chip delamination conditioning as recited in claim 4, further comprising a backing plate fixedly attached to a side of said mounting plate proximate to said clamping portion.
6. The device for chip delamination conditioning as claimed in claim 5, wherein said backing plate is fixedly attached to said mounting plate by means of bonding and/or riveting.
7. The apparatus for conditioning chip delamination as set forth in claim 4, further comprising a grinder having a grinding table opposed to the holding space, the grinder grinding a surface to be observed of the chip sample.
8. A method of preparing a prototype using the apparatus for chip delamination conditioning as claimed in any of claims 1 to 7, comprising the steps of:
grinding and removing a first solder ball connected with the bottom of the packaging substrate;
carrying out layered grinding to remove the copper-clad plate of the packaging substrate until a second solder ball connected with the bottom of the chip is exposed;
mounting the chip on a chip layer removal adjusting device, and adjusting the verticality of the chip through a position adjusting piece;
the grinding amount of the chip is adjusted through the height adjusting piece;
grinding the surface to be observed of the chip;
and polishing the surface to be observed.
9. The sample preparation method according to claim 8, wherein the grinding amount is 0.05mm to 4 mm.
10. A sample preparation method according to claim 8, wherein the surface to be observed is a side surface or a cross section of a chip sample.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210736420.0A CN114800107B (en) | 2022-06-27 | 2022-06-27 | Chip layer removal adjusting device and sample preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210736420.0A CN114800107B (en) | 2022-06-27 | 2022-06-27 | Chip layer removal adjusting device and sample preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114800107A true CN114800107A (en) | 2022-07-29 |
| CN114800107B CN114800107B (en) | 2022-12-09 |
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