CN114779505B - Display panel, display device and binding detection method - Google Patents
Display panel, display device and binding detection method Download PDFInfo
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- CN114779505B CN114779505B CN202210325201.3A CN202210325201A CN114779505B CN 114779505 B CN114779505 B CN 114779505B CN 202210325201 A CN202210325201 A CN 202210325201A CN 114779505 B CN114779505 B CN 114779505B
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- 230000027455 binding Effects 0.000 title claims abstract description 211
- 238000001514 detection method Methods 0.000 title claims abstract description 132
- 239000010410 layer Substances 0.000 claims abstract description 136
- 239000002184 metal Substances 0.000 claims abstract description 127
- 229910052751 metal Inorganic materials 0.000 claims abstract description 127
- 239000000463 material Substances 0.000 claims abstract description 107
- 238000005192 partition Methods 0.000 claims abstract description 72
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 239000012790 adhesive layer Substances 0.000 claims abstract description 32
- 239000002346 layers by function Substances 0.000 claims abstract description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 4
- 239000000523 sample Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000009870 specific binding Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
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- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application discloses a display panel, a display device and a binding detection method, wherein a binding area is divided into a second substrate, the second substrate comprises a plurality of binding metal wires, a binding insulating layer and an opposite conducting adhesive layer, the binding metal wires are arranged in the binding area at intervals, the binding insulating layer is filled between two adjacent binding metal wires, the opposite conducting adhesive layer is arranged above the binding metal wires, the second substrate further comprises a force-sensitive material layer, and the force-sensitive material layer is arranged between the opposite conducting adhesive layer and the binding metal wires; at least two detection partitions are arranged in the extending direction of each binding metal wire, a force-sensitive material layer is arranged in at least two detection partitions, the force-sensitive material layer comprises an insulating layer and a functional layer, the insulating layer is provided with two layers, the functional layer is arranged between the two layers of insulating layers, and the functional layer converts different pressures into electric signals. According to the method, whether the binding problem exists between the driving element and the display panel or not can be detected, and the specific position where the binding problem exists can be accurately judged.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel, a display device and a binding detection method.
Background
In the manufacturing process of the display panel, a driving chip or a flexible circuit board is usually bound with the display panel by adopting an anisotropic conductive adhesive layer so as to ensure the normal operation of the display panel; when the bound driving chip or flexible circuit board is separated from the display panel, the display panel cannot work normally.
The common binding detection method is to determine whether the driving chip or the flexible circuit board is normally bound with the display panel by judging whether the display panel can normally display; however, in the actual binding process, there may be a micro open circuit (or virtual connection) between the driving element and the display panel, that is, the binding is not completely firm; at this time, although the display panel may still work normally during the inspection, a phenomenon of separation may occur between the driving chip or the flexible circuit board and the display panel as the time of use is prolonged or during the handling, which may cause the display panel to fail to work normally.
How to detect whether the driving element and the display panel are completely and firmly bound and accurately judge the area where the binding problem occurs becomes a problem to be solved in the art.
Disclosure of Invention
The purpose of the application is to provide a display panel, a display device and a binding detection method, which can detect whether a binding problem exists between a driving element and the display panel and accurately judge the specific position where the binding problem exists.
The application discloses display panel, display panel includes first base plate and second base plate, first base plate with the second base plate sets up to the box, the second base plate is divided there is the binding area, the second base plate includes many binding metal lines, binding insulating layer and opposite sex conductive adhesive layer, many binding metal lines interval is arranged in the binding area, binding insulating layer is filled between adjacent two binding metal lines, opposite sex conductive adhesive layer sets up binding metal lines top, the second base plate still includes the force-sensitive material layer, the force-sensitive material layer sets up opposite sex conductive adhesive layer with bind between the metal lines; each binding metal wire is provided with at least two detection partitions in the extending direction, at least two force-sensitive material layers are arranged in the detection partitions, each force-sensitive material layer comprises an insulating layer and a functional layer, the insulating layers are two layers, the functional layers are arranged between the two insulating layers, and the functional layers convert different pressures into electric signals.
Optionally, each of the binding metal lines includes a first end and a second end, where the first end is an end of the binding metal line close to the display area of the second substrate, and the second end is an end of the binding metal line close to the edge of the second substrate; each binding metal wire comprises a first detection partition, a second detection partition and a third detection partition, wherein the first detection partition is close to the first end, the second detection partition is close to the second end, and the third detection partition is arranged between the first detection partition and the second detection partition.
Optionally, each detection partition is provided with one force-sensitive material layer, each force-sensitive material layer includes a first protruding portion, a second protruding portion and a connecting portion, the connecting portion is connected with the binding metal wire, the connecting portions extend along two sides of the binding metal wire in the width direction respectively, and protrude from the binding metal wire to form the first protruding portion and the second protruding portion.
Optionally, the length of the connection portion is greater than one half of the width of the binding metal line and less than or equal to the width of the binding metal line; the width of the first protruding portion and the width of the second protruding portion are equal, and the width of the first protruding portion and the width of the second protruding portion are smaller than or equal to the width of the connecting portion.
Optionally, the force-sensitive material layer has a plurality of force-sensitive material layers, each force-sensitive material layer is connected with a plurality of binding metal wires and covers the detection partitions in the same row in the binding metal wires, and the length of each force-sensitive material layer is greater than the total width of the binding metal wires.
Optionally, the functional layer is composed of 30% of epoxy resin, 10% -30% of curing agent and 40% -60% of nickel powder.
Optionally, the width of the force-sensitive material layer is W, the length of each binding metal wire is L, the relation between the width of the force-sensitive material layer and the length of each binding metal wire is W less than or equal to 1/3L, wherein,
the thickness of the layer of force sensitive material ranges from 10 micrometers to 50 micrometers.
The application also discloses a display device, including driving element, display device still includes foretell display panel, driving element passes through the opposite conductivity glue film with bind the metal line and bind and be connected.
Optionally, the driving element includes a flexible circuit board, on a non-golden finger area of the flexible circuit board, a through hole is provided corresponding to a position of the force-sensitive material layer protruding from the binding metal wire, the flexible circuit board is provided with a circuit board detection zone corresponding to each detection zone of the binding metal wire, a force-sensitive material layer is provided between the flexible circuit board and the anisotropic conductive adhesive layer, and the force-sensitive material layer is disposed in the circuit board detection zone.
The application also discloses a binding detection method for detecting the display panel, comprising the following steps: detecting pressure changes of each detection partition on each binding metal line; receiving a pressure signal for each detection zone; calculating a pressure signal value of each detection partition; judging whether each detection partition has a binding problem according to the magnitude of the pressure signal value, if so, determining a binding metal wire with the binding problem according to the detection partition, and determining the specific position of the binding metal wire with the binding problem.
Compared with the scheme that the binding condition of the display panel is judged according to the display condition of the display panel, the binding metal wire and the driving element can be judged according to the strength of the electric signals generated under different pressures by arranging at least two detection partitions on each binding metal wire, the force-sensitive material layer is arranged in each detection partition, after the display panel and the driving element are bound through the anisotropic conductive adhesive layer, the different pressures can be converted into the electric signals when the force-sensitive material layer under the anisotropic conductive adhesive layer is subjected to the pressure effect, so that the binding metal wire and the driving element can be judged according to the specific binding problems such as virtual connection or micro-open circuit in which detection partition is generated, and meanwhile, the specific position where the binding problem occurs is determined according to the detection partition where the problem occurs is favorable for improving the detection and maintenance efficiency.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive faculty for a person skilled in the art. In the drawings:
FIG. 1 is a schematic diagram of an embodiment of a display panel of the present application;
FIG. 2 is a schematic view of a portion of a first embodiment of a second substrate of a display panel according to the present application;
FIG. 3 is a partial top view of a first embodiment of a second substrate in a display panel of the present application;
FIG. 4 is a partial top view of a second embodiment of a second substrate in a display panel of the present application;
FIG. 5 is a partial top view of a third embodiment of a second substrate in a display panel of the present application;
FIG. 6 is a partial schematic view of an embodiment of a display device of the present application;
FIG. 7 is a schematic diagram of a portion of a detection device of the present application in detecting display device binding;
FIG. 8 is a step diagram of a binding detection method according to an embodiment of the present application.
10, a display device; 100. a display panel; 110. a first substrate; 120. a second substrate; 121. an array substrate; 122. a layer of force sensitive material; 123. an insulating layer; 124. a functional layer; 125. binding metal wires; 126. binding an insulating layer; 127. a first protrusion; 128. a second protruding portion; 129. a connection part; 130. binding area; 140. a anisotropic conductive adhesive layer; 150. detecting a partition; 151. a first detection partition; 152. a second detection partition; 153. a third detection partition; 154. detecting the subarea by a circuit board; 155. a first end; 156. a second end; 400. a flexible circuit board; 410. a through hole; 500. a detection device; 510. a probe; 520. a force-sensitive sensor; 600. a driving element.
Detailed Description
It should be understood that the terminology, specific structural and functional details disclosed herein are merely representative for purposes of describing particular embodiments, but that the application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or implicitly indicating the number of technical features indicated. Thus, unless otherwise indicated, features defining "first", "second" may include one or more such features either explicitly or implicitly; the meaning of "plurality" is two or more. The terms "comprises," "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or groups thereof may be present or added.
In addition, terms of the azimuth or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., are described based on the azimuth or relative positional relationship shown in the drawings, are merely for convenience of description of the present application, and do not indicate that the apparatus or element referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present application.
Furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
The present application is described in detail below with reference to the attached drawings and alternative embodiments.
Fig. 1 is a schematic diagram of an embodiment of a display panel of the present application, fig. 2 is a partial schematic diagram of a first embodiment of a second substrate in the display panel of the present application, fig. 3 is a partial top view of the first embodiment of the second substrate in the display panel of the present application, as shown in fig. 1 to 3, the present application discloses a display panel 100, the display panel 100 includes a first substrate 110 and a second substrate 120, the first substrate 110 and the second substrate 120 are arranged in pairs, the second substrate 120 is divided into a binding area 130, the second substrate 120 includes a plurality of binding metal wires 125, a binding insulating layer 126 and an anisotropic conductive adhesive layer 140, the plurality of binding metal wires 125 are arranged in the binding area 130 at intervals, the binding insulating layer 126 is filled between two adjacent binding metal wires 125, the anisotropic conductive adhesive layer 140 is arranged above the binding metal wires 125, the second substrate 120 further includes a force sensitive material layer 122, and the force sensitive material layer 122 is arranged between the anisotropic conductive adhesive layer 140 and the binding metal wires 125; at least two detection partitions 150 are divided in the extending direction of each binding metal wire 125, a force sensitive material layer 122 is arranged in at least two detection partitions 150, the force sensitive material layer 122 comprises an insulating layer 123 and a functional layer 124, the insulating layer 123 is provided with two layers, the functional layer 124 is arranged between the two insulating layers 123, and the functional layer 124 converts different pressures into electric signals.
The second substrate 120 of the present application may be an array substrate in a common liquid crystal display panel, or may be an array substrate in a COA (Color Filter on Array) display panel, which is not particularly limited herein, and in the following embodiments, only the second substrate 120 is exemplified as the array substrate 121 in the common liquid crystal display panel.
A plurality of binding metal wires 125 for binding connection are arranged on a binding area 130 of the array substrate 121, binding insulating layers 126 are filled in mutually-spaced areas of the binding metal wires 125, and short circuits among the binding metal wires 125 are avoided; an anisotropic conductive paste is coated on the plurality of bonding metal wires 125, and an anisotropic conductive paste 140 is formed by the coated anisotropic conductive paste, and the driving element 600 (driving chip or flexible circuit board) is bonded and connected with the plurality of bonding metal wires 125 through the anisotropic conductive paste 140.
According to the method, at least two detection partitions 150 are arranged on each binding metal wire 125, the force-sensitive material layer 122 is arranged in each detection partition 150, after the array substrate 121 and the driving element 600 are bound through the opposite conductive adhesive layer 140, when the force-sensitive material layer 122 below the opposite conductive adhesive layer 140 is subjected to the pressure action, different pressures can be converted into electric signals, and therefore the positions of the binding metal wires 125, which are in particular binding problems such as virtual connection or slight open circuit, between the binding metal wires 125 and the driving element 600 can be determined according to the electric signal intensity generated under different pressures generated by the force-sensitive material layer 122, and meanwhile, the positions of the binding problems are determined according to the detection partitions 150 on the binding metal wires 125, which are in particular binding problems, are in particular binding positions, so that the detection and maintenance efficiency can be improved.
In addition, the functional layer 124 is wrapped in the force-sensitive material layer 122 by the two insulating layers 123, preventing the force-sensitive material layer 122 from being short-circuited between the bonding wire 125 and the anisotropic conductive adhesive layer 140, and protecting the functional layer 124 from being damaged. When the force-sensitive material layer 122 receives pressure, the pressure is conducted to the functional layer 124 through the insulating layer 123, the functional layer 124 receives the pressure and converts the pressure into an electrical signal, so that the electrical signal is obtained through the detecting device 500, and the binding state between the array substrate 121 and the driving element 600 is determined by determining the strength of the electrical signal.
In order to improve the sensitivity and accuracy of the force-sensitive material layer 122 in converting pressure into an electrical signal, the specific limitation is made to the components of the functional layer 124 in the force-sensitive material layer 122 in the present application, where the functional layer 124 is used as a core part of the force-sensitive material layer 122 for converting pressure into an electrical signal, and the materials of the functional layer 124 will directly affect the sensitivity and accuracy of converting pressure into an electrical signal in the present application: the functional layer 124 is composed of 30% of epoxy resin, 10% -30% of curing agent and 40% -60% of nickel powder.
Through the above limitation on the components of the functional layer 124, the sensitivity and accuracy of the functional layer 124 for converting pressure into an electrical signal can be better realized, so that when the detection device 500 detects, an accurate signal can be read out, and the accuracy of judging the binding condition of the array substrate 121 is further improved.
Further, in order to facilitate the binding between the binding metal wire 125 and the driving element 600 to be firm on the basis of saving the use of the force-sensitive material layer 122 as much as possible, and simultaneously, when detecting the binding problem, the force-sensitive material layer 122 can be rapidly positioned to the area on the binding metal wire 125 where the binding problem specifically occurs, the following specific design is performed on the arrangement of the force-sensitive material layer 122 on the binding metal wire 125:
as shown in fig. 3, each of the bonding wires 125 includes a first end 155 and a second end 156, the first end 155 being an end of the bonding wire 125 near the display area of the array substrate 121, and the second end 156 being an end of the bonding wire 125 near the edge of the array substrate 121; each binding wire 125 includes a first detection zone 151, a second detection zone 152, and a third detection zone 153, the first detection zone 151 disposed proximate to the first end 155, the second detection zone 152 disposed proximate to the second end 156, and the third detection zone 153 disposed between the first detection zone 151 and the second detection zone 152.
In the above design, each binding metal wire 125 is divided into three parts by the first detection partition 151, the second detection partition 152 and the third detection partition 153, the first detection partition 151 and the second detection partition 152 are respectively close to the first end 155 and the second end 156 of the binding metal wire 125, and the third detection partition 153 is arranged between the first detection partition 151 and the second detection partition 152, for example, the third detection partition 153 can be arranged in the middle of the binding metal wire 125, and when each binding metal wire 125 is detected, only three main areas of the two ends and the middle of each binding metal wire 125 need to be detected, so that the position of the binding problem on the binding metal wire 125 can be roughly determined, and the detection time of the binding metal wire 125 with the binding problem is shortened; meanwhile, the force sensitive material layers 122 are only arranged near the two ends and the middle of the binding metal wires 125, so that the number of the force sensitive material layers 122 used on each binding metal wire 125 is greatly reduced, the area of the part, which leaks out of the binding metal wires 125, is larger, the binding metal wires 125 and the driving element 600 are more favorable for binding, and the falling off is not easy to occur.
Of course, in the present application, there may be a plurality of detecting areas 150 on each binding wire 125, and the arrangement design of the force-sensitive material layer 122 is not limited to the above-mentioned design, but the force-sensitive material layer 122 may be arranged within a reasonable range according to different numbers of detecting areas 150, and the above-mentioned design is only illustrative.
In addition, to better enable the force sensitive material layer 122 to have sufficient space in each bonding metal while not affecting the bonding of the driving element 600 to the bonding metal lines 125, the force sensitive material layer 122 is provided withThe arrangement of the wires 125 in the detection zone 150 is also advantageous for the detection device 500 to detect the force-sensitive material layer 122, and the size of the force-sensitive material layer 122 is specifically designed in the present application, where the relationship between the width W of the force-sensitive material layer 122 and the length L of each bonding wire 125 is W is less than or equal to 1/3L, where,
the thickness of the force sensitive material layer 122 ranges from 10 microns to 50 microns, and the length of the force sensitive material layer 122 is greater than the width of the bond wires 125.
Through the above limitation on the width, thickness and length of the force-sensitive material layer 122, the binding metal wires 125 and the driving element 600 can still achieve the purpose of conducting through the adhesion of the anisotropic conductive adhesive layer 140, and meanwhile, the detection of the force-sensitive material layer 122 by the detection device 500 is facilitated.
Further, as shown in fig. 3, there are a plurality of force-sensitive material layers 122, each force-sensitive material layer 122 is connected to the plurality of binding metal lines 125 and covers the detection zones 150 in the same row in the plurality of binding metal lines 125, and the length of each force-sensitive material layer 122 is greater than the total width of the plurality of binding metal lines 125.
In the actual detection process, the detection device 500 is used for detecting the part of the force-sensitive material layer 122 which is not covered on the binding metal wires 125, so that the short circuit caused by the direct contact between the detection device 500 and the binding metal wires 125 can be effectively avoided; meanwhile, the area of the detection device 500 capable of detecting the force-sensitive material layer 122 is further increased, the detection difficulty is reduced, and the detection rate can be effectively improved; meanwhile, the plurality of force-sensitive material layers 122 are arranged at intervals to expose the binding metal wires 125, so that the driving element 600 is bonded with the exposed binding metal wires 125 through the anisotropic conductive adhesive layer 140, and the bonding stability is not affected.
Fig. 4 is a partial top view of a second embodiment of the second substrate in the display panel of the present application, as shown in fig. 4, where the embodiment shown in fig. 4 is based on the improvement of fig. 3, and each detection partition 150 is correspondingly provided with a force-sensitive material layer 122, where the force-sensitive material layer 122 includes a first protrusion 127, a second protrusion 128, and a connection portion 129, the connection portion 129 is connected to the bonding metal line 125, and the connection portion 129 extends along two sides of the bonding metal line 125 in the width direction, and protrudes from the bonding metal line 125 to form the first protrusion 127 and the second protrusion 128.
The difference between this embodiment and the previous embodiment is that each force-sensitive material layer 122 in this embodiment is a small section that is independent, and the plurality of force-sensitive material layers 122 are arranged at intervals along the length direction of each binding metal wire 125, and the force-sensitive material layers 122 arranged at intervals expose part of the binding metal wires 125, so as to facilitate connection between the anisotropic conductive adhesive and the binding metal wires 125, and achieve binding between the driving element 600 and the binding metal wires 125; meanwhile, the force-sensitive material layer 122 is divided into three parts, namely a first protruding part 127, a second protruding part 128 and a connecting part 129, the force-sensitive material layer 122 is connected with the binding metal wire 125 by the connecting part 129, so that stable contact can be formed between the force-sensitive material layer 122 and the binding metal wire 125, and the binding condition between the binding metal wire 125 and the driving element 600 can be monitored through the force-sensitive material layer 122; the first protruding portion 127 and the second protruding portion 128 protrude from the binding metal wire 125, so when the detection device 500 is used to detect the force sensitive material layer 122, the detection device 500 can be directly inserted into the first protruding portion 127 and the second protruding portion 128 to directly detect the strength of the electrical signal converted from the pressure change of the force sensitive material layer 122, and the detection device 500 can be prevented from contacting the binding metal wire 125, thereby causing short circuit. Meanwhile, the multiple binding partitions which are subdivided out are respectively detected, so that the binding problem can be accurately positioned. The accuracy of detecting the binding condition between the array substrate 121 and the driving element 600 is improved, detection personnel can conveniently detect the position with problems, the time for removing faults is saved, and the detection efficiency is improved.
FIG. 5 is a partial top view of a third embodiment of a second substrate in the display panel of the present application, as shown in FIG. 5, wherein the embodiment of FIG. 5 is based on the improvement of FIG. 4, and the length of the connecting portion 129 is greater than one half of the width of the bonding metal line 125 and less than or equal to the width of the bonding metal line 125; the width of the first protruding portion 127 and the width of the second protruding portion 128 are both equal, and the width of the first protruding portion 127 and the width of the second protruding portion 128 are both smaller than or equal to the width of the connecting portion 129.
According to the difference in width between the first protruding portion 127 and the second protruding portion 128 and the connecting portion 129, the structure of the force-sensitive material layer 122 is also different, for example, as shown in fig. 4, when the width of the first protruding portion 127 and the second protruding portion 128 is smaller than the width of the connecting portion 129, and the length of the connecting portion 129 is smaller than the width of the binding metal wire 125 and larger than half of the width of the binding metal wire 125, i.e., the force-sensitive material layer 122 is narrowed along two sides of the width direction of the binding metal wire 125 to form a structure similar to a shape of a Chinese character 'zhong', the use area of the force-sensitive material layer 122 is reduced, and the force-sensitive material is saved; and the two protruding end positions of the force sensitive material layer 122 with the middle-shaped structure are more obvious, so that the detection is facilitated.
Fig. 6 is a schematic partial view of an embodiment of a display device of the present application, and as shown in fig. 6, the present application discloses a display device 10, including a driving element 600, and the display device further includes the display panel, where the driving element 600 is connected to the bonding metal lines 125 through the anisotropic conductive adhesive layer 140. The display device 10 of the present application may be a device with a display panel 100, such as a television, a computer, a tablet computer, etc., and is not particularly limited herein.
The display device 10 of the present application is convenient for detecting the array substrate 121 therein, and can effectively detect whether there is a virtual connection or a micro-open phenomenon between the driving element 600 and the array substrate 121, thereby improving the quality of the display device 10. In addition, the display device 10 of the present application can still ensure the normal operation of the display device 10 when used for a long time or subjected to external force due to transportation and other factors.
Fig. 7 is a schematic diagram of a portion of the detection device of the present application in detecting binding situations of a display device, as shown in fig. 7, the detection device 500 used in the present application includes a probe 510 and a force sensor 520, where the probe 510 transmits an electrical signal of the force sensitive material layer 122 to the force sensor 520, and the force sensor 520 determines a binding state of the array substrate 121.
The force-sensitive material layer 122 can convert different pressures into electric signals, the probe 510 of the detection device 500 is inserted into the part of the force-sensitive material layer 122 protruding out of the binding metal wire 125, the probe transmits the electric signals generated by the pressure of the force-sensitive material layer 122 to the force-sensitive sensor 520, and the binding state is judged according to the display value of the force-sensitive sensor 520. Taking the case of detecting the binding between the binding metal wire 125 and the flexible circuit board 400 as an example, the specific principle is as follows:
when the binding state of the binding metal wire 125 and the flexible circuit board 400 is normal, the pressure applied to the anisotropic conductive adhesive layer 140 and the force-sensitive material layer 122 is large, and the display value of the force-sensitive sensor 520 is also large; when the binding state is poor and even open, the pressure applied to the anisotropic conductive adhesive layer 140 and the force sensitive material layer 122 is small or zero, and the display value of the corresponding force sensitive sensor 520 is also small or zero.
The display value range of the force sensor 520 is set to be between 0 and 100, and when the display value of the force sensor 520 is 0, the binding between the array substrate 121 and the flexible circuit board 400 is in an open state; when the display value of the force sensor 520 is between 1 and 40, the binding state between the array substrate 121 and the flexible circuit board 400 is poor; when the display value of the force sensor 520 is between 41 and 80, the binding state of the array substrate 121 and the flexible circuit board 400 is poor, and there is a reliability risk; when the display value of the force sensor 520 is between 81 and 100, the binding state of the array substrate 121 and the flexible circuit board 400 is good.
The binding state between the array substrate 121 and the flexible circuit board 400 is determined by acquiring the electrical signal by the probe 510 in the detection device 500, displaying by the force sensor 520, and using the numerical value displayed by the force sensor 520, and the same principle is adopted when detecting the binding state between the array substrate 121 and the driving chip, and will not be described in detail herein; thus, the binding state of the pressure monitoring driving chip or the flexible circuit board 400, which is received by the force sensitive material layer 122, is detected by the detecting device 500, and the normal operation and reliability of the display panel 100 are ensured. The quality of the display panel 100 is improved, and the specific location where the binding problem occurs can be determined by detecting the plurality of detection partitions 150 within the plurality of binding metal lines 125.
Further, when the detection device 500 is used to detect between the display panel 100 and the driving element 600, the driving element 600 often shields the probe 510 of the detection device 500, which is not beneficial to the probe 510 to acquire the electrical signal of the force-sensitive material layer 122, and meanwhile, the binding condition between the driving element 600 and the anisotropic conductive adhesive layer 140 is not easy to be judged, so the application is improved for the flexible circuit board 400, and the specific improvement is as follows:
as shown in fig. 7, the driving element 600 includes a flexible circuit board 400, through holes 410 are disposed on the non-gold finger area of the flexible circuit board 400 at positions where the stress sensitive material layer 122 protrudes from the binding wires 125, the flexible circuit board is provided with circuit board detection partitions 150 corresponding to the detection partitions 150 of each binding wire 125, a force sensitive material layer 122 is disposed between the flexible circuit board and the anisotropic conductive adhesive layer 140, and the force sensitive material layer 122 is disposed in the circuit board detection partitions 150.
Since the probe 510 is used to remove the portion of the force-sensitive material layer 122 protruding from the binding metal wire 125 when the force-sensitive material layer 122 is detected by the detection device 500, the through hole 410 is provided on the non-gold finger area of the flexible circuit board 400 at the position of the force-sensitive material layer 122 protruding from the binding metal wire 125, so that the probe 510 can directly pass through the through hole 410 on the flexible circuit board 400 to contact with the force-sensitive material layer 122 to obtain data when the force-sensitive material layer 122 is detected. Therefore, the detection is more convenient, and the detection efficiency is improved.
The flexible circuit board 400 is provided with the plurality of circuit board detection partitions 150, the side, far away from the binding metal wires 125, of the anisotropic conductive adhesive layer 140 is provided with the force-sensitive material layer 122 in each circuit board detection partition 150, and the pressure of the plurality of circuit board detection partitions 150 is detected through the probes, so that the binding state or open circuit condition of the flexible circuit board 400 and the anisotropic conductive adhesive layer 140 can be more accurately confirmed, and the circuit board detection partitions 150 with binding problems can be rapidly found through testing the circuit board detection partitions 150 at different positions, so that the specific positions of the binding problems between the flexible circuit board and the anisotropic conductive adhesive layer 140 can be determined. The detection efficiency is improved, and the maintenance is more convenient to conduct pertinence.
Fig. 8 is a step diagram of a binding detection method according to an embodiment of the present application, and as shown in fig. 8, the present application further discloses a binding detection method for detecting the above-mentioned array substrate 121, including the steps of: s1, detecting pressure changes of each detection partition 150 on each binding metal line 125; s2, receiving a pressure signal of each detection partition 150; s3, calculating a pressure signal value of each detection partition 150; s4, judging whether each detection partition 150 has a binding problem according to the magnitude of the pressure signal value, if so, determining a binding metal wire 125 with the binding problem and a specific position of the binding metal wire 125 with the binding problem according to the detection partition 150.
The pressure signal mentioned in this application refers to the signal produced by pressure, this signal produced by pressure can be the signal, also can be deformation parameter etc., this application only uses pressure signal as the signal for the illustration, when the pressure signal of production is the signal, then adopt the probe to acquire the signal, judge the strength of signal through force sensor, thereby find the binding metal wire 125 that has the binding problem, the specific position that has the binding problem on the binding metal wire 125 is judged through the binding subregion on the binding metal wire 125, make the maintenance personnel maintain through specific position more easily, detection rate and maintenance efficiency have been improved.
The binding state of the array substrate 121 and the driving chip or the flexible circuit board 400 can be detected in the above manner, so that the normal operation and reliability of the display panel 100 are ensured; and the area with binding failure or poor state can be detected rapidly and effectively by a partition detection method, so that the timeliness of failure analysis is improved.
It should be noted that, the inventive concept of the present application may form a very large number of embodiments, but the application documents have limited space and cannot be listed one by one, so that on the premise of no conflict, the above-described embodiments or technical features may be arbitrarily combined to form new embodiments, and after the embodiments or technical features are combined, the original technical effects will be enhanced.
The foregoing is a further detailed description of the present application in connection with specific alternative embodiments, and it is not intended that the practice of the present application be limited to such descriptions. It should be understood that those skilled in the art to which the present application pertains may make several simple deductions or substitutions without departing from the spirit of the present application, and all such deductions or substitutions should be considered to be within the scope of the present application.
Claims (9)
1. The display panel comprises a first substrate and a second substrate, wherein the first substrate and the second substrate are arranged in a box-to-box manner, the second substrate is divided into binding areas, the second substrate comprises a plurality of binding metal wires, binding insulating layers and anisotropic conductive adhesive layers, the binding metal wires are arranged in the binding areas at intervals, the binding insulating layers are filled between two adjacent binding metal wires, the anisotropic conductive adhesive layers are arranged above the binding metal wires,
the second substrate is characterized by further comprising a force-sensitive material layer, wherein the force-sensitive material layer is arranged between the anisotropic conductive adhesive layer and the binding metal wire;
at least two detection subareas are arranged in the extending direction of each binding metal wire, the force sensitive material layer is arranged in at least two detection subareas,
the force-sensitive material layer comprises an insulating layer and a functional layer, wherein the insulating layer is provided with two layers, the functional layer is arranged between the two layers of insulating layers, and the functional layer converts different pressures into electric signals;
each binding metal wire comprises a first end and a second end, wherein the first end is that the binding metal wire is close to
One end of the display area of the second substrate, the second end being one end of the binding metal wire close to the edge of the second substrate;
each binding metal wire comprises a first detection partition, a second detection partition and a third detection partition, wherein the first detection partition is close to the first end, the second detection partition is close to the second end, and the third detection partition is arranged between the first detection partition and the second detection partition.
2. The display panel of claim 1, wherein each of the detection zones is provided with a corresponding one of the force sensitive material layers,
the force-sensitive material layer comprises a first protruding part, a second protruding part and a connecting part, wherein the connecting part is connected with the binding metal wire, and the connecting part extends along two sides of the binding metal wire in the width direction respectively and protrudes out of the binding metal wire to form the first protruding part and the second protruding part.
3. The display panel according to claim 2, wherein a length of the connection portion is greater than one half of a width of the bonding metal line and less than or equal to the width of the bonding metal line; the width of the first protruding portion and the width of the second protruding portion are equal, and the width of the first protruding portion and the width of the second protruding portion are smaller than or equal to the width of the connecting portion.
4. The display panel of claim 1, wherein the force sensitive material layer has a plurality of strips, each of the force sensitive material layers is connected to the plurality of bonding wires and covers the detection zones in the same row of the plurality of bonding wires, and a length of each of the force sensitive material layers is greater than a total width of the plurality of bonding wires.
5. The display panel of claim 1, wherein the functional layer is composed of 30% epoxy resin, 10% -30% curing agent, and 40% -60% nickel powder.
6. The display panel according to any one of claims 1 to 5, wherein the width of the force sensitive material layer is W, the length of each of the binding wires is L, and the relationship between the width of the force sensitive material layer and the length of each of the binding wires is W.ltoreq.1/3L, wherein,
the thickness of the layer of force sensitive material ranges from 10 micrometers to 50 micrometers.
7. A display device comprising a driving element, characterized in that the display device further comprises a display panel according to any one of claims 1 to 6, the driving element being in binding connection with the binding metal lines via the anisotropic conductive adhesive layer.
8. The display device according to claim 7, wherein the driving element comprises a flexible circuit board, a through hole is provided on the non-gold finger area of the flexible circuit board at a position corresponding to the position where the force sensitive material layer protrudes from the binding metal wire,
the flexible circuit board is provided with a circuit board detection partition corresponding to the detection partition of each binding metal wire, the force-sensitive material layer is arranged between the flexible circuit board and the anisotropic conductive adhesive layer, and the force-sensitive material layer is arranged in the circuit board detection partition.
9. A binding detection method for detecting the display panel according to any one of claims 1 to 6, comprising the steps of:
detecting pressure changes of each detection partition on each binding metal line;
receiving a pressure signal for each detection zone;
calculating a pressure signal value of each detection partition;
judging whether each detection partition has a binding problem according to the magnitude of the pressure signal value, if so, determining a binding metal wire with the binding problem according to the detection partition, and determining the specific position of the binding metal wire with the binding problem.
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| CN110164901A (en) * | 2019-06-25 | 2019-08-23 | 京东方科技集团股份有限公司 | Array substrate and preparation method thereof, display panel and display device |
| CN113031357A (en) * | 2021-03-18 | 2021-06-25 | 绵阳惠科光电科技有限公司 | Array substrate, liquid crystal display panel and liquid crystal display device |
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| CN106604543B (en) * | 2017-02-17 | 2019-03-15 | 京东方科技集团股份有限公司 | Circuit unit and its manufacturing method and bound device |
| CN106771832B (en) * | 2017-02-23 | 2019-08-16 | 京东方科技集团股份有限公司 | Its display device of a kind of circuit checker, circuit detecting method and application |
| CN110416264B (en) * | 2019-07-22 | 2022-03-01 | 武汉华星光电半导体显示技术有限公司 | Display device and binding method thereof |
| CN113296319A (en) * | 2020-02-21 | 2021-08-24 | 华为技术有限公司 | Display module assembly and display device |
| CN111652128B (en) * | 2020-06-02 | 2023-09-01 | 浙江大华技术股份有限公司 | High-altitude power operation safety monitoring method, system and storage device |
| CN112599058B (en) * | 2020-12-22 | 2022-06-03 | 湖北长江新型显示产业创新中心有限公司 | Display panel, display device and repair method of display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110164901A (en) * | 2019-06-25 | 2019-08-23 | 京东方科技集团股份有限公司 | Array substrate and preparation method thereof, display panel and display device |
| CN113031357A (en) * | 2021-03-18 | 2021-06-25 | 绵阳惠科光电科技有限公司 | Array substrate, liquid crystal display panel and liquid crystal display device |
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