CN114734716A - Film cutting mechanism and film cutting device - Google Patents
Film cutting mechanism and film cutting device Download PDFInfo
- Publication number
- CN114734716A CN114734716A CN202210389244.8A CN202210389244A CN114734716A CN 114734716 A CN114734716 A CN 114734716A CN 202210389244 A CN202210389244 A CN 202210389244A CN 114734716 A CN114734716 A CN 114734716A
- Authority
- CN
- China
- Prior art keywords
- cutting
- cut
- film layer
- blade
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/003—Cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/157—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis
- B26D1/18—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis mounted on a movable carriage
- B26D1/185—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis mounted on a movable carriage for thin material, e.g. for sheets, strips or the like
Abstract
The application relates to a film layer cutting mechanism and a film layer cutting device, wherein the film layer cutting mechanism comprises a rack, a cutting tool holder and a cutting blade, and a fixed shaft is arranged on the rack; the cutting tool apron is connected to the fixed shaft in a rotating way around the axis of the fixed shaft; the cutting blade is fixedly connected with the cutting blade holder. The utility model provides a membrane layer cuts mechanism is through setting up the fixed axle in the frame, and make and cut the blade holder and rotate around the axis of fixed axle and connect in the fixed axle, so, cut the blade holder and cut the blade homoenergetic and rotate for the frame around the axis of fixed axle, when cutting the operation, can cut the blade and wait to cut the rete before, make it rotate to being close to one side of waiting to cut the rete, cut the blade with wait to cut the rete after, wait to cut the rete not only receive the impact force along the cutting direction that the blade provided, still can receive the overdraft that the blade provided, at this moment, wait to cut the protection film on the rete and just can not appear warping and peel off, avoid waiting to cut defects such as bubble on the rete.
Description
Technical Field
The application relates to the technical field of machining equipment, in particular to a film layer cutting mechanism and a film layer cutting device.
Background
The polarizer is an essential component for realizing imaging in the liquid crystal display, and in the processing and manufacturing process of the polarizer, a polarizer film layer is required to be cut so as to obtain the required polarizer. In the related art, a cutting device is generally used for cutting the polarizer film, but in the process, because a cutter in the cutting device directly impacts the polarizer film when the cutter is inserted into the cutting device, the protective film on the polarizer film is warped and peeled off, and the defects of bubbles and the like appear on the polarizer film, so that the product quality is affected.
Disclosure of Invention
Accordingly, there is a need to provide a film cutting mechanism and a film cutting device for solving the problems of warpage and peeling of a protective film on the surface of a polarizer and the occurrence of bubbles on the polarizer during the cutting of the polarizer.
The embodiment of the application provides a membrane layer cuts mechanism includes: the rack is provided with a fixed shaft; the cutting knife seat is rotationally connected to the fixed shaft around the axis of the fixed shaft; and the cutting blade is fixedly connected with the cutting knife seat.
In one embodiment, the cutting blade includes an annular blade disposed around the cutting blade holder, and a central axis of the annular blade is parallel to an axis of the fixed shaft.
In one embodiment, the film cutting mechanism further comprises a bearing, wherein the bearing comprises an inner ring, an outer ring sleeved on the inner ring, and a rolling body arranged between the inner ring and the outer ring, and the outer ring is configured to rotate relative to the inner ring; the inner ring is sleeved on the fixed shaft, and the cutting tool holder is sleeved on the outer ring.
In one embodiment, the rack is provided with a mounting seat, the mounting seat is slidably connected with the rack, and the fixed shaft is arranged on the mounting seat, so that the cutting blade and the cutting blade seat can move relative to the rack along a preset direction under the driving of the mounting seat.
In one embodiment, the film cutting mechanism further comprises a driving member in transmission connection with the mounting seat, and the driving member is configured to provide power for moving the mounting seat relative to the frame along a preset direction.
In one embodiment, the film cutting mechanism further comprises a trigger block disposed on a moving path of the cutting blade relative to the frame, the trigger block is fixedly disposed relative to the frame, and the trigger block is configured to provide a power for rotating the cutting blade and the cutting blade holder relative to the fixed shaft when the cutting blade passes over the trigger block.
In one embodiment, the size of the trigger block protruding from the surface of the frame is smaller than the distance between the fixed shaft and the surface of the frame.
In one embodiment, the trigger block is made of a material including plastic.
The embodiment of this application still provides a film layer cutting device, includes: the film cutting mechanism as described above; and the bottom plate is arranged in parallel with the rack.
In one embodiment, the bottom plate is provided with a plurality of adsorption holes for adsorbing the film layer to be cut.
Film cuts mechanism and rete cutting device based on this application embodiment, through set up the fixed axle in the frame, and make the cutter seat rotate around the axis of fixed axle and connect in the fixed axle, so, the cutter seat rotates for the frame with the axis that cuts the blade homoenergetic around the fixed axle, when cutting the operation, can be before cutting the blade and waiting to cut the rete contact, make it rotate to being close to one side of waiting to cut the rete, thus, cut the blade with wait to cut the rete after, wait to cut the rete not only receive the impact force along the cutting direction that the cutter blade provided, still can receive the overdraft that the cutter blade provided, at this moment, the protection film that waits to cut on the rete just can not appear the warpage and peel off, thereby just can avoid waiting to cut defects such as bubbles appearing on the rete.
Drawings
Various additional advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Moreover, like reference numerals are used to refer to like elements throughout. In the drawings:
FIG. 1 is a schematic diagram of a polarizer film in the related art;
FIG. 2 is a schematic diagram illustrating a position of occurrence of a trimming defect in the related art;
FIG. 3 is a schematic view showing a defective structure of a cutter according to the related art;
fig. 4 is a schematic overall structure diagram of a film cutting mechanism according to an embodiment of the present disclosure;
fig. 5 is a perspective view of a cutting blade holder and a connecting structure of a cutting blade and a fixed shaft in a film layer cutting mechanism according to an embodiment of the present application;
fig. 6 is a schematic structural view of a cutting blade in a film layer cutting mechanism according to an embodiment of the present application after contacting a film layer to be cut;
fig. 7 is a schematic structural view of a cutting blade in a film layer cutting mechanism according to an embodiment of the present application after the cutting blade contacts a trigger block;
fig. 8 is a schematic diagram illustrating an overall structure of a film cutting device according to an embodiment of the present application.
The reference numbers in the detailed description are as follows:
100: cutting mechanism 140: bearing assembly
110: a rack 150: trigger block
111: fixing shaft 200: base plate
120: tool apron 210: adsorption hole
130: the blade 300: film layer to be cut
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Fig. 1 is a schematic structural view of a polarizer film 10 in the related art, fig. 2 is a schematic structural view of a defect of the polarizer film 10 in the related art, and fig. 3 is a schematic structural view of a defect of a cutter 15 in the related art.
The polarizer is an essential component of the liquid crystal display for realizing imaging, and in the processing and manufacturing process of the polarizer, the polarizer film layer 10 needs to be cut to obtain the required polarizer. As shown in fig. 1, the polarizer film layer 10 includes a carrier film 11, a polarizer 12, and a protective film 13, which are sequentially stacked, and during the cutting process, the polarizer 12 and the protective film 13 are cut along a dotted line in fig. 1 to separate the carrier film 11 from the polarizer 12 and the protective film 13.
In the related art, a cutting device is generally used to cut the polarizer film 10, but in the process, since a cutter in the cutting device directly impacts the polarizer film 10 when the cutter is inserted into the cutting device, the polarizer film 10 is subjected to an impact force in a cutting direction provided by the cutter, so that the protective film 13 on the polarizer film 10 is warped and peeled off and no longer tightly attached to the polarizer 12, as shown in fig. 2, defects such as bubbles 14 occur on the polarizer film 10, which affects product quality.
In addition, after the cutting device completes a plurality of times of cutting, the installation angle of the cutter 15 therein is adjusted, that is, the cutter 15 is rotated by a specific angle, so that the blades at different positions on the cutter 15 are in contact with the polarizer film layer 10, and the cutting efficiency is prevented from being influenced by the dullness of the blade of the cutter 15. After the cutting edge of the whole circle of the cutting knife 15 is used after being adjusted for many times, the cutting knife 15 is scrapped, as shown in fig. 3, in the process, because the cutting knife 15 rotates around a specific angle every time, a large number of cutting edges at positions on the cutting knife 15 are still not used in the cutting process, that is, the whole cutting knife 15 in the cutting device is not fully utilized, and the loss rate is high.
Fig. 4 is a schematic overall structure diagram of the film layer cutting mechanism 100 according to an embodiment of the present application, fig. 5 is a perspective view of a connection structure between the cutting base 120 and the cutting blade 130 and the fixing shaft 111 in the film layer cutting mechanism 100 according to an embodiment of the present application, and fig. 6 is a schematic structural diagram of the film layer cutting mechanism 100 according to an embodiment of the present application after the cutting blade 130 contacts the film layer 300 to be cut.
In order to at least partially solve the above problem, referring to fig. 4 to fig. 6, the present disclosure provides a film cutting mechanism 100, in which the film cutting mechanism 100 includes a frame 110, a cutting knife seat 120, and a cutting blade 130.
The frame 110 is used for bearing, mounting and fixing the cutting knife holder 120 and the cutting blade 130, and the shape, size and the like of the frame 110 are determined according to the shape, size, mounting position and the like of the cutting knife holder 120 and the cutting blade 130, so that a sufficient relative movement space between the cutting blade 130 and the film layer 300 to be cut can be ensured. Specifically, the frame 110 is provided with a fixed shaft 111, and the cutting blade holder 120 is rotatably coupled to the fixed shaft 111 around the axis of the fixed shaft 111, so that the cutting blade holder 120 can rotate with respect to the frame 110 around the axis of the fixed shaft 111. The position of the fixed shaft 111 on the frame 110, the size of the fixed shaft 111, and the like are not particularly limited.
The cutting knife seat 120 is used for installing the cutting knife 130, the cutting knife 130 is used for cutting the film layer 300 to be cut, and the cutting knife 130 is fixedly connected to the cutting knife seat 120, specifically, the cutting knife 130 and the cutting knife seat 120 may be directly connected, or may be connected by using a connecting piece or a connecting structure, which is not limited herein. Since the cutting blade 130 is fixedly coupled to the cutting blade holder 120, the cutting blade 130 is capable of rotating with the cutting blade holder 120 about the axis of the fixed shaft 111 with respect to the frame 110.
When the film layer 300 to be cut is cut by the film layer cutting mechanism 100, the cutting blade 130 can be rotated to a side close to the film layer 300 to be cut before contacting the film layer 300 to be cut, so that after contacting the cutting blade 130 with the film layer 300 to be cut, the film layer 300 to be cut is subjected to the impact force along the cutting direction provided by the cutting blade 130 and the downward pressure provided by the cutting blade 130, at the moment, the protective film on the film layer 300 to be cut cannot be warped and peeled off, and therefore the defects of bubbles and the like on the film layer 300 to be cut can be avoided.
The film cutting mechanism 100 of the embodiment of the application is provided with the fixing shaft 111 on the frame 110, and the cutting tool holder 120 is rotatably connected to the fixing shaft 111 around the axis of the fixing shaft 111, so that the cutting tool holder 120 and the cutting blade 130 can rotate around the axis of the fixing shaft 111 relative to the frame 110. By adopting the film cutting mechanism 100 to cut the film 300 to be cut, the protective film on the film 300 to be cut can not be warped and peeled, so that the defects of bubbles and the like on the film 300 to be cut can be avoided.
In order to ensure that the cutting blade 130 rotates with the cutter holder 120 about the axis of the fixed shaft 111 relative to the frame 110, and also to ensure that the film layer 300 to be cut can be cut after the cutting blade 130 rotates relative to the frame 110, as shown in fig. 5, in some embodiments, the cutting blade 130 optionally includes an annular blade 130 disposed around the cutter holder 120, and the central axis of the annular blade 130 is parallel to the axis of the fixed shaft 111.
In the annular blade 130, the cutting edge thereof is disposed around the central axis thereof, and since the central axis of the annular blade 130 is parallel to the axis of the fixed shaft 111, after the cutting blade 130 rotates with the cutting blade holder 120 relative to the fixed shaft 111, the annular blade 130 also rotates around the central axis thereof, and regardless of the rotation angle, the cutting edge of the annular blade 130 is still in the original plane after the rotation, so as to cut the film layer 300 to be cut. Further, in some embodiments, the central axis of the annular blade 130 coincides with the axis of the fixed shaft 111, so that the cutting edge of the cutting blade 130 is still on the original circumference after the cutting blade is rotated, which is more convenient for use.
With reference to fig. 5, the cutting tool holder 120 is rotatably connected to the fixed shaft 111 around the axis of the fixed shaft 111, and in some embodiments, the film cutting mechanism 100 further includes a bearing 140, where the bearing 140 includes an inner ring, an outer ring sleeved on the inner ring, and a rolling body disposed between the inner ring and the outer ring, and the outer ring is configured to rotate relative to the inner ring; the inner ring is sleeved on the fixed shaft 111, and the cutting tool holder 120 is sleeved on the outer ring.
That is, in this embodiment, the bearing 140 is sleeved outside the fixed shaft 111, the cutting tool holder 120 is rotatably connected to the fixed shaft 111 by sleeving the cutting tool holder 120 outside the bearing 140, and the bearing 140 can support the mechanical rotating body, reduce the friction coefficient during the movement process, and ensure the rotation precision of the mechanical rotating body, so that the cutting tool holder 120 can rotate more smoothly around the axis of the fixed shaft 111. There are various types of the bearing 140, and in the present embodiment, the type of the bearing 140 may be selected according to the relative movement between the cutter holder 120 and the fixed shaft 111.
The cutting tool holder 120 and the cutting blade 130 are mounted on the frame 110, during the cutting operation, the film layer 300 to be cut can be moved relative to the cutting blade 130 for cutting, and the cutting blade 130 can also be moved relative to the film layer 300 to be cut for cutting, in some embodiments, optionally, a mounting seat is arranged on the frame 110, the mounting seat is slidably connected to the frame 110, and the fixing shaft 111 is arranged on the mounting seat, so that the cutting blade 130 and the cutting tool holder 120 can be driven by the mounting seat to move relative to the frame 110 along the preset direction.
The frame 110 is provided with a mounting seat connected with the frame in a sliding manner, the fixing shaft 111 is arranged on the mounting seat, the cutting blade 130 and the cutting blade seat 120 are connected with the frame 110 in a sliding manner by means of the mounting seat, in the cutting operation process, the film layer 300 to be cut is kept fixed, the cutting blade 130 and the cutting blade seat 120 are driven by the mounting seat to move relative to the frame 110 along a preset direction, the preset direction is the required cutting direction, and thus, the cutting blade 130 can gradually approach and penetrate through the film layer 300 to be cut in the moving process relative to the frame 110, and the cutting process of the film layer 300 to be cut is realized.
In order to make the sliding process more stable, the number of the mounting seats may be two or more, the mounting seats are all mounted on the frame 110 and are opposite to each other and arranged at intervals, the fixing shaft 111 is clamped between the opposite fixing seats, and the cutting blade holder 120 and the cutting blade 130 are sleeved on the fixing shaft 111, so that the cutting blade holder 120 and the cutting blade 130 are more stable in the sliding process with respect to the frame 110. Further, a guide rail may be disposed on the frame 110, and the mounting seat is disposed in the guide rail so as to move relative to the frame 110 under the guiding action of the guide rail.
The mounting seat is connected with the frame 110 in a sliding manner, the cutting blade 130 and the cutting blade seat 120 can move relative to the frame 110 along a preset direction under the driving of the mounting seat, and in the process, the relative sliding between the mounting seat and the frame 110 can be driven manually or automatically. On the basis of the above embodiment, optionally, the film cutting mechanism 100 further includes a driving member in transmission connection with the mounting base, and the driving member is configured to provide a power for moving the mounting base and the frame 110 in a predetermined direction.
The driving piece can provide the power that makes mount pad and frame 110 take place relative slip along predetermineeing the direction, through the start and the stop of control driving piece, can control the slip of mount pad and stop sliding to, through the power size that control driving piece provided, can change the slip speed of mount pad, when the power that the driving piece provided is great, the slip speed of mount pad is fast, when the power that the driving piece provided is less, the slip speed of mount pad is slow. The driving member may be of various types, and for example, the driving member may be an electric push rod, a motor, or the like, and is not limited in particular.
Fig. 7 is a schematic structural diagram of the film layer cutting mechanism 100 according to an embodiment of the present disclosure after the cutting blade 130 contacts the trigger block 150.
Referring to fig. 7 in conjunction with fig. 6, in some embodiments, the film cutting mechanism 100 further includes a trigger block 150 disposed on a moving path of the cutting blade 130 relative to the frame 110, the trigger block 150 is fixedly disposed relative to the frame 110, and the trigger block 150 is configured to provide a power for rotating the cutting blade 130 and the cutting blade holder 120 relative to the fixed shaft 111 when the cutting blade 130 passes over the trigger block 150.
In the cutting process, the cutting blade 130 is driven by the mounting base to move toward the direction close to the film layer 300 to be cut, and since the trigger block 150 is disposed on the moving path of the cutting blade 130 relative to the frame 110, the cutting blade 130 will contact with the trigger block 150 first before the cutting blade 130 contacts with the film layer 300 to be cut. Because the trigger block 150 is fixedly arranged relative to the frame 110, and the cutting blade 130 is driven by the mounting seat to move continuously, the cutting blade 130 is subjected to resistance from the trigger block 150 during the movement process, so as to rotate around the axis of the fixed shaft 111, and finally passes through the trigger block 150 to contact with the film layer 300 to be cut for cutting. That is, the cutting blade 130 can be automatically rotated by the trigger block 150, so as to provide a downward pressure to the film layer 300 to be cut, prevent the protective film on the film layer 300 from being warped and peeled off, and further prevent the film layer 300 from being cut from having defects such as bubbles.
In order to enable the trigger block 150 to automatically rotate the cutting blade 130 without blocking the cutting blade 130 from passing through, in some embodiments, the trigger block 150 may optionally protrude from the surface of the frame 110 by a size smaller than the distance between the fixed shaft 111 and the surface of the frame 110. Because the fixed shaft 111 is a rotating shaft of the cutting blade 130 when rotating relative to the frame 110, the size of the trigger block 150 protruding from the surface of the frame 110 is smaller than the distance between the fixed shaft 111 and the surface of the frame 110, that is, the position of the rotating shaft of the cutting blade 130 is higher than the surface of the trigger block 150, so that the cutting blade 130 can be driven to rotate by contacting with the trigger block 150 and cannot pass through the trigger block 150 when moving towards the direction close to the film layer 300 to be cut under the driving of the mounting seat.
Since the trigger block 150 is often in contact with the cutting blade 130 during the cutting operation, in order to increase the useful life of the trigger block 150, in some embodiments, the trigger block 150 is optionally made of a material that includes plastic. Illustratively, the trigger block 150 is made of a material including UPE (Ultra-high molecular weight polyethylene) material. The UPE material has outstanding impact resistance, stress cracking resistance, high-temperature creep resistance, low friction coefficient, self-lubricity, excellent chemical corrosion resistance, fatigue resistance, noise damping property, nuclear radiation resistance and the like, and can effectively prolong the service life of the trigger block 150.
Fig. 8 is a schematic diagram illustrating an overall structure of a film cutting device according to an embodiment of the present application.
Referring to fig. 8, an embodiment of the present invention further provides a film cutting device, which includes the film cutting mechanism 100 and a bottom plate 200, where the bottom plate 200 is disposed parallel to the frame 110. By adopting the film cutting mechanism 100 in the above embodiment, the fixing shaft 111 is disposed on the frame 110, and the cutting tool holder 120 is rotatably connected to the fixing shaft 111 around the axis of the fixing shaft 111, so that the cutting tool holder 120 and the cutting tool 130 can rotate around the axis of the fixing shaft 111 relative to the frame 110. By adopting the film cutting mechanism 100 to cut the film 300 to be cut, the protective film on the film 300 to be cut cannot be warped and peeled off, so that the defects of bubbles and the like on the film 300 to be cut can be avoided.
As shown in fig. 8, in some embodiments, optionally, the bottom plate 200 is provided with a plurality of suction holes 210 for sucking the film layer 300 to be cut. The suction holes 210 can suck air to form a negative pressure on the base plate 200, and the film layer 300 to be cut on the base plate 200 can be sucked on the base plate 200 by the negative pressure. At this time, the film cutting apparatus may further include an air pumping mechanism, which is communicated with the adsorption holes 210 through a pipe to pump air at the adsorption holes 210.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The utility model provides a membrane layer cuts mechanism which characterized in that includes:
the device comprises a rack, wherein a fixed shaft is arranged on the rack;
the cutting knife seat is rotationally connected to the fixed shaft around the axis of the fixed shaft; and
and the cutting blade is fixedly connected with the cutting knife seat.
2. The film layer cutting mechanism as set forth in claim 1, wherein said cutting blade includes an annular blade disposed around said cutting blade holder, a central axis of said annular blade being parallel to an axis of said fixed shaft.
3. The film layer cutting mechanism as recited in claim 1, further comprising a bearing, wherein the bearing comprises an inner ring, an outer ring sleeved on the inner ring, and a rolling element disposed between the inner ring and the outer ring, and the outer ring is configured to rotate relative to the inner ring;
the inner ring is sleeved on the fixed shaft, and the cutting tool holder is sleeved on the outer ring.
4. The film cutting mechanism as set forth in claim 1, wherein a mounting seat is disposed on the frame, the mounting seat is slidably connected to the frame, and the fixing shaft is disposed on the mounting seat, so that the cutting blade and the cutting blade seat can move relative to the frame along a predetermined direction under the driving of the mounting seat.
5. The film layer cutting mechanism as set forth in claim 4, further comprising a driving member in transmission connection with the mounting base, wherein the driving member is configured to provide power for moving the mounting base relative to the frame along the predetermined direction.
6. The film layer cutting mechanism as set forth in claim 4 further comprising a trigger block disposed in a path of movement of said cutting blade relative to said frame, said trigger block being fixedly disposed relative to said frame, said trigger block being configured for providing a motive force for rotating said cutting blade and said cutting blade holder relative to said fixed shaft when said cutting blade passes said trigger block.
7. The film layer cutting mechanism as set forth in claim 6, wherein the size of the trigger protruding from the surface of the frame is smaller than the distance between the fixed shaft and the surface of the frame.
8. The film cutting mechanism of claim 6 wherein the trigger block is made of a material including plastic.
9. A film layer cutting device, comprising:
the film layer cutting mechanism of any one of claims 1 to 8; and
the bottom plate, the bottom plate with frame parallel arrangement.
10. The film layer cutting device as claimed in claim 9, wherein the base plate is provided with a plurality of suction holes for sucking the film layer to be cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210389244.8A CN114734716A (en) | 2022-04-14 | 2022-04-14 | Film cutting mechanism and film cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210389244.8A CN114734716A (en) | 2022-04-14 | 2022-04-14 | Film cutting mechanism and film cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114734716A true CN114734716A (en) | 2022-07-12 |
Family
ID=82281277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210389244.8A Pending CN114734716A (en) | 2022-04-14 | 2022-04-14 | Film cutting mechanism and film cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114734716A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201800071U (en) * | 2010-09-20 | 2011-04-20 | 深圳市盛波光电科技有限公司 | Multi-angle film cutting device |
| US20120211153A1 (en) * | 2010-03-09 | 2012-08-23 | Nitto Denko Corporation | Method of cutting laminate film, cutting apparatus and method of manufacturing optical display device |
| CN205766293U (en) * | 2016-05-31 | 2016-12-07 | 黄金荣 | Plastic foil automatic cutting means |
| CN206436302U (en) * | 2016-12-08 | 2017-08-25 | 深圳市东鹏印刷厂 | Print guillotine |
| CN108326958A (en) * | 2017-12-29 | 2018-07-27 | 重庆市中光电显示技术有限公司 | Polaroid cutting means |
| CN110713053A (en) * | 2019-10-12 | 2020-01-21 | 中国乐凯集团有限公司 | Knife roller assembly for film preparation device and film preparation device |
| CN110722625A (en) * | 2019-10-29 | 2020-01-24 | 镇江立达纤维工业有限责任公司 | Longitudinal cutter adjusting device |
| CN211306456U (en) * | 2019-10-23 | 2020-08-21 | 中国乐凯集团有限公司 | Film edge cutting device |
| CN111716428A (en) * | 2020-06-29 | 2020-09-29 | 李德清 | Clothing fabric cutting device |
-
2022
- 2022-04-14 CN CN202210389244.8A patent/CN114734716A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120211153A1 (en) * | 2010-03-09 | 2012-08-23 | Nitto Denko Corporation | Method of cutting laminate film, cutting apparatus and method of manufacturing optical display device |
| CN201800071U (en) * | 2010-09-20 | 2011-04-20 | 深圳市盛波光电科技有限公司 | Multi-angle film cutting device |
| CN205766293U (en) * | 2016-05-31 | 2016-12-07 | 黄金荣 | Plastic foil automatic cutting means |
| CN206436302U (en) * | 2016-12-08 | 2017-08-25 | 深圳市东鹏印刷厂 | Print guillotine |
| CN108326958A (en) * | 2017-12-29 | 2018-07-27 | 重庆市中光电显示技术有限公司 | Polaroid cutting means |
| CN110713053A (en) * | 2019-10-12 | 2020-01-21 | 中国乐凯集团有限公司 | Knife roller assembly for film preparation device and film preparation device |
| CN211306456U (en) * | 2019-10-23 | 2020-08-21 | 中国乐凯集团有限公司 | Film edge cutting device |
| CN110722625A (en) * | 2019-10-29 | 2020-01-24 | 镇江立达纤维工业有限责任公司 | Longitudinal cutter adjusting device |
| CN111716428A (en) * | 2020-06-29 | 2020-09-29 | 李德清 | Clothing fabric cutting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA2644993C (en) | Food product slicer knife and associated slicer and knife removal tool | |
| EP0845440A1 (en) | Apparatus for cutting the peripheral portion of a film projecting form the peripheral edge of a laminated glass plate | |
| US9390958B2 (en) | Transfer unit including suction openings configured to receive suction pads or seal members therein | |
| CN108972164B (en) | Ultrasonic rotating disc type automatic grinding equipment and grinding method for carbon fiber composite material | |
| US11904492B2 (en) | Strip cutting device for diagnostic kit | |
| CN114734716A (en) | Film cutting mechanism and film cutting device | |
| CN111280200B (en) | Automatic ultrasonic cake cutting machine | |
| CN211841526U (en) | Automatic centering and V-shaped groove or edge cutting device for wafer | |
| CN210025469U (en) | Film cutting device | |
| JP2007281210A (en) | Method and apparatus for slicing substrate | |
| KR20060047162A (en) | Method of cutting a protective tape and protective tape cutting apparatus using the same method | |
| CN111406769B (en) | Ultrasonic cake cutting machine convenient to material loading and unloading | |
| CN109459230A (en) | A kind of rotation detection jig of cutter | |
| CN111406770B (en) | Automatic ultrasonic cake cutting machine | |
| CN212763732U (en) | Vegetable dicing device | |
| CN213437848U (en) | Laser cutting device | |
| JP2011120545A (en) | Welsh onion cutting apparatus | |
| CN214749862U (en) | Mobile rotating device and wafer detection equipment | |
| CN107786047B (en) | Impeller assembly equipment | |
| CN213481968U (en) | Durability testing device | |
| CN220731482U (en) | Wafer flat edge alignment device | |
| KR102556907B1 (en) | Double side chamfering apparatus | |
| CN217861650U (en) | Slicing equipment with adjustable slicing thickness | |
| CN218631991U (en) | Wafer turnover mechanism | |
| CN220740095U (en) | Fixed knife assembly mounting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |