KR20060047162A - Protective tape cutting method and protective tape cutting device - Google Patents

Abstract

The present invention relates to a method for driving a cutter blade along the outer periphery of a semiconductor wafer to cut out a protective tape attached to a surface of the semiconductor wafer according to the outer shape of the wafer. Change the angle of the cutter blade about the center.

Semiconductor, wafer, cutter, protective tape, cutting

Description

Protective tape cutting method and protective tape cutting device {METHOD OF CUTTING A PROTECTIVE TAPE AND PROTECTIVE TAPE CUTTING APPARATUS USING THE SAME METHOD}

1 is a perspective view showing an entire protective tape attaching device according to an embodiment of the present invention.

2 is a front view of a tape cutter tool.

3 is a perspective view of a main portion of the tape cutting tool;

4 is a plan view of a main portion of the tape cutter tool;

Fig. 5 is a side view of the main portion of the tape cutting tool.

6 is a front view of the main portion of the guide mechanism;

7 is a perspective view of the cutter support member.

8 is an explanatory diagram of an intersection angle of cutter blades.

9 is an operation explanatory diagram of an example device.

10 is an operation explanatory diagram of an example device.

11 is an operation explanatory diagram of an example device.

12 is an operation explanatory diagram of an example device.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for cutting a protective tape attached to the surface of a semiconductor wafer according to the outer shape of the wafer by relatively running the cutter blade along the outer circumference of the semiconductor wafer.

As cutting means of the said protective tape, it is disclosed by Unexamined-Japanese-Patent No. 2004-25438, for example. Specifically, the protective tape is supplied to the surface of the wafer held on the table, and the attachment roller is electrically driven to attach the protective tape to the surface of the wafer. Thereafter, the cutter blade is stuck on the protective tape, and the table is rotated relative to the outer circumference of the wafer by rotating the table, and the protective tape is cut along the outer circumference of the wafer. By cutting and adjusting the crossing angle of the cutter blade with respect to the surface of the wafer in the wafer radial direction at the time of cutting the said protective tape, the amount of blowing out of the protective tape with respect to the outer periphery of a wafer is chamfered by the thickness of a wafer and the outer periphery of a wafer. It is comprised so that adjustment can be carried out arbitrarily according to shape or the like.

However, the cutting means of the protective tape has the following problems.

For example, as a means for changing and adjusting the crossing angle of the cutter blade in the wafer radial direction with respect to the surface of the wafer, a structure for changing and adjusting the inclination angle of the cutter unit around a point set at a high position above the table is adopted. It is. Therefore, if the angle of the cutter blade is changed, the position of the cutter blade is changed up and down, the cutting position of the protective tape is changed, and the angle and height of the cutter blade need to be adjusted. There is a problem.

The present invention has been made in view of such a problem, and a main object thereof is to enable the angle adjustment of the cutter blade to be quickly performed.

In order to achieve such an object, the present invention adopts the following configuration.

In a method of cutting a protective tape of a semiconductor wafer in which the cutter blade is driven relative to the outer periphery of the semiconductor wafer to cut out the protective tape attached to the surface of the semiconductor wafer according to the wafer outline.

The method includes the step of changing and adjusting the crossing angle of the cutter blade in the wafer radial direction with respect to the surface of the semiconductor wafer,

In the above process, the angle of the cutter blade is changed with the cutting edge in contact with the edge of the cutter blade and the protective tape.

According to the protective tape cutting method of the present invention, even if the angle of the cutter blade is adjusted, there is no change in position at the cutting portion where the edge of the cutter blade and the protective tape contact, so that the angle adjustment of the cutter blade is completed in a short time.

Therefore, when adjusting the amount of blowing of the protective tape to the outer circumference of the wafer in accordance with the thickness of the wafer, the chamfered shape of the outer circumference of the wafer, etc., the adjustment is solved in a short time, and the procedure time accompanying the change of the working type is shortened. It is effective in improving work efficiency.

Further, according to the method of cutting the protective tape of the present invention, by adjusting the angle of the edge to the running direction of the cutter blade and by cutting the protective tape in accordance with the outer shape of the semiconductor wafer, by elastic means directed toward the center side of the semiconductor wafer. It is preferable to push the cutter blade slippery. According to this structure, the position of a cutter blade can be matched precisely.

In addition, the edge of the cutter blade is, for example, the edge of the cutter blade, the cutting edge contacting the edge of the cutter blade and the protective tape, the thickness of the protective tape that the blade edge of the cutter blade can penetrate through the protective tape. Have

Moreover, this invention adopts the following structures, in order to achieve such an objective.

In a method of cutting a protective tape of a semiconductor wafer in which the cutter blade is driven relative to the outer circumference of the semiconductor wafer to cut out the protective tape attached to the surface of the semiconductor wafer according to the outer shape of the wafer.

The method includes the step of changing and adjusting the crossing angle of the cutter blade in the wafer radial direction with respect to the surface of the semiconductor wafer,

In this process, the blade edge of the cutter blade in contact with the cutting portion of the protective tape is used as a point, and the base end side holding the cutter blade is swung in an arc shape to change the angle of the cutter blade. .

According to the method of cutting the protective tape of the present invention, even if the angle of the cutter blade is adjusted, there is no change in position at the cutting portion where the edge of the cutter contacts the protective tape, and the angle of the cutter blade is completed in a short time.

Therefore, when adjusting the amount of blowing of the protective tape to the outer circumference of the wafer in accordance with the thickness of the wafer, the chamfered shape of the outer circumference of the wafer, etc., the adjustment is solved in a short time, and the procedure time accompanying the change of the working type is shortened. It is effective in improving work efficiency.

Further, according to the method of cutting the protective tape of the present invention, by adjusting the angle of the edge to the running direction of the cutter blade and by cutting the protective tape in accordance with the outer shape of the semiconductor wafer, by elastic means directed toward the center side of the semiconductor wafer. It is preferable to push the cutter blade slippery. According to this structure, the position of a cutter blade can be matched precisely.

In addition, the edge of the cutter blade is, for example, the edge of the cutter blade, the cutting edge contacting the edge of the cutter blade and the protective tape, the thickness of the protective tape that the blade edge of the cutter blade can penetrate through the protective tape. Have

Moreover, this invention adopts the following structures, in order to achieve such an objective.

A protective tape cutting device for semiconductor wafers, wherein the cutter tape is moved along the outer circumference of the semiconductor wafer to cut out the protective tape attached to the surface of the semiconductor wafer according to the outer shape of the wafer.

The apparatus includes a support bracket for driving turning around a center axis of the semiconductor wafer and a concentric longitudinal axis;

A cutter support member to which a cutter blade attached to the bracket is attached;

It is provided between the support bracket and the cutter support member, and is provided with a guide mechanism for moving the support bracket and the cutter support member in an arc shape around the cutting edge where the edge of the cutter blade and the protective tape contact each other.

By inserting the guide mechanism, the cutter support member is characterized in that it supports the angle adjustable and fixed to the support bracket.

According to the protective tape cutting device of the present invention, by adjusting the movement of the cutter support member by inserting the guide mechanism to the support bracket, the cutter blade can be angled with respect to the cutting portion.

Therefore, by introducing an arc-shaped guide mechanism, it is possible to change and adjust the angle of the cutter blade centering on the cutting portion at which a mechanical point cannot be provided, and the above-described cutting method of the protective tape can be preferably performed. have.

The guide mechanism comprises an arc-shaped slide guide groove and an arc-shaped slide protrusion into which the slide is freely inserted in the arc direction. The slide guide groove is provided on one side of the support bracket and the cutter support member. It is preferable to comprise so that the said slide protrusion part.

According to this configuration, even if the angle of the cutter blade is adjusted, there is no change in position at the cutting portion where the edge of the cutter blade and the protective tape contact, so that the angle of the cutter blade can be adjusted in a short time.

The protective tape cutting device of the present invention further includes a traveling angle adjusting mechanism for adjusting the angle of the edge of the cutter blade relative to the running direction of the cutter blade, and the cutting of the protective tape in accordance with the shape of the semiconductor wafer. An elastic means for slidingly pushing the cutter blade toward the center side of the cutter, and furthermore, a mark capable of confirming the slide position from the hole when the slide moves while the slide projection is fitted in the slide guide groove. Is preferably provided on one side of the slide guide groove or the slide member, and on the other side, a memory capable of reading the angle of the cutter blade at the position of the mark identified from the long hole is provided.

According to this structure, the position of a cutter blade can be matched precisely.

While some preferred forms are presently contemplated for describing the invention, the invention is not limited to the configuration and method as shown.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

1 is a perspective view showing the overall configuration of a protective tape applying device. This protective tape applying device includes a wafer supply / recovery unit 1 and a robot arm 2 loaded with a cassette C containing a semiconductor wafer (hereinafter simply abbreviated as “wafer”) W. FIG. Surface protective protective tape T toward the wafer W, the wafer conveyance mechanism 3, the alignment stage 4, the chuck table 5 for holding and holding the wafer W, and the wafer W; ) Is provided in the tape supply unit 6 for supplying the separator, the separator recovery unit 7 for peeling and recovering the separator s from the protective tape T with the separator supplied from the tape supply unit 6, and the chuck table 5 Attachment unit 8 for attaching protective tape T to the suction and held wafer W, and tape cutting mechanism for cutting and cutting the protective tape T attached to the wafer W according to the outer shape of the wafer W. (9) Peeling unit (1) for attaching to wafer (W) and peeling off unnecessary tape (T`) after cutting 0), a tape recovery portion 11 for rolling off and collecting the unnecessary tape T ′ peeled off by the peeling unit 10, and the like, and specific configurations of the structures and mechanisms will be described below. .

Two cassettes C can be loaded in the wafer supply / recovery section 1 in parallel. In each cassette C, a plurality of wafers W having a wiring pattern face upward are sandwiched in a horizontal posture in multiple stages.

The robot arm 2 provided in the wafer conveyance mechanism 3 is comprised so that advancing and moving can be performed horizontally, and the whole can turn and lift up and down. Therefore, at the tip of the robot arm 2, a vacuum suction wafer holder 2a having a horseshoe shape is provided. The robot arm 2 sucks and holds the wafer W inner surface by inserting the wafer holding portion 2a into a gap such as the wafer W accommodated in the cassette C in multiple stages, and the wafer W held by the adsorption. ) Is taken out from the cassette C and conveyed in the order of the alignment stage 4, the chuck table 5, and the wafer supply / container 1.

The alignment stage 4 performs alignment of the wafer carried in by the wafer transfer mechanism 3 based on an orientation flat, notch, etc. formed on the outer periphery thereof.

The chuck table 5 is configured to vacuum suck the wafers W transferred from the wafer transfer mechanism 3 and placed in a predetermined position. In addition, since the protective tape T is cut on the upper surface of the chuck table 5 by rotating the cutter blade 12 provided in the tape cutter tool 9 described later according to the outer shape of the wafer W, the cutter tape is cut. The running groove 13 (refer FIG. 9) is formed.

The tape supply unit 6 guides the protective tape T with the separator introduced from the supply bobbin 14 to the guide roller 15 group and guides the protective tape T from which the separator is peeled off. 8) is configured to lead to. In addition, the tape supply part 6 is comprised so that the supply bobbin 14 may give a suitable rotational resistance and excess tape may not be inserted.

The separator recovery part 7 is made to roll-out the separator s peeled from the protective tape T, and to rotate-drive in the direction which the collection bobbin 16 rolls.

The attachment unit 8 is provided with an attachment roller 17 horizontally forward, and is reciprocally driven horizontally and horizontally by the slide guide mechanism 18 and a screw transmission type drive mechanism (not shown).

As shown in FIG. 9, the peeling unit 10 is provided with the peeling roller 19 horizontally in front, and is horizontally right and left by the said slide guide mechanism 18 and the screw transmission type drive mechanism not shown. It is designed to reciprocate.

The tape recovery part 11 is rotationally driven in the direction in which the recovery bobbin 20 which rolls out unnecessary tape T 'rolls out.

As shown in FIG. 1, the tape cutting tool 9 is basically located near the longitudinal center X positioned on the center of the chuck table 5, below the movable pedestal 21 capable of driving up and down. A pair of support arms 22 are mounted in parallel so as to be rotatable in a drive. With the cutter unit 23 provided on the free end side of the support arms 22, the cutter blades 12 with the blade ends downward are It is installed. That is, when the support arm 22 pivots around the longitudinal center X, the cutter blade 12 travels along the outer periphery of the wafer W to cut out the protective tape T. As shown in FIG. The detailed structure of the tape cutter mechanism 9 is shown in Figs.

As shown in FIG. 2, the movable stand 21 is moved up and down with a screw along the longitudinal rail 25 by driving the motor 24 forward and reverse rotation. Moreover, the rotating shaft 26 equipped so that the free end of this movable stand 21 is rotatable near the said longitudinal axis X is provided with the two belts (for the motor 27 arrange | positioned on the movable stand 21). It is comprised so that the rotation shaft 26 may rotate at low speed by the operation | movement of the motor 27 by interlocking 28). Thus, as shown in FIG. 3, the support arm 22 is horizontally slide-adjustably supported under the support member 29 extending downward from the pivot shaft 26. Therefore, by adjusting the slide of the support arm 22, it is possible to change and adjust the turning radius of the cutter blade 12 corresponding to the wafer diameter.

The bracket 30 is fixed by the free end of the support arm 22, and the cutter unit 23 is attached to this bracket 30, and is supported. The cutter unit 23 supports the rotating member 31 supported by the bracket 30 so as to be rotatable near the longitudinal axis Y, and the vertical wall-shaped support bracket 32 connected to the end surface of the rotating member 31. The cutter support member 33 connected to the side of the bracket 32, the movable bracket 34 slidably supported horizontally on the cutter support member 33, the cutter holder 35 installed on the movable bracket 34, and the like. It consists of. The cutter blade 12 is screwed to the side surface of the cutter holder 35 so that the rear edge of the blade coincides with the longitudinal axis Y.

Here, as shown in FIG. 4, on the upper side of the rotating member 31, an operating flange that rotates integrally with the rotating member 31 by a relationship between the long hole 36 and two pins 37. flange 38 is arranged. The operation flange 38 is rotated by an air cylinder 39, whereby the posture near the longitudinal axis Y of the entire cutter unit 23 with respect to the support arm 22, that is, the cutter blade ( It is possible to adjust the angle with respect to the travel direction of 12) within a predetermined small range. In addition, the bracket 30, the rotation member 31, the long hole 36, the operation flange 38, and the air cylinder 39 correspond to the traveling angle adjustment mechanism of this invention.

5 to 7, the cutter support member 33 is rotatably connected to the support bracket 32 by sandwiching the guide mechanism 40. The guide mechanism 40 is a partial arc-shaped slide guide groove 41 formed on the side surface of the support bracket 32, and sandwiches the partial arc-shaped slide protrusion 42 protruding from the side surface of the support bracket 32. The cutter support member 33 is pivotally rotated with respect to the support bracket 32 within a predetermined range (for example, 30 °) with the center of curvature of the slide guide groove 41 and the slide protrusion 42 as a point. It is possible. Thus, the center of curvature P of the slide guide groove 41 and the slide protrusion 42 formed in the partial arc shape is in the wafer radial direction of the cutter blade 12 with respect to the wafer surface at the blade edge of the cutter blade 12. It is possible to change and adjust the crossing angle (?, See Fig. 8).

In addition, at the bottom of the concave slide guide groove 41, a partial arc-shaped long hole 43 is formed with the same curvature, and the two holders are inserted into the long hole 43 from the rear surface of the support bracket 32. 44 is pushed into the cutter support member 33 so that the cutter support member 33 can be fixed at any slide position. Further, on the bottom of the slide guide groove 41, a memory (not shown) is engraved at a predetermined angle pitch (2 ° in this example) so that the slide position of the slide protrusion 42 fitted into the groove 41 can be confirmed. It is installed. That is, as shown in FIG. 7, the mark 45 is attached to the surface of the slide protrusion 42 which faces the bottom of the slide guide groove 41, and accompanies the slide movement of the slide protrusion 42. By referring to the position where the mark 45 moves and the memory of the slide guide groove 41, the angle of intersection of the cutter blade 12 in the wafer radial direction with respect to the wafer surface is known.

Further, a tension spring 46 is attached between the cutter support member 33 and the movable bracket 34 which is slidably connected horizontally to the cutter support member 33, and the movable bracket 34 slides toward the cutter pivot center side. It is supposed to be attached. In addition, the tension spring 46 acts as an elastic means of the present invention.

Next, a series of basic operations for attaching the protective tape T to the surface of the wafer W using the above-described embodiment device will be described.

When the attaching instruction is given, first, the robot arm 2 in the wafer conveyance mechanism 3 is moved toward the cassette C installed in the wafer supply / recovery section 1, and the wafer holding section 2a is provided. Is inserted between the gaps of the wafers accommodated in the cassette (C). Therefore, the wafer W is sucked and held from the inner surface (lower surface) by the wafer holding section 2a, and the wafer W is removed and moved to the alignment stage 4.

The wafer W provided in the alignment stage 4 is aligned using the notch formed in the outer periphery of the wafer W. As shown in FIG. The positioned wafer W is again carried out by the robot arm 2 and placed on the chuck table 5.

The wafer placed on the chuck table 5 is held and held in such a state that its center is on the center of the chuck table 5. At this time, as shown in Fig. 9, the attachment unit 8 and the peeling unit 10 are at the initial position on the left side, and the cutter blades 12 of the tape cutting tool 9 are respectively at the initial position on the upper side. I'm waiting.

Next, as shown by the imaginary line in FIG. 9, the attachment roller 17 of the attachment unit 8 is lowered | hung, and the wafer W is hold | maintained while pressing the protection tape T downwardly to this attachment roller 17. FIG. ) Is rotated forward (right in Fig. 9). By this rolling operation, the protective tape T is attached to the entire surface of the wafer W (see FIG. 10).

Next, the attachment unit 8 reaches the end position, and as shown in FIG. 11, the cutter blade 12 waiting upward is lowered to protect the cutter running groove 13 of the chuck table 5. It is stabbed with tape T.

The cutter blade 12 is lowered to a predetermined cutting height position and stopped, and as shown in FIG. 12, the support arm 22 is rotated in a predetermined direction, and accompanying this, the cutter blade 12 is longitudinally centered. The protective tape T is cut in accordance with the wafer outline by pivoting around (X). In this case, the cutter blade 12 is driven while being pressed against the outer circumference of the wafer W by the sliding and pushing force of the tension spring 46, and the tape cutting according to the outer shape of the wafer W is performed. All.

When the tape cutting along the outer circumference of the wafer W is completed, as shown in FIG. 12, the cutter blade 12 is raised to the original standby position, and then, with the peeling unit 10 moving forward. The unnecessary tape T` cut out on the wafer W is wound up and peeled off.

The peeling unit 10 reaches the end position of the peeling operation, and the peeling unit 10 and the attachment unit 8 move in the reverse direction to return to the initial position. At this time, the unnecessary tape T 'is rolled up by the recovery bobbin 20, and a certain amount of the protective tape T is fed from the tape supply unit 6. As shown in FIG.

After the tape attaching operation is finished and the adsorption on the chuck table 5 is released, the wafer W on which the adhesion treatment is resolved is transferred to the wafer holding portion 2a of the robot arm 2 to supply / return the wafer. It is inserted into the cassette C of the section 1 and recovered.

After the one-time tape applying process is completed, the above operation is repeated sequentially.

In addition, this invention can also be implemented with the following forms.

(1) In constructing the above-described guide mechanism 40, it is also possible to install the slide projection 42 on the support bracket 32 and to install the slide guide groove 41 on the cutter support member 33. Do.

(2) The guide mechanism 40 can be constituted by an arc-shaped slide guide rod centered on the cut portion of the cutter blade 12 and a member slidably fitted outside in accordance with the rod. .

The present invention can be embodied in other specific forms without departing from the spirit or essence thereof, and therefore, the scope of the invention should be referred to, rather than the foregoing description, with reference to the appended claims.

According to the present invention, even if the angle of the cutter blade is adjusted, there is no change in position at the cutting portion where the edge of the cutter blade and the protective tape come into contact, so that the angle of the cutter blade can be adjusted in a short time.

Therefore, when adjusting the amount of blowing of the protective tape to the outer circumference of the wafer in accordance with the thickness of the wafer, the chamfered shape of the outer circumference of the wafer, etc., the adjustment is solved in a short time, and the procedure time accompanying the change of the working type is shortened. It is effective in improving work efficiency.

Claims (13)

A semiconductor which cuts the protective tapes T attached to the surface of the semiconductor wafer W by running the cutter blade 12 relative to the outer circumference of the semiconductor wafer W according to the wafer W outline. In the method of cutting the protective tape of the wafer, The method includes the step of changing and adjusting the crossing angle of the cutter blade 12 in the wafer radial direction with respect to the surface of the semiconductor wafer W, In the above process, the cutting edge of the protective tape, characterized in that for changing the angle of the cutter blade (12) centered on the cutting portion that the edge of the cutter blade 12 and the protective tape (T) contact. The method of claim 1, The cutting method of the protective tape, characterized in that further comprising the step of adjusting the angle of the edge with respect to the running direction of the cutter blade (12). The method of claim 1, A protective tape, characterized in that the cutter blade 12 is slidably pushed by the elastic means toward the center of the semiconductor wafer W while the protective tape T is cut along the outer shape of the semiconductor wafer W. Cutting method. The method of claim 1, The blade edge of the cutter blade 12 is at the blade edge of the cutter blade 12, The cutting edge contacting the edge of the cutter blade 12 and the protective tape T has a thickness of the protective tape T through which the edge of the cutter blade 12 can penetrate the protective tape T. A method of cutting protective tapes. A method of cutting a protective tape of a semiconductor wafer in which the cutter blade 12 is relatively driven along the outer circumference of the semiconductor wafer W to cut out the protective tape T attached to the surface of the semiconductor wafer W according to the outer shape of the wafer W. To The method includes the step of changing and adjusting the crossing angle of the cutter blade 12 in the wafer radial direction with respect to the surface of the semiconductor wafer W, In this process, the blade end of the cutter blade 12 in contact with the cutting portion of the protective tape T is a point, and the base end side of the cutter blade 12 is swinged in an arc shape. Cutting the protective tape, characterized in that for changing the angle of the cutter blade (12). The method of claim 5, The cutting method of the protective tape, characterized in that further comprising the step of adjusting the angle of the edge with respect to the running direction of the cutter blade (12). The method of claim 5, A protective tape, characterized in that the cutter blade 12 is slidably pushed by the elastic means toward the center of the semiconductor wafer W while the protective tape T is cut along the outer shape of the semiconductor wafer W. Cutting method. The method of claim 5, The blade edge of the cutter blade 12 is at the blade edge of the cutter blade 12, The cutting edge contacting the edge of the cutter blade 12 and the protective tape T has a thickness of the protective tape T through which the edge of the cutter blade 12 can penetrate the protective tape T. A method of cutting protective tapes. In the protective tape cutting device of the semiconductor wafer to run the cutter blade 12 along the outer periphery of the semiconductor wafer (W) to cut out the protective tape (T) attached to the surface of the semiconductor wafer (W) according to the outer shape of the wafer (W). In The apparatus includes a support bracket 32 which is driven and rotated in the vicinity of the center of the semiconductor wafer W and its longitudinal axis, which is concentric. A cutter support member 33 to which a cutter blade 12 mounted to the bracket 32 is attached; Interposed between the support bracket 32 and the cutter support member 33, the support bracket 32 is formed in an arc shape centering on the cutting portion where the edge of the cutter blade 12 and the protective tape T come into contact with each other. And a guide mechanism 40 for moving the cutter support member 33, Inserting the guide mechanism 40, the protective tape cutting device, characterized in that for supporting the cutter support member 33 to be adjustable and fixed to the support bracket (32). The method of claim 9, The guide mechanism 40 is composed of an arc-shaped slide guide groove 41 and an arc-shaped slide protrusion 42 in which a slide is freely inserted in the arc direction. Protective tape cutting device, characterized in that provided with the slide guide (40) on one side of the support bracket (32) and the cutter support member (33), and the slide projection (42) on the other side. The method of claim 9, Protective tape cutting device further comprises a driving angle adjustment mechanism for adjusting the angle of the edge with respect to the running direction of the cutter blade (12). The method of claim 9, And elastic means for slidingly pushing the cutter blade 12 toward the center side of the semiconductor wafer W while cutting the protective tape T according to the outer shape of the semiconductor wafer W. Protective tape cutting device. The method of claim 9, On the bottom of the arc-shaped slide guide groove 41, a long hole 36 having the same curvature as the slide guide groove 41 is formed, When the slide is moved in a state where the slide protrusion 42 is inserted into the slide guide groove 41, a mark 45 for identifying the slide position from the long hole 36 extends to the slide guide groove 41. Installed on one side, A protective tape cutting device, characterized in that a memory capable of reading the angle of the cutter blade 12 from the position of the mark 45 identified from the long hole 36 is provided on the other side.

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