CN114734371A - Semiconductor manufacturing equipment for avoiding high-temperature explosion based on electronic industry - Google Patents
Semiconductor manufacturing equipment for avoiding high-temperature explosion based on electronic industry Download PDFInfo
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- CN114734371A CN114734371A CN202210355373.5A CN202210355373A CN114734371A CN 114734371 A CN114734371 A CN 114734371A CN 202210355373 A CN202210355373 A CN 202210355373A CN 114734371 A CN114734371 A CN 114734371A
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- penetrating
- side wall
- semiconductor manufacturing
- manufacturing equipment
- electronic industry
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of semiconductor manufacturing, and discloses semiconductor manufacturing equipment for avoiding high-temperature explosion based on the electronic industry. The cone and wear the space between the body top and accelerate outside air current and get into and replace away inside temperature, reduce the cone and excessively laminate semiconductor lateral wall and the situation that continuous work makes the temperature rise, the lateral wall of card pearl strikes the board at the swinging plate, the activity line runs through to the lateral wall department of swinging plate, drives the swinging plate vibration, will blow down from some granules of master internal side wall exhaust, reduce the trend that the granule upwards splashes, avoid simultaneously that gas particle is close to the mixture entering around and arouse the potential safety hazard.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to semiconductor manufacturing equipment for avoiding high-temperature explosion based on the electronic industry.
Background
The manufacturing and processing of semiconductors in the electronic industry need polish attenuate or grind semiconductor self according to the user demand of different products, semiconductor manufacturing equipment is in the in-process of continuous processing, the preorder process flow of semiconductor can lead to there being various unsafe gas and granule to mix together in same space, and the in-process of polishing or grinding is made to the semiconductor this moment, can make the contact point incessantly at the contact friction, the temperature of equipment itself can rise gradually, mix together with gas on every side, arouse high temperature explosion's accident easily, arouse the potential safety hazard.
Disclosure of Invention
In order to solve the problem that the temperature of equipment is easy to continuously rise due to continuous operation in the process of processing, grinding and manufacturing the semiconductor, so that the potential safety hazard is caused, and the purpose that the space directly contacted with the semiconductor processing and grinding can be switched to replace gas to achieve airflow cooling is achieved, the invention is realized by the following technical scheme: the semiconductor manufacturing equipment for avoiding high-temperature explosion based on the electronic industry comprises a main disc, wherein a support frame is connected to the outer side edge of the bottom of the main disc in a penetrating manner, a penetrating rod mechanism is connected to the bottom end of the support frame in a sliding manner, a penetrating body is arranged inside the penetrating rod mechanism, a penetrating body mechanism is connected to the bottom side wall of the main disc in a penetrating manner, a cone is arranged inside the penetrating body mechanism, a curtain supporting mechanism is connected to the side wall of the penetrating mechanism in a penetrating manner and movably connected to the side wall of the penetrating mechanism, an inserting rod, an elastic curtain and a penetrating frame are arranged inside the curtain supporting mechanism, the outer end of the inserting rod is connected to the side wall of the penetrating frame in a penetrating manner, an elastic curtain is connected to the side wall of the penetrating frame in a penetrating manner, a clamping mechanism is connected to the side end of the elastic curtain in a penetrating manner, a swinging plate, clamping beads and a movable wire are arranged inside the clamping beads, the side wall of the movable line is connected in the inner side wall of the swinging plate in a penetrating way and is connected with the side end of the elastic pull belt.
Furthermore, stab the inside of body mechanism and still include the backup pad, the top through connection of cone is inside the bottom side of backup pad, and the top lateral wall department through connection in the bottom lateral wall department of master, when the lateral wall of master rotated, can drive the cone rotatory.
Furthermore, the inside of the rod penetrating mechanism further comprises a supporting pad, and the top side wall of the supporting pad is connected to the bottom end of the penetrating body in a penetrating mode.
Further, the bottom end of the cone is located above the penetrating body, and the space between the bottom end of the cone and the top end of the penetrating body can accelerate the entering of external air flow.
Furthermore, the top end of the curtain supporting mechanism is movably connected to the bottom side wall of the main disc, and the curtain supporting mechanism is kept still when the side wall of the main disc rotates.
Furthermore, one end of the inserted bar, which is far away from the penetrating frame, is movably connected to the side wall of the penetrating body, and when the top end of the penetrating body penetrates through the side wall of the inserted bar, the side wall of the inserted bar at the bottom end can be pushed leftwards.
Further, the one end through connection that latch mechanism was kept away from to the bullet stretching strap has worn the shell, the inboard bottom through connection who wears the shell has lifted the board, lift the board and keep away from the one end swing joint who wears the shell and locate in the end lateral wall of elasticity curtain, lift the board and keep away from the outer end of wearing the shell when propping the end lateral wall of elasticity curtain, the elasticity curtain can drive to contract between the lateral wall of wearing the frame, can give the lateral wall of semiconductor the atress by the flexible adjustment aversion that drives of the lateral wall of elasticity curtain when, can guarantee that the lateral wall of semiconductor is rotatory to be ground more even.
Furthermore, the bottom end of the side wall of the swinging plate is movably connected to the side edge of the main disc, and the movable line penetrates through the side wall of the swinging plate and can blow some particles discharged from the inner side wall of the main disc downwards.
The invention provides a semiconductor manufacturing device for avoiding high-temperature explosion based on the electronic industry. The method has the following beneficial effects:
1. this semiconductor manufacturing equipment based on electronic industry avoids high temperature explosion, it is upwards to be extruded when the inserted bar through the bottom alternates along the lateral wall of wearing the body, the semiconductor on top is upwards extruded to accumulational inserted bar, it is rotatory to drive the backup pad when the master is rotatory, make the cone grind the lateral wall department of semiconductor, the cone is rotatory when keeping away from inserted bar lateral wall department, the entering of outside air current is accelerated in the space between cone and the wearing body top, go out the replacement of inside temperature, reduce the cone and excessively laminate semiconductor lateral wall and the situation that continuous work makes the temperature rise.
2. This semiconductor manufacturing equipment based on electronic industry avoids high temperature explosion, scrape with the inside wall department of bullet stretching strap when rotatory through the master, the lateral wall department of master is provided with the unsmooth piece and promotes latch mechanism to the distance, latch mechanism receives the restriction of bullet stretching strap, when the unsmooth piece of master lateral wall department changes latch mechanism, the activity line is being connected to the bullet stretching strap, the board is beaten at the wobble plate to the lateral wall of card pearl, make the activity line run through the lateral wall department to the wobble plate, drive the wobble plate vibration, can blow down some granules of following master inside wall exhaust, reduce the trend that the granule upwards splashes, avoid simultaneously that the gaseous granule is close to mixing to get into and arouses the potential safety hazard around.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view showing the connection of the internal structure of the lancing mechanism according to the present invention;
FIG. 3 is a right side schematic view of the structural connection between the plunger and the plunger mechanism of the present invention;
fig. 4 is a schematic view of the structural connection between the shell and the side wall of the curtain supporting mechanism.
In the figure: 1. a master disk; 2. a support frame; 3. a body poking mechanism; 311. a cone; 312. a support plate; 4. a rod penetrating mechanism; 411. a body is worn; 412. a support pad; 5. a curtain supporting mechanism; 511. inserting a rod; 512. an elastic curtain; 513. putting on a rack; 6. penetrating a shell; 7. lifting the plate; 8. a clamping mechanism; 811. a swinging plate; 812. clamping the beads; 813. a movable wire; 9. and (6) elastic pulling of the belt.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
The embodiment of the semiconductor manufacturing equipment for avoiding high-temperature explosion based on the electronic industry is as follows:
referring to fig. 1 to 4, a semiconductor manufacturing apparatus for avoiding high temperature explosion based on the electronics industry includes a main tray 1, a support frame 2 is connected to an outer side of a bottom of the main tray 1 in a penetrating manner, a rod penetrating mechanism 4 is slidably connected to a bottom end of the support frame 2, a penetrating body 411 is included in the rod penetrating mechanism 4, a support pad 412 is further included in the rod penetrating mechanism 4, a top side wall of the support pad 412 is connected to a bottom end of the penetrating body 411 in a penetrating manner, a bottom side wall of the main tray 1 is connected to a stabbing mechanism 3 in a penetrating manner, the stabbing mechanism 3 includes a cone 311, the stabbing mechanism 3 further includes a support plate 312, a top end of the cone 311 is connected to an inner side of a bottom side of the support plate 312 in a penetrating manner, a top side wall of the support plate 312 is connected to a bottom side wall of the main tray 1 in a penetrating manner, when the side wall of the main tray 1 rotates, the cone 311 can be driven to rotate, the bottom end of the cone 311 is positioned above the penetrating body 411, and the space between the bottom end of the cone 311 and the top end of the penetrating body 411 can accelerate the entering of external air flow;
the side wall of the rod penetrating mechanism 4 is penetrated and movably connected with a curtain supporting mechanism 5, the top end of the curtain supporting mechanism 5 is movably connected with the bottom side wall of the main disc 1, when the side wall of the main disc 1 rotates, the curtain supporting mechanism 5 is kept still, the curtain supporting mechanism 5 internally comprises an inserting rod 511, an elastic curtain 512 and a penetrating frame 513, the outer end of the inserting rod 511 is penetrated and connected with the side wall of the penetrating frame 513, the side wall of the elastic curtain 512 is penetrated and connected with the side wall of the penetrating frame 513, one end of the inserting rod 511 far away from the penetrating frame 513 is movably connected with the side wall of the penetrating body 411, when the top end of the penetrating body 411 is penetrated and connected with the side wall of the inserting rod 511, the side wall of the inserting rod 511 at the bottom end can be pushed leftwards, one end of the elastic pull belt 9 far away from the clamping mechanism 8 is penetrated and connected with a penetrating shell 6 in a penetrating manner, the bottom end of the inner side of the penetrating shell 6 is penetrated and connected with a lifting plate 7 in a penetrating way, one end of the lifting plate 7 far away from the penetrating shell 6 is movably connected with the bottom side wall of the elastic curtain 512, the outer end of the lifting plate 7 far away from the penetrating shell 6 is positioned at the bottom side wall of the elastic curtain 512, the elastic curtain 512 can drive the side walls of the penetrating frame 513 to contract, and can drive the side walls of the semiconductors to adjust and shift when stressed by the stretching of the side walls of the elastic curtain 512, so that the side walls of the semiconductors can be ensured to be more uniformly ground in a rotating manner;
the outside limit through connection of main disc 1 has play stretching strap 9, the side through connection of play stretching strap 9 has latch mechanism 8, latch mechanism 8's inside is including pendulum plate 811, card pearl 812 and activity line 813, the inside through connection of card pearl 812 is in the lateral wall of activity line 813, the lateral wall through connection of activity line 813 is in the inside wall of pendulum plate 811 and is connected with the side of play stretching strap 9, the lateral wall bottom swing joint of pendulum plate 811 is in the side department of main disc 1, activity line 813 runs through to the lateral wall department of pendulum plate 811, can blow down some granules of following the main disc 1 inside wall exhaust.
The working principle is as follows: as shown in fig. 1-3, the sidewall of the semiconductor to be polished is inserted into the sidewall slit of the insertion rod 511, when the sidewall of the insertion rod 511 passes through the sidewall of the penetrating body 411, the thickness of the sidewall of the semiconductor to be polished can be determined according to the height between the sidewall of the penetrating mechanism 4 and the bottom sidewall of the top piercing mechanism 3, when the top end of the penetrating body 411 passes through the sidewall of the insertion rod 511, the sidewall of the insertion rod 511 at the bottom end can be pushed to the left, the insertion rod 511 at the top end is inserted into the binding tube of the penetrating body 411, the sidewall of the penetrating body 411 is triangular, the sidewall of the insertion rod 511 at the bottom end is pressed and stacked upwards along the sidewall of the penetrating body 411, so that the stacked sidewall of the insertion rod 511 presses the semiconductor sidewall at the top end upwards, when the sidewall of the main tray 1 rotates, the sidewall of the supporting plate 312 can be driven to rotate to polish the sidewall of the cone 311, because the side wall of the insertion rod 511 is inserted into the inner side wall of the insertion rod 511, and the side wall of the insertion rod 511 is only located on one side of the main disk 1, when the side wall of the cone 311 rotates to a position far away from the side wall of the insertion rod 511, the space between the bottom end of the cone 311 and the top end of the penetrating body 411 accelerates the entering of external air flow, replaces the internal temperature, and reduces the situation that the temperature is increased due to the fact that the cone 311 is excessively attached to the side wall of the semiconductor and continuously works;
as shown in fig. 1 and 4, when the side wall of the main tray 1 rotates, the side wall of the elastic pull belt 9 is scraped, a concave-convex block is arranged at the side wall of the main tray 1, the side wall of the latch mechanism 8 can be pushed to a far distance, the side wall of the latch mechanism 8 is limited by the elastic pull belt 9, when the concave-convex block at the side wall of the main tray 1 rotates to the side wall of the latch mechanism 8, the elastic pull belt 9 is connected with a movable wire 813, the side wall of the clamp bead 812 is knocked at the side wall of the swing plate 811, the movable wire 813 can penetrate through the side wall of the swing plate 811, some particles discharged from the inner side wall of the main tray 1 can be blown downwards, and the upward splashing tendency of the particles is reduced.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. Semiconductor manufacturing equipment for avoiding high-temperature explosion based on the electronic industry, comprising a main disc (1), characterized in that: the bottom outer side edge of the main disc (1) is connected with a support frame (2) in a penetrating mode, the bottom end of the support frame (2) is connected with a penetrating rod mechanism (4) in a sliding mode, the inside of the penetrating rod mechanism (4) comprises a penetrating body (411), the bottom side wall of the main disc (1) is connected with a piercing body mechanism (3) in a penetrating mode, the inside of the piercing body mechanism (3) comprises a cone (311), the side wall of the penetrating rod mechanism (4) is connected with a curtain-supporting mechanism (5) in a penetrating mode, the inside of the curtain-supporting mechanism (5) comprises an inserted rod (511), an elastic curtain (512) and a penetrating frame (513), the outer end of the inserted rod (511) is connected with the side wall of the penetrating frame (513) in a penetrating mode, the side wall of the elastic curtain (512) is connected with the side wall of the penetrating frame (513) in a penetrating mode, the outer side edge of the main disc (1) is connected with an elastic pull belt (9) in a penetrating mode, and the side end of the elastic pull belt (9) is connected with a clamping mechanism (8) in a penetrating mode, the clamping mechanism (8) comprises a swing plate (811), a clamping bead (812) and a movable wire (813), the clamping bead (812) is connected to the side wall of the movable wire (813) in a penetrating mode, and the side wall of the movable wire (813) is connected to the inner side wall of the swing plate (811) in a penetrating mode and connected with the side end of the elastic pull belt (9).
2. The semiconductor manufacturing equipment for avoiding high temperature explosion based on the electronic industry as claimed in claim 1, wherein: the stab body mechanism (3) is characterized in that a supporting plate (312) is further arranged inside the stab body mechanism, the top end of the cone (311) is connected inside the bottom side of the supporting plate (312) in a penetrating mode, and the top side wall of the supporting plate (312) is connected to the bottom side wall of the main disc (1) in a penetrating mode.
3. The semiconductor manufacturing equipment for avoiding high temperature explosion based on the electronic industry as claimed in claim 1, wherein: the rod penetrating mechanism (4) further comprises a supporting pad (412), and the top side wall of the supporting pad (412) is connected to the bottom end of the penetrating body (411) in a penetrating mode.
4. The semiconductor manufacturing equipment for avoiding high temperature explosion based on the electronic industry as claimed in claim 1, wherein: the bottom end of the cone (311) is positioned above the penetrating body (411).
5. The semiconductor manufacturing equipment for avoiding high temperature explosion based on the electronic industry as claimed in claim 1, wherein: the top end of the curtain supporting mechanism (5) is movably connected to the bottom side wall of the main disc (1).
6. The semiconductor manufacturing equipment for avoiding high temperature explosion based on the electronic industry as claimed in claim 1, wherein: one end of the inserting rod (511) far away from the penetrating frame (513) is movably connected to the side wall of the penetrating body (411).
7. The semiconductor manufacturing equipment for avoiding high temperature explosion based on the electronic industry as claimed in claim 1, wherein: shell (6) is worn to the one end through connection that latch mechanism (8) were kept away from in bullet stretching strap (9), the inboard bottom through connection who wears shell (6) has and lifts board (7), it keeps away from the one end swing joint in the end lateral wall department of elasticity curtain (512) of wearing shell (6) to lift board (7).
8. The semiconductor manufacturing equipment for avoiding high temperature explosion based on the electronic industry as claimed in claim 1, wherein: the bottom end of the side wall of the swinging plate (811) is movably connected to the concave-convex part of the side edge of the main disc (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210355373.5A CN114734371A (en) | 2022-04-06 | 2022-04-06 | Semiconductor manufacturing equipment for avoiding high-temperature explosion based on electronic industry |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210355373.5A CN114734371A (en) | 2022-04-06 | 2022-04-06 | Semiconductor manufacturing equipment for avoiding high-temperature explosion based on electronic industry |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114734371A true CN114734371A (en) | 2022-07-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210355373.5A Pending CN114734371A (en) | 2022-04-06 | 2022-04-06 | Semiconductor manufacturing equipment for avoiding high-temperature explosion based on electronic industry |
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|---|---|
| CN (1) | CN114734371A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN212444726U (en) * | 2020-04-29 | 2021-02-02 | 明曜半导体设备(沈阳)有限公司 | Semiconductor processing grinding device |
| CN112435939A (en) * | 2020-11-23 | 2021-03-02 | 上饶市迈创商贸有限公司 | Semiconductor degumming machine auxiliary device capable of preventing blade from dripping due to residual colloid |
| CN113400179A (en) * | 2021-07-23 | 2021-09-17 | 上海芯莘科技有限公司 | Polishing disk for semiconductor polishing machine |
| CN113787426A (en) * | 2021-09-18 | 2021-12-14 | 明捷精密机械(太仓)有限公司 | Polishing device for semiconductor flexible material production and use method thereof |
| CN216030144U (en) * | 2021-09-02 | 2022-03-15 | 盛吉盛(宁波)半导体科技有限公司 | Quartz semiconductor grinding disc and grinding equipment applying same |
-
2022
- 2022-04-06 CN CN202210355373.5A patent/CN114734371A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN212444726U (en) * | 2020-04-29 | 2021-02-02 | 明曜半导体设备(沈阳)有限公司 | Semiconductor processing grinding device |
| CN112435939A (en) * | 2020-11-23 | 2021-03-02 | 上饶市迈创商贸有限公司 | Semiconductor degumming machine auxiliary device capable of preventing blade from dripping due to residual colloid |
| CN113400179A (en) * | 2021-07-23 | 2021-09-17 | 上海芯莘科技有限公司 | Polishing disk for semiconductor polishing machine |
| CN216030144U (en) * | 2021-09-02 | 2022-03-15 | 盛吉盛(宁波)半导体科技有限公司 | Quartz semiconductor grinding disc and grinding equipment applying same |
| CN113787426A (en) * | 2021-09-18 | 2021-12-14 | 明捷精密机械(太仓)有限公司 | Polishing device for semiconductor flexible material production and use method thereof |
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