CN114710660A - Camera test system of intelligence passenger cabin and autopilot territory - Google Patents
Camera test system of intelligence passenger cabin and autopilot territory Download PDFInfo
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Abstract
The invention discloses a camera test system for an intelligent cabin and an automatic driving area. The system comprises: the device comprises a single-path signal pickup module, a multi-path signal generation module and a multi-path signal test module; the single-path signal pickup module is used for receiving an original camera signal acquired by a single camera and transmitting the original camera signal to the multi-path signal generation module; the multi-path signal generating module comprises a plurality of high-speed switch chips and is used for generating a first path of copied camera signals in a time-sharing manner according to the original camera signals and sending the copied camera signals to the multi-path signal testing module; and the multi-path signal testing module is used for outputting the multi-path copied camera signals received in a time-sharing manner to each signal output end so as to carry out time-sharing testing on the plurality of camera testing screens. The embodiment of the invention solves the problem that a large number of cameras are needed when the host in the intelligent cabin area performs the camera test screen test, reduces the cost of the camera test of the host in the intelligent cabin area, and reduces the occupied area of the camera test screen.
Description
Technical Field
The invention relates to the technical field of data processing, in particular to a camera test system for an intelligent cabin and an automatic driving area.
Background
Present intelligence passenger cabin territory host computer, external camera is more and more, and intelligent passenger cabin territory host computer needs external a plurality of cameras usually, and the camera includes: panorama formula surveillance image system camera, face identification camera, passenger surveillance camera in the car, vehicle event data recorder camera, blind area detection camera, so intelligent passenger cabin territory host computer carries out complete test, needs test environment to have a plurality of cameras.
In the process of implementing the invention, the inventor finds that the prior art has the following defects: when a host computer need test multichannel camera signal, need a large amount of camera test screens, can increase camera test screen cost to occupy great test site, the test site also becomes mixed and disorderly owing to camera test screen is in large quantity.
Disclosure of Invention
The embodiment of the invention provides a camera test system for an intelligent cabin and an automatic driving area, which aims to solve the problem that a large number of cameras are needed when a host of the intelligent cabin area tests a camera test screen, reduce the cost of the camera test of the host of the intelligent cabin area, and reduce the occupied area of the camera test screen.
In a first aspect, an embodiment of the present invention provides a camera test system for an intelligent cockpit and an autopilot domain, including a single-channel signal pickup module, a multi-channel signal generation module, and a multi-channel signal test module, where the single-channel signal pickup module is connected to a single camera, and multiple signal output ends in the multi-channel signal test module are respectively connected to multiple camera test screens in an intelligent cockpit domain to be tested;
the single-path signal pickup module is used for receiving an original camera signal collected by the single camera and transmitting the original camera signal to the multi-path signal generation module;
the multi-path signal generating module comprises a plurality of high-speed switch chips and is used for generating a first path of copied camera signals in a time-sharing manner according to the original camera signals and sending the copied camera signals to the multi-path signal testing module;
each high-speed switch chip is used for copying an input path of signals to obtain a second path of copied signals for time-sharing output, and the first path of signals is greater than the second path of signals;
and the multi-path signal testing module is used for outputting the multi-path copied camera signals received in a time-sharing manner to each signal output end so as to carry out time-sharing testing on a plurality of camera testing screens respectively connected with each signal output end.
Further, the multi-channel signal generating module specifically includes: the high-speed switch chip combination network and the gating signal control unit; the high-speed switch chip combination network is formed by sequentially connecting a plurality of cascade units, each cascade unit comprises at least one high-speed switch chip, the first cascade unit is used for inputting the original camera signal, the last cascade unit is used for outputting the copied camera signal of the first path in a time-sharing manner, and the input of the next cascade unit is the output of the previous cascade unit; the gating signal control unit is used for sequentially outputting gating control signal sets and sending the gating control signal sets to each high-speed switch chip in the high-speed switch chip combination network so as to control the high-speed switch chip combination network to output only one path of the copied camera signals at the same time.
Further, the number of the high-speed switch chips included in each cascade unit in the high-speed switch chip combination network is determined by the first path number and the second path number.
Further, the high-speed switch chips included in each cascade unit in the high-speed switch chip combination network have a quantity value of
(ii) a Wherein N is the first path number, B is the second path number, N is the hierarchical position of the cascade unit in the front-to-back direction,
for taking, straightening and transporting upwardsAnd the number of the high-speed switch chips included in the first cascade unit is 1.
Further, the gating signal control unit comprises an N-to-1 selector switch, where N is the first path number; the N selector switches of the gating signal control unit are connected with the channel switching ports of the high-speed switch chips in the high-speed switch chip combination network in a preset connection mode; and the N-to-1 selector switch is used for sequentially gating each selector switch so as to control the high-speed switch chip combination network to sequentially gate one path of the copied camera signals from multiple paths and output the same to the multiple paths of signal testing modules.
Further, the N-to-1 selector switch is a program-controlled switch; the N-to-1 selector switch is programmed to be set to enable each selector switch to sequentially gate a set time length so as to perform time-sharing test on the camera test screen for one path of copied camera signals matched with each selector switch in the set time length.
Further, the single-channel signal pickup module specifically includes: the first signal conversion socket comprises a first connection interface and a second connection interface; the first signal conversion socket is configured to receive the original camera signal through the first connection interface, and transmit the received original camera signal to the multi-channel signal generation module through the second connection interface.
Further, the multi-channel signal testing module specifically includes: a plurality of signal output units; the signal output unit is a second signal conversion socket; the second signal conversion socket comprises a third connecting interface and a fourth connecting interface; the second signal conversion socket is configured to receive the multiple paths of the replica camera signals generated by the multiple paths of signal generation modules through the third connection interface, and output each of the replica camera signals to each of the signal output ends through the fourth connection interface.
Further, the first number of paths is 8, and the second number of paths is 4.
Further, the multi-channel signal generating module specifically includes: the N-to-1 selector switch is an 8-to-1 selector switch; the first cascade unit comprises a first high-speed switch chip; the second cascade unit comprises a second high-speed switch chip and a third high-speed switch chip; wherein, each high speed switch chip all includes: the first level control pin, the second level control pin, the first signal output channel, the second signal output channel, the third signal output channel, the fourth signal output channel and the signal input channel; the 1-out-of-8 selector switch comprises: the first change-over switch, the second change-over switch, the third change-over switch, the fourth change-over switch, the fifth change-over switch, the sixth change-over switch, the seventh change-over switch and the eighth change-over switch; the first signal output channel of the first high-speed switch chip is connected with the signal input channel of the second high-speed switch chip, the second signal output channel of the first high-speed switch chip is connected with the signal input channel of the third high-speed switch chip, and the signal input channel of the first high-speed switch chip is connected with the single-channel signal pickup module; a first signal output channel of the second high-speed switch chip is connected with a first path of copying camera signals, a second signal output channel of the second high-speed switch chip is connected with a second path of copying camera signals, a third signal output channel of the second high-speed switch chip is connected with a third path of copying camera signals, and a fourth signal output channel of the second high-speed switch chip is connected with a fourth path of copying camera signals; a first level control pin of the second high-speed switch chip is connected with a first control pin of the first change-over switch, and a second control pin of the first change-over switch is connected in a suspended mode; a second level control pin of the second high-speed switch chip is connected with a first control pin of the second change-over switch, and a first level control pin of the second high-speed switch chip is connected with a second control pin of the second change-over switch; a second level control pin of the second high-speed switch chip is connected with a first control pin of the third change-over switch, and a first level control pin of the second high-speed switch chip is connected with a second control pin of the third change-over switch; a second level control pin of the second high-speed switch chip is connected with a first control pin of the fourth change-over switch, and a first level control pin of the second high-speed switch chip is connected with a second control pin of the fourth change-over switch; the first signal output channel of the third high-speed switch chip is connected with a fifth path of copying camera signals, the second signal output channel of the third high-speed switch chip is connected with a sixth path of copying camera signals, the third signal output channel of the third high-speed switch chip is connected with a seventh path of copying camera signals, and the fourth signal output channel of the third high-speed switch chip is connected with an eighth path of copying camera signals; a first level control pin of the third high-speed switch chip is connected with a first control pin of the fifth change-over switch, and a first level control pin of the first high-speed switch chip is connected with a second control pin of the fifth change-over switch; a first level control pin of the third high-speed switch chip is connected with a first control pin of the sixth change-over switch, and a second level control pin of the third high-speed switch chip is connected with a second control pin of the sixth change-over switch; a first level control pin of the third high-speed switch chip is connected with a first control pin of the seventh change-over switch, and a second level control pin of the third high-speed switch chip is connected with a second control pin of the seventh change-over switch; and a first level control pin of the third high-speed switch chip is connected with a first control pin of the eighth change-over switch, and a second level control pin of the third high-speed switch chip is connected with a second control pin of the eighth change-over switch.
According to the technical scheme provided by the embodiment of the invention, the camera test systems of the intelligent cockpit and the automatic driving area are respectively connected with a plurality of camera test screens in the intelligent cockpit area to be tested through a single-path signal pickup module, a multi-path signal generation module and a multi-path signal test module, wherein the single-path signal pickup module is connected with a single camera; the single-path signal pickup module is used for receiving an original camera signal collected by the single camera and transmitting the original camera signal to the multi-path signal generation module; the multi-path signal generating module comprises a plurality of high-speed switch chips and is used for generating a first path of copied camera signals in a time-sharing manner according to the original camera signals and sending the copied camera signals to the multi-path signal testing module; and the multi-path signal testing module is used for outputting the multi-path copied camera signals received in a time-sharing manner to each signal output end so as to carry out time-sharing testing on a plurality of camera testing screens respectively connected with each signal output end. The embodiment of the invention solves the problem that a large number of cameras are needed when the host in the intelligent cabin area performs the camera test screen test, reduces the cost of the camera test of the host in the intelligent cabin area, and reduces the occupied area of the camera test screen.
Drawings
Fig. 1 is a schematic structural diagram of a camera test system for an intelligent cockpit and an autopilot domain according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a specific application scenario in a camera test system of an intelligent cockpit and an automatic driving area according to a second embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention.
It should be further noted that, for the convenience of description, only some but not all of the relevant aspects of the present invention are shown in the drawings. Before discussing exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although a flowchart may describe the operations (or steps) as a sequential process, many of the operations can be performed in parallel, concurrently or simultaneously. In addition, the order of the operations may be re-arranged. The process may be terminated when its operations are completed, but may have additional steps not included in the figure. The processes may correspond to methods, functions, procedures, subroutines, and the like.
The terms "first" and "second," and the like in the description and claims of embodiments of the invention and in the drawings, are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not set forth for a listed step or element but may include steps or elements not listed.
Example one
Fig. 1 is a schematic structural diagram of a camera test system for an intelligent cabin and an automatic driving area according to an embodiment of the present invention, where this embodiment is applicable to a situation where a large number of cameras are required to collect and test signals when a multi-path copy camera signal test is performed on a host in an intelligent cabin area, as shown in fig. 1, the system may include: the system comprises a single-path signal pickup module 110, a multi-path signal generation module 120 and a multi-path signal test module 130, wherein the single-path signal pickup module is connected with a single camera, and a plurality of signal output ends in the multi-path signal test module are respectively and correspondingly connected with a plurality of camera test screens in an intelligent cockpit area to be tested.
The single-channel signal pickup module 110 is configured to receive an original camera signal acquired by the single camera and transmit the original camera signal to the multi-channel signal generation module;
the multi-path signal generating module 120 includes a plurality of high-speed switch chips, and is configured to generate a first number of duplicate camera signals in a time-sharing manner according to the original camera signal, and send each of the duplicate camera signals to the multi-path signal testing module;
each high-speed switch chip is used for copying an input path of signals to obtain a second path of copied signals for time-sharing output, and the first path of signals is greater than the second path of signals;
the multi-path signal testing module 130 is configured to output the multiple paths of the copied camera signals received in a time-sharing manner to each signal output end, so as to perform a time-sharing test on the multiple camera testing screens respectively connected to each signal output end.
The single-path signal pickup module can be a module for receiving an original camera signal collected by a single camera and can also be a signal pickup module for transmitting the received original camera signal to a next module. The original camera signal may be a camera signal obtained by performing signal acquisition according to a single camera.
The multi-path signal generating module may be a module capable of respectively performing time-sharing transmission according to an original camera signal to obtain a multi-path copied camera signal, and specifically, the multi-path signal generating module may further perform time-sharing output of a signal to the multi-path signal testing module according to a cascading manner of a plurality of high-speed switch chips. The high-speed switch chip can be used for selecting a multi-path copy camera signal and can be connected with the single-path signal pickup module and the multi-path signal testing module. The first number may be the number of duplicate camera signals obtained from the original camera signal. The duplicate camera signal may be a camera signal that is consistent with the original camera signal content and may be transmitted to different signal output terminals, respectively.
The multi-path signal testing module can be a module for receiving a plurality of copied camera signals in a time-sharing manner and outputting the copied camera signals to each signal output end, and can test the multi-path copied camera signals. The second number may be the number of replicated camera signals output by each high-speed switch chip. The camera test screen can be used for testing the display effect of each copied camera signal in the intelligent cabin domain host.
For example, it is assumed that the single-channel signal pickup module receives one channel of original camera signals collected by a single camera and transmits the one channel of original camera signals to the multi-channel signal generation module. In the multi-path signal generating module, eight paths of copied camera signals are generated in a time-sharing mode according to one path of original camera signals, and one path of the eight paths of copied camera signals is sequentially gated and sent to the multi-path signal testing module. In the multi-path signal testing module, eight paths of copied camera signals received in a time-sharing mode are respectively output to eight signal output ends, and therefore time-sharing testing is conducted on eight camera testing screens connected with the eight signal output ends respectively.
Optionally, the multi-channel signal generating module specifically includes: the high-speed switch chip combination network and the gating signal control unit; the high-speed switch chip combination network is formed by sequentially connecting a plurality of cascade units, each cascade unit comprises at least one high-speed switch chip, the first cascade unit is used for inputting the original camera signal, the last cascade unit is used for outputting the copied camera signal of the first path in a time-sharing manner, and the input of the next cascade unit is the output of the previous cascade unit; the gating signal control unit is used for sequentially outputting gating control signal sets and sending the gating control signal sets to each high-speed switch chip in the high-speed switch chip combination network so as to control the high-speed switch chip combination network to output only one path of the copied camera signals at the same time.
The high-speed switch chip combination network can be a network obtained by cascading and combining a plurality of high-speed switch chips and is used for receiving an original camera signal, generating a plurality of paths of copied camera signals in a time-sharing manner, outputting one path of copied camera signals selected in sequence and sending each copied camera signal to the multi-path signal test module. The gating signal control unit can control the high-speed switch chip combination network to output only one path of copied camera signals at one moment. The first cascade unit may be a high-speed switch chip for inputting the multiple-path replica camera signals. The last cascade unit can be one or more high-speed switch chips, and is used for connecting with a first cascade unit, receiving the copied camera signal output by the first cascade unit, and selectively outputting one path of copied camera signal. The gating control signal set can be used for determining which specific path is selected to copy the camera signals, and the number of gating paths is determined according to the high and low levels of pins in a plurality of high-speed switch chips in the high-speed switch chip combination network.
For example, it is assumed that a high-speed switch chip combination network has a first cascade unit and two last cascade units, and the first cascade unit is respectively cascaded with the two last cascade units. And the last cascade unit is used for generating eight paths of copied camera signals from the two paths of copied camera signals and outputting the eight paths of copied camera signals to the multi-path signal testing module in a time-sharing manner. The specific path of output of the copied camera signal is determined by a gating control signal set in a gating signal control unit.
The advantages of such an arrangement are: the high-speed switch chip combination network and the gating signal control unit jointly form a multi-channel signal generation module, so that one-channel copied camera signals can be accurately determined and selected and output, the selection process can be simpler and more convenient by setting the high-speed switch chip combination network, the number of camera test screens used for signal acquisition can be reduced, and the efficiency, accuracy and reliability of signal test acquired by the camera are improved.
Optionally, the number of the high-speed switch chips included in each cascade unit in the high-speed switch chip combination network is determined by the first path number and the second path number.
The first number may be the number of duplicate camera signals obtained from the original camera signal. The second number may be the number of replicated camera signals output by each high-speed switch chip.
For example, assuming that a single-channel signal pickup module receives one channel of original camera signals and the number of the copied camera signals required to be obtained is 8, the number of the copied camera signals associated with the high-speed switch chip corresponding to each cascade unit is 4, that is, the first channel number is 8, and the second channel number is 4, the number of the high-speed switch chips may be determined by the first channel number and the second channel number.
The advantages of such an arrangement are: the number of the high-speed switch chips is determined by the first path number and the second path number together, so that the plurality of high-speed switch chips can be more reasonably cascaded, and the time-sharing transmission of the multiple-path copy camera signals is carried out to the maximum extent.
Optionally, the number of the high-speed switch chips included in each cascade unit in the high-speed switch chip combination network is equal to
(ii) a Wherein N is the first path number, B is the second path number, N is the hierarchical position of the cascade unit in the front-to-back direction,
for the rounding-up operation, the number of the high-speed switch chips included in the first cascade unit is 1.
In the previous example, the first number of paths is 8, the second number of paths is 4, i.e. N is 10, and B is 4. Since n is the hierarchical position in which the tandem cell is located in the front-to-back direction. When n =1, is the first cascaded unit, according to
And thus the number of first cascade units is 1. When n =2, is the second cascade unit, according to
And thus the number of first cascade units is 2. Since the number of the copied camera signals associated with the high-speed switch chip corresponding to each cascade unit is 4, the high-speed switch chip combination network can be determined to be two-stage cascade, and the number of the high-speed switch chips corresponding to the first cascade unit is 3 and the number of the high-speed switch chips corresponding to the last cascade unit is 2 through calculation.
Specifically, the method is suitable for the condition that the high-speed switch chip combination network is in multi-stage cascade connection.
The advantages of such an arrangement are: the number of the high-speed switch chips contained in the first cascade unit and the number of the high-speed switch chips contained in the last cascade unit can be calculated according to a formula through the first path number, the second path number and the hierarchical position of the cascade unit in the front-to-back direction. Therefore, the number of the high-speed switch chips respectively corresponding to each cascade unit can be optimally determined, the high-speed switch chips can be saved, the cost is saved, the efficiency of testing the copied camera signals can be improved, and the reliability of the test is improved.
Optionally, the gating signal control unit includes an N-to-1 selector switch, where N is the first number; the N selector switches of the gating signal control unit are connected with the channel switching ports of the high-speed switch chips in the high-speed switch chip combination network in a preset connection mode; and the N-to-1 selector switch is used for sequentially gating each selector switch so as to control the high-speed switch chip combination network to sequentially gate one path of the copied camera signals from multiple paths and output the same to the multiple paths of signal testing modules.
The N-to-1 selector switch may be configured to select 1 switch among the N switches, and transmit a path of replicated camera signals corresponding to the switch. The channel switching port is a port where the N-to-1 selector switch is connected with the tail cascade unit, and can perform channel switching.
In the previous example, if N is 8, since the number of the high-speed switch chips corresponding to the first cascade unit is 1, it is assumed that the high-speed switch chips are respectively set as 1; if the number of the high-speed switch chips corresponding to the last cascade unit is 2, it is assumed that the high- speed switch chips 2 and 3 are set. It is assumed that the channel switching port on the high-speed switch chip 2 is connected to the switch 1, the switch 2, the switch 3 and the switch 4 in the N-to-1 selector switch respectively, and the channel switching port on the high-speed switch chip 3 is connected to the switch 5, the switch 6, the switch 7 and the switch 8 in the N-to-1 selector switch respectively. When the switch 1 is selected, one path of copied camera signals on the channel where the switch 1 is located is output to the multi-path signal testing module.
The advantage that sets up like this lies in, selects 1 change over switch's setting through N, can more conveniently accurately carry out the transmission of duplicating the camera signal, has improved signal transmission's rate of accuracy and reliability to when carrying out the camera signal test in the intelligent passenger cabin territory host computer, can reduce the cost of intelligent passenger cabin territory host computer camera test.
Optionally, the 1-out-of-N selector switch is a program-controlled switch; the N-to-1 selector switch is programmed to be set to enable each selector switch to sequentially gate a set time length so as to perform time-sharing test on the camera test screen for one path of copied camera signals matched with each selector switch in the set time length.
The programmable switch can be a switch which sequentially turns on corresponding circuits or electric appliances according to preset time length and sequence.
In the previous example, assume that the programmed switches associated with the N-out-of-1 switch are set to open one switch every 1s, and the switch 1 is opened at the 1 st s, the switch 2 is opened at the 2 nd s, the switch 3 is opened at the 3 rd s, and so on. Therefore, the switch 1 is turned on in the 1 st s, one path of copied camera signals matched with the switch 1 is transmitted to each signal output end, and the display test is carried out in the camera test screen. And (2) opening the switch 2 in the 2 nd s, transmitting one path of copied camera signals matched with the switch 2 to each signal output end, and performing display test in a camera test screen. And opening the switch 3 in the 3 rd s, transmitting one path of camera signals matched with the switch 3 to each signal output end, and performing display test in the camera test screen.
The advantages of such an arrangement are: the corresponding switch can be opened according to the set period through the setting of the program control switch, and the transmission of one-way copy camera signals can be carried out in a time-sharing mode. Therefore, the signal transmission of the copying camera can be programmed, can be reasonably transmitted to each signal output end, and can be used for carrying out signal display test on the camera test screen, so that the test efficiency of the intelligent cabin domain host is improved.
Optionally, the single-channel signal pickup module specifically includes: a first signal conversion jack comprising a first connection interface and a second connection interface; the first signal conversion socket is configured to receive the original camera signal through the first connection interface, and transmit the received original camera signal to the multi-channel signal generation module through the second connection interface.
The first signal conversion socket may be a connection socket for receiving and outputting an original camera signal, and specifically, the first signal conversion socket may be a baker socket. The maker socket is a connection socket for receiving an original camera signal. The first connection interface may be a connection interface for receiving an original camera signal. The second connection interface may be a connection interface for outputting an original camera signal, and outputs the original camera signal to the multi-path signal generation module.
The advantages of such an arrangement are: the receiving and the output of original camera signal are carried out through the first signal conversion socket, so that the original camera signal can be received and transmitted with high fidelity, the loss of the original camera signal in the transmission process is reduced, the test of the original camera signal is more accurate in the host of the intelligent cabin domain, the reliability of signal test can be increased, the use of the camera can be reduced, and the test cost of the camera signal test is reduced.
Optionally, the multi-channel signal testing module specifically includes: a plurality of signal output units; the signal output unit is a second signal conversion socket; the second signal conversion socket comprises a third connecting interface and a fourth connecting interface; the second signal conversion socket is configured to receive the multiple paths of the replica camera signals generated by the multiple paths of signal generation modules through the third connection interface, and output each of the replica camera signals to each of the signal output ends through the fourth connection interface.
The signal output unit can transmit the received multiple paths of copied camera signals to each signal output end, and time-sharing test is carried out in the camera test screen. The second signal conversion socket can receive the multi-path copy camera signals generated by the multi-path signal generating module and output the signals to each signal output end in the multi-path signal testing module in a time-sharing manner. The third connection interface may be a connection interface for receiving each of the duplicated camera signals time-divisionally transmitted by the multiple signal generating modules. The fourth connection interface may be a connection interface that transmits each of the replica camera signals to each of the signal output terminals.
The advantages of such an arrangement are: and receiving the multi-path copy camera signals generated by the multi-path signal generating module through the second signal conversion socket, and outputting the signals to each signal output end in the multi-path signal testing module in a time-sharing manner. Like this can be high-fidelity receive come from the multichannel reproduction camera signal that multichannel signal generation module generated to duplicate camera signal transmission to each signal output end, reduce the loss of reproduction camera signal in the transmission course, thereby make to carry out the test of camera signal more accurate at intelligence passenger cabin territory host computer, thereby increased signal test's reliability, thereby can reduce the cost of camera test.
According to the technical scheme provided by the embodiment of the invention, the camera test systems of the intelligent cockpit and the automatic driving area are respectively connected with a plurality of camera test screens in the intelligent cockpit area to be tested through a single-path signal pickup module, a multi-path signal generation module and a multi-path signal test module, wherein the single-path signal pickup module is connected with a single camera; the single-path signal pickup module is used for receiving an original camera signal collected by the single camera and transmitting the original camera signal to the multi-path signal generation module; the multi-path signal generating module comprises a plurality of high-speed switch chips and is used for generating a first path of copied camera signals in a time-sharing manner according to the original camera signals and sending the copied camera signals to the multi-path signal testing module; and the multi-path signal testing module is used for outputting the multi-path copied camera signals received in a time-sharing manner to each signal output end so as to carry out time-sharing testing on a plurality of camera testing screens respectively connected with each signal output end. The embodiment of the invention solves the problem that a large number of cameras are needed when the host in the intelligent cabin area performs the camera test screen test, reduces the cost of the camera test of the host in the intelligent cabin area, and reduces the occupied area of the camera test screen.
Example two
Fig. 2 is a schematic structural diagram of a specific application scenario in a camera test system of an intelligent cockpit and an autopilot domain in a second embodiment of the present invention, where this embodiment is a further refinement of the foregoing technical solutions, and the technical solutions in this embodiment may be combined with various alternatives in one or more embodiments described above.
The intelligent cockpit and autopilot domain camera testing system may include: the system comprises a single-path signal pickup module 110, a multi-path signal generation module 120 and a multi-path signal test module 130, wherein the single-path signal pickup module 110 is connected with a single camera, and a plurality of signal output ends in the multi-path signal test module 130 are respectively and correspondingly connected with a plurality of camera test screens in an intelligent cockpit area to be tested.
The one-way signal pickup module 110 includes a signal input unit, which is set to JP 2.
The multi-path signal generating module 120 includes 3 high-speed switch chips. The first cascade unit comprises 1 high-speed switch chip which is respectively set as U1; the last cascade unit includes 2 high-speed switch chips, set as U2 and U3.
The multi-path signal testing block 130 includes 8 signal output units, which are respectively set as OUT1, OUT 2, OUT 3, OUT 4, OUT 5, OUT 6, OUT 7, and OUT 8.
Optionally, the first number of passes is 8, and the second number of passes is 4.
Specifically, a single-path signal pickup module receives one path of original camera signals, and a multi-path signal generation module generates 8 paths of copied camera signals, namely, the first path number is 8. Further, since the second path number is 4, the high-speed switch chip U2 is connected to OUT1, OUT 2, OUT 3, and OUT 4 of the multi-path signal testing module, respectively; the high-speed switch chip U3 is connected to OUT 5, OUT 6, OUT 7 and OUT 8 of the multi-signal test module, respectively.
Optionally, the multi-channel signal generating module specifically includes: the N-to-1 selector switch is an 8-to-1 selector switch;
the first cascade unit comprises a first high-speed switch chip; the second cascade unit comprises a second high-speed switch chip and a third high-speed switch chip;
wherein, each high speed switch chip all includes: the device comprises a first level control pin, a second level control pin, a first signal output channel, a second signal output channel, a third signal output channel, a fourth signal output channel and a signal input channel;
the 1-out-of-8 selector switch comprises: the first change-over switch, the second change-over switch, the third change-over switch, the fourth change-over switch, the fifth change-over switch, the sixth change-over switch, the seventh change-over switch and the eighth change-over switch;
the first signal output channel of the first high-speed switch chip is connected with the signal input channel of the second high-speed switch chip, the second signal output channel of the first high-speed switch chip is connected with the signal input channel of the third high-speed switch chip, and the signal input channel of the first high-speed switch chip is connected with the single-channel signal pickup module;
a first signal output channel of the second high-speed switch chip is connected with a first path of copying camera signals, a second signal output channel of the second high-speed switch chip is connected with a second path of copying camera signals, a third signal output channel of the second high-speed switch chip is connected with a third path of copying camera signals, and a fourth signal output channel of the second high-speed switch chip is connected with a fourth path of copying camera signals; a first level control pin of the second high-speed switch chip is connected with a first control pin of the first change-over switch, and a second control pin of the first change-over switch is connected in a suspended mode; a second level control pin of the second high-speed switch chip is connected with a first control pin of the second change-over switch, and a first level control pin of the second high-speed switch chip is connected with a second control pin of the second change-over switch; a second level control pin of the second high-speed switch chip is connected with a first control pin of the third change-over switch, and a first level control pin of the second high-speed switch chip is connected with a second control pin of the third change-over switch; a second level control pin of the second high-speed switch chip is connected with a first control pin of the fourth change-over switch, and a first level control pin of the second high-speed switch chip is connected with a second control pin of the fourth change-over switch;
the first signal output channel of the third high-speed switch chip is connected with a fifth path of copying camera signals, the second signal output channel of the third high-speed switch chip is connected with a sixth path of copying camera signals, the third signal output channel of the third high-speed switch chip is connected with a seventh path of copying camera signals, and the fourth signal output channel of the third high-speed switch chip is connected with an eighth path of copying camera signals; a first level control pin of the third high-speed switch chip is connected with a first control pin of the fifth change-over switch, and a first level control pin of the first high-speed switch chip is connected with a second control pin of the fifth change-over switch; a first level control pin of the third high-speed switch chip is connected with a first control pin of the sixth change-over switch, and a second level control pin of the third high-speed switch chip is connected with a second control pin of the sixth change-over switch; a first level control pin of the third high-speed switch chip is connected with a first control pin of the seventh change-over switch, and a second level control pin of the third high-speed switch chip is connected with a second control pin of the seventh change-over switch; and a first level control pin of the third high-speed switch chip is connected with a first control pin of the eighth change-over switch, and a second level control pin of the third high-speed switch chip is connected with a second control pin of the eighth change-over switch.
The first cascade unit may be a unit connected to the single-channel signal pickup module and may include a first high-speed switch chip, and the second cascade unit may be a unit connected to an output of the first cascade unit and to an input of the multi-channel signal test module and may include a second high-speed switch chip and a third high-speed switch chip.
Specifically, the first high-speed switch chip may be one switch chip in the first cascade unit, which is U1 in fig. 2. The second high-speed switch chip and the third high-speed switch chip are both switch chips in the second cascade unit, the second high-speed switch chip is U2, and the third high-speed switch chip is U3.
The first level control pin may be a first pin on the high-speed switch chip, and may be divided into a high level and a low level, and the high level may be set to be 1, and the low level may be set to be 0. The second level control pin may be a second pin on the high-speed switch chip, and may be divided into a high level and a low level, and the high level may be set to be 1, and the low level may be set to be 0. In the high-speed switch chip, the selection of the selector switch is determined by the first level control pin and the second level control pin together.
The first signal output channel, the second signal output channel, the third signal output channel and the fourth signal output channel can be channels which are arranged on a high-speed switch chip and used for connecting and outputting signals of the multi-path copying camera. The signal input channel may be a channel for inputting an original camera signal or a duplicate camera signal on a high-speed switch chip.
Further, the first switch is used for controlling transmission of the replicated camera signals, and when the first switch is turned on, the first replicated camera signals corresponding to the first switch are connected for transmission; when the first switch is turned off, the first path of copied camera signal corresponding to the first switch is connected and cannot be transmitted.
Similarly, the second switch, the third switch, the fourth switch, the fifth switch, the sixth switch, the seventh switch and the eighth switch respectively correspond to the second path of copied camera signal, the third path of copied camera signal, the fourth path of copied camera signal, the fifth path of copied camera signal, the sixth path of copied camera signal, the seventh path of copied camera signal and the eighth path of copied camera signal, and the transmission and non-transmission of the corresponding copied camera signals are performed according to the turning on or turning off of the switches.
Specifically, in fig. 2, the first change-over switch is SW1, the second change-over switch is SW2, the third change-over switch is SW3, the fourth change-over switch is SW4, the fifth change-over switch is SW5, the sixth change-over switch is SW6, the seventh change-over switch is SW7, and the eighth change-over switch is SW 8.
Illustratively, in fig. 2, the first signal output channel RF1 of the first high-speed switch chip U1 is connected to the signal input channel RFC of the second high-speed switch chip U2, the second signal output channel RF2 of the first high-speed switch chip U1 is connected to the signal input channel RFC of the third high-speed switch chip U3, and the signal input channel RFC of the first high-speed switch chip U1 is connected to the one-way signal pickup module JP 2.
A first signal output channel RF1 of the second high-speed switch chip U2 is in signal connection with the first path of replicated camera, a second signal output channel RF2 of the second high-speed switch chip U2 is in signal connection with the second path of replicated camera, a third signal output channel RF3 of the second high-speed switch chip U2 is in signal connection with the third path of replicated camera, and a fourth signal output channel RF4 of the second high-speed switch chip U2 is in signal connection with the fourth path of replicated camera; a first level control pin U2-A of the second high-speed switch chip U2 is connected with a first control pin 1 of the first switch SW1, and a second control pin 4 of the first switch SW1 is connected in a hanging manner; the second level control pin U2-B of the second high-speed switch chip U2 is connected with the first control pin 7 of the second change-over switch SW2, and the first level control pin U2-A of the second high-speed switch chip U2 is connected with the second control pin 10 of the second change-over switch SW 2; a second level control pin U2-B of the second high-speed switch chip U2 is connected with a first control pin 13 of a third change-over switch SW3, and a first level control pin U2-A of the second high-speed switch chip U2 is connected with a second control pin 16 of a third change-over switch SW 3; the second level control pin U2-B of the second high speed switch chip U2 is connected to the first control pin 19 of the fourth switch SW4, and the first level control pin U2-A of the second high speed switch chip U2 is connected to the second control pin 22 of the fourth switch SW 4.
A first signal output channel RF1 of the third high-speed switch chip U3 is connected with a fifth path of copying camera signals, a second signal output channel RF2 of the third high-speed switch chip U3 is connected with a sixth path of copying camera signals, a third signal output channel RF3 of the third high-speed switch chip U3 is connected with a seventh path of copying camera signals, and a fourth signal output channel RF4 of the third high-speed switch chip U3 is connected with an eighth path of copying camera signals; the first level control pin U3-A of the third high-speed switch chip U3 is connected with the first control pin 25 of the fifth change-over switch SW5, and the first level control pin U1-A1 of the first high-speed switch chip U1 is connected with the second control pin 28 of the fifth change-over switch SW 5; a first level control pin U3-A of the third high-speed switch chip U3 is connected with a first control pin 31 of the sixth change-over switch SW6, and a second level control pin U3-B of the third high-speed switch chip U3 is connected with a second control pin 34 of the sixth change-over switch SW 6; a first level control pin U3-A of the third high-speed switch chip U3 is connected with a first control pin 37 of the seventh change-over switch SW7, and a second level control pin U3-B of the third high-speed switch chip U3 is connected with a second control pin 40 of the seventh change-over switch SW 7; the first level control pin U3-A of the third high speed switch chip U3 is connected to the first control pin 43 of the eighth switch SW8, and the second level control pin U3-B of the third high speed switch chip U3 is connected to the second control pin 46 of the eighth switch SW 8.
Table 1 below shows a relationship table between the level control pins of the switches and the high-speed switch chips.
In the table, the pins 9 correspond to the second level control pins of the high-speed switch chips, and the pins 10 correspond to the first level control pins of the high-speed switch chips.
Specifically, when the first switch SW1 is pressed, the first level control pin of the first high-speed switch chip U1 is at a low level 0, the second level control pin is at a low level 0, the first level control pin of the second high-speed switch chip U2 is at a low level 0, the second level control pin is at a low level 0, and the first path is selected to copy the camera signal.
TABLE 1
When the second switch SW2 is pressed, the first level control pin of the first high-speed switch chip U1 is at low level 0, the second level control pin is at low level 0, the first level control pin of the second high-speed switch chip U2 is at high level 1, the second level control pin is at low level 0, and the second path of the duplicated camera signals is selected.
When the third switch SW3 is pressed, the first level control pin of the first high-speed switch chip U1 is at low level 0, the second level control pin is at low level 0, the first level control pin of the second high-speed switch chip U2 is at low level 0, the second level control pin is at high level 1, and the third path of the replica camera signal is selected.
When the fourth switch SW4 is pressed, the first level control pin of the first high-speed switch chip U1 is at low level 0, the second level control pin is at low level 0, the first level control pin of the second high-speed switch chip U2 is at high level 1, the second level control pin is at high level 1, and the fourth channel is selected to copy the camera signal.
When the fifth switch SW5 is pressed, the first level control pin of the first high-speed switch chip U1 is at high level 1, the second level control pin is at low level 0, the first level control pin of the third high-speed switch chip U3 is at low level 0, the second level control pin is at low level 0, and the fifth channel is selected to copy the camera signal.
When the sixth switch SW6 is pressed, the first level control pin of the first high-speed switch chip U1 is at high level 1, the second level control pin is at low level 0, the first level control pin of the third high-speed switch chip U3 is at high level 1, the second level control pin is at low level 0, and the sixth channel of copying camera signals is selected.
When the seventh switch SW7 is pressed, the first level control pin of the first high-speed switch chip U1 is at high level 1, the second level control pin is at low level 0, the first level control pin of the third high-speed switch chip U3 is at low level 0, the second level control pin is at high level 1, and the seventh channel is selected to copy the camera signal.
When the eighth switch SW8 is pressed, the first level control pin of the first high-speed switch chip U1 is at high level 1, the second level control pin is at low level 0, the first level control pin of the third high-speed switch chip U3 is at high level 1, the second level control pin is at high level 1, and the eighth channel of copying camera signals is selected.
According to the technical scheme provided by the embodiment of the invention, the test system of the intelligent cabin domain host receives one path of original camera signals through the single-path signal pickup module, and each high-speed switch chip receives at most four paths of copied camera signals to determine the connection relation of the pins of each module. The situation that one path of the copied camera signals is selected from eight paths of copied camera signals can be solved more specifically, so that the use of a camera for collecting signals can be reduced, the cost of testing an intelligent cabin domain host is further reduced, the accuracy of signal testing is improved, and the reliability of a test result is improved.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in some detail by the above embodiments, the invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the invention, and the scope of the invention is determined by the scope of the appended claims.
Claims (10)
1. A camera test system for an intelligent cockpit and an automatic driving area is characterized by comprising a single-path signal pickup module, a multi-path signal generation module and a multi-path signal test module, wherein the single-path signal pickup module is connected with a single camera, and a plurality of signal output ends in the multi-path signal test module are respectively and correspondingly connected with a plurality of camera test screens in the intelligent cockpit area to be tested;
the single-path signal pickup module is used for receiving an original camera signal collected by the single camera and transmitting the original camera signal to the multi-path signal generation module;
the multi-path signal generating module comprises a plurality of high-speed switch chips and is used for generating a first path of copied camera signals in a time-sharing manner according to the original camera signals and sending the copied camera signals to the multi-path signal testing module;
each high-speed switch chip is used for copying an input path of signals to obtain a second path of copied signals for time-sharing output, and the first path of signals is greater than the second path of signals;
and the multi-path signal testing module is used for outputting the multi-path copied camera signals received in a time-sharing manner to each signal output end so as to carry out time-sharing testing on a plurality of camera testing screens respectively connected with each signal output end.
2. The test system of claim 1, wherein the multi-path signal generation module specifically comprises: the high-speed switch chip combination network and the gating signal control unit;
the high-speed switch chip combination network is formed by sequentially connecting a plurality of cascade units, each cascade unit comprises at least one high-speed switch chip, the first cascade unit is used for inputting the original camera signal, the last cascade unit is used for outputting the copied camera signal of the first path in a time-sharing manner, and the input of the next cascade unit is the output of the previous cascade unit;
the gating signal control unit is used for sequentially outputting gating control signal sets and sending the gating control signal sets to each high-speed switch chip in the high-speed switch chip combination network so as to control the high-speed switch chip combination network to output only one path of the copied camera signals at the same time.
3. The test system according to claim 2, wherein the number of the high-speed switch chips included in each cascaded unit in the high-speed switch chip combining network is determined by the first and second ways in common.
4. A test system according to claim 3Wherein the high-speed switch chips included in each cascade unit in the high-speed switch chip combination network have a quantity value of
；
Wherein N is the first path number, B is the second path number, N is the hierarchical position of the cascade unit in the front-to-back direction,
for the rounding-up operation, the number of the high-speed switch chips included in the first cascade unit is 1.
5. The test system of claim 2, wherein the gating signal control unit comprises an N-to-1 selector switch, where N is the first number; the N selector switches of the gating signal control unit are connected with the channel switching ports of the high-speed switch chips in the high-speed switch chip combination network in a preset connection mode;
and the N-to-1 selector switch is used for sequentially gating each selector switch so as to control the high-speed switch chip combination network to sequentially gate one path of the copied camera signals from multiple paths and output the same to the multiple paths of signal testing modules.
6. The test system of claim 5, wherein the 1-out-of-N diverter switch is a programmable switch;
the N-to-1 selector switch is programmed to be set to enable each selector switch to sequentially gate a set time length so as to perform time-sharing test on the camera test screen for one path of copied camera signals matched with each selector switch in the set time length.
7. The test system of claim 1, wherein the single-channel signal pickup module comprises: a first signal conversion jack comprising a first connection interface and a second connection interface;
the first signal conversion socket is configured to receive the original camera signal through the first connection interface, and transmit the received original camera signal to the multi-channel signal generation module through the second connection interface.
8. The test system of claim 1, wherein the multi-channel signal test module specifically comprises: a plurality of signal output units;
the signal output unit is a second signal conversion socket;
the second signal conversion socket comprises a third connecting interface and a fourth connecting interface;
the second signal conversion socket is configured to receive the multiple paths of the replica camera signals generated by the multiple paths of signal generation modules through the third connection interface, and output each of the replica camera signals to each of the signal output ends through the fourth connection interface.
9. The test system of claim 5 or 6, wherein the first number of passes is 8 and the second number of passes is 4.
10. The test system of claim 9, wherein the multi-path signal generating module specifically comprises: the N-to-1 selector switch is an 8-to-1 selector switch;
the first cascade unit comprises a first high-speed switch chip; the second cascade unit comprises a second high-speed switch chip and a third high-speed switch chip;
wherein, each high speed switch chip all includes: the first level control pin, the second level control pin, the first signal output channel, the second signal output channel, the third signal output channel, the fourth signal output channel and the signal input channel;
the 1-out-of-8 selector switch comprises: the first change-over switch, the second change-over switch, the third change-over switch, the fourth change-over switch, the fifth change-over switch, the sixth change-over switch, the seventh change-over switch and the eighth change-over switch;
the first signal output channel of the first high-speed switch chip is connected with the signal input channel of the second high-speed switch chip, the second signal output channel of the first high-speed switch chip is connected with the signal input channel of the third high-speed switch chip, and the signal input channel of the first high-speed switch chip is connected with the single-channel signal pickup module;
a first signal output channel of the second high-speed switch chip is connected with a first path of copying camera signals, a second signal output channel of the second high-speed switch chip is connected with a second path of copying camera signals, a third signal output channel of the second high-speed switch chip is connected with a third path of copying camera signals, and a fourth signal output channel of the second high-speed switch chip is connected with a fourth path of copying camera signals; a first level control pin of the second high-speed switch chip is connected with a first control pin of the first change-over switch, and a second control pin of the first change-over switch is connected in a suspended mode; a second level control pin of the second high-speed switch chip is connected with a first control pin of the second change-over switch, and a first level control pin of the second high-speed switch chip is connected with a second control pin of the second change-over switch; a second level control pin of the second high-speed switch chip is connected with a first control pin of the third change-over switch, and a first level control pin of the second high-speed switch chip is connected with a second control pin of the third change-over switch; a second level control pin of the second high-speed switch chip is connected with a first control pin of the fourth change-over switch, and a first level control pin of the second high-speed switch chip is connected with a second control pin of the fourth change-over switch;
the first signal output channel of the third high-speed switch chip is connected with a fifth path of copying camera signals, the second signal output channel of the third high-speed switch chip is connected with a sixth path of copying camera signals, the third signal output channel of the third high-speed switch chip is connected with a seventh path of copying camera signals, and the fourth signal output channel of the third high-speed switch chip is connected with an eighth path of copying camera signals; a first level control pin of the third high-speed switch chip is connected with a first control pin of the fifth change-over switch, and a first level control pin of the first high-speed switch chip is connected with a second control pin of the fifth change-over switch; a first level control pin of the third high-speed switch chip is connected with a first control pin of the sixth change-over switch, and a second level control pin of the third high-speed switch chip is connected with a second control pin of the sixth change-over switch; a first level control pin of the third high-speed switch chip is connected with a first control pin of the seventh change-over switch, and a second level control pin of the third high-speed switch chip is connected with a second control pin of the seventh change-over switch; and a first level control pin of the third high-speed switch chip is connected with a first control pin of the eighth change-over switch, and a second level control pin of the third high-speed switch chip is connected with a second control pin of the eighth change-over switch.
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