CN114690815A - High-temperature constant-temperature heating device - Google Patents

High-temperature constant-temperature heating device Download PDF

Info

Publication number
CN114690815A
CN114690815A CN202210226854.6A CN202210226854A CN114690815A CN 114690815 A CN114690815 A CN 114690815A CN 202210226854 A CN202210226854 A CN 202210226854A CN 114690815 A CN114690815 A CN 114690815A
Authority
CN
China
Prior art keywords
temperature
heating
constant
heat
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210226854.6A
Other languages
Chinese (zh)
Inventor
杨高
龚峰
王鑫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen University
Original Assignee
Shenzhen University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen University filed Critical Shenzhen University
Priority to CN202210226854.6A priority Critical patent/CN114690815A/en
Publication of CN114690815A publication Critical patent/CN114690815A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/20Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G05D23/22Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element being a thermocouple

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

The invention belongs to the field of heating technical equipment, and particularly relates to a high-temperature constant-temperature heating device. The high-temperature constant-temperature heating device comprises: the base, heating structure and temperature measurement structure, the arrangement chamber has been seted up to the base, and the arrangement chamber has the opening, and heating structure part at least is acceptd in the arrangement intracavity, and the temperature measurement structure includes heat-conducting plate and a plurality of temperature sensor, and the heat-conducting plate is range upon range of to be set up in the face that generates heat of heating structure, and each temperature sensor is arranged along the circumference interval in proper order of heat-conducting plate. The temperature sensors can measure the temperature of the corresponding position of the heat conducting plate, so as to obtain the distribution condition of the temperature field of the high-temperature constant-temperature heating device.

Description

High-temperature constant-temperature heating device
Technical Field
The invention belongs to the field of heating technical equipment, and particularly relates to a high-temperature constant-temperature heating device.
Background
At present, a high-temperature constant-temperature heating table can provide a high-temperature environment which is relatively stable and is uniformly heated, and is widely applied to various fields such as material science, semiconductors, chemical fibers, food science, biogenetic science and the like.
The temperature distribution of each region of the existing high-temperature constant-temperature heating table on the market is uneven, and the uneven temperature distribution can influence various heating occasions. Meanwhile, the conventional heating table is lack of a device for detecting the uniformity of the temperature, so that the uniformity of the temperature of the heating table cannot be measured accurately during heating, and the heated temperature environment is worried about.
Disclosure of Invention
An object of the embodiment of this application is to provide a high temperature constant temperature heating device, aims at solving the problem how to measure high temperature constant temperature heating device's temperature.
In order to achieve the purpose, the technical scheme adopted by the application is as follows:
provided is a high-temperature constant-temperature heating device, including: the base is provided with a placement cavity, the placement cavity is provided with an opening, at least part of the heating structure is contained in the placement cavity, the temperature measurement structure comprises a heat conduction plate and a plurality of temperature sensors, the heat conduction plate is arranged on the heating surface of the heating structure in a stacked mode, and the temperature sensors are arranged along the circumferential direction of the heat conduction plate at intervals in sequence.
In some embodiments, the heat conducting plate is provided with first temperature measuring holes along a first direction, the first temperature measuring holes are arranged at intervals along the first direction, two ends of each first temperature measuring hole respectively penetrate through two sides of the heat conducting plate and form first inserting holes, and at least one first temperature measuring hole is inserted with one temperature sensor.
In some embodiments, the heat conducting plate is provided with second temperature measuring holes along a second direction, the first direction and the second direction are staggered, the plurality of second temperature measuring holes are arranged at intervals along the second direction, two ends of each second temperature measuring hole respectively penetrate through two sides of the heat conducting plate and form second inserting holes, and at least one of the second temperature measuring holes is inserted with one of the temperature sensors.
In some embodiments, the high-temperature constant-temperature heating device further comprises a heat conducting column, and the shape of the heat conducting column is matched with the shape of the first temperature measuring hole and/or the second temperature measuring hole.
In some embodiments, any one of the first temperature sensing holes intersects and communicates with any one of the second temperature sensing holes.
In some embodiments, the heating structure includes a plurality of heating pipes and a heating block at least partially received in the receiving cavity, the heating block defines a plurality of heating holes arranged at intervals, each of the heating pipes is respectively disposed in each of the heating holes, and the heat conducting plate abuts against the heating block.
In some embodiments, the high-temperature constant-temperature heating device further comprises a cooling block located in the placement cavity, the cooling block, the heating block and the heat conducting plate are sequentially arranged, and the cooling block is provided with a cooling flow channel for cooling fluid to pass through.
In some embodiments, the cooling flow passages are arranged in a serpentine winding manner within the cooling block.
In some embodiments, the high-temperature constant-temperature heating device further comprises a heat insulation layer, and the heat insulation layer is paved on the inner wall of the placement cavity.
In some embodiments, the high-temperature constant-temperature heating device further comprises a handle, and the handles are arranged at two ends of the base.
The beneficial effect of this application lies in: through seting up on the base and settling the chamber, be fixed in the arrangement intracavity with heating structure, set up the heat-conducting plate on heating structure's the face of generating heat again, each temperature sensor is arranged along the circumference interval of settling the chamber, and temperature sensor's temperature measurement end connects the heat-conducting plate to each temperature sensor can measure the temperature of the corresponding position department of heat-conducting plate, and then acquires the distribution condition of high temperature constant temperature heating device's temperature field.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
Fig. 1 is a schematic perspective view of a high-temperature constant-temperature heating device provided in an embodiment of the present application;
FIG. 2 is an exploded schematic view of the high temperature thermostatic heating device of FIG. 1;
fig. 3 is a perspective view of the heat-conducting plate of fig. 2;
fig. 4 is a schematic cross-sectional view of the heat-conducting plate of fig. 3;
fig. 5 is a schematic structural view of a cooling flow passage.
Wherein, in the figures, the respective reference numerals:
100. a high-temperature constant-temperature heating device; 10. a base; 11. a base plate; 12. an annular side plate; 13. a handle; 20. a temperature measuring structure; 21. a heat conducting plate; 22. a temperature sensor; 30. a heating structure; 31. a heating block; 32. heating a tube; 33. cooling the block; 331. a water inlet hole; 332. a water outlet hole; 311. heating the hole; 14. a placement cavity; 15. a thermal insulation layer; 2111. a first plug hole; 2112. a second plug hole; 211. a first temperature measuring hole; 212. a second temperature measuring hole;
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not delimit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and operate, and thus are not to be construed as limiting the present application, and the specific meanings of the above terms may be understood by those skilled in the art according to specific situations. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
Referring to fig. 1 and 3, an embodiment of the present invention provides a high-temperature constant-temperature heating apparatus 100, which includes: a susceptor 10, a heating structure 30, and a temperature measuring structure 20.
Referring to fig. 1 and fig. 3, optionally, the base 10 is provided with a mounting cavity 14, the base 10 includes a bottom plate 11 and an annular side plate 12 connected to the bottom plate 11, the annular side plate 12 is connected to a side plate surface of the bottom plate 11, and forms the mounting cavity 14 together with the bottom plate 11. Alternatively, the bottom plate 11 and the annular side plate 12 are both made of an aluminum alloy, which is an alloy based on aluminum with a certain amount of other alloying elements added, and is one of light metal materials. In addition to the general characteristics of aluminum, aluminum alloys have certain alloy specific characteristics due to the variety and amount of alloying elements added. The aluminum alloy has the density of 2.63-2.85 g/cm3, high strength, specific strength close to high alloy steel, specific stiffness higher than that of steel, good casting performance and plastic processing performance, good electric conduction and heat conduction performance, good corrosion resistance and weldability, can be used as a structural material, and is widely applied to aerospace, aviation, transportation, construction, electromechanics, lightening and daily necessities. The housing chamber 14 has an opening, it being understood that, in use, the base plate 11 lies flat on the table with the opening facing upwards.
Referring to fig. 1 and 3, optionally, the heating structure 30 is at least partially accommodated in the accommodating cavity 14, the heating structure 30 may be entirely accommodated in the accommodating cavity 14, or the lower end of the heating structure 30 is accommodated and positioned in the accommodating cavity 14. It is understood that the heating structure 30 may generate heat in a conductive state to convert electrical energy into thermal energy. Alternatively, the heating structure 30 may be a ceramic heating plate or a heating plate formed of resistance wire.
Referring to fig. 1 and fig. 3, optionally, the temperature measuring structure 20 includes a heat conducting plate 21 and a plurality of temperature sensors 22, the heat conducting plate 21 is disposed on the heat generating surface of the heating structure 30 in a stacked manner, and the temperature sensors 22 are sequentially arranged at intervals along the circumferential direction of the heat conducting plate 21. Optionally, one side of the heat conducting plate 21 is laid on the heat generating surface of the heating structure 30 and receives heat from the heat generating structure, the temperature measuring end of each temperature sensor 22 is connected to the heat conducting plate 21 along the circumferential direction of the heat conducting plate 21, and the temperature of the heating structure 30 is measured by measuring the temperature distribution of the heat conducting plate 21. In this embodiment, the temperature sensor 22 is a thermocouple. The electromotive force at the two ends of the thermocouple is converted into temperature by using the temperature measuring instrument, and the uniformity of the surface temperature of the heat conducting plate 21 can be intuitively and accurately measured.
Referring to fig. 1 and 3, the mounting cavity 14 is formed on the base 10, the heating structure 30 is fixed in the mounting cavity 14, the heat conducting plate 21 is disposed on the heating surface of the heating structure 30, the temperature sensors 22 are arranged at intervals along the circumferential direction of the mounting cavity 14, and the temperature measuring ends of the temperature sensors 22 are connected to the heat conducting plate 21, so that the temperature sensors 22 can measure the temperature at the corresponding positions of the heat conducting plate 21, and further the distribution of the temperature field of the high temperature constant temperature heating apparatus 100 is obtained.
Referring to fig. 1 and 3, the thermocouple is a temperature measuring element commonly used in a temperature measuring instrument, and is used for directly measuring temperature, converting a temperature signal into a thermal electromotive force signal, and converting the thermal electromotive force signal into the temperature of a measured medium through an electric instrument (a secondary instrument). In this embodiment, the thermocouple is a k-type thermocouple.
It can be understood that the heat conductive plate 21 is heated by the heating structure 30, so that the heat conductive plate 21 can realize the heating of the workpiece to be heated.
Referring to fig. 3 and 4, in some embodiments, the heat conducting plate 21 is provided with first temperature measuring holes 211 along a first direction, the first temperature measuring holes 211 are arranged at intervals along the first direction, two ends of each first temperature measuring hole 211 respectively penetrate through two sides of the heat conducting plate 21 and form first inserting holes 2111, and at least one of the first temperature measuring holes 211 is inserted with one of the temperature sensors 22.
Referring to fig. 3 and 4, it can be understood that in the present embodiment, the heat conducting plate 21 is a rectangular plate, the first direction is a length direction of the heat conducting plate 21, and optionally, a path extending direction of the first temperature measuring hole 211 is arranged linearly or nonlinearly. Alternatively, non-straight lines include arcs, serpentines, and the like. The temperature measuring end of one of the temperature sensors 22 is inserted into one of the first temperature measuring holes 211 from the first inserting hole 2111 on one side of the heat conducting plate 21, so that the temperature at the corresponding position of the heat conducting plate 21 is measured.
Referring to fig. 3 and 4, it can be understood that the temperature measuring ends of some of the temperature sensors 22 are respectively inserted into some of the first temperature measuring holes 211, that is, the temperature sensors 22 can be inserted into all of the first temperature measuring holes 211 according to the measurement requirement, or some of the first temperature measuring holes 211 are inserted into the temperature sensors 22, and the temperature sensors 22 are not inserted into the remaining first temperature measuring holes 211, so as to adjust the measurement range.
Referring to fig. 3 and 4, in some embodiments, the heat conducting plate 21 is provided with second temperature measuring holes 212 along a second direction, the first direction and the second direction are staggered, the plurality of second temperature measuring holes 212 are arranged at intervals along the second direction, two ends of each second temperature measuring hole 212 respectively penetrate through two sides of the heat conducting plate 21 and form second inserting holes 2112, and one temperature sensor 22 is inserted into at least one second temperature measuring hole 212.
Referring to fig. 3 and 4, it can be understood that in the present embodiment, the heat conducting plate 21 is a rectangular plate, the second direction is a width direction of the heat conducting plate 21, and the first direction and the second direction are orthogonal. Optionally, the path extension direction of the second temperature measurement hole 212 is arranged in a straight line or a non-straight line. Alternatively, non-straight lines include arcs, serpentines, and the like. The temperature measuring end of one of the temperature sensors 22 is inserted into one of the second temperature measuring holes 212 from the second inserting hole 2112 on one side of the heat conducting plate 21, so that the temperature at the corresponding position of the heat conducting plate 21 is measured.
Referring to fig. 3 and 4, it can be understood that the temperature measuring ends of some of the temperature sensors 22 are respectively inserted into some of the second temperature measuring holes 212, that is, the temperature sensors 22 can be inserted into all of the second temperature measuring holes 212 according to the measurement requirement, or some of the second temperature measuring holes 212 are inserted into the temperature sensors 22, and the temperature sensors 22 are not inserted into the remaining second temperature measuring holes 212, so as to adjust the measurement range.
Referring to fig. 1 and 3, alternatively, in the present embodiment, the heat conducting plate 21 is made of a thin copper plate made of copper, which is a metal material, and 24 temperature sensors 22 are provided, and in other embodiments, 36 temperature sensors 22 may also be provided. The selection can be made according to practical situations and is not limited herein.
Referring to fig. 1 and 3, in some embodiments, the high-temperature constant-temperature heating apparatus 100 further includes a heat-conducting pillar, and the shape of the heat-conducting pillar is adapted to the shape of the first temperature measuring hole 211 and/or the second temperature measuring hole 212.
Optionally, heat-conducting columns with corresponding sizes can be inserted into the unused first temperature measuring hole 211 and/or the unused second temperature measuring hole 212 on the heat-conducting plate 21, and the heat-conducting columns are also made of metal copper, so that the requirement that the number and the positions of the thermocouples can be adjusted according to different use occasions can be met. And the first temperature measuring hole 211 and/or the second temperature measuring hole 212 are inserted into the heat conducting columns, so that the heat conducting columns can prevent the internal hot air flow from losing or prevent the external cold air flow from flowing into the first temperature measuring hole 211 and/or the second temperature measuring hole 212, and therefore the interference of the external cold air flow is avoided, and the accuracy of temperature measurement on the heat conducting plate 21 is improved.
Referring to fig. 1 and 3, in some embodiments, any one of the first temperature measuring holes 211 intersects with and communicates with any one of the second temperature measuring holes 212, so that the air flows in each of the first temperature measuring holes 211 and/or each of the second temperature measuring holes 212 can flow each other, thereby improving the uniformity of the temperature distribution on the heat conducting plate 21 and further improving the uniformity of the detection.
It can be understood that the convenience of use is improved by adjusting the temperature measuring position of the thermocouple by adjusting the length of the thermocouple inserted into the first temperature measuring hole 211 and/or the second temperature measuring hole 212.
Referring to fig. 1 and 3, in some embodiments, the heating structure 30 includes a plurality of heating pipes 32 and a heating block 31 at least partially received in the accommodating chamber 14, the heating block 31 is opened with a plurality of heating holes 311 arranged at intervals, each heating pipe 32 is respectively disposed in each heating hole 311, and the heat conducting plate 21 abuts against an upper surface of the heating block 31.
Alternatively, the heating control of each heating pipe 32 may be realized by a temperature control module. The temperature control module comprises a high-precision temperature controller and a solid-state relay. The temperature control module is separated from the high-temperature constant-temperature heating device 100 and is arranged at a preset distance, and is connected with each heating pipe 32 in the high-temperature constant-temperature heating device 100 through a high-temperature resistant lead. Optionally, the solid-state relay is connected to the output end of the temperature controller by a wire, and is used to control the output power of the heating tube 32, so as to regulate and control the temperature of each region of the heating block 31, and make the temperature distribution more uniform.
Referring to fig. 1 and fig. 3, optionally, the temperature control module adopts fuzzy PID control, which controls temperature accurately and precisely. Firstly, the temperature deviation e and the temperature deviation change rate ec are taken as input and converted into fuzzy values on a fuzzy domain, three parameters Ki, kp and Kd of the PID controller are automatically adjusted after a series of conversion, then the parameters are input into the PID controller, and finally a control quantity is output to an actuating mechanism. The fuzzy PID does not need an accurate mathematical model, can better process the problems of time variation, nonlinearity, hysteresis and the like, and has good robustness and high response speed.
Optionally, the number, position and geometry of the heating pipes 32 are optimized to maximize the heating rate and improve the uniformity of the temperature distribution on the surface of the heating block 31.
Referring to fig. 5, in some embodiments, the high-temperature constant-temperature heating apparatus 100 further includes a cooling block 33 located in the installation cavity 14, the cooling block 33, the heating block 31, and the heat conducting plate 21 are sequentially disposed, and the cooling block 33 is provided with a cooling channel 333 through which a cooling fluid passes. The cooling flow channel 333 forms a water inlet hole 331 and a water outlet hole 332 on the same surface of the cooling block 33.
Alternatively, the cooling fluid may be cooling water, cooling oil, or the like. The rapid cooling of the high-temperature constant-temperature heating device 100 can be realized by controlling the temperature and the speed of water flow, a water inlet and a water outlet are arranged on the same side of a high-temperature-resistant wire of the heating pipe 32, and the cooling block 33 is arranged below the heating block 31 and can directly cool the heating block 31.
Referring to fig. 5, in some embodiments, the cooling channels 333 are arranged in a serpentine winding manner in the cooling block 33. It will be appreciated that the cooling channels 333 in a serpentine, circuitous arrangement may extend their length to enhance the cooling effect.
In some embodiments, the high-temperature constant-temperature heating device 100 further comprises a thermal insulation layer 15, and the thermal insulation layer 15 is laid on the inner wall of the installation cavity 14.
Referring to fig. 1 and 3, the insulation layer 15 is optionally an insulation block made of aluminum silicate. The aluminum silicate heat insulation blocks are coated on the peripheries of the heating block 31 and the cooling block 33, the heat insulation blocks are arranged on the bottom surface of the cooling block 33, and the heat insulation layer 15 can preserve heat and reduce heat energy loss, so that the heating speed is higher, the heating temperature is higher, and the surface temperature distribution uniformity of the heating block 31 is improved; the annular side plates 12 are wrapped around and on the bottom surface of the heat insulation block to fix the heat insulation block.
Referring to fig. 1 and 3, optionally, a plurality of hole portions are formed around the heat insulation block and the annular side plate 12, and the hole portions correspond to the wires of the heating pipe 32, the water inlet 331, the water outlet 332, and the thermocouples on the heat conducting plate 21 in position and size.
Alternatively, the annular side plate 12 is fixed to the bottom plate 11 by fitting screws and threaded holes.
In some embodiments, the high temperature and constant temperature heating apparatus 100 further includes a handle 13, and the handle 13 is disposed at both ends of the base 10. The two handles 13 are arranged in bilateral symmetry, and an operator can easily carry the heating table to a required position by holding the handles 13.
The high-temperature constant-temperature heating device 100 of the embodiment is suitable for occasions with high heating temperature, accurate temperature control and high requirement on thermal uniformity.
The above are merely alternative embodiments of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement or the like made within the spirit and principle of the present application shall be included in the scope of the claims of the present application.

Claims (10)

1. A high-temperature constant-temperature heating device is characterized by comprising: the base is provided with a placement cavity, the placement cavity is provided with an opening, at least part of the heating structure is contained in the placement cavity, the temperature measurement structure comprises a heat conduction plate and a plurality of temperature sensors, the heat conduction plate is arranged on the heating surface of the heating structure in a stacked mode, and the temperature sensors are arranged along the circumferential direction of the heat conduction plate at intervals in sequence.
2. The high-temperature constant-temperature heating apparatus according to claim 1, wherein: the heat conduction plate is provided with first temperature measurement holes along a first direction, the first temperature measurement holes are arranged at intervals along the first direction, two ends of each first temperature measurement hole are respectively communicated with two sides of the heat conduction plate and form first insertion holes, and at least one temperature sensor is inserted into at least one first temperature measurement hole.
3. The high-temperature constant-temperature heating apparatus according to claim 2, wherein: the heat conducting plate is provided with second temperature measuring holes along a second direction, the first direction and the second direction are arranged in a staggered mode, the second temperature measuring holes are arranged at intervals along the second direction, two ends of each second temperature measuring hole penetrate through two sides of the heat conducting plate respectively and form second inserting holes, and at least one temperature sensor is inserted into at least one second temperature measuring hole.
4. A high-temperature constant-temperature heating apparatus according to claim 3, wherein: the high-temperature constant-temperature heating device further comprises a heat conduction column, and the shape of the heat conduction column is matched with the shape of the first temperature measurement hole and/or the second temperature measurement hole.
5. A high-temperature constant-temperature heating apparatus according to claim 3, wherein: any one first temperature measuring hole is intersected with and communicated with any one second temperature measuring hole.
6. The high-temperature constant-temperature heating apparatus according to any one of claims 1 to 5, wherein: the heating structure comprises a plurality of heating pipes and a heating block, at least part of the heating block is contained in the containing cavity, a plurality of heating holes are formed in the heating block at intervals, the heating pipes are respectively arranged in the heating holes, and the heat conduction plate is abutted to the heating block.
7. The high-temperature constant-temperature heating apparatus according to claim 6, wherein: the high-temperature constant-temperature heating device further comprises a cooling block located in the placement cavity, the cooling block, the heating block and the heat-conducting plate are sequentially arranged, and a cooling flow channel for cooling fluid to pass through is formed in the cooling block.
8. The high-temperature constant-temperature heating apparatus according to claim 7, wherein: the cooling flow channel is arranged in the cooling block in a serpentine and roundabout mode.
9. The high-temperature constant-temperature heating apparatus according to claim 6, wherein: the high-temperature constant-temperature heating device further comprises a heat insulation layer, and the heat insulation layer is laid on the inner wall of the placement cavity.
10. The high-temperature constant-temperature heating apparatus according to any one of claims 1 to 5, wherein: the high-temperature constant-temperature heating device further comprises handles, and the handles are arranged at two ends of the base.
CN202210226854.6A 2022-03-08 2022-03-08 High-temperature constant-temperature heating device Pending CN114690815A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210226854.6A CN114690815A (en) 2022-03-08 2022-03-08 High-temperature constant-temperature heating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210226854.6A CN114690815A (en) 2022-03-08 2022-03-08 High-temperature constant-temperature heating device

Publications (1)

Publication Number Publication Date
CN114690815A true CN114690815A (en) 2022-07-01

Family

ID=82137090

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210226854.6A Pending CN114690815A (en) 2022-03-08 2022-03-08 High-temperature constant-temperature heating device

Country Status (1)

Country Link
CN (1) CN114690815A (en)

Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10142072A (en) * 1996-11-13 1998-05-29 Miyazaki Oki Electric Co Ltd Temperature measuring system
US20060007982A1 (en) * 2002-11-13 2006-01-12 Jiri Sevcik Apparatus and method for measuring the heating of gases
JP2012013496A (en) * 2010-05-31 2012-01-19 Chino Corp Soaking block for thermostatic devices
US20120234069A1 (en) * 2009-11-09 2012-09-20 Toyota Jidosha Kabushiki Kaisha Hot press mold, temperature measuring device, and hot press molding method
JP2014020884A (en) * 2012-07-18 2014-02-03 Hitachi High-Technologies Corp Temperature controller
CN203881448U (en) * 2014-06-04 2014-10-15 上海赛科利汽车模具技术应用有限公司 A constant temperature calibration furnace used for thermal infrared imager on-site calibration
CN104362076A (en) * 2014-09-23 2015-02-18 北京七星华创电子股份有限公司 Temperature control device, temperature control system and temperature control method of semiconductor device
CN107300479A (en) * 2017-08-16 2017-10-27 国网湖南省电力公司 A kind of test platform and its application process of SVG heat-pipe radiators characteristic
CN206724243U (en) * 2017-05-10 2017-12-08 广东海明晖电子科技有限公司 Temperature measuring device for electromagnetic oven
CN108051100A (en) * 2017-11-30 2018-05-18 西南铝业(集团)有限责任公司 Induction heater temp measuring method and thermometric ingot casting
CN207475906U (en) * 2017-09-05 2018-06-08 河北哨宾科技有限公司 Integral heating device
JP2019008954A (en) * 2017-06-23 2019-01-17 日産自動車株式会社 Heat block
CN109282915A (en) * 2017-07-20 2019-01-29 中国航空工业集团公司西安飞机设计研究所 A kind of heating water tank inside temperature measuring equipment
CN209182328U (en) * 2018-12-06 2019-07-30 青岛尚德环保科技有限公司 A kind of constent temperature heater for soil organic matter detection
CN110672221A (en) * 2019-10-22 2020-01-10 福建工程学院 Metal weldment temperature field detection system and temperature detection method thereof
CN110707035A (en) * 2019-10-16 2020-01-17 北京北方华创微电子装备有限公司 Electrostatic chuck, semiconductor processing chamber and apparatus
CN210477658U (en) * 2019-08-27 2020-05-08 江西震汉科技有限公司 Glue injection mold with temperature measuring hole
CN210572154U (en) * 2019-07-18 2020-05-19 成都理工大学 Constant temperature structure and constant temperature device
CN211831203U (en) * 2020-04-27 2020-10-30 山东省新铭煦新能源科技发展有限公司 Electric heating plate for agricultural product detection
US20200370971A1 (en) * 2018-01-09 2020-11-26 Beijing Const Instruments Technology Inc. High-temperature dry block temperature calibrator
CN212432483U (en) * 2020-06-17 2021-01-29 苏州联讯仪器有限公司 Clamp for testing luminescent device
CN212706302U (en) * 2020-06-17 2021-03-16 苏州联讯仪器有限公司 Multifunctional clamp for optical device
CN113125106A (en) * 2021-04-02 2021-07-16 西安交通大学 Rectangular narrow slit channel test section under heat flow local concentration and test method
CN113125025A (en) * 2021-03-24 2021-07-16 中国科学院金属研究所 Vacuum thermal field temperature measurement armored thermocouple dismounting device and temperature measurement method
CN113237567A (en) * 2021-04-23 2021-08-10 广州碳思科技有限公司 Device and method for recognizing object contour based on temperature difference
CN113387551A (en) * 2021-06-30 2021-09-14 深圳大学 Heating device and roller-to-plate hot-stamping equipment
CN113670448A (en) * 2021-08-16 2021-11-19 季华实验室 Reaction chamber temperature measuring system, method and device and temperature adjusting method
CN113983757A (en) * 2021-12-23 2022-01-28 常州铭赛机器人科技股份有限公司 Constant temperature module and stock preparation barrel with same

Patent Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10142072A (en) * 1996-11-13 1998-05-29 Miyazaki Oki Electric Co Ltd Temperature measuring system
US20060007982A1 (en) * 2002-11-13 2006-01-12 Jiri Sevcik Apparatus and method for measuring the heating of gases
US20120234069A1 (en) * 2009-11-09 2012-09-20 Toyota Jidosha Kabushiki Kaisha Hot press mold, temperature measuring device, and hot press molding method
JP2012013496A (en) * 2010-05-31 2012-01-19 Chino Corp Soaking block for thermostatic devices
JP2014020884A (en) * 2012-07-18 2014-02-03 Hitachi High-Technologies Corp Temperature controller
CN203881448U (en) * 2014-06-04 2014-10-15 上海赛科利汽车模具技术应用有限公司 A constant temperature calibration furnace used for thermal infrared imager on-site calibration
CN104362076A (en) * 2014-09-23 2015-02-18 北京七星华创电子股份有限公司 Temperature control device, temperature control system and temperature control method of semiconductor device
CN206724243U (en) * 2017-05-10 2017-12-08 广东海明晖电子科技有限公司 Temperature measuring device for electromagnetic oven
JP2019008954A (en) * 2017-06-23 2019-01-17 日産自動車株式会社 Heat block
CN109282915A (en) * 2017-07-20 2019-01-29 中国航空工业集团公司西安飞机设计研究所 A kind of heating water tank inside temperature measuring equipment
CN107300479A (en) * 2017-08-16 2017-10-27 国网湖南省电力公司 A kind of test platform and its application process of SVG heat-pipe radiators characteristic
CN207475906U (en) * 2017-09-05 2018-06-08 河北哨宾科技有限公司 Integral heating device
CN108051100A (en) * 2017-11-30 2018-05-18 西南铝业(集团)有限责任公司 Induction heater temp measuring method and thermometric ingot casting
US20200370971A1 (en) * 2018-01-09 2020-11-26 Beijing Const Instruments Technology Inc. High-temperature dry block temperature calibrator
CN209182328U (en) * 2018-12-06 2019-07-30 青岛尚德环保科技有限公司 A kind of constent temperature heater for soil organic matter detection
CN210572154U (en) * 2019-07-18 2020-05-19 成都理工大学 Constant temperature structure and constant temperature device
CN210477658U (en) * 2019-08-27 2020-05-08 江西震汉科技有限公司 Glue injection mold with temperature measuring hole
CN110707035A (en) * 2019-10-16 2020-01-17 北京北方华创微电子装备有限公司 Electrostatic chuck, semiconductor processing chamber and apparatus
CN110672221A (en) * 2019-10-22 2020-01-10 福建工程学院 Metal weldment temperature field detection system and temperature detection method thereof
CN211831203U (en) * 2020-04-27 2020-10-30 山东省新铭煦新能源科技发展有限公司 Electric heating plate for agricultural product detection
CN212432483U (en) * 2020-06-17 2021-01-29 苏州联讯仪器有限公司 Clamp for testing luminescent device
CN212706302U (en) * 2020-06-17 2021-03-16 苏州联讯仪器有限公司 Multifunctional clamp for optical device
CN113125025A (en) * 2021-03-24 2021-07-16 中国科学院金属研究所 Vacuum thermal field temperature measurement armored thermocouple dismounting device and temperature measurement method
CN113125106A (en) * 2021-04-02 2021-07-16 西安交通大学 Rectangular narrow slit channel test section under heat flow local concentration and test method
CN113237567A (en) * 2021-04-23 2021-08-10 广州碳思科技有限公司 Device and method for recognizing object contour based on temperature difference
CN113387551A (en) * 2021-06-30 2021-09-14 深圳大学 Heating device and roller-to-plate hot-stamping equipment
CN113670448A (en) * 2021-08-16 2021-11-19 季华实验室 Reaction chamber temperature measuring system, method and device and temperature adjusting method
CN113983757A (en) * 2021-12-23 2022-01-28 常州铭赛机器人科技股份有限公司 Constant temperature module and stock preparation barrel with same

Similar Documents

Publication Publication Date Title
CN107688039B (en) System and method for testing heat conductivity coefficient and interface thermal resistance of sheet material
KR960003389B1 (en) Method and apparatus for measuring and controlling a fluid flow rate
JP3114139B2 (en) Thermal conductivity meter
US10107661B2 (en) Thermal flowmeter with energy storage element
CN101750172B (en) Device and method for detecting temperature characteristics of temperature sensor
US8583385B2 (en) Thermal, flow measuring device
AU2016320032B2 (en) Heat exchanger
CN205620336U (en) A rapid measurement device that is used for effective thermal conductance rate of porous metal material based on protection hot plate method
CN104263634A (en) Flow polymerase chain reaction (PCR) circulating heating apparatus based on capillaries and heating method
US4036051A (en) Heat meters
CN103728337A (en) Hot-fluid density probe for measuring hot-fluid density of object interior and measuring method
CN108592997A (en) A kind of horizontal pipe steam condensation heat transfer thermal parametre measuring device
Hamadi et al. A novel thin-film temperature and heat-flux microsensor for heat transfer measurements in microchannels
CN108195879A (en) The method that Transient Method measures material thermal conductivity and thermal diffusion coefficient
CN106645284A (en) Circular-tube material heat conductivity coefficient measuring system and measuring method thereof
CN114690815A (en) High-temperature constant-temperature heating device
US7553074B2 (en) Performance testing apparatus for heat pipes
CN208953164U (en) Thermal resistance heat flow transducer calibrating installation
CN113077692B (en) Air transverse single tube forced convection heat transfer teaching experiment device and use method
CN108886086A (en) Electrothermal module power generation evaluating apparatus
CN112345582A (en) Semiconductor refrigerating sheet performance parameter testing method
CN107271476B (en) Motor iron core axial heat conductivity coefficient testing device and testing method
CN219915446U (en) Test fixture for heat conduction performance of heat conduction interface material of optical module
EP0666972A4 (en) Gas heater for processing gases.
CN219777548U (en) Thermal conductivity measuring device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination