CN113387551A - Heating device and roller-to-plate hot-stamping equipment - Google Patents
Heating device and roller-to-plate hot-stamping equipment Download PDFInfo
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- CN113387551A CN113387551A CN202110745165.1A CN202110745165A CN113387551A CN 113387551 A CN113387551 A CN 113387551A CN 202110745165 A CN202110745165 A CN 202110745165A CN 113387551 A CN113387551 A CN 113387551A
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 103
- 238000004049 embossing Methods 0.000 claims abstract description 18
- 230000005855 radiation Effects 0.000 claims abstract description 16
- 238000012546 transfer Methods 0.000 claims abstract description 11
- 238000003825 pressing Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000001816 cooling Methods 0.000 claims description 32
- 230000007246 mechanism Effects 0.000 claims description 21
- 238000007723 die pressing method Methods 0.000 claims description 14
- 238000009413 insulation Methods 0.000 claims description 13
- 230000005540 biological transmission Effects 0.000 claims description 12
- 239000002086 nanomaterial Substances 0.000 claims description 12
- 239000002826 coolant Substances 0.000 claims description 7
- 230000000903 blocking effect Effects 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000011521 glass Substances 0.000 abstract description 24
- 238000000465 moulding Methods 0.000 abstract description 7
- 230000009477 glass transition Effects 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 2
- 238000013500 data storage Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000003075 superhydrophobic effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/02—Re-forming glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/0013—Re-forming shaped glass by pressing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/0086—Heating devices specially adapted for re-forming shaped glass articles in general, e.g. burners
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/0093—Tools and machines specially adapted for re-forming shaped glass articles in general, e.g. chucks
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
The invention relates to the field of hot-stamping technical equipment, in particular to a heating device and roller-to-plate hot-stamping equipment. Heating device is used for the heating to be the blank of platelike setting and carries out the hot embossing to the blank, and heating device includes: the heat conduction structure comprises heat conduction plates which are tiled and a plurality of heating rods which transfer heat to the heat conduction plates, the heating rods are sequentially arranged at intervals and connected with the heat conduction plates, and the blank is arranged on the upward plate surface of the heat conduction plates; a heat radiation structure including a heating pipe and a mold pressing roller disposed above the blank, the mold pressing roller being made of a light-transmitting and temperature-resistant material, the heating pipe being inserted into the mold pressing roller and radiating heat toward the blank to heat the blank; and a support structure for supporting the heat-conducting plate and the molding roller. The invention increases the maximum heating temperature and heating rate of the heating device so that the maximum temperature to which the glass is heated is greater than the temperature of its glass transition point.
Description
Technical Field
The invention relates to the technical field of amorphous material forming equipment, in particular to a heating device and roller-to-plate hot stamping equipment.
Background
At present, devices with special micro-nano structures, such as micro-optical elements, micro-electro-mechanical systems, micro-fluidic chips, data storage media, mobile phone back plate structural colors, super-hydrophobic surfaces and the like, have wide application in the fields of aerospace, national defense safety, green energy, space sensing, laser radiation, optical fiber communication, biomedical, information data storage, consumer electronics and the like. With the progress of science and technology and the development of society, the demand of functional micro-nano structure devices applied to the fields is more and more large. The roll-to-plate hot stamping technology can manufacture large-area complex micro-nano structures efficiently, environmentally and inexpensively, and is concerned by the industry and academia.
However, limited by the maximum heating temperature of the roll-to-plate hot stamping device, the roll-to-plate hot stamping device developed by companies at home and abroad is generally heated in one direction, and micro-nano structure devices can be hot-pressed only on the plastic surface with low glass transition temperature. In the case of glass blank, since glass has a higher glass transition temperature (generally greater than 400 ℃) than polymer, the heating method of hot embossing of the glass plate by using a common roller becomes more challenging to manufacture micro-nano structure on the surface of the glass.
Disclosure of Invention
An object of the embodiment of this application is to provide a heating device, aims at solving the problem of how to realize high temperature heating and improve heating device's maximum heating temperature to the blank.
In order to achieve the purpose, the technical scheme adopted by the application is as follows: there is provided a heating device for heating and hot-stamping a blank arranged in a plate shape, the heating device including:
the heat conduction structure comprises a heat conduction plate which is tiled and a plurality of heating rods which transfer heat to the heat conduction plate, the heating rods are sequentially arranged at intervals and connected with the heat conduction plate, and the blank is arranged on the upward plate surface of the heat conduction plate;
the heat radiation structure comprises a heating pipe and a die pressing roller arranged above the blank, the die pressing roller is made of a light-transmitting and temperature-resistant material, and the heating pipe is inserted into the die pressing roller and radiates heat to the blank so as to heat the blank; and
and the supporting structure is used for supporting the heat conducting plate and the die pressing roller.
In one embodiment, the central axis of the heating tube is arranged coincident with the central axis of the embossing roll.
In one embodiment, the heat radiating structure further comprises a reflective shield spaced relative to the embossing roll and partially surrounding the embossing roll from above to below to reflect the heat to the blanks.
In one embodiment, the reflective cover comprises a cover body and a reflective layer coated on the cover body, wherein the reflective layer is positioned on the surface of the cover body facing the molding roller.
In one embodiment, the heat conducting plate is provided with positioning holes, the heating rods are arranged in the positioning holes, and the number of the positioning holes is matched with the number of the heating rods and is arranged in a one-to-one correspondence manner.
In one embodiment, the supporting structure comprises a sliding table mechanism supporting the heat conducting structure, the heat conducting structure further comprises a cooling block, the cooling block is located between the sliding table mechanism and the heat conducting plate, and the cooling block is used for blocking the heat from being transmitted to the sliding table mechanism; the cooling block is provided with a cooling channel, and a cooling medium is contained in the cooling channel.
In one embodiment, the heat conducting structure further comprises a heat insulating block located between the cooling block and the slide mechanism.
In one embodiment, the sliding table mechanism includes a first sliding table and a second sliding table connected to the first sliding table, the first sliding table is connected to and supports the heat insulation block and drives the heat insulation block to slide along a vertical direction, and the second sliding table is connected to and drives the first sliding table to slide along a horizontal direction.
In one embodiment, the supporting structure further includes a base, the base defines a receiving groove, two side walls of the receiving groove each define a transfer hole, the supporting structure further includes two air bearings and two transmission shafts, the two air bearings are respectively located in the two transfer holes, one end of each of the two transmission shafts is respectively connected to two ends of the molding roller, and the other end of each of the two transmission shafts is respectively rotatably connected to the two air bearings.
Another aim of this application still lies in providing a roll is to board hot stamping equipment, and it includes heating device, the week side of mould pressing roller has been offered and has been used for the impression the micro nano structure of blank.
The beneficial effect of this application lies in: carry out heat-conduction through the lower face of heat conduction structure to glass, rethread thermal radiation structure carries out the heat radiation to the last face of glass to through two kinds of collaborative heating methods of heat-conduction and heat radiation, heat glass simultaneously, be favorable to improving heating device's maximum heating temperature and rate of heating, thereby make the maximum temperature that is heated of glass be greater than the temperature of its glass transition point.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
Fig. 1 is a schematic perspective view of a heating device provided in an embodiment of the present application;
FIG. 2 is a schematic cross-sectional view of the heating apparatus of FIG. 1 taken along a direction parallel to the X-axis;
fig. 3 is a schematic cross-sectional view of the heating apparatus of fig. 1 taken along a direction perpendicular to the X-axis.
Wherein, in the figures, the respective reference numerals:
100. a heating device; 101. a blank; 10. a support structure; 11. a base; 111. a base plate; 112. supporting the side plates; 113. fixing the side plate; 12. a drive shaft; 13. an air bearing; 16. a heat insulating pad; 20. a heat conducting structure; 21. a heat conducting plate; 22. a heating rod; 23. cooling the block; 24. a heat insulation block; 211. positioning holes; 114. a containing groove; 33. a reflector; 231. a cooling channel; 31. a die pressing roller; 32. heating a tube; 232. an air inlet;
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and operate, and thus are not to be construed as limiting the present application, and the specific meanings of the above terms may be understood by those skilled in the art according to specific situations. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
Referring to fig. 1 and 3, a heating device 100 for heating a plate-shaped blank 101 is provided in an embodiment of the present application. Optionally, the blank 101 is an amorphous material, including glass, amorphous alloys, and plastics. In this embodiment, the blank 101 is glass, and the glass transition point temperature of the glass is in the range of 400-700 ℃. The heating apparatus 100 includes a heat conductive structure 20, a heat radiation structure, and a support structure 10. The heat conducting structure 20 includes a heat conducting plate 21 disposed in a flat manner and a plurality of heating rods 22 for transferring heat to the heat conducting plate 21, and the heating rods 22 are sequentially disposed at intervals and connected to the heat conducting plate 21. Alternatively, the heat conductive plate 21 is made of a metal material having a good heat conductive property, such as metallic copper. The heating rod 22 increases the temperature of the heat conductive plate 21 by converting electric energy into heat energy. The blank 101 is placed on the upward-facing surface of the heat-conducting plate 21, so that the lower surface of the glass absorbs heat from the heat-conducting plate 21. The heat radiation structure includes a heating pipe 32 and a press roll 31 disposed above the blank 101, and optionally, the heating pipe 32 is an infrared lamp tube which emits infrared rays outward in a conductive state to heat the blank 101. The molding roller 31 is made of a light-transmitting and temperature-resistant material. A heating pipe 32 is inserted into the press roll 31 and radiates heat toward the blank 101 to heat the upper face of the glass. Alternatively, the embossing roll 31 is made of fused silica, which is an amorphous form of silica, and has a good infrared transmittance. It has the characteristics of high temperature resistance and low thermal expansion coefficient, thereby reducing the blockage of infrared rays emitted by the heating pipe 32. The support structure 10 is intended to support the plate 21 and the embossing cylinder 31. The heat conducting structure 20 and the heat radiating structure can be fixed and positioned by the support structure 10, which facilitates heating and warming of the blank 101. Optionally, the power of the heating rod 22 and the heating tube 32 is selected as desired.
Carry out heat-conduction to the lower face of glass through heat conduction structure 20, rethread thermal radiation structure carries out the thermal radiation to the last face of glass to through two kinds of collaborative heating methods of heat-conduction and thermal radiation, heat glass simultaneously, be favorable to improving heating device 100's maximum heating temperature and rate of heating, thereby make the maximum temperature that is heated of glass be greater than the temperature of its glass transition point.
Alternatively, the maximum heating temperature of the heating device 100 is 700 ℃.
Referring to fig. 1 and 3, in an embodiment, the central axis of the heating pipe 32 is coincident with the central axis of the embossing roller 31, the heating pipe 32 is arranged with circumferential symmetry, and the radiant heating rate in the circumferential direction of the embossing roller 31 is relatively uniform, so that the heating pipe 32 has uniform temperature distribution and uniform heat radiation outwards, and the heating pipe 32 radiates heat outwards uniformly along the center of the embossing roller 31, which is beneficial to the homogenization of the heating of the blank 101. It can be understood that the heating pipe 32 is spaced apart from the inner wall of the embossing roll 31, thereby preventing heat conduction between the heating pipe 32 and the embossing roll 31 and reducing thermal deformation of the embossing roll 31.
In one embodiment, the heat radiation structure further includes a reflection cover 33, the reflection cover 33 is disposed at a distance from the embossing drum 31, and the reflection cover 33 partially surrounds the embossing drum 31 from above to reflect heat to the blank 101. Optionally, the reflector 33 reflects the heat radiated upward from the heating pipe 32 downward to the glass, thereby increasing the maximum heating temperature of the glass and saving energy.
Referring to fig. 1 and 3, in one embodiment, the reflective cover 33 includes a cover body and a reflective layer coated on the cover body, wherein the reflective layer is located on a surface of the cover body facing the embossing roll 31. Optionally, the reflective layer is made of gold, and has good reflective performance, thereby being beneficial to increasing the maximum heating temperature of the glass.
In one embodiment, the heat conducting plate 21 is provided with positioning holes 211, the heating rods 22 are disposed in the positioning holes 211, and the number of the positioning holes 211 is adapted to the number of the heating rods 22 and is disposed in a one-to-one correspondence manner. Optionally, the positioning holes 211 are arranged at equal intervals along the length direction of the heat conducting plate 21, so that the temperature of the heat conducting plate 21 is uniformly increased, and the heating uniformity of the glass is improved.
Referring to fig. 1 and 3, in an embodiment, the supporting structure 10 includes a sliding mechanism supporting the heat conducting structure 20, the heat conducting structure 20 further includes a cooling block 23, the cooling block 23 is located between the sliding mechanism and the heat conducting plate 21, and the cooling block 23 is used for blocking heat from being transferred to the sliding mechanism; the cooling block 23 is provided with a cooling passage 231, and a cooling medium is contained in the cooling passage 231. Alternatively, the cooling medium may be gas or liquid, and the heat conduction of the heat conductive plate 21 toward the slide table mechanism may be blocked by the cooling medium, which is advantageous for the reliability of the slide table mechanism.
Optionally, an air inlet 232 is disposed at one end of the cooling channel 231, and a cooling medium is filled into the cooling channel 231 through the air inlet 232.
Referring to fig. 1 and 3, in one embodiment, the heat conducting structure 20 further includes a heat insulation block 24, and the heat insulation block 24 is located between the cooling block 23 and the sliding table mechanism. Optionally, the heat insulation block 24 is made of aluminum silicate ceramic, and the heat insulation block 24 is placed between the cooling block 23 and the sliding table mechanism, so that heat transfer from the cooling block 23 to the sliding table mechanism is greatly reduced, and normal operation of the sliding table mechanism is guaranteed.
In one embodiment, the slide mechanism includes a first slide that is connected to and supports the heat shielding block 24 and drives the heat shielding block 24 to slide in the vertical direction, and a second slide that is connected to and drives the first slide to slide in the horizontal direction. Optionally, the first sliding table drives the heat insulation block 24 to move along the Z axis, and finally, the blank 101 slides along the Z axis; and the second sliding table drives the first sliding table to slide along the X axis, and finally the blank 101 slides along the X axis.
Referring to fig. 1 and 3, in an embodiment, the supporting structure 10 further includes a base 11, the base 11 defines an accommodating groove 114, two groove walls of the accommodating groove 114 define two transfer holes, the supporting structure 10 further includes two air bearings 13 and two transmission shafts 12, the two air bearings 13 and the two transmission shafts 12 are respectively disposed in the two transfer holes, one end of each of the two transmission shafts 12 is respectively connected to two ends of the molding roller 31, and the other end of each of the two transmission shafts 12 is respectively rotatably connected to the two air bearings 13. Alternatively, the driving shaft 12 is a driving shaft 12 made of zirconia ceramics having good heat insulating property, thereby preventing heat dissipation and transfer of the molding drum 31 and reducing thermal deformation of the molding drum 31.
Referring to fig. 1 and 3, two air bearings 13 are optionally used to support the ceramic shaft 12 in this embodiment. The air bearing 13 has the characteristics of high transmission precision, particularly high radial precision, and further meets the requirement of the die pressing roller 31 on high hot stamping precision of the plate-shaped blank 101. The air bearing 13 does not need oil lubrication and is suitable for working in a vacuum environment; and the air bearing 13 can work at high temperature, and the air flowing in the air bearing 13 plays a role of cooling to a certain extent, so that heat is not excessively transferred to a power supply wiring and a motor on the base 11, and the normal operation of the equipment is ensured.
Referring to fig. 1 and fig. 3, optionally, the base 11 includes a bottom plate 111 and two supporting side plates 112 connected to the bottom plate 111, the two supporting side plates 112 are spaced apart from each other, the two supporting side plates 112 and the bottom plate 111 together form an accommodating groove 114, and the two adapting holes are respectively opened in the two supporting side plates 112. The support structure 10 further includes a heat insulating pad 16 located at the receiving groove 114 and connected to the bottom plate 111, the heat insulating pad 16 being used for the reflection housing 33 while preventing heat thereof from being conducted to the base 11, thereby preventing thermal deformation of the base 11. Optionally, the insulation blanket 16 is made of an aluminum silicate ceramic.
Referring to fig. 1 and 3, optionally, the supporting structure 10 further includes a fixed side plate 113 connected to the bottom plate 111, the fixed side plate 113 is spaced apart from one of the supporting side plates 112, and the terminal of the heating tube 32 is connected to the fixed side plate 113.
Referring to fig. 1 and 3, the rapid heating apparatus 100 provided by the present application has the characteristics of high power, and the like, and can rapidly and uniformly heat the mold pressing roller 31 and the glass blank 101 to a temperature above 700 ℃, and a cooling system is provided to reduce the influence of heat concentration on the parts of the apparatus, so that the application of the roller-to-plate hot-stamping process is extended to the formation of glass functional micro-nano structure devices.
Referring to fig. 1 and fig. 3, the present invention further provides a roll-to-plate hot stamping apparatus, which includes a heating device 100, and the specific structure of the heating device 100 refers to the above embodiments, and since the roll-to-plate hot stamping apparatus adopts all technical solutions of all the above embodiments, the roll-to-plate hot stamping apparatus also has all beneficial effects brought by the technical solutions of the above embodiments, and no further description is provided herein.
Referring to fig. 1 and 3, in an embodiment, a micro-nano structure for imprinting the blank 101 is disposed on a peripheral side of the mold pressing roller 31, and the micro-nano structure includes a micro mechanism with a micron size and/or a nano structure with a nano size.
Optionally, the micro-nano structure is plated with a mold coating, the infrared lamp tube directly performs radiation heating on the mold coating, and the thickness of the mold coating is generally 0.05 to 2 micrometers. Thus, the thermal mass of the embossing roll 31 is very small, resulting in a high heating efficiency and cooling rate.
Referring to fig. 1 and 3, the surface temperature of the heat-conducting plate 21 is optionally monitored by 9K-type thermocouples distributed at different locations. The number, geometry, and distribution position of the heating rods 22 are optimized to maximize the uniformity of the surface temperature distribution of the heating rods 22. The heating rate and cooling rate of the heat conducting structure 20 are controlled by controlling the power of the heating rod 22 and the cooling medium speed in the channel of the cooling block 23.
The above are merely alternative embodiments of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement or the like made within the spirit and principle of the present application shall be included in the scope of the claims of the present application.
Claims (10)
1. A heating device for heating and hot-embossing a blank arranged in a plate shape, the heating device comprising:
the heat conduction structure comprises a heat conduction plate which is tiled and a plurality of heating rods which transfer heat to the heat conduction plate, the heating rods are sequentially arranged at intervals and connected with the heat conduction plate, and the blank is arranged on the upward plate surface of the heat conduction plate;
the heat radiation structure comprises a heating pipe and a die pressing roller arranged above the blank, the die pressing roller is made of a light-transmitting and temperature-resistant material, and the heating pipe is inserted into the die pressing roller and radiates heat to the blank so as to heat the blank; and
and the supporting structure is used for supporting the heat conducting plate and the die pressing roller.
2. The heating device of claim 1, wherein: the central axis of the heating pipe is coincided with the central axis of the mould pressing roller.
3. The heating device of claim 1, wherein: the heat radiation structure further comprises a reflecting cover which is arranged at intervals relative to the die pressing roller and partially surrounds the die pressing roller from top to bottom so as to reflect the heat to the blank.
4. A heating device as claimed in claim 3, wherein: the bowl cover comprises a cover body and a reflecting layer coated on the cover body, wherein the reflecting layer is positioned on the cover body and faces the surface of the die pressing roller.
5. The heating device according to any one of claims 1 to 4, wherein: the heat conducting plate is provided with positioning holes, the heating rods are arranged in the positioning holes, and the number of the positioning holes is matched with the number of the heating rods and is arranged in a one-to-one correspondence manner.
6. The heating device according to any one of claims 1 to 4, wherein: the supporting structure comprises a sliding table mechanism supporting the heat conducting structure, the heat conducting structure further comprises a cooling block, the cooling block is located between the sliding table mechanism and the heat conducting plate, and the cooling block is used for blocking the heat from being transferred to the sliding table mechanism; the cooling block is provided with a cooling channel, and a cooling medium is contained in the cooling channel.
7. The heating device of claim 6, wherein: the heat conduction structure further comprises a heat insulation block, and the heat insulation block is located between the cooling block and the sliding table mechanism.
8. The heating device of claim 7, wherein: the sliding table mechanism comprises a first sliding table and a second sliding table connected with the first sliding table, the first sliding table is connected with and supports the heat insulation block and drives the heat insulation block to slide along the vertical direction, and the second sliding table is connected with and drives the first sliding table to slide along the horizontal direction.
9. The heating device according to any one of claims 1 to 4, wherein: the supporting structure further comprises a base, the base is provided with a containing groove, the groove walls on the two sides of the containing groove are provided with two transfer holes, the supporting structure further comprises air bearings and transmission shafts, the air bearings and the transmission shafts are provided with two air bearings which are located in the two transfer holes respectively, one ends of the transmission shafts are connected with the two ends of the die pressing roller respectively, and the other ends of the transmission shafts are connected with the two air bearings respectively in a rotating mode.
10. The roll-to-plate hot stamping equipment is characterized by comprising the heating device according to any one of claims 1 to 9, wherein a micro-nano structure for stamping the blank is arranged on the peripheral side surface of the stamping roller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110745165.1A CN113387551A (en) | 2021-06-30 | 2021-06-30 | Heating device and roller-to-plate hot-stamping equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110745165.1A CN113387551A (en) | 2021-06-30 | 2021-06-30 | Heating device and roller-to-plate hot-stamping equipment |
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| CN113387551A true CN113387551A (en) | 2021-09-14 |
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| CN202110745165.1A Pending CN113387551A (en) | 2021-06-30 | 2021-06-30 | Heating device and roller-to-plate hot-stamping equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114690815A (en) * | 2022-03-08 | 2022-07-01 | 深圳大学 | High-temperature constant-temperature heating device |
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| CN103974915A (en) * | 2012-01-05 | 2014-08-06 | 旭硝子株式会社 | Apparatus for moulding glass case and method for moulding same |
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