CN114690342A - Surface parallelism adjusting system for coupling optical fiber array and silicon optical chip end face - Google Patents
Surface parallelism adjusting system for coupling optical fiber array and silicon optical chip end face Download PDFInfo
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- CN114690342A CN114690342A CN202210326285.2A CN202210326285A CN114690342A CN 114690342 A CN114690342 A CN 114690342A CN 202210326285 A CN202210326285 A CN 202210326285A CN 114690342 A CN114690342 A CN 114690342A
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- fiber array
- optical fiber
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- laser emitter
- silicon optical
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- 230000003287 optical effect Effects 0.000 title claims abstract description 68
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 65
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 65
- 239000010703 silicon Substances 0.000 title claims abstract description 65
- 239000013307 optical fiber Substances 0.000 title claims abstract description 55
- 230000008878 coupling Effects 0.000 title claims abstract description 9
- 238000010168 coupling process Methods 0.000 title claims abstract description 9
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 9
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 description 12
- 230000007246 mechanism Effects 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 2
- 230000001808 coupling effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
- G02B6/4222—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera by observing back-reflected light
Abstract
The invention provides a surface parallelism adjusting system when an optical fiber array is coupled with the end face of a silicon optical chip, which comprises: the device comprises a laser emitter, a laser emitter adjusting device, a curtain plate adjusting device, a chip bearing table and an optical fiber array adjusting device. The parallelism adjusting system provided by the invention is used by matching the laser emitter with the curtain plate, and utilizes the reflection pattern to carry out auxiliary comparison adjustment, so that the silicon optical chip and the end face of the optical fiber array are quickly coupled, and the parallelism adjusting system has the advantages of high coupling efficiency, simple adjusting steps, low adjusting workload and the like.
Description
Technical Field
The invention belongs to the technical field of photoelectronic chip packaging test, and particularly relates to a surface parallelism adjusting system for coupling an optical fiber array and a silicon optical chip end face.
Background
The silicon optical chip is an independent chip formed by monolithically integrating optical elements such as an optical modulator, an optical detector, an optical waveguide and the like by utilizing the conventional CMOS (complementary metal oxide semiconductor) process based on silicon-based substrate materials such as silicon, SOI (silicon on insulator) and the like, has the advantages of high speed, low power consumption and low cost, and is widely applied to the field of optical fiber communication. When the silicon optical chip is tested or packaged, the relative position of the optical fiber array and the silicon optical chip needs to be accurately controlled by using the six-axis displacement platform, so that the optical fiber channel and the waveguide access port on the end face of the chip are accurately aligned, the aim of optical path coupling is fulfilled, and the silicon optical chip works normally.
In the end-face coupling of a general silicon optical chip, an optical circuit is usually designed on the silicon optical chip, and the coupling effect is determined by the overall loss of the optical circuit. In addition, a photoelectric conversion element is designed on part of the silicon optical chip to convert the input optical signal into an electrical signal for output, and the coupling effect is judged according to the magnitude of the electrical output. The common point of the two modes is that six adjusting shafts, particularly three angle shafts, must be accurately adjusted, three displacement shafts need to be compensated every time the adjusting shafts are adjusted, the three angle shafts are gradually adjusted to the optimal angle, the workload and the repeatability are great, and the efficiency is low.
Disclosure of Invention
In order to overcome the technical problem of low efficiency when the silicon optical chip is coupled with the end face of the optical fiber array, the invention provides a surface parallelism adjusting system when the optical fiber array is coupled with the end face of the silicon optical chip. The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview and is intended to neither identify key/critical elements nor delineate the scope of such embodiments. Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is presented later.
The invention adopts the following technical scheme:
in some alternative embodiments, the present invention provides a system for adjusting surface parallelism when an optical fiber array is coupled to an end face of a silicon optical chip, comprising: the laser emitter is used for emitting parallel beams irradiating the optical fiber array and the silicon optical chip; and the curtain plate is used for receiving the parallel light beams reflected by the optical fiber array and the silicon optical chip and displaying the reflection pattern.
Further, the surface parallelism adjusting system when the optical fiber array is coupled with the end face of the silicon optical chip further comprises: and the optical fiber array adjusting device is used for clamping the optical fiber array and carrying out six-axis adjustment.
Further, the surface parallelism adjusting system when the optical fiber array is coupled with the end face of the silicon optical chip further comprises: and the chip bearing table is used for bearing the silicon optical chip and carrying out XYZ three-axis adjustment and XOY plane rotation angle adjustment.
Furthermore, the curtain plate is provided with a through hole.
Further, the surface parallelism adjusting system when the optical fiber array is coupled with the end face of the silicon optical chip further comprises: and the curtain plate adjusting device is used for clamping the curtain plate and performing XYZ three-axis adjustment and XOY plane rotation angle adjustment.
Further, the surface parallelism adjusting system when the optical fiber array is coupled with the end face of the silicon optical chip further comprises: and the laser emitter adjusting device is used for clamping the laser emitter and carrying out six-axis adjustment.
Furthermore, the laser emitter is a red laser pen with adjustable focal length.
Further, the diameter of the through hole is larger than the cross-sectional diameter of the parallel light beam emitted by the laser emitter.
The invention has the following beneficial effects: the parallelism adjusting system provided by the invention is used by matching the laser emitter with the curtain plate, and utilizes the reflection pattern to carry out auxiliary comparison adjustment, so that the silicon optical chip and the end face of the optical fiber array are quickly coupled, and the parallelism adjusting system has the advantages of high coupling efficiency, simple adjusting steps, low adjusting workload and the like.
Drawings
FIG. 1 is a schematic view of the construction of the surface parallelism adjusting system of the present invention;
FIG. 2 is an enlarged view of the actual position relationship between the silicon optical chip and the optical fiber array according to the present invention;
FIG. 3 is a side view of the present invention adjusting the angle at which red light perpendicularly illuminates a silicon photochip;
FIG. 4 is a side view of the silicon photonic chip of the present invention in alignment with an optical fiber array;
FIG. 5 is a diagram of the pattern reflected by the fiber array when illuminated by a red laser pointer;
FIG. 6 shows the pattern reflected by the silicon photo chip when illuminated by a red laser pointer.
Detailed Description
The following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others.
As shown in fig. 1 to 4, in some illustrative embodiments, the present invention provides a surface parallelism adjusting system when an optical fiber array is coupled to an end face of a silicon optical chip, which realizes rapid adjustment of surface parallelism of the optical fiber array and the silicon optical chip to a parallel state, and specifically includes: the device comprises a laser emitter 1, a laser emitter adjusting device 2, a curtain plate 3, a curtain plate adjusting device 4, a chip bearing table 6 and an optical fiber array adjusting device 8.
The laser emitter 1 is used for emitting parallel beams irradiated on the optical fiber array 7 and the silicon optical chip 5, wherein the size of a light spot when the parallel beams are emitted needs to meet the requirement that the parallel beams can be irradiated on the silicon optical chip 5 and the optical fiber array 7 simultaneously. Specifically, the laser emitter 1 is a red laser pen with an adjustable focal length, which is convenient for adjusting the emitted light beam and displaying the light beam on a corresponding device clearly.
And the laser emitter adjusting device 2 is used for clamping the laser emitter 1 and carrying out six-axis adjustment so as to ensure that the laser emitter 1 can be adjusted to a required position and angle. Wherein, the laser emitter adjusting device 2 selects a six-axis displacement platform and a clamp assembled on the six-axis displacement platform. The six-axis displacement platform mainly completes the adjustment of the position and the angle of the laser emitter 1, and the specific structure thereof is the prior art and is not described herein again. The clamp used by the laser emitter adjusting device 2 is used for fixing the laser emitter 1 on the six-axis displacement platform, the connection mode of the clamp and the six-axis displacement platform can be bolt connection, and the specific structure of the clamp can be any mechanical structure capable of fixing the red light laser pen, for example, the clamp is connected through bolts and the like.
And the curtain plate 3 is used for receiving the parallel light beams reflected by the optical fiber array 7 and the silicon optical chip 5 and displaying a reflection pattern. The curtain plate 3 is specifically an acrylic plate, when the light beam emitted by the red laser pen irradiates on the optical fiber array 7 and the silicon optical chip 5, a part of the light beam is reflected, and the part of the reflected light beam irradiates on the curtain plate 3 to form a reflection pattern, namely, the curtain plate 3 receives the light beam means that the reflected light beam is blocked, so that the reflected light beam forms the reflection pattern, namely, the reflection pattern irradiating on the curtain plate 3 is displayed.
The reflection pattern formed by the parallel light beams reflected by the silicon optical chip 5 is shown in fig. 6, and the reflection pattern of the silicon optical chip is influenced by the structure of the silicon optical chip material, and after diffraction and interference superposition, the pattern of the dot matrix light spot is finally generated. The reflection pattern formed by the parallel light beams reflected by the optical fiber array 7 is shown in fig. 5, and is specifically a point-shaped light spot.
The curtain plate 3 is provided with a through hole 301, so that the parallel light beams reflected by the silicon optical chip 5 can pass through the through hole 301, and comparison and adjustment are facilitated, and the emergent angle of the red light is perpendicular to the surface of the silicon optical chip 5. Further, the diameter of the through hole 301 is larger than the cross-sectional diameter of the parallel light beam emitted by the laser emitter 1, so as to avoid blocking the light beam and ensure accurate adjustment, wherein the cross section of the parallel light beam emitted by the laser emitter 1 is circular.
And a curtain plate adjusting device 4 for clamping the curtain plate 3 and performing XYZ three-axis adjustment and XOY plane rotation angle adjustment to ensure that the curtain plate 3 can be adjusted to a desired position. Wherein, the curtain plate adjusting device 4 selects a three-axis adjusting frame, a plane angle rotating table and a clamp assembled on the three-axis adjusting frame. The plane angle rotating platform is used for adjusting an rotation angle of an XOY plane, and can be specifically realized by using a rotating platform structure driven by a motor, for example, a driving shaft of the motor is connected with a disc with a flat surface through a gear transmission mechanism. The three-axis adjusting frame is arranged on the plane angle rotating table and used for completing XYZ three-axis adjustment, the existing three-axis adjusting mechanism applied to the optical field can be selected, and the specific structure is not repeated herein. The anchor clamps that curtain board adjusting device 4 used are used for fixing curtain board 3 on the triaxial alignment jig, and the connected mode of anchor clamps and triaxial alignment jig can be bolted connection, and the concrete structure of anchor clamps be arbitrary can fix the mechanical structure of curtain board 3 can, for example through set up splint and carry out fixed connection through the bolt with two splint in curtain board 3 both sides to with the 3 centre gripping of curtain board between splint.
The silicon optical chip 5 is a chip which needs to be coupled and aligned with the optical fiber array 7 and is manufactured by a micro-nano processing technology on the basis of an SOI chip.
And the chip bearing table 6 is used for bearing the silicon optical chip 5 and carrying out XYZ three-axis adjustment and XOY plane rotation angle adjustment so as to ensure that the silicon optical chip 5 can be adjusted to a required position. Wherein, the chip bearing table 6 adopts a three-axis adjusting frame, a plane angle rotating table and a fixing mechanism assembled on the plane angle rotating table. The plane angle rotating platform is used for completing the adjustment of an XOY plane rotation angle, and can be specifically realized by a rotating platform structure driven by a motor, for example, a driving shaft of the motor is meshed with a disk with a threaded hole on the surface through a gear transmission mechanism, and the threaded hole formed in the disk is used for being connected with a fixing mechanism above the threaded hole. The plane angle revolving stage sets up on the triaxial alignment jig for accomplish XYZ triaxial and adjust, specifically can select to use current triaxial guiding mechanism who uses in the optics field, and concrete structure this paper is no longer repeated. The fixing mechanism used by the chip bearing table 6 is used for fixing the silicon optical chip 5 on the plane angle rotating table, specifically, the fixing mechanism can be an air pump and a part structure containing an air vent, and the silicon optical chip 5 is fixed through air pressure adsorption.
The optical fiber array 7 is the optical fiber array which needs to be coupled and aligned with the silicon optical chip 5.
And the optical fiber array adjusting device 8 is used for clamping the optical fiber array 7 and performing six-axis adjustment. Wherein, the optical fiber array adjusting device 8 selects a six-axis displacement platform and a clamp assembled on the six-axis displacement platform. The six-axis displacement platform mainly completes the adjustment of the position and the angle of the optical fiber array 7, and the specific structure thereof is the prior art and is not described herein again. The fixture used by the optical fiber array adjusting device 8 is used for fixing the optical fiber array 7 on the six-axis displacement platform, the connection mode of the fixture and the six-axis displacement platform can be bolt connection, the specific structure of the fixture can be any mechanical structure capable of fixing the optical fiber array, for example, two clamping plates are connected through bolts, and grooves matched with the optical fiber array are formed in the clamping plates.
The testing steps of the surface parallelism adjusting system of the invention are as follows:
firstly, adjusting a laser emitter adjusting device 2 to enable parallel light beams emitted by a laser emitter 1 to pass through a through hole 301 formed in a curtain plate 3 and then irradiate the through hole onto a silicon optical chip 5, when the laser emitter 1 is not perpendicular to the silicon optical chip 5, dot matrix light spots reflected by the silicon optical chip 5 can irradiate the curtain plate 3, the focal length of a red light laser pen is adjusted at the moment to enable a reflection pattern to be clear, then, angles and positions of the laser emitter 1 and the curtain plate 3 are continuously adjusted until the brightest point in the center of the dot matrix light spots is overlapped with the through hole 301, and the red light emitting angle is perpendicular to the surface of the silicon optical chip 5 at the moment, as shown in fig. 3;
then, as shown in fig. 4, adjusting the vertical angle rotation angle of the laser emitter adjusting device 2, quantifying the rotation angle of 45 °, making the red light exit angle form an included angle of 45 ° with the surface of the silicon optical chip 5, then translating the positions of the laser emitter 1 and the curtain plate 3, making the red light irradiate on the silicon optical chip 5 and the optical fiber array 7 simultaneously, and making the reflected light irradiate on the curtain plate, wherein when the plane angles are aligned, the irradiation angle of the laser emitter 1 includes but is not limited to 45 °, and according to the actual situation, other feasible angles within 0 ° to 90 ° can be selected;
finally, when the red light is simultaneously irradiated on the silicon optical chip 5 and the optical fiber array 7, two reflection patterns can simultaneously appear on the screen plate 3, as shown in fig. 5 and 6, wherein a single red small circle point corresponds to the plane parallelism state of the surface of the optical fiber array, a red dot matrix light spot corresponds to the plane parallelism state of the surface of the silicon optical chip, the XOZ and YOZ angles of the optical fiber array 7 are finely adjusted, so that the red small circle point coincides with the central brightest point of the red dot matrix light spot, and at this time, the surface of the optical fiber array 7 is parallel to the surface of the silicon optical chip 5.
The precision of the invention depends on the ratio of the horizontal distance value between the optical fiber array 7 and the silicon optical chip 5 and the vertical distance value between the silicon optical chip 5 and the curtain plate 3, the irradiation angle is 45 degrees, when the ratio is less than 1/200, the plane angle deviation of the optical fiber array 7 and the silicon optical chip 5 when aligned is less than 0.2 degrees, and the surface parallelism leveling of the silicon optical chip 5 and the optical fiber array 7 can be determined.
The invention uses the laser emitter 1 to irradiate the optical fiber array 7 and the silicon optical chip 5 simultaneously, adjusts the parallelism through the alignment of the reflection patterns, uses the multi-axis adjustable structure of the laser emitter adjusting device 2 and the curtain plate adjusting device 4 and the through hole at the center of the curtain plate 3 to realize the alignment of the irradiation of the red light laser pen vertical chip, greatly reduces the adjusting difficulty and can simultaneously ensure the coupling precision.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.
Claims (8)
1. Surface parallelism governing system when fiber array and silicon optical chip terminal surface coupling, its characterized in that includes:
the laser emitter is used for emitting parallel beams irradiating the optical fiber array and the silicon optical chip;
and the curtain plate is used for receiving the parallel light beams reflected by the optical fiber array and the silicon optical chip and displaying the reflection patterns.
2. The system of claim 1, further comprising: and the optical fiber array adjusting device is used for clamping the optical fiber array and carrying out six-axis adjustment.
3. The system of claim 2, further comprising: and the chip bearing table is used for bearing the silicon optical chip and carrying out XYZ three-axis adjustment and XOY plane rotation angle adjustment.
4. The system of claim 3, wherein the curtain plate is perforated with through holes.
5. The system of claim 4, further comprising: and the curtain plate adjusting device is used for clamping the curtain plate and performing XYZ three-axis adjustment and XOY plane rotation angle adjustment.
6. The system of claim 5, further comprising: and the laser emitter adjusting device is used for clamping the laser emitter and carrying out six-axis adjustment.
7. The system of claim 6, wherein the laser transmitter is a red laser pointer with adjustable focal length.
8. The system of claim 7, wherein the diameter of the through hole is larger than a cross-sectional diameter of the parallel beam emitted from the laser emitter.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210326285.2A CN114690342A (en) | 2022-03-30 | 2022-03-30 | Surface parallelism adjusting system for coupling optical fiber array and silicon optical chip end face |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210326285.2A CN114690342A (en) | 2022-03-30 | 2022-03-30 | Surface parallelism adjusting system for coupling optical fiber array and silicon optical chip end face |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115542479A (en) * | 2022-11-28 | 2022-12-30 | 武汉驿路通科技股份有限公司 | Adjusting device for coupling optical fiber and chip, coupling device and coupling method |
| CN115657228A (en) * | 2022-12-29 | 2023-01-31 | 武汉锐科光纤激光技术股份有限公司 | Optical fiber coupling method, device, equipment and storage medium |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0657037A1 (en) * | 1985-12-24 | 1995-06-14 | Astarte Fiber Networks, Inc. | Improved apparatus and method for aligning optical fibers |
| CN102866471A (en) * | 2012-09-29 | 2013-01-09 | 武汉光迅科技股份有限公司 | Coupling aligning device for waveguide chip and photo-diode (PD) array and aligning method applying coupling aligning device |
| US20130236143A1 (en) * | 2012-03-09 | 2013-09-12 | Fujitsu Limited | Optical coupling structure and array optical amplification module |
| CN204269869U (en) * | 2014-09-12 | 2015-04-15 | 江苏亨通光网科技有限公司 | A kind of laser instrument that utilizes is to the regulating device of PLC to photo-equilibrium axle |
| CN106019496A (en) * | 2016-05-31 | 2016-10-12 | 武汉光迅科技股份有限公司 | Light source packaging structure, and positioning and coupling method thereof |
| CN109458957A (en) * | 2018-12-27 | 2019-03-12 | 中国电子科技集团公司第三十四研究所 | Depth of parallelism test method between a kind of array fibre optical tweezer fiber cores |
| DE102018201688A1 (en) * | 2018-02-05 | 2019-08-08 | Robert Bosch Gmbh | calibration device |
| CN110554513A (en) * | 2019-08-30 | 2019-12-10 | 中国科学院上海光学精密机械研究所 | optical fiber array device for debugging grating compressor and debugging method thereof |
| CN110632713A (en) * | 2019-08-30 | 2019-12-31 | 珠海达明科技有限公司 | Device and method for rapidly coupling large-divergence-angle laser to single-mode fiber |
| CN112558244A (en) * | 2020-12-28 | 2021-03-26 | 武汉光迅科技股份有限公司 | Method and device for flip coupling of optical chip |
| WO2021185128A1 (en) * | 2020-03-18 | 2021-09-23 | 阿里巴巴集团控股有限公司 | Laser module, silicon optical module, and optical transmission device |
| CN115857187A (en) * | 2022-12-01 | 2023-03-28 | 之江实验室 | Silicon-based chip packaging method and device, storage medium and electronic equipment |
-
2022
- 2022-03-30 CN CN202210326285.2A patent/CN114690342A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0657037A1 (en) * | 1985-12-24 | 1995-06-14 | Astarte Fiber Networks, Inc. | Improved apparatus and method for aligning optical fibers |
| US20130236143A1 (en) * | 2012-03-09 | 2013-09-12 | Fujitsu Limited | Optical coupling structure and array optical amplification module |
| CN102866471A (en) * | 2012-09-29 | 2013-01-09 | 武汉光迅科技股份有限公司 | Coupling aligning device for waveguide chip and photo-diode (PD) array and aligning method applying coupling aligning device |
| CN204269869U (en) * | 2014-09-12 | 2015-04-15 | 江苏亨通光网科技有限公司 | A kind of laser instrument that utilizes is to the regulating device of PLC to photo-equilibrium axle |
| CN106019496A (en) * | 2016-05-31 | 2016-10-12 | 武汉光迅科技股份有限公司 | Light source packaging structure, and positioning and coupling method thereof |
| DE102018201688A1 (en) * | 2018-02-05 | 2019-08-08 | Robert Bosch Gmbh | calibration device |
| CN109458957A (en) * | 2018-12-27 | 2019-03-12 | 中国电子科技集团公司第三十四研究所 | Depth of parallelism test method between a kind of array fibre optical tweezer fiber cores |
| CN110554513A (en) * | 2019-08-30 | 2019-12-10 | 中国科学院上海光学精密机械研究所 | optical fiber array device for debugging grating compressor and debugging method thereof |
| CN110632713A (en) * | 2019-08-30 | 2019-12-31 | 珠海达明科技有限公司 | Device and method for rapidly coupling large-divergence-angle laser to single-mode fiber |
| WO2021185128A1 (en) * | 2020-03-18 | 2021-09-23 | 阿里巴巴集团控股有限公司 | Laser module, silicon optical module, and optical transmission device |
| CN112558244A (en) * | 2020-12-28 | 2021-03-26 | 武汉光迅科技股份有限公司 | Method and device for flip coupling of optical chip |
| CN115857187A (en) * | 2022-12-01 | 2023-03-28 | 之江实验室 | Silicon-based chip packaging method and device, storage medium and electronic equipment |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115542479A (en) * | 2022-11-28 | 2022-12-30 | 武汉驿路通科技股份有限公司 | Adjusting device for coupling optical fiber and chip, coupling device and coupling method |
| CN115542479B (en) * | 2022-11-28 | 2023-03-14 | 武汉驿路通科技股份有限公司 | Adjusting device for coupling optical fiber and chip, coupling device and coupling method |
| CN115657228A (en) * | 2022-12-29 | 2023-01-31 | 武汉锐科光纤激光技术股份有限公司 | Optical fiber coupling method, device, equipment and storage medium |
| CN115657228B (en) * | 2022-12-29 | 2023-04-14 | 武汉锐科光纤激光技术股份有限公司 | Optical fiber coupling method, device, equipment and storage medium |
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