CN114685989A - Resin composition and adhesive film and covering film containing same - Google Patents

Resin composition and adhesive film and covering film containing same Download PDF

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Publication number
CN114685989A
CN114685989A CN202011608454.9A CN202011608454A CN114685989A CN 114685989 A CN114685989 A CN 114685989A CN 202011608454 A CN202011608454 A CN 202011608454A CN 114685989 A CN114685989 A CN 114685989A
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parts
resin
resin composition
film
adhesive layer
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Inventor
汪青
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Shengyi Technology Co Ltd
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Shengyi Technology Co Ltd
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Priority to CN202011608454.9A priority Critical patent/CN114685989A/en
Priority to PCT/CN2021/081802 priority patent/WO2022141817A1/en
Publication of CN114685989A publication Critical patent/CN114685989A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C08K2003/321—Phosphates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate

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  • Chemical & Material Sciences (AREA)
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  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)

Abstract

The invention provides a resin composition, and an adhesive film and a covering film containing the same, wherein the resin composition comprises the following components in parts by weight: 40-80 parts of polyamide-imide resin, 10-40 parts of epoxy resin, 5-30 parts of phenoxy resin and 5-20 parts of phosphorus-containing flame retardant; through screening and synergistic compounding of the components, the glass transition temperature and the heat resistance of the resin composition are obviously improved, and the resin composition has excellent adhesive property and flame retardance. The adhesive film and the covering film containing the resin composition have the glass transition temperature of over 160 ℃, have outstanding heat resistance, stability and reliability, high peel strength and good adhesive property and flame retardance, can fully meet the processing and application requirements of flexible circuit substrates, and are particularly suitable for preparing flexible copper clad laminates and flexible printed circuit boards with high temperature resistance and high reliability.

Description

Resin composition and adhesive film and covering film containing same
Technical Field
The invention belongs to the technical field of printed circuit boards, and particularly relates to a resin composition, and an adhesive film and a covering film containing the resin composition.
Background
A Flexible Printed Circuit Board (FPCB) is a Printed Circuit Board having a pattern formed by using a Flexible substrate (FCCL). The FPCB has many advantages that the rigid printed circuit board does not have, for example, it can be freely bent, rolled and folded, can be arbitrarily arranged according to the space layout requirement, and can be arbitrarily moved and extended in a three-dimensional space, thereby achieving integration of component assembly and wire connection. The FPCB can be used for greatly reducing the volume of the electronic product, and can meet the requirements of the electronic product on development towards high density, miniaturization, high reliability and high performance.
In the manufacturing process of the multi-layer FPCB, it is generally required to use an adhesive film as an adhesive layer to achieve the connection of the multi-layer structure. The adhesive film is usually formed by using a release film or release paper as a carrier and coating a layer of adhesive on the carrier. The cover film is an important flexible circuit substrate, is used for covering the outer surface of the flexible printed circuit board, plays a role in resisting soldering, prevents the circuit from being polluted by dust, moisture and chemicals and other forms of damage, has certain flexibility and strengthening function, can reduce the influence of stress of a conductor in the bending process, and improves the flexibility resistance of the flexible printed circuit board. The coverlay film is generally formed by coating a polyimide film as a substrate and a layer of adhesive on the polyimide film. In the multi-layer FPCB, the material of the bonding layer can directly influence the processability, heat resistance and reliability of the plate, so that the selection of the adhesive suitable for the FPCB has important significance for improving the performance of the printed circuit board.
The adhesives used in the market at present mainly comprise acrylate adhesives and epoxy resin adhesives, wherein the glass transition temperature of the acrylate is generally low, the heat resistance is poor, and the processing conditions and application requirements of FPCB (flexible printed circuit board) are difficult to meet, so that most of the covering films or adhesive films adopt the epoxy resin adhesives. However, a cured product of an epoxy resin is relatively hard and brittle and has poor workability, and in order to improve flexibility, it is usually necessary to blend and modify the epoxy resin.
CN102702989A discloses a covering film for a flexible copper-clad plate and a manufacturing method thereof, the covering film for the flexible copper-clad plate is formed by compounding an adhesive and release paper, and the adhesive consists of the following components: 30-40 parts of epoxy resin, 10-20 parts of epoxy toughening agent, 6-25 parts of halogen-free flame retardant, 1-3 parts of radiation-proof agent, 1-3 parts of additive and 20-40 parts of solvent; wherein the epoxy flexibilizer is carboxyl nitrile rubber, carboxyl-terminated nitrile rubber, cardanol, polypropylene glycol diglycidyl ether or linoleic acid dimer diglycidyl ether. The covering film for the flexible copper-clad plate has good flame retardancy and electrical appliance insulation performance, and has excellent appearance, but the glass transition temperature is low, the heat resistance is poor, and the product requirement of higher performance cannot be met.
CN103694631A discloses a halogen-free flame retardant epoxy resin composition and a cover film prepared by using the same, the halogen-free flame retardant epoxy resin composition comprises: halogen-free epoxy resin, nitrile rubber, aromatic amine curing agent, imidazole curing accelerator, aromatic amine antioxidant, nitrogen-containing flame retardant, phosphorus-containing flame retardant, filler and organic solvent. The halogen-free flame-retardant epoxy resin composition has good mechanical property and flame retardance, and a covering film containing the halogen-free flame-retardant epoxy resin composition has high peel strength, insulativity and processability, but the rubber-containing composition represented by the materials has generally low glass transition temperature which is usually not more than 80 ℃, and low thermal decomposition temperature, and is difficult to be applied to flexible printed circuit boards with high requirements on heat resistance.
Therefore, it is a research focus in the field to develop an adhesive layer resin material with high glass transition temperature and high heat resistance to meet the application requirements of high-performance flexible printed circuit boards.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a resin composition and an adhesive film and a covering film containing the same, wherein the resin composition has high glass transition temperature, excellent heat resistance, high bonding strength and good flame retardance through screening and compounding of components, and can fully meet the processing and application requirements of a high-performance flexible printed circuit board.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides a resin composition, comprising the following components in parts by weight:
Figure BDA0002874090440000031
the resin composition provided by the invention takes polyamide-imide resin (PAI) as a main resin, and has high glass transition temperature and heat resistance; the epoxy resin, the phenoxy resin and the phosphorus-containing flame retardant are matched to form a compact and stable chemical crosslinking structure in a resin system, so that the glass transition temperature, the heat resistance and the bonding property are further improved; meanwhile, the phenolic oxygen resin is cooperated with other components, so that the film forming property and the flexibility of the resin composition are effectively improved, and the application requirement of the flexible printed circuit board is fully met. The resin composition remarkably improves the glass transition temperature and the heat resistance of a resin condensate by compounding the three polymers and the phosphorus-containing flame retardant, has excellent flame retardance and adhesive property, high thermal decomposition temperature, good stability and high flexibility and peel strength, and fully meets the performance requirements of a high-performance flexible printed circuit board on a circuit substrate.
The resin composition may include 40 to 80 parts of the polyamideimide resin, for example, 42 parts, 45 parts, 48 parts, 50 parts, 52 parts, 55 parts, 58 parts, 60 parts, 62 parts, 65 parts, 68 parts, 70 parts, 72 parts, 75 parts or 78 parts, and specific points therebetween, and the invention is not intended to be limited by space and for the sake of brevity, and is not intended to be exhaustive of the specific points included in the range.
The epoxy resin is 10-40 parts, for example, 11 parts, 13 parts, 15 parts, 17 parts, 19 parts, 20 parts, 21 parts, 23 parts, 25 parts, 27 parts, 29 parts, 30 parts, 31 parts, 33 parts, 35 parts, 37 parts or 39 parts, and specific values therebetween are not exhaustive, and for brevity, the invention is not intended to be limited to the specific values included in the range.
The phenoxy resin is 5-30 parts, for example, 6 parts, 8 parts, 10 parts, 11 parts, 13 parts, 15 parts, 17 parts, 19 parts, 20 parts, 21 parts, 23 parts, 25 parts, 27 parts or 29 parts, and specific values therebetween are not limited by space and for the sake of brevity, and the invention is not intended to be exhaustive of the specific values included in the range.
The phosphorus-containing flame retardant is 5-20 parts, for example, 6 parts, 8 parts, 10 parts, 11 parts, 13 parts, 15 parts, 17 parts or 19 parts, and specific values therebetween are limited by space and for the sake of brevity, and the invention is not intended to be exhaustive of the specific values included in the ranges.
According to the preferable technical scheme, based on 100 parts of the total mass of the resin composition, 40-80 parts of polyamide imide resin, 10-40 parts of epoxy resin, 5-30 parts of phenoxy resin and 5-20 parts of phosphorus-containing flame retardant are used; the four components are cooperated according to a specific ratio, so that the resin composition is endowed with excellent heat resistance, adhesive property, flexibility and flame retardance. If the amount of the polyamideimide resin is too small, the glass transition temperature of the whole resin system is lowered, the heat resistance is lowered, and the film-forming property is poor. If the amount of the polyamide-imide resin is too large, the degree of crosslinking of the system is reduced, the adhesion and heat resistance are affected, and the flowing glue is too large, so that the thermal stability and reliability of a flexible copper clad laminate and a flexible printed circuit board comprising the polyamide-imide resin are reduced.
Preferably, the epoxy resin includes any one of a bisphenol a type epoxy resin, a phosphorus-containing epoxy resin, an isocyanate-modified epoxy resin, a novolac epoxy resin, a biphenyl type epoxy resin, a dicyclopentadiene type epoxy resin, or a cycloaliphatic epoxy resin, or a combination of at least two thereof.
Preferably, the isocyanate modified epoxy resin is an MDI modified epoxy resin.
Preferably, the epoxy equivalent of the epoxy resin is 100-500 g/eq, for example, 110g/eq, 130g/eq, 150g/eq, 170g/eq, 190g/eq, 200g/eq, 220g/eq, 250g/eq, 280g/eq, 300g/eq, 320g/eq, 350g/eq, 380g/eq, 400g/eq, 420g/eq, 450g/eq, 470g/eq, or 490g/eq, and the specific point values between the above point values are limited in space and for the sake of brevity, the present invention does not list the specific point values included in the range exhaustively.
Preferably, the weight average molecular weight of the phenoxy resin is 10000 to 100000, and may be, for example, 15000, 20000, 25000, 30000, 35000, 40000, 45000, 50000, 55000, 60000, 65000, 70000, 75000, 80000, 85000, 90000 or 95000, and specific values therebetween, which are limited in space and for the sake of brevity, the present invention is not exhaustive enumeration of specific values included in the range.
Preferably, the phenoxy resin comprises an unmodified phenoxy resin and/or a phosphorus-containing phenoxy resin.
Preferably, the phosphorus-containing flame retardant comprises an additive-type phosphorus-containing flame retardant.
Preferably, the phosphorus-containing flame retardant comprises any one of or a combination of at least two of phosphate, phosphate ester, polyphosphate ester, phosphazene compound, tris (2, 6-dimethylphenyl) phosphine, or 10- (2, 5-dihydroxyphenyl) -10H-9-oxa-10-phosphaphenanthrene-10-oxide.
Preferably, any one or a combination of at least two of a curing accelerator, a filler or a silane coupling agent may also be included in the resin composition.
Preferably, the curing accelerator includes any one or a combination of at least two of imidazole curing accelerators, organophosphine curing accelerators, organoamine curing accelerators, quaternary ammonium salts, peroxides or organic metal salts.
Preferably, the filler comprises an inorganic filler and/or an organic filler.
In a second aspect, the present invention provides a resin glue solution, which comprises a solvent and the resin composition according to the first aspect dissolved or dispersed in the solvent.
Preferably, the solid content of the resin cement is 20-60%, for example, 22%, 25%, 28%, 30%, 32%, 35%, 37%, 40%, 42%, 45%, 48%, 50%, 52%, 55% or 58%, and the specific values therebetween are limited by space and for brevity, the invention is not exhaustive of the specific values included in the range.
The type of the solvent is not particularly limited, and any solvent that can satisfy the dissolution or dispersion requirements is suitable for the resin dope solution.
Preferably, the solvent is selected from one or a combination of at least two of dimethylacetamide, dimethylformamide, propylene glycol methyl ether, ethylene glycol methyl ether, acetone, butanone, toluene, ethanol, isopropanol, cyclohexanone, propylene glycol methyl ether acetate or ethyl acetate.
In a third aspect, the present invention provides an adhesive film, including a release material, and an adhesive layer disposed on the release material; the material of the adhesive layer includes the resin composition according to the first aspect.
Preferably, the adhesive layer is obtained by coating a resin glue solution of the resin composition on a release material and drying.
Preferably, still be provided with another release material on the adhesive layer of glued membrane, promptly the glued membrane is including the first material layer of leaving type, adhesive layer and the second material layer of leaving type that sets gradually.
Preferably, the release material comprises a release film or a release paper.
The release material in the adhesive film is not particularly selected, and may be, for example, a plastic film such as polyethylene, polyester, polypropylene, polymethylpentene, polyvinyl chloride, polyvinylidene fluoride, polytetrafluoroethylene, polyphenylene sulfide, or the like, a film obtained by subjecting the above film to surface coating treatment such as silicone or a fluorine compound, paper obtained by laminating the above materials, paper impregnated with or surface-coated with a release polymer, or the like.
Illustratively, the preparation method of the adhesive film comprises the following steps: and coating the resin glue solution of the resin composition on a release material, and drying to remove the solvent to obtain the glue film.
Preferably, the drying temperature is 100-180 ℃, for example, 105 ℃, 110 ℃, 115 ℃, 120 ℃, 125 ℃, 130 ℃, 135 ℃, 140 ℃, 145 ℃, 150 ℃, 155 ℃, 160 ℃, 165 ℃, 170 ℃ or 175 ℃ and the like.
Preferably, the drying time is 1-10 min, for example, 2min, 3min, 4min, 5min, 6min, 7min, 8min or 9 min.
In a fourth aspect, the present invention provides a coverlay comprising an insulating base film, and an adhesive layer disposed on the insulating base film; the material of the adhesive layer includes the resin composition according to the first aspect.
Preferably, the insulating base film includes any one of a polyimide film, a polyethylene terephthalate film, a polybutylene terephthalate film, or a polyethylene naphthalate film.
Preferably, a release material layer is further disposed on the adhesive layer, that is, the cover film includes an insulating base film, an adhesive layer and a release material layer which are sequentially disposed.
Illustratively, the method for preparing the coverlay film comprises the following steps: and coating the resin glue solution of the resin composition on the insulating base film, and drying to remove the solvent to obtain the cover film.
Preferably, the drying temperature is 100-180 ℃, for example, 105 ℃, 110 ℃, 115 ℃, 120 ℃, 125 ℃, 130 ℃, 135 ℃, 140 ℃, 145 ℃, 150 ℃, 155 ℃, 160 ℃, 165 ℃, 170 ℃ or 175 ℃ and the like.
Preferably, the drying time is 1-10 min, for example, 2min, 3min, 4min, 5min, 6min, 7min, 8min or 9 min.
In a fifth aspect, the invention provides an adhesive film according to the third aspect and an application of a cover film according to the fourth aspect in a flexible copper clad laminate or a flexible printed circuit board.
Compared with the prior art, the invention has the following beneficial effects:
(1) the resin composition provided by the invention comprises the combination of polyamide-imide resin, epoxy resin, phenoxy resin and phosphorus-containing flame retardant, the glass transition temperature and the heat resistance of the resin composition are obviously improved through screening and synergistic compounding of the components, and the resin composition has excellent adhesive property and flame retardance and can meet the application requirements of a flexible printed circuit board.
(2) The glass transition temperature of the glue layer is not less than 165 ℃, the thermal decomposition temperature (weight loss 5%) reaches 365-375 ℃, the peel strength with an insulating base film is 0.85-0.9N/mm, the peel strength with a copper foil is 2.2-2.32N/mm, the delamination or foaming phenomenon does not occur in dip welding at 288 ℃ for 20s, the flame retardance reaches V-0 level, and the resin composition has outstanding heat resistance, stability and reliability, high peel strength, good bonding performance and flame retardance, and is particularly suitable for preparing flexible copper clad laminates and flexible printed circuit boards with high temperature resistance and high reliability.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Example 1
A resin composition comprises the following components in parts by weight: 40 parts of polyamide-imide resin (Yinxi technology, SP1A-5), 30 parts of epoxy resin (Japan chemical, NC3000H), 25 parts of phenoxy resin (RESOLUTION, 53-BH-35) and 5 parts of phosphate flame retardant (Kelaien, OP 935).
An adhesive film comprises a release film and an adhesive layer (with the thickness of 20 μm) arranged on the release film, wherein the material of the adhesive layer is the resin composition provided by the embodiment; the preparation method comprises the following steps:
(1) mixing the resin composition with Dimethylacetamide (DMAC) and uniformly dispersing to obtain a resin glue solution with a solid content of 35%;
(2) and (2) coating the resin glue solution obtained in the step (1) on one surface of a release film, and placing the release film in an oven for baking for 5min at 155 ℃ to remove the solvent, thereby obtaining the glue film.
A coverlay film comprising a polyimide film (PI film) and an adhesive layer (having a thickness of 20 μm) provided on the polyimide film, the material of the adhesive layer being the resin composition provided in this example; the preparation method comprises the following steps: mixing the resin composition with Dimethylacetamide (DMAC) and uniformly dispersing to obtain a resin glue solution with 35% of solid content; and coating the resin glue solution on one surface of a polyimide film, and baking in an oven at 155 ℃ for 5min to remove the solvent to obtain the covering film.
Example 2
A resin composition comprises the following components in parts by weight: 50 parts of polyamide-imide resin (TOYOBO, HR-71DD), 20 parts of novolac epoxy resin (HEXION, EPR627), 20 parts of phenoxy resin (Nippon Feiki chemical, ERF-001M30) and 10 parts of phosphate flame retardant (Kelaien, OP 935).
An adhesive film, which is different from example 1 only in that the material of the adhesive layer is the resin composition provided in this example; other materials and preparation methods are the same as those of example 1.
A coverlay film which differs from example 1 only in that the material of the adhesive layer is the resin composition provided in this example; the other materials and preparation methods were the same as in example 1.
Example 3
A resin composition comprises the following components in parts by weight: 60 parts of polyamide-imide resin (Yinxi technology, SP1A-5), 10 parts of phosphorus-containing epoxy resin (Touchi chemical, XZ92530), 10 parts of phenoxy resin (Xinri Fei chemical, YP-50S-PMA30) and 20 parts of phosphate flame retardant (Kelaien, OP 935).
An adhesive film, which is different from the adhesive film of the embodiment 1 only in that the material of the adhesive layer is the resin composition provided by the embodiment; the other materials and preparation methods were the same as in example 1.
A coverlay film which differs from example 1 only in that the material of the adhesive layer is the resin composition provided in this example; other materials and preparation methods are the same as those of example 1.
Example 4
A resin composition comprises the following components in parts by weight: 80 parts of polyamide-imide resin (SOLVAY, AI-10), 10 parts of bisphenol A type epoxy resin (EPIKOTE 1001, Meiji), 5 parts of phenoxy resin (RESOLUTION, 53-BH-35) and 5 parts of phosphate flame retardant (Kelaien, OP 935).
An adhesive film, which is different from example 1 only in that the material of the adhesive layer is the resin composition provided in this example; the other materials and preparation methods were the same as in example 1.
A coverlay film which differs from example 1 only in that the material of the adhesive layer is the resin composition provided in this example; the other materials and preparation methods were the same as in example 1.
Example 5
A resin composition comprises the following components in parts by weight: 40 parts of polyamide-imide resin (Yinxi technology, SP1A-5), 40 parts of epoxy resin (Japan chemical, NC3000H), 15 parts of phenoxy resin (RESOLUTION, 53-BH-35) and 5 parts of phosphate flame retardant (Kelaien, OP 935).
An adhesive film, which is different from example 1 only in that the material of the adhesive layer is the resin composition provided in this example; the other materials and preparation methods were the same as in example 1.
A coverlay film which differs from example 1 only in that the material of the adhesive layer is the resin composition provided in this example; the other materials and preparation methods were the same as in example 1.
Example 6
A resin composition comprises the following components in parts by weight: 40 parts of polyamide-imide resin (Yinxi technology, SP1A-5), 20 parts of epoxy resin (Japan chemical, NC3000H), 30 parts of phenoxy resin (RESOLUTION, 53-BH-35) and 10 parts of phosphate flame retardant (Kelaien, OP 935).
An adhesive film, which is different from example 1 only in that the material of the adhesive layer is the resin composition provided in this example; the other materials and preparation methods were the same as in example 1.
A coverlay film which differs from example 1 only in that the material of the adhesive layer is the resin composition provided in this example; the other materials and preparation methods were the same as in example 1.
Comparative example 1
A resin composition comprises the following components in parts by weight: 60 parts of bisphenol A type epoxy resin (Mylar, EPIKOTE 1001), 30 parts of carboxyl-terminated nitrile rubber (ZEON, Nipol 1072CG), 5 parts of 4,4' -diaminodiphenyl sulfone and 5 parts of phosphate flame retardant (Kelaien, OP 935).
An adhesive film which differs from example 1 only in that the material of the adhesive layer is the resin composition provided in this comparative example; the other materials and preparation methods were the same as in example 1.
A coverlay film differing from example 1 only in that the material of the adhesive layer was the resin composition provided in this comparative example; the other materials and preparation methods were the same as in example 1.
Comparative example 2
A resin composition comprises the following components in parts by weight: 90 parts of acrylate copolymer emulsion, 3 parts of aldehyde amine curing agent and 7 parts of phosphate flame retardant (Kelain, OP 935).
An adhesive film which differs from example 1 only in that the material of the adhesive layer is the resin composition provided in this comparative example; other materials and preparation methods are the same as those of example 1.
A coverlay film differing from example 1 only in that the material of the adhesive layer was the resin composition provided in this comparative example; other materials and preparation methods are the same as those of example 1.
Comparative example 3
A resin composition comprises the following components in parts by weight: 30 parts of polyamide-imide resin (TOYOBO, HR-71DD), 30 parts of novolac epoxy resin (HEXION, EPR627), 30 parts of phenoxy resin (Nissian iron chemical, ERF-001M30) and 10 parts of phosphate flame retardant (Kelaien, OP 935).
An adhesive film which is different from example 1 only in that the material of the adhesive layer is the resin composition provided in this comparative example; the other materials and preparation methods were the same as in example 1.
A coverlay film differing from example 1 only in that the material of the adhesive layer was the resin composition provided in this comparative example; other materials and preparation methods are the same as those of example 1.
Comparative example 4
A resin composition comprises the following components in parts by weight: 30 parts of polyamide-imide resin (TOYOBO, HR-71DD), 40 parts of novolac epoxy resin (HEXION, EPR627), 20 parts of phenoxy resin (Nippon iron chemical, ERF-001M30) and 10 parts of phosphate flame retardant (Kelaien, OP 935).
An adhesive film which is different from example 1 only in that the material of the adhesive layer is the resin composition provided in this comparative example; the other materials and preparation methods were the same as in example 1.
A coverlay film which is different from example 1 only in that the material of the adhesive layer is the resin composition provided by the present comparative example; the other materials and preparation methods were the same as in example 1.
Comparative example 5
A resin composition comprises the following components in parts by weight: 30 parts of polyamide-imide resin (TOYOBO, HR-71DD), 20 parts of novolac epoxy resin (HEXION, EPR627), 40 parts of phenoxy resin (Nissian iron chemical, ERF-001M30) and 10 parts of phosphate flame retardant (Kelaien, OP 935).
An adhesive film which is different from example 1 only in that the material of the adhesive layer is the resin composition provided in this comparative example; the other materials and preparation methods were the same as in example 1.
A coverlay film differing from example 1 only in that the material of the adhesive layer was the resin composition provided in this comparative example; the other materials and preparation methods were the same as in example 1.
Comparative example 6
A resin composition comprises the following components in parts by weight: 85 parts of polyamide-imide resin (TOYOBO, HR-71DD), 5 parts of novolac epoxy resin (HEXION, EPR627), 5 parts of phenoxy resin (Nissian iron chemical, ERF-001M30) and 5 parts of phosphate flame retardant (Kelaien, OP 935).
An adhesive film which differs from example 1 only in that the material of the adhesive layer is the resin composition provided in this comparative example; the other materials and preparation methods were the same as in example 1.
A coverlay film differing from example 1 only in that the material of the adhesive layer was the resin composition provided in this comparative example; the other materials and preparation methods were the same as in example 1.
Comparative example 7
A resin composition comprises the following components in parts by weight: 65 parts of polyamide-imide resin (TOYOBO, HR-71DD), 25 parts of novolac epoxy resin (HEXION, EPR627) and 10 parts of phosphate flame retardant (Kelain, OP 935).
An adhesive film which differs from example 1 only in that the material of the adhesive layer is the resin composition provided in this comparative example; the other materials and preparation methods were the same as in example 1.
A coverlay film differing from example 1 only in that the material of the adhesive layer was the resin composition provided in this comparative example; the other materials and preparation methods were the same as in example 1.
Comparative example 8
A resin composition comprises the following components in parts by weight: 50 parts of polyamide-imide resin (TOYOBO, HR-71DD), 20 parts of novolac epoxy resin (HEXION, EPR627), 20 parts of phenoxy resin (Nissian iron chemical, ERF-001M30) and 10 parts of bromine-containing flame retardant (tetrabromobisphenol A).
An adhesive film which differs from example 1 only in that the material of the adhesive layer is the resin composition provided in this comparative example; the other materials and preparation methods were the same as in example 1.
A coverlay film differing from example 1 only in that the material of the adhesive layer was the resin composition provided in this comparative example; the other materials and preparation methods were the same as in example 1.
The adhesive films and the covering films provided in the embodiments 1 to 6 and the comparative examples 1 to 8 are subjected to performance tests, and the specific test method comprises the following steps:
(1) glass transition temperature Tg: curing the adhesive layer, and testing the glass transition temperature by Differential Scanning Calorimetry (DSC), wherein the testing atmosphere is nitrogen, and the heating rate is 10 ℃/min;
(2) thermal decomposition temperature Td: the thermal decomposition temperature at 5% weight loss was measured using thermogravimetric analysis (TGA) and was carried out as specified in IPC-TM-6502.4.24.6;
(3) peel strength with copper foil PS: testing was carried out as specified in the IPC-TM-6502.4.9 standard;
(4) peel strength with base insulating film (PI film) PS: testing was carried out as specified in the IPC-TM-6502.4.9 standard;
(5) thermal stress: 288 ℃ for 20s, according to the method specified in the IPC-TM-6502.4.13 standard;
(6) flame retardancy: the test was carried out according to the UL94 standard.
The specific test results are shown in table 1:
TABLE 1
Figure BDA0002874090440000141
Figure BDA0002874090440000151
According to the test data in table 1, compared with the epoxy resin system in comparative example 1 or the acrylate system in comparative example 2, the resin composition provided in examples 1 to 6 of the present invention is used as the material of the adhesive layer, the glass transition temperature of the obtained adhesive film and cover film is greater than 160 ℃, 165 to 173 ℃, the thermal decomposition temperature (weight loss 5%) is 365 to 375 ℃, the peel strength with the insulating base film (PI film) is 0.85 to 0.9N/mm, the peel strength with the copper foil is 2.2 to 2.32N/mm, no delamination or foaming phenomenon occurs in dip soldering at 288 ℃ for 20s, the flame retardance reaches V-0 level, and the adhesive has excellent heat resistance, thermal stability and reliability, high peel strength, good adhesive property and flame retardance, and is particularly suitable for preparing high temperature resistant and high reliability flexible copper clad laminate and flexible printed circuit board.
The polyamide-imide resin is used as a main material, the epoxy resin, the phenoxy resin and the phosphorus-containing flame retardant with specific contents are matched and used, and the resin composition has high glass transition temperature, excellent heat resistance and flame retardant, high peel strength and high adhesive property through the synergistic effect of the components. If the content of the polyamideimide resin in the resin composition is too low (comparative examples 3 to 5), the glass transition temperature of the adhesive layer is lowered, the heat resistance is deteriorated, and the adhesion is significantly reduced; on the other hand, excessive addition of the polyamideimide resin (comparative example 6) causes a decrease in adhesion, and also causes a problem of excessive flow due to insufficient crosslinking degree, which affects the application. If the system does not contain the phenoxy resin (comparative example 7), the adhesive properties are slightly reduced, and this results in poor film-forming properties, local cratering problems during gumming, and poor appearance. Further, if the flame retardant is a phosphorus-free flame retardant (comparative example 8), a decrease in heat resistance is caused, and a decrease in adhesive properties is significant.
The applicant states that the present invention is described by the above examples, but the present invention is not limited to the above examples, i.e. the present invention is not limited to the above examples. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.

Claims (9)

1. The resin composition is characterized by comprising the following components in parts by weight:
Figure FDA0002874090430000011
2. the resin composition according to claim 1, wherein the epoxy resin comprises any one of or a combination of at least two of a bisphenol a type epoxy resin, a phosphorus-containing epoxy resin, an isocyanate-modified epoxy resin, a novolac epoxy resin, a biphenyl type epoxy resin, a dicyclopentadiene type epoxy resin, or a cycloaliphatic epoxy resin;
preferably, the epoxy equivalent of the epoxy resin is 100 to 500 g/eq.
3. The resin composition according to claim 1 or 2, wherein the phenoxy resin has a weight average molecular weight of 10000 to 100000;
preferably, the phenoxy resin comprises an unmodified phenoxy resin and/or a phosphorus-containing phenoxy resin.
4. The resin composition as claimed in any one of claims 1 to 3, wherein the phosphorus-containing flame retardant comprises any one of phosphate, phosphate ester, polyphosphate ester, phosphazene compound, tris (2, 6-dimethylphenyl) phosphine, or 10- (2, 5-dihydroxyphenyl) -10H-9-oxa-10-phosphaphenanthrene-10-oxide, or a combination of at least two thereof.
5. A resin glue solution, which is characterized by comprising a solvent and the resin composition as claimed in any one of claims 1 to 4 dissolved or dispersed in the solvent;
preferably, the solid content of the resin glue solution is 20-60%.
6. The adhesive film is characterized by comprising a release material and an adhesive layer arranged on the release material; the material of the adhesive layer comprises the resin composition according to any one of claims 1 to 4;
preferably, the adhesive layer is obtained by coating a resin glue solution of the resin composition on a release material and drying;
preferably, the adhesive film comprises a first release material layer, an adhesive layer and a second release material layer which are arranged in sequence.
7. A coverlay film, comprising an insulating base film, and an adhesive layer disposed on the insulating base film; the material of the adhesive layer comprises the resin composition according to any one of claims 1 to 4.
8. The coverlay film of claim 7, wherein the insulating base film comprises any one of a polyimide film, a polyethylene terephthalate film, a polybutylene terephthalate film, or a polyethylene naphthalate film;
preferably, a release material layer is further disposed on the adhesive layer.
9. The adhesive film of claim 6, the coverlay film of claim 7 or 8, and applications of the coverlay film in flexible copper clad laminates or flexible printed circuit boards.
CN202011608454.9A 2020-12-30 2020-12-30 Resin composition and adhesive film and covering film containing same Pending CN114685989A (en)

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